JP2008137074A - Method for manufacturing chassis for apparatus, and chassis for apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a chassis for an apparatus, which restrains traces caused by joining metal fitting members to a metal frame on the outer face of the chassis for an apparatus, and provide the chassis for an apparatus. <P>SOLUTION: The chassis for an apparatus comprises the metal frame 12 in which an apparatus is put, and the metal fitting members 14 with which the apparatus is mounted in the metal frame 12. In the invented manufacturing method, the chassis 10 for an apparatus is manufactured by joining the metal frame 12 and the metal fitting members 14. The metal fitting members 14 have protrusions 16 on the interface with the metal frame 12. The method comprises a pressurizing step in which the protrusions 16 are deformed by pressurization after making the protrusions 16 contact with the metal frame 12 so that an oxide film at the portion where the protrusions 16 contact with the metal frame 12 is removed, and a solid phase diffusion bonding step in which the metal frame 12 and the metal fitting members 16 are joined by solid phase diffusion of the metal with the contacting portion heated. It is preferable to add a coating step to the manufacturing method in which the metal frame 12 joined with the metal fitting members 14 by solid phase diffusion bonding is electrostatically coated with a powder paint. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a device casing and a device casing, and in particular, includes a metal frame for inserting a device and a metal attachment member for attaching the device to the metal frame, and joining the metal frame and the metal attachment member. The present invention relates to a method for manufacturing a device casing and a device casing.

  An equipment housing that houses electrical equipment, electronic equipment, or the like, for example, a bezel (screen frame) housing of a small or large flat display device is manufactured of a synthetic resin material, a metal material, or the like. And each member which comprises an apparatus housing | casing is generally joined by arc welding, rivet joining, etc. For example, Patent Document 1 discloses a video display device casing manufactured by welding a metal member using aluminum or magnesium.

JP 2000-330206 A

  By the way, when joining a metal frame into which equipment such as electrical parts, circuit parts or mechanism parts and a metal mounting member for attaching these equipment to the metal frame by arc welding, the heat generated during welding causes the metal frame to Since the surface is deformed, there is a possibility that traces due to joining such as welding traces remain on the outer surface of the equipment housing. Moreover, when joining by rivet joining etc., the trace by joining, such as a rivet trace, may remain on the outer surface of an apparatus housing | casing. Therefore, for example, before the surface treatment such as painting or anodizing treatment of aluminum, there is a case where a step of removing the trace caused by the above-mentioned joining may be required. And the process which removes the trace by joining increases, Productivity of an apparatus housing | casing falls, There exists a problem that manufacturing cost becomes high. In addition, the design of the device casing may be restricted due to the occurrence of the trace due to the above-described joining.

  Therefore, an object of the present invention is to provide a method for manufacturing a device casing and a device casing in which the outer surface of the device casing suppresses traces due to the joining of the metal frame and the metal mounting member.

  An apparatus casing manufacturing method according to the present invention includes a metal frame for inserting an apparatus and a metal mounting member for mounting the apparatus on the metal frame, and the apparatus casing manufactured by joining the metal frame and the metal mounting member. The metal attachment member has a protrusion on a surface to be joined to the metal frame, and after the protrusion is brought into contact with the metal frame, the protrusion is pressed and deformed to thereby The pressurization process which removes the oxide film in a contact part with a metal frame, and the solid phase diffusion joining process of heating a contact part and carrying out solid phase diffusion of a metal and joining are characterized by the above-mentioned.

  In the device housing manufacturing method according to the present invention, the tip section of the protrusion is formed at 50 degrees or more and 80 degrees or less.

  In the method for manufacturing an equipment casing according to the present invention, the pressurizing step is characterized by pressurizing and deforming the protrusion at a pressure of 0.52 MPa to a predetermined pressure.

  The method for manufacturing an equipment casing according to the present invention is characterized by comprising a painting step of electrostatically painting a metal frame, to which a metal mounting member is solid-phase diffusion bonded, with a powder paint.

  An apparatus housing according to the present invention includes a metal frame for inserting an apparatus and a metal attachment member for attaching the apparatus to the metal frame, and a method for manufacturing an apparatus enclosure manufactured by joining the metal frame and the metal attachment member. The metal attachment member has a protrusion on a surface to be joined to the metal frame, and after the protrusion is brought into contact with the metal frame, the protrusion is pressed and deformed to thereby form the protrusion and the metal frame. Characterized in that it is manufactured by a manufacturing method comprising: a pressurizing step for removing an oxide film at a contact portion of the substrate; and a solid phase diffusion bonding step for heating the contact portion to solid phase diffuse and bond the metal. .

  An apparatus housing according to the present invention includes a metal frame for inserting an apparatus and a metal attachment member for attaching the apparatus to the metal frame, and a method for manufacturing an apparatus enclosure manufactured by joining the metal frame and the metal attachment member. The metal attachment member has a protrusion on a surface to be joined to the metal frame, and after the protrusion is brought into contact with the metal frame, the protrusion is pressed and deformed to thereby form the protrusion and the metal frame. A pressurizing step for removing the oxide film at the contact portion, a solid phase diffusion joining step for heating the contact portion to solid-phase diffuse the metal and joining, and a metal frame on which the metal mounting member is solid-phase diffusion joined. And a coating process for electrostatic coating with a powder coating.

  The apparatus housing according to the present invention is for a flat display.

  As described above, according to the device casing manufacturing method and the device casing according to the present invention, the metal frame and the metal mounting member are bonded to each other on the outer surface of the device casing by suppressing heat. Traces due to joining with the mounting member can be suppressed.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. The device casing can be used for, for example, a flat display display device, a notebook computer, or the like. Of course, the device housing is not limited to the application of the above-described device, but can be applied to other devices. Below, the apparatus housing | casing used for a flat display display apparatus is mentioned as an example, and it demonstrates with the manufacturing method.

  FIG. 1 is a diagram illustrating a configuration of a device housing, FIG. 1 (a) is an overall view of the device housing, and FIG. 1 (b) is an enlarged view of an end portion of the device housing. The device housing 10 includes a metal frame 12 into which the device is placed and a metal attachment member 14 that attaches the device to the metal frame 12.

  The metal frame 12 has a function of inserting a display device or the like, and is manufactured by machining a metal material. As the metal material, for example, an aluminum alloy is preferably used in view of weight reduction and material cost. As the aluminum alloy, for example, 6000 series aluminum alloy can be used. Of course, depending on other conditions, the metal material is not limited to an aluminum alloy. The metal frame 12 can be manufactured by, for example, cutting or pressing. The thickness of the metal frame 12 is preferably designed to be thin as long as the mechanical strength can be maintained for weight reduction, and is, for example, 1.5 mm to 3.0 mm.

  The metal attachment member 14 has a function of attaching display display device components and the like to the metal frame 12, and is provided by being joined to the metal frame 12. As the metal material, for example, a 2000 series aluminum alloy or the like can be used in JIS display. Of course, depending on other conditions, the metal material is not limited to an aluminum alloy. The metal material used for the metal attachment member 14 may be the same metal material as the metal material used for the metal frame 12, or may be a different metal material. The metal attachment member 14 is manufactured by machining a metal material such as cutting. For the metal mounting member 14, for example, a cylindrical metal column can be used. Further, the metal mounting member 14 is formed with a female screw or a male screw for fixing a display display device component or the like.

  The metal attachment member 14 has a protrusion 16 on the surface to be joined to the metal frame 12. FIG. 2 is a cross-sectional view of the metal attachment member 14. As described later, the projection 16 is provided on the metal mounting member 14 by bringing the projection 16 into contact with the metal frame 12 and then pressurizing and deforming the projection 16. This is because the oxide film at the contact portion with the metal frame 12 is removed and solid phase diffusion bonding is performed. The tip section of the protrusion 16 is preferably formed at 50 degrees or more and 80 degrees or less. The apex angle (A) of the tip cross section of the protrusion 16 is 50 degrees or more because if it is less than 50 degrees, it is difficult to machine the protrusion 16 with a predetermined processing accuracy. Further, the apex angle (A) of the tip cross section of the protrusion 16 is 80 degrees or less, and it is difficult to deform when the apex angle (A) of the protrusion 16 is large, and the protrusion 16 and the metal frame 12 are not deformed. This is because it becomes difficult to become familiar with the contact portion, and the bonding strength between the metal frame 12 and the metal attachment member 14 becomes small. Of course, depending on other conditions, the tip cross section of the protrusion 16 is not limited to the apex angle (A) within the above range, and may be, for example, a mountain shape.

  The protrusion 16 can be formed in a circumferential shape on the surface to be joined to the metal frame 12, for example. And it is preferable that the diameter (d) of the projection part 16 shall be 0.6D or more and 0.9D or less. Here, D is the width of the head in the metal mounting member. The diameter (d) of the protrusion 16 is 0.6D or more because when the diameter (d) of the protrusion 16 is smaller than 0.6D, the contact area between the protrusion 16 and the metal frame 12 is reduced. This is because the amount of charge flowing in the unit area in the portion increases and the variation in bonding strength increases. The diameter (d) of the protrusion 16 is 0.9D or less because when the diameter (d) of the protrusion 16 is larger than 0.9D, the contact area between the protrusion 16 and the metal frame 12 increases. This is because the amount of charge flowing in the unit area at the contact portion is reduced, and the bonding strength is reduced. The diameter of the protrusion 16 is selected so that it can be easily formed by machining, and a stable bonding strength is always obtained in consideration of the power capacity of the bonding apparatus to be used. Of course, depending on other conditions, the diameter (d) of the protrusion 16 is not limited to the above range. Moreover, the height (H) of the protrusion 16 is, for example, 0.1D to 0.2D.

  Next, the joining of the metal frame 12 and the metal attachment member 14 will be described. The joining of the metal frame 12 and the metal attachment member 14 is performed including a pressurizing step and a solid phase diffusion joining step.

  The pressurizing step is a step of removing the oxide film at the contact portion between the projecting portion 16 and the metal frame 12 by bringing the projecting portion 16 into contact with the metal frame 12 and then pressurizing and deforming the projecting portion 16. . FIG. 3 is a view showing a state in which the metal mounting member 14 is set on the metal frame 12. The metal attachment member 14 is set by bringing the protrusion 16 into contact with a predetermined position of the metal frame 12. After the setting, the protrusion 16 is pressed and deformed by pressing the metal attachment member 14 with a press or the like. FIG. 4 is a diagram illustrating a state in which the protrusion 16 is pressed and deformed. By plastically deforming the contact portion between the protrusion 16 and the metal frame 12, the oxide film at the contact portion between the protrusion 16 and the metal frame 12 can be destroyed and removed.

  Here, it is preferable to pressurize and deform the protrusion 16 at a pressure not lower than 0.52 MPa and not higher than a predetermined pressure. The protrusion 16 is pressed at a pressure of 0.52 MPa or more because when the pressure is lower than 0.52 MPa, the plastic flow is reduced at the interface between the protrusion 16 and the metal frame 12. This is because the oxide film at the contact portion may not be sufficiently removed, and the contact resistance at the contact portion may increase. Further, when the protrusion 16 is pressurized below a predetermined pressure, the contact resistance between the metal mounting member 14 and the metal frame 12 decreases when the plastic flow increases at the interface between the protrusion 16 and the metal frame 12. This is because a short-circuit phenomenon may occur when a current is passed through the contact portion.

  The solid phase diffusion bonding step is a step in which the contact portion between the protrusion 16 and the metal frame 12 is heated and the metal is solid phase diffused and bonded. FIG. 5 is a diagram illustrating a state in which the contact portion between the protrusion 16 and the metal frame 12 is heated and the metal is solid-phase diffused and bonded. 5 includes a capacitor 20, a resistor 22, switches 24 and 26, and a power supply 28. By causing the electric charge stored in the capacitor 20 to flow in the contact portion between the protruding portion 16 and the metal frame 12, the contact portion can be heated by Joule heat generated when a current is passed. Then, by heating the contact portion, the metal material is softened to increase the contact area, and the metal can diffuse to each other and be solid-phase bonded. Here, the pulse width of the charge flowing through the contact portion is preferably about 40 microseconds, and the total charge is preferably 21 to 25 coulombs. Of course, depending on other conditions, the pulse width and the total charge amount are not limited to the above values.

  As described above, according to the above-described configuration, the metal frame and the metal mounting member are joined by solid phase diffusion bonding so that the metal frame and the metal mounting member are bonded while suppressing heat. It is possible to perform bonding while suppressing traces due to bonding with the mounting member. And since the trace by joining with a metal frame and a metal attachment member can be suppressed and it can join, the process of repairing a joining trace becomes unnecessary, productivity of an apparatus housing | casing improves and manufacturing cost can be suppressed.

  According to the above configuration, even when an aluminum alloy that is a good electric body and forms a stable oxide film on the surface is used for the metal frame and the metal mounting member, the oxide film at the contact portion between the metal frame and the metal mounting member Since it removes and joins, it can join to the outer surface of an apparatus housing | casing, suppressing the trace by joining.

  The relationship between the pressure applied to the protrusion of the metal mounting member and the bonding strength between the metal mounting member and the metal frame was evaluated. As the metal frame, a metal member having a plate thickness of 2 mm made of No. 6000 series aluminum alloy was used. As the metal mounting member, a metal column of 2000 series aluminum alloy having a head width (D) of 12 mm or less was used.

  First, the optimum value of the pulse width of the current flowing through the contact portion between the protrusion and the metal frame was determined. The pulse width of the current is closely related to other physical variables in the bonding conditions. Basically, in the above-described bonding apparatus shown in FIG. 5, the amount of charge stored in the capacitor (C) and the resistance ( R). The resistance (R) is a combined resistance of the resistance (R1) of a plurality of components constituting the circuit and the contact resistance (R2) between the protrusion and the metal frame. The contact resistance (R2) is a solid phase It varies with time during the diffusion bonding process. Therefore, as a result of a preliminary test, the optimum value of the current pulse width was set to about 40 microseconds.

  As for the shape of the protrusion, the diameter (d) of the protrusion was 7.0 mm, the apex angle (A) of the tip cross section was 60 degrees, and the height (H) was 1.0 mm. And the pressure which pressurizes a projection part was 0.47 MPa, 0.52 MPa, and 0.57 MPa. Further, the total amount of charge flowing through the contact portion between the protrusion and the metal frame was changed from 21 coulombs to 24 coulombs, and the metal frame and the metal attachment member were subjected to solid phase diffusion bonding to determine the joint breaking load. FIG. 6 is a diagram illustrating a test method for a joint fracture test. With the metal frame fixed, a load is applied to the head of the metal mounting member approximately horizontally as indicated by the arrow X, and the load when the metal mounting member peels and breaks at the joint surface with the metal frame is the joint breaking load. As sought.

  FIG. 7 is a diagram illustrating the relationship between the pressure applied to the protrusion and the joint breaking load between the metal attachment member and the metal frame. In FIG. 7, the vertical axis represents the joint breaking load, the horizontal axis represents the total charge, and the pressure applied to the protrusion is shown as a variable. As shown in FIG. 7, a relationship was obtained in which the junction breaking load increases as the total charge increases. When the pressure applied to the protrusions was 0.52 MPa or more, the slope of the joint fracture load curve became gentle, and the change in the joint fracture load was small with respect to the total charge. Therefore, when the pressure applied to the protrusion is 0.52 MPa or more, the slope of the joint fracture load curve is small, so even when the total charge changes slightly during production, the variation in joint fracture load is reduced and stable. Solid phase diffusion bonding can be performed. In addition, the trace by joining on the outer surface was not seen in each apparatus housing | casing manufactured by making pressure into 0.47MPa, 0.52MPa, and 0.57MPa.

  Next, the relationship between the apex angle of the tip cross section at the protrusion and the joint breaking load between the metal mounting member and the metal frame was evaluated. As for the shape of the protrusion, the diameter (d) of the protrusion was 7.0 mm, the height (H) was 1.0 mm, and the apex angle (A) of the tip section was changed to 60 degrees, 70 degrees, and 90 degrees. . The pressure applied to the protrusions was 0.52 MPa. Then, the total amount of charge flowing through the contact portion between the protrusion and the metal frame was changed from 19.5 coulombs to 23.5 coulombs, the metal frame and the metal mounting member were joined, and the joint breaking load was obtained. The pulse width of the current was about 40 microseconds.

  FIG. 8 is a diagram showing the relationship between the apex angle of the tip cross-section at the protrusion and the joint breaking load between the metal mounting member and the metal frame. In FIG. 8, the vertical axis represents the junction breaking load, the horizontal axis represents the total charge, and the apex angle of the tip cross section at the protrusion is shown as a variable. When the total charge amount was constant, the smaller the apex angle of the tip cross-section at the protrusion, the greater the bond breaking load. This is because the smaller the apex angle of the tip cross-section at the protrusion, the easier it is to deform, and it becomes easier to become familiar with the contact portion between the protrusion and the metal frame. In addition, in each of the device casings manufactured with the apex angle of the tip cross-section at the protrusions being 60 degrees, 70 degrees, and 90 degrees, no traces due to bonding were seen on the outer surface.

  Next, the relationship between the diameter (d) of the protrusion and the joint breaking load between the metal attachment member and the metal frame was evaluated. The shape of the protrusion changes from 60 ° to the apex angle (A) of the tip section, 1.0 mm in height (H), and the diameter (d) of the protrusion changes to 0.71D, 0.86D, and 1.0D. I let you. Here, D is the width of the head in the metal mounting member. The pressure applied to the protrusions was 0.55 MPa. Then, the total amount of charge flowing through the contact portion between the protrusion and the metal frame was changed from 19.5 coulombs to 23.5 coulombs, the metal frame and the metal mounting member were joined, and the joint breaking load was obtained. The pulse width of the current was about 40 microseconds.

  FIG. 9 is a diagram showing the relationship between the diameter (d) of the protrusion and the joint breaking load between the metal mounting member and the metal frame. In FIG. 9, the vertical axis represents the joint breaking load, the horizontal axis represents the total charge, and the diameter (d) of the protrusion is shown as a variable. As shown in FIG. 9, when the diameter (d) of the protruding portion is increased, the result that the joint breaking load is reduced is obtained. This is because when the diameter (d) of the protrusion is increased, the current flowing per unit area of the contact portion is reduced, and the familiarity of the contact surface is suppressed. Further, it was found that when the diameter (d) of the protruding portion is increased, the joint fracture load curve becomes gentle and the joint strength is more stable. Therefore, when the diameter (d) of the protrusion is larger, even when the total amount of charge changes slightly during production, the variation in the bonding breakdown load is reduced, and solid phase diffusion bonding can be performed more stably. In addition, the trace by joining on the outer surface was not seen in each apparatus housing | casing manufactured by making the diameter (d) of a protrusion part into 0.71D, 0.86D, and 1.0D.

Table 1 shows the optimum manufacturing conditions for the device casing obtained from the evaluation results.

  In addition, as a device casing used for a personal computer, a metal frame made of an aluminum alloy having a plate thickness of 0.5 mm is generally used. For the metal mounting member, a metal column made of an aluminum alloy having a diameter of about 7 mm and a length of 4 mm to 7 mm is used. Therefore, the metal frame having the above shape and the metal mounting member were bonded under the solid phase diffusion bonding conditions shown in Table 1, and the bonding characteristics were evaluated. For the metal frame and the metal mounting member, 6000 series and 2000 series aluminum alloys were used, respectively. And as a result of testing by the joint fracture test method shown in FIG. 6, a joint fracture load greater than 300 N was obtained. Further, after solid-phase diffusion bonding of the metal mounting member to the metal frame, the appearance of the outer surface of the device housing was observed, and as a result, no bonding trace was found. Therefore, it has been found that even when a thin aluminum alloy metal frame having a thickness of 0.5 mm is used, the metal attachment member can be bonded to the metal frame while suppressing traces due to bonding on the outer surface of the device casing.

  Next, a method for manufacturing another device casing will be described. In addition, the same code | symbol is attached | subjected to the same element and detailed description is abbreviate | omitted. The manufacturing method of the device casing 10 further includes a painting process in which the metal frame 12 to which the metal mounting member 14 is solid-phase diffusion bonded is electrostatically coated with a powder paint.

  The metal frame 12 to which the metal attachment member 14 is solid-phase diffusion bonded is used because the trace of joining the metal attachment member 14 and the metal frame 12 on the outer surface of the metal frame 12 is suppressed. Because there is no need to do. When the metal mounting member 14 is joined to the metal frame 12 by arc welding, rivet joining, or the like, welding marks and rivet marks remain on the outer surface of the metal frame 12. Therefore, putty or the like is applied to remove these traces before the paint finish. Since putty and the like are generally insulative, if the putty is attached to the surface of an object to be coated, it is not preferable for electrostatic coating. On the other hand, in the metal frame 12 in which the metal mounting member 14 is solid phase diffusion bonded, the trace of bonding the metal mounting member 14 and the metal frame 12 on the outer surface of the metal frame 12 is suppressed. This is because there is no need to apply and repair the bonding marks or the like.

  The metal frame 12 is formed using, for example, an L-shaped angle made of an aluminum alloy. Here, the length of the L-shaped angle used in the 65-inch model of the plasma type flat television is, for example, 810 mm, and the plate thickness of the L-shaped angle is, for example, 2.0 mm to 3.0 mm. The length of the L-shaped angle used in the 103 type model is, for example, 1310 mm, and the plate thickness of the L-shaped angle is, for example, 4.0 mm. The L-shaped angle is subjected to machining such as drilling as necessary. Moreover, the metal attachment member 14 is joined to the metal frame 12 by the pressurization process and the solid phase diffusion bonding process described above.

  Powder paint is used as the paint used for painting. This is because the powder paint does not contain a volatile organic solvent or the like, and therefore, pollution can be reduced compared with the case of using a solvent-based paint. Further, since the oversprayed powder coating material can be collected and reused, the production cost of the device housing 10 can be further reduced. As the powder coating, for example, polyester resin powder coating, epoxy resin powder coating, acrylic resin powder coating, or the like is used. Of course, the powder paint is not limited to these paints.

  An electrostatic coating method is used as a powder coating method. In the electrostatic coating method, the metal frame 12 to which the metal mounting member 14 is solid phase diffusion bonded is used as an anode, an electrostatic coating gun for spraying the powder coating is used as a cathode, a high voltage is applied, and the powder coating is charged. This is a coating method in which the metal mounting member 14 is fixed to the metal frame 12 obtained by solid phase diffusion bonding with an electrostatic force. By applying the electrostatic coating method, it is possible to improve the yield of the paint and the quality of the finished coating as compared with the case of applying by the general spray coating method. Generally, the electrostatic coating method and the electrostatic coating equipment currently performed by electrostatic coating, such as aluminum alloy, can be used for electrostatic coating. Note that pretreatment such as degreasing is performed before electrostatic coating of the powder coating.

  The coating film is baked by heating the metal frame 12 to which the powder coating material is attached by electrostatic coating. The coating film is baked by, for example, inserting the metal frame 12 with the powder coating attached into a baking furnace heated from 160 ° C. to 200 ° C. As the baking furnace, a heating furnace generally used for baking a coating film can be used. After the coating film is baked, the appearance of the coating is inspected and packed after the appearance inspection.

  As described above, according to the above configuration, it is not necessary to repair the outer surface of the metal frame with the insulating putty by using the metal frame obtained by solid phase diffusion bonding of the metal mounting member. Can be painted. As a result, the productivity of the device casing is improved, and a device casing manufacturing method excellent in an environment that does not discharge volatile organic solvents can be provided.

In embodiment of this invention, it is a figure which shows the structure of an apparatus housing | casing. In embodiment of this invention, it is a figure which shows the cross section of a metal attachment member. In embodiment of this invention, it is a figure which shows the state which set the metal attachment member to the metal frame. In embodiment of this invention, it is a figure which shows the state which pressurized and deformed the projection part. In embodiment of this invention, the contact part of a projection part and a metal frame is heated, and it is a figure which shows the state currently joined by carrying out solid phase diffusion of the metal. In embodiment of this invention, it is a figure which shows the test method of a joint fracture test. In embodiment of this invention, it is a figure which shows the relationship between the pressure loaded on a projection part, and the joint destruction load of a metal attachment member and a metal frame. In embodiment of this invention, it is a figure which shows the relationship of the apex angle of the front-end | tip cross section in a projection part, and the joint fracture load of a metal attachment member and a metal frame. In embodiment of this invention, it is a figure which shows the relationship between the diameter of a projection part, and the joint destruction load of a metal attachment member and a metal frame.

Explanation of symbols

  10 equipment housing, 12 metal frame, 14 metal mounting member, 16 protrusion, 20 capacitor, 22 resistor, 24, 26 switch, 28 power supply.

Claims (6)

A metal frame to put the equipment,
A metal mounting member for mounting the device on the metal frame;
With
A manufacturing method of an equipment casing manufactured by joining a metal frame and a metal mounting member,
The metal mounting member has a protrusion on the surface to be joined to the metal frame,
A pressing step for removing the oxide film at the contact portion between the protrusion and the metal frame by pressing and deforming the protrusion after bringing the protrusion into contact with the metal frame;
A solid phase diffusion bonding step in which the contact portion is heated to bond the metal by solid phase diffusion; and
A method for manufacturing a device casing, comprising: It is a manufacturing method of the equipment case according to claim 1,
The method of manufacturing a device casing, wherein the tip cross-section of the protrusion is formed at 50 degrees or more and 80 degrees or less. It is a manufacturing method of the equipment case according to claim 1 or 2,
The method of manufacturing an equipment casing, wherein the pressurizing step is performed by pressing and deforming the protrusion at a pressure of 0.52 MPa or more and a predetermined pressure or less. It is a manufacturing method of the apparatus housing according to any one of claims 1 to 3,
A device housing manufacturing method comprising a coating step of electrostatically coating a metal frame, to which a metal mounting member is solid-phase diffusion bonded, with a powder coating.   A device casing manufactured by the method for manufacturing a device casing according to any one of claims 1 to 4. The device casing according to claim 5,
The device housing is for a flat display.

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