JP2008103755A5 - - Google Patents

Description

Substrate transfer method

  The present invention relates to a substrate transfer method in a semiconductor processing facility.

  FIG. 13 is a cross-sectional view showing a part of the semiconductor processing facility 1 in which the conventional substrate transfer method is implemented. The semiconductor processing facility 1 includes a wafer processing apparatus 2 that processes a semiconductor wafer that is a substrate, and a wafer transfer apparatus 3. The wafer transfer device is a front end module device (abbreviated as EFEM). The spaces 9 and 10 in the semiconductor processing facility 1 are filled with a predetermined atmospheric gas. Specifically, the wafer processing apparatus 2 forms a processing space 10 filled with a predetermined atmospheric gas. The wafer transfer device 3 forms a preparation space 9 filled with a predetermined atmospheric gas.

The semiconductor wafer 4 is a substrate container FOUP (Front Opening Unified Pod).
5 is transferred to the semiconductor processing facility 1 while being accommodated in the semiconductor processing facility 1. The wafer transfer device 3 includes a preparation space forming unit 11, a hoop opener 6, and a wafer transfer robot 7 as a substrate transfer robot. Box 11 defines a preparation space 9. The preparation space 9 is kept in a clean space by a dust collecting device such as a fan filter unit fixed to the preparation space forming unit 11. The hoop opener 6 opens and closes the doors formed in the hoop 5 and the preparation space forming portion 11. The hoop opener 6 can switch between a state in which the internal space of the hoop 5 and the preparation space 9 communicate with each other and a closed state by opening and closing each door. The wafer transfer robot 7 is accommodated in the preparation space 9 and transfers the wafer 4 across the hoop 5 and the wafer processing apparatus 2.

  The wafer transfer robot 7 takes out the unprocessed wafer 4 from the hoop 5 in a state where the hoop 5 is held by the wafer transfer device 3 and outside air is prevented from entering the preparation space 9. The robot 7 transports the unprocessed wafer 4 that has been taken out, passes through the preparation space 9, and places it in the processing space 10 of the wafer processing apparatus 2. The wafer transfer robot 7 takes out the processed wafer 4 from the processing space 10 of the wafer processing apparatus 2. The wafer transfer robot 7 transfers the processed wafer 4 that has been taken out, passes through the preparation space 9, and re-accommodates it in the internal space of the FOUP 5. As described above, the wafer 4 processed by transferring the wafer 4 to the wafer processing apparatus 2 using the hoop 5 and the wafer transfer apparatus 3 is prevented from adhering dust floating in the atmosphere. For example, such a technique is disclosed in Patent Document 1.

JP 2003-45933 A

  FIG. 14 is a plan view showing a part of the semiconductor processing facility 1A in which the substrate transfer method of the first conventional technique is implemented. The robot arm 14 of the wafer transfer robot 7 of the first prior art is connected to a base 18 and can be turned around a turning axis A0 set on the base 18 and a first link body 15a and a first link body 15a. The second link body 15b is connected to the second link body 15b and connected to the second link body 15b. The second link body 15b can be angularly displaced around the first joint axis A1 set on the first link body 15a. And a third link body 15c that can be angularly displaced about the second joint axis A2. The third link body 15c is provided with a robot hand 12 at the tip.

  In the wafer transfer robot 7, the minimum rotation area 17 necessary for one rotation around the base 18 is included in the preparation space 9 in a state where the link bodies 15 a to 15 c are angularly displaced from each other to make the most compact. Set to In other words, the minimum turning radius R of the robot is set to be less than ½ of the longitudinal dimension B of the preparation space 9. The distance L11 between the turning axis A0 and the first joint axis A1 and the distance L12 between the first joint axis A1 and the second joint axis A2 are set to be the same.

  The wafer transfer device 3 includes three units for performing the attaching / detaching operation of the FOUP 5 with respect to the wafer transfer device 3 and the transfer operation of the wafer 4 in the FOUP 5 held by the wafer transfer device 3 in parallel. Or, there may be four hoop openers 6. In this case, in the wafer transfer robot 7 of the first prior art described above, the hand 12 may not be able to reach the farthest hoop 5 from the base 18. If the length of the link body is increased so as to widen the operable area of the robot 7, the robot arm 14 may interfere with the preparation space forming unit 11 or enter the robot intrusion prohibited area.

  FIG. 15 is a plan view showing a part of the semiconductor processing facility 1B according to the second prior art. As shown in FIG. 15, in the second conventional technique, in order to transfer the wafers 4 of all the hoops 5, the wafer transfer robot 7 has a robot main body 13 having a robot arm 14 and a robot main body 13. 5 traveling means 12 that travels in the parallel direction Y.

  In the second prior art, traveling means 12 for driving the robot main body 13 to travel is disposed in the preparation space 9. The traveling means 12 is realized by a linear drive mechanism. The direct drive mechanism is more difficult to seal dust generated in the drive portion than the rotary drive mechanism. Therefore, there is a problem that the cleanliness of the preparation space 9 is reduced by dust generated by the traveling means 12.

  Further, when the robot main body 13 is moved at a high speed, the robot main body 13 is large, so that the power consumed by the robot main body 13 for traveling is increased. Further, the travel means 12 is increased in size to support the robot body 13, and it is difficult to reduce the size and weight of the wafer transfer robot 7. Further, since the traveling means 12 is large, it is difficult to replace the traveling means 12 when a problem occurs in the traveling means 12. Further, the provision of the traveling means 12 increases the manufacturing cost.

  Further, by increasing the number of links of the robot arm 14 in order to increase the operable area of the wafer transfer robot 7, the traveling means 12 shown in the second prior art can be made unnecessary. However, when the number of links of the robot arm 14 is increased, there is a problem that the structure of the robot becomes complicated. Further, increasing the number of links increases the redundancy of the robot and may make it difficult to control the robot arm 14. For example, regarding wafer transfer, the teaching operation for teaching the deformation state of the robot arm becomes complicated.

  Accordingly, it is an object of the present invention to provide a substrate transfer method that can suppress dust scattering and prevent interference within a wafer transfer apparatus of a substrate transfer robot, and is simple in structure and control.

The present invention provides (a) a substrate processing apparatus that performs substrate processing, and is loaded with a preliminarily adjusted atmosphere gas, and the substrate is loaded in a horizontally long preparation space that is longer in the left-right direction perpendicular to the front-rear direction than in the front-rear direction. And a substrate carrying method for carrying out ,
(B) The preparation space is defined and has a front wall and a back wall that are spaced apart in a predetermined front-rear direction, a plurality of first entrances are formed on the front wall, and the preparation space is formed on the back wall. And a preparation space forming portion in which a second doorway communicating with the processing space adjacent to the preparation space is formed,
(C) opening and closing means for opening and closing each first doorway of the preparation space forming unit;
(D) A substrate transfer robot that is arranged in a preparation space and transfers a substrate across each of the first doorway and the second doorway,
(D1) a base fixed to the preparation space forming part;
(D2) a first link body having one end connected to the base, configured to be angularly displaceable about the swivel axis, and having a first joint axis parallel to the swivel axis;
(D3) The second link is configured such that one end is connected to the other end of the first link body, and the second joint axis is configured to be angularly displaceable about the first joint axis and parallel to the turning axis. Link body,
(D4) One or a plurality of third ones having one end connected to the other end of the second link body so as to be angularly displaceable about the second joint axis, and the robot hand being provided at the other end. Link body,
(D5) a robot arm that grips a substrate in a substrate container provided on a front wall by the robot hand and pivots around a pivot axis in the preparation space and conveys the substrate from the second entrance to the processing space;
(D6) preparing a substrate transfer robot including a driving unit that individually drives each link body around the corresponding joint axis by angular displacement;
(E) The first link distance L1, which is the distance from the turning axis to the end of the first link body that is farthest in the radial direction toward the first joint axis with respect to the turning axis, is the front wall of the preparation space forming portion. The front-rear direction dimension B of the preparation space between the rear wall and the front-rear direction dimension B exceeds 1/2 and the radial dimension T2 of the circumferential surface around the pivot axis of the first link body and the robot The front-rear direction dimension L0 (= T2 + Q), which is the sum of predetermined gap dimensions Q to prevent interference, and the front-rear robot entry prohibition area dimension E from the front wall to the rear wall set by the opening / closing means are subtracted. The substrate transport method is characterized by being set to a value (B−L0−E) or less (B / 2 <L1 ≦ B−L0−E) .
In the present invention, the first inter-axis distance L11 from the turning axis to the first joint axis and the second inter-axis distance L12 from the first joint axis to the second joint axis are set to be the same.
The second link distance L2, which is the distance from the second joint axis to the end of the second link body that is farthest in the direction toward the first joint axis with respect to the second joint axis, is the allowable dimension (B-L0). -E) is set to be more than 1/2 of the allowable dimension (B-L0-E).
In the present invention, the distance from the second joint axis to the end of the third link body or the board portion that is furthest in the radial direction with respect to the second joint axis in a state where the board is held by the robot hand. The three-link distance L3 is set to be more than 1/2 of the allowable dimension (B-L0-E) and not more than the allowable dimension (B-L0-E).
Further, the present invention is characterized in that the first link distance L1, the second link distance L2, and the third link distance L3 are set to be the same as the allowable dimension (B-L0-E).
Further, the present invention is characterized in that the first and second link bodies are angularly displaced about the angular displacement axis, and the third link body is translated in the left-right direction.
In the present invention, with the longitudinal direction of the third link body aligned with the front-rear direction, the robot hand reaches the substrate in the substrate container, and the third link body is translated in the front-rear direction to enter the preparation space. It is transported.
Further, the present invention is characterized in that the substrate held by the robot hand is transported in the preparation space by moving in the left-right direction in a state where the longitudinal direction of the third link body is substantially parallel to the front-rear direction.
Further, the present invention is characterized in that the substrate is transported into the processing space by causing the first to third link bodies to enter the processing space from a state in which the substrate is held by the robot hand in the preparation space.

  According to the present invention, the substrate transfer robot takes out the substrate before processing from the substrate container, puts the substrate before processing into the preparation space, passes through the preparation space, exits from the opening on the back side, and carries it into the substrate processing apparatus. In addition, the substrate transfer robot puts the processed substrate processed in the substrate processing apparatus into the preparation space from the back side opening, passes through the preparation space, exits from the front side opening, and carries it out to the storage container. Therefore, it operates between the front wall and the back wall.

  The preparation space is filled with atmospheric gas, and thus when the substrate before processing is carried from the substrate container to the substrate processing apparatus, and when the substrate after processing is carried from the substrate processing apparatus to the substrate container, The dust floating on the substrate is prevented from adhering to the substrate, and the yield of the substrate to be processed can be improved.

  In such a substrate transfer operation by the substrate transfer robot, the minimum rotation radius R of the robot arm exceeds 1/2 of the front-rear dimension B of the preparation space, so that the robot arm can be compared with the first and second conventional techniques. The minimum turning radius R can be increased. Further, when the minimum turning radius R of the robot arm turns below the subtraction value (B−L0), a gap can be formed between the robot arm in the minimum deformation state and the front wall. Interference with the front wall can be prevented. Therefore, with respect to a reference line that includes the turning axis and extends in the front-rear direction, the robot hand that is the tip of the robot arm is turned and arranged on both sides in the left-right direction perpendicular to the front-rear direction and the turning axis direction extending along the turning axis. be able to. Further, by operating the robot arm in the operation range excluding the interference operation range in which the robot arm is expected to interfere with the back wall, interference with the back wall can be prevented.

  As a result, even if the front-rear direction dimension B of the preparation space is small, the link length of the link body of the robot arm can be increased to prevent the robot arm from interfering with the front wall, and the operating range of the robot arm can be increased. can do. In particular, the movement range of the robot arm can be increased in the left-right direction perpendicular to the front-rear direction and the turning axis direction.

  According to the present invention, the minimum turning radius R of the robot arm is set to the above-described relationship (B / 2 <R ≦ B−L0). As a result, the robot arm can be prevented from interfering with the front wall, and the link length of the link body of the robot arm can be increased. Further, by limiting the angular displacement operation region of the robot arm to less than 360 °, for example, about 180 °, it is possible to prevent the robot arm from interfering with the back wall.

  By increasing the link length of the link body of the robot arm, the operation range of the robot arm can be increased in the left-right direction. This eliminates the need for traveling means for driving the robot in the left-right direction as compared with the second prior art, and eliminates the direct drive mechanism. Therefore, dust generated in the linear drive mechanism can be prevented, and a reduction in the cleanliness of the preparation space can be prevented. Further, since the traveling means is unnecessary, the robot can be reduced in size and weight.

  Also, by increasing the link length of the link body of the robot arm, the robot hand can reach a predetermined position. In addition, the increase in the number of links can be prevented and the structure of the robot can be simplified. Moreover, the redundancy of the robot can be reduced, the control of the robot arm and the teaching of the deformation state can be simplified, and the possibility of the robot arm colliding with the preparation space forming unit can be reduced.

  As described above, according to the present invention, it is possible to suppress the scattering of dust due to the unnecessary travel means, and it is possible to prevent interference in the substrate transfer apparatus.

  FIG. 1 is a plan view showing a part of a semiconductor processing facility 20 including a wafer transfer device 23 that performs the substrate transfer method according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a part of the semiconductor processing facility 20 by cutting. In FIG. 1 and FIG. 2, an example of another movable shape of the robot 27 is indicated by a two-dot chain line. The semiconductor processing facility 20 performs a predetermined process on the semiconductor wafer 24 to be a processing target substrate. For example, various processes such as a heat treatment, an impurity introduction process, a thin film formation process, a lithography process, a cleaning process, or a planarization process are assumed as a process performed on the semiconductor wafer 24. In addition, the semiconductor processing facility 20 may perform substrate processing other than the above-described substrate processing.

The semiconductor processing facility 20 performs the above-described substrate processing in a processing space 30 filled with an atmosphere gas having a high cleanliness. Wafer 24 is a hoop 25 (FOUP, Front Opening
A plurality of substrate containers referred to as “Unified Pods” (abbreviated hoops) are transferred to the semiconductor processing equipment 20. Hoop 25 relates cleaner technology station plant, which is a substrate container mini-environment in a clean environment.

  The hoop 25 includes a hoop main body 60 serving as a container main body in which the wafer 24 is accommodated, and a hoop side door 61 serving as a container side door that is detachably formed with respect to the hoop main body 60. The hoop main body 60 is formed in a substantially box shape opened to one side, and a hoop internal space 34 is formed as a wafer accommodating space. By attaching the hoop side door 61 to the hoop body 60, the hoop inner space 34 is sealed with respect to the outer space 33, and contaminants such as dust particles enter the hoop inner space 34 from the outer space 33. To prevent. Further, by removing the hoop side door 61 from the hoop body 60, the wafer 24 can be accommodated in the hoop inner space 34 and the wafer 24 accommodated in the hoop inner space 34 can be taken out. The hoop 25 accommodates a plurality of wafers 24 arranged in the vertical direction Z. The wafers 24 accommodated in the hoop 25 are arranged at equal intervals in the vertical direction Z, and one surface in the thickness direction extends horizontally.

The semiconductor processing facility 20 includes a wafer processing device 22 and a wafer transfer device 23. The semiconductor processing equipment 20 is, for example, SEMI (Semiconductor Equipment and
Predefined by the Materials International) standard. In this case, for example, the hoop 25 and a hoop opener (FOUP Opener) 26 for opening and closing the hoop 25 are SEM.
It conforms to specifications such as I standard E47.1, E15.1, E57, E62, E63, E84. However, even if the configuration of the semiconductor processing facility 20 is a configuration outside the SEMI standard, it is included in the present embodiment.

  The wafer processing apparatus 22 performs the above-described predetermined processing on the wafer 24 in the processing space 30. In addition to the main body of the processing apparatus that performs processing on the wafer 24, the wafer processing apparatus 22 includes a processing space forming unit that forms the processing space 30, a transfer device that transports the wafer 24 in the processing space 30, and an atmospheric gas that fills the processing space 30. It has an adjusting device to control. The adjusting device is realized by a fan filter unit or the like.

The wafer transfer device 23 takes out the wafer 24 before processing from the FOUP 25 and supplies it to the wafer processing device 22, and takes out the processed wafer 24 from the wafer processing device 22 and re-accommodates it in the FOUP 25. The wafer transfer device 23 is a front end module device (
Equipment Front End Module (abbreviation EFEM). The wafer transfer device 23 serves as an interface unit responsible for delivery of the wafer 24 between the FOUP 25 and the wafer processing device 22 in the semiconductor processing equipment 20 . The wafer 24 passes through a preparation space 29 having a high degree of cleanliness filled with a predetermined atmospheric gas while moving between the in-hoop space 34 and the processing space 30 of the wafer processing apparatus 22.

The preparation space 29 is a closed space in which contamination control is performed, in which suspended fine particles in the air are managed to a level below a limited cleanliness level, and the temperature, humidity, pressure, etc. are controlled as necessary. It is a space where environmental conditions are also managed. In the present embodiment, the processing space 30 and the preparation space 29 are kept clean so as not to adversely affect the processing of the wafer 24. For example, the cleanliness level is ISO (International Organization for Standardization,
CLASS1 defined by International Organization for Standardization is adopted.

  The wafer transfer device 23 includes a preparation space forming unit 28 that forms the preparation space 29, a wafer transfer robot 27 that is arranged in the preparation space 29 and can transfer a wafer, and a hoop opener 26 that is an opening and closing device that opens and closes the hoop 25. And a preparation space adjustment device 100 that adjusts the atmospheric gas that fills the preparation space 29. In the present embodiment, the wafer transfer device 23 further includes an aligner 56 for adjusting the orientation of the wafer 24 held at a predetermined holding position.

The preparation space forming unit 28 surrounds the preparation space 29 and prevents outside air from entering the preparation space 29 from the outer space 33. Each preparation system element necessary for transferring the wafer 24 is fixed to the preparation space forming unit 28. In the present embodiment, four hoop openers 26a, 26b, 26c, and 26d, one wafer transfer robot 27, and one aligner 56 are fixed to the preparation space forming unit 28, respectively.

  The preparation space forming unit 28 is formed in a rectangular parallelepiped box shape, and forms a rectangular parallelepiped preparation space 29. The preparation space forming unit 28 includes a front wall 110 and a back wall 111 that are arranged at a predetermined interval in the front-rear direction X. The front wall 110 serves as a partition that partitions the outer space 33 and the preparation space 29 located in front X1 of the preparation space 29. The rear wall 111 serves as a partition that partitions the preparation space 29 and the processing space 30. Therefore, the preparation space 29 is formed in the rear X2 of the outer space 33 and in the front X1 of the processing space 30.

In addition, the preparation space forming unit 28 has two side walls 112 and 113 that are arranged at intervals in the left-right direction Y. In addition, the preparation space forming unit 28 includes a ceiling wall 114 and a bottom wall 115 that are spaced apart in the vertical direction Z. The walls 110 to 115 included in these preparation space forming portions 28 are each formed in a plate shape.

  In the present embodiment, the front-rear direction X and the left-right direction Y are preset directions. The front-rear direction X and the left-right direction Y are directions orthogonal to the up-down direction Z, extend horizontally, and are orthogonal to each other. A rear X2 in the front-rear direction X is a direction in which the wafer 24 accommodated in the hoop 25 faces the processing space 30. Further, the front X <b> 1 in the front-rear direction X is a direction in which the wafer 24 accommodated in the processing space 30 faces the hoop 25.

The first side wall 112 connects one end of the front wall 110 and the back wall 111 in the left-right direction. The second side wall 113 connects the other ends in the left-right direction of the front wall 110 and the back wall 111. The ceiling wall 114 connects the upper end portions of the front wall 110, the back wall 111, the first side wall 112, and the second side wall 113, respectively. Further, the bottom wall 115 connects the lower end portions of the front wall 110, the back wall 111, the first side wall 112, and the second side wall 113, respectively.

The preparation space 29 is closed in the front-rear direction X by the front wall 110 and the back wall 111. The preparation space 29 is closed in the left-right direction Y by the first side wall 112 and the second side wall 113. The preparation space 29 is closed in the vertical direction Z by the ceiling wall 114 and the bottom wall 115. In this way, the preparation space 29 is defined. The preparation space forming portion 28 is formed in a square frame shape with a cross-sectional shape perpendicular to the up-down direction Z, the left-right direction Y being the longitudinal direction, and the front-rear direction X being the width direction. Therefore, the preparation space 29 is a horizontally long space in which the left-right direction Y is longer than the front-rear direction X.

A front-side opening 120 that penetrates in the front-rear direction X, which is the thickness direction, is formed in the front wall 110. The front opening 120 is formed so that the wafer 24 can be inserted. The wafer 24 is inserted into the preparation space 29 from the outer space 33 by being driven to move backward X2 from the front wall 110 by passing through the front side opening 120 by the wafer transfer robot 27. The wafer 24 is discharged from the preparation space 29 to the outer space 33 by the wafer transfer robot 27 passing through the front-side opening 120 and being driven to move forward X1 from the front wall 110. In the present embodiment, four front side openings 120 are provided, and each front side opening 120 is arranged in the left-right direction Y.

A rear-side opening 121 that penetrates in the front-rear direction X, which is the thickness direction, is formed in the rear wall 111. The back side opening 121 is formed so that the wafer 24 can be inserted. The wafer 24 is discharged from the preparation space 29 to the processing space 30 by being driven to move backward X2 from the back wall 111 by passing through the back side opening 121 by the wafer transfer robot 27. Further, the wafer 24 is inserted into the preparation space 29 from the processing space 30 by being driven to move forward X1 from the back wall 111 by passing through the back side opening 121 by the wafer transfer robot 27. In the present embodiment, two back side openings 121 are provided, and each back side opening 121 is arranged in the left-right direction Y.

  Each of the hoop openers 26a to 26d includes a front plate 101, an opener side door 65, a hoop support portion 31, and a door opening / closing mechanism 109. The hoop openers 26a to 26d are arranged at equal intervals in the left-right direction Y. Each of the hoop openers 26a to 26d is disposed on the front X1 side of the preparation space forming unit 28. The hoop openers 26a to 26d also serve as a substrate container mounting base for installing a hoop that is a substrate container. Therefore, the hoop openers 26a to 26d play a role of at least a substrate container mounting table that supports the hoop.

  The front plate 101 constitutes a part of the front wall 110 of the preparation space forming unit 28. The front plate 101 of each of the hoop openers 26a to 26d is a plate-like or frame-like member that respectively forms the above-described front-side opening 120, and is fixed to the remaining portion of the front wall 110, so that the front wall 110 is Constitute. The front-side opening 120 formed in each front plate 101 is formed so that the hoop-side door 61 can pass in the front-rear direction X.

  The opener side door 65 is a door for opening and closing the front side opening 120. The hoop support portion 31 is disposed in the outer space 33 in the front X1 with respect to the preparation space 29, and supports the hoop 25 from below. The hoop 25 is formed so that it can be positioned at a mounting position set in the hoop support portion 31 while being supported by the hoop support portion 31. Hereinafter, the hoops supported corresponding to the first to fourth hoop openers 26a to 26d are referred to as first to fourth hoops 25a to 25d, respectively. Further, when it is not necessary to distinguish the first to fourth hoops 25a to 25d, they are simply referred to as hoops 25.

  In the positioning state in which the hoop 25 is positioned at the mounting position, the opening 60 a of the hoop body 60 contacts the entire circumference of the opening 101 a of the front plate 101. In the positioning state, the hoop side door 61 faces the opener side door 65 that closes the front opening 120 from the outer space 33.

The door opening / closing mechanism 109 is a mechanism that opens and closes the opener side door 65 and the hoop side door 61 in a state where the hoop 25 is positioned at the mounting position. The door opening / closing mechanism 109 directly or indirectly grips the opener side door 65 and the hoop side door 61 and moves them downward X2 downward from the respective openings 60a, 101a to be set in the preparation space 29 . by moving to the open release position, communicating the FOUP internal space 34 and space 29. The door opening / closing mechanism 109 prevents the opener side door 65 and the hoop side door 61 from being attached to the openings 60 a and 101 a, thereby preventing communication between the hoop inner space 34 and the preparation space 29.

  In the positioning state in which the hoop 25 is positioned, the opening 60a of the hoop body 60 and the opening 101a of the front plate 101 are in contact with each other along the entire circumference of the peripheral edge. Therefore, in the state where the hoop 25 is positioned, even if the opener-side door 65 and the hoop-side door 61 are removed from the openings 60a and 101a by the door opening / closing mechanism 109, the outside air enters the hoop inner space 34 and the preparation space 29. Is prevented.

  The hoop openers 26a to 26d are provided side by side in the left-right direction Y, and are configured to be individually operable. In FIG. 1, the 1st hoop opener 26a located in the left end shows the state which opened the front side opening 120 corresponding. Further, the FOUP openers 26b to 26d other than the first FOUP opener 26a show a state in which the corresponding front side opening 120 is closed.

  In each of the hoop openers 26a to 26d, a movable region 108 for moving the doors 61 and 65 to the open position is set by the door opening / closing mechanism 109. The movable area 108 of the hoop openers 26 a to 26 d is an area set in the preparation space 29, and is an area near the front wall 110 in the preparation space 29.

In this embodiment, the wafer transfer robot 27 is a scalar (Selective Compliance).
Realized by an assembly robot arm (SCARA) type horizontal articulated robot. The wafer transfer robot 27 is disposed in the preparation space 29 and includes a robot arm 41, a horizontal drive unit 42 a, a vertical drive unit 42 b, a base 43, and a controller 44.

The robot arm 41 has a link structure including a plurality of link bodies 41a to 41c that are sequentially connected in a direction from the base end portion toward the tip end portion. A robot hand 40 is formed at the tip of the robot arm 41. The robot hand 40 has a gripping structure that can grip the wafer 24. Gripping of the wafer 24 in the present specification means that one is capable of carrying the wafer 24 by the robot hand 40, by the robot hand 40, the wafer 24 nono, may be in a state of adsorbing or sandwich.

  The horizontal drive means 42a individually angularly drives the link bodies 41a to 41c of the robot arm 41 around the corresponding joint axes A0 to A2. The robot arm 41 displaces and drives the robot hand 40 to an arbitrary position on the horizontal plane within the movable range, as the link bodies 41a to 41c are angularly driven to each other by the horizontal driving means. The horizontal drive means 42a includes a motor that is angularly displaced in accordance with a signal supplied from the controller 44, and a power transmission mechanism that transmits the power of the motor to the link body. A motor and a power transmission mechanism are provided for each of the link bodies 41a to 41c.

  The vertical drive means 42b drives the robot arm 41 to move in the vertical direction Z. The vertical drive means 42b has a fixed part and a movable part, and drives the movable part to be displaced in the vertical direction with respect to the fixed part. The vertical drive means 42b includes a motor that is angularly displaced in accordance with a signal supplied from the controller 44, and a power transmission mechanism that converts the power of the motor into a linear advance force of the movable part with respect to the fixed part and transmits it to the movable part. A fixed portion of the vertical drive means 42 b is supported by the base 43. The base 43 supports the vertical drive means 42 b and is fixed to the preparation space forming unit 28.

The controller 44 controls the horizontal driving means 42a and the vertical driving means 42b according to a predetermined operation program or a movement command input from the user, and moves the robot hand 40 to a predetermined position. The controller 44 sends, to the horizontal driving means 42a and the vertical driving means 42b, a storage circuit that stores a predetermined program, an arithmetic circuit that calculates an arithmetic program stored in the storage circuit, and a signal indicating the calculation result of the arithmetic circuit. Providing output means. For example, a memory circuit includes a RAM (Random Access Memory) and a ROM (
The operation circuit is realized by a CPU (Central Processing).
Unit).

  In the robot arm 41, the base end portion of the robot arm 41 is fixed to the movable part of the vertical driving means 42b, so that the controller 44 moves the robot hand 40 in the movable range within the movable range X, the horizontal direction Y, and the It can be displaced to an arbitrary position in the vertical direction Z. By controlling the horizontal driving means 42a and the vertical driving means 42b by the controller 44, the wafer 24 held by the robot hand 40 can be moved. As a result, the wafer 24 can be moved along the predetermined route and transferred between the hoop 25 and the wafer processing apparatus 22.

The robot hand 40 passes through the front-side opening 120 and enters the hoop inner space 34 with the hoop openers 26a to 26d opening the hoop side door 61, and grips the wafer 24 accommodated in the hoop 25. Next, the robot hand 40 grips the gripped wafer 24 through the preparation space 29, passes through the back side opening 121 and enters the processing space 30 of the wafer processing apparatus 22 while gripping the wafer 24. Then, the wafer is transferred to a preset wafer placement position 107. Further, the robot hand 40 enters the processing space 30 through the back side opening 121 and holds the wafer 24 held at the wafer arrangement position 107. Next, the robot hand 40, while holding the wafer 24, passes through the preparation space 29, passes through the front-side opening 120, enters the FOUP inner space 34, and holds the gripped wafer 24 on the FOUP 25. Transfer to the storage position.

  In the present embodiment, since four hoop openers 26a to 26d are respectively provided, the robot hand 40 can load and unload the wafer 24 with respect to each of the hoops 25 supported by the respective hoop support portions 31 of the openers 26. Set to The robot hand 40 can place the wafer 24 taken out from the hoop 25 at a holding position set in the aligner 56 and can place the wafer 24 taken out from the holding position of the aligner 56 in the wafer processing apparatus 22. is there.

The aligner 56 is disposed in the preparation space 29 and is disposed on the other side in the left-right direction with respect to the fourth hoop opener 26d located at the other end position in the left-right direction among the plurality of hoop openers 26a to 26d. The aligner 56 has a holding unit that supports the wafer 24, and rotates the wafer 24 held by the holding unit so that the notch or orientation flat formed in the wafer 24 is aligned in a predetermined direction. By holding the aligned wafer 24 by the robot hand 40, the orientation of the wafer 24 can be adjusted and placed in the wafer processing apparatus 22. As a result, the wafer processing apparatus 22 can perform a predetermined process in a state where the orientation of the wafer 24 is aligned.

  The center position of the wafer 25 held by the aligner 56 is set at a substantially intermediate position in the front-rear direction X of the preparation space 29. The aligner 56 is disposed at a position that does not hinder the robot hand 40 from reaching the respective hoop openers 26. In the present embodiment, the aligner 56 is disposed further on the other side in the left-right direction than the fourth hoop opener 26d located at the other end position in the left-right direction.

As described above, the wafer transfer robot 27 is arranged in the preparation space 29 and mainly moves the robot hand 40 in the preparation space 29. The wafer transfer robot 27 is configured to allow the robot hand 40 to pass through the front-side opening 120 to take out the wafer 24 in the hoop inner space 34 and to take the wafer 24 into the hoop inner space 34. Further, the wafer transfer robot 27 can pass the robot hand 40 through the back side opening 121 to take out the wafer 24 from the wafer placement position 107 in the processing space 30 and can take the wafer 24 into the wafer placement position 107 in the processing space 30. Configured. Further, the wafer transfer robot 27 is configured to be able to pass through four front wall openings 120 set in each of the FOUP openers 26a to 26d.

Accordingly, the wafer transfer robot 27 is configured to be able to transfer the robot hand 40 in the front-rear direction X by a dimension B or more of the preparation space 29. Further, the wafer transfer robot 27 is configured to be able to move the robot hand 40 in the left-right direction Y so that the hoop 25 supported by each of the hoop openers 26a to 26d can be accessed. Further, in the present embodiment, the wafer transfer robot 27 is configured to be able to move the robot hand 40 in the left-right direction Y so that the aligner 56 can be accessed.

  The base 43 is fixed to the preparation space forming unit 28, and a predetermined turning axis A0 is set. In the present embodiment, the turning axis A0 extends in the vertical direction and is located closer to the back wall 111 in the preparation space 29. Further, the turning axis A0 is located at the center position in the left-right direction Y between the hoop opener 26a at one end position in the left-right direction and the hoop opener 26d at the other end position in the left-right direction.

  The robot arm 41 has a link structure in which a plurality of link bodies 41a to 41c are connected to each other. The robot arm 41 has a proximal end set at one end in the arrangement direction in which the plurality of link bodies 41a to 41c are arranged in order, and a distal end set at the other end in the arrangement direction. The base end portion of the robot arm 41 is fixed to a movable part of the vertical drive means 42b and is connected to the base 43 via the vertical drive means 42b. A robot hand 40 is formed at the tip of the robot arm 41. The robot arm 41 is configured such that the base end portion can be angularly displaced about the turning axis A0.

  Specifically, the robot arm 41 includes first to third link bodies 41a, 41b, and 41c. Each link body 41a-41c is each formed in the vertically long shape which becomes vertically long in the longitudinal direction. As for the 1st link body 41a, the longitudinal direction one end part 45a is connected with the movable part of the up-and-down drive means 42b. The first link body 41a is configured to be angularly displaceable about the turning axis A0 with respect to the movable part of the vertical drive means 42b. In the first link body 41a, the first joint axis A1 parallel to the turning axis A0 is set at the other end 46a in the longitudinal direction. Therefore, the first joint axis A1 moves as the first link body 41a moves. The longitudinal direction of the first link body 41a is a direction connecting the turning axis A0 and the first joint axis A1.

  The second link body 41b has one longitudinal end 45b connected to the other longitudinal end 46a of the first link body 41a. The second link body 41b is configured to be angularly displaceable about the first joint axis A1 with respect to the first link body 41a. In the second link body 41b, a second joint axis A2 parallel to the turning axis A0 is set at the other end 46b in the longitudinal direction. Therefore, the second joint axis A2 moves with the movement of the second link body 41b. The longitudinal direction of the second link body 41b is a direction connecting the first joint axis A1 and the second joint axis A2.

  The third link body 41c has one longitudinal end 45c connected to the other longitudinal end 46b of the second link body 41b. The third link body 41c is configured to be angularly displaceable about the second joint axis A2 with respect to the second link body 41b. In the third link body 41c, the robot hand 40 is formed at the other end 46c in the longitudinal direction. Therefore, the robot hand 40 moves as the third link body 41c moves. The longitudinal direction of the third link body 41c is a direction connecting the second joint axis A2 and the center position A3 of the wafer 24 held by the robot hand 40.

As described above, the robot arm 41 has a link structure including the three link bodies 41a to 41c. The horizontal driving means 42a described above has first to third motors. The first motor is a motor for rotationally driving the first link body 41a around the turning axis A0. The second motor is a motor for rotationally driving the second link body 41b around the first joint axis A1. The third drive source is a motor for rotationally driving the third link body 41c around the second joint axis A2. Accordingly, the horizontal driving means 42a can drive the first to third link bodies 41a to 41c independently and individually around the corresponding angular displacement axes A0 to A2.

  As shown in FIG. 2, the second link body 41b is disposed above the first link body 41a. As a result, the second link body 41b can move to a position overlapping in the vertical direction Z with respect to the first link body 41a, and the first link body 41a and the second link body 41b are prevented from interfering with each other. . Similarly, the third link body 41c is disposed above the second link body 41b. As a result, the third link body 41c can move to a position overlapping the vertical direction Z with respect to the second link body 41b, and the first link body 41a to the third link body 41c are prevented from interfering with each other. .

  FIG. 3 is a plan view showing the wafer transfer device 23 in a simplified manner in order to explain the length of each of the link bodies 41a to 41c. The robot arm 41 can be deformed to the minimum deformed state by angularly displacing the link bodies 41a to 41c around the corresponding angular displacement axes A0 to A2. The minimum deformed state is a deformed state in which the distance from the turning axis A0 to the arm portion furthest away in the radial direction extending in the horizontal direction around the turning axis A0 is minimized. More specifically, the minimum deformed state is a deformed state in which the distance from the turning axis A0 to the arm part furthest away in the radial direction or a part of the wafer 24 is the smallest when the robot arm 41 holds the wafer 24. It is.

Hereinafter, in the minimum deformation state, the distance from the turning axis A0 to the arm portion or wafer portion that is furthest away from the turning axis A0 in the radial direction is referred to as “minimum turning radius R of the robot”. The dimensions of the longitudinal direction X between or positive wall 110 and the rear wall 111 is referred to as a "longitudinal dimension B of the interface space."

In the present embodiment, the minimum turning radius R of the robot exceeds 1/2 of the longitudinal dimension B of the preparation space 29 . Further, the minimum turning radius R is set to be equal to or less than a subtraction value (B−L0) obtained by subtracting the longitudinal distance L0 from the back wall 111 to the turning axis A0 from the longitudinal dimension B of the preparation space 29 (B / 2 <R ≦ B-L0). Therefore, even if the robot arm 41 is deformed in the minimum deformation state, the amount of angular displacement is limited so that the robot arm 41 is angularly displaced around the turning axis A0 within an allowable angular displacement range in which interference with the back wall 111 is prevented. In the present embodiment, the allowable angular displacement range is set to less than 360 °, for example, about 180 ° around the turning axis A0. As a result, the wafer transfer robot 27 maintained in the minimum deformed state can prevent interference with the front wall 110 and the back wall 111 as long as it operates within the allowable angular displacement range.

The front-rear direction distance L0 from the back wall 111 to the turning axis A0 is set to at least less than 1/2 of the front-rear direction dimension B of the preparation space 29 (L0 <B / 2). In the present embodiment, the longitudinal distance L0 from the back wall 111 to the turning axis A0 is set to be less than 1/5 of the longitudinal dimension B of the preparation space 29 (L0 <B / 5). The front-rear direction distance L0 from the back wall 111 to the turning axis A0 is the circumferential surface around the turning axis A0 in the entire region of the first link body 41a on the side opposite to the first joint axis A1 side with respect to the turning axis A0. A predetermined gap dimension Q is set to be larger than the radial dimension T2 (L0 = T2 + Q). The predetermined gap dimension Q is a gap dimension sufficient to prevent the wafer transfer robot 27 from interfering, and is set to 30 mm in the present embodiment.

More specifically, in the present embodiment, the minimum rotation radius R of the wafer transfer robot 27 is determined from the front-rear direction dimension B of the preparation space 29 to the front-rear direction distance L0 from the back wall of the preparation space forming unit 28 to the turning axis. Exceeds the allowable dimension (B-L0-E) obtained by subtracting the robot entry prohibition area dimension E in the front-rear direction X on the rear wall side from the front wall 110 set in the hoop opener 26, and the allowable dimension (B−L0−E) is set below ((B−L0−E) / 2 <R ≦ B−L0−E). Thereby, it is possible to prevent the wafer transfer robot 27 maintained in the minimum deformation state from interfering with the hoop opener 26.

  The distance from the turning axis A0 to the end of the first link body 41a that is farthest in the radial direction toward the first joint axis A1 with respect to the turning axis A0 is referred to as a first link distance L1. The first link distance L1 exceeds 1/2 of the allowable dimension (B-L0-E) and is set to be equal to or smaller than the allowable dimension (B-L0-E) ((B-L0-E) / 2 <L1 ≦ B-L0-E). The first link body 41a has a radial dimension T1 of the circumferential surface around the first joint axis A1 in the entire region on the opposite side of the swing axis A0 from the first joint axis A1, and the allowable dimension (B-L0). −E) is formed to be equal to or smaller than a value (B−L0−E−L11) obtained by subtracting the first inter-axis distance L11 from the turning axis A0 to the first joint axis A1 (T1 ≦ B−L0−E−L11). ).

  The first link body 41a has a radial dimension T2 around the turning axis A0 from the back wall 111 to the turning axis A0 in the entire region on the opposite side of the turning axis A0 from the first joint axis A1. The distance in the front-rear direction is less than L0 (T2 <L0). Thus, even if the first link body 41a is displaced by 90 ° in the circumferential direction around the turning axis A0 from the state in which the longitudinal direction of the first link body 41a coincides with the front-rear direction X, the turning axis Even when the angular displacement is 90 ° in the other circumferential direction around A0, the first link body 41a is prevented from interfering with the back wall 111.

  In the present embodiment, the first inter-axis distance L11 from the turning axis A0 to the first joint axis A1 and the second inter-axis distance L12 from the first joint axis A1 to the second joint axis A2 are set to be the same. Is done. In this specification, the same includes substantially the same state, and includes the same and substantially the same state. The distance from the second joint axis A2 to the end of the second link body 41b that is farthest in the direction toward the first joint axis A1 with respect to the second joint axis A2 is referred to as a second link distance L2. The second link distance L2 exceeds 1/2 of the allowable dimension (B-L0-E) and is set to be equal to or smaller than the allowable dimension (B-L0-E) ((B-L0-E) / 2 <L2 ≦ B-L0-E).

  In the second link body 41b, the radial dimension T3 of the circumferential surface around the first joint axis A1 in the entire region on the opposite side of the first joint axis A1 from the second joint axis A2 is the allowable dimension (B -L0-E) is formed to be equal to or less than the value obtained by subtracting the first inter-axis distance L11 (B-L0-E-L11) (T3≤B-L0-E-L11). Further, the second link body 41a has a radial dimension T4 around the second joint axis A2 swiveling from the back wall 111 in the entire region on the opposite side of the first joint axis A1 from the second joint axis A2. It is formed less than the longitudinal distance L0 to the axis A0 (T4 <L0).

  Further, in a state in which the wafer 24 is gripped by the robot hand 40, the distance from the second joint axis A2 to the end of the third link body 41c or the wafer portion that is furthest away from the second joint axis A2 in the radial direction is set to the third distance. This is referred to as a link distance L3. The third link distance L3 exceeds 1/2 of the allowable dimension (B-L0-E) and is set to be equal to or smaller than the allowable dimension (B-L0-E) ((B-L0-E) / 2 <L2 ≦ B-L0-E). Further, the third link body 41c has a radial dimension T5 around the second joint axis A2 swung from the back wall 111 in the entire region opposite to the wafer gripping center position A3 side with respect to the second joint axis A2. It is formed less than the longitudinal distance L0 to the axis A0 (T5 <L0).

  In the present embodiment, the first link distance L1 and the second link distance L2 are set to the same distance as the allowable dimension (B-L0-E). Further, the first inter-axis distance L11 and the second inter-axis distance L12 are set to the same distance, and are set to a distance at which the wafer 24 of the hoop 25 supported by each of the hoop openers 26a to 26d can be taken out. In the present embodiment, the third link distance L3 is also set to be the same as the allowable dimension (B-L0-E). As shown in FIG. 3, the robot hand 40 is set to be able to hold the wafer 24 in a state where the first link body 41a and the second link body 41b extend in a straight line.

  When the third link body 41c is disposed at a position for gripping the wafer 24 accommodated in the first hoop 25a supported by the first hoop opener 26a, the front-rear direction X from the second joint axis A2 to the turning axis A0 is determined. Let the distance be S1. The distance in the left-right direction from the second joint axis A2 to the turning axis A0 is S2. Further, the total distance of the first inter-axis distance L11 and the second inter-axis distance L12 is defined as (L11 + L12).

In this case, in the present embodiment, the inter-axis distances L11 and L12 are set so as to satisfy the relationship of (L11 + L12) = (S1 ² + S2 ² ) ^0.5 . Since the distances L11 and L12 between the axes are set equal, the distances L11 and L12 between the axes are set to be ((S1 ² + S2 ² ) / 4) ^0.5 . As a result, as shown in FIG. 3, the robot hand is placed on the wafer 24 accommodated in the first hoop 25a with the longitudinal direction of the first link body 41a and the longitudinal direction of the second link body 41b arranged in a straight line. 40 can be reached. Since the turning axis A0 is arranged at the center position of each of the hoop openers 26a to 26d, the longitudinal direction of the first link body 41a and the longitudinal direction of the second link body 41b are also related to the wafer 24 accommodated in the fourth hoop 25d. And the robot hand 40 can reach the wafer 24 accommodated in the second hoop 25d. Thus, by extending the first link body 41a and the second link body 41b in a straight line, the first inter-axis distance L11 and the second inter-axis distance L12 can be shortened.

  Further, the robot hand 40 may reach the wafer 24 accommodated in the first hoop 25a and the fourth hoop 25d with the longitudinal direction of the third link body 41c inclined with respect to the front-rear direction X. As a result, the first inter-axis distance L11 and the second inter-axis distance L12 can be further shortened.

The interval Y between the wafer center positions A3 of the wafers 24 accommodated in the first hoops 25a to 25d is defined as W. The angle at which the longitudinal direction of the third link body 41c is inclined with respect to the front-rear direction X in the arrival state where the robot hand 40 has reached the wafer 24 accommodated in the first hoop 25a is defined as θ. Further, H is the distance from the wafer center position A3 to the second joint axis A2 in the reached state. In addition, C is a value (S1-L11) obtained by subtracting the first inter-axis distance L11 from the longitudinal distance S1 from the second joint axis A2 to the turning axis A0 in the reached state. In this case, the first inter-axis distance L11 is expressed by the following equation.
(2 · L11) ² ≧ (L11 + C) ² + (1.5 · W · H · s in θ) ² (1)

For example, when C = 0, θ = 0, and W = 505 mm, the distances L11 and L12 between the axes are 437.3 mm or more. Further, the robot entry prohibition area dimension E in the front-rear direction X of the hoop opener 26 from the front wall 110 to the rear wall 111 side is set to 100 mm. The distance L0 in the front-rear direction from the back wall 111 to the turning axis A0 is 65 mm. A distance L10 obtained by subtracting the first inter-axis distance L11 (R-L11) from the minimum turning radius R of the robot is set to 50 mm. In this case, the front-rear direction dimension B of the preparation space 29 is 652.3 mm or more (B ≧ L11 + E + L0 + L10). In other words, if the front-rear direction dimension B of the preparation space 29 is 652.3 mm, the inter-axis distances L11 and L12 are set to 437.3 mm so that the four hoop openers 26a to 26d are respectively supported. The wafers 24 accommodated in the first and fourth hoops 25a and 25d can be taken out. Of course, the wafers 24 accommodated in the second and third hoops 25b and 25c closer to the turning axis A0 than the first and fourth hoops 25a and 25d can also be taken out.

In the present embodiment, the front-rear direction dimension B of the preparation space 29 is 694 mm. Further, the minimum rotation radius R of the wafer transfer robot 27 is set to 485 mm, and the first inter-axis distance L11 and the second inter-axis distance L12 are set to 425 mm. In the state where the robot hand 40 holds the wafer 24, the distance H from the second joint axis A2 to the wafer center position A3 is set to 320 mm. The third link distance L3 is set to 470 mm.

For example, if θ = 5 °, H = 330 mm, and other conditions are the same as those described above, the inter-axis distances L11 and L12 are 420.4 mm or more, and the longitudinal dimension B of the preparation space 29 is 635.4 mm or more. If C = 10 mm, θ = 5 °, H = 330 mm, and other conditions are the same as those described above, the inter-axis distances L11 and L12 are 417.5 mm or more, and the longitudinal direction of the preparation space 29 The dimension B is 632.5 mm or more.

  As described above, when the robot hand 40 reaches the wafer 24, the first link body 41a and the second link body 41b are made to be inclined by tilting the longitudinal direction of the third link body 41c with respect to the front-rear direction X. The wafer 24 accommodated in each of the hoops 25a to 25d can be taken out without increasing the size.

As described above, in the present embodiment, the turning axis A0 is disposed closer to the back wall 111, and the minimum turning radius R of the robot arm 41 exceeds 1/2 of the subtraction value (B−L0), so that the subtraction is performed. By setting the value to a value (B-L0) or less, a gap can be formed between the robot arm 41 in the minimum deformed state and the front wall 101, and the robot arm 41 and the front wall 110 interfere with each other. Can be prevented. Therefore, the robot hand 40 can be arranged on both sides in the left-right direction Y with respect to the reference line P0 including the turning axis A0 and extending in the front-rear direction X.

  Further, the robot arm 41 can be prevented from interfering with the back wall 111 by operating in the operation range excluding the interference operation range that would interfere with the back wall 111. Thereby, even if the front-rear dimension B of the preparation space is small, the robot arm 41 having the link structure having the three link bodies 41a to 41c is supported by a plurality of, for example, four hoop openers 26a to 26d. The wafer 24 accommodated in the four hoops 25a to 25d can be taken out.

  In the present embodiment, the minimum turning radius R of the robot is set to be equal to or smaller than the allowable dimension (B-L0-E), so that the robot arm 41 in the minimum deformed state is closest to the front wall 101. Even if it exists, it can prevent that one part of the robot arm 41 penetrate | invades into the robot invasion prohibition area | region E of each hoop opener 26a-26d. Thus, the robot arm 41 and the hoop openers 26a to 26d can be prevented from interfering with each other regardless of the movable state of the hoop openers 26a to 26d.

Further, the first to third link distances L1 to L3 are set to be more than 1/2 of the allowable dimension (B-L0-E) and not more than the allowable dimension (B-L0-E). Thereby, the length of each link body 41a-41c can be enlarged, and even if the front-rear dimension B of the preparation space 29 is small, the robot hand 40 is arranged at a position away from the turning axis A0 on both sides in the left-right direction Y. Even when the number of hoop openers 26 is increased, the wafer 24 can be transported with a simple link structure. In the present embodiment, the first to third link distances L1 to L3 are set to be the same as the allowable dimension (B-L0-E). This prevents the robot arm 41 from interfering with the front wall 110 and the hoop opener 26, so that the lengths of the link bodies 41a to 41c can be maximized.

  Thus, by increasing the link length of each of the link bodies 41a to 41c of the robot arm 41, the operation range of the robot arm 41 in the left-right direction Y can be increased. This eliminates the need for traveling means for driving the robot 27 in the left-right direction Y as compared with the second prior art, and eliminates the linear drive mechanism. Accordingly, dust generated by the linear motion drive mechanism can be prevented, and a reduction in the cleanliness of the preparation space 29 can be prevented. Further, since the traveling means is unnecessary, the robot 27 can be reduced in size and weight.

Further, by increasing the link length of the link bodies 41a to 41c of the robot arm 41, the robot hand 40 can reach a predetermined position. Further, the increase in the number of links can be prevented, and the structure of the wafer transfer robot 27 can be simplified. Further, the redundancy of the wafer transfer robot 27 can be reduced, the control of the robot arm 41 and the teaching of the deformation state can be simplified, and the possibility of the robot arm 41 colliding with the preparation space forming unit 28 and the hoop opener 26 is reduced. be able to.

  As described above, in this embodiment, the scattering of dust due to the unnecessary travel means can be suppressed, and interference in the wafer transfer device 23 can be prevented, and the wafer transfer robot with a simple structure and control. The wafer transfer device 23 having 27 can be provided. Further, the number of hoop openers 26 can be increased without increasing the size B in the front-rear direction of the preparation space 29. By increasing the number of FOUP openers 26, the transfer and detachment operations of the FOUP 25 with respect to the wafer transfer device 23 and the transfer operations of the wafer in the FOUP 25 held by the wafer transfer device 23 are performed in parallel. Work efficiency can be improved.

  Further, since the front-rear direction dimension B of the preparation space 29 can be reduced, the installation space of the wafer transfer device 23 can be reduced, restrictions on the installation space can be relaxed, and the wafer processing facility 20 can be easily installed. can do. Further, by reducing the front-rear dimension B of the preparation space 29, the cleanliness of the preparation space 29 can be improved even when the preparation space adjustment device 100 having the same ability is used, compared to the case where the front-rear dimension B of the preparation space 29 is large. The yield can be improved.

In the present embodiment, the longitudinal direction B of the preparation space is set so that the longitudinal direction of the third link body 41c is inclined from the front-rear direction X when the robot hand 40 reaches the wafer 24. Even when the first inter-axis distances L11 and L12 are set short to prevent interference with the preparation space forming portion 28 or the hoop opener 26, the wafer 24 supported by the hoop 25 supported by each hoop opener is gripped. Can be easier.

Moreover, since the length of each link body 41a-41c can be lengthened, compared with the case where the length of each link body 41a-41c is short, the angular velocity which carries out an angular displacement around the corresponding turning axis A0-A2 is the same. Even if it exists, the moving speed of the robot hand can be improved. Inertia inertia can be reduced by moving the first link body 41a and the second link body 41b. Also by this, the moving speed of the robot hand 40 can be improved. Thus, by improving the moving speed of the robot hand 40, the transfer time spent for transferring the wafer 24 can be shortened, and the working efficiency can be improved.

FIG. 4 is a diagram showing a simplified transfer operation until the wafer 24 accommodated in the first hoop 25a is transferred to the aligner 56. As shown in FIG. The transport operation proceeds in the order of FIG. 4 (1) to FIG. 4 (7). In the transfer operation shown in FIG. 4, the movement path and the movement via point of the robot hand 40 are stored in the controller 44. The controller 44 executes a predetermined operation program and controls the horizontal driving means 42a and the vertical driving means 42b so as to pass through a plurality of via points according to the movement path. As a result, the wafer transfer robot 27 can transfer the wafer 24 accommodated in the first FOUP 25 a to the aligner 56.

First, the robot arm 41 is moved up and down to the position of the wafer 24 to be gripped, and the robot arm 41 is deformed to move the first link body 41a and the second link body 41b as shown in FIG. The wafer 24 accommodated in the first hoop 25a is gripped by the robot hand 40 in a state of extending in a straight line. Next, as shown in FIG. 4 (2), the first link body 41a and the second link body 41b are angularly displaced around the corresponding angular displacement axes A0, A1, and the third link body 41c is moved to the rear X2. Thus, the third link body 41 c and the wafer 24 are accommodated in the preparation space 29.

  Next, the first link body 41a and the second link body 41b are angularly displaced about the corresponding angular displacement axes A0 and A1, and the third link body 41c is translated in the left-right direction Y, thereby the first hoop opener 26a. To the aligner 56 located at a position distant from the left-right direction Y. At this time, since the first inter-axis distance L11 and the second inter-axis distance L12 are set to be equal, as shown in FIGS. 4 (3) and 4 (4), the first link body 41a is connected to the turning axis. The second link body 41b is angularly displaced about the first joint axis A1 with an angular displacement amount per unit time that is twice the angular displacement amount per unit time that is angularly displaced about A0. As a result, the third link body 41c can be easily translated in parallel without angularly displacing the third link body 41c around the second joint axis A2 and without changing the posture of the third link body 41c.

When the posture of the third link body 41c is changed and arranged on the aligner 56, as shown in FIGS. 4 (5) to 4 (7), the first to third link bodies 41a to 41d are subjected to corresponding angular displacements. The wafer 24 can be placed at a holding position set in the aligner 56 by angularly displacing around the axes A0 to A2. Further, the vertical position of the robot arm 41 is adjusted by the vertical drive means 42b so that the aligner can be held before the wafer 24 is gripped and held by the aligner 56. In this way, the wafer transfer robot 27 can transfer the wafer 24 accommodated in the first FOUP 25 a to the aligner 56.

FIG. 5 is a diagram illustrating a simplified transfer operation until the wafer 24 supported by the aligner 56 is transferred to the processing space 30. The transport operation proceeds in the order of FIG. 5 (1) to FIG. 5 (7). As in the case shown in FIG. 4, the controller controls the horizontal drive means 42a and the vertical drive means 42b according to a predetermined program, so that the wafer transfer robot 27 moves the wafer 24 held by the aligner 56 to the processing space. 30 can be conveyed.

When the wafer 24 is transferred to the processing space 30, it is necessary to point the robot hand 40 toward the rear X2. Therefore, as shown in FIG. 5 (1), the third link body 41c is moved from the state in which the wafer 24 is gripped to the second joint axis C2 in the preparation space 29 from the state in which the second joint axis A2 is moved toward the rear X2. The angular displacement is made around the axis A2, and the second joint axis A2 is moved closer to the front X1 in the preparation space 29. In the case shown in FIG. 5, after the third link body 41c is displaced by about 120 °, the second joint axis A2 is moved closer to the front X1 in the preparation space 29, and the third link body 41c is further angularly displaced. Let

Accordingly, the direction of the third link body 41a can be changed by 180 ° in the preparation space 29 without interfering with the front wall 110, the back wall 111, and the hoop opener 26. Accordingly, as shown in FIGS. 5 (2) to 5 (6), after changing the direction of the third link body 41c, the wafer 24 is transferred to the processing space 30 as shown in FIG. 5 (7). Can do. Further, the vertical position of the robot arm 41 is adjusted by the vertical drive means 42 b so that the wafer 24 can be moved to the processing space 30 before being gripped and moved to the processing space 30. In this way, the wafer transfer robot 27 can transfer the wafer 24 held by the aligner 56 to the processing space 30.

FIG. 6 is a diagram showing the transfer operation until the wafer 24 arranged in the processing space 30 is accommodated in the first FOUP 25a. The transport operation proceeds in the order of FIG. 6 (1) to FIG. 6 (7). As in the case shown in FIG. 4, the controller controls the horizontal driving means 42a and the vertical driving means 42b according to a predetermined program, so that the wafer transfer robot 27 moves the wafer 24 accommodated in the processing space 30 to the first position. It can be conveyed to one hoop 25a.

First, the robot arm 41 is moved up and down to the position of the wafer 24 to be gripped, and the robot arm 41 is deformed to grip the wafer 24 in the processing space 30 as shown in FIG. Next, as shown in FIG. 6 (2), the first link body 41a and the second link body 41b are angularly displaced about the corresponding angular displacement axes A0, A1, and the third link body 41c is moved forward X1. Thus, the third link body 41 c and the wafer 24 are accommodated in the preparation space 29. Next, as shown in FIGS. 6 (3) to 6 (4), the third link body 41c is moved to the second link body 41c while adjusting the position of the second joint axis A2 so as to prevent the interference of the third link body 41c. The orientation of the third link body 41c is changed by rotating around the two joint axis A2 and changing the posture. Next, as shown in FIGS. 6 (4) to 6 (5), the first link body 41a and the second link body 41b are angularly displaced around the corresponding angular displacement axes A0, A1, and the third link body. 41c is translated in the left-right direction Y. Next, as shown in FIG. 6 (6), the robot hand side portion of the third link body 41 c is made to face the opening on the front side and maintained in a posture substantially parallel to the front-rear direction X. In this state, the robot 24 is moved forward X1 to adjust the position of the robot hand 40 in the vertical direction so that the wafer can be accommodated, and the wafer 24 is accommodated in the inner space of the hoop 25 as shown in FIG. To do.

  FIG. 7 is a view showing a state in which the wafer 24 is arranged at the receiving and delivery positions of the wafer 24 of the present embodiment. FIGS. 7A to 7D show states in which the wafer 24 accommodated in the first to fourth hoops 25a to 25d is gripped. FIG. 7 (5) shows a state where the wafer 24 is arranged on the aligner 56. FIGS. 7 (6) and 7 (7) show a state in which the wafer 24 is arranged at a position set in the processing space 30. As described above, in this embodiment, the three-link structure robot arm can be configured to receive and deliver the wafer 24 of the hoop 25 supported by the four hoop openers 26a to 26d.

  In the present embodiment, the number of the third link bodies 41c provided with the robot hand 40 is one. However, the present invention is not limited to this, and the case where a plurality of, for example, two third link bodies 41c are provided is also possible. Are included in the present invention.

  For example, when a plurality of third link bodies 41c are provided, the third link bodies 41c are formed side by side in the vertical direction Z. Each third link body 41c has one longitudinal end 45c connected to the other longitudinal end 46b of the second link body 41b. Each third link body 41c is configured to be individually angularly displaceable about the second joint axis A2 with respect to the second link body 41b. Each third link body 41c is formed with a robot hand 40 at the other longitudinal end 46c. The third link bodies 41c are arranged in different regions in the vertical direction Z, so that the third link bodies 41c can be prevented from interfering with each other even if they are individually angularly displaced around the third joint axis A2. Can be removed. By providing a plurality of third link bodies 41c, it is possible to increase the number of wafers that can be transferred at one time and to improve work efficiency. Further, the number of third link bodies 41c is not limited to one or two, and a large number of third link bodies 41c may be provided. The third link body 41c is preferably formed in the same shape.

FIG. 8 is a plan view showing the wafer transfer device 23 having three hoop openers 26. FIG. 9 is a plan view showing the wafer transfer device 23 having two hoop openers 26. 8 and 9 show an example of another movable shape of the wafer transfer robot 27 with a two-dot chain line. 8 and the wafer transfer robot 27 shown in FIG. 9, FOUP openers 26 is similar to the four wafer transfer apparatus 23 the wafer transfer robot 27. Therefore, the wafer transfer robot 27 can transfer a wafer without interfering with the front wall 110 and the back wall 111 even in the case of two or three hoop openers 26. Therefore, it is not necessary to change the configuration of the robot according to the number of hoop openers 26, and versatility can be improved.

FIG. 10 is a plan view schematically showing a wafer transfer apparatus 23A in which the substrate carrying method according to the second embodiment of the present invention is implemented. The wafer transfer apparatus 23A of the second embodiment has a configuration similar to that of the wafer transfer apparatus 23 of the first embodiment, and the description of the similar configuration is omitted and the same reference numerals are given. The wafer transfer device 23A of the second embodiment is different from the first embodiment in the link length of the wafer transfer robot 27, and the other configurations are the same as those in the first embodiment.

  In the first embodiment, the robot hand 40 is made to reach the wafer 24 accommodated in the first hoop 25a with the first link body 41a and the second link body 41b extending in a straight line. However, the present invention is not limited to this. In the second embodiment, as shown in FIG. 10, the longitudinal direction of the first link body 41a and the longitudinal direction of the second link body 41b form a predetermined angle α and are accommodated in the first hoop 25a. The robot hand 40 is made to reach the wafer 24 to be processed.

In the second embodiment, the angular positions of the first link body 41a and the second link body 41b are set so that the longitudinal direction of the third link body 41c reaches the wafer 24 in a state in which the third link body 41c matches the front-rear direction X. The In the second embodiment, in a state where the longitudinal direction of the third link body 41c coincides with the front-rear direction X, the robot hand 40 is made to reach the wafer 24, and the third link body 41c is translated in the rear X2, The wafer 24 enters the preparation space 29. As a result, even if the gap between the wafer 24 held by the robot hand 40 and the front side opening 101a and the opening 60a of the hoop body 60 is small, the wafer 24 has the openings 101a and 60a. Can be prevented from colliding with.

  Even in this second embodiment, the turning axis A0 is disposed closer to the back wall 111, and the minimum turning radius R of the robot arm 41 exceeds 1/2 of the subtraction value (B-L0). By setting the value to be equal to or less than the subtraction value (B−L0), the same effect as that of the first embodiment can be obtained.

FIG. 11 is a plan view schematically showing a wafer transfer apparatus 23B in which the substrate carrying method according to the third embodiment of the present invention is implemented. In FIG. 11, an example of another movable shape of the wafer transfer robot 27 is indicated by a two-dot chain line. The wafer transfer device 23B of the third embodiment has a configuration similar to that of the wafer transfer device 23 of the first embodiment, and the description of the similar configuration is omitted and the same reference numerals are given. In the wafer transfer apparatus 23B of the third embodiment, the link length of the wafer transfer robot 27 is different from that of the first embodiment, and other configurations are the same as those of the first embodiment.

  In the first embodiment, the first inter-axis distance L11 and the second inter-axis distance L12 are the same dimension. However, the present invention is not limited to this. In the third embodiment, the first inter-axis distance L11 and the second inter-axis distance L12 are slightly different, and the first inter-axis distance L11 is formed slightly larger than the second inter-axis distance L12. In this case, as shown in FIG. 11, the angular displacement that stops the angular displacement about the second joint axis A2 of the third link body 41c and angularly displaces the first link body 41a about the turning axis A0 per unit time. If the second link body 41b is angularly displaced around the first joint axis A1 per unit time with an angular displacement amount that is twice the amount, the posture of the third link body 41c slightly changes.

  When the robot hand 40 advances from the left-right direction Y to the left-right direction Y with respect to the turning axis L0, the movement position 130, 131 of the center position A3 of the wafer 24 held by the robot hand 40 and the second joint axis A2. Is formed in an arc shape that swells forward X1. In FIG. 11, for ease of understanding, the center position A3 and the movement trajectories 130 and 131 of the second joint axis A2 are indicated by broken lines, and the virtual lines 132 and 133 extending in parallel to the left-right direction Y are indicated by alternate long and short dash lines. .

  In this case, when the difference between the first inter-axis distance L11 and the second inter-axis distance L12 is small, the third link body 41c can be moved in the left-right direction Y substantially in parallel. Thus, the first axial distance L11 and the second axial distance L12 may be slightly changed. For example, the dimensional difference allowed between the first inter-axis distance L11 and the second inter-axis distance L12 is set within B−L0−E−L1 mm.

  Even in this third embodiment, the turning axis A0 is disposed closer to the back wall 111, and the minimum turning radius R of the robot arm 41 exceeds 1/2 of the subtraction value (B-L0). By setting the value to be equal to or less than the subtraction value (B−L0), the same effect as that of the first embodiment can be obtained. The lengths of the link bodies 41a to 41c and the inter-axis distances L11 and L12 of the robot arm 41 of the first to third embodiments are examples and may be changed. For example, the first link distance L11, the second link distance L12, and the third link distance L13 may not be the same distance.

FIG. 12 is a plan view showing a part of a semiconductor processing facility 20C in which the substrate transfer method according to the fourth embodiment of the present invention is implemented. The semiconductor processing facility 20A of the fourth embodiment shows a configuration similar to the semiconductor processing facility 20 of the first embodiment, and the description of the similar configuration is omitted and the same reference numerals are given. The semiconductor processing equipment 20C of the fourth embodiment, the wafer transfer robot 27 provided in the wafer transfer apparatus 23 also serves as a transport device provided in the wafer processing apparatus 22. Since other configurations are the same as those in the first embodiment, description thereof will be omitted.

In the first embodiment, the transfer device included in the wafer processing device 22 receives the wafer 24 transferred from the preparation space 29 to the processing space 30 by the wafer transfer device 23 and transfers the received wafer 24 to the wafer processing position. On the other hand, in the fourth embodiment, as shown in FIG. 12, the wafer transfer robot 27 of the wafer transfer device 23 can widen the operation area, so that the wafer transfer within the wafer transfer device 23 is performed. However, the wafer 24 enters the processing space 30 of the wafer processing apparatus 22 and directly transfers the wafer 24 to the wafer processing position. Therefore, the wafer processing apparatus 22 can be dispensed with a transfer device, the number of parts of the wafer processing equipment can be reduced, and the manufacturing cost can be reduced.

In the fourth embodiment, the back side opening 121 is preferably arranged in the vicinity of the turning axis A0 in the left-right direction Y. Further, the back side opening 121 has a virtual circle that goes around the turning axis A0 with the minimum rotation radius R of the wafer transfer robot 27 as a radius from the first intersecting position P1, which is one of two positions intersecting the back wall 111. A shape including a straight line extending in the front-rear direction X passing through the turning axis A0 and having a space greater than or equal to the second intersection position P2 intersecting the back wall 111 and including the second intersection position P2 from the first intersection position P1. It is preferable to be formed. As a result, the first link body 41a is angularly displaced about the turning axis A0 to prevent the first link body 41a from colliding with the back wall 111, and the first joint axis A1 set in the first link body 41a is changed. Can be arranged in the preparation space 29 . Thus, the wafer 24 can be moved to a position away from the back wall 111 in the rear X2 in the preparation space 29 .

  Moreover, each Embodiment 1-4 mentioned above is an illustration of this invention, and can be changed within the range of invention. For example, in the present embodiment, the wafer transfer device 23 used in the wafer processing facility 20 has been described. However, a substrate transfer device used in a substrate processing facility for processing a substrate other than a semiconductor wafer is also included in the present invention. It is. In this case, the substrate transfer apparatus transfers the substrate gas from the substrate container to the substrate processing apparatus via the preparation space in which the atmospheric gas is adjusted, and conveys the substrate transfer apparatus from the substrate processing apparatus to the substrate container via the preparation space. It can be applied to all substrate transfer apparatuses. For example, the substrate may be a glass substrate in addition to a semiconductor substrate. Further, the wafer size has been described on the assumption that it is 300 mm. However, in the case of other sizes, a robot arm having a link dimension suitable for other sizes can be applied.

  Further, in the substrate transfer method of the present embodiment, the wafer transfer apparatus 23 has the aligner 56, but may have a processing device other than the aligner 56. The processing device is an apparatus for holding a wafer in the preparation space 29 and performing a predetermined process or operation. For example, the processing device may be a buffer body that holds the wafer 56 in the preparation space 29, or an inspection device that holds the wafer in the preparation space 29 and inspects the quality and the presence or absence of defective products. Moreover, even if the wafer transfer apparatus 23 does not have a processing device such as the aligner 56, it is included in the present invention.

  Further, even when the number of hoop openers is three or less, in order to transfer the wafer 24 to the processing device, it is necessary to move the wafer 24 over a wide range in the left-right direction. Even if the dimension B in the front-back direction of the space is small, the wafer can be transported suitably. In this case, the position of the turning axis A0 in the left-right direction Y is appropriately determined depending on the position of the object to be moved in the left-right direction. Moreover, it may replace with a hoop opener and the board | substrate container installation stand which installs a board | substrate container may be provided.

  Further, in the present embodiment, the first link body 41a can be displaced by 90 ° in the circumferential direction one and the other circumferential direction around the turning axis A0 with respect to the reference line P0 including the turning axis A0 and extending in the front-rear direction X. However, it is not limited to this. In the present embodiment, the front-rear direction X, the left-right direction Y, and the up-down direction Z are used. However, the first direction, the second direction, and the third direction, which are three directions orthogonal to each other, may be used.

The following embodiments are possible for the present invention.
(1) The minimum turning radius R is determined from the front-rear direction dimension B of the preparation space to the front-rear direction distance L0 from the back wall of the preparation space forming portion to the turning axis, and from the front wall to the back wall side set by the hoop opener. A wafer transfer apparatus characterized in that it is set (R ≦ B−L0−E) to be equal to or smaller than a permissible dimension (B−L0−E) obtained by subtracting the robot entry prohibition area dimension E in the front and rear direction.

  By setting the minimum turning radius R to be equal to or less than the allowable dimension (B-L0-E), even if the robot arm is in the state closest to the front wall, a part of the robot arm becomes the movable region of the hoop opener. Intrusion can be prevented. Thus, the robot arm and the hoop opener can be prevented from interfering with each other regardless of the movable state of the hoop opener.

  By setting the minimum turning radius R to be equal to or less than the allowable dimension (B-L0-E), even if the robot arm is in the state closest to the front wall, a part of the robot arm becomes the movable region of the hoop opener. Preventing intrusion can be prevented. As a result, contact between the robot arm and the hoop opener can be prevented, and malfunction of the wafer transfer device can be prevented.

(2) The robot arm
A first link body having one end connected to a base and configured to be angularly displaceable about the swivel axis, wherein a first joint axis parallel to the swivel axis is set;
A second link body having one end connected to the other end of the first link body, configured to be angularly displaceable about the first joint axis, and having a second joint axis parallel to the pivot axis; ,
One or more first links are connected to the other end of the second link body and configured to be angularly displaceable about the second joint axis, and a robot hand that holds the substrate is formed at the other end. 3 link bodies,
The first link distance L1, which is the distance from the turning axis to the end of the first link body that is furthest away from the turning axis in the radial direction toward the first joint axis, is the allowable direction dimension (B-L0-E). Is set to be less than the allowable dimension (B−L0−E) and (B−L0−E) / 2 <L1 ≦ B−L0−E). apparatus.

  The first link distance L1 is set to be greater than 1/2 of the allowable dimension (B-L0-E) and equal to or less than the allowable dimension (B-L0-E). Thereby, even when the first link body is in the state closest to the front wall, it is possible to prevent a part of the first link body from entering the movable region of the hoop opener. Accordingly, interference with the front wall can be prevented, and the other end portion of the first link body can be moved to both sides in the left-right direction with respect to the turning axis. Further, the first link distance L1 is set to be less than the allowable dimension (B-L0-E) and is made as large as possible to prevent the front wall and the hoop opener from interfering with the first link body, and to turn. The other end portion of the first link body can be moved to a position on both sides in the left-right direction with respect to the axis, and the operating range of the first link body can be increased.

  The first link distance L1 exceeds 1/2 of the front-rear direction dimension B of the preparation space and is set to be equal to or less than the allowable dimension (B-L0-E). Accordingly, the first link body can be prevented from interfering with the front wall and the hoop opener, and the link length of the first link body can be increased. Further, by restricting the angular displacement operation region of the first link body to less than 360 °, for example, about 180 °, it is possible to prevent the first link body from interfering with the back wall. By enlarging the first link body, the second link body and the third link body can be disposed at positions away from the turning axis in the left-right direction, and the movable region of the robot can be expanded in the left-right direction. it can.

(3) The first inter-axis distance L11 from the turning axis to the first joint axis and the second inter-axis distance L12 from the first joint axis to the second joint axis are set to be the same.
The second link distance L2, which is the distance from the second joint axis to the end of the second link body furthest away from the second joint axis in the radial direction toward the first joint axis, is the allowable direction dimension (B− L0-E) is set to be more than 1/2 of the allowable dimension (B-L0-E) and below.

  In the state where the second link body is overlapped with the first link body with respect to the turning axis direction and the turning axis line and the second joint axis line coincide with each other, the distance to the end of the second link body farthest from the turning axis line is The allowable dimension (B-L0-E) or less. Therefore, in a state where the turning axis and the second joint axis coincide with each other, it is possible to prevent a part of the second link body from entering the movable region of the hoop opener. Further, the second link distance L2 is set to be less than the allowable dimension (B-L0-E) and is made as large as possible to prevent interference between the front wall and the hoop opener and the second link body, The other end portion of the second link body can be moved to positions apart on both sides in the direction, and the operating range of the second link body can be increased.

  Further, by making the first inter-axis distance L11 and the second inter-axis distance L12 the same, the angular displacement around the turning axis of the first link body is around the first angular displacement axis of the second link body. By doubling the angular displacement of the second link body, the other end portion of the second link body can be translated in the left-right direction, and the arm body can be easily controlled. Here, the same includes substantially the same state, and includes the same and substantially the same state.

  The second link distance L2 exceeds 1/2 of the front-rear direction dimension B of the preparation space and is set to the allowable dimension (B-L0-E) or less. Accordingly, the second link body is prevented from interfering with the front wall and the hoop opener by overlapping the first link body and the second link body to bring the robot arm into a minimum deformation state. The link length can be increased. By enlarging the second link body, the third link body can be disposed at a position away from the turning axis in the left-right direction, and the movable region of the robot can be expanded in the left-right direction.

  (4) Third link distance, which is a distance from the second joint axis to the end of the third link body or the wafer portion that is furthest away from the second joint axis in the radial direction in a state where the robot hand holds the wafer. L3 is set to be more than 1/2 of the allowable dimension (B-L0-E) and not more than the allowable dimension (B-L0-E).

  In the state where the first to third link bodies are overlapped with each other with respect to the turning axis direction, and the turning axis line and the second joint axis line coincide with each other, the distance to the end of the third link body furthest away from the turning axis line is It becomes below permissible dimension (B-L0-E). Therefore, in a state where the pivot axis and the second joint axis coincide with each other, a part of the third link body or a part of the wafer held by the third link is prevented from entering the movable region of the hoop opener. Can do. Further, the third link distance L3 is set to be equal to or smaller than the allowable dimension (B-L0-E) and is made as large as possible to prevent interference between the front wall and the hoop opener and the third link body, The other end portion of the third link body can be moved to positions apart on both sides in the direction, and the operating range of the third link body can be increased.

  The third link distance L2 is set to exceed 1/2 of the front-rear direction dimension B of the preparation space and equal to or less than the allowable dimension (B-L0-E). Thereby, the first to third links are overlapped, and the robot arm is brought into the minimum deformation state, thereby preventing the third link body from interfering with the front wall and the hoop opener, and the link length of the third link body. The thickness can be increased. By enlarging the third link body, the wafer held by the third link body can be disposed at a position away from the turning axis in the left-right direction, and the movable area of the robot can be expanded in the left-right direction. it can.

  (5) The wafer transfer apparatus, wherein the first link distance L1, the second link distance L2, and the third link distance L3 are set to be the same as the allowable dimension (B-L0-E).

  The first to third link distances L1 to L3 are set to be the same as the allowable dimension (B-L0-E). Accordingly, when the robot arm is in the minimum deformation state, it is possible to prevent each link body from coming into contact with the front wall and the hoop opener. Here, the same includes substantially the same state, and includes the same and substantially the same state. In addition, since the length of each link body is set to the maximum while preventing interference, the operation range of the robot arm can be increased in the left-right direction. Thus, even when the front side opening and the back side opening are formed at positions separated in the left-right direction, the wafer can be carried in and out by the robot arm.

  The first to third link distances L1 to L3 are set to be the same as the allowable dimension (B-L0-E). Accordingly, when the robot arm is in the minimum deformation state, it is possible to prevent each link body from coming into contact with the front wall and the hoop opener. Moreover, since the length of each link body can be increased as much as possible, the operation range of the robot arm can be increased in the left-right direction. Thus, even when the front side opening and the back side opening are formed at positions separated in the left-right direction, the wafer can be carried in and out by the robot arm.

(6) The preparation space forming part is formed with four front side openings arranged in the left-right direction perpendicular to the front-rear direction and the turning axis direction,
A wafer transfer apparatus, wherein four hoop openers are provided to open and close each front opening.

  As described above, even when the front-rear direction dimension B of the preparation space is small, the movement range of the robot arm in the left-right direction can be increased. Thus, even when four hoop openers are provided, the wafer is not attached to the substrate container mounted on each hoop opener without providing the robot with a traveling axis and without increasing the number of links of the robot arm. The wafer can be carried in and out of the processing apparatus.

  As described above, even when the front-rear direction dimension B of the preparation space is small, the movement range of the robot arm in the left-right direction can be increased. Thus, even when four hoop openers are provided, the wafer is not attached to the substrate container mounted on each hoop opener without providing the robot with a traveling axis and without increasing the number of links of the robot arm. The wafer can be carried in and out of the processing apparatus. By providing four hoop openers, it is possible to perform in parallel the transfer and detachment operations of the substrate container with respect to the wafer transfer device and the transfer operation of the wafer in the substrate container held by the wafer transfer device. , Work efficiency can be improved.

(7) A substrate transfer apparatus that carries in and out a substrate in a preparatory space filled with an atmospheric gas that is adjusted in advance with respect to the substrate processing apparatus that performs substrate processing,
A preparation for defining the preparation space and having a front wall and a back wall arranged at predetermined intervals in the front-rear direction, the first entrance being formed in the front wall, and the second entrance being formed in the back wall A space forming section;
Opening and closing means for opening and closing the first doorway of the preparation space forming unit;
A substrate transfer robot disposed in the preparation space and transferring a substrate across the first doorway and the second doorway;
The substrate transfer robot
A base that is fixed to the preparation space forming section and has a predetermined turning axis set;
A first link body having one end connected to a base and configured to be angularly displaceable about the swivel axis, wherein a first joint axis parallel to the swivel axis is set;
A second link body having one end connected to the other end of the first link body, configured to be angularly displaceable about the first joint axis, and having a second joint axis parallel to the pivot axis; ,
One or more first links are connected to the other end of the second link body and configured to be angularly displaceable about the second joint axis, and a robot hand that holds the substrate is formed at the other end. 3 link bodies,
Drive means for individually driving the angular displacement of each link body around the corresponding joint axis,
The pivot axis is arranged on the other side of the preparation space in the front-rear direction,
The first link distance L1, which is the distance from the turning axis to the end of the first link body that is furthest away from the turning axis in the radial direction toward the first joint axis, is the front wall and the rear wall of the preparation space forming part. The value obtained by subtracting the longitudinal distance L0 from the back wall of the preparation space forming portion to the turning axis from the longitudinal dimension B of the preparation space, exceeding 1/2 of the longitudinal dimension B of the preparation space, which is the dimension between (B−L0) A substrate transfer apparatus characterized in that the following is set (B / 2 <L1 ≦ B−L0).

  The minimum turning radius R of the robot arm of the wafer transfer device exceeds 1/2 of the front-rear direction dimension B of the preparation space, so that the minimum turning radius R of the robot arm is increased as compared with the first and second conventional techniques. be able to. In addition, by setting the minimum turning radius R of the robot arm to be equal to or less than the subtraction value (B−L0), a gap can be formed between the robot arm in the minimum deformation state and the front wall. And the front wall can be prevented from interfering with each other.

  Accordingly, even if the front-rear direction dimension B of the preparation space is small, the link length of the link body of the robot arm can be increased, and the robot arm can be prevented from interfering with the front wall. Therefore, the operation range of the robot arm can be increased. In particular, the movement range of the robot arm can be increased in the left-right direction perpendicular to the front-rear direction and the turning axis direction. This eliminates the need for traveling means and prevents the number of link bodies from increasing undesirably.

  The minimum turning radius R of the robot arm is set to the above relationship (B / 2 <R ≦ B−L0). As a result, the robot arm can be prevented from interfering with the front wall, and the link length of the link body of the robot arm can be increased. Further, by limiting the angular displacement operation region of the robot arm to less than 360 °, for example, about 180 °, it is possible to prevent the robot arm from interfering with the back wall.

  As a result, traveling means for driving the robot in the left-right direction is unnecessary, dust generated by the traveling means can be prevented, and a reduction in cleanliness of the preparation space can be prevented. Further, the number of links required for the robot arm can be reduced, and the structure of the robot can be simplified. Further, the redundancy of the robot can be reduced, and the possibility that the robot arm collides with the preparation space forming unit can be reduced.

  As described above, according to the present invention, it is possible to suppress the scattering of dust due to the necessity of the traveling means, and it is possible to prevent the interference in the substrate transfer apparatus by suppressing the increase in the number of links. A substrate transfer apparatus including a substrate transfer robot that can be easily controlled can be provided. The substrate transfer device may be a substrate processed in a predetermined adjustment space in addition to a semiconductor wafer, and may be another substrate such as a glass substrate.

It is a top view which shows a part of semiconductor processing equipment 20 provided with the wafer transfer apparatus 23 with which the substrate conveying method which is 1st Embodiment of this invention is implemented. FIG. 3 is a cross-sectional view showing a part of the semiconductor processing equipment 20 by cutting. It is a top view which simplifies and shows the wafer transfer apparatus 23 in order to demonstrate the length of each link body 41a-41c. It is a figure which simplifies and shows the conveyance operation | movement until the wafer 24 accommodated in the 1st hoop 25a is conveyed to the aligner 56. FIG. FIG. 6 is a diagram showing a simplified transfer operation until a wafer 24 supported by an aligner 56 is transferred to a processing space 30. It is a figure which simplifies and shows the conveyance operation | movement until the wafer 24 arrange | positioned in the process space 30 is accommodated in the 1st hoop 25a. It is a figure which shows the state which has arrange | positioned the wafer 24 in the reception and delivery position of the wafer 24 of this Embodiment. The hoop opener 26 is a plan view showing three wafer transfer devices 23. The hoop opener 26 is a plan view showing two wafer transfer devices 23. It is a top view which simplifies and shows the wafer transfer apparatus 23A with which the board | substrate conveyance method of 2nd Embodiment of this invention is implemented. It is a top view which simplifies and shows the wafer transfer apparatus 23B with which the board | substrate conveyance method of 3rd Embodiment of this invention is implemented. It is a top view which shows 20C of semiconductor processing apparatuses with which the board | substrate conveyance method of 4th Embodiment of this invention is enforced. It is sectional drawing which cut | disconnects and shows a part of semiconductor processing equipment 1 in which the board | substrate conveyance method of a prior art is implemented. It is a top view which cut | disconnects and shows a part of 1 A of semiconductor processing equipment with which the board | substrate conveyance method of 1st prior art is implemented. It is a top view which cut | disconnects and shows a part of semiconductor processing equipment 1B with which the board | substrate conveyance method of a 2nd prior art is implemented.

DESCRIPTION OF SYMBOLS 20 Semiconductor processing equipment 22 Wafer processing apparatus 23 Wafer transfer apparatus 24 Semiconductor wafer 25 Hoop 26 Hoop opener 27 Wafer transfer robot 28 Preparation space formation part 41 Robot arm 41a 1st link body 42b 2nd link body 41c 3rd link body 43 base Table 110 Front wall 111 Rear wall 120 Front side opening 121 Rear side opening R Minimum turning radius A0 Rotating axis A1 First joint axis A2 Second joint axis

Claims (8)

(A) A substrate processing apparatus that performs substrate processing is loaded and unloaded in a horizontally long preparation space that is filled with an atmospheric gas that is adjusted in advance and that is longer in the left-right direction perpendicular to the front-rear direction than in the front-rear direction. A substrate transfer method,
(B) The preparation space is defined and has a front wall and a back wall that are spaced apart in a predetermined front-rear direction, a plurality of first entrances are formed on the front wall, and the preparation space is formed on the back wall. And a preparation space forming portion in which a second doorway communicating with the processing space adjacent to the preparation space is formed,
(C) opening and closing means for opening and closing each first doorway of the preparation space forming unit;
(D) A substrate transfer robot that is arranged in a preparation space and transfers a substrate across each of the first doorway and the second doorway,
(D1) a base fixed to the preparation space forming part;
(D2) a first link body having one end connected to the base, configured to be angularly displaceable about the swivel axis, and having a first joint axis parallel to the swivel axis;
(D3) The second link is configured such that one end is connected to the other end of the first link body, and the second joint axis is configured to be angularly displaceable about the first joint axis and parallel to the turning axis. Link body,
(D4) One or a plurality of third ones having one end connected to the other end of the second link body so as to be angularly displaceable about the second joint axis, and the robot hand being provided at the other end. Link body,
(D5) a robot arm that grips a substrate in a substrate container provided on a front wall by the robot hand and pivots around a pivot axis in the preparation space and conveys the substrate from the second entrance to the processing space;
(D6) preparing a substrate transfer robot including a driving unit that individually drives each link body around the corresponding joint axis by angular displacement;
(E) The first link distance L1, which is the distance from the turning axis to the end of the first link body that is farthest in the radial direction toward the first joint axis with respect to the turning axis, is the front wall of the preparation space forming portion. The front-rear direction dimension B of the preparation space between the rear wall and the front-rear direction dimension B exceeds 1/2 and the radial dimension T2 of the circumferential surface around the pivot axis of the first link body and the robot The front-rear direction dimension L0 (= T2 + Q), which is the sum of predetermined gap dimensions Q to prevent interference, and the front-rear robot entry prohibition area dimension E from the front wall to the rear wall set by the opening / closing means are subtracted. Substrate transport method characterized by being set to a value (B−L0−E) or less (B / 2 <L1 ≦ B−L0−E) . The first inter-axis distance L11 from the turning axis to the first joint axis and the second inter-axis distance L12 from the first joint axis to the second joint axis are set to be the same,
The second link distance L2, which is the distance from the second joint axis to the end of the second link body that is farthest in the direction toward the first joint axis with respect to the second joint axis, is the allowable dimension (B-L0). The substrate transport method according to claim 1, wherein the substrate transport method is set to be less than the allowable dimension (B−L0−E) exceeding 1/2 of −E).   A third link distance L3 that is a distance from the second joint axis line to the end of the third link body or the board portion that is farthest in the radial direction with respect to the second joint axis line when the board is held by the robot hand. 3. The substrate transfer method according to claim 2, wherein the substrate transport method is set to be more than 1/2 of the allowable dimension (B-L0-E) and equal to or less than the allowable dimension (B-L0-E).   4. The substrate transfer method according to claim 3, wherein the first link distance L1, the second link distance L2, and the third link distance L3 are set to be the same as the allowable dimension (B-L0-E).   5. The substrate transfer method according to claim 1, wherein the first link body and the second link body are angularly displaced about an angular displacement axis, and the third link body is translated in the left-right direction. .   The robot hand is made to reach the substrate in the substrate container with the longitudinal direction of the third link body aligned with the front-rear direction, and the third link body is translated into the preparation space by moving in parallel in the front-rear direction. The substrate carrying method according to any one of claims 1 to 5.   4. The substrate held by the robot hand is transported in the preparation space by moving in the left-right direction with the longitudinal direction of the third link body substantially parallel to the front-rear direction. The board | substrate conveyance method as described in any one.   8. The method according to claim 1, wherein the substrate is transferred into the processing space by allowing the first to third link bodies to enter the processing space from a state where the substrate is held by the robot hand in the preparation space. The board | substrate conveyance method as described in any one.