JP2008130594A - Thermoelectric conversion device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device which can be manufactured in a simplified process and can improve reliability mechanical/electrical connection in a thermocouple. <P>SOLUTION: The device is provided with a plurality of thermocouple forming regions 2A disposed with a predetermined interval and integrally formed via bent portions 2B, 2B, ... as a whole; a plurality of groups of thermocouples 3 each formed by serially connecting a plurality of thermocoules 5 formed on the plurality of thermocouple forming regions 2A; and a plurality of connecting patterns 8B formed on the bending portions 2B, 2B, ... and serially connecting two groups of thermocouples 3, 3 adjacent to each other among the plurality of groups of thermocouples 3, 3. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a thermoelectric conversion device and a method for manufacturing the thermoelectric conversion device, and more particularly, to a thermoelectric conversion device that generates power by a temperature difference between a hot junction and a cold junction and a method for manufacturing the thermoelectric conversion device.

  As a conventional thermoelectric conversion device, a plurality of thermocouples formed by connecting a first metal wire (for example, a copper wire) as a first thermocouple element and a second metal wire (for example, a nickel wire) as a second thermocouple element (Patent Document 1).

  The thermoelectric conversion device includes a flexible electrically insulating sheet, a thermocouple group formed on one surface of the electrically insulating sheet, and an electrically insulating sheet so as to cover the thermocouple group. And a pair of shape maintaining sheets fixed from both sides.

  The electrically insulating sheet is formed into a corrugated cross-section as a whole by bending a flat rectangular plastic sheet so that the long side of the sheet undulates. The electrical insulating sheet is formed with a plurality of slits extending along the long side of the sheet. The plurality of slits are arranged in a region where the thermocouple group is not formed. The thermocouple group is formed by connecting a plurality of thermocouples composed of a first metal wire and a second metal wire in series on one surface of the electrically insulating sheet. The pair of shape maintaining sheets is formed of a planar rectangular electrically insulating material having flexibility and stretchability.

  In the above configuration, power generation is performed based on heating and cooling at the contact portions of the first and second metal wires of the plurality of thermocouples.

On the other hand, since the entire electrical insulating sheet is formed in a corrugated shape so that the sheet long side undulates, if an external force acts on the thermoelectric conversion device so that the sheet long side of the electrical insulating sheet is curved, The conversion device bends in the direction of the external force. In addition, since a plurality of slits extending along the long side of the electrical insulating sheet are formed, when an external force acts on the thermoelectric conversion device so that the short side of the electrical insulating sheet is curved, the plurality of slits are formed. It spreads in the direction of the sheet short side of the electrically insulating sheet, and the thermoelectric conversion device bends in the direction in which the external force acts. Thereby, it becomes possible to bend the thermoelectric conversion device in various directions.
JP 2005-328000 A

  However, according to the thermoelectric conversion device of Patent Document 1, since the contact portion of the thermocouple is formed in the vicinity of the bent portion of the electrically insulating sheet, the electrically insulating sheet is used to avoid disconnection at the contact portion of the thermocouple. There is a problem that it is necessary to pay close attention to bending (corrugation processing) of the steel sheet, which makes the manufacturing process troublesome.

  In addition, the fact that the contact portion of the thermocouple is formed in the vicinity of the bent portion of the electrically insulating sheet makes it easier for bending stress to act on the contact portion of the thermocouple during waveform processing of the electrically insulating sheet. There was also a problem that the reliability of mechanical and electrical connection was lowered.

  Accordingly, an object of the present invention is to provide a thermoelectric conversion device capable of simplifying the manufacturing process and improving the reliability of mechanical and electrical connection in a thermocouple, and a method for manufacturing the thermoelectric conversion device. .

(1) In order to achieve the above-mentioned object, the present invention forms a plurality of sheet-like members that are arranged in parallel at a predetermined interval and are integrally formed through bent portions, and the plurality of sheet-like members. A plurality of thermocouple groups formed by connecting a plurality of thermocouples connected in series, and a plurality of thermocouple groups formed in the bent portion and connecting two adjacent thermocouple groups among the plurality of thermocouple groups in series A thermoelectric conversion device comprising: a connection conductor.

(2) In order to achieve the above object, the present invention provides a plurality of first region portions arranged in parallel at a predetermined interval, and two adjacent first region portions among the plurality of first region portions. A first step of forming a sheet-like base member having a plurality of second region portions interposed therein, and a plurality of thermocouple groups formed by connecting a plurality of thermocouples in series to the plurality of first region portions, A second step formed on the base member and a plurality of sheet shapes via a plurality of bent portions corresponding to the plurality of second region portions by bending the base member with the plurality of second region portions as boundaries. And a third step of forming a member. A method of manufacturing a thermoelectric conversion device is provided.

  According to the present invention, the manufacturing process can be simplified and the reliability of the mechanical and electrical connection in the thermocouple can be increased.

[Embodiment]
FIG. 1 is a perspective view for explaining a thermoelectric conversion device according to an embodiment of the present invention. FIG. 2 is a plan view for explaining the thermoelectric conversion device according to the embodiment of the present invention.

(Overall configuration of thermoelectric conversion device)
1 and 2, a thermoelectric conversion device denoted by reference numeral 1 includes a device body 2 made of a flexible material, and a plurality of power generators that generate power by providing a temperature difference between a hot junction and a cold junction on the device body 2. .. And the package member 4 made of a flexible material in the same manner as the device body 2. In the thermoelectric conversion device 1, heat generation and heat absorption can be obtained by energizing the thermocouple groups 3, 3,.

(Configuration of device body 2)
As shown in FIG. 1, the device body 2 includes a plurality of thermocouple forming region portions (sheet-like members) 2A, 2A,... That are arranged in parallel in the thickness direction with a predetermined interval (0.3 to 0.5 mm). Among these thermocouple forming region portions 2A, 2A,..., There are a plurality of bent portions 2B, 2B,... Intervening between two adjacent thermocouple forming region portions 2A, 2A. It is formed by a zigzag-shaped insulating plastic sheet made of a flexible material. The thickness of the device body 2 is set to a dimension of about 12 to 125 μm, for example.

  As shown in FIG. 2, the two adjacent thermocouple forming regions 2A, 2A among the thermocouple forming regions 2A, 2A,... Are arranged at positions where the front surfaces or the back surfaces thereof face each other. . Projection pieces 2C, 2C exposed to the outside of the package 4 are integrally formed on the upper side of the tip edge of the thermocouple formation region 2A, 2A at both ends of the thermocouple formation region 2A, 2A,. Yes. Further, terminal patterns 9 and 9 that are output to the outside are formed across the protruding pieces 2C and 2C, respectively, on the upper side of the tip edges of the thermocouple forming region portions 2A and 2A. The plane dimensions of the thermocouple formation region portions 2A, 2A,... Are set to, for example, a vertical dimension of about 3 to 5 mm and a horizontal dimension of about 100 mm.

  The bent portions 2B, 2B,... Are disposed (formed) as a whole between the two thermocouple forming region portions 2A, 2A adjacent to each other among the thermocouple forming region portions 2A, 2A,. In the bent portions 2B, 2B,..., Connection patterns (connection conductors) 8B, 8B,... As conductive members made of a flexible material such as Cu (copper) straddle the thermocouple formation region portions 2A, 2A,. Is formed.

(Configuration of thermocouple groups 3, 3, ...)
As shown in FIG. 1, each of the plurality of thermocouple groups 3, 3,... Is composed of a plurality of thermocouples 5, 5,... (For example, 10,000 in total), and the device body 2 (thermocouple forming region 2A, 2A,...). The thermocouples 5, 5, ... have first thermocouple elements 5A, 5A, ... and second thermocouple elements 5B, 5B, ..., and the bent portion side ends of the thermocouple forming region parts 2A, 2A, ... Are connected in series by first contact portions 6, 6,... And second contact portions 7, 7,..., Which are arranged in parallel along one side (upper) edge and the other side (lower) edge adjacent to the edge. Yes. The thermocouples 5 and 5 formed in the two adjacent thermocouple formation regions 2A and 2A among the thermocouple formation regions 2A, 2A,... Are connected by a connection pattern 8B. Terminal patterns 9 and 9 are connected to thermocouples 5 and 5 (first thermocouple element 5A and second thermocouple element 5B) at the end of thermocouples 5, 5,.

  The first thermocouple elements 5A, 5A,... Are made of a p-type thermoelectric semiconductor, and are patterned on one surface (surface) of the thermocouple forming regions 2A, 2A. The second thermocouple elements 5B, 5B,... Are made of n-type thermoelectric semiconductors, and are patterned on the surface of the thermocouple formation regions 2A, 2A,..., Similarly to the first thermocouple elements 5A, 5A,. . The thickness of the p-type thermoelectric semiconductor and the n-type thermoelectric semiconductor is set to about 4 to 5 μm, and the width is set to about 300 μm. As the p-type thermoelectric semiconductor and the n-type thermoelectric semiconductor, a Bi (bismuth) Te (tellurium) -based semiconductor material is used in order to obtain good thermoelectric power (Seebeck effect).

  The first contact portions 6, 6,... Are arranged at the upper edge of the thermocouple forming regions 2 A, 2 A,. The second contact portions 7, 7,... Are arranged at the lower edge of the thermocouple forming regions 2 A, 2 A,... And are configured to function as cold junctions of the thermoelectric conversion device 1.

(Configuration of package member 4)
As shown in FIG. 1, the package member 4 is formed of, for example, a rectangular parallelepiped, and is entirely formed of a flexible material such as, for example, silicone resin (PDMS: polydimethylsiloxane). And it is comprised so that the device main body 2 and several thermocouple groups 3, 3, ... (connection pattern 8B, 8B, ...) may be covered.

(Operation of thermoelectric conversion device 1)
When the first contact part side of the thermoelectric conversion device 1 is disposed in a high temperature (for example, waste heat of a vehicle bonnet) atmosphere and the second contact part side is disposed in a low temperature atmosphere (for example, air), a thermocouple A temperature difference (about 10 ° C.) is generated between the first contact portions 5, 6,... 5, and the second contact portions 7, 7,. Therefore, a voltage (about 4 to 6 V) is generated between the terminal patterns 9 and 9 connected to the thermocouples 5 and 5 at the end of the thermocouples 5 and 5.

(Method for manufacturing thermoelectric conversion device)
3-6 is a figure shown in order to demonstrate the manufacturing method of the thermoelectric conversion device which concerns on embodiment of this invention. FIG. 3 is a plan view for explaining the formation process (first step) of the base member (thermocouple forming member). FIG. 4 is a plan view for explaining the thermocouple group forming step (second step). 4A shows a connection (terminal) pattern forming process, and FIG. 4B shows a thermocouple element forming process. FIG. 5 is a perspective view for explaining the base member bending formation step (third step). FIG. 6 is a perspective view for explaining a package member forming process.

  In the method of manufacturing a thermoelectric conversion device shown in the present embodiment, the steps of “formation of base member”, “formation of thermocouple group”, “formation of bending of base member”, and “formation of package member” are sequentially performed. Therefore, each of these steps will be described sequentially.

"Formation of base member"
As shown in FIG. 3, first region portions 20A, 20A,... That become a plurality of thermocouple forming region portions 2A, 2A,... Parallel in the plane direction with a predetermined interval, these first region portions 20A, 20A,. Among the two first region portions 20A, 20A adjacent to each other, the second regions 20B, 20B,... Which become the plurality of bent portions 2B, 2B,. 20A,... A base member for forming a thermocouple having third region portions 20C and 20C that become projecting pieces 2C and 2C projecting to one side portion of the front end edge of the first region portions 20A and 20A at the extreme end portions, respectively. 20 is formed. As the base member 20, for example, a strip-shaped insulating plastic sheet made of a flexible material such as polyimide resin is used.

`` Formation of thermocouple group ''
First, as shown in FIG. 4A, connection patterns 8B, 8B,... Are formed across the first region portions 20A, 20A,... And the second region portions 20B, 20B,. Terminal patterns 9 and 9 are formed across the first region portions 20A and 20A and the third region portions 20C and 20C at the end of 20A, 20A,. In this case, the connection patterns 8B, 8B,... Are formed on one surface of the first region portions 20A, 20A,... And the one surface of the second region portions 20B, 20B,. After the Cu layer is formed, the Cu layer is etched by using a lithography method. Further, the terminal patterns 9 and 9 are formed in the same manner as in the case of forming the connection patterns 8B, 8B,... Of the first region portions 20A, 20A at the end of the first region portions 20A, 20A,. This is performed on the one side surface and the one side surface of the third region 20C, 20C.

  Next, as shown in FIG. 4B, the first thermocouple elements 5A, 5A,... And the second thermocouple elements 5B, 5B,. , And a plurality of first thermocouple elements 5A and second thermocouple elements 5B corresponding to each other among the first thermocouple elements 5A, 5A,... And the second thermocouple elements 5B, 5B,. Of the first region 20A, 20A,... Are arranged in parallel along the one side edge and the other side edge adjacent to the second region side edge, respectively. Are connected in series by second contact portions 7, 7,. In this case, when the plurality of thermocouples 5, 5,... Are connected in series, the thermocouples 5 in the two first region portions 20A, 20A adjacent to each other among the plurality of first region portions 20A, 20A,. 5 (thermocouple groups 3, 3) are connected to each other by connection pattern 8B, and among the plurality of thermocouples 5, 5,..., The endmost thermocouples 5, 5 are connected to terminal patterns 9, 9, respectively. A plurality of thermocouple groups 3, 3... Are formed on the base member 20.

  The formation of the first thermocouple elements 5A, 5A,... Is, for example, about 4-5 .mu.m in thickness using a CVD (Chemical Vapor Deposition) method on one side (surface) of the first region 20A, 20A,. After a p-type semiconductor layer having a width of about 300 μm is formed, the p-type thermoelectric semiconductor layer is etched by using a lithography method. The formation of the second thermocouple elements 5B, 5B,... Is performed using, for example, a CVD method on the surface of the first region portions 20A, 20A,..., As in the case of forming the first thermocouple elements 5A, 5A,. After an n-type semiconductor layer having a thickness of about 4 to 5 μm and a width of about 300 μm is formed, the n-type thermoelectric semiconductor layer is etched using a lithography method.

"Bending formation of base member"
As shown in FIG. 5, the base member 20 is bent and formed with a virtual line a (shown in FIG. 4B) dividing the second region portions 20B, 20B,. To do. In this case, when the base member 20 is bent and formed, among the plurality of thermocouple formation region portions 2A, 2A,... And the plurality of thermocouple formation region portions 2A, 2A,. A plurality of bent portions 2B, 2B,... Intervening between two adjacent thermocouple forming region portions 2A, 2A, and a thermocouple at the end of the plurality of thermocouple forming region portions 2A, 2A,. A zigzag-shaped device body 2 having projecting pieces 2C and 2C respectively located on one side of the front end edges of the formation region portions 2A and 2A is formed.

"Formation of package members"
As shown in FIG. 6, a device in which the thermocouple groups 3, 3,... Are formed while holding the zigzag state of the device body 2 (the bent state of the base member 20) using a holder (not shown) or the like. The main body 2 is accommodated in the molding die 100. At this time, the protruding pieces 2C and 2C of the device body 2 are partially exposed from the slits 100A and 100A of the molding die 100 to the outside of the die. Next, after injecting the silicone resin liquid into the molding die 100 from the resin injection hole 100B, the injected silicone resin liquid is heated and solidified to form the package member 4. In this case, when the package member 4 is formed, the thermocouple groups 3, 3,... (Including the connection patterns 8B, 8B,...) And the device body 2 are part of the terminal patterns 9, 9 and the protruding pieces 2C, 2C. Is covered by the package member 4. Thereafter, the thermocouple groups 3, 3,... And the device body 2 covered by the package member 4 are taken out of the molding die 100 by push pins (not shown) or the like.
In this way, the thermoelectric conversion device 1 can be manufactured.

[Effect of the embodiment]
According to the embodiment described above, the following effects can be obtained.

(1) First contact portions 6, 6,..., And 2 that are arranged in parallel along the one side edge and the other side edge adjacent to the bent portion side edges of the thermocouple forming region portions 2A, 2A,. Since the plurality of thermocouples 5, 5,... Are connected in series by the contact portions 7, 7,..., The utmost care is taken as in the past when the base member 20 is bent (manufacture of the thermoelectric conversion device 1). This eliminates the necessity and simplifies the manufacturing process.

(2) The first contact portions 6, 6,... And the second contact portions 7, 7,... Are not formed in the vicinity of the bent portions 2B, 2B,. When the thermoelectric conversion device 1 is manufactured, bending stress does not act on the first contact portions 6, 6,... And the second contact portions 7, 7,. The reliability of the general connection can be increased.

  As mentioned above, although the thermoelectric conversion device (manufacturing method of a thermoelectric conversion device) of this invention was demonstrated based on said embodiment, this invention is not limited to said embodiment, and does not deviate from the summary. The present invention can be implemented in various modes within the scope, and for example, the following modifications are possible.

  In the present embodiment, the case where a BiTe-based semiconductor material is used as the material of the first thermocouple elements 5A, 5A,... And the second thermocouple elements 5B, 5B,. Alternatively, a semiconductor material such as Pb (lead) Te (tellurium), Fe (iron) Si (silicon), or Pb (lead) Sn (tin) Te (tellurium) can be used. In addition to the semiconductor material, the thermocouples 5, 5,... Are, for example, two types such as Cu (copper) and Ni (nickel), Cu (copper) and Bi (bismuth), or Fe (iron) and Ni (nickel). The metal material may be used.

The perspective view shown in order to demonstrate the thermoelectric conversion device which concerns on embodiment of this invention. The top view shown in order to demonstrate the thermoelectric conversion device which concerns on embodiment of this invention. The top view shown in order to demonstrate the formation process of a base member. (A) And (b) is a top view shown in order to demonstrate the formation process of a thermocouple group. The perspective view shown in order to demonstrate the bending formation process of a base member. The perspective view shown in order to demonstrate the formation process of a package member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Thermoelectric conversion device, 2 ... Device main body, 2A ... Thermocouple formation area part, 2B ... Bending part, 2C ... Projection piece, 3 ... Thermocouple group, 4 ... Package member, 5 ... Thermocouple, 5A ... 1st Thermocouple element, 5B ... 2nd thermocouple element, 6 ... 1st contact part, 7 ... 2nd contact part, 8B ... Connection pattern, 20 ... Base member, 20A ... 1st area | region part, 20B ... 2nd area | region part, 20C ... 3rd area | region part, 100 ... Mold for shaping | molding, 100A ... Slit, 100B ... Resin injection hole, a ... Virtual line

Claims (5)

A plurality of sheet-like members that are arranged in parallel at a predetermined interval and are integrally formed through the bent portions as a whole,
A plurality of thermocouple groups formed by connecting a plurality of thermocouples formed on the plurality of sheet-like members in series;
A thermoelectric conversion device comprising: a plurality of connecting conductors formed in the bent portion and connecting two thermocouple groups adjacent to each other among the plurality of thermocouple groups in series.   The thermoelectric conversion device according to claim 1, wherein the plurality of sheet-like members, the plurality of thermocouple groups, and the plurality of connection conductors are covered with a package member. A sheet-like base having a plurality of first region portions arranged in parallel at a predetermined interval, and a plurality of second region portions interposed between two adjacent first region portions among the plurality of first region portions. A first step of forming a member;
A second step of forming, on the base member, a plurality of thermocouple groups formed by connecting a plurality of thermocouples in series to the plurality of first regions;
Forming a plurality of sheet-like members via a plurality of bent portions corresponding to the plurality of second region portions by bending the base member with the plurality of second region portions as boundaries. The manufacturing method of the thermoelectric conversion device characterized by the above-mentioned.   The method for manufacturing a thermoelectric conversion device according to claim 3, wherein, in the second step, the plurality of thermocouple groups are formed on one surface of the base member.   In the second step, conductive members are respectively formed in the plurality of second region portions, and the thermocouple groups formed in two first region portions adjacent to each other among the plurality of first region portions are electrically connected to each other. The manufacturing method of the thermoelectric conversion device of Claim 3 connected by a member.

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