JP2008110400A5 - Laser processing method and laser processing apparatus - Google Patents
Laser processing method and laser processing apparatus Download PDFInfo
- Publication number
- JP2008110400A5 JP2008110400A5 JP2007251924A JP2007251924A JP2008110400A5 JP 2008110400 A5 JP2008110400 A5 JP 2008110400A5 JP 2007251924 A JP2007251924 A JP 2007251924A JP 2007251924 A JP2007251924 A JP 2007251924A JP 2008110400 A5 JP2008110400 A5 JP 2008110400A5
- Authority
- JP
- Japan
- Prior art keywords
- processing
- condensing lens
- laser light
- laser
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title claims description 10
- 230000001678 irradiating Effects 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims 32
- 201000009310 astigmatism Diseases 0.000 claims 3
- 238000003754 machining Methods 0.000 claims 2
- 238000010128 melt processing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
本発明は、板状の加工対象物を切断予定ラインに沿って切断するためのレーザ加工方法及びレーザ加工装置に関する。 The present invention relates to a laser processing method and a laser processing apparatus for cutting a plate-like processing object along a scheduled cutting line.
そこで、本発明は、このような事情に鑑みてなされたものであり、環状のフレームに張られた拡張可能シートに貼り付けられた板状の加工対象物の内部に改質領域を形成するに際し、フレームに加工用レーザ光を照射してフレームに損傷を与えるのを防止することができるレーザ加工方法及びレーザ加工装置を提供することを目的とする。 Therefore, the present invention has been made in view of such circumstances, and in forming a modified region inside a plate-like workpiece attached to an expandable sheet stretched on an annular frame. An object of the present invention is to provide a laser processing method and a laser processing apparatus capable of preventing damage to the frame by irradiating the processing laser beam on the frame.
Claims (17)
前記加工対象物と前記フレームとの間に外形を有する加工領域を設定する工程と、
前記切断予定ラインを含むライン上に沿って前記集光用レンズ及び前記加工対象物の少なくとも一方を相対的に移動させ、前記集光用レンズが前記加工領域上に位置している際に、測定用レーザ光を前記集光用レンズで前記加工領域に向けて集光して、前記加工対象物のレーザ光照射面で反射された前記測定用レーザ光の反射光を検出することにより、前記加工用レーザ光の集光点が前記レーザ光照射面を基準として所定の位置に合うように、前記レーザ光照射面と前記集光用レンズとの距離を調整しながら、前記加工用レーザ光を前記集光用レンズで前記加工対象物に向けて集光して、前記改質領域を前記加工対象物の内部に形成する工程と、を含むことを特徴とするレーザ加工方法。 By irradiating a processing laser beam with a condensing point aligned with a condensing lens inside a plate-like processing object attached to an expandable sheet stretched on an annular frame, the processing object A laser processing method for forming a modified region that is a starting point of cutting along the planned cutting line inside the workpiece,
Setting a processing region having an outer shape between the processing object and the frame;
Measurement is performed when at least one of the condensing lens and the object to be processed is relatively moved along a line including the planned cutting line, and the condensing lens is positioned on the processing region. The processing laser beam is condensed toward the processing region by the condensing lens and the reflected light of the measurement laser beam reflected by the laser light irradiation surface of the processing object is detected, thereby the processing Adjusting the distance between the laser light irradiation surface and the condensing lens so that the condensing point of the laser light is aligned with a predetermined position with respect to the laser light irradiation surface. And a step of condensing light toward the object to be processed by a condensing lens, and forming the modified region inside the object to be processed.
前記加工対象物と前記フレームとの間に外形を有する加工領域を設定する工程と、
前記切断予定ラインを含むライン上に沿って前記集光用レンズ及び前記加工対象物の少なくとも一方を相対的に移動させ、前記集光用レンズが前記加工領域上に位置している際に、測定用レーザ光を前記集光用レンズで前記加工領域に向けて集光して、前記加工対象物のレーザ光照射面で反射された前記測定用レーザ光の反射光を検出することにより、前記加工用レーザ光の集光点が前記レーザ光照射面を基準として所定の位置に合うように、前記レーザ光照射面と前記集光用レンズとの距離を調整し、その調整に関する調整情報を取得する工程と、
前記切断予定ラインを含むライン上に沿って前記集光用レンズ及び前記加工対象物の少なくとも一方を相対的に移動させ、前記集光用レンズが前記加工領域上に位置している際に、前記調整情報に基づいて、前記レーザ光照射面と前記集光用レンズとの距離を調整しながら、前記加工用レーザ光を前記集光用レンズで前記加工対象物に向けて集光して、前記改質領域を前記加工対象物の内部に形成する工程と、を含むことを特徴とするレーザ加工方法。 By irradiating a processing laser beam with a condensing point aligned with a condensing lens inside a plate-like processing object attached to an expandable sheet stretched on an annular frame, the processing object A laser processing method for forming a modified region that is a starting point of cutting along the planned cutting line inside the workpiece,
Setting a processing region having an outer shape between the processing object and the frame;
Measurement is performed when at least one of the condensing lens and the object to be processed is relatively moved along a line including the planned cutting line, and the condensing lens is positioned on the processing region. The processing laser beam is condensed toward the processing region by the condensing lens and the reflected light of the measurement laser beam reflected by the laser light irradiation surface of the processing object is detected, thereby the processing The distance between the laser light irradiation surface and the condensing lens is adjusted so that the condensing point of the laser light is aligned with a predetermined position with reference to the laser light irradiation surface, and adjustment information relating to the adjustment is acquired. Process,
When at least one of the condensing lens and the object to be processed is relatively moved along a line including the planned cutting line, and when the condensing lens is positioned on the processing region, Based on the adjustment information, while adjusting the distance between the laser light irradiation surface and the condensing lens, the processing laser light is condensed toward the processing object by the condensing lens, Forming a modified region inside the object to be processed.
一方の側から前記ラインと前記加工領域の外形との一方の交点上に前記集光用レンズが達するまで、前記レーザ光照射面と前記集光用レンズとの距離を調整するための前記測定用レーザ光の反射光の光量に基づく演算処理を停止し、前記加工対象物の厚さ方向において一定の位置に前記集光用レンズを固定し、且つ前記加工用レーザ光の照射を停止し、
前記ラインと前記加工領域の外形との一方の交点上から前記ラインと前記加工対象物の外縁との一方の交点上に前記集光用レンズが達するまで、前記測定用レーザ光の反射光の光量に基づく演算処理を実施し、前記加工対象物の厚さ方向において一定の位置に前記集光用レンズを固定し、且つ前記加工用レーザ光の照射を停止し、
前記ラインと前記加工対象物の外縁との一方の交点上から前記ラインと前記加工対象物の外縁との他方の交点上に前記集光用レンズが達するまで、前記測定用レーザ光の反射光の光量に基づく演算処理を実施し、前記レーザ光照射面と前記集光用レンズとの距離を調整し、且つ前記加工用レーザ光の照射を実施することを特徴とする請求項１〜６のいずれか一項記載のレーザ加工方法。 Relatively moving at least one of the condenser lens and the object to be processed along the line crossing the frame;
The measurement for adjusting the distance between the laser light irradiation surface and the condensing lens until the condensing lens reaches one intersection of the line and the outer shape of the processing region from one side Stop arithmetic processing based on the amount of reflected light of the laser light, fix the condensing lens at a fixed position in the thickness direction of the workpiece, and stop the irradiation of the processing laser light,
The amount of reflected light of the laser beam for measurement from one intersection point of the line and the outer shape of the processing area until the condensing lens reaches one intersection point of the line and the outer edge of the workpiece The calculation processing based on is performed, the condenser lens is fixed at a fixed position in the thickness direction of the workpiece, and the irradiation of the processing laser beam is stopped,
Until the condensing lens reaches the intersection of the line and the outer edge of the object to be processed from one intersection of the line and the outer edge of the object to be processed, The calculation processing based on the light quantity is performed, the distance between the laser light irradiation surface and the condensing lens is adjusted, and the processing laser light irradiation is performed. A laser processing method according to claim 1.
環状のフレームに張られた拡張可能シートに貼り付けられた前記加工対象物が載置される載置台と、
前記加工用レーザ光を出射する加工用レーザ光源、及び測定用レーザ光を出射する測定用レーザ光源を有するレーザユニットと、
前記加工用レーザ光及び前記測定用レーザ光を集光する集光用レンズと、を備え、
前記加工対象物と前記フレームとの間に外形を有する加工領域を設定し、
前記切断予定ラインを含むラインと前記加工領域の前記外形との一方の交点及び他方の交点の座標を取得し、
前記ライン上に沿って前記集光用レンズ及び前記加工対象物の少なくとも一方を相対的に移動させ、前記一方の交点上に前記集光用レンズが達してから前記他方の交点上に前記集光用レンズが達するまでの間において、前記集光用レンズが前記加工領域上に位置している際に、前記測定用レーザ光を前記集光用レンズで前記加工領域に向けて集光して、前記加工対象物のレーザ光照射面で反射された前記測定用レーザ光の反射光を検出することにより、前記加工用レーザ光の集光点が前記レーザ光照射面を基準として所定の位置に合うように、前記レーザ光照射面と前記集光用レンズとの距離を調整しながら、前記加工用レーザ光を前記集光用レンズで前記加工対象物に向けて集光して、前記改質領域を前記加工対象物の内部に形成することを特徴とするレーザ加工装置。 By aligning a condensing point inside the plate-like object to be processed and irradiating a processing laser beam, a modified region that becomes a starting point of cutting along the scheduled cutting line of the object to be processed is defined as the object to be processed. A laser processing apparatus to be formed inside,
A mounting table on which the processing object pasted on an expandable sheet stretched on an annular frame is mounted;
A processing laser light source for emitting the processing laser light, and a laser unit having a measurement laser light source for emitting the measurement laser light;
A condensing lens for condensing the processing laser light and the measurement laser light,
Set a machining area having an outer shape between the workpiece and the frame;
Acquire the coordinates of one intersection and the other intersection of the line including the planned cutting line and the outer shape of the processing region,
The at least one of the condensing lens and the object to be processed is relatively moved along the line, and after the condensing lens reaches the one intersection, the condensing is performed on the other intersection. Until the lens for reaching, when the condensing lens is located on the processing region, the measurement laser light is condensed toward the processing region by the condensing lens, By detecting the reflected light of the measurement laser light reflected by the laser light irradiation surface of the workpiece, the focusing point of the processing laser light is aligned with a predetermined position with respect to the laser light irradiation surface. As described above, while adjusting the distance between the laser light irradiation surface and the condensing lens, the processing laser light is condensed toward the object to be processed by the condensing lens, and the modified region Is formed inside the workpiece. The laser processing apparatus according to claim.
一方の側から前記ラインと前記加工領域の外形との一方の交点上に前記集光用レンズが達するまで、前記レーザ光照射面と前記集光用レンズとの距離を調整するための前記測定用レーザ光の反射光の光量に基づく演算処理を停止し、前記加工対象物の厚さ方向において一定の位置に前記集光用レンズを固定し、且つ前記加工用レーザ光の照射を停止し、
前記ラインと前記加工領域の外形との一方の交点上から前記ラインと前記加工対象物の外縁との一方の交点上に前記集光用レンズが達するまで、前記測定用レーザ光の反射光の光量に基づく演算処理を実施し、前記加工対象物の厚さ方向において一定の位置に前記集光用レンズを固定し、且つ前記加工用レーザ光の照射を停止し、
前記ラインと前記加工対象物の外縁との一方の交点上に前記集光用レンズが達してから前記ラインと前記加工対象物の外縁との他方の交点上に前記集光用レンズが達するまでの間において、前記測定用レーザ光の反射光の光量に基づく演算処理を実施し、前記レーザ光照射面と前記集光用レンズとの距離を調整し、且つ前記加工用レーザ光の照射を実施することを特徴とする請求項８〜１０のいずれか一項記載のレーザ加工装置。 Relatively moving at least one of the condenser lens and the object to be processed along the line crossing the frame;
The measurement for adjusting the distance between the laser light irradiation surface and the condensing lens until the condensing lens reaches one intersection of the line and the outer shape of the processing region from one side Stop arithmetic processing based on the amount of reflected light of the laser light, fix the condensing lens at a fixed position in the thickness direction of the workpiece, and stop the irradiation of the processing laser light,
The amount of reflected light of the laser beam for measurement from one intersection point of the line and the outer shape of the processing area until the condensing lens reaches one intersection point of the line and the outer edge of the workpiece The calculation processing based on is performed, the condenser lens is fixed at a fixed position in the thickness direction of the workpiece, and the irradiation of the processing laser beam is stopped,
From when the condensing lens reaches one intersection of the line and the outer edge of the object to be processed, until the condensing lens reaches the other intersection of the line and the outer edge of the object to be processed In the meantime, arithmetic processing based on the amount of reflected light of the measurement laser light is performed, the distance between the laser light irradiation surface and the condenser lens is adjusted, and the processing laser light is irradiated. The laser processing apparatus according to any one of claims 8 to 10, wherein:
環状のフレームに張られた拡張可能シートに貼り付けられた前記加工対象物が載置される載置台と、
前記加工用レーザ光を出射する加工用レーザ光源、及び測定用レーザ光を出射する測定用レーザ光源を有するレーザユニットと、
前記加工用レーザ光及び前記測定用レーザ光を集光する集光用レンズと、を備え、
前記加工対象物と前記フレームとの間に外形を有する加工領域を設定し、
前記切断予定ラインを含むラインと前記加工領域の前記外形との一方の交点及び他方の交点の座標を取得し、
前記ライン上に沿って前記集光用レンズ及び前記加工対象物の少なくとも一方を相対的に移動させ、前記一方の交点上に前記集光用レンズが達してから前記他方の交点上に前記集光用レンズが達するまでの間において、前記集光用レンズが前記加工領域上に位置している際に、前記測定用レーザ光を前記集光用レンズで前記加工領域に向けて集光して、前記加工対象物のレーザ光照射面で反射された前記測定用レーザ光の反射光を検出することにより、前記加工用レーザ光の集光点が前記レーザ光照射面を基準として所定の位置に合うように、前記レーザ光照射面と前記集光用レンズとの距離を調整し、その調整に関する調整情報を取得し、
前記ライン上に沿って前記集光用レンズ及び前記加工対象物の少なくとも一方を相対的に移動させ、前記集光用レンズが前記加工領域上に位置している際に、前記調整情報に基づいて、前記レーザ光照射面と前記集光用レンズとの距離を調整しながら、前記加工用レーザ光を前記集光用レンズで前記加工対象物に向けて集光して、前記改質領域を前記加工対象物の内部に形成することを特徴とするレーザ加工装置。 By aligning a condensing point inside the plate-like object to be processed and irradiating a processing laser beam, a modified region that becomes a starting point of cutting along the scheduled cutting line of the object to be processed is defined as the object to be processed. A laser processing apparatus to be formed inside,
A mounting table on which the processing object pasted on an expandable sheet stretched on an annular frame is mounted;
A processing laser light source for emitting the processing laser light, and a laser unit having a measurement laser light source for emitting the measurement laser light;
A condensing lens for condensing the processing laser light and the measurement laser light,
Set a machining area having an outer shape between the workpiece and the frame;
Acquire the coordinates of one intersection and the other intersection of the line including the planned cutting line and the outer shape of the processing region,
The at least one of the condensing lens and the object to be processed is relatively moved along the line, and after the condensing lens reaches the one intersection, the condensing is performed on the other intersection. Until the lens for reaching, when the condensing lens is located on the processing region, the measurement laser light is condensed toward the processing region by the condensing lens, By detecting the reflected light of the measurement laser light reflected by the laser light irradiation surface of the workpiece, the focusing point of the processing laser light is aligned with a predetermined position with respect to the laser light irradiation surface. So as to adjust the distance between the laser light irradiation surface and the condensing lens, and obtain adjustment information related to the adjustment,
When at least one of the condensing lens and the object to be processed is relatively moved along the line, and the condensing lens is positioned on the processing region, based on the adjustment information And adjusting the distance between the laser light irradiation surface and the condensing lens while condensing the processing laser light toward the object to be processed by the condensing lens, A laser processing apparatus, wherein the laser processing apparatus is formed inside a workpiece.
一方の側から前記ラインと前記加工領域の外形との一方の交点上に前記集光用レンズが達するまで、前記レーザ光照射面と前記集光用レンズとの距離を調整するための前記測定用レーザ光の反射光の光量に基づく演算処理を停止し、前記加工対象物の厚さ方向において一定の位置に前記集光用レンズを固定し、且つ前記加工用レーザ光の照射を停止し、
前記ラインと前記加工領域の外形との一方の交点上から前記ラインと前記加工対象物の外縁との一方の交点上に前記集光用レンズが達するまで、前記測定用レーザ光の反射光の光量に基づく演算処理を実施し、前記加工対象物の厚さ方向において一定の位置に前記集光用レンズを固定し、且つ前記加工用レーザ光の照射を停止し、
前記ラインと前記加工対象物の外縁との一方の交点上に前記集光用レンズが達してから前記ラインと前記加工対象物の外縁との他方の交点上に前記集光用レンズが達するまでの間において、前記測定用レーザ光の反射光の光量に基づく演算処理を実施し、前記レーザ光照射面と前記集光用レンズとの距離を調整し、且つ前記加工用レーザ光の照射を実施することを特徴とする請求項１３〜１５のいずれか一項記載のレーザ加工装置。 Relatively moving at least one of the condenser lens and the object to be processed along the line crossing the frame;
The measurement for adjusting the distance between the laser light irradiation surface and the condensing lens until the condensing lens reaches one intersection of the line and the outer shape of the processing region from one side Stop arithmetic processing based on the amount of reflected light of the laser light, fix the condensing lens at a fixed position in the thickness direction of the workpiece, and stop the irradiation of the processing laser light,
The amount of reflected light of the laser beam for measurement from one intersection point of the line and the outer shape of the processing area until the condensing lens reaches one intersection point of the line and the outer edge of the workpiece The calculation processing based on is performed, the condenser lens is fixed at a fixed position in the thickness direction of the workpiece, and the irradiation of the processing laser beam is stopped,
From when the condensing lens reaches one intersection of the line and the outer edge of the object to be processed, until the condensing lens reaches the other intersection of the line and the outer edge of the object to be processed In the meantime, arithmetic processing based on the amount of reflected light of the measurement laser light is performed, the distance between the laser light irradiation surface and the condenser lens is adjusted, and the processing laser light is irradiated. The laser processing apparatus according to any one of claims 13 to 15, wherein
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007251924A JP5117806B2 (en) | 2006-10-04 | 2007-09-27 | Laser processing method and laser processing apparatus |
| PCT/JP2008/066747 WO2009041329A1 (en) | 2007-09-27 | 2008-09-17 | Laser processing method |
| TW097136878A TW200932410A (en) | 2007-09-27 | 2008-09-25 | Laser processing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006273296 | 2006-10-04 | ||
| JP2006273296 | 2006-10-04 | ||
| JP2007251924A JP5117806B2 (en) | 2006-10-04 | 2007-09-27 | Laser processing method and laser processing apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008110400A JP2008110400A (en) | 2008-05-15 |
| JP2008110400A5 true JP2008110400A5 (en) | 2012-02-02 |
| JP5117806B2 JP5117806B2 (en) | 2013-01-16 |
Family
ID=39443220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007251924A Active JP5117806B2 (en) | 2006-10-04 | 2007-09-27 | Laser processing method and laser processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5117806B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010082663A (en) * | 2008-09-30 | 2010-04-15 | Sunx Ltd | Laser beam machine |
| JP5263261B2 (en) * | 2010-10-29 | 2013-08-14 | 株式会社デンソー | Manufacturing method of semiconductor device |
| JP5839383B2 (en) * | 2011-03-18 | 2016-01-06 | 株式会社ディスコ | Wafer processing method |
| US11024501B2 (en) | 2018-12-29 | 2021-06-01 | Cree, Inc. | Carrier-assisted method for parting crystalline material along laser damage region |
| US10562130B1 (en) | 2018-12-29 | 2020-02-18 | Cree, Inc. | Laser-assisted method for parting crystalline material |
| US10576585B1 (en) | 2018-12-29 | 2020-03-03 | Cree, Inc. | Laser-assisted method for parting crystalline material |
| US10611052B1 (en) | 2019-05-17 | 2020-04-07 | Cree, Inc. | Silicon carbide wafers with relaxed positive bow and related methods |
| JP7270216B2 (en) | 2019-08-23 | 2023-05-10 | パナソニックＩｐマネジメント株式会社 | LASER PROCESSING DEVICE, LASER PROCESSING METHOD, AND CORRECTION DATA GENERATION METHOD |
| US11969823B2 (en) | 2020-04-16 | 2024-04-30 | Panasonic Intellectual Property Management Co., Ltd. | Laser processing apparatus and laser processing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4440036B2 (en) * | 2004-08-11 | 2010-03-24 | 株式会社ディスコ | Laser processing method |
| JP4630731B2 (en) * | 2005-05-30 | 2011-02-09 | 株式会社ディスコ | Wafer division method |
| JP4424302B2 (en) * | 2005-11-16 | 2010-03-03 | 株式会社デンソー | Manufacturing method of semiconductor chip |
| JP4804911B2 (en) * | 2005-12-22 | 2011-11-02 | 浜松ホトニクス株式会社 | Laser processing equipment |
-
2007
- 2007-09-27 JP JP2007251924A patent/JP5117806B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008110400A5 (en) | Laser processing method and laser processing apparatus | |
| TWI658664B (en) | Laser processing device | |
| KR102178210B1 (en) | Method for detecting spot shape of laser beam | |
| US10207362B2 (en) | Laser processing apparatus | |
| JP2006114627A5 (en) | ||
| JP2008087053A5 (en) | ||
| TWI637143B (en) | Bump detection device | |
| MY146877A (en) | Laser processing method and laser processing apparatus | |
| JP6071775B2 (en) | Wafer processing method | |
| TW201738950A (en) | Wafer processing method | |
| JP2010048715A (en) | Height position detector and height position detection method | |
| JP6382568B2 (en) | Laser processing equipment | |
| JP2006218482A5 (en) | ||
| JP7325897B2 (en) | Machining device and machining method of workpiece | |
| US9981343B2 (en) | Laser processing apparatus | |
| TW201110221A (en) | Wafer processing method | |
| TW201707824A (en) | Laser processing apparatus capable of inhibiting ablation to the lowest lime and solving the problem that a region of a workpiece cannot be normally divided in a laser processing method of forming a modification layer inside the workpiece | |
| CN102478699B (en) | Automatic focusing device and method thereof | |
| JP5441629B2 (en) | Wafer processing method | |
| JP2012121031A (en) | Laser beam machining device | |
| JP5329199B2 (en) | Laser processing apparatus, laser processing control method, and laser processing program | |
| KR101540174B1 (en) | Method of performing beam characterization in a laser scribing apparatus, and laser scribing apparatus capable of performing such a method | |
| TW201618876A (en) | Detection method of penetrating laser beam | |
| JP5656690B2 (en) | Laser processing equipment | |
| JP2003001457A5 (en) | Laser processing equipment |