JP2008117804A - Packaging substrate having two-stage structure, and crystal oscillator using the same - Google Patents

Packaging substrate having two-stage structure, and crystal oscillator using the same Download PDF

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Publication number
JP2008117804A
JP2008117804A JP2006296914A JP2006296914A JP2008117804A JP 2008117804 A JP2008117804 A JP 2008117804A JP 2006296914 A JP2006296914 A JP 2006296914A JP 2006296914 A JP2006296914 A JP 2006296914A JP 2008117804 A JP2008117804 A JP 2008117804A
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Prior art keywords
substrate
hole
metal pin
stage structure
solder
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JP2006296914A
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JP5188054B2 (en
Inventor
Takashi Uchida
剛史 内田
Manabu Ito
学 伊藤
Tomotaka Kuroda
智孝 黒田
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Nihon Dempa Kogyo Co Ltd
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Nihon Dempa Kogyo Co Ltd
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Priority to JP2006296914A priority Critical patent/JP5188054B2/en
Priority to US11/975,753 priority patent/US7791425B2/en
Priority to EP07254214A priority patent/EP1919042A3/en
Publication of JP2008117804A publication Critical patent/JP2008117804A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09463—Partial lands, i.e. lands or conductive rings not completely surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/1084—Notched leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging substrate having a two-stage structure, where a metal pin is reliably joined to a first substrate, and to provide a crystal oscillator using the packaging substrate. <P>SOLUTION: In the packaging substrate having a two-stage structure, a second substrate 1b is supported onto the first substrate 1a having a mounted electrode on an external bottom surface by the metal pin 4, and the tip of the metal pin 4 is inserted into a hole 5 provided on the surface of the first substrate 1a for fixing to an annular electrode land 6 provided on the surface of the first substrate 1a becoming the periphery of the hole 5 by solder 7. In the annular electrode land 6, a partial annular portion is opened. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は金属ピンによる二段構造の実装基板及びこれを用いた水晶発振器を技術分野とし、特に金属ピンの立設構造に関する。   The present invention relates to a two-stage mounting substrate using metal pins and a crystal oscillator using the same, and more particularly to a standing structure of metal pins.

（発明の背景）
水晶発振器は周波数の基準源として通信機器等に広く用いられる。このようなものの一つに、水晶振動子を恒温槽に収容して動作温度を一定として、発振周波数を高安定に維持した基地局や中継局の通信機器に内蔵される恒温型の水晶発振器（以下、恒温型発振器とする）がある。 (Background of the Invention)
Crystal oscillators are widely used as communication frequency sources as frequency reference sources. One of these is a constant-temperature crystal oscillator built in a communication device of a base station or a relay station in which a crystal resonator is housed in a thermostatic chamber and the operating temperature is kept constant and the oscillation frequency is kept highly stable ( Hereinafter, it is referred to as a constant temperature type oscillator).

（従来技術の一例）
第２図及び第３図は一従来例を説明する図で、第２図（ａ）は恒温型発振器の断面図、同図（ｂ）は恒温槽９の配置断面図であり、第３図（ａ）は第１基板１ａの一部拡大平面図、同図（ｂ）は金属ピン４を立設した第１基板１ａの一部拡大図、同図（ｃ）は同側面図である。 (Example of conventional technology)
2 and 3 are diagrams for explaining a conventional example, FIG. 2 (a) is a sectional view of a thermostatic oscillator, FIG. 2 (b) is an arrangement sectional view of a thermostatic bath 9, and FIG. (A) is a partially enlarged plan view of the first substrate 1a, (b) is a partially enlarged view of the first substrate 1a with the metal pins 4 erected, and (c) is a side view thereof.

恒温型発振器はいずれもガラスエポキシ材からなる第１基板１ａ、第２基板１ｂとを有する。第１基板１ａは例えば積層基板として、積層面及び端面のスルーホールを経て外底面の４角部に実装端子２を有する。第１基板１ａの表面には例えば回路素子３が配置される。第２基板１ｂは第１基板１ａの上方に水平方向として、例えば４角部の金属ピン４によって支持される。   Each of the constant temperature oscillators includes a first substrate 1a and a second substrate 1b made of a glass epoxy material. The first substrate 1a is, for example, a laminated substrate, and has mounting terminals 2 at the four corners of the outer bottom surface through the laminated surface and through holes on the end surface. For example, the circuit element 3 is arranged on the surface of the first substrate 1a. The second substrate 1b is supported by, for example, four corner metal pins 4 in the horizontal direction above the first substrate 1a.

ここでは、第１基板１ａの４角部には穴５が設けられ、穴５の外周となる第１基板１ａの表面には環状の電極ランド６が設けられる。但し、穴５の内部には電極は形成されず、電極ランド６には図示しない導電路が接続する。そして、金属ピン４の下端側の先端が穴５に挿入されて、電極ランド６と半田７によって接合される。穴５は例えば積層基板の上層側に貫通孔を設けたり、積層後にドリル等によって設けられる。   Here, holes 5 are provided in the four corners of the first substrate 1 a, and annular electrode lands 6 are provided on the surface of the first substrate 1 a that is the outer periphery of the hole 5. However, no electrode is formed inside the hole 5, and a conductive path (not shown) is connected to the electrode land 6. The tip on the lower end side of the metal pin 4 is inserted into the hole 5 and joined with the electrode land 6 and the solder 7. The hole 5 is provided by, for example, a through hole on the upper layer side of the laminated substrate, or by a drill or the like after the lamination.

第２基板１ｂは金属ピン４の上端側の円板状に突出したストッパー８に係止して支持される。第２基板１ｂの下面側には恒温槽９（金属筒）に収納された水晶振動子１０を配置し、上面側には発振回路を形成する回路素子３や、恒温槽９の温度を一定に制御する回路素子３を配置する。   The second substrate 1b is supported by being locked to a stopper 8 protruding like a disk on the upper end side of the metal pin 4. A crystal resonator 10 housed in a thermostatic chamber 9 (metal cylinder) is arranged on the lower surface side of the second substrate 1b, and the temperature of the circuit element 3 forming the oscillation circuit and the thermostatic chamber 9 is made constant on the upper surface side. A circuit element 3 to be controlled is arranged.

恒温槽９は一端側が開口した水晶振動子１０の収容部を有し、対向する脚壁を下面に有して両端開口の凹部を形成する。そして、脚壁間の凹部内となる第２基板１ｂには加熱素子としてのチップ抵抗３ａ及び温度検出素子としてのサーミスタ３ｂを配設する。符号１０ａは水晶振動子１０の一対のリード線である。   The thermostatic chamber 9 has a housing portion for the crystal resonator 10 that is open at one end side, and has opposing leg walls on the lower surface to form recesses that are open at both ends. A chip resistor 3a as a heating element and a thermistor 3b as a temperature detection element are disposed on the second substrate 1b in the recess between the leg walls. Reference numeral 10 a denotes a pair of lead wires of the crystal unit 10.

第１基板１ａの各回路素子３は図示しない回路パターン（導電路）によって電気的に接続し、これらは金属ピン４によって第１基板１ａの回路パターンに接続する。そして、第２基板１ｂの回路素子３等に接続してスルーホールによって積層面に延出し、さらに前述のように実装端子２に接続する。なお、第１基板１ａの全表面にはアース（シールド）用とする金属膜が形成され、エッチングによって必要な電極パターンが形成される。   Each circuit element 3 on the first substrate 1 a is electrically connected by a circuit pattern (conductive path) (not shown), and these are connected to the circuit pattern on the first substrate 1 a by metal pins 4. And it connects to the circuit element 3 etc. of the 2nd board | substrate 1b, is extended to a laminated surface by a through hole, and is further connected to the mounting terminal 2 as mentioned above. A metal film for grounding (shielding) is formed on the entire surface of the first substrate 1a, and a necessary electrode pattern is formed by etching.

このようなものでは、第２基板１ｂの下面側に恒温槽９に収納された水晶振動子１０を配置し、第１基板１ａ上に金属ピン４によって第２基板１ｂを支持する。この場合、恒温槽９（水晶振動子１０）は第１基板１ａ上から離間して配置されるので、恒温槽９は熱的に遮断されるので放熱を防止する。なお、第１基板１ａの回路素子３は第２基板１ｂ上に配設できる場合は、第１基板１ａ上には無素子とすることもできる。
特開２００５−１２４１２９号公報 In such a case, the crystal resonator 10 accommodated in the thermostatic chamber 9 is disposed on the lower surface side of the second substrate 1b, and the second substrate 1b is supported by the metal pins 4 on the first substrate 1a. In this case, since the thermostatic chamber 9 (quartz crystal unit 10) is disposed away from the first substrate 1a, the thermostatic chamber 9 is thermally blocked, so that heat radiation is prevented. In addition, when the circuit element 3 of the first substrate 1a can be disposed on the second substrate 1b, the circuit element 3 can be left on the first substrate 1a.
JP 2005-124129 A

（従来技術の問題点）
しかしながら、上記構成の恒温型発振器では、第２基板１ｂを支持する金属ピン４の下端側先端は第１基板１ａの穴５に挿入され、第１基板１ａの電極ランド６と半田７によって接合される。このため、半田接合時の熱や、恒温型発振器が図示しないセット基板に半田リフローによって搭載されるときの熱によって、第１基板１ａの穴５内の閉じ込められた空気が膨張し、半田７が破裂する。これにより、第１基板１ａに対して金属ピン４を植設できなかったり、接合強度が低下する問題があった。 (Problems of conventional technology)
However, in the constant temperature oscillator configured as described above, the lower end of the metal pin 4 that supports the second substrate 1 b is inserted into the hole 5 of the first substrate 1 a and joined to the electrode land 6 of the first substrate 1 a by the solder 7. The For this reason, the air trapped in the hole 5 of the first substrate 1a expands due to the heat at the time of soldering and the heat when the constant temperature oscillator is mounted on a set substrate (not shown) by solder reflow, and the solder 7 Burst. Thereby, there existed a problem that the metal pin 4 could not be implanted with respect to the 1st board | substrate 1a, or joining strength fell.

なお、第１基板１ａの穴５を貫通すればこの問題は解消する。しかし、この場合は、恒温型発振器を実装するセット基板に回路パターンが形成されていると、第１基板１ａの穴５内の金属ピン４と電気的に接続するおそれがあり、現実には採用できないことになる。   Note that this problem can be solved by passing through the hole 5 of the first substrate 1a. However, in this case, if a circuit pattern is formed on the set substrate on which the constant-temperature oscillator is mounted, there is a risk of electrical connection with the metal pin 4 in the hole 5 of the first substrate 1a. It will not be possible.

（発明の目的）
本発明は、第１基板に対する金属ピンの接合を確実にした二段構造の実装基板及びこれを用いた水晶発振器を提供することを目的とする。 (Object of invention)
An object of the present invention is to provide a mounting substrate having a two-stage structure in which a metal pin is reliably bonded to a first substrate, and a crystal oscillator using the mounting substrate.

本発明は、特許請求の範囲（請求項１）に示したように、外底面に実装電極を有する第１基板上に金属ピンによって第２基板を支持し、前記金属ピンは先端が前記第１基板の表面に設けられた穴に挿入され、前記穴の外周となる前記第１基板の表面に設けられた環状の電極ランドに半田によって固着された二段構造の実装基板において、前記環状の電極ランドは環状の一部が開放した構成とする。   According to the present invention, as shown in the claims (Claim 1), the second substrate is supported by the metal pin on the first substrate having the mounting electrode on the outer bottom surface, and the tip of the metal pin has the first end. In the mounting substrate having a two-stage structure, which is inserted into a hole provided on the surface of the substrate and is fixed to the annular electrode land provided on the surface of the first substrate, which is the outer periphery of the hole, by solder, the annular electrode The land has a structure in which a part of the ring is opened.

このような構成であれば、電極ランドの一部を開放したので、この部分では半田が付着せず、穴との連通部を形成する。したがって、半田接合時や半田リフローによるセット基板への搭載時には、熱によって穴内の空気が膨張しても連通部から排出される。これにより、半田が破裂することなく、第１基板上に確実に接合できる。   In such a configuration, since a part of the electrode land is opened, solder does not adhere to this part, and a communication part with the hole is formed. Therefore, when the solder is joined or mounted on the set substrate by solder reflow, even if the air in the hole expands due to heat, it is discharged from the communicating portion. Thereby, it can join reliably on a 1st board | substrate, without a solder bursting.

（実施態様項）
本発明の請求項２では、請求項１において、前記第２基板は前記金属ピンの上端側に設けられて円板状に突出したストッパーに位置決めされる。これにより、第２基板を金属ピンに確実に位置決して水平に維持する。 (Embodiment section)
According to a second aspect of the present invention, in the first aspect, the second substrate is positioned on a stopper that is provided on the upper end side of the metal pin and protrudes in a disk shape. This ensures that the second substrate is never positioned horizontally on the metal pins.

同請求項３では、請求項１にける前記第２基板の下面には恒温槽に収容された水晶振動子が配設され、前記第２基板の上面には回路素子が配設される。これにより、水晶振動子の動作温度を一定とした恒温型発振器を提供できる。   According to the third aspect of the present invention, a crystal resonator housed in a thermostatic chamber is disposed on the lower surface of the second substrate according to the first aspect, and a circuit element is disposed on the upper surface of the second substrate. Thereby, it is possible to provide a constant temperature oscillator in which the operating temperature of the crystal unit is constant.

第１図は本発明の一実施形態を説明する二段構造の実装基板（恒温型発振器）の図で、同図（ａ）は第１基板の一部拡大平面図、同図（ｂ）は同図（ａ）のＡ−Ａ線で示す部分の金属ピンを立設した第１基板の一部拡大図、同図（ｃ）は電極ランドの開放部から見た側面図である。なお、前従来例と同一部分には同番号を付与してその説明は簡略又は省略する。   FIG. 1 is a view of a two-stage mounting board (constant temperature oscillator) for explaining an embodiment of the present invention. FIG. 1 (a) is a partially enlarged plan view of the first board, and FIG. FIG. 4A is a partially enlarged view of the first substrate in which the metal pins of the portion indicated by line AA in FIG. 1A are erected, and FIG. 3C is a side view as seen from the open portion of the electrode land. In addition, the same number is attached | subjected to the same part as a prior art example, and the description is simplified or abbreviate | omitted.

恒温型発振器は前述したように第２基板１ｂが金属ピン４によって第１基板１ａ上に支持された二段構造の実装基板によって構成される。ここでも、第１基板１ａは積層基板として積層面及び端面を経て外底面に実装端子２を有し、回路素子３を表面に配設される。そして、第２基板１ｂの下面側には水晶振動子１０を収納した恒温槽９及び加熱用のチップ抵３ａ及び温度検出用のサーミスタ３ｂが配設され、上面側には発振回路及び温度制御用の回路素子３が配設される。   As described above, the constant temperature oscillator is configured by a two-stage mounting substrate in which the second substrate 1b is supported on the first substrate 1a by the metal pins 4. Also here, the first substrate 1 a has a mounting terminal 2 on the outer bottom surface through a laminated surface and an end surface as a laminated substrate, and a circuit element 3 is disposed on the surface. A constant temperature bath 9, a heating chip resistor 3a, and a temperature detection thermistor 3b are disposed on the lower surface side of the second substrate 1b, and an oscillation circuit and a temperature control device are disposed on the upper surface side. Circuit element 3 is provided.

第１基板１ａの４角部には金属ピン４の下端側の先端が挿入される穴５が第１基板１ａの積層後に例えばドリルによって設けられる。ここでは、穴５の外周となる第１基板１ａの表面に形成された電極ランド６は、環状の一部が開放した切欠部１１を有する。例えば穴５の直径分が開放する。これらは、予め、第１基板１ａ上に形成された金属膜上から穴５を設けることによって形成される。   In the four corners of the first substrate 1a, holes 5 into which the tips on the lower end side of the metal pins 4 are inserted are provided by, for example, drilling after the first substrate 1a is stacked. Here, the electrode land 6 formed on the surface of the first substrate 1a serving as the outer periphery of the hole 5 has a notch 11 in which an annular part is opened. For example, the diameter of the hole 5 is opened. These are formed in advance by providing the holes 5 on the metal film formed on the first substrate 1a.

そして、金属ピン４の下端側の先端を穴５に挿入し、電極ランド６と半田７によって接合する。これらは、例えば第２基板１ｂの４角部に金属ピン４を半田付けして一体的にした後、各金属ピン４の先端を第１基板１ａの４角部の穴５に挿入して半田付けされる。   Then, the tip on the lower end side of the metal pin 4 is inserted into the hole 5 and joined with the electrode land 6 and the solder 7. For example, after the metal pins 4 are soldered and integrated with the four corners of the second substrate 1b, the tips of the respective metal pins 4 are inserted into the holes 5 at the four corners of the first substrate 1a and soldered. Attached.

このようなものでは、環状とした金属ランドの一部を開放するので、ガラスエポキシ材の素地が露出した無電極部が形成される。したがって、半田７の溶融時には、無電極部に対応（対面）した金属ピン４の根本部には半田７が塗布されず、穴５と空間的に接続した連通部を形成する。そして、半田７の溶融時に穴５内の空気が膨張しても、連通部が排気口となって空気を排出する。このことから、半田７が膨張した空気によって破裂することがないので、第１基板１ａに対する金属ピン４の接合を確実にする。   In such a case, a part of the annular metal land is opened, so that an electrodeless portion in which the base of the glass epoxy material is exposed is formed. Therefore, when the solder 7 is melted, the solder 7 is not applied to the root portion of the metal pin 4 corresponding to (facing to) the electrodeless portion, and a communication portion spatially connected to the hole 5 is formed. Even if the air in the hole 5 expands when the solder 7 is melted, the communication portion serves as an exhaust port to discharge the air. Therefore, the solder 7 is not ruptured by the expanded air, so that the joining of the metal pin 4 to the first substrate 1a is ensured.

（他の事項）
上記実施例では、第１及び第２基板１ｂはガラスエポキシ材としたが、セラミック等であっても同様に適用できる。また、水晶振動子１０は恒温槽９に収容した恒温型発振器として説明したが、恒温槽９に収容しない場合でも、同様に適用できる。また、第１基板１ａは積層基板としたが、単板でもよいことは勿論である。 (Other matters)
In the above embodiment, the first and second substrates 1b are made of a glass epoxy material. Further, although the quartz resonator 10 has been described as a constant temperature oscillator housed in the constant temperature bath 9, it can be similarly applied even when not stored in the constant temperature bath 9. Further, although the first substrate 1a is a laminated substrate, it is needless to say that it may be a single plate.

本発明の一実施形態を説明する二段構造の実装基板の図で、同図（ａ）は第１基板１ａの一部拡大平面図、同図（ｂ）は同図（ａ）のＡ−Ａ線で示す部分の金属ピン４を立設した第１基板１ａの一部拡大図、同図（ｃ）は電極ランド６の開放部から見た側面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a figure of the mounting substrate of the two-stage structure explaining one Embodiment of this invention, the figure (a) is a partial enlarged plan view of the 1st board | substrate 1a, the figure (b) is A- of the figure (a). A partially enlarged view of the first substrate 1 a erected with the metal pin 4 at the portion indicated by line A, FIG. 10C is a side view seen from the open portion of the electrode land 6. 従来例を説明する図で、同図（ａ）は恒温型発振器の断面図、同図（ｂ）は恒温槽９の配置断面図である。It is a figure explaining a prior art example, the figure (a) is a sectional view of a thermostatic oscillator, and the figure (b) is an arrangement sectional view of thermostatic tank 9. 従来例を説明する二段構造の実装基板の図で、同図（ａ）は第１基板１ａの一部拡大平面図、同図（ｂ）は金属ピン４を立設した第１基板１ａの一部拡大図、同図（ｃ）は同側面図である。FIG. 2A is a partially enlarged plan view of a first substrate 1a, and FIG. 2B is a diagram of a first substrate 1a in which metal pins 4 are erected. A partially enlarged view and FIG. 10C are side views.

符号の説明Explanation of symbols

１ａ 第１基板、１ｂ 第２基板、２ 実装端子、３ 回路素子、４ 金属ピン、５ 穴、６ 電極ランド、７ 半田、８ ストッパー、９ 恒温槽、１０ 水晶振動子、１１ 切欠部。   DESCRIPTION OF SYMBOLS 1a 1st board | substrate, 1b 2nd board | substrate, 2 mounting terminal, 3 circuit element, 4 metal pin, 5 hole, 6 electrode land, 7 solder, 8 stopper, 9 thermostat, 10 crystal oscillator, 11 notch.

Claims (3)

外底面に実装電極を有する第１基板上に金属ピンによって第２基板を支持し、前記金属ピンは先端が前記第１基板の表面に設けられた穴に挿入され、前記穴の外周となる前記第１基板の表面に設けられた環状の電極ランドに半田によって固着された二段構造の実装基板において、前記環状の電極ランドは環状の一部が開放したことを特徴とする二段構造の実装基板。   The second substrate is supported by a metal pin on the first substrate having a mounting electrode on the outer bottom surface, and the metal pin is inserted into a hole provided on the surface of the first substrate and becomes the outer periphery of the hole. A two-stage mounting board fixed by soldering to an annular electrode land provided on the surface of the first substrate, wherein the annular electrode land is partially open. substrate. 請求項１において、前記第２基板は前記金属ピンの上端側に設けられて円板状に突出したストッパーに位置決めされた二段構造の実装基板。   2. The mounting substrate having a two-stage structure according to claim 1, wherein the second substrate is positioned on a stopper that is provided on an upper end side of the metal pin and protrudes in a disk shape. 請求項１における前記第２基板の下面には恒温槽に収容された水晶振動子が配設され、前記第２基板の上面には回路素子が配設された水晶発振器。   2. The crystal oscillator according to claim 1, wherein a crystal resonator housed in a thermostatic chamber is disposed on the lower surface of the second substrate, and a circuit element is disposed on the upper surface of the second substrate.
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