JP2008139078A - Method and apparatus for measuring parallel holes - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for measuring parallel holes, capable of effectively and precisely measuring a parallelization degree of the parallel holes with respect to the axial center used as a reference of an object to be measured. <P>SOLUTION: A master pin 2 is set in set-pin support holes 7, 8 of a planetary carrier, and the planetary carrier is supported so as to be centered by a pair of support pins 18, 19, thereby obtaining the axial center used as the reference of the planetary carrier. Then, a bias of a plane to be measured 5 whose squareness to the pin axial center L1 of the master pin 2 is assured, is measured in the direction of the axial center of the planetary carrier, and the parallelization degree of the set-pin support holes 7, 8 is derived based on the measured result. Therefore, the parallelization degree of the set-pin support holes 7, 8 can be measured effectively and precisely. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method and apparatus for measuring parallelism of a parallel hole with respect to a reference of an object to be measured, for example, parallelism of a set pin support hole with respect to an axis of a planetary carrier.

  In general, an automatic transmission of an automobile incorporates a planetary gear constituted by a ring gear, a pinion gear, a sun gear, and a planetary carrier, and shifts are performed by switching a combination pattern of an input gear, an output gear, and a fixed gear. For planetary gears, the parallelism between meshed gears is extremely important for ensuring performance. If the parallelism error between these gears is large, problems such as the generation of abnormal noise and damage to the gears can occur. May occur. Therefore, conventionally, in a planetary carrier, the parallelism of a pair of set pin support holes (parallel holes) with respect to an axis (reference) has been measured using a three-dimensional measuring machine. By the way, when measuring the parallelism of the pair of set pin support holes with respect to the axis of the planetary carrier (hereinafter simply referred to as the parallelism of the set pin support holes in the planetary carrier), the axis of the planetary carrier is set high. It is necessary to calculate with accuracy.

  However, since the planetary carrier is machined based on the center hole of the shaft portion, conventionally, the axis of the planetary carrier has been required based on the axis of the center hole. It took a great deal of time to measure with a three-dimensional measuring machine. Moreover, since the set pin support holes are arranged at predetermined intervals in the axial direction, the axis of the set pin support hole is the center of each set pin support hole obtained individually by a three-dimensional measuring machine. If there is an error in the shape and inclination of each set pin support hole, the axis of the set pin support hole as a parallel hole cannot be obtained accurately, and eventually The parallelism of the set pin support hole in the planetary carrier could not be obtained with high accuracy. In particular, in the case of a parallel hole machined from two directions, it is extremely difficult to make the axes of the holes coincide with each other, and the axis of the parallel hole cannot be obtained with high accuracy.

  Furthermore, in the planetary carrier, the distance between the shaft center (reference) and the set pin support hole (parallel hole) (distance between the axes) is short, so the measuring head of the three-dimensional measuring machine is the shaft of the planetary carrier. May interfere. In this case, it is necessary to mount a special measuring head for avoiding interference on the three-dimensional measuring machine, which increases the equipment cost and makes measurement difficult.

  Accordingly, the present invention has been made in view of the above circumstances, and a parallel hole measuring method and a parallel method capable of efficiently and highly accurately measuring the parallelism of a parallel hole with respect to an axis as a reference of an object to be measured. An object of the present invention is to provide a hole measuring device.

In order to solve the above-mentioned problems, a parallel hole measuring method of the present invention is a method for measuring the parallelism of a parallel hole with respect to a reference of a measured object having a parallel hole eccentric with respect to the reference. A master pin having a surface to be measured with a guaranteed perpendicularity is fitted into the parallel hole of the object to be measured with a predetermined fitting tolerance, and the object to be measured with the master pin fitted in the parallel hole is supported by the center. Centering the axis as a reference of the object to be measured by centering, in this state, measuring the deviation of the surface to be measured in the direction parallel to the axis as the reference of the object to be measured. Based on the result, the parallelism of the parallel hole with respect to the axis as the reference of the object to be measured is derived.
According to the parallel hole measuring method of the present invention, the center of the object to be measured, in which the master pin is fitted in the parallel hole, is centered and centered to obtain the axis as the reference of the object to be measured. The deviation (positional deviation) in the direction parallel to the axis as the reference of the object to be measured is measured on the surface to be measured, which is guaranteed to be perpendicular to the pin axis of the master pin. Since the parallelism of the parallel hole with respect to the axis as the reference of the object to be measured is derived, the parallelism of the parallel hole can be measured efficiently and with high accuracy.

In order to solve the above problems, a parallel hole measuring apparatus according to the present invention is an apparatus for measuring the parallelism of a parallel hole with respect to a reference of an object having a parallel hole eccentric to the reference. A master pin that is fitted with a predetermined fitting tolerance, a measurement surface that is formed on the master pin and has a guaranteed perpendicularity with respect to the axis of the pin, and an object to be measured by centering the object to be measured in the center A centering unit that requires an axial center as the reference for the measurement object, and the object to be measured centered by the centering unit, in a direction parallel to the axis as the reference for the object to be measured And a measuring unit for measuring the deviation of the parallelism, wherein the parallelism of the parallel hole with respect to the axis as the reference of the object to be measured is derived based on the measurement result of the measuring unit.
According to the parallel hole measuring device of the present invention, the object to be measured, in which the master pin is fitted in the parallel hole, is centered by the centering unit by the centering unit to obtain the center as the reference of the object to be measured, In this state, the measurement unit measures the deviation (positional deviation) in the direction parallel to the axis as the reference of the object to be measured on the surface to be measured, which is guaranteed to be perpendicular to the pin axis of the master pin. Then, based on the measurement result, the parallelism of the parallel holes with respect to the axis as the reference of the object to be measured is derived, whereby the parallelism of the parallel holes can be measured efficiently and with high accuracy.

(Aspect of the Invention)
In the following, aspects of the invention that is recognized as being capable of being claimed in the present application (hereinafter referred to as claimable invention) will be exemplified, and each exemplified aspect will be described. Here, as in the claims, each aspect is divided into paragraphs, numbers are assigned to the respective paragraphs, and the descriptions of other paragraphs are cited as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combination of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiment, etc., and as long as the interpretation is followed, another aspect is added to the aspect of each section. Moreover, the aspect which deleted the component from the aspect of each term can also be one aspect of the claimable invention.
In the following items, each of items (1) to (6) corresponds to each of claims 1 to 6.

(1) A method of measuring a parallelism of a parallel hole with respect to a reference of a measurement object having a parallel hole eccentric with respect to a reference, the master pin having a measurement surface with a guaranteed perpendicularity with respect to the pin axis Is fitted to the parallel hole of the object to be measured with a predetermined fitting tolerance, and the object to be measured is centered by supporting the object to be measured with the master pin fitted to the parallel hole. In this state, the deviation of the surface to be measured in the direction parallel to the axis as the reference of the object to be measured is measured. Based on the measurement result, the deviation from the axis as the reference of the object to be measured is measured. A parallel hole measuring method, wherein the parallelism of the parallel holes is derived.
The parallel hole measuring method described in this section obtains an axis as a reference of the object to be measured by centering the object to be measured in which the master pin is fitted in the parallel hole, and in this state, Measure the deviation of the measured surface of the master pin, which is guaranteed to be perpendicular to the pin axis, in a direction parallel to the axis as the reference of the object to be measured. By deriving the parallelism of the parallel hole with respect to the axis as the reference of the object, the parallelism of the parallel hole with respect to the axis as the reference of the object to be measured is used as the reference of the object to be measured on the measurement surface of the master pin. Measurement can be performed based on the deviation in a direction parallel to the axis, and the parallelism of the parallel holes can be measured efficiently and with high accuracy.
Conventionally, the parallelism of the parallel hole with respect to the axis as the reference of the object to be measured is measured by a three-dimensional measuring machine. First, the axis as the reference of the object to be measured is obtained, and then one of the parallel holes is measured. Since the center of the hole and the center of the other hole were obtained and the straight line connecting the centers of the two holes was obtained as the axis of the parallel hole, it took a long time to measure the parallelism of the parallel holes. Therefore, in the aspect of this section, the parallelism of the parallel hole with respect to the axis as the reference of the object to be measured is set in the direction parallel to the axis of the measurement surface of the master pin as the reference of the object to be measured. It becomes possible to measure efficiently based on the deviation, and the measurement time of the parallelism of the parallel holes can be greatly shortened.
In addition, conventionally, the center of one hole and the center of the other hole in a parallel hole have been measured individually to determine the axis of the parallel hole. When there is an error in the inclination of the axis of the parallel hole, the axis of the parallel hole could not be obtained accurately. However, in the mode of this section, the inclination of the parallel hole with respect to the axis as the reference of the object to be measured is parallel. The inclination of the pin axis of the master pin fitted in the hole, that is, the deviation of the measured surface of the master pin in a direction parallel to the axis as the reference of the object to be measured appears. In the aspect of this section, the deviation of the measured surface of the master pin in the direction parallel to the axis as the reference of the measured object, in other words, as the measured object reference of the measured surface. By measuring the perpendicularity with respect to the axial center, the parallelism of the parallel hole with respect to the axial center as a reference of the object to be measured can be obtained with high accuracy.
The aspect of this section is applied to, for example, the measurement of the parallelism of the set pin support hole with respect to the axis as a reference in the planetary carrier incorporated in the planetary gear. In this case, the deviation of the measured surface of the master pin fitted in the pair of set pin support holes (parallel holes) of the planetary carrier in the direction parallel to the axis as the reference of the planetary carrier is measured. By doing so, the parallelism of the set pin support hole with respect to the axis as a reference of the planetary carrier can be measured efficiently and with high accuracy. In this case, by using the master pin, it is possible to perform measurement in a state approximated to the usage state of the product (planetary gear), and the reliability of the measurement result is improved.

(2) A measuring element provided parallel to the axis as the reference of the object to be measured is brought into contact with the surface to be measured of the master pin fitted in the parallel hole of the object to be measured, and this state Measure the displacement of the probe in the direction parallel to the axis as the reference of the object to be measured when the probe is moved and the surface to be measured is copied with the probe. The parallel hole measuring method according to (1), wherein the deviation of the surface to be measured in a direction parallel to the axis as the reference of the object to be measured is measured.
In the aspect described in this section, when the measuring element is moved on the surface to be measured and the measuring surface is imitated with the measuring element, the measuring element is parallel to the axis as the reference of the object to be measured. By measuring the displacement in the direction, the deviation of the surface to be measured in the direction parallel to the axis as the reference of the object to be measured is measured.

(3) The measuring element is brought into contact with the measured surface of the master pin fitted in the parallel hole of the measured object, and in this state, the measuring element is parallel to the axis as the reference of the measured object. Measure the displacement of the probe in a direction parallel to the axis as the reference of the object to be measured when the surface to be measured is copied by the probe with at least one rotation around the axis. The parallel hole measuring method according to (1) or (2), wherein the deviation of the surface to be measured in a direction parallel to the axis as a reference of the object to be measured is measured based on the result.
In the aspect described in this section, the measurement is performed when the measuring element is rotated at least once around an axis (rotation axis) parallel to the axis as the reference of the object to be measured and the surface to be measured is copied by the measuring element. By measuring the displacement of the child in the direction parallel to the axis as the reference of the object to be measured, the deviation of the surface to be measured in the direction parallel to the axis as the reference of the object to be measured Is measured. In this aspect, the rotation axis of the probe is set to the design center position of the master pin (axis position of the parallel hole), and the probe is rotated at least once in a circular orbit around the rotation axis. The displacement of the probe in the direction parallel to the axis as the reference of the object to be measured is measured.

(4) A device for measuring the parallelism of a parallel hole with respect to a reference of an object to be measured having a parallel hole eccentric with respect to a reference, the master pin being fitted to the parallel hole with a predetermined fitting tolerance, and a master A surface to be measured which is formed on a pin and guarantees a perpendicularity with respect to the pin axis; a centering unit which is required to have a center as a reference of the object to be measured by centering the object to be measured; A measuring unit that measures the deviation of the surface to be measured in a direction parallel to the axis as a reference of the object to be measured, with the object to be measured centered by the centering unit; A parallel hole measuring device, wherein the parallelism of a parallel hole with respect to an axis as a reference of an object to be measured is derived based on a measurement result of a measuring unit.
The parallel hole measuring device described in this section obtains an axis as a reference of the object to be measured by centering the object to be measured with the master pin fitted in the parallel hole by centering the centering unit, In this state, the deviation (positional deviation) in the direction parallel to the axis of the object to be measured of the surface to be measured in which the squareness of the master pin with respect to the pin axis is guaranteed is measured by the measurement unit. By calculating the parallelism of the parallel hole with respect to the axis as a reference of the object to be measured based on the measurement result, the parallelism of the parallel hole can be measured efficiently and with high accuracy.
Conventionally, the parallelism of the parallel hole with respect to the axis as the reference of the object to be measured is measured by a three-dimensional measuring machine. First, the axis as the reference of the object to be measured is obtained, and then one of the parallel holes is measured. Since the center of the hole and the center of the other hole were obtained and the straight line connecting the centers of the two holes was obtained as the axis of the parallel hole, it took a long time to measure the parallelism of the parallel holes. Therefore, in the aspect of this section, the center of the object to be measured is centered with the centering unit supported by the centering unit to obtain the axis as the reference of the object to be measured, The deviation in the direction parallel to the axis as the reference, in other words, the perpendicularity of the surface to be measured with respect to the axis as the reference of the object to be measured is measured, and the reference of the object to be measured is based on the measurement result. By calculating the parallelism of the parallel hole with respect to the axial center, the measurement time of the parallelism of the parallel hole can be greatly shortened.
Moreover, in the aspect of this term, by providing a flange portion at one end of the master pin, the master pin is positioned in the axial direction of the pin portion with respect to the parallel hole. A circular measured surface is formed on the end face of the flange portion. Furthermore, in this mode, when there is play between the pin part of the master pin and the parallel hole (when the fitting error is large), the master pin moves relative to the parallel hole by the amount of play and accurate measurement is performed. Therefore, it is recommended that a plurality of types of master pins with different external dimensions (diameters) of the pin portion be prepared in advance.

(5) The measuring unit includes a measuring head having a measuring element that can move along a predetermined trajectory, and the measuring object of the measuring element when the measuring element is moved along the predetermined trajectory and the surface to be measured is copied by the measuring element. The parallel hole measuring device according to (4), further comprising: a measuring unit that measures a displacement in a direction parallel to the axis as a reference of the object.
In the mode described in this section, the measuring element is moved along a predetermined trajectory, the surface to be measured is copied by the measuring element, and the measuring element is displaced in a direction parallel to the axis as the reference of the object to be measured. Is measured by the measuring unit, and based on the measurement result of the measuring unit, the deviation of the surface to be measured in the direction parallel to the axis as the reference of the object to be measured is measured.

(6) The measuring head is configured so that the measuring element is moved along a circular orbit having a rotation radius R around the axis line in which parallelism with the axis of the centering unit is guaranteed. .
In the embodiment described in this section, the measuring element is moved along a circular orbit having a rotation radius R around an axis line (rotating axis) in which parallelism with the axis of the centering unit is guaranteed, and the measurement surface is moved by the measuring element. By measuring the displacement of the tracing stylus in the direction parallel to the axis as the reference of the object to be measured, by the measuring unit, the axis of the measurement surface with respect to the axis as the reference of the object to be measured The deviation in the parallel direction is measured. In this aspect, the rotation axis of the probe is set to the design center position of the master pin (axis position of the parallel hole), and the probe is rotated at least once in a circular orbit around the rotation axis. The displacement of the probe in the direction parallel to the axis as the reference of the object to be measured is measured.

(7) The object to be measured is a planetary carrier, and the parallel holes are a pair of set pin support holes for supporting both ends of the set pin of the pinion gear in the planetary carrier. Parallel hole measuring device.
In the aspect described in this section, the parallelism of the pair of set pin support holes with respect to the shaft center as the reference of the planetary carrier can be obtained efficiently and with high accuracy. In this case, it is possible to perform measurement in a state approximated by the usage state of the product (planetary gear), and the reliability of the measurement result is improved.
In the aspect of this section, the tip of the centering unit is formed in a conical or frustoconical shape, and both ends of the center hole of the planetary carrier are center-supported by a pair of center support jigs whose coaxiality is guaranteed. , Centering on a planetary career. In the aspect of this section, the centering unit may be configured to support the planetary carrier using the spring force of the compression coil spring, or depending on the inner diameter of the center hole, a hydraulic chuck or mechanical type The planetary carrier may be supported by a chuck or the like.
In this aspect, when the master pin is fitted into the set pin support hole (parallel hole), the master pin is adjusted so that the clearance between the set pin support hole and the pin portion of the master pin is 0 to 0.002 mm. To manufacture. As a result, it is possible to perform measurement in a state closer to the state in which the set pin of the pinion gear is fitted in the set pin support hole of the planetary carrier.

  It is possible to provide a parallel hole measuring method and a parallel hole measuring apparatus capable of measuring the parallelism of a parallel hole with respect to an axis serving as a reference of an object to be measured efficiently and with high accuracy.

  An embodiment of the present invention will be described with reference to FIGS. In the present embodiment, a case where the parallelism of the pair of set pin support holes 7 and 8 (parallel holes) with respect to the axis L0 as a reference of the planetary carrier 6 (measurement object) is described. The parallel hole measuring device 1 includes a master pin 2 (see FIG. 3) that is provided with a surface to be measured 5 in which a perpendicularity to the pin axis L1 is guaranteed and is fitted into a pair of set pin support holes 7 and 8. The centering unit 3 that requires the axis L0 as a reference for the planetary carrier 6 by centering the planetary carrier 6 with the center being supported, and the planetary carrier 6 is centered by the centering unit 3 In this state, a direction parallel to the axis LO of the planetary carrier 6 of the measured surface 5 of the master pin 2 fitted in the pair of set pin support holes 7 and 8 (hereinafter referred to as the planetary carrier axial direction) And a measurement unit 4 for measuring a deviation (positional deviation) in the vertical direction in FIGS. 1 and 3.

  The parallel hole measuring device 1 then sets the set pin support holes 7 and 8 with respect to the axis LO of the planetary carrier 6 based on the deviation of the measured surface 5 measured by the measurement unit 4 in the direction of the planetary carrier axis. The parallelism is derived. As shown in FIG. 3, the master pin 2 has a pin portion 9 fitted into the set pin support holes 7 and 8 (parallel holes), and a flange portion 10 formed at one end of the pin portion 9. . Further, the outer diameter of the pin portion 9 is set so that the gap between the pin portion 9 and the set pin support holes 7 and 8 is 0 to 0.002 mm when fitted into the set pin support holes 7 and 8. The master pin 2 is provided with a surface to be measured 5 on which the perpendicularity with respect to the pin axis L1 is guaranteed on the end surface on the flange portion 10 side. As shown in FIG. 2, the outer peripheral surface of the flange portion 10 of the master pin 2 is knurled. As shown in FIG. 1, the centering unit 3 is provided on the base 11 of the parallel hole measuring device 1, and the centering frame 13 formed in a U-shape has both ends of the shaft portion 12 of the planetary carrier 6. A lower head 14 and an upper head 15 that support the center are disposed.

  The lower head 14 includes a support pin 18 erected vertically, and a tip portion formed in a conical shape of the support pin 18 has a center hole formed in one end surface 12 a of the shaft portion 12 of the planetary carrier 6. It is engaged with 16 openings. The upper head 15 includes a support pin 19 in which the coaxiality of the lower head 14 with respect to the support pin 18 is guaranteed, and the support pin 19 has a tip portion formed in a truncated cone shape and a shaft portion of the planetary carrier 6. 12 is engaged with the opening of the center hole 17 formed in the other end surface 12b. Further, the upper head 15 is urged downward (downward in FIG. 1) by the support pin 19 by the spring force of the compression coil spring 20. Then, in the centering unit 3, the lever 21 of the upper head 15 is operated to move the support pin 19 of the upper head 15 upward (upward in FIG. 1) while pushing and compressing the compression coil spring 20 to hold the lever 21. In this state, the center hole 16 of the planetary carrier 6 is engaged with the support pin 18.

  Further, with the center hole 16 of the planetary carrier 6 engaged with the support pin 18, the lever 21 of the upper head 15 is returned and the support pin 19 is moved downward, so that the support pin 19 is moved to the planetary carrier. 6 is engaged with the center hole 17. As a result, the centering unit 3 supports the planetary carrier 6 in the center, that is, in a state where the axis L0 of the planetary carrier 6 is aligned with the axis of the support pins 18 and 19, The structure is held between the support pins 18 and 19. As shown in FIGS. 1 and 2, the measurement unit 4 has a parallelism with respect to the axis of the support pins 18, 19, and thus to the axis L 0 of the planetary carrier 6 centered by the support pins 18, 19. A measurement head 23 having a guaranteed probe 22 and a support frame 24 that supports the measurement head 23 so as to be positioned are provided.

  The measurement head 23 includes a bushing 26 that is held by a slide arm 25 (movable horizontally in the left-right direction in FIG. 1) of the support frame 24 and in which parallelism with respect to the axis L0 of the planetary carrier 6 is guaranteed. A hollow shaft 28 having a flange portion 27 formed at the upper end is fitted to the bushing 26 so as to be rotatable about the axis. A ring member 29 is fitted to the hollow shaft 28 at a portion protruding from the bushing 26 of the hollow shaft 28, and the ring member 29 is fixed to the lower end surface of the hollow shaft 28 with a bolt 30. A spindle 31 having a lower end penetrating the ring member 29 is slidably fitted into the hollow portion of the hollow shaft 28. A measuring element holding member 32 is fitted to the lower end portion of the spindle 31, and the measuring element holding member 32 is fixed to the lower end surface of the spindle 31 by a bolt 33. The probe holding member 32 is restricted from relative movement around the axis (same axis) with respect to the ring member 29 and is allowed to move in a predetermined stroke in the axial direction (vertical direction in FIG. 1). .

  The measurement head 23 includes a displacement sensor 35 that is provided on the slide arm 25 via a sensor bracket 36 and measures a relative movement distance of the hollow shaft 28 in the axial direction of the spindle 31. Further, the measurement unit 4 is a signal processing unit (measurement unit) that measures the displacement of the probe 22 in the axial direction (planetary carrier axial direction) of the support pins 18 and 19 based on the detection signal of the displacement sensor 35. ). In the parallel hole measuring device 1, the planetary carrier 6 is center-supported by the support pins 18 and 19, and in this state, the axis of the measuring head 23 is fitted into the set pin support holes 7 and 8 of the planetary carrier 6. The measuring element 22 is brought into contact with the measured surface 5 of the master pin 2 and the axis of the measuring head 23 is aligned with the axis of the master pin 2 (the axis of the parallel hole). In this state, when the hollow shaft 28 is rotated once around the axis, the probe 22 rotates around the axis of the measuring head 23 in which the parallelism with the axis L0 as the reference of the planetary carrier 6 is guaranteed. It is rotated on a circular orbit having a radius R (distance between the axes of the spindle 31 and the probe 22).

  In the measurement unit 4, the displacement (position) of the probe 22 in the direction of the axis of the planetary carrier when the measured surface 22 of the master pin 2 is copied by one rotation along the circular orbit of the rotation radius R by the probe 22. And the parallelism of the set pin support holes 7 and 8 (parallel holes) with respect to the axis L0 as the reference of the planetary carrier 6 is derived based on the measurement result. The outer peripheral surface of the flange portion 27 of the hollow shaft 28 is knurled. A stopper 34 that is in contact with the upper end surface of the hollow shaft 28 is mounted on the outer peripheral surface of the upper end portion of the spindle 31. Further, a compression coil spring 37 is accommodated between the ring member 29 and the probe support member 32, and the probe support member 32 is moved against the ring member 29 by the spring force of the compression coil spring 37. The stylus 22 is urged toward the measurement surface 5.

  Next, a method for measuring the parallelism of the set pin support holes 7 and 8 (parallel holes) with respect to the axis L0 as a reference of the planetary carrier 6 (measurement object) using the parallel hole measuring device 1 will be described. To do. First, the master pin 2 is set in the set pin support holes 7 and 8 of the planetary carrier 6. Next, the planetary carrier 6 is center-supported by the pair of support pins 18 and 19 of the centering unit 3. Thereby, the planetary carrier 6 is held by the centering unit 3 in a state in which the axis L0 is aligned with the axis of the support pins 18, 19, that is, in a state centered in the parallel hole measuring device 1. Next, the slide arm 25 is moved horizontally to position the measurement head 23 at the measurement position. At the measurement position, the axis of the measurement head 23 coincides with the axis of the master pin 2 (the axis of the parallel hole), and the measuring element 22 is brought into contact with the surface to be measured 5 of the master pin 2.

  In this state, by manually operating the flange portion 27 of the hollow shaft 28 and rotating the hollow shaft 28 around the axis of the measuring head 23, the probe 22 is moved relative to the axis L 0 as a reference of the planetary carrier 6. One rotation is performed on a circular orbit having a rotation radius R around the axis of the measuring head 23 for which parallelism is guaranteed. As a result, the probe 22 follows the surface to be measured 5 of the master pin 2 in a predetermined circular orbit. Then, the deviation (positional deviation, Y shown in FIG. 4) of the measuring element 22 in the direction of the axis of the planetary carrier when the measuring element 22 follows the surface to be measured 5 is measured. The parallelism of the set pin support holes 7 and 8 (parallel holes) with respect to the axis L0 as the reference of the planetary carrier 6 is derived.

This embodiment has the following effects.
According to this embodiment, the master pin 2 is fitted into the set pin support holes 7 and 8 (parallel holes) of the planetary carrier 6 (measurement object), and the planetary carrier 6 is connected to the pair of support pins 18 and 19. By supporting the center, the axis LO as a reference for the planetary carrier 6 is obtained. In this state, the planetary carrier of the surface to be measured 5 in which the perpendicularity of the master pin 2 to the pin axis L1 is guaranteed. The deviation in the axial direction is measured, and the parallelism of the set pin support holes 7 and 8 with respect to the axial center L0 as the reference of the planetary carrier 6 is derived based on the measurement result.
Therefore, conventionally, since the parallelism of the set pin support holes 7 and 8 has been measured by a three-dimensional measuring machine, it takes a lot of time for the measurement, but in the present embodiment, the set pin support holes 7 and 8 are measured. , 8 is measured based on the deviation of the measured surface 5 of the master pin 2 fitted to the planetary carrier axial direction, so that the parallelism of the set pin support holes 7, 8 can be measured efficiently. It becomes possible, and the measurement time of the parallelism of a parallel hole can be shortened significantly.

  Conventionally, the axis of the set pin support holes 7 and 8 (parallel holes) has been measured separately for the center of the set pin support hole 7 and the center of the set pin support hole 8. If there is an error in the shape or inclination of the planetary carrier 6 with respect to the axial center LO, the axial centers of the set pin support holes 7 and 8 could not be obtained accurately. The inclination of the set pin support holes 7 and 8 with respect to the axis L0 as a reference is the inclination of the pin axis L1 of the master pin 2 fitted in the set pin support holes 7 and 8, that is, the surface 5 to be measured. Since it appears as a deviation in the direction of the planetary carrier axis, the deviation of the measured surface 5 in the direction of the planetary carrier axis, in other words, the axis of the measured surface 5 as a reference for the planetary carrier 6 Measuring perpendicularity to L0 Thus, the parallelism of the set pin support holes 7 and 8 with respect to the axis L0 as the reference of the planetary carrier 6 can be obtained efficiently.

  Furthermore, in this embodiment, the master pin 2 is fitted into the set pin support holes 7 and 8 of the planetary carrier 6, and the surface to be measured 5 formed on the master pin 2 is measured by the measuring element 22. Since the parallelism of the set pin support holes 7 and 8 with respect to the axis L0 as the reference of the planetary carrier 6 can be obtained, it is possible to measure the parallelism in a state approximated by the usage condition of the product (planetary gear) Thus, the reliability of the measurement result is improved.

In addition, embodiment is not limited above, For example, you may comprise as follows.
When the length L of the set pin support holes 7 and 8 (parallel holes) and the radius R (refer to FIG. 4) of the circular orbit of the measuring element 22 are different from those of the present embodiment, the measuring element 22 in the direction of the planetary carrier axis. By converting the bias Y by the conversion formula Y · R / L, the parallelism of the parallel holes can be measured and compared on the same basis.
The parallel hole measuring device 1 is not applied only when measuring the parallelism of the set pin support holes 7 and 8 (parallel holes) with respect to the axis L0 as a reference of the planetary carrier 6 (object to be measured). It is widely applied when measuring parallelism with respect to a reference of a parallel hole eccentric with respect to the reference.

It is a front view of the parallel hole measuring device of this embodiment. It is explanatory drawing of a measurement unit, and is the figure which showed a part of measurement head in the cross section. It is a figure which shows the state by which the master pin was fitted by the set pin support hole of the planetary carrier. It is explanatory drawing of this embodiment, and is a figure explaining that the inclination of the axial center of a set pin support hole is measured based on the deviation to the planetary carrier axial center direction of the to-be-measured surface of a master pin.

Explanation of symbols

1 parallel hole measuring device, 2 master pin, 3 centering unit, 4 measuring unit, 5 surface to be measured, 6 planetary carrier (object to be measured), 7, 8 set pin support hole (parallel hole), 22 measuring element, 23 Measuring head

Claims (6)

A method of measuring the parallelism of the parallel hole with respect to the reference of an object to be measured having a parallel hole eccentric with respect to the reference,
A master pin having a surface to be measured with a guaranteed perpendicularity to the pin axis is fitted into the parallel hole of the object to be measured with a predetermined fitting tolerance, and the master pin is fitted into the parallel hole. The center of the object to be measured is centered with the center of the object to be measured to obtain the axis as a reference of the object to be measured. In this state, the surface to be measured is parallel to the axis as the reference of the object to be measured. A parallel hole measuring method, wherein a deviation in a direction is measured, and a parallelism of the parallel hole with respect to an axis as a reference of the object to be measured is derived based on the measurement result. A measuring element provided parallel to the axis of the object to be measured is brought into contact with the surface to be measured of the master pin fitted in the parallel hole of the object to be measured centered, and in this state Measuring the displacement of the measuring element in a direction parallel to the axis as a reference of the object to be measured when the measuring element is moved and the measuring surface is copied by the measuring element; The parallel hole measuring method according to claim 1, wherein a deviation of the surface to be measured in a direction parallel to an axis as a reference of the object to be measured is measured based on a measurement result. The measuring element is brought into contact with the surface to be measured of the master pin fitted in the parallel hole of the object to be measured centered, and in this state, the measuring element is a shaft as a reference of the object to be measured. When the measuring surface is rotated by at least one rotation around an axis parallel to the center and the measuring surface is copied, the measuring device is moved in a direction parallel to the axis as a reference of the measuring object. 3. A displacement is measured, and based on the measurement result, a deviation of the surface to be measured in a direction parallel to an axis as a reference of the object to be measured is measured. 2. The parallel hole measuring method according to 1. An apparatus for measuring the parallelism of the parallel hole with respect to the reference of an object to be measured having a parallel hole eccentric with respect to the reference,
A master pin fitted in the parallel hole with a predetermined fitting tolerance;
A surface to be measured which is formed on the master pin and has a guaranteed perpendicularity to the pin axis;
A centering unit in which an axis as a reference of the object to be measured is required by centering the object to be measured and centering;
A measuring unit for measuring a deviation of the surface to be measured in a direction parallel to an axis as a reference of the object to be measured in a state where the object to be measured is centered by the centering unit; ,
The parallel hole measuring device is characterized in that the parallelism of the parallel hole with respect to an axis as a reference of the object to be measured is derived based on a measurement result of the measurement unit. The measurement unit is
A measuring head having a probe that can move in a predetermined trajectory;
The displacement of the measuring element in a direction parallel to the axis as the reference of the object to be measured when the measuring element is moved along a predetermined trajectory and the surface to be measured is copied by the measuring element. A measuring unit to measure,
The parallel hole measuring device according to claim 4, comprising: 6. The measuring head according to claim 4 or 5, wherein the measuring element is moved in a circular orbit having a radius of rotation R around an axis in which parallelism with respect to the axis of the centering unit is guaranteed. Parallel hole measuring device.

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