JP2008124259A - Electromagnetic-wave shield housing - Google Patents

Electromagnetic-wave shield housing Download PDF

Info

Publication number
JP2008124259A
JP2008124259A JP2006306691A JP2006306691A JP2008124259A JP 2008124259 A JP2008124259 A JP 2008124259A JP 2006306691 A JP2006306691 A JP 2006306691A JP 2006306691 A JP2006306691 A JP 2006306691A JP 2008124259 A JP2008124259 A JP 2008124259A
Authority
JP
Japan
Prior art keywords
electromagnetic
electromagnetic wave
wave shielding
screw
rubber sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006306691A
Other languages
Japanese (ja)
Other versions
JP4859048B2 (en
Inventor
Takahisa Ichii
孝久 一井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Priority to JP2006306691A priority Critical patent/JP4859048B2/en
Publication of JP2008124259A publication Critical patent/JP2008124259A/en
Application granted granted Critical
Publication of JP4859048B2 publication Critical patent/JP4859048B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize an electromagnetic-wave shield housing without damaging its electromagnetic-wave shield effect, in the electromagnetic-wave shield housing so constituted as to be able to store electronic components therein and suppress the inputting/outputting of the electromagnetic wave to/from the electronic components. <P>SOLUTION: Fig. 3 shows such a state that in an electromagnetic-wave shield housing of an embodiment a printed wiring board 90 is so fastened onto a spacer 18 by a screw 91 as to be covered with a cap portion 20. A rubber sheet 22 filled with a ferrite is stuck on the surface of the inner wall of the cap portion 20, and since a hole portion 24 is drilled in the opposite portion to the spacer 18 with respect to the rubber sheet 22, the head portion of the screw 91 is engaged with the hole portion 24. Since the head portion of the screw 91 is made of a metal, all the electromagnetic waves intended to pass through the hole portion 24 are reflected by the head portion of the screw 91, and the rubber sheet 22 absorbs the electromagnetic wave. Also, since the head portion of the screw 91 is engaged with the hole portion 24, even though the rubber sheet 22 is not thinned extremely, any unavailable space present in the inside of the electromagnetic-wave shield housing can be reduced effectively. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子部品を収納可能に構成された筐体に関し、詳しくは、その電子部品からの電磁波の出入りを抑制可能な電磁波シールド筐体に関する。   The present invention relates to a housing configured to be able to store an electronic component, and more particularly, to an electromagnetic shielding housing capable of suppressing electromagnetic waves from entering and exiting the electronic component.

従来より、CPU,IC等の電子部品から電磁波が放射されて周囲の回路に影響を与えたり、周囲の回路から放射された電磁波が上記電子部品の信号線等に重畳してその電子部品の動作に影響を与えたりするのを抑制するため、電子部品からの電磁波の出入りを抑制することが考えられている。このような、いわゆる電磁波シールドを達成するため、電子部品を覆う箱形の筐体内面に、電磁波シールド材料からなる導電層を形成することが提案されている(例えば、特許文献1参照)。
特開2001−111282号公報
Conventionally, electromagnetic waves are radiated from electronic components such as CPUs and ICs to affect surrounding circuits, or electromagnetic waves radiated from surrounding circuits are superimposed on signal lines of the electronic components to operate the electronic components. In order to suppress the influence on the electronic component, it is considered that the electromagnetic wave from the electronic component is suppressed. In order to achieve such a so-called electromagnetic wave shield, it has been proposed to form a conductive layer made of an electromagnetic wave shielding material on the inner surface of a box-shaped housing covering an electronic component (see, for example, Patent Document 1).
JP 2001-111282 A

ところが、近年、この種の電子部品を使用した機器には、例えば携帯電話や薄型テレビに代表されるように、小型化が強く要請されている。このため、電子部品の筐体にも小型化が要請されるが、上記導電層等の電磁波シールド層をあまり薄くすると、充分な電磁波シールド効果が得られない。   However, in recent years, there has been a strong demand for downsizing devices using this type of electronic component, as represented by, for example, mobile phones and flat-screen televisions. For this reason, the housing of the electronic component is also required to be downsized. However, if the electromagnetic shielding layer such as the conductive layer is made too thin, a sufficient electromagnetic shielding effect cannot be obtained.

そこで、本発明は、電子部品を収納可能に構成され、その電子部品からの電磁波の出入りを抑制可能な電磁波シールド筐体において、電磁波シールド効果を損なうことなく良好に小型化することを目的としてなされた。   Accordingly, the present invention is made for the purpose of satisfactorily reducing the size of an electromagnetic wave shielding casing that does not impair the electromagnetic wave shielding effect in an electromagnetic wave shielding case that is configured to be capable of accommodating electronic parts and that can suppress the entry and exit of electromagnetic waves from the electronic parts. It was.

上記目的を達するためになされた本発明は、電子部品を収納可能に構成された筐体本体と、該筐体本体の内壁面の少なくとも一部に設けられ、上記筐体本体に収納された上記電子部品からの電磁波の出入りを抑制する電磁波シールド層と、該電磁波シールド層に穿設され、上記筐体本体内で使用される雄ネジ部材の頭部が嵌合する穴部と、を備えたことを特徴としている。   In order to achieve the above object, the present invention provides a housing body configured to be able to store electronic components, and the housing body provided in at least a part of the inner wall surface of the housing body and housed in the housing body. An electromagnetic wave shielding layer that suppresses electromagnetic waves from entering and exiting an electronic component, and a hole that is formed in the electromagnetic wave shielding layer and that fits a head of a male screw member used in the housing body. It is characterized by that.

このように構成された本発明では、電子部品を収納可能に構成された筐体本体の内壁面の少なくとも一部に、その筐体本体に収納された電子部品からの電磁波の出入りを抑制する電磁波シールド層が設けられている。このため、この電磁波シールド層により、電子部品から出入りする電磁波を良好にシールドすることができる。また、この電磁波シールド層には、上記筐体本体内で使用される雄ネジ部材の頭部が嵌合する穴部が穿設されている。このため、電磁波シールド層をそれ程薄くしなくても、筐体本体内の無駄な空間を減らして筐体本体を良好に小型化することができる。しかも、上記穴部に嵌合する雄ネジ部材の頭部は金属製であり、電磁波を反射するため、その穴の部分を電磁波が通過するのも良好に抑制することができる。従って、本発明の電磁波シールド筐体は、電磁波シールド効果を損なうことなく良好に小型化することができる。   In the present invention configured as described above, an electromagnetic wave that suppresses the electromagnetic waves from entering and exiting from the electronic component housed in the housing body on at least a part of the inner wall surface of the housing body configured to be capable of housing the electronic component. A shield layer is provided. For this reason, the electromagnetic wave entering and exiting the electronic component can be well shielded by the electromagnetic wave shielding layer. Further, the electromagnetic wave shielding layer is provided with a hole portion into which a head portion of a male screw member used in the housing body is fitted. For this reason, even if the electromagnetic wave shielding layer is not so thin, the useless space in the housing body can be reduced and the housing body can be favorably downsized. And since the head part of the external thread member fitted to the said hole part is metal and reflects electromagnetic waves, it can also suppress satisfactorily that electromagnetic waves pass through the part of the hole. Therefore, the electromagnetic wave shielding casing of the present invention can be favorably downsized without impairing the electromagnetic wave shielding effect.

なお、本発明は以下の構成に限定されるものではないが、上記穴部が、上記電磁波シールド層から上記筐体本体の内壁面に亘って穿設されてもよい。この場合、雄ネジ部材の頭部を上記穴部に一層深く嵌合させて、筐体本体内の無駄な空間を一層良好に減らすことができる。従って、この場合、電磁波シールド筐体を一層良好に小型化することができる。   In addition, although this invention is not limited to the following structures, the said hole part may be drilled ranging from the said electromagnetic wave shield layer to the inner wall face of the said housing body. In this case, the useless space in the housing body can be further reduced by fitting the head portion of the male screw member deeper into the hole. Therefore, in this case, the electromagnetic wave shielding housing can be further downsized.

また、上記雄ネジ部材が、上記筐体本体内に上記電子部品を固定するためのビスであってもよい。この場合、電子部品近傍で筐体本体内の無駄な空間を一層良好に減らすことができ、電磁波シールド筐体を一層良好に小型化することができる。   The male screw member may be a screw for fixing the electronic component in the housing body. In this case, the useless space in the housing body in the vicinity of the electronic component can be further reduced, and the electromagnetic wave shielding housing can be further downsized.

更に、上記電磁波シールド層が、電磁波吸収体が充填されたシート状の部材から構成されたものであってもよい。この場合、上記シート状の部材に充填された電磁波吸収体が電磁波を吸収することにより、上記電子部品から出入りする電磁波を良好にシールドすることができる。また、雄ネジ部材の頭部に反射された電磁波も、この電磁波吸収体によって吸収することができるので、上記電磁波を一層良好にシールドすることができる。   Furthermore, the electromagnetic wave shielding layer may be composed of a sheet-like member filled with an electromagnetic wave absorber. In this case, when the electromagnetic wave absorber filled in the sheet-like member absorbs the electromagnetic wave, the electromagnetic wave entering and exiting from the electronic component can be well shielded. Further, since the electromagnetic wave reflected by the head of the male screw member can also be absorbed by the electromagnetic wave absorber, the electromagnetic wave can be shielded better.

そして、この場合、上記筐体本体の、少なくとも上記電磁波シールド層が設けられる部分が、平板状の合成樹脂板に切削加工を施して構成されたものであってもよい。筐体本体が射出成形等によって成形された場合、内壁面を平面状に成形するのが困難で、上記のようなシート状の電磁波シールド層を良好に固定することができない。これに対して、電磁波シールド層が設けられる部分が平板状の合成樹脂板に切削加工を施して構成されたものである場合、その部分の平面性を良好に確保することができ、シート状の電磁波シールド層を隙間なく良好に固定することができる。従って、この場合、電磁波シールド筐体の耐久性を向上させると共に一層良好に小型化することができる。   In this case, at least a portion of the housing body on which the electromagnetic wave shielding layer is provided may be formed by cutting a flat synthetic resin plate. When the casing body is molded by injection molding or the like, it is difficult to mold the inner wall surface into a flat shape, and the above-described sheet-shaped electromagnetic wave shielding layer cannot be satisfactorily fixed. On the other hand, when the portion where the electromagnetic wave shielding layer is provided is formed by cutting a flat synthetic resin plate, the flatness of the portion can be ensured satisfactorily. The electromagnetic wave shielding layer can be fixed well without gaps. Therefore, in this case, the durability of the electromagnetic wave shielding casing can be improved and the size can be further reduced.

次に、本発明の実施の形態を、図面と共に説明する。図1は、本発明が適用された電磁波シールド筐体1の構成を表す斜視図である。図1に示すように、この電磁波シールド筐体1の筐体本体は、矩形の盆状に構成された箱部10と、その箱部10に開閉可能に設けられた蓋部20とから構成されている。   Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the configuration of an electromagnetic wave shielding casing 1 to which the present invention is applied. As shown in FIG. 1, the case main body of the electromagnetic wave shielding case 1 includes a box part 10 configured in a rectangular tray shape and a lid part 20 provided on the box part 10 so as to be opened and closed. ing.

箱部10は、長方形の底板11を備え、その底板11の各辺外周から、右側壁12,左側壁13,後側壁14,前側壁15が立設されている。各側壁12,13,14,15の上端には、フランジ12a,13a,14a,15aが立設され、このフランジ12a,13a,14a,15aが蓋部20に形成された断面矩形の溝21に嵌合することによって、蓋部20が箱部10に固定される。   The box portion 10 includes a rectangular bottom plate 11, and a right side wall 12, a left side wall 13, a rear side wall 14, and a front side wall 15 are erected from the outer periphery of each side of the bottom plate 11. Flange 12 a, 13 a, 14 a, 15 a is erected on the upper end of each side wall 12, 13, 14, 15, and this flange 12 a, 13 a, 14 a, 15 a is formed in a groove 21 having a rectangular cross section formed in the lid portion 20. By fitting, the lid portion 20 is fixed to the box portion 10.

更に、底板11には、蓋部20をネジ固定するための円柱状の雌ネジ部材17が四隅に設けられ、CPU,IC等を複数搭載した電子部品の一例としてのプリント配線基板90を箱部10の内部に支持するための円柱状のスペーサ18が中央近傍に4本設けられている。また、後側壁14には、箱部10の内外に亘ってコードを通すためのコード穴14bが設けられている。   Further, the bottom plate 11 is provided with columnar female screw members 17 for fixing the lid portion 20 with screws at four corners, and a printed wiring board 90 as an example of an electronic component on which a plurality of CPUs, ICs and the like are mounted is provided in a box portion. Four columnar spacers 18 for supporting inside 10 are provided near the center. Further, the rear side wall 14 is provided with a cord hole 14b for allowing the cord to pass through the inside and outside of the box portion 10.

一方、蓋部20の溝21より内側の内壁部には、電磁波吸収体の一例としてのフェライトが充填されたゴムシート22(例えば、商品名「MG吸収シート」:北川工業製)が貼着され、そのゴムシート22の雌ネジ部材17との対向部には、円形の穴部23が蓋部20の内壁の一部に亘って穿設されている。また、ゴムシート22のスペーサ18との対向部にも、円形の穴部24が蓋部20の内壁の一部に亘って穿設されている。更に、穴部23の中央には図示しないビスを挿通可能なネジ穴23aが穿設され、雌ネジ部材17の中央には雌ネジ17aが切ってある。このため、箱部10に蓋部20をかぶせてフランジ12a,13a,14a,15aに溝21を嵌合させ、ネジ穴23aを通って雌ネジ17aに上記ビスを螺合させることにより、蓋部20が箱部10に固定される。   On the other hand, a rubber sheet 22 (for example, trade name “MG absorption sheet” manufactured by Kitagawa Industries) filled with ferrite as an example of an electromagnetic wave absorber is attached to the inner wall portion inside the groove 21 of the lid portion 20. A circular hole 23 is formed in a portion of the rubber sheet 22 facing the female screw member 17 over a part of the inner wall of the lid portion 20. In addition, a circular hole 24 is formed in a portion of the rubber sheet 22 facing the spacer 18 over a part of the inner wall of the lid 20. Further, a screw hole 23 a through which a screw (not shown) can be inserted is formed in the center of the hole 23, and a female screw 17 a is cut in the center of the female screw member 17. For this reason, the lid portion 20 is covered by covering the box portion 10 with the lid portion 20, fitting the grooves 21 into the flanges 12 a, 13 a, 14 a, and 15 a, and screwing the screws into the female screw 17 a through the screw holes 23 a. 20 is fixed to the box part 10.

次に、蓋部20は、平板状の合成樹脂板に切削加工を施してその外形及び溝21を形成し、ゴムシート22を接着剤で貼着した後に、更に切削加工を施して穴部23,24及びネジ穴23aを穿設して作成される。   Next, the lid portion 20 is formed by cutting a flat synthetic resin plate to form an outer shape and a groove 21. After the rubber sheet 22 is attached with an adhesive, the lid portion 20 is further cut to form the hole portion 23. 24 and screw holes 23a.

箱部10も、平板状の合成樹脂板に切削加工を施すことにより、次のように作成される。図2は、箱部10の構成を表す分解斜視図である。図2に示すように、底板11は、右側壁12,左側壁13と一体に合成樹脂板から切削加工によって切り出され、底板11と右側壁12,左側壁13との間に切削加工によって形成された断面V字状の折り溝19で、略直角に折り曲げられる。底板11,右側壁12,左側壁13の前後端縁近傍には、その内壁側に、断面矩形の溝11b,12b,13bが形成されている。後側壁14,前側壁15は、平板状の合成樹脂板から切削加工によってそれぞれ別体に切り出され、前述のフランジ14a,15aが全周に亘って形成されている。このため、右側壁12,左側壁13を上記のように折り曲げた後、フランジ14a,15aを溝11b,12b,13bに嵌合させて接着することにより、箱部10の外枠が作成される。   The box part 10 is also produced as follows by cutting a flat synthetic resin plate. FIG. 2 is an exploded perspective view showing the configuration of the box portion 10. As shown in FIG. 2, the bottom plate 11 is cut by cutting from a synthetic resin plate integrally with the right side wall 12 and the left side wall 13, and is formed by cutting between the bottom plate 11, the right side wall 12, and the left side wall 13. The fold groove 19 having a V-shaped cross section is bent substantially at a right angle. In the vicinity of the front and rear end edges of the bottom plate 11, the right side wall 12, and the left side wall 13, grooves 11b, 12b, and 13b having a rectangular cross section are formed on the inner wall side. The rear side wall 14 and the front side wall 15 are cut out separately from each other by cutting from a flat synthetic resin plate, and the aforementioned flanges 14a and 15a are formed over the entire circumference. For this reason, after bending the right side wall 12 and the left side wall 13 as described above, the outer frame of the box part 10 is created by fitting the flanges 14a and 15a to the grooves 11b, 12b and 13b and bonding them. .

更に、底板11には、雌ネジ部材17,スペーサ18を固定すべき位置に円形の凹部11c,11dが切削加工によって形成されており、この部分に雌ネジ部材17,スペーサ18を接着することによって箱部10が完成する。なお、雌ネジ部材17,スペーサ18は、いずれも、雌ネジ17a,18aを構成する金属部品と一体に射出成形等によって作成される。   Further, circular recesses 11c and 11d are formed in the bottom plate 11 at positions where the female screw member 17 and the spacer 18 are to be fixed, and the female screw member 17 and the spacer 18 are bonded to this portion. The box part 10 is completed. The female screw member 17 and the spacer 18 are both made by injection molding or the like integrally with the metal parts constituting the female screws 17a and 18a.

次に、図3は、雄ネジ部材の一例としてのビス91を雌ネジ18aに螺合することによってプリント配線基板90をスペーサ18の上に固定し、蓋部20をかぶせた状態を表す断面図である。前述のように、スペーサ18との対向部には穴部24が蓋部20の内壁に亘って穿設されているので、ビス91の頭部はゴムシート22に穿設された穴部24に嵌合してゴムシート22と同一平面状に並ぶ。ビス91の頭部は金属製であるため、穴部24を通過しようとした電磁波は全てビス91の頭部によって反射される。また、ゴムシート22は、フェライトが充填されているので、そのゴムシート22を通過しようとした電磁波やビス91の頭部に反射された電磁波を良好に吸収することができる。   Next, FIG. 3 is a cross-sectional view showing a state in which the printed wiring board 90 is fixed on the spacer 18 by screwing a screw 91 as an example of a male screw member to the female screw 18a, and the lid portion 20 is covered. It is. As described above, since the hole 24 is formed in the portion facing the spacer 18 over the inner wall of the lid portion 20, the head of the screw 91 is formed in the hole 24 formed in the rubber sheet 22. They are fitted and lined up with the rubber sheet 22 in the same plane. Since the head of the screw 91 is made of metal, all the electromagnetic waves that have attempted to pass through the hole 24 are reflected by the head of the screw 91. Further, since the rubber sheet 22 is filled with ferrite, the electromagnetic wave that is about to pass through the rubber sheet 22 and the electromagnetic wave reflected on the head of the screw 91 can be satisfactorily absorbed.

このため、本実施の形態では、プリント配線基板90から蓋部20を通って出入りしようとする電磁波を良好にシールドすることができる。また、本実施の形態では、ビス91の頭部が穴部24に嵌合するため、ゴムシート22をそれ程薄くしなくても、電磁波シールド筐体1の内部の無駄な空間を良好に減らすことができる。このため、電磁波シールド効果を損なうことなく、電磁波シールド筐体1を良好に小型化することができる。   For this reason, in this Embodiment, the electromagnetic waves which are going to enter / exit through the cover part 20 from the printed wiring board 90 can be shielded favorably. Moreover, in this Embodiment, since the head of the screw | thread 91 fits into the hole part 24, even if it does not make the rubber sheet 22 so thin, it can reduce the useless space inside the electromagnetic wave shielding housing | casing 1 favorably. Can do. For this reason, the electromagnetic wave shielding casing 1 can be favorably downsized without impairing the electromagnetic wave shielding effect.

なお、本発明は上記実施の形態に何ら限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の形態で実施することができる。例えば、雄ネジ部材はビスに限定されるものではなく、例えば六角ナットであってもよい。また、フェライトを充填したゴムシート22の代わりに、フェライトを充填した樹脂シートや導電性フィラー,金属箔,磁性箔等を充填したシートなど、各種電磁波シールド層(例えば、商品名「EMI吸収シート」「リーチフィルム」「クールプロバイド(登録商標)」「チェンジゲル(登録商標)」「レスミラー(登録商標)」「マグネフィルム」など:いずれも北川工業製)を利用することもできる。   In addition, this invention is not limited to the said embodiment at all, It can implement with a various form in the range which does not deviate from the summary of this invention. For example, the male screw member is not limited to a screw, and may be a hexagonal nut, for example. Further, instead of the rubber sheet 22 filled with ferrite, various electromagnetic wave shielding layers (for example, trade name “EMI absorption sheet”) such as a resin sheet filled with ferrite, a sheet filled with conductive filler, metal foil, magnetic foil, etc. “Leach Film”, “Cool Provide (registered trademark)”, “Change Gel (registered trademark)”, “Les Miller (registered trademark)”, “Magnefilm”, etc .: all manufactured by Kitagawa Industries Co., Ltd.) can also be used.

更に、上記実施の形態では、平板状の合成樹脂板に切削加工を施して箱部10,蓋部20を作成しているが、これらは射出成形等によって作成してもよい。但し、上記実施の形態のように各部を作成した場合、金型を作成する必要がなく製造コストを良好に低減することができる。また、射出成形では、ゴムシート22を貼着すべき部分を平面状に成形するのが困難であるが、上記作成方法によれば、ゴムシート22を貼着すべき部分の平面性を容易にかつ良好に確保することができる。従って、上記実施の形態では、ゴムシート22を蓋部20に隙間なく良好に固定することができ、電磁波シールド筐体1の耐久性を向上させると共に一層良好に小型化することができる。   Further, in the above embodiment, the box portion 10 and the lid portion 20 are formed by cutting a flat synthetic resin plate, but these may be formed by injection molding or the like. However, when each part is created as in the above embodiment, it is not necessary to create a mold, and the manufacturing cost can be reduced well. Further, in injection molding, it is difficult to form a portion where the rubber sheet 22 is to be pasted into a flat shape. However, according to the above creation method, the flatness of the portion where the rubber sheet 22 is to be pasted easily. And it can be secured satisfactorily. Therefore, in the said embodiment, the rubber sheet 22 can be favorably fixed to the cover part 20 without a gap, and the durability of the electromagnetic wave shielding housing 1 can be improved and further miniaturized.

本発明が適用された電磁波シールド筐体の構成を表す斜視図である。It is a perspective view showing the structure of the electromagnetic wave shielding housing | casing to which this invention was applied. その電磁波シールド筐体の箱部の構成を表す分解斜視図である。It is a disassembled perspective view showing the structure of the box part of the electromagnetic wave shielding housing | casing. その電磁波シールド筐体の内部にプリント配線基板を固定した状態を表す断面図である。It is sectional drawing showing the state which fixed the printed wiring board inside the electromagnetic wave shielding housing | casing.

符号の説明Explanation of symbols

1…電磁波シールド筐体 10…箱部 18…スペーサ
18a…雌ネジ 20…蓋部 22…ゴムシート
23,24…穴部 90…プリント配線基板 91…ビス
DESCRIPTION OF SYMBOLS 1 ... Electromagnetic shielding housing 10 ... Box part 18 ... Spacer 18a ... Female screw 20 ... Cover part 22 ... Rubber sheet 23, 24 ... Hole part 90 ... Printed wiring board 91 ... Screw

Claims (5)

電子部品を収納可能に構成された筐体本体と、
該筐体本体の内壁面の少なくとも一部に設けられ、上記筐体本体に収納された上記電子部品からの電磁波の出入りを抑制する電磁波シールド層と、
該電磁波シールド層に穿設され、上記筐体本体内で使用される雄ネジ部材の頭部が嵌合する穴部と、
を備えたことを特徴とする電磁波シールド筐体。
A housing body configured to store electronic components;
An electromagnetic wave shielding layer that is provided on at least a part of the inner wall surface of the housing body and suppresses electromagnetic waves from entering and exiting the electronic component housed in the housing body;
A hole formed in the electromagnetic wave shielding layer and fitted with a head of a male screw member used in the housing body;
An electromagnetic wave shielding housing comprising:
上記穴部が、上記電磁波シールド層から上記筐体本体の内壁面に亘って穿設されたことを特徴とする請求項1記載の電磁波シールド筐体。   2. The electromagnetic wave shielding casing according to claim 1, wherein the hole is formed from the electromagnetic shielding layer to an inner wall surface of the casing main body. 上記雄ネジ部材が、上記筐体本体内に上記電子部品を固定するためのビスであることを特徴とする請求項1または2記載の電磁波シールド筐体。   3. The electromagnetic wave shielding casing according to claim 1, wherein the male screw member is a screw for fixing the electronic component in the casing main body. 上記電磁波シールド層が、電磁波吸収体が充填されたシート状の部材から構成されたことを特徴とする請求項1〜3のいずれかに記載の電磁波シールド筐体。   The electromagnetic wave shielding casing according to any one of claims 1 to 3, wherein the electromagnetic wave shielding layer is composed of a sheet-like member filled with an electromagnetic wave absorber. 上記筐体本体の、少なくとも上記電磁波シールド層が設けられる部分が、平板状の合成樹脂板に切削加工を施して構成されたことを特徴とする請求項4記載の電磁波シールド筐体。   The electromagnetic shielding casing according to claim 4, wherein at least a portion of the casing main body on which the electromagnetic shielding layer is provided is formed by cutting a flat synthetic resin plate.
JP2006306691A 2006-11-13 2006-11-13 Electromagnetic shielding case Expired - Fee Related JP4859048B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006306691A JP4859048B2 (en) 2006-11-13 2006-11-13 Electromagnetic shielding case

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006306691A JP4859048B2 (en) 2006-11-13 2006-11-13 Electromagnetic shielding case

Publications (2)

Publication Number Publication Date
JP2008124259A true JP2008124259A (en) 2008-05-29
JP4859048B2 JP4859048B2 (en) 2012-01-18

Family

ID=39508690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006306691A Expired - Fee Related JP4859048B2 (en) 2006-11-13 2006-11-13 Electromagnetic shielding case

Country Status (1)

Country Link
JP (1) JP4859048B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106093489A (en) * 2016-05-30 2016-11-09 镇江市宏业科技有限公司 A kind of test cabinet shielding construction
WO2024029319A1 (en) * 2022-08-01 2024-02-08 株式会社オートネットワーク技術研究所 Terminal block

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113418A (en) * 1981-01-05 1982-07-14 Teijin Ltd Magnetic recording medium
JPS60106396A (en) * 1983-11-15 1985-06-11 Nec Corp Drive system for stepper motor
JPS6244498A (en) * 1985-08-22 1987-02-26 Ricoh Co Ltd Directly drawing planographic printing original plate
JPH0198308A (en) * 1987-10-09 1989-04-17 Matsushita Electric Ind Co Ltd Voltage controlled amplifier
JPH0384215U (en) * 1989-12-20 1991-08-27
JPH08167786A (en) * 1994-12-09 1996-06-25 Kokusai Electric Co Ltd Communication repeater
JPH08204380A (en) * 1995-01-31 1996-08-09 Tokin Corp Noise suppressing method for electric apparatus and noise suppressed electronic apparatus using this method
JPH08316662A (en) * 1995-05-24 1996-11-29 Fujitsu Ltd Electronic apparatus
JPH10233482A (en) * 1997-02-19 1998-09-02 Fuji Electric Co Ltd Semiconductor device
JPH10322052A (en) * 1997-05-15 1998-12-04 Saitama Nippon Denki Kk Electronic component mounting structure
JPH11338361A (en) * 1998-05-25 1999-12-10 Toshiba Corp Display device
JP2003051684A (en) * 1991-12-11 2003-02-21 Agilent Technol Inc Chassis for electronic device
JP2003141466A (en) * 2001-08-20 2003-05-16 Sony Corp Card read/write device and electromagnetic wave absorber

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113418A (en) * 1981-01-05 1982-07-14 Teijin Ltd Magnetic recording medium
JPS60106396A (en) * 1983-11-15 1985-06-11 Nec Corp Drive system for stepper motor
JPS6244498A (en) * 1985-08-22 1987-02-26 Ricoh Co Ltd Directly drawing planographic printing original plate
JPH0198308A (en) * 1987-10-09 1989-04-17 Matsushita Electric Ind Co Ltd Voltage controlled amplifier
JPH0384215U (en) * 1989-12-20 1991-08-27
JP2003051684A (en) * 1991-12-11 2003-02-21 Agilent Technol Inc Chassis for electronic device
JPH08167786A (en) * 1994-12-09 1996-06-25 Kokusai Electric Co Ltd Communication repeater
JPH08204380A (en) * 1995-01-31 1996-08-09 Tokin Corp Noise suppressing method for electric apparatus and noise suppressed electronic apparatus using this method
JPH08316662A (en) * 1995-05-24 1996-11-29 Fujitsu Ltd Electronic apparatus
JPH10233482A (en) * 1997-02-19 1998-09-02 Fuji Electric Co Ltd Semiconductor device
JPH10322052A (en) * 1997-05-15 1998-12-04 Saitama Nippon Denki Kk Electronic component mounting structure
JPH11338361A (en) * 1998-05-25 1999-12-10 Toshiba Corp Display device
JP2003141466A (en) * 2001-08-20 2003-05-16 Sony Corp Card read/write device and electromagnetic wave absorber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106093489A (en) * 2016-05-30 2016-11-09 镇江市宏业科技有限公司 A kind of test cabinet shielding construction
WO2024029319A1 (en) * 2022-08-01 2024-02-08 株式会社オートネットワーク技術研究所 Terminal block

Also Published As

Publication number Publication date
JP4859048B2 (en) 2012-01-18

Similar Documents

Publication Publication Date Title
US9639148B2 (en) Mobile information terminal
US9285843B2 (en) Electronic device
JP2007323751A (en) Hard disk drive housing case (hdd case)
US10347965B2 (en) Electronic apparatus with shielded antenna space
US10178455B2 (en) Electronic device including sound output module and housing for the electronic device
KR102083213B1 (en) Camera Module
JP2007200940A (en) Wireless device
US20080247147A1 (en) Electromagnetic-shielding device
JP2012028611A (en) Mobile electronic apparatus, and support member of electric substrate
CN112995378A (en) Loudspeaker module and electronic equipment
JP2003209419A (en) Electronic equipment and antenna packaging method
JP4859048B2 (en) Electromagnetic shielding case
JP6799785B2 (en) Audio equipment and electronic musical instruments
JP2006040966A (en) Electronic equipment
WO2014097654A1 (en) Electronic apparatus
US8014169B2 (en) Shield structure for electronic device
JP2018080916A (en) Portable radiation imaging device
JP6567079B2 (en) Electronics
JP2003202938A (en) Portable information processor
JP2011250205A (en) Portable electronic equipment
WO2016051720A1 (en) Shield cover and electronic apparatus
JP7092985B2 (en) Shield structure of high frequency circuit of electronic equipment
TW201633876A (en) Housing and electronic device using the same
CN115665624B (en) Speaker module and electronic equipment
JP2001267775A (en) Plastic case for electronic apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090812

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110512

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110524

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110722

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20111004

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20111027

R150 Certificate of patent or registration of utility model

Ref document number: 4859048

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141111

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141111

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees