JP2008097271A - Optical information reader - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical information reader which can make a mounting area small while having an imaging lens and a light receiving sensor. <P>SOLUTION: An imaging lens unit 50 is mounted on a mounting board 15 by abutting a boss section 56 extending downward of the imaging lens unit 50 to a mounting board 15 and inserting a lead 23i of a light receiving sensor 23 housed in an accommodation section 54i of an imaging lens unit 50 to a through hole 15s of the mounting board 15 concerned. Namely, since a rear face of the light receiving sensor 23 is apart from the mounting board 15 with the boss section 56, parts can be arranged between the mounting board 15 and the rear face of the light receiving sensor 23, and the mounting area can be increased. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an optical information reading apparatus that reads a one-dimensional information code such as a barcode and a two-dimensional information code such as a QR code (registered trademark).

In recent years, due to the downsizing of optical information readers, there is a problem that the area of a substrate to be incorporated is reduced, the mounting area of components is reduced, and components cannot be mounted. In particular, unlike a C-MOS sensor, a dedicated power source, timing generator, amplifier, and the like must be mounted on a CCD area sensor substrate, making it difficult to mount on a miniaturized optical information reader.

In this case, for example, in Patent Document 1, the line sensor usually has legs (leads) on both sides of the package, and the mounting area of the substrate is reduced by mounting the leads in a line on one side.

Further, in Patent Document 2, the lead of the four corners in the lead of the CCD area sensor is used for fixing the position of the substrate and the sensor, the remaining lead is bent, and the excess lead is cut, so that the opposite surface of the sensor Other than the fixing four-corner leads protruding in the area, it can be used as a mountable area.
Japanese Patent Laid-Open No. 7-2106 JP-A-11-284164

However, in the technique of Patent Document 1, since the image sensor is erected by standing one row on one side, the stability is poor, and a base is required for actual use, and the base takes up a mounting area. . Furthermore, the attachment of such an image sensor is unavoidable, and increases the cost.

Further, in the method of the cited document 2, screws are used to fix the position of the sensor and the housing of the imaging lens, and the mounting area of the sensor surface is taken by the housing of the imaging lens. In the mounting process, it is necessary to bend and cut the sensor leads.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an optical information reading apparatus that can reduce the mounting area while including an imaging lens and a light receiving sensor. is there.

In order to achieve the above object, the invention of claim 1 is directed to a light receiving sensor 23 having a lead 23i, an imaging lens 27 for connecting an image to be imaged on the light receiving sensor 23, and a mounting for mounting the light receiving sensor 23. In an optical information reading device comprising a substrate 15,
A U-shaped leaf spring 60 comprising a pair of side plates 60a and a bottom plate 60b for holding the light receiving sensor 23, the leaf spring 60 having an opening 60c formed in the pair of side plates 60a;
An imaging lens unit 50 for holding the imaging lens 27, and a lower accommodation portion 54i configured to connect the image to be imaged by accommodating the light receiving sensor 23, and is erected from the lower end. An imaging lens unit 50 that includes a side wall 54a, an engagement piece 58 that extends laterally from the side wall 54a, and a boss portion 56 that extends downward from the lower end;
In a state where the light receiving sensor 23 is housed in the housing portion 54 i of the imaging lens unit 50, the light receiving sensor 23 is brought into contact with the bottom plate 60 b of the plate spring 60, and the opening 60 c of the side plate 60 a of the plate spring 60. Is engaged with the engagement piece 58 of the side wall 54a, the light receiving sensor 23 is held by the imaging lens unit 50 by the leaf spring 60,
The boss portion 56 of the imaging lens unit 50 is brought into contact with the mounting substrate 15, and the lead 23 i of the light receiving sensor 23 is inserted into the through hole 15 s of the mounting substrate 15, whereby the imaging lens unit 50. Is mounted on the mounting substrate 15 as a technical feature.

In the optical information reading device according to the first aspect, the boss portion 56 extending downward of the imaging lens unit 50 is brought into contact with the mounting substrate 15, and the light receiving sensor 23 accommodated in the accommodating portion 54 i of the imaging lens unit 50. The imaging lens unit 50 is mounted on the mounting substrate 15 by inserting the lead 23 i into the through hole 15 s of the mounting substrate 15. That is, since the back surface of the light receiving sensor 23 is separated from the mounting substrate 15 by the boss portion 56, components can be arranged between the mounting substrate 15 and the back surface of the light receiving sensor 23, and the mounting area is increased. Can be made. In particular, the bypass capacitor 28 can be disposed immediately below the light receiving sensor 23, and thus noise can be effectively reduced.
Furthermore, since the light receiving sensor 23 is attached to the imaging lens unit 50 by the leaf spring 60 which is an elastic member, the reliability against vibration and dropping can be improved. Since the imaging lens unit 50 is positioned on the mounting substrate 15 by bringing a boss 56 extending downward of the imaging lens unit 50 holding the light receiving sensor 23 into contact with the mounting substrate 15, the mounting substrate 15 And the light receiving sensor 23 can be kept parallel, and there is no need to use a special jig for mounting the light receiving sensor 23.

Further, the invention of claim 2 includes a plurality of light receiving sensors 23A and 23B having leads 23i, a plurality of imaging lenses 27A and 27B for connecting images to be imaged on the light receiving sensors 23A and 23B, and the light receiving sensor 23A. , 23B, an optical information reading device comprising a mounting substrate 15 for mounting,
A U-shaped leaf spring 60 composed of a pair of side plates 60a and a bottom plate 60b for holding the plurality of light receiving sensors 23A, 23B, one sheet having an opening 60c formed in the pair of side plates 60a. Leaf spring 60 of
One imaging lens unit 50 that holds the plurality of imaging lenses 27A and 27B, and is configured to connect the plurality of light receiving sensors 23A and 23B to connect the images to be imaged. A plurality of accommodating portions 54i, a side wall 54a standing from the lower end, an engagement piece 58 extending laterally from the side wall 54a, and a boss portion 56 extending downward from the lower end. A lens unit 50, and
In a state where the light receiving sensors 23A and 23B are accommodated in the plurality of accommodating portions 54i of the imaging lens unit 50, the light receiving sensors 23A and 23B are brought into contact with the bottom plate 60b of the leaf spring 60, respectively. By engaging the opening 60c of the side plate 60a with the engaging piece 58 of the side wall 54a, the light receiving sensors 23A and 23B are held by the imaging lens unit 50 by the single leaf spring 60,
The boss portion 56 of the imaging lens unit 50 is brought into contact with the mounting substrate 15, and the leads 23 i of the plurality of light receiving sensors 23 A and 23 B are inserted into the through holes 15 s of the mounting substrate 15. A technical feature is that the image lens unit 50 is mounted on the mounting substrate 15.

In the optical information reading device according to claim 2, the boss portion 56 extending downward of the imaging lens unit 50 is brought into contact with the mounting substrate 15, and the light reception accommodated in the plurality of accommodation portions 54 i of the imaging lens unit 50. The imaging lens unit 50 is mounted on the mounting substrate 15 by inserting the leads 23i of the sensors 23A and 23B into the through holes 15s of the mounting substrate 15. That is, since the back surfaces of the light receiving sensors 23A and 23B are separated from the mounting substrate 15 by the boss portion 56, components can be disposed between the mounting substrate 15 and the back surfaces of the light receiving sensors 23A and 23B. The mounting area can be increased. In particular, the bypass capacitor 28 can be disposed immediately below the light receiving sensors 23A and 23B, and thus noise can be effectively reduced. In addition, since the plurality of light receiving sensors 23A and 23B are accommodated in one imaging lens unit 50, the area occupied by the light receiving sensors 23A and 23B can be reduced.
Furthermore, since the plurality of light receiving sensors 23A and 23B are attached to the imaging lens unit 50 with a single leaf spring 60, which is an elastic member, reliability against vibration and dropping can be improved. Since the imaging lens unit 50 is positioned on the mounting substrate 15 by bringing the boss portion 56 extending downward of the imaging lens unit 50 holding the light receiving sensors 23A and 23B into contact with the mounting substrate 15, the mounting lens 15 is mounted. The substrate 15 and the light receiving sensors 23A and 23B can be kept parallel, and it is not necessary to use a special jig for mounting the light receiving sensors 23A and 23B. Since the plurality of light receiving sensors 23A and 23B are accommodated in one imaging lens unit 50 and mounted on the mounting substrate 15, the mounting process of the light receiving sensors 23A and 23B can be reduced.

According to the third aspect, since the engaging piece 58 of the imaging lens unit 50 has an inverted triangular cross section, the end of the side plate 60a of the U-shaped leaf spring 60 can easily get over the engaging piece 58. The light receiving sensor 23 can be easily fixed by the leaf spring 60.

In the fourth aspect, since the lead 23i of the SOP type light receiving sensor 23 is formed downward, the lead 23i can be inserted into the through hole 15s of the mounting board 15.

[First embodiment]
Hereinafter, an embodiment in which a portable terminal of the present invention is applied to an information code reader will be described with reference to the drawings. First, a configuration outline of the information code reading device 10 according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a partial longitudinal sectional view showing an outline of the configuration of a housing and the like of an information code reading device, and FIG. 2 is a block diagram showing an outline of the configuration of a circuit portion of the information code reading device.

As shown in FIG. 1, an information code reader 10 that reads a QR code Q mainly includes a housing 11 that has a vertically long, substantially rectangular box shape. The housing 11 is a molded part made of a synthetic resin such as ABS resin, and has a reading port 11a on one end side thereof. The reading port 11a is an opening through which incident light incident on a light receiving sensor 23 of the circuit unit 20 described later can be introduced. A secondary battery 49 is accommodated on the other end side of the housing 11. An opening to which the liquid crystal display 46 can be attached is also formed on the surface side of the housing 11. A circuit unit 20 described later is accommodated in the housing 11. In FIG. 1, printed wiring boards (mounting boards) 15 and 16 constituting the circuit unit 20 are shown.

As shown in FIG. 2, the circuit unit 20 mainly includes an optical system such as a red light emitting diode 21, a condensing lens 22, a light receiving sensor 23, and an imaging lens 27, a memory 35, a control circuit 40, an operation switch 12, 14, a microcomputer (hereinafter referred to as “microcomputer”) system such as a liquid crystal display 46, and a power system such as a power switch 41, a battery 49, and a power circuit 39, and the mounting boards 15 and 16 described above. Or mounted inside the housing 11.

The red light emitting diode 21 constituting the optical system functions as a light irradiator capable of irradiating the illumination light Lf, and is condensed by a condensing lens 22 in which a diffusion lens and a convex lens are combined. In the present embodiment, red light emitting diodes 21 are provided on both sides of the light receiving sensor 23, and the illumination light Lf can be irradiated toward the QR code Q to be read through the reading port 11a of the housing 11. ing.

The light receiving sensor 23 is configured so as to be able to receive the reflected light Lr irradiated and reflected by the QR code Q through the imaging lens 27. For example, the light receiving sensor 23 is a two-dimensional structure composed of a solid-state imaging device such as a C-MOS or CCD. Consists of an image sensor. A bypass capacitor 28 is connected to a power supply line that supplies power to the light receiving sensor 23 to prevent noise from being superimposed on the power supply line.

The imaging lens 27 is an imaging optical system that allows incident light incident from the outside through the reading port 11 a to collect the light reflected by the reflecting mirror 26 and form an image on the light receiving surface of the light receiving sensor 23. It functions as. As shown in FIG. 1, the imaging lens 27 is accommodated in the lens barrel 52 of the imaging lens unit 50, and the light receiving sensor 23 is accommodated at the lower end of the imaging lens unit 50. A bypass capacitor 28 that prevents noise from being superimposed from the power supply line is mounted on the substrate 15 immediately below the light receiving sensor 23.

An outline of the configuration of the microcomputer system will be described. The microcomputer system includes an amplification circuit 31, an A / D conversion circuit 33, a memory 35, an address generation circuit 36, a synchronization signal generation circuit 38, a control circuit 40, operation switches 12, 14, an LED 43, a buzzer 44, a liquid crystal display 46, a communication. It consists of an interface 48 and the like.

An image signal (analog signal) output from the light receiving sensor 23 of the optical system is input to the amplification circuit 31 and amplified by a predetermined gain, and then input to the A / D conversion circuit 33. Converted into a digital signal. The digitized image signal, that is, image data (image information) is input to the memory 35 and stored. The synchronization signal generation circuit 38 is configured to generate a synchronization signal for the light receiving sensor 23 and the address generation circuit 36. The address generation circuit 36 is based on the synchronization signal supplied from the synchronization signal generation circuit 38. Thus, the storage address of the image data stored in the memory 35 can be generated.

The control circuit 40 is a microcomputer capable of controlling the entire information code reading device 10 and includes a CPU, a system bus, an input / output interface, and the like. The control circuit 40 can constitute an information processing device together with the memory 35 and has an information processing function. The control circuit 40 is configured to be connectable to various input / output devices (peripheral devices) via a built-in input / output interface. The communication interface 48 is configured to transfer the read data.

Next, the configuration of the imaging lens unit 50 will be described with reference to FIGS. 3A is an explanatory diagram for attaching the imaging lens unit 50 to the substrate 15, FIG. 3B is a front view showing a mounting state, and FIG. 3C is a mounting on the substrate 15. It is explanatory drawing which shows an area | region. 4A is a front view of the imaging lens unit 50, FIG. 4B is a side view, and FIG. 4C is a top view. FIG. 4D is a front view of the light receiving sensor 23.

The imaging lens unit 50 is made of resin and includes a cylindrical lens barrel 52 that houses the imaging lens 27 therein, and a cubic base 54. As shown in FIG. 4A, the base 54 has a concave receiving portion 54i formed at the lower end of the base so as to connect the image to be imaged by receiving the light receiving sensor, and a side from the side wall 54a of the base 54. An engagement piece 58 having an inverted triangular cross section extending to the bottom and a cubic boss 56 extending downward from the lower end are formed. A pair of engagement pieces 58 are provided on both sides of the base portion 54, and a pair of boss portions 56 are also provided on the diagonal line of the base portion 54.

FIG. 5A shows a top view, a front view, and a side view of the light receiving sensor 23 in FIG. The light receiving sensor is a DIP type, and a lead 23i extending downward is formed.

FIG. 3A shows a plate spring 60 for fixing the light receiving sensor 23 to the housing portion 54 i of the imaging lens unit 50. The leaf spring 60 is formed by forming an elastic metal into a U-shape comprising a pair of side plates 60a and a bottom plate 60b that are slightly inclined inward. As shown in a side view in FIG. 3A, the side plate 60a is formed with an opening 60c through which the engaging piece 58 on the imaging lens unit side is inserted and engaged.

The light receiving sensor 23 is assembled to the imaging lens unit 50 in a state where the light receiving sensor 23 is accommodated in the accommodating portion 54i and the leaf spring 60 is fitted and the upper surface of the bottom plate 60b of the leaf spring 60 is brought into contact with the lower surface of the light receiving sensor 23. The side plate 60a sandwiches the side wall 54a of the base 54, and the engagement piece 58 is engaged with the opening 60c of the side plate 60a. Here, since the engagement piece 58 of the imaging lens unit 50 has an inverted triangular cross section, the upper end portion of the side plate 60a of the U-shaped leaf spring 60 can easily get over the engagement piece 58. The light receiving sensor 23 can be fixed by the leaf spring 60.

As shown in FIG. 3B, the lead 23i of the light receiving sensor 23 is mounted on the substrate 15 so that the lower end of the boss portion 56 of the imaging lens unit is brought into contact with the substrate 15. This is done by inserting the through hole 15 s formed in 15 and fixing with solder or the like. FIG. 3C shows the mounting area 15 a of the substrate 15. Here, only the portion where the lower end of the boss portion 56 is in contact with the substrate 15 is the mounting region 15a, which is a portion where other components cannot be mounted.

In the optical information reading device, a boss 56 extending downward from the imaging lens unit 50 is brought into contact with the mounting substrate 15, and the lead 23 i of the light receiving sensor 23 accommodated in the accommodation portion 54 i of the imaging lens unit 50 is attached. The imaging lens unit 50 is mounted on the mounting substrate 15 by being inserted into the through hole 15 s of the mounting substrate 15. That is, since the back surface of the light receiving sensor 23 is separated from the mounting substrate 15 by the boss portion 56, components can be disposed between the top surface of the mounting substrate 15 and the back surface of the light receiving sensor 23. (Other than the mounting region 15a where the boss portion 56 shown in FIG. 3C abuts can be mounted) In particular, as shown in FIG. 1, the bypass capacitor 28 is placed directly under the light receiving sensor 23. It becomes possible to arrange | position and this can reduce noise effectively.

Furthermore, since the light receiving sensor 23 is attached to the imaging lens unit 50 by the leaf spring 60 which is an elastic member, the reliability against vibration and dropping can be improved. Since the imaging lens unit 50 is positioned on the mounting substrate 15 by bringing a boss 56 extending downward of the imaging lens unit 50 holding the light receiving sensor 23 into contact with the mounting substrate 15, the mounting substrate 15 And the light receiving sensor 23 can be kept parallel, and there is no need to use a special jig for mounting the light receiving sensor 23.

FIG. 5B is a top view, a front view, and a side view of the SOP type light receiving sensor. In the case of the DIP type light receiving sensor described above with reference to FIG. 5A, it is not necessary to form the lead 23i. In the case of the SOP type light receiving sensor, the lead 23i of the SOP type light receiving sensor shown in FIG. 5 (C) is formed so as to face downward as shown in FIG. 5 (D) and can be connected to the substrate 15. It is necessary to.

[Second Embodiment]
The second embodiment will be described below with reference to FIGS. In the first embodiment, one light receiving sensor is provided. On the other hand, in the second embodiment, two light receiving sensors are provided. FIG. 6 is a block diagram illustrating a schematic configuration of a circuit unit of the optical information reading apparatus.

In the optical information reading apparatus of the second embodiment, an amplifier circuit 31A, an A / D conversion circuit 33A, an address generation circuit 36A, and a synchronization signal generation circuit 38A are provided for the first light receiving sensor 23A. In addition, an amplification circuit 31B, an A / D conversion circuit 33B, an address generation circuit 36B, and a synchronization signal generation circuit 38B are provided for the second light receiving sensor 23B.

As shown in FIG. 7, the first light receiving sensor 23 </ b> A and the second light receiving sensor 23 </ b> B, the first light receiving sensor imaging lens 27 </ b> A, and the second light receiving sensor imaging lens 27 </ b> B are provided as one imaging lens unit 50. Is housed in. In the imaging lens unit 50, the center axis of the imaging area of the first light receiving sensor 23A and the second light receiving sensor 23B and the center axis of the imaging lenses 27A and 27B are assembled to be shifted, and the two light receiving sensors 23A, The 23B imaging areas are arranged so as to overlap at a certain distance D1 as shown in the figure. Since the two light receiving sensors 23A and 23B capture images simultaneously, the QR code Q image has the same size. Here, by using the two light receiving sensors 23A and 23B, it is possible to select a clear image, and it is possible to cope with specular reflection or the like.

Next, the configuration of the imaging lens unit 50 according to the second embodiment will be described with reference to FIG. 8A is a front view, a side view, and a top view of the imaging lens unit 50, and FIG. 8B is a front view and a side view of the leaf spring 60. 8C is a cross-sectional view of a state in which the light receiving sensor 23A is accommodated in the imaging lens unit 50, and FIG. 8D is a side view of a state in which the light receiving sensor 23A is accommodated in the imaging lens unit 50. FIG. 8E is a cross-sectional view of the imaging lens unit 50 in which the light receiving sensors 23A and 23B are accommodated.

The imaging lens unit 50 is made of resin and includes cylindrical lens barrels 52A and 52B that accommodate the imaging lenses 27A and 27B therein, and a cubic base 54. As shown in FIG. 8 (E), the base 54 has a pair of receiving portions 54i configured to connect the images to be captured by receiving the light receiving sensors 23A and 23B, and a side from the side wall 54a of the base 54. An engagement piece 58 having an inverted triangular cross section extending in the direction and a cubic boss portion 56 extending downward from the lower end are formed. A pair of engagement pieces 58 are provided on both sides of the base portion 54, and a pair of boss portions 56 are also provided on the diagonal line of the base portion 4.

FIG. 8B shows a leaf spring 60 for fixing the first and second light receiving sensors 23A and 23B to the housing portion 54i of the imaging lens unit 50. The leaf spring 60 is formed by forming an elastic metal into a U-shape comprising a pair of side plates 60a and a bottom plate 60b that are slightly inclined inward. As shown in the side view in FIG. 8B, the side plate 60a is formed with an opening 60c through which the engaging piece 58 on the imaging lens unit side is inserted and engaged.

The light receiving sensor 23 is assembled to the imaging lens unit 50 in a state where the light receiving sensors 23A and 23B are accommodated in the pair of accommodating portions 54i, respectively, and the plate spring 60 is fitted, and the upper surface of the bottom plate 60b of the plate spring 60 is received by the light receiving sensor. 23A and 23B are brought into contact with each other, the side plate 60a sandwiches the side wall 54a of the base 54, and the engagement piece 58 is engaged with the opening 60c of the side plate 60a.

In the optical information reading device of the second embodiment, the boss portion 56 extending downward from the imaging lens unit 50 is brought into contact with the mounting substrate 15 and is accommodated in the plurality of accommodation portions 54 i of the imaging lens unit 50. The imaging lens unit 50 is mounted on the mounting board 15 by inserting the leads 23 i of the light receiving sensors 23 </ b> A and 23 </ b> B into the through holes 15 s of the mounting board 15. That is, since the back surfaces of the light receiving sensors 23A and 23B are separated from the mounting substrate 15 by the boss portion 56, components can be disposed between the mounting substrate 15 and the back surfaces of the light receiving sensors 23A and 23B. The mounting area can be increased. In particular, the bypass capacitor 28 (see FIG. 6) can be disposed immediately below the light receiving sensors 23A and 23B, thereby effectively reducing noise. Further, since the plurality of light receiving sensors 23A and 23B are accommodated in one imaging lens unit 50, the area occupied by the light receiving sensors 23A and 23B can be reduced.

Furthermore, since the plurality of light receiving sensors 23A and 23B are attached to the imaging lens unit 50 with a single leaf spring 60, which is an elastic member, reliability against vibration and dropping can be improved. Since the imaging lens unit 50 is positioned on the mounting substrate 15 by bringing the boss portion 56 extending downward of the imaging lens unit 50 holding the light receiving sensors 23A and 23B into contact with the mounting substrate 15, the mounting lens 15 is mounted. The substrate 15 and the light receiving sensors 23A and 23B can be kept parallel, and it is not necessary to use a special jig for mounting the light receiving sensors 23A and 23B. Since the plurality of light receiving sensors 23A and 23B are accommodated in one imaging lens unit 50 and mounted on the mounting substrate 15, the mounting process of the light receiving sensors 23A and 23B can be reduced.

In the first and second embodiments described above, two boss portions 56 (one pair) are provided, but four boss portions (two pairs) may be provided.

1 is a cross-sectional view of an optical information reading device according to a first embodiment of the present invention. It is a block diagram which shows the circuit structure of the optical information reader shown in FIG. 3A is an explanatory diagram for attaching the imaging lens unit to the substrate, FIG. 3B is a front view showing a mounting state, and FIG. 3C shows a mounting region on the substrate. It is explanatory drawing. 4A is a front view of the imaging lens unit, FIG. 4B is a side view, and FIG. 4C is a top view. FIG. 4D is a front view of the light receiving sensor. 5A is a top view, a front view, and a side view of the DIP type light receiving sensor, and FIG. 5B is a top view, a front view, and a side view of the SOP type light receiving sensor. ) Is a front view of the SOP type light receiving sensor before lead forming, and FIG. 5D is a front view of the SOP type light receiving sensor after forming. It is a block diagram which shows the circuit structure of the optical information reader of 2nd Embodiment. It is explanatory drawing which shows the overlap of the imaging area of two light receiving sensors. FIG. 8A is a front view, a side view, and a top view of the imaging lens unit, and FIG. 8B is a front view and a side view of the leaf spring. 8C is a cross-sectional view of a state where the light receiving sensor is accommodated in the imaging lens unit, and FIG. 8D is a side view of a state where the light receiving sensor is accommodated in the imaging lens unit. (E) is a cross-sectional view of a state in which the light receiving sensor is accommodated in the imaging lens unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Optical information reader 15 Mounting board 15s Through hole 23 Light receiving sensor 23A 1st light receiving sensor 23B 2nd light receiving sensor 27, 27A, 27B Imaging lens 40 CPU
DESCRIPTION OF SYMBOLS 50 Imaging lens unit 52 Lens barrel 54 Base part 54a Side wall 54i Accommodating part 56 Boss part 58 Engagement piece 60 Leaf spring 60a Side plate 60b Bottom plate 60c Opening

Claims (4)

1 for holding the light receiving sensor in an optical information reading apparatus including a light receiving sensor having a lead, an imaging lens that connects an image to be imaged on the light receiving sensor, and a mounting substrate on which the light receiving sensor is mounted. A U-shaped leaf spring comprising a pair of side plates and a bottom plate, the leaf spring having an opening formed in the pair of side plates;
An imaging lens unit for holding the imaging lens, wherein a receiving portion at a lower end configured to tie an image to be imaged by accommodating the light receiving sensor, a side wall standing from the lower end, An imaging lens unit comprising an engagement piece extending from the side wall to the side, and a boss extending downward from the lower end;
With the light receiving sensor housed in the housing portion of the imaging lens unit, the light receiving sensor is brought into contact with the bottom plate of the leaf spring, and the opening of the side plate of the leaf spring is engaged with the engagement piece on the side wall. By making the image sensor unit hold the light receiving sensor by the leaf spring,
The imaging lens unit is mounted on the mounting substrate by bringing the boss portion of the imaging lens unit into contact with the mounting substrate and inserting the lead of the light receiving sensor through the through hole of the mounting substrate. An optical information reader. In an optical information reader including a plurality of light receiving sensors having leads, a plurality of imaging lenses that connect images to be imaged on the light receiving sensors, and a mounting substrate on which the light receiving sensors are mounted.
A U-shaped leaf spring comprising a pair of side plates and a bottom plate for holding the plurality of light receiving sensors, the leaf spring having an opening formed in the pair of side plates;
A single imaging lens unit that holds the plurality of imaging lenses, and a plurality of storage portions at a lower end configured to connect the images to be imaged by storing the plurality of light receiving sensors, respectively; An imaging lens unit comprising a side wall standing from the lower end, an engagement piece extending laterally from the side wall, and a boss portion extending downward from the lower end;
In a state where the light receiving sensors are housed in the plurality of housing portions of the imaging lens unit, the light receiving sensor is brought into contact with the bottom plate of the leaf spring, and the opening of the side plate of the leaf spring is set to the engagement piece of the side wall. The light receiving sensor is held by the imaging lens unit by the single leaf spring,
The imaging lens unit is brought into contact with the mounting substrate by bringing the boss portion of the imaging lens unit into contact with the mounting substrate and inserting the leads of the plurality of light receiving sensors through the through holes of the mounting substrate. An optical information reader characterized by being mounted. The optical information reading device according to claim 1, wherein the engagement piece is configured to have an inverted triangular cross section. 4. The optical information reader according to claim 1, wherein the light receiving sensor is of an SOP type, and a lead is formed so as to be inserted into a through hole of the mounting board. .

Images