JP2008110898A - Apparatus for cleaving, system for cleaving, and method for cleaving - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent edges of a cleaved plane from chipping by external force applied when in mechanically gauging or carrying a processing substrate. <P>SOLUTION: The apparatus for cleaving 10 comprises a substrate holder 50 holding the processing substrate 60, a laser heating part 30 regionally heating by irradiating the processing substrate 60 at a region in the vicinity of a line 65 scheduled to cleave with a laser beam LB2, and a cooling part 40 spraying a cooling agent C having fluidity on the processing substrate 60 held by the substrate holder 50 at a region heated with the laser beam LB2 in the vicinity of the line 65 scheduled to cleave. The cooling agent C spraying from the cooling part 40 contains a protective material 1 which protects the edges 60e of the cleaved plane 60t of the processing substrate 60 by sticking on the surface of the processing substrate 60 to remain. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cleaving device, a cleaving system, and a cleaving method for cleaving a substrate to be processed made of a brittle material, and more particularly to a cleaving device, a cleaving system, and a cleaving method for preventing an edge of a cleaved surface of a substrate to be processed from being lost. .

  As shown in FIG. 6, a cleaving apparatus 10 for cleaving a substrate to be processed 60 made of a brittle material such as glass includes a substrate holder 50 that holds the substrate to be processed 60, and a substrate to be processed that is held by the substrate holder 50. Among the laser preheating unit 20 that preheats the cutting line 65 of the substrate to be processed 60 by irradiating the region near the cutting line 65 of the laser beam LB1 and the substrate 60 to be processed held by the substrate holder 50 The laser heating unit 30 that irradiates the laser beam LB2 locally to the region near the planned cutting line 65 preheated by the laser beam LB1 from the laser preheating unit 20 and the workpiece to be processed held by the substrate holder 50 A cooling unit 40 that injects a fluid coolant C ′ is provided in a region near the planned cutting line 65 heated by the laser beam LB <b> 2 from the laser heating unit 30 in the substrate 60.

  The coolant C ′ sprayed from the cooling unit 40 includes water, mist (a mixture of water and gas), a gas such as nitrogen, a particulate solid such as carbon dioxide particles (dry ice), a liquid such as alcohol, Mist-like alcohol, snow-like dry ice, etc. are used.

  However, the edge of the cut section of the substrate to be processed 60 cut by the cleaving apparatus 10 is not protected at all and is exposed to the outside. For this reason, the edge may be chipped due to an external force applied when the workpiece substrate 60 is mechanically gauged or when the workpiece substrate 60 is carried.

  The present invention has been made in consideration of such points, and the edge of the fractured surface of the substrate to be processed by an external force applied when the substrate to be processed is mechanically gauged or when the substrate to be processed is carried. An object of the present invention is to provide a cleaving device, a cleaving system, and a cleaving method that prevent chipping.

  The present invention relates to a cleaving apparatus that heats and cools a substrate to be processed made of a brittle material locally along a planned cutting line and generates a crack in the substrate to be processed by a stress generated at that time. A substrate holder that holds the processed substrate, a laser heating unit that irradiates the region near the planned cutting line of the substrate to be processed held by the substrate holder and locally heats the substrate, and a substrate that is held by the substrate holder In the processed substrate, a cooling unit for injecting a fluid coolant is provided in a region in the vicinity of the planned cutting line heated by the laser beam from the laser heating unit. A cleaving apparatus comprising a protective material that protects an edge of a fractured surface of a substrate to be processed by adhering and remaining on the surface of the processed substrate.

  With such a configuration, it is possible to prevent the edge of the fractured surface of the workpiece substrate from being lost due to an external force applied when the workpiece substrate is mechanically gauged or when the workpiece substrate is carried.

  The present invention is a cleaving apparatus characterized in that the coolant contains water and the protective material is made of a water-soluble material that dissolves in the water.

  The present invention is a cleaving apparatus characterized in that the coolant contains an organic solvent, and the protective material is made of an oily material that dissolves in the organic solvent.

  The present invention is a cleaving apparatus characterized in that the coolant contains a solid fine powder.

  The present invention is the cleaving apparatus characterized in that the protective material has elasticity after adhering to the substrate to be processed and drying.

  With such a configuration, the external force applied when mechanically gauging the substrate to be processed or when carrying the substrate to be processed can be sufficiently absorbed, so that the edge of the cut section of the substrate to be processed is missing. It can prevent more reliably.

  The present invention is a cleaving apparatus characterized in that the protective material does not have adhesiveness after adhering to the substrate to be processed and drying.

  With such a configuration, it is possible to eliminate the possibility that the protective material attached to the substrate to be processed adheres to various places such as peripheral devices, and the substrate to be processed can be easily handled.

  According to the present invention, the cleaving apparatus is characterized in that the cooling unit injects a coolant onto the surface of the substrate to be processed so that the protective material adheres and remains on the edge of the substrate to be processed with a thickness of 0.1 μm to 1 mm. It is.

  With such a configuration, it is possible to more reliably prevent the edge of the fractured surface of the substrate to be chipped, and the protective material is too thickly attached to the substrate to be processed, making it difficult to handle the substrate to be processed. This can be prevented.

  The present invention is a cleaving system comprising the above cleaving apparatus and a removing apparatus that removes the protective material adhering to and remaining on the edge of the substrate to be processed from the substrate to be processed.

  With such a configuration, the protective material that remains and adheres to the substrate to be processed can be automatically removed from the substrate to be processed.

  The present invention is a cleaving system in which the removing device removes the protective material from the workpiece substrate by washing the protective material attached to the workpiece substrate with water or an organic solvent.

  The present invention is a cleaving system characterized in that the removing device removes the protective material from the workpiece substrate by bringing a mechanical, thermal or chemical external factor to the protective material attached to the workpiece substrate. is there.

  The present invention relates to a cleaving method in which a substrate to be processed made of a brittle material is heated and cooled locally along a planned cutting line, and the substrate to be processed is cracked by a stress generated at that time. A substrate holding step for holding the substrate to be processed by the holder, and a laser heating for locally heating the laser beam by irradiating a region near the planned cutting line of the substrate to be processed held by the substrate holder by the laser heating unit. And a cooling step of injecting a fluid coolant to a region near the planned cutting line heated by the laser beam from the laser heating portion of the substrate to be processed held by the substrate holder by the cooling unit; And a coolant sprayed from the cooling part contains a protective material that protects the edge of the cut section of the substrate to be processed by adhering to and remaining on the surface of the substrate to be processed. It is a cleaving method to.

  With such a configuration, it is possible to prevent the edge of the fractured surface of the workpiece substrate from being lost due to an external force applied when the workpiece substrate is mechanically gauged or when the workpiece substrate is carried.

  The present invention is a cleaving method characterized by further comprising a removing step of removing the protective material adhering to and remaining on the edge of the substrate to be processed from the substrate to be processed.

  According to the present invention, by using a coolant containing a protective material that protects the edge of the cut surface of the substrate to be processed by adhering to and remaining on the surface of the substrate to be processed, the substrate to be processed is mechanically It is possible to prevent the edge of the cut surface of the substrate to be chipped due to an external force applied when gauging or carrying the substrate to be processed.

Embodiment Hereinafter, an embodiment of the cleaving system of the present invention will be described with reference to the drawings. Here, FIG. 1 to FIG. 5 are diagrams showing an embodiment of the present invention.

  The cleaving system heats and cools the substrate 60 to be processed made of a brittle material such as glass locally along the planned cutting line 65, and generates a crack in the substrate to be processed 60 by the stress generated at that time. 1 and a removing device 70 for removing the protective material 1 (described later) adhering to the edge 60e of the substrate 60 to be processed from the substrate 60 (FIGS. 2 to 4). a) and (b)).

  As shown in FIG. 1, the cleaving apparatus 10 included in the cleaving system includes a laser in a substrate holder 50 that holds a substrate to be processed 60 and a region in the vicinity of the planned cutting line 65 of the substrate to be processed 60 held by the substrate holder 50. Of the laser preheating unit 20 that preheats the cutting line 65 of the substrate to be processed 60 by irradiation with the light LB1 and the substrate to be processed 60 held by the substrate holder 50, the laser beam LB1 from the laser preheating unit 20 The laser heating unit 30 that irradiates the laser beam LB2 to the preheated region near the planned cutting line 65 and locally heats the substrate 60 to be processed held by the substrate holder 50. A cooling unit 40 that injects a fluid coolant C is provided in the vicinity of the planned cutting line 65 heated by the laser beam LB2.

  In FIG. 1, the direction of the cleaving line 65 extending in the substrate 60 to be processed is the X direction, the in-plane direction of the substrate to be processed 60 and the direction orthogonal to the X direction is the Y direction, The normal direction of the processed substrate 60 (the direction orthogonal to the X direction and the Z direction) is taken as the Z direction.

  As shown in FIG. 1, the substrate holder 50 is provided on a moving stage 55 that moves relative to the laser preheating unit 20, the laser heating unit 30, and the cooling unit 40 in the XY plane.

  Next, the laser preheating part 20, the laser heating part 30, and the cooling part 40 mentioned above are demonstrated in detail.

  The laser preheating unit 20 shown in FIG. 1 is for locally heating the substrate 60 by irradiating the substrate 60 with the laser beam LB1. As shown in FIG. 1, the laser preheating unit 20 includes a laser oscillator 21 that emits about 200 W of CO 2 laser light, a reflection mirror 22 that reflects the laser light LB1 emitted by the laser oscillator 21, and a reflection mirror 22 that reflects the laser light. A polygon mirror 23 that scans the processed laser beam LB1 on the substrate 60 to be processed. The laser beam LB1 emitted from the laser oscillator 21 is reflected by the polygon mirror 23 via the reflection mirror 22 and repeatedly scanned along the planned cutting line 65 on the substrate 60 to be processed.

  Further, the laser heating unit 30 shown in FIG. 1 is for irradiating the laser beam LB2 on the substrate to be processed 60 to locally heat the substrate to be processed 60 and causing the substrate to be processed 60 to crack. is there. As shown in FIG. 1, the laser heating unit 30 includes a laser oscillator 31 that emits CO2 laser light of several tens of watts to hundreds of tens of watts, and a reflection mirror 32 that reflects the laser light LB2 emitted from the laser oscillator 31. And a polygon mirror 33 that scans the laser beam LB2 reflected by the reflection mirror 32 on the substrate 60 to be processed. The laser beam LB2 emitted from the laser oscillator 31 is reflected by the polygon mirror 33 through the reflection mirror 32 and repeatedly scanned along the planned cutting line 65 on the substrate 60 to be processed.

  Moreover, the cooling unit 40 shown in FIG. 1 is for cooling by spraying the coolant C on the planned cutting line 65 on the substrate 60 heated locally. Such a coolant C contains the protective material 1 that protects the edge 60e of the fractured surface 60t of the substrate 60 to be processed by adhering and remaining on the surface of the substrate 60 to be processed (FIG. 3A). ) (B) and FIGS. 4 (a) and 4 (b)). 3A, 3B, and 4A, 4B are front views of the protective member 1 attached to the edge 60e of the substrate 60, as viewed from the arrow A in FIG.

  When the coolant C contains water (including a mist), the protective material 1 is made of a water-soluble material that dissolves in the water. Further, when the coolant C contains an organic solvent such as alcohol (including a mist), the protective material 1 is made of an oily material that dissolves in the organic solvent.

  Moreover, when the coolant C contains solid fine powders, such as dry ice, the protective material 1 is mixed in the said solid fine powder.

  The protective material 1 preferably has elasticity after being attached to the substrate 60 and dried. By using such a protective material 1, it is possible to sufficiently absorb external force applied when the workpiece substrate 60 is mechanically gauged or when the workpiece substrate 60 is carried. This is because it is possible to more reliably prevent the 60t edge 60e from being chipped (see FIGS. 3A and 3B and FIGS. 4A and 4B).

  Moreover, it is preferable that the protective material 1 does not have adhesiveness after adhering to the substrate 60 to be processed and drying. This is because if the protective material 1 has adhesiveness, the protective material 1 may adhere to various places such as peripheral devices, and it becomes difficult to handle the substrate 60 to be processed.

  As the protective material 1 made of a water-soluble material, a water-soluble paint, a water-soluble adhesive, or the like can be used. More specifically, water-based paint, Bond (registered trademark), or the like can be used.

  Of the protective material 1 made of the water-soluble material described above, it is particularly preferable to use a vinyl acetate adhesive. The vinyl acetate-based adhesive dissolves easily in water, has moderate elasticity when dried, can be obtained at a low cost, and further, when removing the protective material 1 from the substrate 60 to be processed, as will be described later. This is because it can be easily removed by peeling from the processed substrate 60.

  Moreover, as the protective material 1 made of an oily material, an oily paint, an oily adhesive, or the like can be used.

  By the way, when the coolant C contains solid fine powder such as dry ice, the protective material 1 is mixed in the solid fine powder as described above. For this reason, as the protective material 1, any material can be used as long as it remains attached to the substrate 60 to be processed, such as a water-soluble paint, a water-soluble adhesive, an oil-based paint, and an oil-based adhesive.

  In FIG. 1, the cooling unit 40 injects the coolant C onto the surface of the substrate to be processed 60 so that the protective material 1 remains on the edge 60e of the substrate to be processed 60 with a thickness of 0.1 μm to 1 mm. 3 (a) and 3 (b) and FIGS. 4 (a) and 4 (b)).

  Further, as shown in FIG. 2, the removing device 70 included in the cleaving system is connected to a substrate holder 72 that holds the substrate 60 to be processed and a lower portion of the substrate holder 72, and moves to drive the substrate holder 72 in the horizontal direction. A stage 75 and a removal unit 71 that is disposed above the substrate holder 72 and removes the protective material 1 remaining on the edge 60e of the substrate 60 to be processed from the substrate 60 to be processed are provided.

  Here, when the protective material 1 attached to the substrate to be processed 60 is made of a water-soluble material, the protective material 1 is removed from the substrate to be processed 60 by washing the protective material 1 with water as the removing unit 71. Things can be used. Moreover, when the protective material 1 consists of an oily material, what removes the protective material 1 from the to-be-processed substrate 60 can be used as the removal part 71 by wash | cleaning the protective material 1 with an organic solvent.

  Further, as the removing unit 71, a physical force is applied to the protective material 1 attached to the processed substrate 60 (by causing a mechanical external cause) to remove the protective material 1 from the processed substrate 60, Applying or cooling heat (by causing a thermal external cause) to remove the protective material 1 from the substrate 60 to be processed, or applying a chemical or the like (by causing a chemical external cause) What removes the protective material 1 from the process board | substrate 60 can also be used.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, the substrate 60 is held by the substrate holder 50 (substrate holding step 81) (see FIGS. 1 and 5).

  Next, the substrate holder 50 is moved by the moving stage 55, and the laser preheating unit 20, the laser heating unit 30, and the cooling unit 40 are positioned on the planned cutting line 65 of the substrate to be processed 60 (see FIG. 1). The laser preheating unit 20, the laser heating unit 30, and the cooling unit 40 are positioned on the planned cutting line 65 of the substrate to be processed 60, and then arranged in a straight line at appropriate intervals along the planned cutting line 65. The alignment is adjusted in advance so that

  Next, the region on the planned cutting line 65 of the substrate to be processed 60 held by the substrate holder 50 is changed to a predetermined temperature (about 30 ° C. to 200 ° C.) by the linear laser beam LB 1 irradiated from the laser preheating unit 20. ) Is locally preheated (laser preheating step 83) (see FIGS. 1 and 5). At this time, the laser preheating unit 20 reflects the laser beam LB1 emitted from the laser oscillator 21 by the reflection mirror 22, then reflects by the polygon mirror 23, and repeats along the planned cutting line 65 on the substrate 60 to be processed. Scan.

  Next, the region on the cutting planned line 65 narrower than the region on the substrate 60 to be locally preheated by the laser preheating unit 20 is caused by the linear laser beam LB2 irradiated from the laser heating unit 30. Then, it is heated locally at a predetermined temperature (about 100 ° C. to 400 ° C.) (laser heating step 85) (see FIGS. 1 and 5). At this time, the laser heating unit 30 reflects the laser beam LB2 emitted from the laser oscillator 31 by the reflection mirror 32, then reflects by the polygon mirror 33, and repeats along the planned cutting line 65 on the substrate 60 to be processed. Scan. In this way, thermal stress is generated by heating in the region on the cutting line 65 of the substrate 60 to be processed.

  Thereafter, the coolant 60 is sprayed by the cooling unit 40 onto a circular region having a width wider than the region heated locally by the laser heating unit 30, thereby causing the substrate 60 to be processed locally. Is cooled (cooling step 87) (see FIGS. 1 and 5). By cooling in this manner, the surface of the substrate 60 to be processed contracts, and tensile stress is generated. For this reason, the induced stress can be enlarged, and the substrate 60 to be processed can be efficiently cleaved by the cleaved planned line 65.

  As described above, the coolant C sprayed from the cooling unit 40 contains the protective material 1 that remains attached to the surface of the substrate 60 to be processed. For this reason, the protective material 1 adheres and remains on the edge 60e of the fractured surface 60t of the substrate to be processed 60, and the edge 60e of the substrate to be processed 60 can be protected (FIGS. 3A, 3B, and 4). (See (a) and (b)). As a result, it is possible to prevent the edge 60e of the processed substrate 60 from being accidentally chipped when the processed substrate 60 is mechanically gauged or carried.

  Here, with reference to FIG. 3 (a) (b) and FIG. 4 (a) (b), the process in which the protective material 1 adheres to the edge 60e of the to-be-processed substrate 60 is demonstrated concretely. First, the coolant C sprayed from the cooling unit 40 to the workpiece substrate 60 penetrates into the crack CR formed by applying thermal stress to the workpiece substrate 60 by capillary action (FIG. 3A and FIG. 3). 4 (a)). Next, the water, organic solvent, solid fine powder, etc. of the coolant C sprayed on the surface of the substrate to be processed 60 evaporate, and only the protective material 1 remains on the edge 60e of the substrate 60 to be processed (FIG. 3). (See (a) and FIG. 4 (a)). Thereafter, the substrate to be processed 60 is separated by the crack CR, and at this time, the protective material 1 is also separated together with the substrate to be processed 60 (see FIGS. 3B and 4B).

  At this time, as shown in FIGS. 4A and 4B, the protective material 1 may be attached only to the edge 60e of the fractured surface 60t of the substrate 60 to be processed. As shown, it is more preferable to attach the protective material 1 to the entire fractured surface 60t of the substrate 60 to be processed. As shown in FIGS. 3A and 3B, the protective material 1 is attached to the entire fractured surface 60t of the substrate to be processed 60, thereby protecting not only the edge 60e of the fractured surface 60t but also the entire fractured surface 60t. It is because it can do.

  The coolant C is sprayed onto the surface of the substrate to be processed 60 by the cooling unit 40 so that the protective material 1 remains attached to the edge 60e of the substrate 60 to be processed with a thickness of 0.1 μm to 1 mm. By attaching the protective material 1 to the substrate to be processed 60 with such a thickness, it is possible to more reliably prevent the edge 60e of the split section 60t of the substrate to be processed 60 from being chipped. It can be prevented that the substrate to be processed 60 becomes difficult to handle due to being too thickly attached to the substrate to be processed 60.

  Next, the substrate 60 to be processed is held by the substrate holder 72 of the removing device 70 (substrate holding step 91) (see FIGS. 2 and 5).

  Next, the protective material 1 adhered and remaining on the edge 60e of the substrate 60 to be processed is removed from the substrate 60 by the removing unit 71 of the removing device 70 (removal step 93) (see FIGS. 2 and 5). ). At this time, the workpiece stage 60 held by the substrate holder 72 moves relative to the removal unit 71 by the movement stage 75 moving in the horizontal direction.

  Here, it is preferable that the protective material 1 is made of a vinyl acetate-based adhesive because the protective material 1 can be easily removed by peeling off the substrate 60 to be processed.

The side view which shows the cleaving apparatus of the cleaving system by this invention. The side view which shows the removal apparatus of the cleaving system by this invention. The front view which looked at a mode that the protection member adhered to the edge of the to-be-processed substrate by the cleaving apparatus of the cleaving system by this invention from the arrow A of FIG. The front view which looked at another mode that the protection member adhered to the edge of the to-be-processed board | substrate with the cleaving apparatus of the cleaving system by this invention seen from the arrow A of FIG. The flowchart which shows the cleaving method by this invention. The side view which shows the conventional cleaving apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Protective material 10 Cleaving apparatus 20 Laser preheating part 30 Laser heating part 40 Cooling part 55 Moving stage 60 Substrate 60e Edge 60t Split section 65 Scheduled cutting line 75 Moving stage 50 Substrate holder 72 Substrate holder 70 Removing apparatus 71 Removing part 81 Substrate Holding process 83 Laser preheating process 85 Laser heating process 87 Cooling process 91 Substrate holding process 93 Removal process C Coolant CR Cracks LB1, LB2 Laser light

Claims (12)

In a cleaving apparatus that heats and cools a substrate to be processed made of a brittle material locally along a cleaving line, and generates a crack in the substrate to be cleaved by stress generated at that time,
A substrate holder for holding the substrate to be processed;
A laser heating unit that irradiates a laser beam to a region near the planned cutting line of the substrate to be processed held by the substrate holder and locally heats the substrate;
Of the substrate to be processed held by the substrate holder, a cooling unit that injects a fluid coolant in a region near the planned cutting line heated by the laser beam from the laser heating unit,
The coolant sprayed from a cooling part contains the protective material which protects the edge of the cut surface of a to-be-processed substrate by adhering to the surface of a to-be-processed substrate, and remaining, The cutting apparatus characterized by the above-mentioned. The coolant contains water,
The cleaving apparatus according to claim 1, wherein the protective material is made of a water-soluble material that dissolves in the water. The coolant contains an organic solvent,
The cleaving apparatus according to claim 1, wherein the protective material is made of an oily material that dissolves in the organic solvent.   The cleaving apparatus according to claim 1, wherein the coolant contains a solid fine powder.   The cleaving apparatus according to claim 1, wherein the protective material has elasticity after adhering to the substrate to be processed and drying.   The cleaving apparatus according to claim 1, wherein the protective material does not have adhesiveness after adhering to the substrate to be processed and drying.   2. The cleaving according to claim 1, wherein the cooling unit sprays a coolant onto the surface of the substrate to be processed so that the protective material remains attached to the edge of the substrate to be processed with a thickness of 0.1 μm to 1 mm. apparatus. A cleaving device according to claim 1;
A cleaving system comprising: a removing device that removes a protective material adhered to an edge of a substrate to be processed from the substrate to be processed.   9. The cleaving system according to claim 8, wherein the removing device removes the protective material from the substrate to be processed by washing the protective material attached to the substrate to be processed with water or an organic solvent.   9. The cleaving system according to claim 8, wherein the removing device removes the protective material from the workpiece substrate by bringing a mechanical, thermal or chemical external factor to the protective material attached to the workpiece substrate. . In a cleaving method in which a substrate to be processed made of a brittle material is heated and cooled locally along a planned cutting line, and the substrate to be processed is cracked by a stress generated at that time.
A substrate holding step for holding the substrate to be processed by the substrate holder;
A laser heating step of locally heating the laser beam by irradiating a laser beam onto a region near the planned cutting line of the substrate to be processed held by the substrate holder;
A cooling step of injecting a fluid coolant to a region in the vicinity of the planned cutting line heated by the laser beam from the laser heating unit of the substrate to be processed held by the cooling unit by the cooling unit;
A cleaving method characterized in that the coolant sprayed from the cooling unit contains a protective material that protects the edge of the fractured surface of the substrate to be processed by remaining attached to the surface of the substrate to be processed.   12. The cleaving method according to claim 11, further comprising a removing step of removing the protective material adhering to the edge of the substrate to be processed from the substrate to be processed.

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