JP2008091403A - Electronic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable electronic part that can be mounted to a substrate by press-fitting and engaging a compliant pin. <P>SOLUTION: The electronic part is provided with its body 21 from which a lead wire 22 is led out and a compliant pin 34 that includes a connection part 28 with the lead wire 22 wherein one end face 29 is brought into contact with the lead wire leading face 30 of the body 21 and a connection securing part 32 to be press-fitted and engaged with a through hole of a circuit substrate is provided at the other tip end. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component that can be mounted on a circuit board by press-fitting a compliant pin.

  From the viewpoint of rationalizing the productivity of electronic equipment, reflow soldering is often used as a mounting method for electronic components. In recent years, lead-free solder materials have been used to reduce environmentally hazardous substances. . However, since this lead-free solder material has a higher melting point than conventional lead-containing solder materials, especially in large-volume electronic components, the electronic component main body absorbs reflow heat, so it is connected to the circuit board with solder. Since there is a problem that the temperature of the lead wire portion to be heated is difficult to raise and soldering is difficult, an electronic component having a compliant pin that is press-fitted into a plated through hole and electrically connected has been proposed. ing.

  Conventionally, this type of electronic component has a configuration as shown in a perspective view of FIG. 16 and a bottom view of FIG. 17 in an electronic component called a P-PGA (plastic pin grid array).

  16 and 17, the electronic component includes an electronic component main body 1 in which various semiconductor integrated circuits (ICs) and the like are arranged and connected on a plastic substrate, and the whole is sealed with a plastic material (for example, epoxy resin). The electronic component body 1 is composed of a lead wire 2 that is led out from the bottom surface of the electronic component main body 1 and is a compliant pin that can be connected by being press-fitted into a through hole of the circuit substrate. In the case of mounting to the through hole, the mounting can be performed by press-fitting the lead wire 2 into the through hole without using solder.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent No. 3418030

  However, in the configuration of the electronic component having the conventional compliant pin described above, the lead wire itself led out from the electronic component main body becomes a compliant pin having a tip shape that can be press-fitted into the through hole of the circuit board. The load received when the tip of the compliant pin is press-fitted into the through hole of the circuit board is directly applied to the lead wire of the electronic component.

  On the other hand, as shown in the perspective view of FIG. 18 and the cross-sectional view of FIG. 19, the conventional general electrolytic capacitor includes a capacitor element 13 having a pair of lead wires 12 and impregnated with a driving electrolyte, and an elastic material. The sealing member 14 and the outer metal case 15. The pair of lead wires 12 drawn out from the capacitor element 13 are passed through the sealing member 14, and the capacitor element 13 is inserted into the outer metal case. 15, and the electrolytic capacitor main body 11 sealed by curling the curled portion 17 with the curled portion 17 together with the sealing member 14 and the opening portion of the outer metal case 15, The lead wire 12 penetrates the sealing member 14 and is led out from the electrolytic capacitor body 11, and the lead wire 12 of the electrolytic capacitor 11 is connected to the lead wire 12. When the compliant pin is applied, since the lead wire 12 is held by the sealing member 14 made of an elastic material such as rubber, the lead wire holding force is weaker than the press-fit load when the circuit board is mounted. 12 is transmitted to the capacitor element 13 through 12, causing problems such as a short circuit in the capacitor element 13 and a decrease in airtightness in the sealing member 14.

  An object of the present invention is to solve the above-described conventional problems and to provide an electronic component capable of ensuring stable reliability without applying a load due to press-fitting of a compliant pin to the lead wire of the electronic component main body. It is.

  In order to achieve the above object, the present invention provides an electronic component main body from which a lead wire is led out and a connecting portion between the lead wire and one end surface abuts on the lead wire lead-out surface of the electronic component main body and the other end. An electronic component comprising a compliant pin provided with a connection fixing portion that is press-fitted into the through hole of the circuit board at the tip portion.

  As described above, according to the present invention, the load when the compliant pin connected to the lead wire is press-fitted into the through hole of the circuit board is such that the end surface of the compliant pin contacts the lead wire lead-out surface. Since it is absorbed by the portion and is not transmitted to the internal element through the lead wire of the electronic component body, the effect that the reliability of the electronic component can be secured stably is obtained.

  In the present invention, the electronic component main body from which the lead wire is led out and a connecting portion between the lead wire and one end surface abuts on the lead wire leading surface of the electronic component main body and the other tip portion of the circuit board It has a configuration including a compliant pin provided with a connection fixing portion that is press-fitted into the through hole.

  As a result, the load when the compliant pin connected to the lead wire is press-fitted into the through hole of the circuit board is relieved at the portion where the end surface of the compliant pin contacts the lead wire lead-out surface, This acts so that the load applied to the lead wire connected to the compliant pin is reduced, and the reliability of the electronic component can be secured stably.

  In addition, the area of the lead wire lead-out surface of the electronic component main body that is in contact with one end face of the compliant pin is large enough to absorb the load by which the compliant pin is press-fitted into the through hole of the circuit board. It is good also as a structure which has thickness.

  As a result, the load when the compliant pin connected to the lead wire is press-fitted into the through hole of the circuit board is absorbed by the portion where the end surface of the compliant pin contacts the lead wire lead-out surface, The load is not applied to the lead wire connected to the compliant pin, and the reliability of the electronic component can be secured more stably.

  As a specific example, the electronic component main body includes a capacitor element having a pair of lead wires and impregnated with a driving electrolyte, a sealing member made of an elastic body, and an exterior metal case, A pair of lead wires led out from a capacitor element are passed through the sealing member, the capacitor element is housed in the exterior metal case, and an opening of the exterior metal case is wound together with the sealing member The electrolytic capacitor may be configured such that the electrolytic capacitor is wound at the portion and curled at the curled portion and sealed.

  As a result, even when the electrolytic capacitor uses a sealing member made of an elastic material such as rubber, which has a weak lead wire holding force against the press-fitting load, the compliant pin is inserted into the through-hole of the circuit board. By absorbing the load at the portion where the end surface of the compliant pin connected to the lead wire is in contact with the lead wire lead-out surface, the effect of reducing the load applied to the lead wire becomes more effective, and the reliability of the electronic component is improved. There is an effect that the stability can be secured stably.

  Moreover, it is good also as a structure which provided the recessed part which inserts the said lead wire as said connection part.

  Accordingly, the compliant pin and the lead wire led out from the electronic component main body act so as to be easily connected, and the workability can be improved.

  Moreover, it is good also as a structure which provided the rib which insulates between compliant pins in the lead wire derivation surface of the said electronic component main body.

  This ensures easy and reliable positioning of the compliant pins and increases the contact area of the end surface of the compliant pin to the lead lead-out surface, preventing contact between the compliant pins and the load on the lead wire. There is an effect that the load can be further reduced.

  Moreover, it is good also as a structure which provided the recessed part which engages one end surface of a compliant pin in the lead wire derivation | leading-out surface of the said electronic component main body.

  This ensures easy and reliable positioning of the compliant pins and increases the contact area of the end surface of the compliant pin to the lead lead-out surface, preventing contact between the compliant pins and the load on the lead wire. There is an effect that the load can be further reduced.

  The compliant pin may be configured to exhibit polarity.

  Thereby, it acts so that it is easy to determine the polarity of the electronic component in appearance, and there is an effect that it is possible to prevent the component polarity error during the assembly operation of the electronic device.

  Moreover, it is good also as a structure which the shape of the recessed part which fits in the said lead wire provided in the said connection part of the said compliant pin made into the structure which shows polarity adapts to the shape of the said different lead wire.

  As a result, if a compliant pin with a configuration showing polarity is mistakenly inserted into a lead wire with a different polarity, the correct connection state cannot be obtained and the polarity is wrong in appearance. Acts to be easily detected, and has the effect of preventing polarity errors during assembly of electronic components.

  Hereinafter, an electronic component according to an embodiment of the present invention will be described with reference to the drawings.

(Example 1)
1 is a perspective view of an electronic component according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the electronic component according to the first embodiment, and FIGS. 3 to 6 are perspective views illustrating other examples of the electronic component according to the first embodiment. is there.

  1 and 2, the electronic component has a pair of lead wires 22, a capacitor element 23 impregnated with a driving electrolyte (not shown), a sealing member 24 made of an elastic material such as rubber, An outer metal case 25 made of a metal material such as aluminum, and a pair of lead wires 22 led out from the capacitor element 23 are passed through the sealing member 24, and the capacitor element 23 is placed in the outer metal case 25. A general electrolytic capacitor main body 21 which is housed in the outer metal case 25 and wound together with the sealing member 24 together with the sealing member 24 and curled and sealed with the curled portion 27; A connecting portion 28 with the wire 22, and one end surface 29 abuts against a sealing member 24 made of an elastic material such as rubber, which is the lead wire lead-out surface 30 of the electrolytic capacitor body 21, and the other And a compliant pin 34. made of a metal material having a connection fixing part 32 to be press-fitted into the through-hole 31 of the circuit board on the tip portion of the.

  Further, the area of the lead wire lead-out surface 30 of the electrolytic capacitor main body 21 that is in contact with one end surface 29 of the compliant pin 34 is such that the compliant pin 34 is press-fitted into the through hole 31 of the circuit board. It is set to a size that absorbs the generated load.

  Further, the compliant pin 34 is provided with a concave portion 35 for fitting the lead wire 22 as the connecting portion 28, and the lead wire 22 is fitted into the concave portion 35 and connected by welding, soldering, pressure welding or the like. Yes.

  In the configuration as described above, since one end surface 29 of the compliant pin 34 connected to the lead wire 22 is in contact with the lead wire lead-out surface 30, the connection fixing portion 32 at the other end of the compliant pin 34 is The load at the time of press-fitting into the through hole 31 of the circuit board is absorbed by the portion where the end surface 29 of the compliant pin 34 is in contact with the lead wire lead-out surface 30, and the capacitor element through the lead wire 22 of the electrolytic capacitor body 21. Thus, the effect of ensuring stable reliability with respect to short circuit resistance and airtightness can be obtained.

  Further, the recess 35 provided in the compliant pin 34 fits the lead wire 22 led out from the electrolytic capacitor main body 21, functions so as to facilitate the connection, and has an effect of improving the workability of the connection. It is what

  Further, the shape of the compliant pin 34 is such that, as shown in FIG. 3, a semi-cylindrical base 33 is provided with a concave portion 35 in which the lead wire 22 is fitted as the connecting portion 28, or as shown in FIG. In this configuration, the end surface 29 of the compliant pin 34 is in contact with the lead wire lead-out surface 30 in a configuration in which a concave portion 35 for fitting the lead wire 22 bent in a right angle direction is provided in the semi-cylindrical base portion 33. The contact area can be increased, the margin for absorbing the load when the compliant pin 34 is press-fitted into the through hole 31 of the circuit board is increased, and the effect of ensuring more stable reliability can be obtained. .

  Note that the compliant pin 34 may have a structure in which the connection fixing portion 32 has a split pin shape. As shown in FIG. 5, the lead wire 22 is passed through the center portion of the split pin connection fixing portion 32 and sandwiched. Alternatively, as shown in FIG. 6, the lead wire 22 may be inserted and held in the horizontal direction with the pin in the center portion of the split pin-shaped connection fixing portion 32. In this case, the lead wire 22 and the compliant pin 34 are connected to each other when the compliant pin 34 is press-fitted into the through hole 31 of the circuit board and the lead wire 22 and the compliant pin 33 are plated with the plated through hole 31. Since the inner wall is in pressure contact with each other and can be electrically connected reliably, the labor of connecting the compliant pin 34 and the lead wire 22 by welding or soldering can be saved, and the workability can be improved. It is what

(Example 2)
7 is a perspective view of an electronic component according to the second embodiment of the present invention, FIG. 8 is a bottom view of the electronic component according to the second embodiment, and FIG. 9 is a perspective view illustrating another example of the electronic component according to the second embodiment. In addition, about what has the structure similar to the structure of Example 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  7 and 8, the difference from the first embodiment is that an I-shaped rib 36 is integrally formed on the lead wire lead-out surface 30 side of the sealing member 24 made of an elastic material such as rubber of the electrolytic capacitor main body 21. The ribs 36 are provided so as to enter and come into contact with the compliant pins 34 having the prismatic base 33.

  With this configuration, the compliant pin 34 can be positioned easily and reliably, and the contact area of the end surface 29 of the compliant pin 34 with the lead lead-out surface 30 can be increased so that the contact between the compliant pins 34 can be achieved. It is possible to obtain the effect that the prevention and the load applied to the lead wire 22 can be further reduced.

  Further, as shown in FIG. 9, the shape of the rib 36 is such that the base 33 has a large area where the flat portions of the side surfaces of the pair of compliant pins 34 having a semi-cylindrical shape face each other and the end surface 29 is in contact with the lead outlet surface 30. A rectangular parallelepiped configuration located between the flat portions of the semi-cylindrical base portion 33 of the compliant pin 34 may be used, and the area where the end surface 29 of the compliant pin 34 contacts the lead wire lead-out surface 30 can be increased. The margin for absorbing the press-fitting load of the compliant pin 34 is increased, and the effect of ensuring more stable reliability can be obtained.

  The rib 36 may be configured by fitting an insulating material such as a resin material so that it protrudes from the lead lead-out surface 30 so as to be positioned between the compliant pins 34, or may be attached by bonding or the like. The same effect can be obtained as long as it has a configuration for insulating between the client pins 34.

(Example 3)
FIG. 10 is a perspective view of the electronic component according to the third embodiment of the present invention, and FIG. 11 is a perspective view before the electronic component main body and the compliant pin of the electronic component according to the embodiment of the present invention are connected. In addition, about what has the structure similar to the structure of Example 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  10 and 11, the difference from the first embodiment is that the end surface 29 of the compliant pin 34 is fitted on the lead wire lead-out surface 30 side of the sealing member 13 made of an elastic material such as rubber of the electrolytic capacitor body. The recessed portion 37 to be inserted is provided by molding.

  With this configuration, the compliant pins 34 can be positioned easily and reliably, and the contact area of the end surface 29 of the compliant pin 34 with the lead wire lead-out surface 30 can be increased, so that the space between the compliant pins 34 can be increased. The effect that the contact prevention and the load applied to the lead wire 22 can be further reduced can be obtained.

  In addition, the configuration of the recess 37 is such that if the area where the end surface 29 of the compliant pin 34 abuts on the lead wire lead-out surface 30 is large in a semi-cylindrical shape or the like, a margin for absorbing the press-fit load of the compliant pin 34. As a result, the effect of ensuring more stable reliability can be obtained.

Example 4
FIG. 12 is a perspective view of an electronic component according to Embodiment 4 of the present invention, and FIG. 13 is a perspective view illustrating another example of the electronic component according to the embodiment. In addition, about what has the structure similar to the structure of Example 1, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In FIG. 12, the difference from the first embodiment is that the compliant pin 34 has polarity, and the sizes of the anode side connection fixing portion 42a and the cathode side connection fixing portion 42b are different.

  With this configuration, it is possible to easily determine the polarity of the electrolytic capacitor in appearance, and it is possible to obtain an effect that it is possible to prevent a component polarity error during the assembly operation of the electronic device.

  Further, as shown in FIG. 13, the compliant pin 34 has a split pin-shaped connection fixing portion 32 that penetrates and sandwiches the lead wire 22 in the central portion, a positive-shaped anode-side base portion 43a, and a negative-shaped configuration. The base portion 43b on the cathode side may have the same effect as long as it has different shapes depending on the polarity.

  The same effect can be obtained even if the color is different depending on the polarity.

(Example 5)
14 is a cross-sectional view of an electronic component according to Embodiment 5 of the present invention, and FIG. 15 is a cross-sectional view illustrating another example of the electronic component according to the embodiment. In addition, about the thing which has the structure similar to the structure of Example 4, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In FIG. 14, the difference from the fourth embodiment is that the lengths of the anode lead wire 52a and the cathode lead wire 52b derived from the electrolytic capacitor main body 21 are different depending on the polarity, and these anode lead wire 52a and cathode lead wire are different. 52b is a compliant pin 34 provided with a concave portion 55a on the anode side and a concave portion 55b on the cathode side, respectively.

  With this configuration, if the compliant pin 34 having a configuration indicating polarity is mistakenly inserted into a lead wire having a different polarity, a normal connection state cannot be obtained, and the polarity is incorrect in appearance. Therefore, it is possible to easily detect that there is a polarity, and it is possible to prevent an error in polarity when assembling the electronic component.

  Further, as shown in FIG. 15, the thicknesses of the anode lead wire 52a and the cathode lead wire 52b derived from the electrolytic capacitor main body 21 are different depending on the polarity, and the anode lead wire 52a and the cathode lead wire 52b are respectively suitable. The same effect can be obtained even when the compliant pin 34 is provided with the anode-side recess 55a and the cathode-side recess 55b.

  The electronic component of the present invention can be applied to an electronic component that can be mounted on a board by press-fitting of a compliant pin.

The perspective view of the electronic component in Example 1 of this invention Sectional drawing of the electronic component in Example 1 of this invention The perspective view which shows the other example of the electronic component in Example 1 of this invention. The perspective view which shows the other example of the electronic component in Example 1 of this invention. The perspective view which shows the other example of the electronic component in Example 1 of this invention. The perspective view which shows the other example of the electronic component in Example 1 of this invention. The perspective view of the electronic component in Example 2 of this invention The bottom view of the electronic component in Example 2 of this invention The perspective view which shows the other example of the electronic component in Example 2 of this invention. The perspective view of the electronic component in Example 3 of this invention The perspective view before the electronic component main body and compliant pin connection of the electronic component in Example 3 of this invention The perspective view of the electronic component in Example 4 of this invention The perspective view which shows the other example of the electronic component in Example 4 of this invention. Sectional drawing of the electronic component in Example 5 of this invention Sectional drawing of the electronic component in Example 5 of this invention Side view of an electronic component having a conventional compliant pin Bottom view of an electronic component having a conventional compliant pin Perspective view of a conventional general electrolytic capacitor Cross section of a conventional general electrolytic capacitor

Explanation of symbols

DESCRIPTION OF SYMBOLS 21 Electrolytic capacitor main body 22 Lead wire 23 Capacitor element 24 Sealing material 25 Exterior metal case 26 Winding part 27 Curled part 28 Connection part 29 End face 30 Lead wire lead-out surface 31 Through hole of circuit board 32 Connection fixing part 33 Base part 34 Compliant pin 35 recess 36 rib 37 lead recess 42a anode side connection fixing part 42b cathode side connection fixing part 43a anode side base 43b cathode side base 52a anode lead wire 52b cathode lead wire 55a anode side recess 55b cathode side Recess 62a Anode lead wire 62b Cathode lead wire 65a Anode recess 65b Cathode recess

Claims (8)

The electronic component main body from which the lead wire is led out and a connecting portion between the lead wire and one end surface abuts on the lead wire lead-out surface of the electronic component main body, and the other tip portion is press-fitted into the through hole of the circuit board. An electronic component comprising a compliant pin provided with a connection fixing portion to be joined. The area of the lead wire lead-out surface of the electronic component main body that is in contact with one end surface of the compliant pin absorbs the load applied when the compliant pin is press-fitted into the through hole of the circuit board. The electronic component according to claim 1, which is a size. The electronic component main body includes a capacitor element having a pair of lead wires and impregnated with a driving electrolyte, a sealing member made of an elastic body, and an exterior metal case, and a pair drawn from the capacitor element The lead wire is passed through the sealing member, the capacitor element is housed in the exterior metal case, and the opening of the exterior metal case is wound together with the sealing member at the tightening portion, and the curled portion The electronic component according to claim 1, wherein the electrolytic capacitor is curled and sealed. The electronic component according to claim 1, wherein a concave portion for fitting the lead wire is provided in the connection portion. The electronic component according to claim 1, wherein a rib for insulating between compliant pins is provided on a lead-out surface of the electronic component main body. The electronic component according to claim 1, wherein a recess for fitting one end surface of the compliant pin is provided on a lead wire lead-out surface of the electronic component main body. The electronic component according to claim 1, wherein the compliant pin is configured to exhibit polarity. 8. The electronic component according to claim 7, wherein the shape of the concave portion into which the lead wire provided in the connecting portion of the compliant pin configured to exhibit the polarity is adapted to the shape of the different lead wire.

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