JP2008106169A5 - - Google Patents

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Publication number
JP2008106169A5
JP2008106169A5 JP2006291150A JP2006291150A JP2008106169A5 JP 2008106169 A5 JP2008106169 A5 JP 2008106169A5 JP 2006291150 A JP2006291150 A JP 2006291150A JP 2006291150 A JP2006291150 A JP 2006291150A JP 2008106169 A5 JP2008106169 A5 JP 2008106169A5
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JP
Japan
Prior art keywords
ethylenically unsaturated
monomer
unsaturated group
meth
acrylate
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Pending
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JP2006291150A
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Japanese (ja)
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JP2008106169A (en
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Priority to JP2006291150A priority Critical patent/JP2008106169A/en
Priority claimed from JP2006291150A external-priority patent/JP2008106169A/en
Publication of JP2008106169A publication Critical patent/JP2008106169A/en
Publication of JP2008106169A5 publication Critical patent/JP2008106169A5/ja
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Description

本発明者は、樹脂組成物中の炭素と水素との結合の解離エネルギーと理論活性水素量に着目し、特定の数値以下の炭素と水素との結合の解離エネルギーを有する理論活性水素の量が特定の数値範囲内にあれば、TVOCの放散量が少なくなるという知見を得るに及んで、本発明を完成させるに至った。
すなわち本発明は、エチレン性不飽和基を含有する樹脂(1)及び一分子中にエチレン性不飽和基を1個有する単量体(2)を含んでなる硬化性樹脂組成物において、前記エチレン性不飽和基を含有する樹脂(1)が、ポリエステル(メタ)アクリレートであり前記一分子中にエチレン性不飽和基を1個有する単量体(2)が、フェノキシエチル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、及び2−ヒドロキシエチル(メタ)アクリレートからなる群から選ばれる少なくとも1種であり、前記エチレン性不飽和基を含有する樹脂(1)及び/又は前記一分子中にエチレン性不飽和基を1個有する単量体中に炭素と水素との結合解離エネルギーが密度汎関数法に基づいて算出される値で80kcal/mol以下の結合からなる活性水素を有し、前記活性水素の量が前記樹脂(1)と前記単量体(2)との合計1Kg中0.1〜20molであることを特徴とする硬化性樹脂組成物に関する。


The inventor pays attention to the dissociation energy of the bond between carbon and hydrogen and the theoretically active hydrogen amount in the resin composition, and the amount of theoretically active hydrogen having the dissociation energy of the bond between carbon and hydrogen below a specific numerical value. As long as it is within a specific numerical range, the present inventors have completed the present invention in order to obtain the knowledge that the amount of TVOC emission is reduced.
That is, the present invention provides a ethylenically unsaturated group-containing resin-1 and curing resin composition comprising the monomer (2) having one ethylenically unsaturated group per molecule, the ethylene The resin (1) containing an ethylenically unsaturated group is a polyester (meth) acrylate, and the monomer (2) having one ethylenically unsaturated group in one molecule is a phenoxyethyl (meth) acrylate, Resin (1) and / or said one molecule which is at least one selected from the group consisting of dicyclopentenyloxyethyl (meth) acrylate and 2-hydroxyethyl (meth) acrylate, and contains said ethylenically unsaturated group 80 kcal / m as a value calculated based on the density functional theory of bond dissociation energy of carbon and hydrogen in a monomer having one ethylenically unsaturated group Curability characterized by having active hydrogen consisting of bonds of 1 or less, and the amount of the active hydrogen being 0.1-20 mol in a total of 1 kg of the resin (1) and the monomer (2) The present invention relates to a resin composition.


Claims (2)

エチレン性不飽和基を含有する樹脂(1)及び一分子中にエチレン性不飽和基を1個有する単量体(2)を含んでなる硬化性樹脂組成物において、前記エチレン性不飽和基を含有する樹脂(1)が、ポリエステル(メタ)アクリレートであり前記一分子中にエチレン性不飽和基を1個有する単量体(2)が、フェノキシエチル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、及び2−ヒドロキシエチル(メタ)アクリレートからなる群から選ばれる少なくとも1種であり、前記エチレン性不飽和基を含有する樹脂(1)及び/又は前記一分子中にエチレン性不飽和基を1個有する単量体中に炭素と水素との結合解離エネルギーが密度汎関数法に基づいて算出される値で80kcal/mol以下の結合からなる活性水素を有し、前記活性水素の量が前記樹脂(1)と前記単量体(2)との合計1Kg中0.1〜20molであることを特徴とする硬化性樹脂組成物。 A curable resin composition comprising a resin (1) containing an ethylenically unsaturated group and a monomer (2) having one ethylenically unsaturated group in one molecule, wherein the ethylenically unsaturated group is The resin (1) contained is polyester (meth) acrylate, and the monomer (2) having one ethylenically unsaturated group in one molecule is phenoxyethyl (meth) acrylate or dicyclopentenyloxyethyl. It is at least one selected from the group consisting of (meth) acrylate and 2-hydroxyethyl (meth) acrylate, and contains the ethylenically unsaturated resin (1) containing the ethylenically unsaturated group and / or one molecule. In a monomer having one saturated group, the bond dissociation energy between carbon and hydrogen is a value calculated based on the density functional method, and from a bond of 80 kcal / mol or less. That has active hydrogen, the curable resin composition, wherein the amount of the active hydrogen is the sum 1Kg in 0.1~20mol of the resin (1) wherein the monomer (2). 前記活性水素の量が、前記樹脂(1)と前記単量体(2)との合計1Kg中1.5〜20molである請求項1に記載の硬化性樹脂組成物。 2. The curable resin composition according to claim 1 , wherein the amount of the active hydrogen is 1.5 to 20 mol in a total of 1 kg of the resin (1) and the monomer (2).
JP2006291150A 2006-10-26 2006-10-26 Curable resin composition Pending JP2008106169A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006291150A JP2008106169A (en) 2006-10-26 2006-10-26 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006291150A JP2008106169A (en) 2006-10-26 2006-10-26 Curable resin composition

Publications (2)

Publication Number Publication Date
JP2008106169A JP2008106169A (en) 2008-05-08
JP2008106169A5 true JP2008106169A5 (en) 2009-12-10

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ID=39439798

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JP2006291150A Pending JP2008106169A (en) 2006-10-26 2006-10-26 Curable resin composition

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JP (1) JP2008106169A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010146912A1 (en) * 2009-06-18 2010-12-23 Dic株式会社 Air-drying polyester (meth)acrylate resin composition, structure and method for providing same
KR101786778B1 (en) * 2010-06-18 2017-10-18 디아이씨 가부시끼가이샤 Urethane(meth)acrylate resin composition and coating material using same
JP5003854B2 (en) * 2010-11-19 2012-08-15 Dic株式会社 Radical curable resin composition, coating material using the same, civil engineering building structure, and construction method thereof
JP5845935B2 (en) * 2012-01-31 2016-01-20 Dic株式会社 Radical polymerizable resin composition
JP2014065873A (en) 2012-09-27 2014-04-17 Dic Corp Radical-polymerizable compound
JP6212892B2 (en) * 2013-03-25 2017-10-18 Dic株式会社 Radical curable composition and civil engineering building material
JP6394077B2 (en) * 2014-06-04 2018-09-26 Dic株式会社 Radical polymerizable composition, concrete repair material and road primer

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002332316A (en) * 2001-05-09 2002-11-22 Dainippon Ink & Chem Inc Unsaturated polyester resin composition, coating material and molded product
JP4151310B2 (en) * 2001-05-22 2008-09-17 Dic株式会社 Curable unsaturated resin composition
JP4193490B2 (en) * 2002-08-27 2008-12-10 Dic株式会社 Floor covering structure
JP5179696B2 (en) * 2003-10-20 2013-04-10 昭和電工株式会社 Low odor resin composition, coating material containing the same, and coating method using the same
JP2005154688A (en) * 2003-11-28 2005-06-16 Hitachi Chem Co Ltd Thermosetting resin composition
JP2005255937A (en) * 2004-03-15 2005-09-22 Hitachi Chem Co Ltd Unsaturated polyester resin composition and putty coating
JP4441868B2 (en) * 2004-12-09 2010-03-31 Dic株式会社 Curable resin composition for civil engineering and building materials, civil engineering and building materials for application, and civil engineering buildings
JP4973914B2 (en) * 2006-06-07 2012-07-11 Dic株式会社 Curable resin composition and waterproof material composition

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