JP2008120859A - Curing method of sealing material and assembling method of electronic equipment - Google Patents

Curing method of sealing material and assembling method of electronic equipment Download PDF

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JP2008120859A
JP2008120859A JP2006303369A JP2006303369A JP2008120859A JP 2008120859 A JP2008120859 A JP 2008120859A JP 2006303369 A JP2006303369 A JP 2006303369A JP 2006303369 A JP2006303369 A JP 2006303369A JP 2008120859 A JP2008120859 A JP 2008120859A
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sealing material
curing
atmosphere
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Seishi Ishikawa
聖之 石川
Hirofumi Nakano
裕文 中野
Toshiharu Oshima
寿治 大島
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Toyota Motor Corp
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Toyota Motor Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that, as it takes at least 24 hr until conventional room temperature-curable sealing materials are cured, a large amount of stock waiting for curing of the sealing material in a production process of on-vehicle electronic equipment. <P>SOLUTION: The curing method of a sealing material 7, which comprises a silicone resin as its ingredient and exhibits accelerated curing by absorbing moisture in the air, comprises causing the sealing material 7 to cure in an atmosphere of a relative humidity within the range of 55-90% and a temperature within the range of 25-64°C, preferably in an atmosphere of a relative humidity within the range of 70-90% and a temperature within the range of 40-64°C. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、シリコン樹脂を成分として含有し、大気中の水分を吸収することにより硬化が促進するシール材の硬化方法、およびその硬化方法にて硬化されたシール材を用いた電子機器の組立て方法に関する。   The present invention relates to a method for curing a sealing material containing a silicon resin as a component, and curing is accelerated by absorbing moisture in the air, and a method for assembling an electronic apparatus using the sealing material cured by the curing method About.

近年、車両においては電子制御化が急速に進んできており、車両への車載ＥＣＵ（Ｅｌｅｃｔｒｏｎｉｃ Ｃｏｎｔｒｏｌ Ｕｎｉｔ）等の車載電子機器の搭載率が増加し、特にエンジンルーム内に搭載される車載電子機器が急増している。
エンジンルーム内に搭載される車載電子機器は防水構造に構成されていることが好ましく、防水構造に構成された車載電子機器としては、例えば、ＥＣＵ基板を収納するケースと該ケースを閉塞するための蓋体との間にシール材を塗布して硬化させ、該ケースと蓋体との接合面をシールしたものがある。 In recent years, electronic control has been rapidly progressing in vehicles, and the mounting rate of in-vehicle electronic devices such as in-vehicle ECUs (Electronic Control Units) in vehicles has increased. In particular, in-vehicle electronic devices mounted in an engine room It is increasing rapidly.
The in-vehicle electronic device mounted in the engine room is preferably configured in a waterproof structure. As the in-vehicle electronic device configured in the waterproof structure, for example, a case for storing an ECU board and a case for closing the case There is one in which a sealing material is applied between the lid and cured to seal the joint surface between the case and the lid.

このように、車載電子機器のケースと蓋体との間をシールするシール剤としては、シリコン樹脂（シリコーン）にて構成され、加熱することにより硬化する熱硬化型のシール材が多く用いられているが、一般的に熱硬化型のシール材は、該シール材が塗布された箇所に油脂成分等の硬化阻害物質が付着していると硬化障害が発生するという問題があった。   As described above, as a sealant that seals between a case and a lid of an in-vehicle electronic device, a thermosetting sealing material that is made of silicon resin (silicone) and is cured by heating is often used. However, in general, a thermosetting sealing material has a problem that a curing failure occurs when a curing-inhibiting substance such as an oil or fat component adheres to a portion where the sealing material is applied.

そこで、近年では硬化障害が発生しにくいシリコン樹脂シール材として、加熱することなしに常温で硬化可能な常温硬化型のシール材が用いられるようになってきている。
常温硬化型のシール材によりシールが行われた車載電子機器としては、例えば特許文献１に記載された車載電子機器のようなものがある。
特開２００４−１５３０３４号公報 Therefore, in recent years, a room-temperature curable sealing material that can be cured at room temperature without heating has been used as a silicone resin sealing material that is less likely to cause a curing failure.
As an in-vehicle electronic device sealed with a room temperature curing type sealing material, there is an in-vehicle electronic device described in Patent Document 1, for example.
JP 2004-153034 A

しかし、前述の常温硬化型のシール材は、大気中の水分を吸収することにより硬化が進行するタイプのシール材であり、塗布してから硬化するまでに２４時間以上の時間を要していた。
このように、シール材の硬化に長い時間を要すると、車載電子機器の生産工程においては、シール材の硬化待ちの在庫を多量に抱えることとなって好ましくない。 However, the above-mentioned room temperature curing type sealing material is a type of sealing material that cures by absorbing moisture in the atmosphere, and it takes 24 hours or more to cure after being applied. .
Thus, if a long time is required for curing the sealing material, a large amount of stock waiting for curing of the sealing material is held in the production process of the in-vehicle electronic device.

そこで、本発明においては、硬化障害が発生しにくい常温硬化型のシール材を用いながら、短い時間で硬化を完了させることができるシール材の硬化方法および車載電子機器等の電子機器の組立て方法を提供するものである。   Therefore, in the present invention, there is provided a method for curing a sealing material and a method for assembling an electronic device such as an in-vehicle electronic device that can complete curing in a short time while using a room temperature curing type sealing material that is less likely to cause a curing failure. It is to provide.

上記課題を解決するシール材の硬化方法および電子機器の組立て方法は、以下の特徴を有する。
即ち、請求項１記載の如く、シリコン樹脂を成分として含有し、大気中の水分を吸収することにより硬化が促進するシール材の硬化方法であって、前記シール材を、相対湿度が５５％〜９０％の範囲内、かつ温度が２５℃〜６４℃の範囲内の雰囲気下で硬化させる。
これにより、シール材を従来に比べて短時間で硬化させることができるので、大気中の水分を吸収することにより硬化が進行するシール材を用いた場合でも、電子機器の生産工程における、シール材の硬化待ちの在庫を減少させることができ、生産工程の短縮化を図ることができる。 A sealing material curing method and an electronic device assembling method that solve the above problems have the following characteristics.
That is, as described in claim 1, a method for curing a sealing material containing a silicone resin as a component and promoting curing by absorbing moisture in the atmosphere, wherein the sealing material has a relative humidity of 55% to Curing is performed in an atmosphere within a range of 90% and a temperature within a range of 25 ° C to 64 ° C.
As a result, the sealing material can be cured in a shorter time than before, so even when a sealing material that cures by absorbing moisture in the atmosphere is used, the sealing material in the production process of electronic equipment The stock waiting to be cured can be reduced, and the production process can be shortened.

また、請求項２記載の如く、シリコン樹脂を成分として含有し、大気中の水分を吸収することにより硬化が促進するシール材の硬化方法であって、前記シール材を、相対湿度が７０％〜９０％の範囲内、かつ温度が４０℃〜６４℃の範囲内の雰囲気下で硬化させる。
これにより、シール材を従来に比べて大幅に短時間で硬化させることができるので、大気中の水分を吸収することにより硬化が進行するシール材を用いた場合でも、電子機器の生産工程における、シール材の硬化待ちの在庫を大幅に減少させることができ、生産工程を大幅に短縮することができる。 Further, according to claim 2, there is provided a method for curing a sealing material containing silicon resin as a component and promoting curing by absorbing moisture in the atmosphere, wherein the sealing material has a relative humidity of 70% to Curing is performed in an atmosphere within a range of 90% and a temperature within a range of 40 ° C to 64 ° C.
Thereby, since the sealing material can be cured in a considerably short time compared to the conventional, even in the case of using a sealing material that cures by absorbing moisture in the atmosphere, in the production process of electronic equipment, The stock of the sealant waiting to be cured can be greatly reduced, and the production process can be greatly shortened.

また、請求項３記載の如く、前記シール材を、前記雰囲気下に１０分以上放置する。
これにより、前記電子機器の生産工程における、シール材の硬化待ちの在庫を大幅に減少させつつ、前記電子機器に求められるシール性以上のシール性を得ることができる。 According to a third aspect of the present invention, the sealing material is left in the atmosphere for 10 minutes or longer.
Thereby, the sealing performance more than the sealing performance calculated | required by the said electronic device can be obtained, reducing the inventory of the sealing material waiting for hardening in the production process of the said electronic device significantly.

また、請求項４記載の如く、半導体素子が実装された基板を収納するケースの開口を蓋体にて閉塞して構成される電子機器の組立て方法であって、請求項１〜請求項３の何れかに記載のシール材の硬化方法にて硬化されたシール材を用いて、前記ケースと蓋体との接合面のシールを行う。
これにより、前記電子機器に求められるシール性を確保しつつ、該電子機器の生産工程における、シール材の硬化待ちの在庫を大幅に減少させることができ、生産工程を短縮することができる。 According to a fourth aspect of the present invention, there is provided an electronic device assembling method configured by closing an opening of a case for housing a substrate on which a semiconductor element is mounted with a lid. Sealing of the joint surface between the case and the lid is performed using the sealing material cured by any of the sealing material curing methods.
Thereby, while ensuring the sealing performance required for the electronic device, it is possible to greatly reduce the stock of the sealing material waiting to be cured in the production process of the electronic device, thereby shortening the production process.

本発明によれば、シール材を従来に比べて短時間で硬化させることができるので、大気中の水分を吸収することにより硬化が進行するシール材を用いた場合でも、車載電子機器の生産工程における、シール材の硬化待ちの在庫を減少させることができ、生産工程の短縮化を図ることができる。   According to the present invention, since the sealing material can be cured in a shorter time than conventional, even when a sealing material that cures by absorbing moisture in the atmosphere is used, the production process of the in-vehicle electronic device , The stock of the sealant waiting to be cured can be reduced, and the production process can be shortened.

次に、本発明を実施するための形態を、添付の図面を用いて説明する。   Next, modes for carrying out the present invention will be described with reference to the accompanying drawings.

図１〜図３に示す車載電子機器としての車載ＥＣＵ（Ｅｌｅｃｔｒｏｎｉｃ Ｃｏｎｔｒｏｌ Ｕｎｉｔ）１は、半導体素子５・５・・・やコネクタ６等が実装された基板４をケース２に収納して、該ケース２上面の開口を蓋体３により閉塞することで構成されている。   An in-vehicle ECU (Electronic Control Unit) 1 as an in-vehicle electronic device shown in FIGS. 1 to 3 stores a substrate 4 on which semiconductor elements 5,... 2 Opening on the upper surface is closed by the lid 3.

前記ケース２の上面における開口周縁部２ａには全周にわたってシール材７が塗布されており、ケース２の開口を蓋体３にて閉じた状態では、該ケース２と蓋体３との間にシール材７が介在しており、該シール材７によりケース２と蓋体３との接合面がシールされている。
このように、ケース２と蓋体３との接合面をシール材７によりシールすることで、車載ＥＣＵ１の防水性を高めて、ケース２内部への水分の浸入を防止している。 A sealing material 7 is applied to the peripheral edge 2a of the opening on the upper surface of the case 2 over the entire periphery. When the opening of the case 2 is closed by the lid 3, the gap between the case 2 and the lid 3 The sealing material 7 is interposed, and the joint surface between the case 2 and the lid 3 is sealed by the sealing material 7.
In this way, the joint surface between the case 2 and the lid 3 is sealed with the sealing material 7, thereby improving the waterproofness of the in-vehicle ECU 1 and preventing moisture from entering the case 2.

前記シール材７は、シリコン樹脂（シリコーン）にて構成されており、未硬化状態のシール材７を大気中に放置しておくと、大気中の水分を吸収することにより硬化が進行していく。   The sealing material 7 is made of silicon resin (silicone), and when the uncured sealing material 7 is left in the atmosphere, curing proceeds by absorbing moisture in the atmosphere. .

具体的には、シール材７は以下のようなメカニズムにより硬化する。
図４に示すように、まず、未硬化状態のシール材７に含まれる第１シリコン重合物（−Ｓｉ−ＯＣＨ３）が、大気中の水分（Ｈ２Ｏ）と反応することにより、メタノール（ＣＨ３ＯＨ）の放出を伴いながら第２シリコン重合物（−Ｓｉ−ＯＨ）が生成される。 Specifically, the sealing material 7 is cured by the following mechanism.
As shown in FIG. 4, first, the first silicon polymer (—Si—OCH 3 ) contained in the uncured sealing material 7 reacts with moisture (H 2 O) in the atmosphere, so that methanol ( A second silicon polymer (—Si—OH) is produced with the release of (CH 3 OH).

次に、前記第１シリコン重合物（−Ｓｉ−ＯＣＨ３）と生成された第２シリコン重合物（−Ｓｉ−ＯＨ）とが反応して、メタノール（ＣＨ３ＯＨ）の放出を伴いながら硬化状態のシリコン樹脂（−Ｓｉ−Ｏ−Ｓｉ）が生成される。 Next, the first silicon polymer (—Si—OCH 3 ) reacts with the generated second silicon polymer (—Si—OH), and the cured state is accompanied with the release of methanol (CH 3 OH). Silicon resin (-Si-O-Si) is produced.

このように、シール材７においては、大気中の水分を吸収することにより脱アルコール反応が進行して、硬化するように構成されている。
従って、本シール材７は、大気中に含まれる水分量が多いほど硬化が促進され、短時間で硬化が完了することとなる。 As described above, the sealing material 7 is configured such that the dealcoholization reaction proceeds and is cured by absorbing moisture in the atmosphere.
Accordingly, the sealing material 7 is cured as the amount of moisture contained in the atmosphere increases, and the curing is completed in a short time.

そこで、本シール材７の硬化方法においては、該シール材７を硬化させるために放置する大気の湿度条件、および温度条件は、次のように設定している。
つまり、図５に示すように、前記シール材７は、相対湿度が５５％〜９０％の範囲内、かつ温度が２５℃〜６４℃の範囲内の雰囲気下に放置して硬化させる。
さらに好ましくは、前記シール材７は、相対湿度が７０％〜９０％の範囲内、かつ温度が４０℃〜６４℃の範囲内の雰囲気下に放置して硬化させる。 Therefore, in the method for curing the sealing material 7, the humidity conditions and temperature conditions of the atmosphere left to cure the sealing material 7 are set as follows.
That is, as shown in FIG. 5, the sealing material 7 is left to cure in an atmosphere having a relative humidity in the range of 55% to 90% and a temperature in the range of 25 ° C. to 64 ° C.
More preferably, the sealing material 7 is left to cure in an atmosphere having a relative humidity in the range of 70% to 90% and a temperature in the range of 40 ° C to 64 ° C.

シール材７の硬化条件をこのような条件に設定したのは、以下の理由による。
つまり、シール材７を硬化させる雰囲気の相対湿度が９０％以上になると結露を生じるため、雰囲気の相対湿度２を９０％未満に設定している。
また、シール材７の硬化中に該シール材７から放出されるメタノールの沸点が６４℃であり、雰囲気温度が６４℃以上になると放出されたメタノールが蒸発してシール材７内に気泡が生じる原因となり得るため、雰囲気の温度が６４℃未満となるように設定している。 The curing conditions for the sealing material 7 are set to such conditions for the following reason.
That is, condensation occurs when the relative humidity of the atmosphere for curing the sealing material 7 is 90% or more, so the relative humidity 2 of the atmosphere is set to less than 90%.
Further, the boiling point of methanol released from the sealing material 7 during the curing of the sealing material 7 is 64 ° C., and when the ambient temperature becomes 64 ° C. or higher, the released methanol evaporates and bubbles are generated in the sealing material 7. Since it may be a cause, the temperature of the atmosphere is set to be lower than 64 ° C.

また、シール材７は、常温・常湿（本例の場合２３±２℃、５０±５％ＲＨ）の雰囲気条件にて硬化させた場合２４時間で硬化するが、本シール材７の硬化方法においては、シール材７の硬化時の雰囲気の温度を２５℃以上とするとともに相対湿度を５５％以上として、常温・常湿（本例の場合２３±２℃、５０±５％ＲＨ）の雰囲気条件よりも、大気中に含まれる水分量が多くなるような雰囲気条件にシール材７を放置して、２４時間よりも短い時間でシール材７を硬化させるようにしている。   Further, the sealing material 7 is cured in 24 hours when cured under the atmospheric condition of normal temperature and normal humidity (23 ± 2 ° C., 50 ± 5% RH in this example). In this example, the temperature of the sealing material 7 during curing is set to 25 ° C. or higher and the relative humidity is set to 55% or higher so that the atmosphere is normal temperature and normal humidity (23 ± 2 ° C., 50 ± 5% RH in this example). The sealing material 7 is allowed to stand in an atmospheric condition in which the amount of moisture contained in the atmosphere is larger than the conditions, and the sealing material 7 is cured in a time shorter than 24 hours.

特に、シール材７の硬化時の雰囲気の温度を４０℃以上とするとともに相対湿度を７０％以上とした場合には、常温・常湿の場合に比べると大気中に含まれる水分量が、常温・常湿の場合に比べて大幅に増加するため硬化の進行が大いに促進され、硬化開始から１０分で硬化を完了することができる。
すなわち、シール材７を相対湿度が７０％〜９０％の範囲内、かつ温度が４０℃〜６４℃の範囲内の雰囲気下に放置した場合、シール材７を１０分で硬化させることが可能となる。 In particular, when the temperature of the atmosphere at the time of curing of the sealing material 7 is set to 40 ° C. or higher and the relative humidity is set to 70% or higher, the amount of moisture contained in the atmosphere is higher than that at normal temperature and normal humidity. -Significantly increased compared to normal humidity, the progress of curing is greatly accelerated, and curing can be completed within 10 minutes from the start of curing.
That is, when the sealing material 7 is left in an atmosphere where the relative humidity is in the range of 70% to 90% and the temperature is in the range of 40 ° C. to 64 ° C., the sealing material 7 can be cured in 10 minutes. Become.

なお、本シール材７は、塗布後空気に触れた部分から硬化していくが、本例でいう「硬化の完了」とは、硬化が開始されたシール材７の表面から厚み方向に予め定められた所定厚さだけ硬化した時点のことをいう。   The sealing material 7 is cured from the portion that has been exposed to air after application. In this example, “completed curing” is determined in advance in the thickness direction from the surface of the sealing material 7 on which curing has started. It means the point of time when a predetermined thickness is cured.

このように、相対湿度が７０％〜９０％の範囲内、かつ温度が４０℃〜６４℃の範囲内の雰囲気下に放置したシール材７の硬化度合いを、該シール材７のシール性（具体的には、シール材７にてシールした車載ＥＣＵ１のケース２と蓋体３との接合面の耐圧性）により確認するために行った実験の結果を以下に示す。   As described above, the degree of cure of the sealing material 7 left in an atmosphere having a relative humidity in the range of 70% to 90% and a temperature in the range of 40 ° C. to 64 ° C. is determined by the sealing property of the sealing material 7 (specifically Specifically, the results of an experiment conducted to confirm by the pressure resistance of the joint surface between the case 2 and the lid 3 of the in-vehicle ECU 1 sealed with the sealing material 7 are shown below.

図６に示すように、本実験は、前記車載ＥＣＵ１のケース２と蓋体３との接合部にシール材７を介装させた状態で放置した時間と、該ケース２における蓋体３との接合部の耐圧性との関係を調べたものであり、蓋体３が接合されたケース２に負圧をかけてケース２内部から外部へのリークが発生しなければ耐圧ＯＫで、リークが発生すると耐圧ＮＧと判定した。   As shown in FIG. 6, this experiment is performed with respect to a time period in which the sealing material 7 is interposed in a joint portion between the case 2 and the lid 3 of the in-vehicle ECU 1 and the lid 3 in the case 2. The relationship with the pressure resistance of the joint is examined. When a negative pressure is applied to the case 2 to which the lid 3 is joined and no leak from the inside of the case 2 to the outside occurs, the leak occurs at the withstand voltage OK. Then, it was determined that the breakdown voltage was NG.

また、本実験は、本例の硬化条件の範囲に含まれる温度が５０℃かつ相対湿度が８０％の雰囲気下に放置してシール材７を硬化させた車載ＥＣＵ１のサンプルと、従来条件である常温・常湿（２３℃、５０％ＲＨ）の雰囲気下に放置してシール材７を硬化させた比較例となる車載ＥＣＵ１のサンプルとについて行った。   Further, this experiment is a sample of the in-vehicle ECU 1 in which the sealing material 7 is cured by leaving it in an atmosphere having a temperature included in the range of the curing conditions of this example of 50 ° C. and a relative humidity of 80%, and the conventional conditions. This was carried out for a sample of the in-vehicle ECU 1 as a comparative example in which the sealing material 7 was cured by leaving it in an atmosphere of normal temperature and normal humidity (23 ° C., 50% RH).

図６によれば、本例の硬化条件となる温度が５０℃かつ相対湿度が８０％の雰囲気下に放置して硬化させたシール材７にてシールした車載ＥＣＵ１については、シール材２の硬化時間が１０分以上になると、車載ＥＣＵ１に要求される耐圧以上の耐圧が得られている。
これに対し、従来条件である常温・常湿の雰囲気下に放置して硬化させたシール材７にてシールした車載ＥＣＵ１については、シール材２の硬化時間が１４４０分（２４時間）に達して、初めて車載ＥＣＵ１に要求される耐圧以上の耐圧を得ることが可能となっている。 According to FIG. 6, for the in-vehicle ECU 1 sealed with the sealing material 7 cured by leaving it in an atmosphere having a temperature of 50 ° C. and a relative humidity of 80% as the curing condition of this example, the sealing material 2 is cured. When the time is 10 minutes or more, a breakdown voltage that is higher than the breakdown voltage required for the in-vehicle ECU 1 is obtained.
On the other hand, the curing time of the sealing material 2 reaches 1440 minutes (24 hours) for the in-vehicle ECU 1 sealed with the sealing material 7 which has been cured by leaving it in an atmosphere of normal temperature and normal humidity, which is a conventional condition. For the first time, it is possible to obtain a withstand voltage higher than that required for the in-vehicle ECU 1.

このように、本硬化方法の条件によりシール材２を硬化させると、従来に比べて短時間で硬化させることができるので、大気中の水分を吸収して脱アルコール反応が生じることにより硬化が進行する所謂常温硬化型のシール材２を用いた場合でも、前記車載ＥＣＵ１に求められるシール性を確保しつつ、該車載ＥＣＵ１の生産工程における、シール材２の硬化待ちの在庫を減少させることができ、生産工程の短縮化を図ることができる。   As described above, when the sealing material 2 is cured according to the conditions of the present curing method, it can be cured in a shorter time than in the past, and therefore, curing proceeds by absorbing moisture in the atmosphere and causing a dealcoholization reaction. Even when the so-called room temperature curing type sealing material 2 is used, it is possible to reduce the stock waiting for curing of the sealing material 2 in the production process of the in-vehicle ECU 1 while ensuring the sealing performance required for the in-vehicle ECU 1. The production process can be shortened.

特に、シール材を、相対湿度が７０％〜９０％の範囲内、かつ温度が４０℃〜６４℃の範囲内の雰囲気下に放置すると１０分で硬化させることができるので、シール材２の硬化待ちの在庫を大幅に減少させることができ、生産工程を大幅に短縮することができる。   In particular, if the sealing material is allowed to stand in an atmosphere having a relative humidity in the range of 70% to 90% and a temperature in the range of 40 ° C. to 64 ° C., the sealing material can be cured in 10 minutes. The waiting inventory can be greatly reduced, and the production process can be greatly shortened.

本発明の硬化方法にて硬化されるシール材により、蓋体との接合面をシールされる車載ＥＣＵのケースを示す平面図である。It is a top view which shows the case of vehicle-mounted ECU by which the joint surface with a cover body is sealed by the sealing material hardened | cured with the hardening method of this invention. 本発明の硬化方法にて硬化されるシール材により、ケースとの接合面をシールされる車載ＥＣＵの蓋体を示す平面図である。It is a top view which shows the cover body of vehicle-mounted ECU by which the joint surface with a case is sealed with the sealing material hardened | cured with the hardening method of this invention. 本発明の硬化方法にて硬化されるシール材により、ケースと蓋体との接合面がシールされた車載ＥＣＵを示す側面断面図である。It is side surface sectional drawing which shows vehicle-mounted ECU by which the joint surface of a case and a cover body was sealed with the sealing material hardened | cured with the hardening method of this invention. シール材の硬化メカニズムを示す図である。It is a figure which shows the hardening mechanism of a sealing material. 本発明の硬化方法におけるシール材の硬化条件を示す図である。It is a figure which shows the hardening conditions of the sealing material in the hardening method of this invention. シール材にてシールされた車載ＥＣＵの耐圧性とシール材の硬化条件との関係を示す図である。It is a figure which shows the relationship between the pressure resistance of vehicle-mounted ECU sealed with the sealing material, and the hardening conditions of a sealing material.

符号の説明Explanation of symbols

１ 車載ＥＣＵ
２ ケース
３ 蓋体
４ 基板
５ 半導体素子
６ コネクタ
７ シール材 1 In-vehicle ECU
2 Case 3 Lid 4 Substrate 5 Semiconductor element 6 Connector 7 Sealing material

Claims (4)

シリコン樹脂を成分として含有し、大気中の水分を吸収することにより硬化が促進するシール材の硬化方法であって、
前記シール材を、相対湿度が５５％〜９０％の範囲内、かつ温度が２５℃〜６４℃の範囲内の雰囲気下で硬化させる、
ことを特徴とするシール材の硬化方法。 A curing method for a sealing material containing a silicone resin as a component, and curing is accelerated by absorbing moisture in the atmosphere,
The sealing material is cured in an atmosphere having a relative humidity within a range of 55% to 90% and a temperature within a range of 25 ° C to 64 ° C.
A method for curing a sealing material. シリコン樹脂を成分として含有し、大気中の水分を吸収することにより硬化が促進するシール材の硬化方法であって、
前記シール材を、相対湿度が７０％〜９０％の範囲内、かつ温度が４０℃〜６４℃の範囲内の雰囲気下で硬化させる、
ことを特徴とするシール材の硬化方法。 A curing method for a sealing material containing a silicone resin as a component, and curing is accelerated by absorbing moisture in the atmosphere,
The sealing material is cured in an atmosphere having a relative humidity of 70% to 90% and a temperature of 40 ° C to 64 ° C.
A method for curing a sealing material. 前記シール材を、前記雰囲気下に１０分以上放置する、
ことを特徴とする請求項２に記載のシール材の硬化方法。 The sealing material is left in the atmosphere for 10 minutes or more.
The method for curing a sealing material according to claim 2. 半導体素子が実装された基板を収納するケースの開口を蓋体にて閉塞して構成される電子機器の組立て方法であって、
請求項１〜請求項３の何れかに記載のシール材の硬化方法にて硬化されたシール材を用いて、前記ケースと蓋体との接合面のシールを行う、
ことを特徴とする電子機器の組立て方法。

A method of assembling an electronic device configured by closing an opening of a case for housing a substrate on which a semiconductor element is mounted with a lid,
Sealing the joint surface between the case and the lid using the sealing material cured by the method of curing a sealing material according to any one of claims 1 to 3.
A method for assembling an electronic device.

JP2006303369A 2006-11-08 2006-11-08 Curing method of sealing material and assembling method of electronic equipment Pending JP2008120859A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59113051A (en) * 1982-12-20 1984-06-29 Kanegafuchi Chem Ind Co Ltd Room temperature curable composition
JPS6023445A (en) * 1983-07-19 1985-02-06 Kanegafuchi Chem Ind Co Ltd Room temperature curing composition
JPH01242234A (en) * 1988-03-25 1989-09-27 Koito Mfg Co Ltd Bonding seal-processing method in light appliance for vehicle
JPH05140532A (en) * 1991-11-20 1993-06-08 Sanyo Chem Ind Ltd Moisture-curing sealant
JP2000038508A (en) * 1998-07-23 2000-02-08 Ge Toshiba Silicones Co Ltd Room temperature curing polyorganosiloxane composition having thermal conductivity
JP2000129145A (en) * 1998-10-22 2000-05-09 Asahi Glass Co Ltd Composition curable at room temperature
JP2000178535A (en) * 1998-12-14 2000-06-27 Three Bond Co Ltd Sealing agent composition
JP2000218784A (en) * 1999-02-03 2000-08-08 Fuji Electric Co Ltd Ink-jet recording head
JP2001232703A (en) * 2000-02-21 2001-08-28 Dainippon Printing Co Ltd Decorative sheet and decorative material
JP2002037942A (en) * 2000-07-25 2002-02-06 Mitsui Chemicals Inc Curable elastic composition and application thereof
JP2004143360A (en) * 2002-10-28 2004-05-20 Mitsui Chemicals Inc Olefin polymer, olefin polymer composition, molding material, crosslinked product, method of manufacturing crosslinked product, use of molding material and
JP2004153034A (en) * 2002-10-31 2004-05-27 Mitsubishi Electric Corp Case structure of onboard electronic equipment
JP2005002189A (en) * 2003-06-11 2005-01-06 Yokohama Rubber Co Ltd:The Curable composition
JP2006131824A (en) * 2004-11-09 2006-05-25 Shin Etsu Chem Co Ltd Room temperature curable organopolysiloxane composition

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