JP2008130985A - Flux supply/recovery unit in electronic component packaging equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flux supply/recovery unit which can variably supply, because of its simple structure, an amount of flux necessary for transfer depending on the type of electronic components, has a recovery function to minimize the deterioration of quality of the flux itself, and further has excellent stability in transferring the flux to electronic parts. <P>SOLUTION: The device for supplying/recovering flux comprises a transfer belt 12 traveling in one direction and capable of mounting the flux F, a flux chamber 14 having a blade 20 that can be in contact with a surface 12A of the transfer belt 12 and capable of storing the flux F, a belt guide mechanism 16 for altering the traveling direction of the transfer belt 12 from X1 to X2 at a predetermined position P1, and a drive mechanism 18 for altering the distance L1 between a blade and the predetermined position. Furthermore, a backup plate 42 which supports the transfer belt 12 horizontally from underneath during the transfer of flux to an electronic part 82 is arranged underneath the transfer belt 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an apparatus capable of rationally supplying and collecting flux in an electronic component mounting apparatus and stably performing transfer of flux to the electronic component.

  A mounting apparatus for mounting electronic components such as an IC, an LSI, a flip chip, a resistor chip, and a chip capacitor at a predetermined position on a substrate is disclosed. This type of mounting apparatus includes a suction head having a suction nozzle that vacuum-sucks these electronic components, and moves the suction head (specifically, a holder that holds the head) in the X and Y directions (horizontal drive). ) And the movement of the suction nozzle in the Z-axis direction (vertical drive) and the rotation of the suction head itself around the Z-axis (θ drive) are mounted on the substrate.

  As a method for mounting an electronic component, when solder bonding is employed, a method of transferring a paste-like flux to bumps on the electronic component is widely known for the purpose of improving solder bonding.

  The size of the bump of the electronic component varies depending on the type of the electronic component. Therefore, the amount of flux to be attached to the bump (necessary transfer amount of flux) needs to be changed according to the size of the bump.

  In Patent Document 1, in order to achieve this object, a flux supply device as shown in FIG. 6 is disclosed. In the transfer device 113, a plurality of flat coating film surfaces 113b to 113e provided at different heights with respect to the horizontal film thickness reference surface 113a are formed on the transfer unit 113. Here, if the sliding contact portion 114c of the squeegee 114 is moved while being in contact with the coating film reference surface 113a, a plurality of flux films having different film thicknesses can be formed on the coating film surfaces 113b to 113e.

  When changing the product type, the suction head on which the electronic component is mounted is moved to any part of the plurality of flux films, and the suction nozzle descends there to transfer an appropriate amount of flux.

JP 2003-142814 A

  In recent years, mounting of electronic components has been increasingly in a small quantity and a wide variety, and more advanced quality has been required for each product. Since the flux is generally corrosive, it is necessary to perform the minimum transfer corresponding to the bump to be transferred. Accordingly, there is an increasing need to change / adjust the supply amount of flux when transferring more finely according to the type of electronic component.

  However, in the above-described flux supply device according to Patent Document 1, the range of film thickness change or the amount of change in film thickness per stage is limited, so when a variety of film thicknesses are to be obtained. However, there is a problem that the apparatus becomes proportionally large and complicated accordingly.

  In addition, due to the structure of the apparatus, it is necessary to always keep the flux thinly applied on a wide plane, and there is a problem that the quality of the flux itself is likely to deteriorate.

  In order to solve such a problem, the applicant variably changes the amount of flux necessary for transfer with a simple structure according to the type of electronic component in a previously known application (Japanese Patent Application No. 2005-295307). We have proposed a flux supply / recovery device that can be supplied and that has a recovery function and can minimize degradation of the quality of the flux itself.

  However, in this flux supply / recovery device, since the flux is formed on the transfer belt having a small rigidity, there is a possibility that the stability at the time of transferring the flux to the electronic component may be lacking.

  The present invention has been made in view of such problems, and according to the type of electronic component, it is possible to variably supply a flux amount necessary for transfer with a simple structure, and to provide a recovery function. It is an object of the present invention to provide a flux supply / recovery device that can minimize deterioration of the quality of the flux itself and has excellent stability when transferring the flux to an electronic component.

  In the invention according to the prior application (Japanese Patent Application No. 2005-295307) that is not publicly known, the present inventor provides a backup plate that supports the transfer belt from below during the flux transfer to the electronic component, It has been found that the above problems can be solved. Furthermore, it has been found that the stability when transferring the flux to the electronic component is further improved by applying a predetermined device to the backup plate.

  That is, the present invention is a flux supply / recovery device in an electronic component mounting apparatus, which has a predetermined width on which a flux can be placed, and is disposed so as to cover the surface of the transfer belt, which proceeds endlessly. A flux chamber capable of abutting against the surface of the transfer belt, and a flux chamber capable of storing the flux, and a moving direction of the transfer belt from a predetermined position to a side opposite to the side where the flux chamber exists A belt guide mechanism to be changed, and a drive mechanism that allows the flux chamber to move along the surface of the transfer belt together with the blade, and the flux chamber is moved downstream of the transfer belt along the blade during the transfer process. By moving the blade to the side and adjusting the distance of the blade from the predetermined position, A gap capable of supplying the flux can be variably formed between the belt and the feeding belt. After the transfer process is completed, the flux chamber is moved to the upstream side of the feeding belt together with the blade, and the blade is moved from the predetermined position. The blade is brought into contact with the surface of the transfer belt by moving away from it, and the flux remaining on the transfer belt can be recovered from a recovery port formed on the upstream side of the flux chamber. A backup plate for horizontally supporting the transfer belt from below is provided under the transfer belt.

  The backup plate is preferably movable up and down in terms of further improving the stability when transferring the flux to the electronic component, and it is also preferable to provide a suction hole in the backup plate. When a suction hole is provided in the backup plate, the surface layer portion that comes into contact with the transfer belt may be formed from a porous material.

  In the present invention, the transfer belt on which the flux is placed is advanced in a specific direction, and the flux is supplied to the flux transfer unit. The thickness of the flux placed on the transfer belt is variably controlled by a gap formed between the blade provided in the flux chamber and the surface of the transfer belt. In the present invention, the control of the gap is not performed by a general technique of “moving the blade tip in the thickness direction of the flux (a direction perpendicular to the belt traveling direction or a direction including the component thereof)” A method of “changing the traveling direction of the transfer belt from a predetermined position to a direction opposite to the direction in which the flux chamber exists and changing the relative distance between the predetermined position and the blade” is employed. As a result, the gap between the blade and the surface of the transfer belt can be adjusted, and a very delicate fine adjustment can be realized with a simple structure.

  In addition, only the flux required for transfer is supplied to the flux transfer section, and the remaining flux after transfer is collected in the flux chamber. Therefore, most of the flux is basically in the flux chamber. Therefore, deterioration over time can be minimized.

  Furthermore, since the backup plate that supports the transfer belt horizontally from the bottom when transferring the flux to the electronic component is provided under the transfer belt, the stability when transferring the flux to the electronic component is excellent.

  According to the present invention, the amount of flux required for transfer can be variably supplied with a simple structure according to the type of electronic component, and the recovery function has a minimum deterioration in quality of the flux itself. Furthermore, the stability when transferring the flux to the electronic component is excellent.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is an overall schematic view showing an example of a flux transfer device to which a flux supply / recovery device according to a first embodiment of the present invention is applied, and FIG. 2 is an enlarged view of a main part in the vicinity of arrow II in FIG. FIG. 3 is an oblique plan view seen from the direction of arrow III in FIG.

  The flux transfer device 10 includes a transfer belt 12, a flux chamber 14, a belt guide mechanism 16, a drive mechanism 18, and a backup plate 42.

  The transfer belt 12 has a predetermined width W1 on which the flux F can be placed (see FIG. 3), and can advance in a predetermined direction X endlessly. The flux chamber 14 is disposed so as to cover the surface 12A of the transfer belt 12, has a blade 20 capable of contacting the surface 12A of the transfer belt 12, and can store the flux F. The belt guide mechanism 16 changes the advancing direction of the transfer belt 12 by an angle α to the side opposite to the side where the flux chamber 14 exists, and is specifically constituted by an idler roller 22. Thus, the traveling direction X of the transfer belt 12 is changed from the direction X1 in the figure to the direction X2 (horizontal direction) after the predetermined position P1. The drive mechanism 18 reciprocates the flux chamber 14 together with the blade 20 along the surface 12A of the transfer belt 12 in the direction of X1 in the drawing to change the distance L1 between the blade 20 and the predetermined position P1. The backup plate 42 is disposed horizontally below the transfer belt 12 and supports the transfer belt 12 from below so that the transfer belt 12 can be prevented from being bent at the time of flux transfer and maintained horizontal.

  Hereinafter, the configuration of each unit will be described in more detail.

  The frame 30 is provided with a drive roller 32 and a driven roller 34 connected to the transfer belt drive motor M1. As the driven roller 34 rotates, the transfer belt 12 rotates endlessly in a substantially triangular shape via the idler roller 36 and the idler roller 22 described above. The transfer belt 12 is stretched at a constant tension by a tensioner screw 38 attached to the shaft 36A of the idler roller 36. The width W1 of the transfer belt 12 is set larger than the width W2 of the flux chamber 14 (see FIG. 3).

  A backup plate 40 is disposed inside the transfer belt 12 between the idler rollers 36 and 22. The backup plate 40 is inclined with the idler roller 36 as a base point, and its upper surface is positioned on a tangent to the idler rollers 36 and 22. The flux chamber 14 is disposed in a portion where the traveling direction X of the transfer belt 12 is inclined in the direction (angle) X1.

  A backup plate 42 is horizontally disposed inside the transfer belt 12 between the idler roller 22 and the driven roller 34. The upper surface of the backup plate 42 is positioned on the tangent line between the idler roller 22 and the driven roller 34, and the upper surface of the backup plate 42 is horizontal. The backup plate 42 supports the transfer belt 12 from below so as to prevent the transfer belt 12 from being bent at the time of flux transfer and maintain the level. The flux transfer portion A is located at a portion where the traveling direction of the transfer belt 12 is changed to the horizontal X2 direction by the idler roller 22.

  The flux chamber 14 has four surfaces of a front wall 46, an upper surface wall 48, a right surface wall 50, and a left surface wall 52 with respect to the belt traveling direction X1, and the lower surface side is open to the transfer belt 12. Among these, the front wall 46 is integrated with the blade 20, and the rear wall is also used as a collection gate 72 described later. The opening on the lower surface of the flux chamber 14 is W3 on the downstream side (supply side) in the belt traveling direction and W4 on the upstream side (collection side), and the upstream side is formed wider. The flux chamber 14 is positioned with respect to the frame 30 by the chamber hinge 54 being hooked on the chamber hook portion 55.

  The chamber hinge 54 passes through a long hole 56 formed in the two chamber moving frames 64, and springs 58 are applied to both ends of the chamber hinge 54. The spring 58 has a function of pressing the flux chamber 14 toward the transfer belt 12 passing over the backup plate 40 via the chamber hinge 54 and the chamber hook portion 55, and the flux chamber 14 is in close contact with the surface 12 A of the flux belt 12. Yes.

  The flux chamber 14 reciprocates along the upper surface of the backup plate 40 (with each blade 20) by a flux chamber moving motor M2 and a chamber moving screw 59 which are main components of the driving mechanism 18. When the flux chamber 14 moves downstream and the tip 20A of the blade 20 reaches the R portion of the idler roller 22 beyond the predetermined position P1, a gap 60 is formed between the surface 12A of the transfer belt 12 and the front surface 20A. Has been. Depending on the amount of movement of the flux chamber 14, that is, the distance L1 between the tip 20A of the blade 20 and the predetermined position P1 (overhang from the predetermined position P1 of the tip 20A) L1, the height S of the gap 60 (of the flux film Ff (Corresponding to the thickness t) can be arbitrarily adjusted.

  When the transfer belt 12 rotates, the flux F in the flux chamber 14 passes through the gap 60 while adhering to the transfer belt 12, so that the flux film Ff is regulated by the gap 60. The flux film Ff is also regulated by the opening width W3 on the flux supply side. Therefore, on the transfer belt 12, the flux is fed from the flux chamber 14 in a sheet-like state in which the thickness is a thickness t corresponding to the height S of the gap 60 and the width is shaped into the opening width W3 on the supply side. A membrane will be supplied.

  On the downstream side of the idler roller 22, a film thickness detection sensor 62 for detecting the thickness t of the flux film Ff coming out of the gap 60 is disposed. When the thickness t of the flux film Ff measured by the film thickness detection sensor 62 is not the optimum film thickness for the bump to be transferred, the flux chamber moving motor M2 is feedback controlled to change the overhang L1. Thus, the height S of the gap 60 is adjusted.

  The chamber moving frame 64 is guided by the guide rail 66 and driven by the flux chamber moving motor M2 and the chamber moving screw 59, and reciprocates in parallel with the backup plate 40 from the standby position to the flux film forming position. When the flux chamber 14 moves upstream in conjunction with the chamber moving frame 64, the collection gate pin 68 is pushed up by the collection gate opening / closing cam 70 against the urging force of the gate spring 69. As a result, the recovery gate 72 integrated with the recovery gate pin 68 is pushed open around the gate hinge 73, and the flux (flux remaining on the transfer belt after transfer) F returned through the flux recovery port 74 is removed. The flux is collected in the flux chamber 14. Since the flux F remaining on the transfer belt after the transfer is collected in the flux chamber 14, deterioration with time can be minimized.

  In FIG. 1, reference numeral 78 denotes a suction head, 80 denotes a suction nozzle, 82 denotes an electronic component, and 84 denotes a bump.

  FIG. 4 is a control block diagram of the flux supply / recovery device according to the first embodiment. The control unit 200 controls the movement of the transfer belt 12 by controlling the transfer belt drive motor M1 via the transfer belt drive motor driver D1. Further, the measurement result of the film thickness detection sensor 62 is input to the control unit 200. Based on the input measurement result, the control unit 200 controls the flux chamber moving motor M2 via the flux chamber moving motor driver D2 so that the film thickness becomes a predetermined thickness, and the flux chamber 14 in the X1 direction is controlled. Adjust the position.

  Next, the operation of the flux transfer device to which the flux supply / recovery device according to the first embodiment is applied will be described with reference to the process chart shown in FIG. 5 and the flowchart shown in FIG.

  In the standby position shown in FIG. 5 (A), the gap 60 is closed, and the collection gate 74 is also closed, so that the flux chamber 14 is sealed to prevent the flux F from drying. The transfer belt 12 is not rotating at this point. When the electronic component 82 to be flux-transferred is selected, the suction nozzle 80 sucks the corresponding electronic component 82 from a component supply device (not shown) and transports it to the flux transfer unit A. Data relating to the target thickness t of the flux film Ff corresponding to the size of the bump 84 is input to the control unit 200 (step S1). In the flux film forming part B, the flux chamber 14 is moved to the flux film forming position shown in FIG. 5B by the chamber moving motor M2, and the tip 20A of the blade 20 is a predetermined position corresponding to the axis of the idler roller 22. When passing through P1, a gap 60 is formed between the belt 1 and the transfer belt 12. The height S of the gap 60 changes according to the distance (overhang) L1 between the predetermined position P1 and the tip 20A of the blade 20, and the thickness of the formed flux film Ff changes. Based on the data regarding the target thickness t of the flux film Ff input to the controller 200, the position of the flux chamber 14 in the X1 direction is adjusted, and the flux chamber 14 moves to a predetermined position (step S2). Here, the transfer belt 12 starts to rotate (step S3).

  The film thickness detection sensor 62 measures the thickness t of the flux film Ff coming out of the flux chamber 14, and the measurement result is input to the control unit 200. The control unit 200 compares this measurement result with the target thickness t of the flux film Ff input in step 1, and determines whether or not the film thickness is appropriate (step S4).

  If the film thickness is not appropriate, the flow returns to step S2 to move the flux chamber 14, and the position of the flux chamber 14 is feedback controlled until the film thickness becomes appropriate. For this reason, the flux film | membrane Ff which has thickness with high precision can be formed.

  When the thickness t of the flux film Ff reaches a predetermined thickness, the transfer belt 12 stops (step S5). Then, the suction nozzle 80 that sucks the electronic component 82 is lowered and the flux is transferred to the bumps 84 of the electronic component 82 (step S6), and then the suction nozzle 80 is lifted and placed on the substrate (not shown). The electronic component 82 is mounted at a predetermined position (step S7). FIG. 5B shows a state where the transfer is completed and the flux F is transferred to the bumps 84.

  The above operations are repeated for all parts until the above operations are completed (step S8).

  FIG. 7 is a front view showing a main part of a flux transfer device to which a second embodiment of the flux supply / recovery device according to the present invention is applied. In the second embodiment, a driving device 102 is added to the first embodiment. Specifically, the backup plate 43 is connected and held to the cylinder 102A of the driving device 102 disposed at the lower portion, and is driven up and down via the cylinder 102A. FIG. 7A shows a state before the backup plate rises, and FIG. 7B shows a state after the backup plate rises.

  When the backup plate 43 rises by an appropriate height, the tension of the transfer belt 12 increases, and the horizontal plane of the transfer belt 12 is reliably held following the horizontal plane of the backup plate 43. As a result, the amount of flux transferred to the bumps 84 of the electronic component 82 is more accurately controlled.

  FIG. 8 is a control block diagram of the second embodiment of the flux supply / recovery device according to the present invention. The same components as those in the control block diagram (FIG. 4) of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the second embodiment, as described above, the backup plate 43 can be moved up and down by the drive device 102. In the control block diagram (FIG. 8) of the second embodiment, the backup plate moving motor driver D3 and the backup plate moving A motor M3 is added. The control unit 200 controls the backup plate moving motor M3 via the backup plate moving motor driver D3, drives the cylinder 102A of the driving device 102 up and down, and adjusts the height position of the backup plate 43. When the backup plate 43 is driven up and down, an air cylinder may be used instead of the motor. In this case, a backup plate moving air cylinder switching valve is used instead of the backup plate moving motor driver D3, and the backup plate is moved. A backup plate moving air cylinder may be used in place of the moving motor M3.

  Next, the operation of the flux transfer device to which the flux supply / recovery device according to the second embodiment is applied will be described using the flowchart shown in FIG.

  Since steps S11 to S15 are the same as steps S1 to S5 of the first embodiment, detailed description thereof is omitted. The film thickness detection sensor 62 measures the thickness t of the formed flux film Ff and outputs the measurement result to the control unit 200. When the control unit 200 confirms that the thickness t of the formed flux film Ff is stabilized at a predetermined value based on the measurement result (step S14), the control unit 200 stops the transfer belt 12 (step S15). ), The backup plate 43 is raised by a distance set in advance by the driving device 102 (step S16, FIG. 7B). The tension of the transfer belt 12 increases, and the horizontal plane of the transfer belt 12 is reliably held following the horizontal plane of the backup plate 43. Thereafter, the control unit 200 lowers the suction nozzle 80 and lowers the bumps 84 of the electronic component 82 until they contact the transfer belt 12, thereby transferring the flux (step S17). Since the transfer belt 12 in the flux transfer section A is backed up horizontally by the backup plate 43, even if the electronic component 82 is attracted to the suction nozzle 80 at an angle, this backup plate 12. In response to the reaction force from the 43 side, the electronic component 82 can receive the transfer of the flux F in a state where the electronic component 82 is correctly leveled.

  When the transfer is completed, the suction nozzle 80 is raised, the bump 84 is separated from the transfer belt 12, and the electronic component 82 is mounted at a predetermined position on the substrate (not shown) (step S18). When the backup plate 43 is lowered to the position where the transfer belt 12 can be rotated (step S19), the transfer belt 12 starts to rotate, new flux films Ff are successively formed, and flux transfer can be continuously performed. it can. Even if the electronic component to be transferred changes and the thickness t of the flux film Ff to be formed changes, the overhang L1 is changed by driving the flux chamber moving motor M2, and the height S of the gap 60 is changed. Can be easily accommodated.

  The above operation is repeated for all parts until the above operation is completed (step S20).

  FIG. 10 is a front view showing the main part of the flux transfer device to which the third embodiment of the flux supply / recovery device according to the present invention is applied. FIG. 10 (A) shows the state before suction. (B) shows the state after suction. FIG. 11A is a perspective view of the backup plate of the third embodiment, and FIG. 11B is a side view of the backup plate of the third embodiment. In this embodiment, the backup plate 44 has a plurality of vertical connection holes 44A. The plurality of vertical coupling holes 44A have their lower portions coupled to the horizontal coupling holes 44B, and are connected to the vacuum generator 104 via the connection joint 104A and the connection pipe 104B. The transfer belt 12 is sucked by the vacuum generator 104 through the plurality of vertical connection holes 44 </ b> A and is in close contact with the backup plate 44. As a result, the transfer belt 12 closely contacts the horizontal surface of the backup plate 44, and the horizontal surface of the transfer belt 12 is securely held. As a result, the amount of flux transferred to the bumps 84 of the electronic component 82 is more accurately controlled.

  The horizontal connecting hole 44B can be formed by a drill or the like. In that case, one side surface is left without being penetrated, and a plug 44C is provided on the side where the hole is formed (FIG. 11 ( B)).

  The backup plate 44 is provided with a plurality of vertical connection holes 44A. Instead of providing the plurality of vertical connection holes 44A, as shown in FIG. 12 (A) perspective view and (B) side view, The lower part and the peripheral part of the porous material 45A may be formed of the metal plate 45B to serve as the backup plate 45. Further, the backup plate 46 can be made of sintered metal. Specifically, as shown in the perspective view of FIG. 13A and the side view of FIG. 13B, the lower portion and the peripheral portion other than the suction portion 46A. A backup plate 46 made of sintered metal may be used as a sizing treatment portion 46B in which the holes are closed by sizing treatment.

  FIG. 14 is a control block diagram of the third embodiment of the flux supply / recovery device according to the present invention. The same components as those in the control block diagram (FIG. 4) of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the third embodiment, as described above, the transfer belt 12 is sucked by the vacuum generator 104 through the plurality of vertical connection holes 44A of the backup plate 44 and is in close contact with the backup plate 44. In the control block diagram (FIG. 14), a vacuum generator switching valve V1 and a vacuum generator 104 are added. The control unit 200 controls the suction by the vacuum generator 104 via the vacuum generator switching valve V <b> 1 to bring the transfer belt 12 into close contact with the backup plate 44.

  Next, the operation of the flux transfer device to which the flux supply / recovery device according to the third embodiment is applied will be described with reference to the flowchart shown in FIG.

  Since steps S21 to S25 are the same as steps S1 to S5 of the first embodiment, detailed description thereof is omitted. The film thickness detection sensor 62 measures the thickness t of the formed flux film Ff and outputs the measurement result to the control unit 200. When the control unit 200 confirms that the thickness t of the formed flux film Ff is stabilized at a predetermined value based on the measurement result (step S24), the control unit 200 stops the transfer belt 12 (step S25). ), Suction by the vacuum generator 104 is started (step S26, FIG. 10B). The transfer belt 12 closely contacts the horizontal surface of the backup plate 44, and the horizontal surface of the transfer belt 12 is securely held. Thereafter, the control unit 200 lowers the suction nozzle 80 and lowers the bump 84 of the electronic component 82 until it contacts the transfer belt 12, thereby transferring the flux (step S27). Since the transfer belt 12 in the flux transfer portion A is horizontally backed up by the backup plate 44, even if the electronic component 82 is attracted to the suction nozzle 80 at a slight angle, this backup plate In response to the reaction force from the 43 side, the electronic component 82 can receive the transfer of the flux F in a state where the electronic component 82 is correctly leveled.

  When the transfer is completed, the suction nozzle 80 is raised, the bump 84 is separated from the transfer belt 12, and the electronic component 82 is mounted at a predetermined position on the substrate (not shown) (step S28). When the suction by the vacuum generator 104 is released (step S29), the transfer belt 12 starts to rotate, new flux films Ff are successively formed, and flux transfer can be performed continuously. Even if the electronic component to be transferred changes and the thickness t of the flux film Ff to be formed changes, the overhang L1 is changed by driving the flux chamber moving motor M2, and the height S of the gap 60 is changed. Can be easily accommodated.

  The above operation is repeated for all parts until the above operation is completed (step S30).

  Note that the second embodiment and the third embodiment may be combined so that the backup plate can be moved up and down and can also be sucked (fourth embodiment). In this case, as shown in the flowchart of FIG. 16, the operation starts suction after the backup plate has been lifted (step S36) (step S37). Then, the suction mounting head 78 is lowered to transfer the flux (step S38). After the suction mounting head 78 is lifted (step S39), the suction is released (step S40) and the backup plate is lowered (step S41). .

  In any of the first to fourth embodiments, when the series of transfer steps is completed, the flux chamber 14 moves to the flux collection position shown in FIG. 5C and closes the gap 60. Accordingly, the formation of a new flux film Ff is stopped here. On the other hand, at this position, the collection gate pin 68 is pushed up by the collection gate opening / closing cam 70, so that the collection gate 72 is opened around the gate hinge 73 and the flux collection port 74 is kept open. Thus, the returned flux F is collected in the flux chamber 14.

  When the transfer belt 12 rotates for one round or more and the recovery of the flux F is completed, the flux chamber 14 returns to the standby state shown in FIG. 5A, the flux recovery port 74 is closed by the action of the gate spring 69, and the flux chamber 14 is sealed. As described above, the flux F in the flux chamber 14 is basically placed on the transfer belt 12 only when necessary, but is collected in the flux chamber 14 each time one round is completed, and complete when the transfer process is completed. It will be stored in a sealed state. Therefore, quality degradation can be minimized.

  In the above-described embodiment, the flux chamber 14 is disposed in the portion where the transfer belt 12 is inclined, and the idler roller 22 functions as a part of the endless rotation mechanism of the transfer belt 12 and the movement of the transfer belt 12. Although the configuration of the belt guide mechanism for changing the direction is shared and the configuration is simplified, the flux supply / recovery measure according to the present invention is arranged in a portion where the flux chamber is not necessarily inclined. do not have to.

  Further, in the above embodiment, the moving belt 12 is changed in the traveling direction by using the idler roller 22, but in the present invention, the moving belt is moved in the direction where the flux chamber exists. The configuration for changing to the opposite side is not limited to this method. For example, instead of the idler roller 22 in FIG. 1, a backup plate (not shown) formed with a material having a small friction coefficient and having a desired shape (not shown) is brought into contact with this position from the back side of the transfer belt 12. The traveling direction can be changed even if it is made to do. Since this method can stabilize the behavior of the transfer belt 12 particularly in the vicinity of the gap 60, the height of the gap 60 can be adjusted more accurately and with less variation.

  In the above embodiment, the transfer belt 12 is stopped at the time of transfer. However, the suction belt 78 is moved in the horizontal direction in synchronization with the movement of the transfer belt 12 without stopping the transfer belt 12. The nozzle 80 may be lowered.

  The present invention can be applied to an apparatus for transferring flux onto bumps of an electronic component mounting apparatus.

1 is an overall schematic front view of a flux transfer device to which a first embodiment of a flux supply / recovery device according to the present invention is applied. The principal part expanded sectional view of the flux transcription | transfer apparatus to which 1st Embodiment was applied (the arrow II vicinity of FIG. 1) Oblique plan view of the overall schematic front view (FIG. 1) of the flux transfer apparatus to which the first embodiment is applied as viewed from the direction of arrow III. Control block diagram of the flux supply / recovery device according to the first embodiment Process drawing for demonstrating the supply and collection | recovery effect | action of the flux in the flux transcription | transfer apparatus to which 1st Embodiment was applied The flowchart which shows operation | movement of the flux transfer apparatus with which 1st Embodiment was applied. The front view which shows the principal part of the flux transcription | transfer apparatus to which 2nd Embodiment of the flux supply / collection apparatus which concerns on this invention was applied ((A) is before a backup plate raises, (B) is after a backup plate rises) Control block diagram of flux supply / recovery device according to second embodiment The flowchart which shows operation | movement of the flux transfer apparatus with which 2nd Embodiment was applied. The front view which shows the principal part of the flux transcription | transfer apparatus with which 3rd Embodiment of the flux supply / collection apparatus which concerns on this invention was applied ((A) is before suction start, (B) is after suction start) (A) Perspective view showing an example of a backup plate of the third embodiment, (B) side view (A) A perspective view which shows other examples of the backup plate of 3rd Embodiment, (B) Side view (A) Perspective view showing still another example of backup plate of third embodiment, (B) side view Control block diagram of flux supply / recovery device according to third embodiment The flowchart which shows operation | movement of the flux transfer apparatus with which 3rd Embodiment was applied. The flowchart which shows operation | movement of the flux transfer apparatus with which 4th Embodiment was applied. The perspective view which shows the structure of the conventional flux supply apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Transfer apparatus 12 ... Transfer belt 12A ... Transfer belt surface 14 ... Flux chamber 16 ... Belt guide mechanism 18 ... Drive mechanism 20 ... Blade 22 ... Idler roller 30 ... Frame 32 ... Drive roller 34 ... Driven roller 36 ... Idler roller 36A ... Shaft 38 ... Tensioner screw 40, 42, 43, 44 ... Backup plate 44A ... Vertical connection hole 44B ... Horizontal connection hole 44C ... Plug 46 ... Front wall 48 ... Top wall 50 ... Right side wall 52 ... Left side wall 54 ... Chamber hinge 55 ... chamber hook part 56 ... long hole 58 ... spring 59 ... chamber moving screw 60 ... gap 62 ... film thickness detection sensor 64 ... chamber moving frame 66 ... guide rail 68 ... recovery gate pin 70 ... recovery gate open / close cam 72 ... recovery gate 73 ... Gate hinge 74 ... Flux times Mouth 78 ... suction head 80 ... suction nozzle 82 ... electronic component 84 ... bump 102 ... driving device 102A ... cylinder 104 ... vacuum generator 104A ... connection joint 104B ... connecting pipe P1 ... place L1 ... distance (overhang)
F ... Flux Ff ... Flux film S ... Hap height t ... Flux film thickness W3 ... Flux film width M1 ... Transfer belt drive motor M2 ... Flux chamber movement motor

Claims (4)

In the flux supply / recovery device for electronic component mounting equipment,
A transfer belt having a predetermined width on which the flux can be placed and proceeding endlessly;
A flux chamber that is disposed so as to cover the surface of the transfer belt, has a blade that can contact the surface of the transfer belt, and can store a flux;
A belt guide mechanism that changes a traveling direction of the transfer belt from a predetermined position to a side opposite to a side where the flux chamber exists;
A drive mechanism capable of moving the flux chamber along the surface of the transfer belt together with the blades,
During the transfer process, the flux chamber can be moved to the downstream side of the transfer belt together with the blade, and the flux can be supplied between the blade and the transfer belt by adjusting the distance of the blade from the predetermined position. The gap can be variably formed,
After completion of the transfer process, the flux chamber is moved to the upstream side of the transfer belt together with the blade, and the blade is brought into contact with the surface of the transfer belt by moving the blade away from the predetermined position. The remaining flux can be recovered from a recovery port formed on the upstream side of the flux chamber,
Further, the flux supply / recovery device in the electronic component mounting apparatus, further comprising a backup plate under the transfer belt for supporting the transfer belt horizontally from below when transferring the flux to the electronic component. In claim 1,
The backup plate moves up and down, and is a flux supply / recovery device in an electronic component mounting apparatus. In claim 1 or 2,
The backup plate has a suction hole, and is a flux supply / recovery device in an electronic component mounting apparatus. In claim 3,
A flux supply / recovery device in an electronic component mounting apparatus, wherein at least a surface layer portion of the backup plate that contacts the transfer belt is made of a porous material.

Images