JP2008126472A - マイクロ流体チップの精密溶着方法 - Google Patents
マイクロ流体チップの精密溶着方法 Download PDFInfo
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- JP2008126472A JP2008126472A JP2006312841A JP2006312841A JP2008126472A JP 2008126472 A JP2008126472 A JP 2008126472A JP 2006312841 A JP2006312841 A JP 2006312841A JP 2006312841 A JP2006312841 A JP 2006312841A JP 2008126472 A JP2008126472 A JP 2008126472A
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Abstract
【解決手段】上面に超微小サイズ(μmサイズ)の溝を形成した樹脂製の有溝基板の上面に樹脂製の平板状蓋を密着させ、密着状態の基板と蓋とを、透明でヒートシンク機能を有する上型および下型からなるプレス装置内に組み込んで型締めし、上型上面に溝に対応するマスキングを配置し、上型側から赤外線を照射して基盤と蓋とを溶着させる。
【選択図】図1
Description
3: 基板
5: 上型
7: 下型
9: マスキング
Claims (3)
- 上面に超微小サイズの溝を形成した樹脂製の有溝基板の上面に樹脂製の平板状蓋を密着させ、密着状態の基板と蓋とを、透明でヒートシンク機能を有する上型および下型からなるプレス装置に組み込んで型締めし、上型上面に溝に対応するマスキングを配置し、上型側から赤外線を照射して基盤と蓋とを溶着させることを特徴とするマイクロ流体チップの精密溶着方法。
- 前記上型は赤外線透過性材料で構成することを特徴とする請求項1に記載の方法。
- 前記上型は熱伝導性の良好な材料で構成することを特徴とする請求項2に記載の方法。
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JP2006312841A JP2008126472A (ja) | 2006-11-20 | 2006-11-20 | マイクロ流体チップの精密溶着方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103395152A (zh) * | 2013-08-07 | 2013-11-20 | 苏州扬清芯片科技有限公司 | 一种圆环形高聚物微流控芯片的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003039843A1 (en) * | 2001-11-07 | 2003-05-15 | Mitsui Chemicals Inc | Process for welding of thermoplastic resins |
JP2005074796A (ja) * | 2003-08-29 | 2005-03-24 | Sumitomo Bakelite Co Ltd | マイクロチップ基板の接合方法およびマイクロチップ |
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2006
- 2006-11-20 JP JP2006312841A patent/JP2008126472A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003039843A1 (en) * | 2001-11-07 | 2003-05-15 | Mitsui Chemicals Inc | Process for welding of thermoplastic resins |
JP2005074796A (ja) * | 2003-08-29 | 2005-03-24 | Sumitomo Bakelite Co Ltd | マイクロチップ基板の接合方法およびマイクロチップ |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103395152A (zh) * | 2013-08-07 | 2013-11-20 | 苏州扬清芯片科技有限公司 | 一种圆环形高聚物微流控芯片的制备方法 |
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