JP2008091695A - Surface mounting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide surface mounting equipment in which the moving distance or moving time of a head unit for recognizing an imaging object can be shortened more effectively. <P>SOLUTION: The surface mounting equipment comprises a mechanism which drives a head unit 6 for a mounting machine body along the XY plane, two cameras 17 and 18 provided in the head unit 6 at different positions, and a section 19 for controlling the drive mechanism based on the position of a mark Fa, Fb put on at least one of a print circuit board 3 and the mounting machine body and the position of the head unit 6 such that one of the cameras 17 and 18 located closest to the mark Fa, Fb or movable to the mark Fa, Fb in the shortest time can image the mark Fa, Fb. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a surface mounter for mounting an electronic component such as an IC chip on a printed circuit board or the like.

  In general, a surface mounting machine is known in which a head unit having a suction nozzle is driven between an electronic component supply unit and a printed circuit board to transport and mount the electronic component sucked by the supply unit onto the printed circuit board. It has been.

  In this type of surface mounter, the head for the driving target is recognized by recognizing a mark provided on the supply unit or printed circuit board (hereinafter referred to as a driving target) that is a target of driving the head unit. The drive position of the unit is corrected.

  For example, when the positional relationship between the head unit and the printed board is specified, a fiducial mark as the mark provided on the printed board is recognized. Specifically, the positional deviation between the assumed fiducial mark and the actually captured fiducial mark can be specified by imaging the fiducial mark with a camera provided in the head unit. it can.

  In general, a printed board is provided with a plurality of marks, for example, fiducial marks are provided at two or more locations, and a multi-cavity board in which a large number of unit boards are provided in one board. In this case, a fiducial mark or a bad mark for identifying defective products is attached to each unit substrate.

In order to speed up the specification of such a positional relationship, for example, in Patent Document 1, a path through which one recognition camera provided on the suction head passes all of a plurality of marks provided on the substrate is obtained in advance. Of these paths, a path that minimizes the moving distance of the suction head is employed.
JP 2004-214247 A

  However, since the technique of Patent Document 1 recognizes a plurality of marks with one recognition camera, in order to minimize the moving distance of the head unit from the current position to the mark recognition position, The distance is limited to one of the distances between the recognition camera and the mark, and the distance cannot be further shortened.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a surface mounter that can more effectively reduce the moving distance or moving time of the head unit for recognizing an imaging target. It is said.

  In order to solve the above-described problems, the present invention includes a head unit having a suction nozzle that sucks an electronic component, and a mounting machine body on which a printed board is placed, and the head unit is attached to the mounting machine body. A surface mounter capable of mounting an electronic component sucked by the suction nozzle by relative displacement on a printed circuit board, wherein the head unit is mounted on the mounter body along a plane defined by two-dimensional coordinates. And a position of an imaging target provided on at least one of the printed circuit board and the mounting machine main body, a driving mechanism for driving the head unit, a plurality of imaging means provided in the head unit and arranged at different coordinate positions, respectively. Based on the position of the head unit and the position of the head unit, it is at the coordinate position closest to the imaging target or the coordinate position that can be moved in the shortest time among the imaging means. So that the image unit is possible imaging the imaging object, to provide a surface mounting apparatus which is characterized in that a control means for controlling the drive mechanism.

  According to the present invention, it is possible to select an imaging unit at a coordinate position closest to the imaging target or a coordinate position that can be moved in the shortest time from among a plurality of imaging units provided. Unlike the case where the shortest moving distance or the shortest moving time of the head unit for picking up the image pickup object is limited to one of the linear distance connecting the image pickup means and the image pickup object or the time for moving the same. The shortest distance or moving time can be selected from the distances or moving times from the plurality of imaging means to the imaging target.

  Therefore, according to the present invention, it is possible to more effectively reduce the moving distance or moving time of the head unit for recognizing the imaging target.

  In the surface mounter, the imaging object is preferably a mark attached to a printed board.

  According to this configuration, by recognizing the mark attached to the printed circuit board, the position of the printed circuit board itself, the component mounting position set on the printed circuit board, and the like can be recognized by the imaging unit.

  The surface mounter further includes coordinate position specifying means for specifying the coordinate position of each of the imaging means, and the control means includes storage means in which a coordinate position set as an arrangement position of the mark is stored in advance. And an arithmetic means for specifying an imaging means at a coordinate position closest to the coordinate position of the mark or a coordinate position movable in the shortest time based on the coordinate position of each imaging means and the coordinate position of the mark. (Claim 3).

  According to this configuration, when the coordinate position of each imaging unit is specified by the coordinate position specifying unit, it is possible to specify the imaging unit located at the closest coordinate position or the coordinate position that can be moved in the shortest time from the mark. .

  In the surface mounter, the storage means stores in advance an imaging order preset for a plurality of the marks provided, and a coordinate position set as an arrangement position of each mark, and the calculation means The coordinate position closest to the coordinate position of the next imaging target mark based on the coordinate position of the next imaging target mark stored in the storage unit when the coordinate position of the specific mark is captured Alternatively, it is preferable to specify the imaging means at the coordinate position that can be moved in the shortest time.

  According to this configuration, when a mark is imaged in accordance with a preset imaging sequence, it is possible to specify an imaging unit that should image the next mark to be imaged when a specific mark is imaged.

  In the surface mounter, the control means is an imaging means for imaging a preset imaging order for a plurality of the marks provided and a coordinate position of each mark included in the imaging order. Among the image pickup means, the image pickup means at the closest coordinate position to the next coordinate position of the mark to be imaged or the coordinate position that can be moved in the shortest time immediately after the image of the coordinate position of the mark is imaged next. A storage unit that stores in advance imaging unit identification information that is set to capture the coordinate position of the mark is provided, and the coordinate position of the mark is sequentially captured by the imaging unit that is set in the imaging unit identification information according to the imaging sequence. It is preferable to control the drive mechanism in such a manner.

  According to this configuration, when the marks are imaged in accordance with the preset imaging order, the imaging means for imaging the marks included in the imaging order is also stored in advance. The mark can be imaged in a shorter time as compared with the case of specifying.

  In the surface mounter, the imaging order includes the imaging means at the time of imaging the coordinate position of the specific mark among the coordinate positions of the mark that have not yet been imaged at the time of imaging the coordinate position of the specific mark. In this order, it is preferable that the mark at the closest coordinate position or the coordinate position that can be moved in the shortest time is set as the next image pickup target mark.

  According to this configuration, since the order of imaging the mark itself is set to shorten the moving distance or moving time of the head unit, the head is more effectively combined with the driving of the driving mechanism by the control means described above. The moving distance of the unit can be shortened.

  In the surface mounter, the control means includes an operation sequence of the head unit for imaging the coordinate positions of the plurality of marks provided and mounting a plurality of electronic components on a printed circuit board, and the operation sequence. Image pickup means for picking up the coordinate position of each mark, and of each of the image pickup means, the image of the mark to be picked up next when the mark coordinate position is picked up immediately before or the electronic component is mounted immediately before Imaging means identification information set in advance so that the imaging means at the closest coordinate position to the coordinate position or the coordinate position that can be moved in the shortest time captures the coordinate position of the mark to be imaged next is stored in advance. It is provided with storage means and is driven so that the coordinate positions of the marks are sequentially picked up by the image pickup means set in the image pickup means identification information in accordance with the operation sequence. It is preferable to control the driving of the structure (claim 7).

  According to this configuration, when performing imaging of the mark or mounting of the electronic component according to a preset operation sequence, the imaging means for imaging the mark included in this operation sequence is also stored in advance. The mark can be imaged in a shorter time as compared with the case where an appropriate imaging means is specified each time.

  In the surface mounter, the operation order is determined as follows: the coordinate position of the specific mark among the coordinate positions of the mark that has not yet been captured when the coordinate position of the specific mark is imaged or the specific electronic component is mounted. The order in which the mark at the closest coordinate position or the coordinate position that can be moved in the shortest time is set as the next imaging target mark in relation to each imaging means at the time of imaging or when a specific electronic component is mounted (Claim 8).

  According to this configuration, since the operation sequence itself is set to shorten the moving distance or moving time of the head unit, the head unit can be moved more effectively in combination with the driving of the driving mechanism by the control means described above. The distance or travel time can be shortened.

  According to the present invention, it is possible to select an imaging unit at a coordinate position closest to the imaging target or a coordinate position that can be moved in the shortest time from among a plurality of imaging units provided. Unlike the case where the shortest moving distance or the shortest moving time of the head unit for picking up the image pickup object is limited to one of the linear distance connecting the image pickup means and the image pickup object or the time for moving the same. The shortest distance or moving time can be selected from the distances or moving times from the plurality of imaging means to the imaging target.

  Therefore, according to the present invention, it is possible to more effectively reduce the moving distance or moving time of the head unit for recognizing the imaging target.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a surface mounter according to the present invention. As shown in the figure, the surface mounter includes a mounter main body and a component mounting head unit 6 provided above the mounter main body and capable of relative displacement with respect to the mounter main body.

  The mounting machine body includes a base 1 and component supply units 4 and 4 provided on the base 1.

  A printed circuit board transport conveyor 2 is disposed on the base 1, and the printed circuit board 3 is transported on the conveyor 2 and stopped at a predetermined mounting work position. On the printed circuit board 3, as shown in FIG. 5, fiducial marks Fa and Fb for specifying the position of the printed circuit board 3 with respect to the base 1 and the mounting position of the electronic component are specified. Local fiducial marks Fc and Fd are formed (hereinafter referred to as marks Fa to Fd).

  On both sides of the conveyor 2, component supply units 4 and 4 are arranged. These component supply units 4 and 4 are provided with a plurality of rows of tape feeders 4a. Each tape feeder 4a is configured such that small pieces of chip parts such as ICs, transistors, capacitors, etc. are stored at predetermined intervals, and the held tape is led out from the reel. Electronic parts are taken out intermittently.

  The head unit 6 is movable across the component supply units 4 and 4 and the component mounting unit on which the printed circuit board 3 is located, and is orthogonal to the X axis in the X axis direction (the direction of the conveyor 2) and the Y axis direction (on the horizontal plane). (In the direction to be).

  That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 that is rotationally driven by a Y-axis servo motor 9 are disposed on the base 1, and a head unit support member 11 is disposed on the fixed rail 7. The nut portion 12 provided on the head unit support member 11 is screwed onto the ball screw shaft 8. The head unit support member 11 is provided with a guide member 13 in the X-axis direction and a ball screw shaft 10 driven by an X-axis servo motor 14 so that the head unit 6 can move to the guide member 13. And a nut portion (not shown) provided on the head unit 6 is screwed onto the ball screw shaft 10. The head unit support member 11 is moved in the Y axis direction by the operation of the Y axis servo motor 9, and the head unit 6 is moved in the X axis direction with respect to the head unit support member 11 by the operation of the X axis servo motor 14. It is supposed to be. That is, in this embodiment, the members indicated by reference numerals 7 to 14 constitute a drive mechanism.

  The head unit 6 is provided with a plurality of mounting heads 16 each having a component suction nozzle 16a at the tip. The mounting head 16 can be moved up and down (moved in the Z-axis direction) and rotated around the nozzle center axis (R-axis) with respect to the frame of the head unit 6. And a rotary driving means such as an R-axis servo motor. In the present embodiment, a configuration is shown in which eight nozzles 16a are arranged in a line in the X direction.

  Further, the head unit 6 is provided with one first camera 17 and one second camera 18 at positions outside the mounting heads 16 in the X-axis direction. These cameras 17 and 18 are imaging means each composed of an area sensor, and are arranged with the imaging range directed toward the base 1 in order to capture the marks Fa to Fd.

  The surface mounter is provided with a control unit 19. FIG. 3 is a block diagram showing an electrical configuration of a control unit provided in the surface mounter of FIG.

  The control unit 19 includes a well-known CPU that executes logical operations, a ROM that stores initial settings, and a RAM that temporarily stores various data during operation of the apparatus.

  Specifically, the control unit 19 includes an arithmetic processing unit (arithmetic unit) 20, a storage unit 21, a drive control unit 22, an interface 23, and an image processing unit 24 connected to the arithmetic processing unit 20.

  The storage unit 21 stores initial operations set for each type of the printed circuit board 3, electronic component suction positions, electronic component mounting positions (XY coordinates), mounting order, and XY marks Fa to Fd (see FIG. 5). Information such as coordinates is stored in advance, and each piece of information is output to the arithmetic processing unit 20 as necessary.

  The storage unit 21 is preset with XY coordinates of the origin positions (not shown) of the cameras 17 and 18. Based on this origin position, the current position of each camera 17, 18 is calculated by the arithmetic processing unit 20 described later.

  The drive control unit 22 drives the Y-axis servo motor 9, the X-axis servo motor 14, the Z-axis servo motor and the R-axis servo motor (not shown) based on the information stored in the storage unit 21. ing.

  The interface 23 is connected to an encoder 26 provided in each of the Y-axis servomotor 9 and the X-axis servomotor 14. The encoder 26 detects the moving distance of the head unit 6 (each camera 17, 18) with respect to a preset origin position, and outputs this to the interface 23.

  The image processing unit 24 receives image data from the first camera 17 and the second camera 18 and appropriately performs image processing necessary for the arithmetic processing unit 20 described later to perform processing.

  The arithmetic processing unit 20 performs various arithmetic processes based on information supplied from the storage unit 21, the drive control unit 22, the interface 23, and the image processing unit 24, and displays predetermined information on the display unit 25 as necessary. Outputs a signal to

  Specifically, the arithmetic processing unit 20 drives the head unit 6 to perform the imaging of the marks Fa to Fd by each of the cameras 17 and 18 or the mounting operation of the electronic component based on the information stored in the storage unit 21. In order to do this, the drive control unit 22 is controlled.

  The arithmetic processing unit 20 is assumed based on the image data of the marks Fa to Fd captured by the cameras 17 and 18 and the XY coordinates of the marks Fa to Fd stored in the storage unit 21. The amount of positional deviation between the XY coordinates and the actual XY coordinates is calculated, and using this, the driving of the head unit 6 is corrected.

  Further, the arithmetic processing unit 20 moves the moving distance of the head unit 6 (each camera 17, 18) detected by the encoder 26 and the origin position (XY coordinate) of each camera 17, 18 stored in the storage unit 21. Based on the above, the XY coordinates of the cameras 17 and 18 at the present time are calculated. That is, the arithmetic processing unit 20, the encoder 26, and the storage unit 21 constitute a coordinate position specifying unit of the present embodiment.

  In this embodiment, the arithmetic processing unit 20 is based on the positional relationship between the XY coordinates of the marks Fa to Fd stored in the storage unit 21 and the XY coordinates of the cameras 17 and 18 specified as described above. Then, the route that is the shortest distance among all the routes that connect each of the cameras 17 and 18 from each of the marks Fa to Fd, and the combination of the mark and the camera that constitute this route are specified, and the camera is used. Thus, the drive control unit 22 can be controlled so as to capture the mark.

  The storage unit 21 stores in advance acceleration, maximum speed, and deceleration for the driving speed of the head unit 6 in the X-axis and Y-axis directions. These speeds are set to be the same at any position within the moving range of the head unit 6 in principle. When the respective speeds are set to be the same as described above, the arithmetic processing unit 20 specifies the shortest distance from each of the marks Fa to Fd to each of the cameras 17 and 18 as described above. Yes.

  On the other hand, the respective speeds may be individually set in a specific range within the movement range of the head unit 6, and these speeds may be stored in the storage unit 21. When the respective speeds are set individually as described above, the arithmetic processing unit 20 determines the XY coordinates of the marks Fa to Fd, the XY coordinates of the cameras 17 and 18, the acceleration / deceleration speed and the maximum speed of the head unit 6. Based on the above, the shortest movement time for each of the cameras 17 and 18 to move to each of the marks Fa to Fd and the combination of the mark and the camera corresponding to this movement time are specified. The drive control unit 22 can be controlled so as to capture the mark using the camera.

  Hereinafter, processing executed by the control unit 19 will be described with reference to FIGS.

  When the process of the control unit 19 is executed, it is first determined whether or not the printed circuit board 3 has been carried onto the base 1 (step S1). This determination process is determined by whether or not the printed circuit board 3 is located at a specified position of the base 1 by a substrate detection sensor (not shown) connected to the control unit 19.

  If it is determined in step S1 that the printed circuit board 3 has been loaded onto the base 1 (YES in step S1), processing for recognizing the position of the printed circuit board 3 is performed.

  That is, the information regarding the XY coordinates of the fiducial marks Fa and Fb is read from the storage unit 21 (step S2), and the combination of the mark and the camera that takes the shortest time to image the marks Fa and Fb is specified. (Step S3).

  Specifically, in step S3, when the acceleration / deceleration speed and the maximum speed of the head unit 6 are set to be the same for all the movement ranges of the head unit 6, the XY coordinates of the marks Fa and Fb and the sensor 26, based on the current position (XY coordinates) of the head unit 6 detected by H. 26, the shortest of all paths connecting the marks Fa and Fb and the cameras 17 and 18 at the current position of the head unit 6. A route to be a distance is specified, and a combination of a mark and a camera constituting this route is specified.

  On the other hand, when the acceleration / deceleration speed and the maximum speed of the head unit 6 are individually set within the movement range of the head unit 6, the XY coordinates of the marks Fa and Fb and the current position (XY coordinates) of the head unit 6 Based on the acceleration / deceleration speed and the maximum speed of the head unit 6, the movement time for moving each camera 17, 18 to each of the marks Fa, Fb is specified, and the movement time is specified. The combination of the mark and the camera corresponding to is specified.

  In step S3, the camera combination for the mark Fa and the camera combination for the mark Fb are specified. For example, when the second camera 18 is specified for the mark Fa and the first camera 17 is specified for the mark Fb, in the subsequent step S4, the mark Fa is first imaged by the second camera 18 (FIG. 5 (a )), And the mark Fb is imaged by the camera 17 (FIG. 5B). In addition, when only one camera corresponding to the second camera 18 is provided as in the related art, a moving distance for moving the second camera 18 along the diagonal line of the printed circuit board 3 is necessary. Therefore, the moving distance of the head unit 6 can be shortened by moving as in the present embodiment.

  In step S4, image processing of the captured data is further performed. In step S5, the driving of the head unit 6 is corrected based on the image data.

  When the recognition of the position of the printed circuit board 3 is completed in this manner, an electronic component mounting operation is then performed. That is, component information such as the type of electronic component to be mounted and the mounting position (XY coordinates) is read from the storage unit 21 (step S6), and the local fiducial marks Fc, Fd are used for mounting the read electronic component. It is determined whether or not recognition is necessary (step S7). When it is determined that it is not necessary, step S10 described later is executed.

  On the other hand, if it is determined that the marks Fc and Fd need to be recognized (YES in step S7), the shortest distance or the shortest distance between the marks Fc and Fd and the cameras 17 and 18 is obtained as in step S3. A combination that can be moved in time is specified (step S8).

  FIG. 6 shows a case where the combination is specified at the current position of the head unit 6 in which the mounting operation has already been completed using the specific nozzle 16A. In this case, as shown in FIG. 6A, the first camera 17 is closer to the marks Fc and Fd than the second camera 18, and the first of the marks Fc and Fd is the first. The mark Fc is closer to the camera 17. Therefore, in the case shown in the figure, first, the combination of the first camera 17 and the mark Fc is specified. Further, at the current position of the head unit 6 shown in FIG. 6B in which the mark Fc is imaged with the combination specified in this way, the first camera 17 is clearly close to the remaining mark Fd. In the case shown in the figure, the combination of the first camera 17 and the mark Fd is specified.

  As described above, when the combination of the cameras 17 and 18 for each of the marks Fc and Fd is specified in step S8, the marks Fc and Fd are sequentially imaged according to the combination, and the target electronic data is based on the imaging data. The component mounting position is corrected (step S9).

  Next, the electronic component is sucked from the tape feeder 4a and mounted on the printed circuit board 3 (step S10), and it is determined whether or not there is an unmounted electronic component in the preset mounting order. (Step S11) The above step S6 is repeated if it exists, and the process ends if it does not exist.

  As described above, according to the above-described embodiment, among the plurality of cameras 17 and 18, the cameras 17 and 18 or the marks Fa to Fd located closest to the marks Fa to Fd are the shortest in the shortest time. Since the cameras 17 and 18 that can move can be selected, the shortest moving distance or the shortest moving time of the head unit 6 for imaging the marks Fa to Fd as in the case of one camera. Unlike the case of being limited to one of the linear distances connecting the marks Fa to Fd or the time for moving the marks, the shortest of the distances or moving times from the plurality of cameras 17 and 18 to the marks Fa to Fd. Distance or travel time can be selected.

  Therefore, according to the embodiment, it is possible to more effectively reduce the moving distance or moving time of the head unit 6 for recognizing the marks Fa to Fd.

  In the above-described embodiment, the combination of the marks Fc and Fd and the cameras 17 and 18 is specified in real time according to the current position of the head unit 6, but the recognition order of a plurality of marks is set in advance. Alternatively, the cameras 17 and 18 that should capture the target mark in the process of recognizing according to this recognition order may be specified. For example, as shown in FIG. 8, such a process is effective for the multi-planar substrate 30 having a large number of marks.

  The multi-sided board 30 includes, for example, a plurality of areas 30a (nine areas are shown in the figure) in which the same circuit is formed, and paste printing and component mounting processing as a single board. After the application, each area 30a is separated and used individually. The multi-sided substrate 30 is formed with a pair of fiducial marks Fe and Ff (corresponding to the fiducial marks Fa and Fb) for recognizing the position, and each area 30a has surface mounting. Fiducial marks Fg and Fh for enhancing the mounting system by the machine are individually set (hereinafter referred to as marks Fe to Fh). Further, each area 30a is formed with a location M1 to which a bad mark is attached with information for specifying an area 30a having a severe defect that cannot be mounted, such as a circuit being damaged.

  In such a multi-sided substrate 30, in this embodiment, imaging sequences P1 to P17 for imaging the fiducial marks Fg and Fh formed in each area 30a are set. In this imaging sequence P1 to P17, imaging starts from the lower side of the leftmost column of each area 30a, shifts from the upper side of this column to the right adjacent column, images this column from the top to the bottom, and then further to the right Moving to the next column, the rightmost column is set to image from the bottom to the top.

  In the present embodiment, the storage unit 21 stores the imaging orders P1 to P17 in advance. Hereinafter, the processing of the control unit 19 in the present embodiment will be described with reference to FIGS. In the flowchart of FIG. 7, steps S1 to S5 in the first half are the same as those in FIG.

  When the process of step S5 is completed, information (including XY coordinates) regarding the marks Fg and Fh to be recognized next in the imaging order P1 to P17 is read from the storage unit 21 (step T1).

  Next, the combination of the mark and the camera that takes the shortest time for imaging the next marks Fg and Fh to be imaged is specified (step T2). That is, in this step T2, as in the above embodiment, each camera 17 is based on the XY coordinates of the cameras 17 and 18 at the current position of the head unit 6 and the XY coordinates of the marks Fg and Fh to be captured next. 18, the camera closest to the mark to be imaged is specified, or the XY coordinates of the cameras 17 and 18 and the XY coordinates of the next images Fg and Fh to be imaged and the head unit 6. Based on the acceleration / deceleration speed and the maximum speed, the camera that can move in the shortest time relative to the mark to be imaged among the cameras 17 and 18 can be identified.

  For example, as shown in FIG. 9A, at the current position of the head unit 6 at the time when the mark Fg in the lower left area 30a is imaged by the second camera 18, the mark Fh to be imaged next is captured. The first camera 17 is closer to the second camera 18. Therefore, at the current position of the head unit 6 shown in FIG. 9A, the first camera 17 can be specified as a camera for imaging the mark Fh.

  Next, the next target imaging target mark (the mark Fh in FIG. 9A) is captured by the camera specified in step T2 (the first camera 17 in FIG. 9A), and the XY coordinates of the mark are determined. Recognize (step T3). By doing in this way, compared with the case where the mark Fh is imaged with the 2nd camera 18 from the state of Fig.9 (a), the moving distance or moving time of the head unit 6 can be shortened.

  Then, it is determined whether or not there is a mark that has not yet been captured among the marks Fg and Fh included in the imaging order P1 to P17 (step T4). If it is determined that it does not exist, the process ends.

  According to this embodiment, when the marks Fg and Fh are imaged in accordance with the imaging sequence P1 to P17 set in advance, the camera that should image the next imaging target mark at the time of imaging the specific mark. Can be identified.

  In the above embodiment, the process of specifying the camera closest to the marks Fg and Fh to be imaged or the camera having the shortest movement time to the marks Fg and Fh is performed here. If P17 and a camera for imaging each of the marks Fg and Fh included in the imaging order P1 to P17 are stored in the storage unit 21 in advance, the processing required for the above specification can be omitted. Processing time can be shortened.

  In other words, in the embodiment described below, the camera 17 or 18 moves to the camera closest to the next imaged mark or the next imaged mark in the shortest time when the mark was imaged immediately before. Camera identification information (imaging means identification information) that is set so that the camera that can capture the next imaged mark is pre-stored in the storage unit 21 and is in accordance with the imaging order P1 to P17. The respective marks Fg and Fh are sequentially picked up by a camera set in camera identification information. Hereinafter, with reference to FIG. 10, processing executed by the control unit 19 of the present embodiment will be described. In the figure, steps S1 to S5 in the first half are the same as those in the above embodiments, and the description thereof is omitted.

  When step S5 is completed, first, the imaging order P1 to P17 and the camera identification information are read from the storage unit 21 (step U1), and then the imaging order as shown in FIGS. 9A and 9B. The marks Fg and Fh are sequentially executed by the cameras set in the camera identification information according to P1 to P17, and the XY coordinates of the marks Fg and Fh are recognized (step U2).

  Note that the imaging order P1 to P17 is not set on the assumption that the two cameras 17 and 18 are provided as in the above embodiments, but this imaging order is determined when a specific mark is imaged. Among the marks that have not yet been picked up in the mark, the mark at the closest XY coordinate position in relation to the cameras 17 and 18 at the time of picking up the specific mark, or the cameras 17 and 18 move in the shortest time. It is preferable that a mark that can be captured is set as a mark to be captured next.

  In this way, the order of imaging the marks Fg and Fh is set to shorten the moving distance or moving time of the head unit 6, so that it is compatible with the drive control of the head unit 6 by the control unit 19 described above. Thus, the moving distance or moving time of the head unit 6 can be shortened more effectively.

  In the above embodiment, the fiducial mark imaging is shown. However, when imaging the fiducial marks Fg and Fh and the location M1 to which the bad mark is added, the imaging order including these is set. You can also

  Furthermore, although the said embodiment demonstrated the structure which memorize | stored the order about only imaging of the marks Fg and Fh (imaging order P1-P17) in the memory | storage part 21, the said imaging order and the mounting order of an electronic component, If the storage unit 21 is made to store the operation order including the above, for example, as shown in FIG. 6A, an operation of imaging the mark closest to the current position of the head unit 6 in the middle of mounting is performed. Therefore, the processing time can be further shortened.

  That is, in the embodiment described below, in addition to the above-described operation order, the camera is for imaging each of the marks Fg and Fh included in this operation order. The camera that is closest to the next mark to be imaged at the time of image capture or electronic component mounting, or the camera that can move to the next image capture mark in the shortest time Camera identification information (imaging means identification information) set to be imaged is stored in the storage unit 21 in advance. Hereinafter, with reference to FIG. 11, processing executed by the control unit 19 of the present embodiment will be described. In the figure, steps S1 to S5 in the first half are the same as those in the above embodiments, and the description thereof is omitted.

  When the step S5 is completed, first, the operation order and camera identification information are read from the storage unit 21 (step V1), and then the marks Fg and Fh are sequentially applied to the cameras set in the camera identification information according to the operation order. An automatic operation process for imaging and mounting electronic components on the multi-sided board 30 is performed (step V2).

  Note that the operation order is not set on the assumption that the two cameras 17 and 18 are provided as in each of the above-described embodiments. Among the marks that have not yet been imaged at the time of mounting the electronic component, they are at the closest XY coordinate position in relation to the cameras 17 and 18 at the time of capturing the specific mark or mounting the specific electronic component. It is preferable that the mark or the mark that can be moved in the shortest time from each of the cameras 17 and 18 is set as a mark to be imaged next.

  In this way, since the operation order itself is set to shorten the moving distance or moving time of the head unit 6, the head unit 6 is more effectively combined with the driving of the head unit 6 by the control unit 19 described above. The moving distance or moving time of the unit 6 can be shortened.

  In each of the above embodiments, a fiducial mark is illustrated as an object to be imaged. However, it may be a bad mark of the multi-sided board, and is provided on at least one of the printed board 3 and the mounting machine body. If there is, it will not be limited to each said mark. As another imaging target, for example, a mark provided in the component supply unit 4 for recognizing the position of the tape feeder 4a can be cited.

It is a top view of the surface mounting machine concerning the embodiment of the present invention. It is a front view of the surface mounting machine of FIG. It is a block diagram which shows the electric constitution of the control part provided in the surface mounting machine of FIG. It is a flowchart which shows the process performed by the control part of FIG. It is a schematic plan view which shows operation | movement of a head unit, (a) has shown the state which imaged the mark Fa, (b) has each shown the state which imaged Fb. It is a schematic plan view which shows operation | movement of a head unit, (a) has shown the state after electronic component mounting, (b) has shown the state which has imaged the mark Fc, respectively. It is a flowchart which shows the process which concerns on another embodiment of this invention. It is a top view which shows a multi-sided board | substrate. It is a schematic plan view which shows operation | movement of a head unit, (a) has shown the state which is imaging the mark Fg, (b) has each shown the state which is imaging the mark Fh. It is a flowchart which shows the process which concerns on another embodiment of this invention. It is a flowchart which shows the process which concerns on another embodiment of this invention.

Explanation of symbols

1 base (mounting machine body)
3 Printed circuit board 4 Component supply unit (mounting machine body)
4a Tape feeder 6 Head unit 7 Fixed rail (drive mechanism)
8 Ball screw shaft (drive mechanism)
9 Y-axis servo motor (drive mechanism)
10 Ball screw shaft (drive mechanism)
11 Head unit support member (drive mechanism)
12 Nut part (drive mechanism)
13 Guide member (drive mechanism)
14 X-axis servo motor (drive mechanism)
16a Nozzle (Suction nozzle)
17 First camera (imaging means)
18 Second camera (imaging means)
19 Control unit (control means)
20 Arithmetic processing part (calculation means)
21 Storage unit (storage means)
30 Multi-sided board 30a Area

Claims (8)

A head unit having a suction nozzle for sucking electronic components and a mounting machine main body on which a printed circuit board is placed, and the head unit is sucked by the suction nozzle by relative displacement with respect to the mounting machine main body. A surface mounter capable of mounting electronic components on a printed circuit board,
A drive mechanism for driving the head unit with respect to the mounter body along a plane defined by two-dimensional coordinates;
A plurality of imaging means provided in the head unit and arranged at different coordinate positions;
Based on the position of the imaging target provided on at least one of the printed circuit board and the mounting machine main body and the position of the head unit, the coordinate position closest to the imaging target or the shortest time among the imaging means can be moved. A surface mounter comprising: control means for controlling the drive mechanism so that the image pickup means at the coordinate position can pick up an image of the image pickup target.   The surface mounter according to claim 1, wherein the imaging target is a mark attached to a printed circuit board.   Coordinate position specifying means for specifying the coordinate position of each image pickup means is further provided, and the control means includes a storage means in which a coordinate position set as an arrangement position of the mark is stored in advance, and each of the image pickup means And an arithmetic means for specifying an imaging means at a coordinate position closest to the coordinate position of the mark or a coordinate position movable in the shortest time based on the coordinate position and the coordinate position of the mark. The surface mounter according to claim 2.   The storage means stores in advance an imaging order set in advance for a plurality of the marks provided, and coordinate positions set as the arrangement positions of the marks, and the arithmetic means stores the coordinates of a specific mark. Based on the coordinate position of the next imaging target mark stored in the storage means, the closest coordinate position or the shortest movement from the coordinate position of the next imaging target mark at the time of imaging the position The surface mounter according to claim 3, wherein an imaging unit at a possible coordinate position is specified.   The control means is an imaging means for imaging a preset imaging order for a plurality of the provided marks and the coordinate positions of the marks included in the imaging order. When the coordinate position of the mark is imaged, the imaging means at the coordinate position closest to the coordinate position of the next image to be imaged or the coordinate position that can be moved in the shortest time captures the coordinate position of the next image to be imaged. And a storage unit that stores in advance the imaging unit identification information set as the imaging unit. The drive unit is configured to sequentially capture the coordinate positions of the marks with the imaging unit set in the imaging unit identification information according to the imaging sequence. The surface mounter according to claim 2, wherein the surface mounter is controlled.   The imaging order is the closest coordinate in relation to each imaging means at the time when the coordinate position of the specific mark is imaged among the coordinate positions of the mark that have not yet been imaged at the time of imaging the coordinate position of the specific mark. 6. The surface mounter according to claim 5, wherein the mark is located at a position or a coordinate position that can be moved in the shortest time as a mark to be a next imaging target.   The control means images the coordinate positions of a plurality of the marks provided and also operates the head unit for mounting a plurality of electronic components on a printed circuit board, and the coordinate positions of the marks included in the operation order. Each of which is closest to the coordinate position of the next image to be imaged when the coordinate position of the mark is imaged immediately before or when the electronic component is mounted immediately before The image pickup means at the coordinate position or the coordinate position that can be moved in the shortest time includes a storage means in which image pickup means identification information that is set to pick up the coordinate position of the mark to be imaged next is stored in advance. Control the drive of the drive mechanism so that the coordinate position of the mark is sequentially imaged by the imaging means set in the imaging means identification information according to the operation sequence Surface mounting machine according to claim 2, characterized.   The operation order is determined when the coordinate position of the specific mark is imaged out of the coordinate positions of the marks that have not yet been imaged when the coordinate position of the specific mark is imaged or when the specific electronic component is mounted. It is the order in which the mark at the closest coordinate position or the coordinate position that can be moved in the shortest time is set as the next imaging target mark in relation to each imaging means when the electronic component is mounted The surface mounter according to claim 7.

Images