JP2008094648A - Alkaline silica-dispersed liquid and production method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an alkaline silica-dispersed liquid in which the production of coarse grains with the lapse of time is extremely little, and particularly when used as an abrasive material for a semiconductor, quality is stable over a long period, and the problem of scratches or the like can be effectively evaded, and to provide a production method therefor. <P>SOLUTION: The alkaline silica-dispersed liquid is obtained by subjecting a silica-dispersed liquid with a pH of 8 to 12 in which fumed silica is dispersed into water or water and another polar solvent to heating treatment under conditions where heating temperature (T°C) lies within the range of 40 to 100°C and heating time (t time) by the heating temperature (T°C) satisfies the following inequality (1), and the increasing rate of coarse grains of ≥0.6 μm after leaving at 25°C for one week is ≤15%: t≥2×10<SP>9</SP>T<SP>(-4.8)</SP>(1). <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a novel alkaline silica dispersion in which fumed silica is dispersed in an alkaline aqueous solution. Specifically, the generation of coarse particles over time is extremely small, especially when used as a semiconductor abrasive, the quality is stable over a long period of time, and an alkaline silica dispersion that can effectively avoid problems such as scratches A liquid and a method for producing the same are provided.

  Conventionally, a silica dispersion whose pH is adjusted to be alkaline has been used as an abrasive to polish a semiconductor wafer typified by silicon or to polish an insulating layer in an IC manufacturing process.

  In particular, a dispersion using fumed silica as silica is advantageous in terms of silica purity, and is considered useful for semiconductor wafer abrasives and IC abrasives that are required to have high purity.

  Conventionally, as an abrasive using the fumed silica, there has been proposed an abrasive made of a silica dispersion whose storage stability is improved by dispersing fumed silica with a high-pressure homogenizer (Patent Document 1).

  The abrasive can maintain the dispersed state sufficiently stably without the dispersed fumed silica particles settling for a long time. However, according to the confirmation of the present inventors, it has been found that the silica dispersion tends to increase over time in the coarse particle portion in the particle size distribution, for example, particles having a particle diameter of 0.6 μm or more. . Such coarse particles are likely to occur when the silica dispersion is adjusted to be alkaline in order to adjust the polishing rate, particularly when a silica dispersion is used as an abrasive.

  And, when the silica dispersion liquid with increased coarse particles is used as an abrasive in this way, scratches on the polished surface due to the coarse particles are likely to occur, which causes a decrease in the yield of the product after polishing. Have.

  Moreover, even if it removes once, the coarse particle in alkaline silica dispersion produces | generates and increases with time. Therefore, for example, in the case of a process in which abrasives are circulated and when stored for a while after removing coarse particles, it is necessary to provide a coarse particle removal step that removes coarse particles with a filter immediately before use. In addition, there is a problem that the burden in the coarse particle removing process becomes large.

JP-A-9-193004

  Therefore, the object of the present invention is to minimize the generation of the coarse particles in an environment at room temperature, and in particular, when used as a semiconductor polishing agent, it is alkaline that can maintain a stable quality with few coarse particles over a long period of time. The object is to provide a silica dispersion.

  The inventors of the present invention have made extensive studies to solve the above problems. As a result, by performing a heat treatment in which fumed silica is dispersed in an aqueous solvent and an aqueous solution having a specific pH in the alkaline region is maintained at a specific high temperature, the generation of coarse particles is extremely low at room temperature. The present inventors have succeeded in obtaining a stable alkaline silica dispersion and have completed the present invention.

  That is, the present invention is a silica dispersion having a pH of 8 to 12 in which fumed silica is dispersed in an aqueous medium, and the increase rate of coarse particles of 0.6 μm or more after standing at 25 ° C. for 1 week is 15% or less. It is an alkaline silica dispersion characterized by being.

  The present invention also provides a suitable method for producing the alkaline silica dispersion.

  That is, according to the present invention, a silica dispersion liquid having a pH of 8 to 12 in which fumed silica is dispersed in an aqueous medium has a heating temperature (T ° C) in the range of 40 to 100 ° C and the heating temperature (T ° C). There is provided a method for producing an alkaline silica dispersion, wherein the heating time (t time) is subjected to heat treatment under the conditions satisfying the following formula (1).

t ≧ 2 × 10 ⁹ T ^(−4.8) (1)

  The alkaline silica dispersion liquid of the present invention is much less likely to generate coarse particles during long-term storage at room temperature than a conventional alkaline silica dispersion liquid in which fumed silica is dispersed in an alkaline aqueous solution.

  Therefore, when the alkaline silica dispersion of the present invention is diluted as necessary and used as a semiconductor polishing agent, the generation of coarse particles is reduced over a long period of time, so that the quality is stabilized and problems such as scratches are effective. Can be avoided.

  Further, the alkaline silica dispersion of the present invention can also be used for the preparation of a filler for newspapers, a coating liquid for inkjet recording paper, and the like due to the above characteristics.

  The production method of the present invention is characterized in that the heat treatment is performed, and the alkaline silica dispersion of the present invention can be obtained with good reproducibility by such a method.

  Although the mechanism that can suppress the formation of coarse particles of the alkaline silica dispersion by the heat treatment is not clear, the present inventors can dissolve over time in the alkaline region of the alkaline silica dispersion by the heat treatment. It is presumed that the decrease in the fine particles prevented the phenomenon that the fine particles were gradually dissolved to form coarse particles.

(Alkaline silica dispersion)
As the fumed silica dispersed in the alkaline silica dispersion of the present invention, fumed silica obtained by a known method is used without particular limitation. For example, those obtained by burning silicon tetrachloride in an oxyhydrogen flame are suitable. The fumed silica obtained by such a method can be obtained by changing the production conditions to obtain a silica having a specific surface area of approximately 50 to 500 m ² / g. The primary particle diameter of silica calculated from the specific surface area is in the range of about 5 to 50 nm, but usually exists as an aggregate of 1 μm or more.

  When the fumed silica is dispersed in an aqueous solvent, it is preferable to perform a humidification treatment to increase the silanol group concentration on the surface in order to improve the dispersion efficiency. For the humidification process, in the process of producing fumed silica, before collecting fumed silica, a method of contacting with water vapor, a method of introducing an appropriate amount of water vapor in a tank for storing fumed silica, and the like are suitable. is there.

  The alkaline silica dispersion of the present invention is obtained by dispersing the fumed silica in an aqueous medium, which will be described later. In order to maintain the sedimentation stability of the silica particles, the particle diameter is 0.05 to 0.00. It is preferable that the fine particles are dispersed to have a size of 3 μm, particularly 0.08 to 0.2 μm.

  In addition, the said average particle diameter has pointed out the average particle diameter of the silica aggregation particle | grains in a silica dispersion liquid, and is a volume reference | standard arithmetic average diameter when it measures with the particle size distribution meter of a light-scattering diffraction system.

  The term “atomization” as used herein means not only the pulverization of silica particles composed of strong agglomerated particles, but also pulverization and dispersion in the sense of loosening the flocculation of silica particles composed of loose agglomerated particles.

  In the present invention, water is typical as the aqueous solvent constituting the alkaline silica dispersion. In addition to water, polar solvents such as alcohols such as methanol, ethanol and isopropanol, ethers and ketones may be used in combination.

  Furthermore, a surfactant or the like may be appropriately added to the alkaline silica dispersion of the present invention in order to improve the stability and dispersibility of the silica particles.

  The pH of the alkaline silica dispersion of the present invention is preferably 8 to 12, particularly 8 to 11. That is, when the pH is less than 8, the dispersion becomes unstable and easily gels, and when the pH exceeds 12, the dispersed silica particles are easily dissolved and the stability is lowered.

  In the present invention, as an alkali for adjusting the alkaline silica dispersion to the above pH, known alkali hydroxides such as KOH, ammonia, amines, tetramethylammonium hydroxide and the like can be used without particular limitation. The

  Among them, in the use as a polishing agent described later, the polishing agent for silicon wafer includes, as the alkali, monoethanolamine, isopropylamine, ethylenediamine, propanediamine, diethanolamine, dipropylamine, dibutylamine, triethanolamine, piperazine , 2-methylpiperazine, N-methylpiperazine, bisaminopropylpiperazine, 2-aminomethylpiperidine, 2-piperidineethanol, triethylenetetramine, aminoethylethanolamine, hexamethylenediamine, diethylenetriamine and other amines, tetramethylammonium hydroxide Tetraalkylammonium hydroxide such as tetraethylammonium hydroxide can be preferably used. In addition, KOH, ammonia, or tetraalkylammonium hydroxide is preferably used as the alkali for the polishing agent for polishing the insulating film during the IC manufacturing process.

  The concentration of fumed silica in the alkaline silica dispersion of the present invention is appropriately determined depending on the application, but the upper limit is preferably 40% by weight. That is, when it exceeds 40% by weight, the fluidity of the silica dispersion liquid is extremely deteriorated, so that the production tends to be difficult.

  Moreover, the minimum of the density | concentration of the fumed silica of an alkaline silica dispersion is about 0.1 weight%. For example, in the use of an abrasive, if the concentration is less than the above, the polishing efficiency tends to decrease.

  The greatest feature of the alkaline silica dispersion of the present invention is that the rate of increase of coarse particles of 0.6 μm or more after standing at 25 ° C. for 1 week is 15% or less, preferably 10% or less.

  In the present invention, the increase rate is a value calculated by the following equation (2).

  As described above, the dispersion of fumed silica having a pH of 8 to 12 does not stop the formation of coarse particles over time at room temperature. Is what happens as it exists.

  Therefore, “at the start of measurement” is not related to the time after the preparation of the alkaline silica dispersion, and the alkaline silica dispersion at the start of measurement is not limited even if the coarse particles are present in the dispersion. It may be after removing coarse particles.

  However, since the alkaline silica dispersion whose time has passed after the preparation of the silica dispersion has deteriorated in other characteristics, generally, within one month after the preparation of the alkaline silica dispersion, the measurement may be started. desirable.

  In the present invention, the number of coarse particles of 0.6 μm or more in the alkaline silica dispersion is a value measured using a number count particle size distribution measuring apparatus. Details will be described in Examples described later.

  Further, the method of leaving the alkaline silica dispersion at 25 ° C. for one week is carried out in a closed container so that the water in the dispersion does not evaporate. Then, the number of coarse particles having a size of 0.6 μm or more is measured in the same manner as described above for the alkaline silica dispersion after standing.

  As will be understood from the examples described below, the increase rate of the dispersion of fumed silica having a pH of 8 to 12 prepared by a conventional method exceeds 20%, whereas the alkaline silica dispersion of the present invention is The increase rate is extremely excellent such that the rate of increase is as small as 15% or less, particularly 10% or less.

  Further, the alkaline silica dispersion liquid of the present invention has the same characteristics without changing the above characteristics even when it is diluted with an aqueous medium.

(Use as an abrasive for semiconductors)
The alkaline silica dispersion of the present invention is useful as an abrasive due to the above properties. That is, the load on the filter used can be remarkably reduced in the coarse particle removal step that is performed after storage or in the circulation step in the polishing step and before being supplied to the polishing machine. Process can be achieved.

  Moreover, since the alkaline silica dispersion of the present invention uses fumed silica whose raw material is highly pure, various abrasives such as abrasives for silicon wafers and abrasives for ICs that require high purity, etc. Is preferably used.

  What is necessary is just to adjust the density | concentration of the silica in the alkaline silica dispersion liquid in the case of using as said abrasive | polishing agent suitably to the target density | concentration within the said range. For example, in ultra-precise finish polishing such as a silicon wafer, a dispersion having a low silica concentration of about 0.5 to 5% by weight is used. When the abrasive is transported, the silica concentration may be adjusted to a high concentration of 20% by weight or more in order to reduce the transportation cost. In this case, it is diluted to a desired concentration with an aqueous solvent at the time of use. Of course, depending on the polishing target, such a high silica concentration may be used.

(Method for producing alkaline silica dispersion)
The method for producing the alkaline silica dispersion of the present invention is not particularly limited, but a typical method is exemplified by heating a silica dispersion having a pH of 8 to 12 in which fumed silica is dispersed in an aqueous medium. Examples include a method in which the temperature (T ° C.) is in the range of 40 to 100 ° C. and the heating time (t time) at the heating temperature (T ° C.) satisfies the following formula (1). .

t ≧ 2 × 10 ⁹ T ^(−4.8) (1)

  In the method for producing the alkaline silica dispersion, a characteristic means is that a silica dispersion having a pH of 8 to 12 in which fumed silica is dispersed in an aqueous medium is predetermined at a high temperature of 40 ° C. or higher, preferably 50 ° C. or higher. The heat treatment is performed for a period of time. By this treatment, an alkaline silica dispersion in which the increase rate of the coarse particles of 0.6 μm or more is suppressed to be extremely low can be obtained.

  That is, when the temperature of the heat treatment is lower than the above range, it is difficult to reduce the rate of increase of coarse particles of 0.6 μm or more in the obtained alkaline silica dispersion.

  In the production method of the present invention, the heat treatment time is important as well as the heat treatment temperature. That is, the lower limit of the treatment time for stabilizing the obtained alkaline silica dispersion varies depending on the heat treatment temperature. If the treatment time is less than the time required for the treatment time, even if the temperature is increased, the alkaline silica of the present invention is used. Dispersion cannot be obtained. And said Formula (1) is a type | formula which shows the minimum of the processing time (t time) in heat processing temperature (T degreeC).

  The upper limit of the heat treatment time is not particularly limited, but industrially, it is within 50 hours, preferably within 10 hours.

  In the present invention, a silica dispersion having a pH of 8 to 12 in which fumed silica is dispersed in the aqueous medium is not particularly limited, and a silica dispersion obtained by a known method is used without any particular limitation. It is preferable to be dispersed in For example, a silica slurry obtained by dispersing fumed silica by mixing fumed silica, an alkali and an aqueous solvent in any order, and an average particle diameter of silica is 0.05 to 0.3 μm, in particular, What was obtained by atomizing so that it might become 0.08-0.2 micrometer is suitable.

  In addition, since the addition amount of the said alkali changes with kinds of alkali to be used, it cannot be specified unconditionally. Usually, while confirming the pH with a pH meter, the alkali may be added little by little so as to achieve the target pH, or a calibration curve of pH with respect to the added amount of alkali may be prepared in advance.

  The method for performing the above-described dispersion processing is not particularly limited, and a method using a known dispersion device is employed. Specifically, a general agitator having a propeller blade, a turbine blade, a paddle blade, a high-speed rotary centrifugal type agitator such as a disper mixer, a high-speed rotary shear type agitator such as a homogenizer, a homomixer, and an ultra mixer, a colloid mill, Dispersers such as planetary mixers and suction dispersers, combined dispersers that combine the high-speed rotating shear type agitator with propeller blades and paddle blades, planetary mixers and high-speed centrifugal radial type agitators, or high-speed rotation Examples thereof include a dispersion treatment using a composite type disperser combined with a shear type stirrer.

  In addition, the method for performing the atomization process is not particularly limited, and a method using a known atomization apparatus is employed. Specifically, the atomization method using wet media type | mold dispersers, such as a sand mill and a bead mill, an ultrasonic homogenizer, a high-pressure homogenizer, etc. are mentioned. Among them, the atomization method using a high-pressure homogenizer is preferable.

  Specific examples of high-pressure homogenizers include nanomizer product names; nanomizer, microfluidics product names; microfluidizers, and Sugino Machine product names;

  The high-pressure homogenizer means that the silica slurry collides with each other at a treatment pressure of 30 MPa or more, or the silica agglomerated particles in the slurry are passed through the orifice under a condition where the pressure difference between the inlet side and the outlet side of the orifice is 30 MPa or more. Is a device for atomizing.

  The atomization process conditions using such a high-pressure homogenizer cannot be generally determined because the various apparatus constants and efficiency differ depending on the model or the atomization efficiency varies depending on the type of silica slurry used. .

  In general, since the atomization efficiency depends on the treatment pressure, the atomization efficiency increases as the treatment pressure increases. For example, when the treatment pressure is 50 MPa or more, preferably 80 MPa or more, more preferably 120 MPa or more, treatment with high atomization efficiency is possible.

  The collision speed of the silica slurry at the time of opposing collision is desirably 50 m / second or more, preferably 100 m / second or more, more preferably 150 m / second or more as a relative speed.

  Further, the linear velocity of the silica slurry when passing through the orifice depends on the hole diameter of the orifice to be used and cannot be determined unconditionally, but it is preferably 50 m / second or more, similarly to the collision velocity at the time of the above-described collision. Is preferably 100 m / second or more, more preferably 150 m / second or more.

  In addition, the frequency | count of processing a silica slurry with a high pressure homogenizer can be selected from the range of 1 to several tens of times according to the particle diameter of the silica particle in the target silica dispersion.

  As a material constituting the portion where the silica slurry is accelerated or collided as described above, diamond is preferably employed in order to suppress wear of the material.

  In the present invention, the liquid temperature during the dispersion treatment and atomization treatment is less than 40 ° C. in order to produce more stably without causing thickening and gelation during the dispersion treatment and atomization treatment. In particular, it is preferable to control to a temperature range of 15 to 30 ° C.

  The method for controlling the temperature range is not particularly limited, and a known cooling means that does not affect the composition of the liquid is employed without particular limitation. For example, by appropriately selecting cooling means such as installation of a jacket type cooler outside each dispersion tank, installation of cooling piping inside each dispersion tank, installation of a heat exchanger at each equipment inlet or outlet piping section, etc. Apply it.

  The silica concentration of the silica dispersion obtained by the above method is determined by the blending ratio of each raw material at the time of preparing the silica slurry. The silica concentration is determined within the range of the silica concentration of the alkaline silica dispersion, that is, in the range of 0.1 to 40% by weight in order to satisfy the silica concentration of the target alkaline silica dispersion.

  However, considering the efficiency at the time of atomization of the silica dispersion, the silica concentration is preferably high to some extent, and is preferably 5% by weight or more, particularly preferably 10% by weight or more. Moreover, also in the said heat processing, since the calorie | heat amount for a heating can be reduced by employ | adopting the said density | concentration, it is industrially advantageous and is a preferable aspect.

  In this case, rather than adopting a high silica concentration, if the silica concentration of the alkaline silica dispersion obtained by heat treatment is higher than the target silica concentration, it may be desired to add the aqueous solvent or other additives. What is necessary is just to dilute to the concentration to be. Even in the diluted alkaline silica dispersion, the effects of the present invention can be exhibited without change.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples. The physical properties of the alkaline silica dispersion were measured by the following method.

(1) pH
The pH of the alkaline silica dispersion was measured using a pH meter (H-22, F-22).

(2) Measurement of average particle size After the dispersion was diluted with ion-exchanged water so that the silica concentration of the alkaline silica dispersion was 10% by weight, a light scattering diffraction type particle size distribution measuring device (Coulter, Coulter LS -230) was used to measure the volume-based arithmetic average diameter, and this value was adopted as the average particle diameter.

  In the measurement, the refractive index of water (dispersion medium) 1.332 and the refractive index of silica 1.458 were input as parameters.

(3) Measurement of the number of coarse particles The number of coarse particles of 0.6 μm or more in the alkaline silica dispersion is measured using a number-count particle size distribution measuring apparatus (manufactured by Particle Sizing System, Accusizer), and the coarse particles per gram of silica particles. The number of particles was converted and this value was adopted as the number of coarse particles.

Example 1
A high-speed rotating shear type disperser (manufactured by Mizuho Kogyo Co., Ltd., Ultramixer LR) in ion-exchanged water to which potassium hydroxide is added using fumed silica (manufactured by Tokuyama, Leolosil QS-09) having a specific surface area of 90 m ² / g as a pH adjuster. -2) to obtain a silica slurry having a silica concentration of 20% by weight and a pH of 10.1. The silica slurry was atomized using a high-pressure homogenizer (Nanomizer, Nanomizer, LA-31) under a treatment pressure of 80 MPa to obtain a silica dispersion. The liquid temperature during the dispersion treatment and atomization treatment was maintained at 25 ° C. This silica dispersion was heat-treated under the conditions shown in Table 1 to obtain an alkaline silica dispersion. The physical properties of the obtained alkaline silica dispersion are shown in Table 1.

Examples 2-3 and Comparative Examples 1-3
An alkaline silica dispersion was obtained in the same manner as in Example 1 except that the heat treatment was performed under the conditions shown in Table 1. The physical properties of the obtained alkaline silica dispersion are shown in Table 1.

Examples 4-5, Comparative Example 4
An alkaline silica dispersion was obtained in the same manner as in Examples 1 and 2 and Comparative Example 1 except that the silica dispersion was filtered with a filter having a filtration accuracy of 3 μm. The physical properties of the obtained alkaline silica dispersion are shown in Table 1.

Claims (4)

A silica dispersion having a pH of 8 to 12 in which fumed silica is dispersed in an aqueous medium, wherein an increase rate of coarse particles of 0.6 μm or more after standing at 25 ° C. for 1 week is 15% or less. Alkaline silica dispersion. The alkaline silica dispersion according to claim 1, wherein the average particle diameter is 0.05 to 0.3 µm. Use of the alkaline silica dispersion according to claim 1 or 2 as an abrasive for semiconductors. A silica dispersion having a pH of 8 to 12 in which fumed silica is dispersed in an aqueous medium has a heating temperature (T ° C.) in the range of 40 to 100 ° C., and a heating time (t time) depending on the heating temperature (T ° C.). The manufacturing method of the alkaline silica dispersion liquid characterized by heat-processing on the conditions which satisfy following formula (1).
t ≧ 2 × 10 ⁹ T ^(−4.8) (1)