JP2008135600A - Method and device for forming pattern - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern formation method and a pattern forming device, capable of forming a pattern on a substrate at a target position with accuracy, while heating the substrate. <P>SOLUTION: A mark is arranged and formed at an upper left corner on a mother sheet 4M before baking. A mark with the mother sheet 4M heated at high temperature (46°C) is photographed by a camera. The image data of the mark, when the sheet is heated to the high temperature (46°C) is compared with that of the mark at room temperature (26°C) to calculate the degree of deformation in the mother sheet 4M, and bit map data is corrected, based on the degree of deformation that takes into consideration the degree of deformation in the green sheet 4G at the high temperature (46°C). Based on the corrected bit map data, the wiring pattern of the internal wiring 6 is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a pattern forming method and a pattern forming apparatus.

In recent years, in order to form a functional pattern, a functional material is dissolved or dispersed in a solvent such as acetone, processed into a liquid material, and further formed into fine droplets (ink) on a substrate for patterning. A so-called droplet discharge method (inkjet method) is known (see, for example, Patent Document 1).

In this type of droplet discharge method (inkjet method), by sequentially discharging droplets (ink) while heating the substrate, the drying speed of the droplets (ink) disposed on the substrate is increased. A technique for improving the patterning speed has been proposed.
JP 2004-306372 A

However, in particular, when a known aqueous solvent is used as the solvent, the substrate temperature needs to be heated to about 46 ° C. in order to reliably evaporate the solvent. As a result, although depending on the constituent material of the substrate, the substrate normally expands during heating. For example, when a green sheet is used as the substrate, when heated from 26 ° C. (room temperature) to 46 ° C., 80 μm
It will be extended to some extent.

As a result, in the case where the pattern is formed while heating the substrate, there is a problem that the pattern cannot be formed at a desired position because the droplets are arranged on the expanded substrate. For example, in the case where a pattern is formed so as to be connected to a via hole in a green sheet in which a via hole or the like has been formed in advance, the arrangement position of the liquid droplet is greatly shifted due to the thermal expansion of the green sheet. For this reason, the formed pattern is not connected to the via hole, and a substrate having desired characteristics cannot be manufactured.

The present invention has been made in view of the above-described problems, and its object is to provide a pattern forming method and pattern capable of accurately forming a pattern formed on a substrate at a target position while heating the substrate. It is to provide a forming apparatus.

The pattern forming method of the present invention is a pattern forming method for forming a pattern on the surface of the substrate by sequentially ejecting droplets of a functional liquid containing a functional material toward the substrate based on data stored in advance. A heating step of heating the substrate to a temperature not lower than the boiling point of the composition constituting the functional liquid, the surface temperature of which is not lower than the temperature of the functional liquid at the time of discharging the droplets, and the substrate before being heated; And a calculation step of calculating the degree of deformation of the substrate due to the heating from a comparison result with the substrate when heated, and a correction step of correcting the data based on the degree of deformation.

According to this, since the substrate is heated, the droplets that have landed on the substrate are immediately dried. For this reason, a pattern is formed in a short time. Even when the substrate is deformed by heating, the data is corrected in accordance with the degree of deformation of the substrate caused by heating, so that the droplets land at a desired position. As a result, the pattern can be accurately formed at the target position.

In this pattern forming method, the calculation step includes arranging and forming a mark on the substrate in advance, and based on a shift amount between the mark before the substrate is heated and the mark when the substrate is heated. The degree of deformation of the substrate may be calculated.

According to this, the deformation degree can be easily calculated.
In this pattern forming method, the substrate is a porous substrate and is a low-temperature firing sheet composed of ceramic particles and a resin, and the functional liquid is a liquid material in which a metal material is dispersed as the functional material. It may be.

According to this, the wiring pattern formed on the substrate can be accurately formed in a target position in a short time.
In this pattern formation method, the substrate may be a circuit substrate on which a circuit element is mounted and wiring electrically connected to the mounted circuit element is formed.

According to this, a circuit board having desired characteristics on which circuit elements are formed can be formed in a short time.
In this pattern forming method, the data may be bitmap data.

According to this, data can be easily corrected according to the degree of deformation of the substrate.
In this pattern formation method, the calculation step may correct the bitmap data when the degree of deformation of the substrate due to the heating changes by one of the bitmap data.

According to this, it is possible to form a pattern that does not break or change the line width in the middle.
In this pattern forming method, the correction may be performed independently along the vertical direction of the substrate and the horizontal direction of the substrate.

According to this, even if the substrates have different degrees of deformation in the vertical direction and the horizontal direction, the pattern can be accurately formed at the target position.
The pattern forming apparatus of the present invention is a pattern forming apparatus that sequentially ejects droplets of a functional liquid containing a functional material toward a substrate based on data stored in advance to form a pattern on the surface of the substrate. Heating means for heating the substrate to a temperature not lower than the boiling point of the composition constituting the functional liquid, the surface temperature of which is higher than the temperature of the functional liquid at the time of discharging the droplets, and the substrate before heating And a calculation means for calculating the degree of deformation of the substrate by the heating from a comparison result with the substrate when heated, a correction means for correcting the data based on the degree of deformation, and the correction data according to the corrected data Discharge means for discharging droplets.

According to this, since the substrate is heated, the droplets that have landed on the substrate are immediately dried. For this reason, a pattern is formed in a short time. Even when the substrate is deformed by heating, the data is corrected in accordance with the degree of deformation of the substrate caused by heating, so that the droplets land at a desired position. As a result, the pattern can be accurately formed at the target position.

In this pattern forming apparatus, a camera is provided at a position facing the substrate, the camera photographs the mark arranged and formed on the substrate when heated, and the calculation means is photographed by the camera. The degree of deformation of the substrate may be measured based on the amount of deviation of the mark from the arrangement position of the mark formed and formed on the substrate before heating.

According to this, the deformation degree can be easily calculated.
In this pattern forming apparatus, the functional liquid may be a liquid material in which a metal material constituting a wiring electrically connected to a circuit element mounted on the substrate is dispersed.

According to this, a circuit board having desired characteristics on which circuit elements are formed can be formed in a short time.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a pattern forming method and a pattern forming apparatus embodying the present invention will be described with reference to the drawings.
First, the circuit module 1 formed using the pattern forming method and the pattern forming apparatus of the present invention will be described.

In FIG. 1, a circuit module 1 includes an LTCC multilayer substrate 2 formed in a plate shape, and a semiconductor chip 3 connected to the upper side of the LTCC multilayer substrate 2 by wire bonding.

The LTCC multilayer board 2 is an LTCC board 4 as a plurality of circuit boards formed in a sheet shape.
It is a laminated body. Each LTCC substrate 4 is made of a glass ceramic material (for example, a sintered body of a glass component such as borosilicate alkali oxide and a ceramic component such as alumina).
(Porous substrate) having a thickness of several hundred μm.

Each LTCC substrate 4 includes various circuit elements 5 such as a resistance element, a capacitive element, and a coil element, internal wiring 6 that electrically connects each circuit element 5, and a predetermined hole diameter that exhibits a stack via structure and a thermal via structure. A plurality of via holes 7 having a diameter (for example, 30 μm) and via wirings 8 filled in the via holes 7 are formed.

Each internal wiring 6 is a sintered body obtained by sintering fine particles of silver (Ag) as a functional material and a metal material, and uses a droplet discharge device (inkjet device) as a pattern forming device of the present invention. Formed.

Next, a droplet discharge device 20 for manufacturing the LTCC multilayer substrate 2 will be described with reference to FIGS.
It explains according to. FIG. 2 is an overall perspective view illustrating the droplet discharge device 20. 3 and 4 are diagrams for explaining the liquid droplet ejection head 30, respectively.

In the present embodiment, a case will be described in which the pattern of the internal wiring 6 is formed on the mother sheet 4M that allows a plurality of LTCC substrates 4 to be cut out. Further, in the following, for the sake of simplicity, as shown in FIG. 6, 10 × 10 L in a matrix form on one mother sheet 4M.
A case where the TCC substrate 4 is formed will be described. That is, as shown in FIG. 6, 10 × 10 formation regions Z are arranged and formed in a matrix on one mother sheet 4M, and the internal wiring 6 constituting the LTCC substrate 4 is formed in each formation region Z. A case where a wiring pattern is formed will be described. For convenience of explanation, the vertical direction of the mother sheet 4M is defined as the Y arrow direction, and the horizontal direction of the mother sheet 4M is defined as the X arrow direction.

In FIG. 2, the droplet discharge device 20 has a base 21 formed in a rectangular parallelepiped shape.
A pair of guide grooves 22 extending along the longitudinal direction (Y arrow direction) is formed on the upper surface of the base 21. Above the guide groove 22, a stage 23 is provided that moves along the guide groove 22 in the Y arrow direction and the counter-Y arrow direction. A placement portion 24 is provided on the upper surface of the stage 23 so that the mother sheet 4M is placed thereon. That is, this mother sheet 4M is obtained by converting the LTCC substrate 4 before firing (hereinafter referred to as “green sheet 4G”) to 10 × 10 (= 1).
00) can be cut out. And the mounting part 24 is the mother sheet | seat 4 of the mounted state.
M is positioned and fixed with respect to the stage 23, and the mother sheet 4M is conveyed in the Y arrow direction and the anti-Y arrow direction.

A rubber heater H as a heating means is embedded in the upper surface of the stage 23. The mother sheet 4M placed on the placement unit 24 is heated to a predetermined temperature by the rubber heater H. In this embodiment, it is heated to 46 ° C.

In addition, a gate-shaped guide member 25 is installed on the base 21 so as to straddle the direction (X arrow direction) orthogonal to the transport direction. An ink tank 26 is disposed above the guide member 25. The ink tank 26 stores the metal ink F as the functional liquid and supplies the stored metal ink F to the droplet discharge head 30 at a predetermined pressure.

The metal ink F is, for example, a water-based metal ink in which silver (Ag) fine particles having a particle diameter of several nm are dispersed in an aqueous solvent. When the droplet Fb of the metal ink F is heated, a part of the solvent or the dispersion medium evaporates to thicken the outer shape of the surface.

The guide member 25 is formed with a pair of upper and lower guide rails 28 extending in the X arrow direction over substantially the entire width in the X arrow direction. A pair of upper and lower guide rails 28 includes a carriage 29.
Is attached. The carriage 29 is guided by the guide rail 28 and moves in the X arrow direction and the counter X arrow direction.

The carriage 29 is provided with a droplet discharge head (hereinafter simply referred to as “discharge head”) 30 and a camera K as discharge means.
3 and 4 are views of the ejection head 30 as viewed from the mother sheet 4M side (lower side).

In FIG. 3, the ejection head 30 includes 15 ejection head pairs H1, H along the X arrow direction.
2, H3, ..., H15. Each of the ejection head pairs H1 to H15 includes a first ejection head Ha and a second ejection head H provided in the Y arrow direction with respect to the first ejection head Ha.
b. The nozzle plate 31 of each ejection head Ha, Hb is a pair of nozzle rows N
L is provided. As shown in FIG. 4, in each nozzle row NL, a plurality of nozzles N are arranged and formed at an equal pitch along the X arrow direction. In this embodiment, 200 nozzles N are arranged and formed at a pitch of 40 μm in each nozzle row NL.

Further, in each of the ejection heads Ha and Hb, each nozzle N of one nozzle row NL is arranged with a half-pitch shift along the X arrow direction with respect to each nozzle N of the other nozzle row NL.
Accordingly, in each of the ejection heads Ha and Hb, each nozzle N of the other nozzle row NL is positioned at an intermediate position of each nozzle N of one nozzle row NL. That is, one nozzle row N
The L nozzles N interpolate between the nozzles N of the other nozzle row NL. In this embodiment, since each nozzle N is arranged and formed at a pitch of 40 μm in each nozzle row NL, in each ejection head Ha and Hb, the nozzle N is arranged at a pitch of 20 μm along the X arrow direction. Will be placed. Accordingly, in each of the ejection heads Ha and Hb, 2 along the X arrow direction.
× 200 = 400 nozzles N are arranged at an equal pitch of 20 μm.

Further, each nozzle row NL of the first ejection head Ha is arranged with a half pitch shift along the X arrow direction with respect to each nozzle row NL of the second ejection head Hb. Accordingly, the first discharge head H
The nozzles N arranged and formed in the second ejection head Hb are located at the intermediate positions of the nozzles N arranged and formed in a. That is, each nozzle N of each nozzle row NL of the first ejection head Ha interpolates between each nozzle N of the nozzle row NL of the second ejection head Hb. In this embodiment, since the nozzle rows NL of the ejection heads Ha and Hb are arranged at a pitch of 20 μm, in each ejection head pair H1 to H15, the nozzle N is 10 along the X arrow direction.
It will be arranged at a pitch of μm. Accordingly, in each of the ejection head pairs H1 to H15, 2 × 400 = 800 nozzles N are arranged at an equal pitch of 10 μm along the X arrow direction.

As shown in FIG. 3, the ejection head pairs H1 to H15 are partially overlapped and connected in a stepped manner so that the nozzles N are continuously arranged at equal intervals along the X arrow direction. ing. Accordingly, by arranging the ejection head pairs H1 to H15 as described above, 15 × 800 = 1.2 × 10 ⁴ nozzles N are arranged at an equal pitch of 10 μm along the X arrow direction as a whole. Yes.

FIG. 5 is a cross-sectional view of a main part for explaining the internal configuration of the first ejection head Ha of the ejection head 30. Since the second ejection head Hb has the same configuration as the first ejection head Ha, detailed description thereof is omitted.

In FIG. 5, each discharge head Ha has a supply tube 30T connected to the upper side thereof. The supply tube 30T is disposed so as to extend in the Z arrow direction, and supplies the metal ink F from the ink tank 26 to the ejection head 30.

On the upper side of the nozzle N, a cavity 32 communicating with the supply tube 30T is formed. The cavity 32 accommodates the metal ink F from the supply tube 30T and supplies the metal ink F to the corresponding nozzle N. On the upper side of the cavity 32, a vibration plate 33 is attached, which vibrates in the vertical direction and expands and contracts the volume in the cavity 32. A piezoelectric element PZ corresponding to the nozzle N is disposed on the upper side of the vibration plate 33. The piezoelectric element PZ contracts and expands in the vertical direction to vibrate the diaphragm 33 in the vertical direction. Diaphragm 33 that vibrates vertically
Forms metallic ink F into droplets Fb of a predetermined size and ejects them from the corresponding nozzles N. The discharged droplet Fb flies in the direction opposite to the arrow Z of the corresponding nozzle N, and the mother sheet 4
It lands at a predetermined position in each of the formation regions Z arranged and formed on the M drawing plane (pattern formation surface 4Ma).

As described above, when the metal ink F landed in each formation region Z is heated, a part of the solvent or the dispersion medium evaporates, and the outer shape of the surface thickens, and the outer edge thickens. The metal ink F is localized by stopping its own wetting and spreading along the surface direction of the mother sheet 4M. Then, the metal inks F that have landed and localized in the formation regions Z are arranged so as to be connected in series, for example, three line-like internal wirings as shown in FIG. 6 wiring patterns are formed.

As shown in FIG. 2, the camera K is provided on the carriage 29 at a position adjacent to the ejection head 30. The camera K is provided so as to be able to take an image on the pattern forming surface 4Ma of the mother sheet 4M placed on the placement unit 24. Specifically, as shown in FIG. 7, a mark M is formed at the upper left corner of the mother sheet 4M before firing. The mark M is formed so as to be in close contact with the mother sheet 4M before firing at normal temperature (26 ° C.) in areas other than the respective formation areas Z on the pattern formation surface 4Ma of the mother sheet 4M. It is. The mark M of the present embodiment has a lattice shape. The camera K captures the state of the mark M and outputs the captured image data of the mark M to the control device 50 described later.

Next, the electrical configuration of the droplet discharge device 20 will be described with reference to FIG.
As shown in FIG. 8, the droplet discharge device 20 includes a control device 50. An input / output device 51 having various operation switches and a display is connected to the control device 50. The input / output device 51 displays the processing status of various processes executed by the droplet discharge device 20 and the internal wiring 6.
The bitmap data BD as data for forming the data is input to the control device 50.

The bitmap data BD is data defining ON or OFF of each piezoelectric element PZ according to the value of each bit (“0” (L level) or “1” (H level)). Specifically, the pattern formation surface 4Ma of the mother sheet 4M of the present embodiment is 1.2 × 1 along the direction of the arrow Y.
By dividing equally into 0 ⁴ and 1.2 × 10 ⁴ along the X arrow direction, (1.2 × 10 4
⁴ ) × (1.2 × 10 ⁴ ) pieces of small square regions R (see FIG. 6) are virtually partitioned. The bitmap data BD is data defining whether or not the droplets Fb are to be discharged to the corresponding regions R on the mother sheet 4M through which the discharge head 30 (each nozzle N) passes.

That is, as described above, the ejection head pair H1 to H15 is 15 × 800 as a whole.
= 1.2 × 10 ⁴ nozzles N are arranged along the X arrow direction. The bitmap data BD is used to turn each piezoelectric element PZ on or off at the timing when each nozzle N reaches a position facing each formation region Z when the mother sheet 4M is at room temperature (26 ° C.). The number of data is (1.2 × 10 ⁴ ) × (1.2 × 10 ⁴ ).

The control device 50 includes a CPU 50A, a ROM 50B, a RAM 50C, etc. as calculation means. Various drive control programs and data correction programs are stored in the ROM 50B. The drive control program is a program for executing a reciprocating process of the stage 23 and the carriage 29, a heating control process of the rubber heater H, a drive control process of the camera K, a drive control process of the piezoelectric element PZ, and the like. The RAM 50C stores bitmap data BD and image data of the mark M when the mother sheet 4M is at room temperature (26 ° C.) in advance.

The data correction program is data for independently correcting the bitmap data BD stored in the RAM 50C to the components in the X arrow direction and the Y arrow direction according to the degree of thermal deformation of the mother sheet 4M. Specifically, the mother sheet 4M placed on the placement unit 24 is heated by the rubber heater H, but expands with a size corresponding to the heating temperature at this time. The data correction program shrinks the bitmap data BD based on the degree of expansion of the mother sheet 4M due to the heating after the mother sheet 4M has been heated and returned to room temperature (26 ° C.), that is, to the original size. A bitmap for each component in the X arrow direction and each component in the Y arrow direction so that the droplet Fb is landed in advance in each formation region Z of the mother sheet 4M where the internal wiring 6 is to be disposed and formed. This is for correcting the data BD.

The data correction program of the present embodiment inserts only one dot into the bitmap data BD when the mother sheet 4M is displaced by one nozzle (10 μm) from the normal temperature (26 ° C.) by heating. This is a program to be corrected. Therefore, for example, when the region R is moved up by one (10 μm) along the arrow Y direction, the bitmap data BD is corrected to the bitmap data BD that discharges the droplets Fb for one extra column. Is done.

The CPU 50A executes a reciprocating process of the stage 23 and the carriage 29, a heating control process of the rubber heater H, a drive control process of the camera K, a drive control process of the piezoelectric element PZ, and the like according to various programs stored in the ROM 50B.

Further, the CPU 50A inputs the image data of the mark M when the mother sheet 4M becomes high temperature (46 ° C.) from the camera K. Then, the CPU 50A reads the image data of the mark M when the mother sheet 4M stored in the RAM 50C in advance is at room temperature (26 ° C.). Then, the CPU 50A displays the mark M when the mother sheet 4M becomes high temperature (46 ° C.).
Is compared with the image data of the mark M at normal temperature (26 ° C.) to calculate the degree of thermal deformation of the mother sheet 4M. That is, with the expansion of the mother sheet 4M, the mark M is arranged so as to be shifted from the mark M when the formation position is normal temperature (26 ° C.) along the Y arrow direction and the X arrow direction. The CPU 50A calculates the degree of thermal deformation of the mother sheet 4M during heating from the amount of deviation along the Y arrow direction and the X arrow direction. Then, the CPU 50A corrects the bitmap data BD from the calculated degree of thermal deformation according to the data correction program.

An X-axis motor drive circuit 52 is connected to the control device 50. The control device 50 outputs a drive control signal to the X-axis motor drive circuit 52. In response to the drive control signal from the control device 50, the X-axis motor drive circuit 52 rotates the X-axis motor MX for moving the carriage 29 forward or backward.

Further, a Y-axis motor drive circuit 53 is connected to the control device 50. Control device 50
Outputs a drive control signal to the Y-axis motor drive circuit 53. In response to the drive control signal from the control device 50, the Y-axis motor drive circuit 53 rotates the Y-axis motor MY for moving the stage 23 forward or backward.

Furthermore, a head drive circuit 54 is connected to the control device 50. Control device 50
Outputs a discharge timing signal LT synchronized with a predetermined discharge frequency to the head drive circuit 54. The control device 50 outputs a drive signal COM for driving each piezoelectric element PZ to the head drive circuit 54 in synchronization with the ejection frequency. The control device 50 generates a discharge control signal SI synchronized with a predetermined frequency using the corrected bitmap data BD, and serially transfers the discharge control signal SI to the head drive circuit 54. The head drive circuit 54 serially / parallel converts the ejection control signal SI from the control device 50 in correspondence with each piezoelectric element PZ.
Further, every time the head driving circuit 54 receives the ejection timing signal LT from the control device 50, the head driving circuit 54 latches the serial / parallel converted ejection control signal SI, and drives the piezoelectric element PZ selected by the ejection control signal SI. COM is supplied.

The control device 50 is connected to a rubber heater drive circuit 55. The control device 50 outputs a drive control signal to the rubber heater drive circuit 55. In response to the drive control signal from the control device 50, the rubber heater drive circuit 55 drives the rubber heater H to control the heating of the mother sheet 4M placed on the stage 23 so as to reach a predetermined temperature. In the present embodiment, the temperature of the mother sheet 4M is equal to or higher than the temperature of the metal ink F when ejected from the ejection head 30 and less than the boiling point of the functional material contained in the metal ink F (the lowest boiling temperature in the liquid composition). Temperature) of 46 ° C., for example.

A camera drive circuit 56 is connected to the control device 50. The control device 50 outputs a drive control signal to the camera drive circuit 56. Specifically, when the mother sheet 4M placed on the placement unit 24 reaches a high temperature (46 ° C.), the control device 50 outputs a drive signal indicating that the mark M arranged and formed on the mother sheet 4M is photographed. Output. Then, the camera K captures the mark M by being driven at this timing, and outputs the image data to the control device 50.

Next, a method of forming the internal wiring 6 on the mother sheet 4M using the droplet discharge device 20 will be described with reference to FIGS.
First, as shown in FIG. 2, the mother sheet 4 </ b> M is placed on the stage 23 so that the pattern formation surface 4 </ b> Ma faces upward (Z arrow direction side). At this time, the stage 23 arranges the mother sheet 4M on the side opposite to the Y arrow direction from the carriage 29. In addition, stage 23 at this time
Is set to be room temperature (26 ° C.). The mother sheet 4M is before firing, and the via hole 7 and the via wiring 8 are formed in advance.

From this state, the bitmap data BD is input from the input / output device 51 to the control device 50. That is, the bitmap data BD input at this time is data that defines the ejection of the droplet Fb when it is assumed that the mother sheet 4M is at room temperature (at 26 ° C.).
The bitmap data BD is stored in the RAM 50C.

Thereafter, the control device 50 drives the rubber heater H provided on the stage 23 via the rubber heater driving circuit 55 to control the heating so that the mother sheet 4M placed on the stage 23 becomes high temperature (46 ° C.). (Heating step). As a result, the mother sheet 4M starts to expand.
After a while, when the mother sheet 4M is heated to a high temperature (46 ° C.) by the heating of the rubber heater H, the mother sheet 4M is thermally deformed (thermal expansion) by a predetermined amount as compared with the green sheet 4G at room temperature (26 ° C.). It will be in the state. Then, in this state, the control device 50 drives the camera K via the camera drive circuit 56 to photograph the state of the mark M arranged and formed in the upper left corner of the mother sheet 4M. As a result, the image data of the mark M at a high temperature (46 ° C.) is input to the control device 50.

Then, the CPU 50A of the control device 50 calculates the degree of deformation of the mother sheet 4M due to the heating (calculation step). Subsequently, the CPU 50A of the control device 50 corrects the bitmap data BD so as to correct the bitmap data BD in consideration of the degree of deformation of the mother sheet 4M at a high temperature (46 ° C.) (correction process).

FIG. 9 shows the state of the mark M on the mother sheet 4M at 46 ° C., and the chain line in FIG. 9 shows the formation position of the state of the mark M on the mother sheet 4M at 26 ° C.
As shown in FIG. 9, the mark M at 46 ° C. is shifted from the mark M at 26 ° C. along the X arrow direction and the Y arrow direction. Specifically, for example, in this embodiment, X
Two regions R are shifted along the arrow direction, and two regions R are shifted along the Y arrow direction.

As described above, the data correction program reads the bitmap data B when the mother sheet 4M is displaced by one nozzle (10 μm) from the normal temperature (26 ° C.) by heating.
This is a program for correcting by inserting only one dot in D. Therefore, in the present embodiment, a bit map that increases the number of nozzles N that discharge droplets Fb twice along the Y arrow direction and discharges the droplets Fb along the X arrow direction one by one. The data is corrected to BD.

Next, the control device 50 drives the X-axis motor MX via the X-axis motor drive circuit 52 to start scanning (forward movement) of the ejection head 30.
When the control device 50 starts scanning (forward movement) of the ejection head 30, the control device 50 generates the ejection control signal SI based on the corrected bitmap data BD, and outputs the drive signal COM to the head drive circuit 54. Then, the carriage 29 is moved to the position designated by the bitmap data BD. That is, the control device 50 ejects the droplet Fb from the selected nozzle N every time the ejection head 30 is positioned in the region R for forming the internal wiring 6 based on the corrected bitmap data BD.

In the present embodiment, the mother sheet 4M has two regions R (2 × 10 μm = 20 μm) along the X arrow direction and the region R along the Y arrow direction by heating, compared to room temperature (26 ° C.).
Are shifted by two (2 × 10 μm = 20 μm). Accordingly, the corrected bitmap data BD increases the discharge nozzles N that discharge the droplets Fb one by one along the X arrow direction and the anti-X arrow direction, and discharges the droplets Fb. The droplet Fb is ejected by increasing the droplet Fb twice along the anti-Y arrow direction.

Accordingly, in each formation region Z of the mother sheet 4M in a high temperature (46 ° C.) state, the position where the internal wiring 6 should be arranged and formed in advance, that is, from the droplets Fb so as to connect the via holes 7 in series. A pattern is formed. At this time, the mother sheet 4M has a high temperature (4
Therefore, the droplet Fb landed on the mother sheet 4M is heated. As a result, the solvent component in the droplet Fb evaporates and the metal particles immediately aggregate to form the wiring pattern of the internal wiring 6.

Thereafter, the ejection head 30 is reciprocated in the X arrow direction and the counter X arrow direction, and the stage 23 is transported in the Y arrow direction.
The operation of discharging at a timing based on the bitmap data BD in consideration of the degree of deformation of the mother sheet 4M at 6 ° C. is repeated. As a result, on the mother sheet 4M,
A wiring pattern in which the wiring pattern of the internal wiring 6 is formed by the landed droplets Fb is formed.

As described above, according to the present embodiment, the following effects are obtained.
(1) According to the present embodiment, the bitmap data BD is corrected in consideration of the degree of deformation of the mother sheet 4M at a high temperature (46 ° C.). Then, the wiring pattern of the internal wiring 6 is formed based on the corrected bitmap data BD. Accordingly, even when the mother sheet 4M is heated at the time of pattern formation, each of the mother sheets 4M after the heating is finished and returned to normal temperature (26 ° C.), that is, when the mother sheet 4M contracts to the original size after expansion. In the formation region Z, the droplet Fb is landed at a position where the internal wiring 6 is to be disposed and formed in advance. As a result, the green sheet 4G having desired characteristics can be formed.

Moreover, since the wiring pattern of the internal wiring 6 can be formed at a target position, the yield of the green sheets 4G can be improved.
(2) According to this embodiment, the mark M is disposed and formed in the upper left corner of the mother sheet 4M before firing. The mark M when the mother sheet 4M is heated to a high temperature (46 ° C.) is photographed by the camera K provided on the carriage 29. Then, the CP of the control device 50
U50A is an image data of mark M when heated to a high temperature (46 ° C.) and normal temperature (26 ° C.
The degree of deformation of the mother sheet 4M is calculated by comparing it with the image data of the mark M at (), and the bitmap data BD is corrected based on the degree of deformation.

Therefore, even if the deformation rate varies for each mother sheet 4M, the bitmap data BD is corrected according to the degree of deformation. As a result, the wiring pattern of the internal wiring 6 can be formed at a target position even for various types of mother sheets 4M having different deformation rates.

(3) According to the present embodiment, the correction program for correcting the bitmap data BD is equivalent to one nozzle N (10 μm) for the mother sheet 4M compared to normal temperature (26 ° C.) by heating.
A program that inserts only one dot into the bitmap data BD at the point of deviation. The wiring pattern of the internal wiring 6 does not break in the middle, and the line width of the internal wiring 6 does not change.

(4) According to the present embodiment, the rubber heater H is provided on the mounting portion 24 of the stage 23. The green sheet 4G placed on the stage 23 by driving the rubber heater H is not less than the temperature of the metal ink F when discharged from the discharge head 30 and less than the boiling point of the functional material contained in the metal ink F ( The heating was controlled so that the temperature was lower than the lowest boiling point in the liquid composition. Accordingly, the droplet Fb landed on the green sheet 4G is heated and the droplet F
As soon as the solvent component in b evaporates, the metal particles aggregate. As a result, the internal wiring 6 can be formed quickly.

(5) According to the present embodiment, the degree of expansion is calculated independently for each of the vertical direction (Y arrow direction) and the horizontal direction (X arrow direction) of the mother sheet 4M. Therefore, even if the mother sheet 4M has a different degree of deformation in the vertical and horizontal directions, the pattern of the internal wiring 6 can be accurately formed at the target position.

In addition, this invention can also be changed and embodied as follows.
In the above embodiment, the mark M is formed on the mother sheet 4M, and the degree of expansion of the mother sheet 4M is calculated from the amount of deviation of the mark M, but the present invention is not limited to this.
For example, a specific via hole 7 may be selected from a plurality of via holes 7 formed in advance in the mother sheet 4M, and the degree of deformation of the green sheet 4G may be calculated from the amount of deviation of the formation position. By doing so, it is not necessary to form a special mark (mark) for calculating the degree of deformation, and therefore the degree of deformation of the green sheet 4G can be easily calculated.
In the above embodiment, the mark M is arranged and formed at the upper left corner of the mother sheet 4M. However, the present invention is not limited to this, and any area other than the formation area Z on the mother sheet 4M may be used. , It may be formed anywhere.
In the above embodiment, the bitmap data BD is corrected, but the present invention is not limited to this. For example, the droplet discharge device 20 is provided with an encoder (not shown) for measuring the position of the stage 23 in the Y arrow direction and the anti-Y arrow direction along the guide groove 22 of the base 21. The control device 50 may adjust (correct) the drive control signal output to the Y-axis motor drive circuit 53 based on the position signal from. By doing so, the landing position of the droplet Fb in the vertical direction of the mother sheet 4M is corrected.
In the above embodiment, the rubber heater H is used as the heating means, but the present invention is not limited to this. For example, induction heating may be used. In this case, a high-frequency oscillation coil that constitutes induction heating may be embedded in the stage 23. In this way, the same effect as that of the above embodiment can be obtained.
In the above embodiment, the functional material constituting the internal wiring 6 is embodied as fine particles of silver (Ag), but the present invention is not limited to this. In addition to silver (Ag), for example, gold (Au), platinum (Pt), copper (Cu), palladium (Pd), rhodium (Rh), osmium (Os),
Ruthenium (Ru), iridium (Ir), iron (Fe), tin (Sn), zinc (Zn),
Cobalt (Co), Nickel (Ni), Chromium (Cr), Titanium (Ti), Tantalum (T
Any one of a), tungsten (W) and indium (In) may be used, or an alloy in which any two or more are combined may be used. However, since silver is reduced at a relatively low temperature, it is easy to handle. In this regard, when using a droplet discharge device, a functional liquid containing silver (Ag) can be used. preferable.

Moreover, it may replace with a metal and may contain the organic compound. An organic compound here is a compound from which a metal precipitates by decomposition | disassembly by heating. Examples of such organic compounds include chlorotriethylphosphine gold, chlorotrimethylphosphine gold, chlorotriphenylphosphine gold, silver 2,4-pentanedionan complex, copper hexafluoropentanedionacyclooctadiene complex, and the like.

Furthermore, the form of the metal contained in the functional liquid may be a form of particles represented by nanoparticles or a form of a compound such as an organic compound.
Furthermore, functional fluid. Instead of metal, a conductive polymer soluble material such as polyaniline, polythiophene, polyphenylene vinylene, poly (3,4 ethylenedioxytoophene) (PEDOT) may be included.
In the above embodiment, the green sheet 4G is embodied as the substrate, but the substrate of the present invention is not limited to this, and an epoxy substrate, a glass epoxy substrate, a ceramic substrate, a silicon substrate, or the like may be used. Even in this case, the same effects as described in the above embodiment can be obtained.

The side sectional view of a circuit module. The whole perspective view of a droplet discharge device. The bottom view of a droplet discharge head. The figure for demonstrating the structure of a droplet discharge head. The principal part sectional side view of a droplet discharge head. The top view of the mother sheet | seat 4M after the pattern was formed. The top view of the mother sheet | seat 4M before a pattern is formed. The block diagram for demonstrating the electrical structure of a droplet discharge apparatus. The figure for demonstrating the effect | action of the pattern formation method of this invention.

Explanation of symbols

BD: Bit map data as data, F: Metallic ink as functional liquid and liquid, Fb: Droplet, H: Rubber heater as heating means, K: Mela, 4G: Porous substrate, low-temperature firing sheet , Green sheets as substrates and circuit boards, 5... Circuit elements, 7 via holes, 7 a via holes, 20 droplet ejection devices as pattern forming devices, 50 A CPU as calculation means.

Claims (10)

In a pattern forming method for forming a pattern on the surface of the substrate by sequentially ejecting droplets of a functional liquid containing a functional material toward the substrate based on data stored in advance,
A heating step of heating the substrate to a temperature not lower than the boiling point of the composition constituting the functional liquid, the surface temperature of which is not lower than the temperature of the functional liquid at the time of discharging the droplets;
A calculation step of calculating a degree of deformation of the substrate due to the heating from a comparison result between the substrate before heating and the substrate when heated;
And a correction step of correcting the data based on the degree of deformation. In the pattern formation method of Claim 1,
In the calculation step, marks are arranged and formed in advance on the substrate,
A pattern forming method characterized in that a degree of deformation of the substrate is calculated based on a deviation amount between the mark before the substrate is heated and the mark when the substrate is heated. In the pattern formation method of Claim 1 or 2,
The substrate is a low-temperature firing sheet composed of a porous substrate and ceramic particles and a resin,
The pattern forming method, wherein the functional liquid is a liquid in which a metal material is dispersed as the functional material. In the pattern formation method as described in any one of Claims 1-3,
The circuit board is a circuit board on which a circuit element is mounted and a wiring electrically connected to the mounted circuit element is formed. In the pattern formation method as described in any one of Claims 1-4,
The pattern forming method, wherein the data is bitmap data. In the pattern formation method of Claim 5,
In the calculation step, the degree of deformation of the substrate due to the heating is 1 of the bitmap data.
A pattern forming method characterized in that the bitmap data is corrected when it changes by one. In the pattern formation method of Claim 5 or 6,
The pattern forming method, wherein the correction is performed independently along a vertical direction of the substrate and a horizontal direction of the substrate. In a pattern forming apparatus that sequentially discharges droplets of a functional liquid containing a functional material toward a substrate based on data stored in advance to form a pattern on the surface of the substrate,
Heating means for heating the substrate to a temperature not lower than the boiling point of the composition constituting the functional liquid, the surface temperature of which is equal to or higher than the temperature of the functional liquid at the time of discharging the droplets;
A calculating means for calculating a degree of deformation of the substrate due to the heating from a comparison result between the substrate before heating and the substrate when heated;
Correction means for correcting the data based on the degree of deformation;
A pattern forming method comprising: ejection means for ejecting the droplets according to the corrected data. The pattern forming apparatus according to claim 8, wherein
A camera is provided at a position facing the substrate,
The camera shoots the mark formed and formed on the substrate when heated,
The calculating means measures the degree of deformation of the substrate based on a deviation amount of the mark photographed by the camera with respect to an arrangement position of the mark formed and formed on the substrate before heating. Pattern forming device. In the pattern formation apparatus as described in any one of Claims 7-9,
The pattern forming apparatus, wherein the functional liquid is a liquid material in which a metal material constituting a wiring electrically connected to a circuit element mounted on the substrate is dispersed.

Images