JP2008105074A - Solder melting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder melting apparatus having an normal operation mode and a sleep mode, which apparatus can reduce the loss of time at the restart of soldering work. <P>SOLUTION: This solder melting apparatus has a normal operation mode for melting solder by heating a predetermined heating object part by a heater to a normal setting temperature, and a sleep mode for lowering the temperature of the heating object part to a sleep setting temperature when the use of the heating object part is stopped. The solder melting apparatus comprises a temperature detecting means for detecting the temperature of the heating object part and a control means for conducting a reset control to the normal operation mode based on a sudden temperature change in the heating object part in the sleep mode. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

 The present invention lowers the heating target part to the sleep setting temperature when interrupting the use of the heating target part and the normal operation mode in which the solder is melted by heating the predetermined heating target part to the normal setting temperature by the heater. The present invention relates to a solder melting apparatus including a sleep mode.

For example, Japanese Patent No. 3670072 discloses a normal operation mode in which solder is melted by heating a tip (heating target portion) to a normal set temperature with a heater, and when the use of the tip is interrupted. A soldering iron device having a sleep mode that lowers the tip to a sleep set temperature is disclosed. According to such a soldering iron device, it is possible to reduce power consumption when the tip is not used, and to prevent the tip from being oxidized, thereby extending its life.
Japanese Patent No. 3670072

 By the way, in the above prior art, in the sleep mode, a configuration is adopted in which the operator returns from the sleep mode to the normal operation mode by operating an operation key provided on the soldering iron device. In other words, when resuming the soldering work (returning to the normal operation mode), it is necessary to operate the operation keys of the soldering iron device. If you are unfamiliar with such operations, do the soldering work. There was a problem that it took time to resume, and the efficiency of the soldering work deteriorated.

 The present invention has been made in view of the above-described problems, and an object of the present invention is to reduce time loss when resuming soldering work in a solder melting apparatus having a normal operation mode and a sleep mode.

 In order to achieve the above object, in the present invention, as a first solution, a normal operation mode in which solder is melted by heating a predetermined heating target part to a normal set temperature by a heater, and use of the heating target part Is a solder melting device comprising a sleep mode for lowering the heating target part to a sleep set temperature, temperature detection means for detecting the temperature of the heating target part, and in the sleep mode, the heating target Control means for performing return control to the normal operation mode based on a sudden temperature change of the unit.

 Further, in the present invention, as the second solving means, in the first solving means, the control means calculates a temperature gradient at a predetermined period based on time series data of the temperature of the heating target portion, and the temperature gradient The sudden temperature change of the said heating object part is judged based on this.

 Further, in the present invention, as a third solving means, in the second solving means, in the period until the temperature of the heating target part reaches the sleep set temperature after shifting to the sleep mode. The temperature gradient is calculated, and the sudden temperature change of the heating target portion is determined based on the temperature gradient.

  In the present invention, as a fourth solving means, in the second or third solving means, the control means switches to the normal operation mode when the current value of the temperature gradient is larger than a past value. The return control is performed.

 Further, in the present invention, as the fifth solving means, in the second or third solving means, the control means calculates the sum or average of the temperature gradients for a certain number of times each time the temperature gradient is calculated. A value is obtained, and when the current value ΔT2 is larger than the previous value ΔT1 of the sum or average of the temperature gradients, the return control to the normal operation mode is performed.

In the present invention, as a sixth solving means, in the fifth solving means, when the previous value ΔT1 and the current value ΔT2 of the sum or average value of the temperature gradients satisfy the following relational expression (1): Control to return to the normal operation mode is performed.
(ΔT1 + N) <ΔT2 (1)
N: Temperature change due to disturbance

 In the present invention, as a seventh solving means, in the second or third solving means, the control means obtains a moving sum or moving average of the temperature gradient for a certain number of times, and moves the temperature gradient. When the current value ΔT2 ′ is larger than the previous value ΔT1 ′ of the sum or moving average, the return control to the normal operation mode is performed.

In the present invention, as the eighth solution means, in the seventh solution means, the previous value ΔT1 ′ and the current value ΔT2 ′ of the moving sum or moving average of the temperature gradient satisfy the following relational expression (2). In this case, the control for returning to the normal operation mode is performed.
(ΔT1 ′ + N) <ΔT2 ′ (2)
N: Temperature change due to disturbance

 Further, in the present invention, as the ninth solving means, in the first solving means, the control means determines that the sudden temperature change occurs when the temperature of the heating target portion changes from a sleep set temperature by a threshold value or more. Judgment is made, and return control to the normal operation mode is performed.

 In the present invention, as a tenth solving means, in the ninth solving means, the control means is configured such that the temperature of the heating target part is a period after the temperature of the heating target part reaches the sleep set temperature. Is determined to be a sudden temperature change, and control for returning to the normal operation mode is performed.

 In the present invention, as the eleventh solving means, in the ninth or tenth solving means, the control means is configured to perform the normal operation when the temperature of the heating target portion is lowered from a sleep set temperature by a threshold value or more. Control to return to the mode is performed.

 Further, in the present invention, as a twelfth solving means, in the first solving means, the control means is predetermined based on time series data of the temperature of the heating target portion in the entire period after shifting to the sleep mode. A temperature gradient is calculated in a cycle, and a sudden temperature change of the heating target portion is determined based on the temperature gradient, and a case where the temperature of the heating target portion changes from a sleep setting temperature by a threshold value or more It is determined that the temperature has changed, and when a sudden temperature change is detected by one of the determinations, the control for returning to the normal operation mode is performed.

 In the present invention, as the thirteenth solving means, in the first solving means, the control means calculates a temperature difference at a predetermined cycle based on time series data of the temperature of the heating target part, and the temperature difference When the current value is larger than the past value, return control to the normal operation mode is performed.

 Further, in the present invention, as the fourteenth solution means, in the thirteenth solution means, the control means obtains an average value of the temperature difference for the predetermined number of times each time the temperature difference is calculated. When the current value of the average value of the temperature differences is larger than the past value, the return control to the normal operation mode is performed.

  According to the present invention, in the sleep mode, the return control to the normal operation mode is performed based on the sudden temperature change of the heating target portion (tip), so that the operator can perform the normal operation by operating the operation key or the like. There is no need to return to the mode, and it is possible to return to the normal operation mode by a simple task of cleaning the tip, and as a result, it is possible to reduce time loss when resuming the soldering operation. .

 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As an example of the solder melting apparatus, a soldering iron apparatus that melts solder for mounting electronic components and the like on a substrate will be described.

 FIG. 1 is a configuration block diagram of a soldering iron device according to an embodiment of the present invention. As shown in this figure, this soldering iron device includes a one-chip microcomputer (control means) 1, a tip (heating target part) 2, a heater 3, a first temperature sensor (temperature detection means) 4, and a power transformer 5. , Thyristor 6, zero cross detector 7, power supply circuit 8, first amplifier 9, second temperature sensor 10, second amplifier 11, multiplexer 12, A / D converter 13, switch 14, buzzer 15, buffer amplifier 16, operation panel 17, display 18, operation switch 19, buffer 20, transistor 21, oscillation circuit 22, reset switch 23, and EEPROM (Electronically Erasable and Programmable Read Only Memory) 24.

 The one-chip microcomputer 1 controls the operation of each component described below according to a control program stored in a ROM (Read Only Memory) provided therein. As this one-chip microcomputer 1, in addition to the ROM, a microcomputer provided with a RAM (Random Access Memory), various timer input / output interfaces and the like is used.

 The tip 2 is a tip provided in a soldering iron portion of the present soldering iron device, and includes a heater 3 and a first temperature sensor 4. One end of the heater 3 is connected to one end of the secondary winding of the power transformer 5, and the other end of the secondary winding of the power transformer 5 is connected to the other end of the heater 3 via a thyristor 6 whose ON / OFF is controlled by the one-chip microcomputer 1. It is connected to the. That is, the heater 3 heats the tip 2 to a predetermined temperature in accordance with the output current control of the power transformer 5 by the thyristor 6. The first temperature sensor 4 detects the heating temperature of the tip 2 and outputs a first temperature detection signal indicating the heating temperature to the first amplifier 9.

 The power transformer 5 lowers the commercial power supplied from the outside and outputs the AC voltage after the low voltage to the heater 3, the zero cross detector 7 and the power circuit 8. The thyristor 6 controls the output current of the power transformer 5 flowing through the heater 3 by ON / OFF control by the one-chip microcomputer 1. The zero cross detector 7 detects the zero cross position of the AC voltage input from the power transformer 5 and outputs it to the one-chip microcomputer 1. The one-chip microcomputer 1 performs ON / OFF control of the thyristor 6 based on the zero-cross position detected by the zero-cross detector 7.

 The power supply circuit 8 rectifies the AC voltage input from the power supply transformer 5 and supplies a DC power supply voltage such as ± 5 V and +3 V to each part in the soldering iron device. The first amplifier 9 amplifies the first temperature detection signal input from the first temperature sensor 4 and outputs the amplified signal to one selection terminal of the multiplexer 12.

 The second temperature sensor 10 detects the cold junction temperature of the first temperature sensor 4 and outputs a second temperature detection signal indicating the cold junction temperature to the second amplifier 11. The second amplifier 11 amplifies the second temperature detection signal and outputs it to the other selection terminal of the multiplexer 12. The multiplexer 12 alternatively outputs the first temperature detection signal or the second temperature detection signal to the A / D converter (analog / digital converter) 13 according to the request of the one-chip microcomputer 1. The A / D converter 13 converts an input signal (first temperature detection signal or second temperature detection signal) that is an analog signal into a digital signal and outputs the digital signal to the one-chip microcomputer 1.

 The switch 14 alternatively outputs either the power supply voltage + 5V or + 3V to the buzzer 15 according to the request of the one-chip microcomputer 1. The buzzer 15 outputs the sound to the outside based on the sound signal input from the one-chip microcomputer 1 via the buffer amplifier 16 and the sound volume defined by the power supply voltage alternatively input from the switch 14. . The buffer amplifier 16 amplifies the audio signal input from the one-chip microcomputer 1 and outputs it to the buzzer 15.

 The operation panel 17 is provided in an operation box of the soldering iron apparatus, and includes a plurality of indicators 18 and operation switches 19. Each operation terminal of the display 18 is connected to the one-chip microcomputer 1 through the buffer 20, and the common terminal is connected to the collector terminal of the transistor 21. Each base terminal of the transistor 21 is connected to the one-chip microcomputer 1 so that a power supply voltage of, for example, +5 V is supplied to the common terminal of each display 18 in accordance with the base signal output from the one-chip microcomputer 1. It has become. The operation switch 19 is inserted between each collector terminal and the one-chip microcomputer 1 and outputs the switching operation information to the one-chip microcomputer 1. The buffer 20 buffers the display signal input from the one-chip microcomputer 1 and outputs the display signal to the display 18 via each operation terminal. That is, the display 18 displays information corresponding to the display signal.

 FIG. 2 shows the configuration of the operation panel 17. In this figure, reference numeral 19a denotes a numerical value input switch for inputting various setting values to be described later. The setting value input from the numerical value input switch 19a is displayed on the setting numerical value display 18a. 19b is a display digit shift switch for operating the digit shift of the numerical value displayed on the set numerical value display 18a, 19c is a parameter selector switch for switching the input mode of the numerical value input from the numerical value input switch 19a, and 19d is the above-mentioned various set values. This is a key lock switch for switching between the key lock setting to be held and the release thereof. When the key lock switch 19d is operated and the soldering iron device is set to the key lock setting state, the key lock setting lamp 18b is turned on.

 Reference numeral 18c is a measurement temperature indicator that displays the heating temperature of the tip 2 detected by the first temperature sensor 4, 18d is a heater energizing lamp that is turned on when the heater 3 is energized, and 18e is a numerical input for the heating temperature. An alarm lamp that is lit when the range set by the switch 19a deviates or is within the range, and 18f is a sleep mode lamp that is lit when the operation mode of the soldering iron device is the sleep mode. The sleep mode lamp 18f is turned off when the operation mode of the soldering iron device is the normal operation mode (the mode in which the tip 2 is heated to the normal set temperature).

 Further, in FIG. 1, the oscillation circuit 22 generates a basic clock signal of the one-chip microcomputer 1 and outputs the basic clock signal to the one-chip microcomputer 1. The reset switch 23 is for initializing the one-chip microcomputer 1 by the switching operation. The EEPROM 24 stores the setting state of the soldering iron device such as various setting values inputted from the numerical value input switch 19a and the key lock setting state by the key lock switch 19d.

 Next, referring to the flowcharts shown in FIGS. 3 to 5 and the temperature change characteristics of the tip 2 shown in FIG. 6, the one-chip microcomputer 1 shifts to the sleep mode and returns from the sleep mode to the normal operation mode. The operation will be described.

 When using this soldering iron device, as shown in FIG. 6, the normal setting temperature of the tip 2 during the normal operation mode of the present soldering iron device, the sleep detection temperature as a reference for the transition to the sleep mode, It is assumed that the sleep set temperature, which is the set temperature in the sleep mode, is input in advance by operating the numeric input switch 19a and the like, and the one-chip microcomputer 1 stores these set temperatures as temperature data in the EEPROM 24. To do.

 Also, during the usage period of the soldering iron device, the temperature of the tip 2 is lowered by the heat capacity of the solder or the printed circuit board to be soldered, but the use of the soldering iron device is interrupted. The check time (CT) from when the temperature of 2 is recovered to the sleep detection temperature to when the temperature is shifted to the sleep mode can be arbitrarily set by operating the numerical input switch 19a. 1 stores the check time (CT) in the EEPROM 24 as check time data.

 In FIG. 3, when the power is turned on to the soldering iron device, the one-chip microcomputer 1 initializes a variable i used for execution of the following control program to "0" (step S1). The one-chip microcomputer 1 determines whether or not twice (2CT) of the check time (CT) is less than 10 minutes (step S2). If this determination is “Yes”, it is provided inside. 10 minutes is set as the initial check time in the timer (step S3), and if this determination is "No", 2CT is set as the initial check time in the timer (step S4). In the following description, a case where 10 minutes is set as the initial check time will be described.

 Subsequently, the one-chip microcomputer 1 turns off the sleep mode lamp 18f and displays that the present soldering iron device is in the normal operation mode (step S5). Then, the one-chip microcomputer 1 reads the normal set temperature from the EEPROM 24, sets it as a reference temperature for temperature control of the tip 2 (step S6), performs ON / OFF control of the thyristor 6, and sets the tip 2 , That is, the temperature detected by the first temperature sensor 4 is controlled to the normal set temperature (step S7).

 The one-chip microcomputer 1 determines whether or not each of the keys on the operation panel 17 is operated (step S8), and this determination is “Yes”, that is, the operator operates the operation panel 17 to operate the present soldering iron. If the setting state of the apparatus is not to be changed, the process proceeds to step S9. The case where this determination is “No” will be described later.

 As shown in FIG. 6, the temperature of the tip 2 gradually increases toward the normal set temperature with the start of the temperature control of the heater 3 in step S7. The one-chip microcomputer 1 determines whether or not the temperature of the tip 2 has reached the sleep detection temperature (step S9). This determination is “Yes”, that is, the temperature of the tip 2 after power-on is detected as sleep. Once the temperature is reached, the variable i is set to “1” (step S10), and it is further determined whether or not the timer has expired (step S11).

 If it is determined as “No” in the above step S11, that is, if 10 minutes have not elapsed since the power is turned on, the one-chip microcomputer 1 determines a certain time from the initial check time (10 minutes) set in the timer, for example, 0.1 seconds to 0.2 seconds are subtracted (step S12), and each processing below the temperature control of the heater 3 based on the normal set temperature in step S7 is repeated. That is, by repeating the loop processing from step S7 to step S12, the set value of the timer sequentially decreases, and when it is detected in step S11 that the set value has become “0”, a sleep routine (described below) The process of step Sa) is performed.

 On the other hand, if “No” is determined in step S8 and step S9, the one-chip microcomputer 1 determines whether or not the variable i is “1” (step S13), and this determination is “No”, that is, the power is turned on. If the temperature of the tip 2 has never reached the sleep detection temperature, the temperature control of the heater 3 based on the normal set temperature in step S7 is repeated, and if “YES” is determined, that is, the sleep detection is once performed. When the temperature is reached, the CT routine (step Sb) described below is performed.

 In other words, in this soldering iron device, when the power is turned on, an initial check time of 10 minutes or a time that is twice the check time CT (2CT) arbitrarily set by the operator is forcibly set. When the tip 2 is not used as it is, the routine shifts to the sleep routine after 10 minutes or 2 CT, while the tip 2 of the soldering iron device is used during this 10 minutes or 2 CT. If there is a key input operation on the operation panel 17, the routine proceeds to the CT routine.

 Hereinafter, the CT routine will be described with reference to FIG. First, the one-chip microcomputer 1 resets the check time (CT) in the timer (step Sb1), and then turns off the sleep mode lamp 18f to indicate the normal operation mode (step Sb2). Then, the one-chip microcomputer 1 sets the normal set temperature to the reference temperature for the temperature control of the tip 2 (step Sb3), and supplies the heater 3 so that the temperature of the tip 2 becomes the normal set temperature. Energization is controlled (step Sb4).

 Then, the one-chip microcomputer 1 determines whether or not various operation keys on the operation panel 17 are operated (step Sb5), as in step S8 of FIG. When the operation panel 17 is not operated to change the setting state of the soldering iron device, the process proceeds to step Sb6. When this determination is “No”, the process of step Sb1 is repeated.

 Subsequently, the one-chip microcomputer 1 determines whether or not the temperature of the tip 2 has reached the sleep detection temperature (step Sb6), and this determination is “Yes”, that is, the tip of the soldering iron device. If 2 is not used, it is determined whether or not the timer has expired (step Sb7). If it is determined as “No” in step Sb6, that is, if the tip 2 of the soldering iron apparatus is in use, the one-chip microcomputer 1 repeats the processing from step Sb1 onward.

 If the determination in step Sb7 is “No”, that is, the check time (CT) has not elapsed, the one-chip microcomputer 1 subtracts a fixed time of 0.1 to 0.2 seconds from the check time (CT). (Step Sb8), the processing from step Sb4 onward is repeated. That is, by repeating the loop processing from step Sb4 to step Sb8, the set value of the timer sequentially decreases, and when it is detected in step Sb7 that the set value has become “0”, the processing in the CT routine is terminated. Then, the sleep routine (step Sa) is performed.

 Next, the sleep routine will be described with reference to FIG. First, the one-chip microcomputer 1 turns on the sleep mode lamp 18f and displays that the present soldering iron device has shifted to the sleep mode (step Sa1). Then, the one-chip microcomputer 1 reads the sleep set temperature from the EEPROM 24, sets it to the reference temperature for temperature control of the tip 2 (step Sa2), and the temperature of the tip 2 is set to sleep as shown in FIG. Energization control of the heater 3 is performed so as to reach the set temperature (step Sa3). Since the sleep set temperature is set to a temperature lower than the normal set temperature, the life of the tip 2 can be extended and the power consumption in the heater 3 can be reduced. In the sleep mode, the measured temperature indicator 18c of the operation panel 17 alternately displays the temperature of the tip 2 and the characters “SLP” indicating the sleep mode.

 Here, as shown in FIG. 6, let Tm be the period during which the temperature of the tip 2 reaches the sleep set temperature from the normal set temperature. The one-chip microcomputer 1 samples the temperature data every predetermined sampling period T (for example, 100 ms) in the period Tm, and calculates the temperature gradient of the tip 2 based on these time-series sampling data (step) Sa4).

 As shown in FIG. 7A, when the sleep set temperature is set as low as about room temperature, the temperature of the tip 2 is set to a period Tm in which the temperature decreases from the normal set temperature to the sleep set temperature C. Reach sleep set temperature while drawing a gentle curve. On the other hand, when the sleep set temperature is set to a temperature B or temperature A higher than room temperature (sleep set temperature C), the temperature of the tip 2 does not reach the sleep set temperature while drawing a gentle curve. Thus, the temperature rapidly changes from the time when the sleep set temperature is reached and is kept constant at the sleep set temperature. In the present embodiment, a case where the sleep set temperature is set to 200 degrees higher than the room temperature will be described. FIG. 7B shows a temperature change of the tip 2 after reaching the sleep set temperature. As described above, after the sleep set temperature is reached, feedback control is performed to maintain the temperature of the tip 2 at the sleep set temperature every predetermined period (about 500 ms), and therefore the temperature of the tip 2 varies periodically. Will have ingredients.

Hereinafter, step Sa4 will be described in detail. FIG. 8A shows the temperature change in the period Tm in FIG. As shown in FIG. 8A, the one-chip microcomputer 1 samples the temperature data (D ₁ , D ₂ , D ₃ ...) For each sampling period T in the period Tm after shifting to the sleep mode. . And, for example, one-chip microcomputer 1, when the sampled temperature data D _2, and calculates the temperature gradient at the first sampling period based on the temperature data D ₂ and D _1. As a method for calculating this temperature gradient, the same method as the method for calculating the slope of a straight line connecting two points can be employed. Similarly, the one-chip microcomputer 1, when the sampled temperature data D _3, calculates the temperature gradient at the second sampling period based on the temperature data D ₃ and D _2. Similarly, the one-chip microcomputer 1 sequentially calculates the temperature gradient in the sampling cycle based on the new temperature data and the previous temperature data when the new temperature data is sampled.

 In the above description, the number of data for calculating the temperature gradient is two, but the temperature gradient may be calculated from a plurality of sampling data of two or more. In this case, the temperature gradient may be calculated by linearly approximating these sampling data by the least square method.

Then, the one-chip microcomputer 1 compares the current value of the temperature gradient calculated for each sampling period T as described above with the previous value (step Sa5), and if the current value is larger (“Yes”), FIG. 4 (that is, return control to the normal operation mode is performed). More specifically, as shown in FIG. 8 (b), to calculate the time T new temperature data D ₅ obtained in ₅ and temperature data D ₄ obtained in the previous time T ₄ based on the time T ₅ - temperature gradient _{K 1} between T ₄ is (temperature gradient calculated based on the temperature data _{D 4} and _{D 3)} previous temperature gradient _{K 2} shifts to greater than the CT routine Sb.

Generally, when the soldering operator suspends the use of the tip 2 and resumes the soldering operation using the tip 2 again, a water-containing sponge or a metal cleaner that does not use water is used. The tip 2 is used for cleaning. At this time, the temperature of the tip 2 instantaneously drops by about several degrees (about 1.4 degrees or more for a metal cleaner). Therefore, in the period Tm, the temperature gradient of the tip 2 should be gradually reduced until the sleep set temperature is reached, but when the tip 2 is cleaned, as shown in FIG. Thus, the current value of the temperature gradient suddenly increases (changes) compared to the previous value. As described above, when the current value of the temperature gradient of the tip 2 becomes larger than the previous value, it is determined that the worker resumes the soldering work, and the return control to the normal operation mode is performed. Thus, unlike the conventional case, the operator does not need to operate the operation keys (such as the operation switch 19) to return to the normal operation mode, and sleeps by a very simple and naturally performed operation of cleaning the tip 2. The mode can be returned to the normal operation mode. FIG. 8 (c), when the return control to the normal operation mode is performed at time T _5, which shows the temperature change of the tip 2.

 In the above description, the current value of the temperature gradient is compared with the previous value, but the current value and the previous value may be compared. That is, the current value of the temperature gradient and the past value may be compared.

In addition, if the method of simply comparing the current value and the previous value of the temperature gradient as described above is adopted, if the temperature data fluctuates greatly due to the influence of noise or other disturbances, the normal operation mode is restored at the wrong timing. There is a possibility. Therefore, each time a certain number (for example, four) of temperature gradients is calculated, the sum of the temperature gradients corresponding to the certain number is obtained. Specifically, for example, when the temperature data is sampled from D _{1 to} D ₉ , the sum of the four temperature gradients calculated based on the temperature data D _{1 to} D ₅ (previous value ΔT1) and the temperature data D _{5 to} D The sum of the four temperature gradients calculated based on ₉ (current value ΔT2) is obtained, and when the previous value ΔT1 and the current value ΔT2 of the sum of these temperature gradients satisfy the following relational expression (1), the normal operation mode Return control may be performed. In the following relational expression (1), the constant N is a value indicating a temperature change due to a disturbance. That is, if the current value ΔT2 is larger than the value obtained by adding the temperature change due to the disturbance to the previous value ΔT1 of the sum of the temperature gradients, the return control to the normal operation mode is performed.
ΔT1 + N <ΔT2 (1)

  Thus, by comparing the previous value and the current value of the sum of the temperature gradients, the influence of noise can be reduced, and the normal operation mode can be restored at an accurate timing. Each time a certain number of temperature gradients are calculated, an average value of the temperature gradients for the certain number may be obtained, and the previous value and the current value of the average value of the temperature gradients may be compared.

Further, instead of the above-described method of obtaining the previous value ΔT1 and the current value ΔT2 of the sum of the temperature gradients for a certain number of times each time a certain number of temperature gradients are calculated, the movement of the temperature gradient for a certain number of times is performed. A method of obtaining the previous value ΔT1 ′ and the current value ΔT2 ′ of the sum may be employed. Specifically, first, it calculates the sum of the four temperature gradient calculated based on the temperature data D ₁ to D ₅ as a preceding value Delta] T1 ', then four temperature calculated based on the temperature data D ₂ to D ₆ The sum of the gradients is obtained as the current value ΔT2 ′, and when the previous value ΔT1 ′ and the current value ΔT2 ′ of the sum of the temperature gradients (moving sum) satisfy the following relational expression (2), the return control to the normal operation mode is performed. To do. A moving average may be used instead of a moving sum of a certain number of temperature gradients.
ΔT1 ′ + N <ΔT2 ′ (2)

Furthermore, the temperature difference may be calculated at a predetermined cycle based on the temperature data of the tip 2, and when the current value of the temperature difference is larger than the past value, the return control to the normal operation mode may be performed.
Specifically, the temperature data _{D 4} based on acquired a new temperature data _{D 5} and the previous time _{T 4} obtained at time _{T 5,} the temperature difference between times _{T 5 -T 4 (D 5 -D} 4) calculating a temperature difference which the temperature difference _(D 5 -D ₄₎ is previously calculated _(D 4 -D ₃₎ moves is greater than the CT routine Sb. Even in this case, if the temperature data greatly fluctuates due to the influence of noise, there is a possibility that the normal operation mode is restored at the wrong timing. Therefore, every time the temperature difference is calculated by a certain number (for example, four), the average value of the temperature difference for the certain number is obtained, and the current value of the average value is larger than the past (for example, the previous) average value. The return control to the normal operation mode may be performed. By performing such control, it is possible to reduce the influence of noise and return to the normal operation mode at an accurate timing.

 On the other hand, if the current value of the temperature gradient is not larger than the previous value in step Sa5 (“No”), the one-chip microcomputer 1 determines whether or not the temperature of the tip 2 has reached the sleep set temperature ( Step Sa6) When the temperature of the tip 2 has not reached the sleep set temperature (“No”), the process returns to Step Sa3 and the heater 3 is set so that the temperature of the tip 2 becomes the sleep set temperature. While conducting the energization control, the temperature gradient change is monitored by the processing of steps Sa4 and Sa5.

 In step Sa6, when the temperature of the tip 2 reaches the sleep set temperature (“Yes”), the one-chip microcomputer 1 determines that the temperature of the tip 2 is stabilized at the sleep set temperature, and then The temperature change of the first 2 is monitored, and as shown in FIG. 7B, it is determined whether or not the sleep set temperature (200 degrees) has decreased by a threshold (for example, 198.6 degrees) or more (step Sa7). In this step Sa7, when “Yes”, that is, when it is detected that the temperature of the tip 2 has decreased from the sleep setting temperature by a threshold value or more, the one-chip microcomputer 1 proceeds to the CT routine Sb shown in FIG. Control to return to mode). On the other hand, if the one-chip microcomputer 1 determines “No” in step Sa7, the temperature of the tip 2 is monitored while maintaining the temperature of the tip 2 at the sleep set temperature.

 As described above, when the metal cleaner is used, the temperature of the tip 2 instantaneously decreases by about 1.4 degrees from the sleep set temperature. Therefore, when the temperature of the tip 2 decreases from the sleep set temperature (200 degrees) by the threshold (198.6 degrees) or more, it is determined that the worker resumes the soldering work, and the normal operation mode is restored. By performing the control, it is not necessary for the operator to operate the operation keys (such as the operation switch 19) to return to the normal operation mode as in the prior art, and cleaning the tip 2 is extremely simple and natural. Can be restored from the sleep mode to the normal operation mode.

  As described above, when the return control to the normal operation mode is triggered by the fact that the temperature of the tip 2 has decreased by a predetermined value or more from the sleep set temperature, when the temperature data greatly fluctuates due to the influence of noise, There is a possibility of returning to the normal operation mode at the wrong timing. Therefore, after the temperature of the tip 2 reaches the sleep set temperature, similarly to the period Tm, the temperature gradient is calculated at a predetermined cycle based on the time-series data of the temperature of the tip 2, and the temperature gradient is set to a certain number. Each time of calculation, the sum of the temperature gradients for the certain number is obtained, and when the previous value ΔT1 and the current value ΔT2 of the sum of the temperature gradients satisfy the relational expression (1), the return control to the normal operation mode is performed. May be performed. Each time a certain number of temperature gradients are calculated, an average value of the temperature gradients for the certain number may be obtained, and the previous value and the current value of the average value of the temperature gradients may be compared.

  Further, similarly to the period Tm, the return control to the normal operation mode may be performed by comparing the previous value and the current value of the moving sum or moving average of a certain number of temperature gradients.

Furthermore, the temperature difference may be calculated at a predetermined cycle based on the temperature data of the tip 2, and when the current value of the temperature difference is smaller than the past value, the return control to the normal operation mode may be performed.
In order to reduce the influence of noise, each time the temperature difference is calculated by a certain number (for example, four), an average value of the temperature difference for the certain number is obtained, and the current value of the average value is calculated in the past (for example, When the average value is smaller than the previous average value, the return control to the normal operation mode may be performed.

 As described above, according to the soldering iron device of the present embodiment, even an operator who is unfamiliar with the operation of the operation keys (such as the operation switch 19) can easily return to the normal operation mode. As a result, it is possible to reduce time loss when resuming the soldering operation.

 In addition, this invention is not limited to the said embodiment, For example, the following modifications can be considered.

(1) In the above embodiment, after shifting to the sleep mode, the function for returning to the normal operation mode in the period Tm from the normal set temperature to the sleep set temperature, and the return to the normal operation mode after reaching the sleep set temperature Although a soldering iron device having both functions has been described, a configuration having a function of returning to either normal operation mode may be adopted.

(2) Further, a function for returning to the normal operation mode using the temperature gradient in the period Tm and a function for returning to the normal operation mode using the threshold after reaching the sleep set temperature according to the temperature change of the tip 2 Instead of using them individually, in the entire period after entering the sleep mode, use both the function to return to the normal operation mode using the temperature gradient and the function to return to the normal operation mode using the threshold, When either one of the return conditions is met, the normal operation mode may be restored.

(3) For example, when the soldering iron device is controlled by a host control device (external control device), such as when the soldering iron device is attached to a robot arm and used in a production line, A configuration in which a control signal for shifting to the sleep mode at a desired timing is output to the soldering iron device to arbitrarily shift to the sleep mode is also conceivable. Thus, even when the soldering iron device is automatically operated on the production line, the tip 2 is cleaned when returning from the sleep mode to the normal operation mode. It is possible to adopt a configuration that returns to the normal operation mode when the tip 2 is cleaned.

(4) In the above embodiment, a configuration is adopted in which the temperature is returned to the normal operation mode when the temperature of the tip 2 is lowered by a threshold value or more from the sleep setting temperature. A configuration may be adopted in which when the temperature rises from the sleep set temperature by a threshold value or more, the normal operation mode is restored. By adopting such a configuration, for example, when the tip 2 is brought into contact with molten (high temperature) solder or other high-temperature object, or the tip 2 is moved into a high-temperature atmosphere. The case can be used as a trigger to return to the normal operation mode.

(5) In the above embodiment, the soldering iron device has been described as an example of the solder melting device. However, the present invention is not limited to this, and the tip 2 is configured in a nozzle shape and melted from the nozzle-shaped tip 2. The solder removal apparatus that sucks and removes the solder in the state can also be provided with a return control function from the sleep mode to the normal operation mode as described above.

1 is a block diagram showing a configuration of an embodiment of a soldering iron device according to the present invention. It is a figure which shows the structural example of the operation panel 17 in the soldering iron apparatus which concerns on this invention. It is a flowchart which shows operation | movement of the soldering iron apparatus which concerns on this invention. It is a flowchart which shows the process of CT routine in the flowchart shown in the said FIG. FIG. 4 is a flowchart showing processing of a sleep routine in the flowchart shown in FIG. 3. It is a 1st graph which shows the change of the tip temperature of the soldering iron apparatus concerning this invention. It is a 2nd graph which shows the change of the tip temperature of the soldering iron apparatus concerning this invention. It is a 3rd graph which shows the change of the tip temperature of the soldering iron apparatus concerning this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... One-chip microcomputer, 2 ... Tip, 3 ... Heater, 4 ... 1st temperature sensor, 5 ... Power supply transformer, 6 ... Thyristor, 7 ... Zero cross detector, 8 ... Power supply circuit, 9 ... 1st amplifier, 10 2nd temperature sensor, 11 ... 2nd amplifier, 12 ... multiplexer, 13 ... A / D converter, 14 ... switch, 15 ... buzzer, 16 ... buffer amplifier, 17 ... operation panel, 18 ... display, 19 ... operation switch 20 ... buffer, 21 ... transistor, 22 ... oscillation circuit, 23 ... reset switch, 24 ... EEPROM

Claims (14)

A normal operation mode in which solder is melted by heating a predetermined heating target part to a normal set temperature by a heater, and a sleep mode in which when the use of the heating target part is interrupted, the heating target part is lowered to a sleep set temperature. A solder melting device comprising:
Temperature detecting means for detecting the temperature of the heating target part;
And a control means for performing return control to the normal operation mode based on a sudden temperature change of the heating target portion in the sleep mode.  The control means calculates a temperature gradient at a predetermined cycle based on time-series data of the temperature of the heating target part, and determines a sudden temperature change of the heating target part based on the temperature gradient. The solder melting apparatus according to claim 1.  The control means calculates the temperature gradient in a period until the temperature of the heating target part reaches a sleep set temperature after shifting to the sleep mode, and the heating target part is suddenly generated based on the temperature gradient. 3. The solder melting apparatus according to claim 2, wherein the temperature change is judged.  4. The solder melting apparatus according to claim 2, wherein the control unit performs return control to the normal operation mode when the current value of the temperature gradient is larger than a past value. 5.  Each time the control means calculates a certain number of the temperature gradients, the control means obtains a sum or average value of the temperature gradients for the certain number, and when the current value ΔT2 is greater than the previous value ΔT1 of the sum or average of the temperature gradients. 4. The solder melting apparatus according to claim 2, wherein return control to the normal operation mode is performed. 6. The solder according to claim 5, wherein when the previous value ΔT1 and the current value ΔT2 of the sum or average value of the temperature gradients satisfy the following relational expression (1), return control to the normal operation mode is performed. Melting equipment.
(ΔT1 + N) <ΔT2 (1)
N: Temperature change due to disturbance  The control means obtains a moving sum or moving average of the temperature gradient for a certain number of times, and when the current value ΔT2 ′ is larger than the previous value ΔT1 ′ of the moving gradient or moving average of the temperature gradient, the control unit enters the normal operation mode. The solder melting apparatus according to claim 2 or 3, wherein the return control is performed. The return control to the normal operation mode is performed when the previous value ΔT1 ′ and the current value ΔT2 ′ of the moving sum or moving average of the temperature gradient satisfy the following relational expression (2). The solder melting apparatus as described.
(ΔT1 ′ + N) <ΔT2 ′ (2)
N: Temperature change due to disturbance  The control means determines that the sudden change in temperature occurs when the temperature of the heating target part changes by more than a threshold value from a sleep set temperature, and performs return control to the normal operation mode. The solder melting apparatus as described.  In the period after the temperature of the heating target part reaches the sleep set temperature, the control means determines that the temperature of the heating target part has changed from the sleep set temperature by a threshold value or more as the sudden temperature change, The solder melting apparatus according to claim 9, wherein return control to the normal operation mode is performed.  11. The solder melting apparatus according to claim 9, wherein the control unit performs return control to the normal operation mode when the temperature of the heating target portion is lowered from a sleep setting temperature by a threshold value or more.  The control means calculates a temperature gradient at a predetermined cycle based on time-series data of the temperature of the heating target portion during the entire period after the transition to the sleep mode, and suddenly detects the heating target portion based on the temperature gradient. When the temperature of the object to be heated has changed by more than a threshold value from the sleep set temperature, it is determined as the sudden temperature change, and the sudden temperature change is detected by one of the determinations. 2. The solder melting apparatus according to claim 1, wherein return control to the normal operation mode is performed. The control means calculates a temperature difference at a predetermined cycle based on the time series data of the temperature of the heating target part, and when the current value of the temperature difference is larger than a past value, the control control to return to the normal operation mode is performed. The solder melting apparatus according to claim 1, wherein the solder melting apparatus is performed.  The control means obtains an average value of the temperature difference for the fixed number of times every time the temperature difference is calculated, and when the current value of the average value of the temperature difference is larger than a past value, the normal operation mode The solder melting apparatus according to claim 13, wherein the return control is performed.

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