JP2008089617A - Method for manufacturing fine structure and fine structure manufactured by the method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for inexpensively mass-producing a fine structure, in particular, a three-dimensional fine structure with high accuracy having an inclined sidewall, the three-dimensional fine structure being electroformed to be usable as a fine mold by an easy X-ray exposure system. <P>SOLUTION: In the method for manufacturing a fine structure obtained by developing a resin layer to be exposed by irradiation with X-rays, fine structure 3, 4 having an inclined side wall in the resin layer 1 are obtained through: a partial exposure step of irradiating the resin layer 1 with X-rays for exposure through a patterned X-ray mask 2; a flood exposure step of irradiating the entire surface of the resin layer 1 with X-rays for exposure; and a developing step of developing the resin layer 1 exposed in the partial exposure step and in the flood exposure step. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention provides a method for producing a fine structure obtained by developing an exposed resin layer by irradiating X-rays, a fine structure produced thereby, and electroforming using the fine structure as a matrix. Manufacturing method of a fine metal structure obtained by the above, a fine metal structure produced thereby, a method of producing a fine resin part obtained by molding the fine metal structure as a fine mold, and thereby The present invention relates to a manufactured fine resin part.
[0002]
[Prior art]
In recent years, devices such as transdermal drug delivery devices (Drug Delivery Devices) for the purpose of drug administration to the human body for medical and cosmetic purposes, and micro-integration such as micro-systems for biochemical analysis and chemical synthesis. In the field of chemical chemical devices and the like, with the development of MEMS (Micro Electro Mechanical Systems) technology, various shapes of three-dimensional microstructures are required. Further, there is a need for a three-dimensional fine mold for mass-producing a three-dimensional fine structure such as a micro needle as a transdermal drug delivery device at low cost.
[0003]
As a technology that can produce fine structures even with a high aspect ratio (ratio of height to aperture width), X-rays are irradiated from a synchrotron radiation device, and a very small fine pattern on the X-ray mask is formed on the X-ray sensitive resin layer. There is X-ray lithography, which is an exposure technique that can be accurately transferred. A process of producing a fine metal structure such as a fine mold using this X-ray lithography is called a LIGA (Lithographie Galvanoformung Abformung: German) process.
[0004]
This LIGA process is a processing method that combines electroforming and molding with X-ray lithography. X-rays are irradiated from an SR (synchrotron radiation) light device through an X-ray mask in which an X-ray non-transparent film pattern is formed on the X-ray transparent film, and is made of polymethyl methacrylate (hereinafter referred to as PMMA). By exposing and developing the PMMA substrate, a pattern is formed on the PMMA substrate to form a fine structure. Electroforming is performed using the fine structure as a matrix to form a fine metal structure. Then, by removing the fine metal structure from the fine structure and using it as a fine mold and a mold mold such as a synthetic resin, it becomes possible to mass-produce fine resin parts at low cost. (For example, refer to Patent Document 1).
[0005]
The X-ray lithography is a processing method that takes advantage of the short wavelength and straightness that are the characteristics of X-rays. While the processing depth in semiconductor microfabrication using various laser beams is several microns, the processing depth of several hundred microns to several millimeters can be performed due to the short X-ray wavelength. . Further, because of the straightness and transparency of X-rays, fine processing with a high aspect ratio of 100 or more can be performed.
[0006]
A method for manufacturing a fine structure by X-ray lithography will be described with reference to the drawings. As shown in FIGS. 20 (a) and 21 (a), an X-ray mask 102 having a circular pattern formed on an X-ray non-transmissive film 102a is placed in parallel with a predetermined interval above the PMMA substrate 101. Deploy. X-rays are irradiated perpendicularly to the surface of the PMMA substrate 101 from an SR (synchrotron radiation) light device (not shown), and the PMMA substrate 101 is exposed through the X-ray mask 102.
[0007]
The amount of X-ray irradiation to the PMMA substrate 101 is very high in the straightness of the X-rays irradiated from the SR light device. Therefore, as shown in FIG. On the PMMA substrate 101 immediately below the X-ray non-transparent film 102a, the dose is almost zero, and on the other portions of the PMMA substrate 101, the dose Q is almost uniform. Since the amount of X-ray absorption inside the PMMA substrate 101 depends on the amount of X-ray irradiation irradiated on the surface, the amount of X-ray absorption inside the PMMA substrate 101 after exposure by X-ray irradiation is shown in FIG. As shown in FIG. 21 (b), the portion immediately below the X-ray non-transparent film 102a is almost zero, and in other portions, the X-ray absorption amount is the largest on the surface of the PMMA substrate 101, and the depth from the surface is large. Accordingly, the amount of X-ray absorption decreases approximately exponentially. In FIG. 21, the concentration change inside the PMMA substrate 101 shows the X-ray absorption amount of each part as a model, and the higher the concentration, the larger the X-ray absorption amount. When X-rays are absorbed by PMMA, the molecular weight of PMMA decreases depending on the amount of X-ray absorption.
[0008]
A development step is performed in which PMMA, which has been lowered to a certain molecular weight or less by exposure, is selectively dissolved and removed by a developer. Since the periphery other than the surface of the PMMA substrate 101 is protected from being dissolved by a protective film (not shown) or the like, the PMMA substrate 101 is sequentially dissolved from the surface. Except for the portion directly below the X-ray non-transparent film 102a of the PMMA substrate 101, the X-ray absorption amount is almost the same if the depth from the surface is the same. Therefore, the molecular weight of PMMA inside the PMMA substrate 101 is from the surface. If the depth is the same, it is almost the same. As a result, as shown in FIGS. 21C to 21E, dissolution of PMMA proceeds in sequence while maintaining substantially parallel to the surface of the PMMA substrate 101. On the other hand, in the portion immediately below the X-ray non-transmissive film 102a of the PMMA substrate 101, the X-ray absorption amount is almost zero, so there is almost no decrease in the molecular weight of PMMA inside the PMMA substrate 101, and PMMA hardly dissolves. Therefore, as the development time elapses, as shown in FIGS. 20 (c), 20 (d), 21 (d), and 21 (e), fine structures 103 and 104 having a column are obtained. However, in the portion where the molecular weight decrease very deep in the PMMA substrate 101 is very small, the dissolution rate of PMMA is extremely slow and a very long development time is required. Therefore, as shown in FIG. Thus, although the portion where the molecular weight of PMMA is slightly lowered can be removed by development, a very long development time is required, so that the development is generally terminated after a predetermined time.
[0009]
Thus, because of the straightness that is a feature of X-rays, the fine structures 103 and 104 obtained by X-ray lithography have sidewalls perpendicular to the boundary between the portion immediately below the X-ray non-transmissive film 102a and the other portions. A 2.5-dimensional structure having
[0010]
However, for example, in order to mass-produce the three-dimensional microstructure at a low cost, a high-accuracy three-dimensional fine mold having a high aspect ratio is required, and the three-dimensional fine mold has an inclination suitable for a draft angle. It is necessary to provide a side wall. Therefore, a method for manufacturing a three-dimensional microstructure having inclined sidewalls using X-ray lithography has been proposed.
[0011]
As a method of manufacturing a three-dimensional microstructure having inclined sidewalls using X-ray lithography, there is a method of irradiating X-rays from a direction inclined with respect to the surface of the PMMA substrate 101. As shown in FIG. 22A, an X-ray mask 105 having a circular pattern formed on the X-ray non-transmissive film 105a is arranged in parallel above the PMMA substrate 101 at a predetermined interval. The PMMA substrate 101 is exposed by irradiating X-rays from the SR light device through the X-ray mask 105 from a direction inclined with respect to the surface of the PMMA substrate 101. When the development is performed, as shown in FIG. 22B, a microstructure 106 having an oblique cylinder having a side wall inclined at an angle equal to the X-ray irradiation angle to the surface of the PMMA substrate 101 is obtained.
[0012]
Furthermore, as a method of manufacturing a three-dimensional microstructure having inclined sidewalls using X-ray lithography, a moving mask X-ray that continuously changes the X-ray absorption distribution with respect to depth by moving the X-ray mask. An exposure method has been proposed (see, for example, Patent Document 2). The moving mask X-ray exposure method is a method performed by irradiating and exposing X-rays while moving the X-ray mask relative to the surface of the PMMA substrate. By this moving mask X-ray exposure method, fine structures 108 and 110 having inclined side walls are obtained as shown in FIGS.
[0013]
As shown in FIG. 23A, the X-ray mask 107 in which a pattern having a rectangular opening is formed on the X-ray non-transmissive film 107a is arranged in parallel at a predetermined interval above the PMMA substrate 101. To do. While the X-ray mask 107 is continuously translated by a predetermined distance in the negative direction of the X axis, X-rays are irradiated from the SR light device to expose the PMMA substrate 101. Since the X-ray irradiation amount of the PMMA substrate 101 is as shown in FIG. 23 (b), when developed, the microstructure 108 having an opening with a trapezoidal shape is formed as shown in FIG. 23 (c). can get. Further, a fine structure having an edge-shaped opening can be obtained by changing the moving distance of the X-ray mask.
[0014]
In addition, an X-ray mask 109 in which a pattern having a track-shaped opening is formed on the X-ray non-transmissive film 109a is parallel to the PMMA substrate 101 with a predetermined interval as shown in FIG. To place. The PMMA substrate 101 is exposed by irradiating X-rays from the SR optical device while continuously rotating the X-ray mask 109 around the center of the track-shaped opening as a central axis. Since the X-ray irradiation amount of the PMMA substrate 101 is as shown in FIG. 24B, when it is developed, a microstructure 110 having a truncated cone-shaped opening is obtained as shown in FIG. 24C. It is also possible to obtain a fine structure having a conical opening by changing the pattern of the X-ray mask.
[0015]
Furthermore, as a method of manufacturing a three-dimensional microstructure having inclined sidewalls using X-ray lithography, the PMMA substrate is inclined and rotated by moving mask X-ray exposure to change the X-ray incident direction with respect to the PMMA substrate surface. A multistage exposure system to which a configuration that can be changed is added has also been proposed. With the multi-stage exposure system, a microstructure with a higher degree of freedom can be obtained.
[0016]
The microstructure obtained by each method of manufacturing a three-dimensional microstructure having inclined sidewalls using the X-ray lithography is subjected to electroforming using a matrix as a matrix, and after forming a metal layer, PMMA is removed with a solvent. By removing, a fine metal structure is obtained. The fine metal structure can be used as a mold for a fine resin molded part or the like, or as it is as a fine metal part.
[0017]
[Patent Document 1]
JP 2001-146017 A (page 1-11, FIG. 1 to FIG. 10)
[Patent Document 2]
JP 2000-35500 A (page 1-9, FIG. 2, FIG. 5 to FIG. 8)
[0018]
[Problems to be solved by the invention]
However, each method for manufacturing a three-dimensional microstructure having inclined side walls using the X-ray lithography has a problem that the introduction cost is large because the X-ray exposure system is complicated, and mass production cannot be performed at low cost. It was.
[0019]
In the method of controlling the X-ray irradiation angle, X-rays are uniformly irradiated from one inclined direction with respect to the entire surface of the PMMA substrate through one X-ray mask, so that a fine structure that can be manufactured is very much. Limited. In particular, since it is very difficult to provide an inclined side wall suitable for the draft angle in the fine structure, the fine metal structure after electroforming is not suitable for use as a mold. Further, since the X-ray exposure system becomes complicated, the introduction cost becomes great.
[0020]
In the moving mask X-ray exposure method, the X-ray mask needs to move continuously and uniformly, and there is a limit to the fine structures that can be produced. Further, since the X-ray exposure system for accurately and continuously controlling the movement of the X-ray mask is complicated, the introduction cost becomes great.
[0021]
In the multi-stage exposure system, since the X-ray irradiation angle is controlled in addition to the moving mask X-ray exposure method, the degree of freedom of the fine structure that can be manufactured is high. However, it is very difficult to accurately and continuously control the X-ray irradiation angle and the movement of the X mask, and the X-ray exposure system becomes very complicated, and the introduction cost becomes enormous.
[0022]
The present invention has been made in view of the circumstances and problems described above, and a fine structure, in particular, a three-dimensional microstructure having inclined side walls that can be electroformed and used as a fine mold, is obtained by a simple X-ray. An object of the present invention is to provide a method that can be mass-produced at low cost by an exposure system.
[0023]
[Means for Solving the Problems]
In order to achieve the above object, the fine structure manufacturing method according to claim 1 forms a pattern in the fine structure manufacturing method obtained by developing an exposed resin layer irradiated with X-rays. A partial exposure step of irradiating and exposing the resin layer with an X-ray through an X-ray mask; an overall exposure step of irradiating and exposing the entire surface of the resin layer; and the partial exposure step and the overall exposure step. And a development step of developing the resin layer exposed in step (1), thereby obtaining a microstructure having a side wall inclined on the resin layer.
[0024]
The fine structure manufacturing method according to claim 2 is the fine structure manufacturing method according to claim 1, wherein the partial exposure step is performed a plurality of times using X-ray masks having different patterns. It is characterized by.
[0025]
The fine structure manufacturing method according to claim 3 is the fine structure manufacturing method according to claim 1 or 2, wherein the X-ray in one exposure step of the partial exposure step and the entire surface exposure step. The amount of irradiation is different from the amount of irradiation of the X-rays in other exposure steps.
[0026]
The fine structure manufacturing method according to claim 4 is the fine structure manufacturing method according to any one of claims 1 to 3, wherein one of the partial exposure step and the entire surface exposure step is exposed. The wavelength of the X-ray irradiated in the process is different from the wavelength of the X-ray irradiated in another exposure process.
[0027]
The method for producing a microstructure according to claim 5 is the method for producing a microstructure according to any one of claims 1 to 4, wherein the surface of the resin layer in the partial exposure step or the entire surface exposure step. The exposure is performed by irradiating the X-ray from a direction inclined with respect to the surface.
[0028]
The method for manufacturing a microstructure according to claim 6 is the method for manufacturing a microstructure according to any one of claims 1 to 5, wherein the X-ray mask is used as a surface of the resin layer in the partial exposure step. The exposure is performed by irradiating with the X-rays while being moved relative to each other.
[0029]
The fine structure manufacturing method according to claim 7 is the fine structure manufacturing method according to any one of claims 1 to 6, wherein the X-rays are emitted from a synchrotron radiation light source. It is said.
[0030]
The microstructure manufacturing method according to claim 8 is the microstructure manufacturing method according to any one of claims 1 to 7, wherein the resin layer is made of polymethyl methacrylate.
[0031]
The microstructure according to claim 9 is manufactured by the method for manufacturing a microstructure according to any one of claims 1 to 8.
[0032]
A method for producing a fine metal structure according to a tenth aspect is characterized in that a fine metal structure is obtained by performing electroforming using the fine structure according to the ninth aspect as a matrix.
[0033]
The fine metal structure according to claim 11 is manufactured by the method for manufacturing a fine metal structure according to claim 10.
[0034]
According to a twelfth aspect of the present invention, there is provided a method for producing a fine resin part, wherein the fine metal structure according to the eleventh aspect is molded as a fine mold to obtain a fine resin part.
[0035]
A fine resin component according to a thirteenth aspect is characterized by being manufactured by the method for manufacturing a fine resin component according to the twelfth aspect.
[0036]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. A PMMA substrate 1 having a resin layer made of polymethyl methacrylate (hereinafter referred to as PMMA) is used as a resist substrate for X-ray exposure. By using the PMMA substrate 1, the pattern is transferred with high accuracy by X-rays, but the present invention is not limited to this, and a substrate made of another X-ray sensitive resin layer may be used. As shown in FIG. 1, the manufacturing method of the fine structure according to the first embodiment includes a partial exposure step of irradiating the PMMA substrate 1 with X-rays through an X-ray mask 2 and exposing the PMMA substrate 1. 1 (f) and FIG. 1 comprising a full exposure process for irradiating and exposing the entire surface with X-rays, and a development process for developing the PMMA substrate 1 exposed in the partial exposure process and the full exposure process. This is a method of obtaining the microstructures 3 and 4 having inclined side walls as shown in (g).
[0037]
The PMMA substrate 1 is made of a resin layer made of PMMA and having a thickness of several tens to several hundreds μm. The thickness of the PMMA substrate 1 is appropriately determined according to the size of the microstructures 3 and 4 to be manufactured. The PMMA substrate 1 may have a configuration in which a resin layer made of PMMA and several tens to several hundreds of μm thick is applied on a metal substrate layer made of Ni and made several hundred μm thick. In addition to Ni, the metal substrate layer may be made of a Ni alloy such as NiW or NiFe or a metal plating layer other than the Ni alloy. Further, a metal film formed on a silicon substrate by sputtering can be used as the metal substrate layer.
[0038]
As shown in FIGS. 1A and 2A, an X-ray mask 2 that is a mask for X-ray lithography is arranged in parallel above the PMMA substrate 1 at a predetermined interval. The X-ray mask 2 is formed on an X-ray transmission film which is a support film of a thin film having a thickness of several μm made of a material that easily transmits X-rays such as silicon nitride, SiC, carbon, and polyimide. An X-ray non-transparent film 2a, which is an X-ray absorber having a thickness of several μm, made of an absorbing material that hardly transmits rays is laminated, and a circular pattern is formed on the X-ray non-transparent film 2a.
[0039]
Thereafter, a partial exposure process is performed in which X-rays are irradiated and exposed perpendicularly to the surface of the PMMA substrate 1 from an SR (synchrotron radiation) light device (not shown) through the X-ray mask 2. By using the SR optical device, high-energy X-rays can be easily generated, and high-precision lithography is possible. Since the X-ray irradiation amount to the PMMA substrate 1 in the partial exposure process is very high in the straightness of the X-rays irradiated from the SR light device, as shown in FIG. On the PMMA substrate 1 in the portion (A part) immediately below the X-ray non-transmissive film 2a where X-rays are blocked by the non-permeable film 2a, it becomes almost 0, and on the PMMA substrate 1 in the part other than the A part (B part) The dose Qp is almost uniform.
[0040]
Next, as shown in FIG. 1C and FIG. 2C, the entire surface exposure process of irradiating the entire surface of the PMMA substrate 1 with X-rays and exposing it without passing through the X-ray mask from the SR light device. Do. Since the amount of X-ray irradiation to the PMMA substrate 1 in the entire surface exposure step does not pass through the X-ray mask, the amount of irradiation Qa is almost uniform over the entire surface of the PMMA substrate 1 as shown in FIG.
[0041]
As shown in FIG. 1E, the total amount of X-ray irradiation in the partial exposure process and the entire surface exposure process is Qa in the A portion on the PMMA substrate 1 and Qp + Qa in the B portion.
[0042]
When X-rays are absorbed by PMMA by irradiation with X-rays, radicals are generated, molecular chains are cut, and the molecular weight of PMMA is lowered. The PMMA on the surface irradiated with X-rays has the smallest molecular weight because much X-rays are absorbed by exposure. The internal PMMA has a reduced X-ray absorption amount because the X-rays are attenuated by the absorption of the X-rays by the PMMA molecules present on the PMMA. Thereby, as the depth from the surface of the PMMA substrate 1 increases, the X-ray absorption amount decreases and the molecular weight of PMMA increases.
[0043]
Since the X-ray absorption amount of the PMMA substrate 1 depends on the amount of irradiated X-rays, when illustrated, the X-ray absorption amount when the partial exposure process is completed is as shown in FIG. Further, the X-ray absorption amount when the entire surface exposure process is completed is as shown in FIGS. 2 (d) and 3 (a). 2 and 3, the change in concentration inside the PMMA substrate 1 shows the X-ray absorption amount of each part as a model, and the higher the concentration, the larger the X-ray absorption amount.
[0044]
Wet etching (development process) is performed in which PMMA, which has been lowered to a certain molecular weight or less by exposure, is selectively dissolved and removed by dipping in a developer. The dissolution rate (etching rate) of PMMA by the developer depends on the molecular weight of PMMA as shown as a model in FIG. As is apparent from FIG. 4, the dissolution rate increases as the molecular weight of PMMA falls below M1, and when the molecular weight of PMMA is M1 or higher, the dissolution rate is very slow and PMMA is hardly dissolved. In the region where the molecular weight of PMMA is 0 to M1, the dissolution rate of PMMA depends on the molecular weight, and the dissolution rate decreases rapidly as the molecular weight increases.
[0045]
The present invention positively utilizes the fact that the dissolution rate of PMMA in the development process depends on the molecular weight, and hence the X-ray irradiation amount, and thus has a microstructure having sidewalls inclined from the direction perpendicular to the surface of the PMMA substrate 1. The process in this development process will be described. Since the X-ray dose Qp + Qa of the B portion is larger than the X-ray dose Qa of the A portion on the PMMA substrate 1, the X-ray absorption amount of the B portion is larger than the X-ray absorption amount of the A portion on the surface of the PMMA substrate 1. large. For this reason, the molecular weight of PMMA in the B part is smaller than the molecular weight of PMMA in the A part on the surface of the PMMA substrate 1. The periphery other than the surface of the PMMA substrate 1 is protected so as not to be dissolved by a protective film (not shown) and the like, and the dissolution proceeds from the surface of the PMMA substrate 1 exposed to the developing solution. As shown in (a), the dissolution rate of the surface of the PMMA substrate 1 is faster in the B part than in the A part. In addition, the magnitude | size of the arrow shown in FIG. 3 respond | corresponds to the melt | dissolution rate of PMMA.
[0046]
When the development process is started and a minute time has elapsed, as shown in FIG. 3B, due to the difference in the dissolution rate of PMMA on the surface of the PMMA substrate 1, the A part remains and the side face is located at the boundary with the B part. PMMA dissolves as provided. At this time, since the side surface of the A portion is exposed to the developer, the dissolution of PMMA proceeds in a direction perpendicular to the side surface, that is, in the lateral direction in FIG. However, this is because a minute time course of the development process is considered to proceed discretely. Actually, since the time course of the development process proceeds continuously, the A part dissolves sequentially from the surface, and the dissolution rate of the adjacent B part is faster than the dissolution rate from the surface of the A part. As the portion B is dissolved, the side surface of the portion A is exposed to the developing solution in the order close to the surface, so that the dissolution proceeds in an oblique direction as shown in FIGS. 3 (c) and 3 (d).
[0047]
When the development is completed after a predetermined time has elapsed, as shown in FIGS. 1 (f), 2 (e) and 3 (e), a microstructure 3 having a conical shape made of PMMA is obtained. When the development time further elapses, the PMMA dissolution further proceeds, but the portion where the molecular weight of the PMMA in the part A is not lowered does not dissolve, so that as shown in FIG. 1 (g) and FIG. A microstructure 4 made of PMMA with a conical shape on top is obtained. As described above, desired microstructures 3 and 4 can be obtained by adjusting the development time. Similar effects can also be obtained by adjusting the X-ray dose in the overall exposure process.
[0048]
By changing the pattern formed on the X-ray non-transmissive film 2a of the X-ray mask 2, another desired fine structure can be obtained. Hereinafter, an example in which another pattern is formed on an X-ray mask will be shown, and a microstructure obtained thereby will be described with reference to the drawings.
[0049]
When the pattern of the X-ray non-transmissive film 21a of the X-ray mask 21 has a circular opening as shown in FIG. 5A, the X-ray irradiation dose in the partial exposure process is as shown in FIG. 5B. become. Since the X-ray irradiation dose in the entire surface exposure process shown in FIG. 5C is as shown in FIG. 5D, the total X-ray irradiation dose in the partial exposure step and the entire exposure step is shown in FIG. As shown in (e). By developing the PMMA substrate 1, as shown in FIG. 5 (f), a fine structure 5 in which a truncated cone shape is perforated on the surface, or a conical surface on the surface as shown in FIG. 5 (g). A fine structure 6 in which the shape is perforated is obtained.
[0050]
In addition, when the pattern of the X-ray non-transmissive film 22a is an X-ray mask 22 called Line & Space Mask in which rectangles are continuous while providing a predetermined interval as shown in FIG. The irradiation dose is as shown in FIG. Since the X-ray irradiation dose in the whole surface exposure process shown in FIG. 6C is as shown in FIG. 6D, the total X-ray irradiation dose in the partial exposure step and the whole surface exposure step is shown in FIG. As shown in (e). By developing the PMMA substrate 1, as shown in FIG. 6 (f), the fine structure 7 continuously having a shape in which the trapezoid extends, or the edge shape as shown in FIG. 6 (g). A continuously provided microstructure 8 is obtained.
[0051]
Further, when the pattern of the X-ray non-transmissive film 23a of the X-ray mask 23 is a shape in which a plurality of circles and a plurality of thin lines are combined as shown in FIG. As shown in FIG. 7B, the entire surface exposure process is performed. By developing the PMMA substrate 1, a fine structure 9 having a conical shape and an edge shape can be obtained as shown in FIG. Further, the conical shape and the edge shape may be a shape obtained by extending the frustoconical shape or the trapezoid, and the heights thereof may be varied. Such a microstructure is particularly useful in the field of micro-integrated chemical devices such as micro-systems that perform biochemical analysis and chemical synthesis.
[0052]
Further, when the X-ray non-transmissive film 24a pattern of the X-ray mask 24 has a shape in which circular shapes are arranged in an array as shown in FIG. 8A, after undergoing a partial exposure step and a full exposure step, By developing the PMMA substrate 1, a fine structure 10 in which cones as shown in FIG. 8F are arranged in an array or a cone on a cylinder as shown in FIG. Microstructures 11 whose shapes are arranged in an array are obtained. By dividing these individually, a large number of conical shapes or fine parts having a conical shape on a cylinder can be obtained. Furthermore, by changing the pattern size, development time, X-ray irradiation amount, etc., the conical shape can be made into a needle-like protrusion, for example, as a micro needle as a transdermal drug delivery device. Can be used. As exemplified above, a desired microstructure having inclined sidewalls can be obtained by appropriately changing the pattern shape of the X-ray mask, the development time, the X-ray irradiation dose, and the like.
[0053]
The fine structure obtained by completing the development step may be used as it is, but it is also possible to obtain a fine metal structure by further performing electroforming using the fine structure as a matrix. A method for manufacturing the fine metal structure 31 by electroforming using the fine structure 30 as a matrix will be described with reference to the drawings. A plating film made of, for example, nickel is formed on the surface of the microstructure 30 shown in FIG. Subsequently, electroplating is performed using the plating film as a conductive layer film to form a metal layer 31 made of nickel, a nickel alloy, or the like, as shown in FIG. 9B. In electroforming, a cathode electrode and an anode electrode, which serve as a matrix, are placed in an electroplating bath filled with an electroforming bath, and a metal layer is electrodeposited on the cathode according to the principle of plating. This is a processing method for obtaining a replicated version. Thereafter, when the fine structure 30 made of PMMA is removed with a solvent, a fine metal structure 31 is obtained as shown in FIG. The fine metal structure 31 is used as a fine mold for a fine resin molded part or the like, or as a fine metal part as it is. When used as a fine mold, the fine metal structure 31 has inclined side walls suitable for a draft angle. This is because, in the development step, the closer to the surface of the PMMA substrate 1, the faster PMMA dissolves, so that each side wall is inclined so as to spread toward the surface. Further, for example, the electroforming process is performed using a microstructure in which the same specific shape such as a cone shape or a truncated cone shape is arranged in an array like the microstructure 10 shown in FIG. 8F. As a result, a fine metal structure in which the shape of the fine structure is inverted is obtained, so that a large number of fine metal structure parts can be obtained by dividing the fine metal structure individually.
[0054]
Furthermore, by using the fine metal structure 31 as a fine mold, the fine resin parts 35 and 36 can be obtained by molding such as hot embossing and injection molding. A method of manufacturing the fine resin parts 35 and 36 by hot embossing will be described with reference to the drawings. First, in a state in which a resin plate 32 in which a resin layer 34 made of a plate-like acrylic resin having a thickness equal to or larger than the thickness of the metal pattern layer in the fine mold 31 is heated on a metal plate 33 made of stainless steel or the like, FIG. As shown to (a), it presses against the fine metal mold | die 31 which processed the mold release agent. As shown in FIG. 10B, the process waits until the acrylic resin of the resin layer 34 is solidified. When the fine mold 31 and the metal plate 33 are removed from the acrylic resin after the acrylic resin is solidified, a fine resin part 35 made of the acrylic resin is completed as shown in FIG. Further, for example, in the case of the fine resin parts 35 in which the needle-like protrusions are arranged in an array, as shown in FIG. 10D, the fine resin parts 36 having a large number of needle-like protrusions are obtained by being separated individually. In addition to the acrylic resin, a resin such as polystyrene, an epoxy resin, or a polycarbonate resin may be used as the resin layer 34.
[0055]
In addition, although the said whole surface exposure process was performed after the said partial exposure process, as shown in FIG. 11, you may perform a partial exposure process after a whole surface exposure process. As shown in FIG. 11A, the entire surface of the PMMA substrate 1 is irradiated with X-rays and exposed without passing through the X-ray mask from the SR light device. Since the amount of X-ray irradiation to the PMMA substrate 1 in the entire surface exposure step does not pass through the X-ray mask, the amount of irradiation Qa is almost uniform over the entire surface of the PMMA substrate 1 as shown in FIG.
[0056]
Thereafter, as shown in FIG. 11C, the X-ray mask 2 is arranged in parallel above the PMMA substrate 1 with a predetermined interval. The X-ray mask 2 is the same as the X-ray mask 2 shown in FIG. 1A, and a circular pattern is formed on the X-ray non-transmissive film 2a. A partial exposure process is performed on the PMMA substrate 1 via the X-ray mask 2 from the SR light device to perform exposure by irradiating with X-rays perpendicular to the surface of the PMMA substrate 1. The amount of X-ray irradiation to the PMMA substrate 1 in the partial exposure step is substantially 0 in the portion immediately below the X-ray transmissive film 2a on the PMMA substrate 1, as shown in FIG. In this case, the dose Qp is almost uniform.
[0057]
As shown in FIG. 11 (e), the distribution of the total amount of X-ray irradiation in the whole surface exposure step and the partial exposure step is the same as the distribution of the total amount of X-ray irradiation shown in FIG. 1 (e). Since the distribution of the total amount of X-ray irradiation is the same, the distribution of the molecular weight of PMMA inside the PMMA substrate 1 is the same, and therefore, through the same process as the development process, FIG. 11 (f) and FIG. As shown in g), the same fine structures 3 and 4 as in FIGS. 1 (f) and 1 (g) are obtained. Thus, if the distribution of the total amount of X-ray irradiation on the PMMA substrate 1 is the same and the subsequent development process is the same, the same fine structure can be obtained, and the partial exposure process and the entire surface exposure are performed. Unaffected before and after the process sequence.
[0058]
Next, a second embodiment of the present invention will be described with reference to the drawings. The fine structure manufacturing method according to the second embodiment is different from the fine structure manufacturing method according to the first embodiment in that the partial exposure process forms patterns as shown in FIG. This method is performed a plurality of times using the X-ray mask.
[0059]
An X-ray mask 25 in which a circular pattern is formed on the X-ray non-transmissive film 25a is arranged in parallel at a predetermined interval above the PMMA substrate 1 as shown in FIG. A first partial exposure process is performed on the PMMA substrate 1 through the X-ray mask 25 to irradiate the surface of the PMMA substrate 1 with X-rays perpendicularly. As shown in FIG. 12B, the X-ray irradiation amount on the PMMA substrate 1 in the partial exposure process is substantially 0 in the portion immediately below the X-ray transmission film 25a on the PMMA substrate 1, and the other portions. In this case, the dose Qp1 is almost uniform.
[0060]
Thereafter, as shown in FIG. 12C, a circular pattern larger than the circular pattern of the X-ray non-transmissive film 25a is formed on the X-ray non-transmissive film 26a at a predetermined interval above the PMMA substrate 1. After the X-ray mask 26 is arranged in parallel, the second partial exposure is performed by irradiating the PMMA substrate 1 from the SR light device via the X-ray mask 26 with X-rays perpendicularly to the surface of the PMMA substrate 1 for exposure. Perform the process. As shown in FIG. 12D, the X-ray irradiation amount on the PMMA substrate 1 in the partial exposure process is almost 0 in the portion immediately below the X-ray transmission film 26a on the PMMA substrate 1, and the other portions. In this case, the dose Qp2 is almost uniform.
[0061]
After that, as shown in FIG. 12E, the entire surface of the PMMA substrate 1 is irradiated with X-rays and exposed without passing through the X-ray mask from the SR light device. As shown in FIG. 12 (f), the X-ray irradiation amount on the PMMA substrate 1 in the entire surface exposure step becomes a substantially uniform irradiation amount Qa on the entire surface of the PMMA substrate 1.
[0062]
As shown in FIG. 12G, the total amount of X-ray irradiation in the two partial exposure processes and the entire surface exposure process is directly below the X-ray non-transmissive film 25a and the X-ray non-transmissive film 26a on the PMMA substrate 1. The portion is Qa, the portion immediately below the X-ray non-transmissive film 26a on the PMMA substrate 1 is Qp1 + Qa, and the other portions on the PMMA substrate 1 are Qp1 + Qp2 + Qa. By developing the PMMA substrate 1, a fine structure 12 as shown in FIG. 12 (h) is obtained.
[0063]
The partial exposure process is not limited to two times, and may be three times or more. Moreover, it is not limited to performing a whole surface exposure process after a several partial exposure process, You may perform a several partial exposure process after a whole surface exposure process, and after performing a whole surface exposure process after one or several times of partial exposure processes, Further, one or more partial exposure steps may be performed. In addition, the shape of the X-ray mask pattern in the partial exposure process is not limited to a circle, and may be various shapes. In the plurality of partial exposure processes, the same X-ray mask is used and the pattern is changed by changing the installation state of the X-ray mask. May be. In this way, by performing the partial exposure process a plurality of times, processing with a higher degree of freedom is possible, and various fine structures can be obtained.
[0064]
Next, a third embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 13 to FIG. 15, the manufacturing method of the microstructure according to the third embodiment is the amount of irradiation with X-rays in one exposure step in the first or second embodiment. However, this is a method different from the amount of X-ray irradiation in other exposure processes.
[0065]
As shown in FIGS. 13A and 14A, the X-ray mask 2 is arranged in parallel above the PMMA substrate 1 at a predetermined interval. The X-ray mask 2 is the same as the X-ray mask 2 shown in FIG. 1A of the first embodiment, and a circular pattern is formed on the X-ray non-transmissive film 2a. A partial exposure process is performed on the PMMA substrate 1 via the X-ray mask 2 from the SR light device to perform exposure by irradiating with X-rays perpendicular to the surface of the PMMA substrate 1. As shown in FIG. 13B, the X-ray irradiation amount on the PMMA substrate 1 in the partial exposure process is substantially 0 in the portion immediately below the X-ray transmission film 2a on the PMMA substrate 1, and the other portions. In this case, the dose Qp ′ is almost uniform.
[0066]
Thereafter, as shown in FIGS. 13 (c) and 14 (c), the entire surface of the PMMA substrate 1 is irradiated with X-rays and exposed without passing through the X-ray mask from the SR light device. . As shown in FIG. 13D, the X-ray irradiation amount on the PMMA substrate 1 in the entire surface exposure step becomes a substantially uniform irradiation amount Qa ′ on the entire surface of the PMMA substrate 1. Here, the dose Qp ′ is different from the dose Qa ′. The X-ray irradiation amount is determined by the integral sum of the X-ray irradiation intensity and the irradiation time.
[0067]
Since the X-ray irradiation amount to the PMMA substrate 1 when the partial exposure step and the entire exposure step are completed is as shown in FIG. 13E, the X-ray absorption amount inside the PMMA substrate 1 is as shown in FIG. As shown in e), it is apparent that the case where the X-ray dose Qp in the partial exposure process is equal to the X-ray dose Qa in the entire exposure process is different from FIG. By developing the PMMA substrate 1, a microstructure 13 as shown in FIG. 13 (f) different from the microstructures 3 and 4 shown in FIG. 1 (f) and FIG. 1 (g) is obtained.
[0068]
FIG. 15 shows a case where exposure is performed by changing the X-ray dose in the partial exposure process in which multiple exposures are performed. FIG. 15 shows a case where the X-ray irradiation dose is changed between the first time and the second time in the partial exposure process of FIG. 12 in the second embodiment. By making the X-ray dose Qp1 ′ in the first partial exposure step different from the X-ray dose Qp2 ′ in the second partial exposure step, the X-ray dose Qp1 in the first partial exposure step and the second time A fine structure 14 as shown in FIG. 15 (h) is different from the fine structure 12 as shown in FIG. 12 (h) obtained when the X-ray dose Qp2 in the partial exposure step is equal. can get. In this way, by making the amount of X-ray irradiation in one exposure process different from the amount of X-ray irradiation in another exposure process, processing with a higher degree of freedom becomes possible and various microstructures Can be obtained.
[0069]
Next, a fourth embodiment of the present invention will be described. The fine structure manufacturing method according to the fourth embodiment is the fine structure manufacturing method according to the first to third embodiments, wherein the wavelength of X-rays irradiated in one exposure step is: This is a method different from the wavelength of X-rays irradiated in other exposure steps. When the wavelength of X-rays to be irradiated is long, the absorption by PMMA increases, so the decrease in the molecular weight of PMMA near the surface of the PMMA substrate increases but does not reach deeply. On the other hand, when the wavelength of X-rays to be irradiated is short, absorption by PMMA becomes small, so that the molecular weight inside the deeper PMMA substrate can be reduced. In this way, by varying the wavelength of the X-rays to be irradiated, it is possible to increase the variety of aspects of the difference in the amount of X-ray absorption inside the PMMA substrate after the both exposure steps, and further processing with a high degree of freedom. A variety of microstructures can be obtained.
[0070]
Next, a fifth embodiment of the present invention will be described with reference to the drawings. The microstructure manufacturing method according to the fifth embodiment includes a partial exposure step in the microstructure manufacturing method according to the first to fourth embodiments, as shown in FIGS. In the overall exposure process, the exposure is performed by irradiating X-rays from a direction inclined with respect to the surface of the PMMA substrate 1.
[0071]
As shown in FIGS. 16A and 17A, an X-ray mask 27 having a circular pattern formed on the X-ray non-transmissive film 27a is arranged in parallel above the PMMA substrate 1 with a predetermined interval therebetween. After the arrangement, a partial exposure process is performed in which X-rays are irradiated from the SR light device and exposed from a direction inclined with respect to the surface of the PMMA substrate 1. By inclining the PMMA substrate 1 with respect to the X-ray irradiation direction from the SR optical device, X-rays are irradiated from the direction inclined with respect to the surface of the PMMA substrate 1.
[0072]
When the X-rays are blocked by the X-ray transmission film 27a, as shown in FIG. 17B, the circular pattern of the X-ray transmission film 27a inclined at an angle equal to the X-ray irradiation angle is extended. In the A part inside the PMMA substrate 1, the X-ray absorption amount in the partial exposure process is almost zero. In the B part inside the PMMA substrate 1 other than the A part, the X-ray absorption amount decreases as the depth from the surface of the PMMA substrate 1 becomes deeper.
[0073]
Thereafter, as shown in FIGS. 16 (b) and 17 (c), the entire surface of the PMMA substrate 1 is irradiated with X-rays and exposed without passing through the X-ray mask from the SR light device. . At this time, the X-rays from the SR light device may be irradiated from a direction inclined with respect to the surface of the PMMA substrate 1 or may be irradiated vertically. Since no X-ray mask is used, the X-ray absorption amount inside the PMMA substrate 1 in the partial exposure process and the entire exposure process is as shown in FIG. By developing the PMMA substrate 1, the fine structure 15 as shown in FIGS. 16C and 17E or the X-ray irradiation as shown in FIGS. 16D and 17F is used. A microstructure 16 is also obtained which also has sidewalls inclined at an angle equal to the angle. As described above, in the partial exposure process, X-rays are irradiated and exposed from a direction inclined with respect to the surface of the PMMA substrate, thereby enabling processing with a higher degree of freedom and obtaining various fine structures.
[0074]
In addition, although the said whole surface exposure process was performed after or before the said partial exposure process by providing a time difference, you may perform a partial exposure process and a whole surface exposure process simultaneously. In this case, a plurality of SR optical devices are used, and one SR optical device irradiates the entire surface of the PMMA substrate without passing through an X-ray mask, and at the same time from another SR optical device. Irradiates the same PMMA substrate with X-rays through an X-ray mask.
[0075]
Next, a sixth embodiment of the present invention will be described with reference to the drawings. The microstructure manufacturing method according to the sixth embodiment includes a partial exposure step in the microstructure manufacturing method according to the first and fifth embodiments, as shown in FIGS. In this method, the PMMA substrate 1 is irradiated with X-rays and exposed while the X-ray masks 28 and 29 are continuously moved. That is, the moving mask X-ray exposure method is used in the partial exposure process.
[0076]
As shown in FIG. 18A, the X-ray mask 28 in which a pattern having a rectangular opening is formed on the X-ray non-transmissive film 28a is arranged in parallel above the PMMA substrate 1 at a predetermined interval. . The X-ray mask 28 is irradiated with X-rays perpendicularly to the surface of the PMMA substrate 1 while being exposed to X-rays from the SR light device while being continuously translated by a predetermined distance in the negative direction of the X-axis. An exposure process is performed. As shown in FIG. 18B, the amount of X-ray irradiation to the PMMA substrate 1 in the partial exposure process is almost zero in the portion that is always directly under the X-ray transmission film 28a on the PMMA substrate 1, The portion of the substrate 1 that is not always directly below the X-ray transparent film 28a has a substantially uniform dose Qp, and the movement of the X-ray mask 28 may or may not be directly below the X-ray transparent film 28a. In the upper part, the X-ray dose is continuously distributed according to the X-ray dose.
[0077]
Thereafter, as shown in FIG. 18C, the entire surface of the PMMA substrate 1 is irradiated with X-rays and exposed without passing through the X-ray mask from the SR light device. As shown in FIG. 18D, the X-ray irradiation amount on the PMMA substrate 1 in the entire surface exposure step becomes a substantially uniform irradiation amount Qa on the entire surface of the PMMA substrate 1.
[0078]
The total amount of X-ray irradiation in the partial exposure process and the entire partial process is as shown in FIG. By developing the PMMA substrate 1, a fine structure 17 as shown in FIG. 18F is obtained.
[0079]
Further, an X-ray mask 29 in which a pattern having a track-shaped opening is formed on the X-ray non-transmissive film 29a is parallel to the PMMA substrate 1 with a predetermined interval as shown in FIG. 19A. To place. While continuously rotating the X-ray mask 29 around the center of the track-shaped opening around the center, the SR light device emits X-rays, and the X-rays are irradiated perpendicularly to the surface of the PMMA substrate 1 for exposure. A partial exposure process is performed. As shown in FIG. 19B, the amount of X-ray irradiation to the PMMA substrate 1 in the partial exposure process is almost 0 in the portion that is always directly under the X-ray transmission film 29a on the PMMA substrate 1, The portion of the substrate 1 that is not always directly below the X-ray transmissive film 29a has a substantially uniform dose Qp, and the movement of the X-ray mask 29 may or may not be directly below the X-ray transmissive film 29a. In the upper part, the X-ray dose is continuously distributed according to the X-ray dose.
[0080]
After that, as shown in FIG. 19C, the entire surface of the PMMA substrate 1 is irradiated with X-rays and exposed without passing through the X-ray mask from the SR light device. As shown in FIG. 19D, the X-ray irradiation amount on the PMMA substrate 1 in the entire surface exposure step becomes a substantially uniform irradiation amount Qa on the entire surface of the PMMA substrate 1.
[0081]
The total amount of X-ray irradiation to the PMMA substrate 1 in the partial exposure process and the entire partial process is as shown in FIG. By developing the PMMA substrate 1, the inclined surface is steeper than the microstructures 5 and 6 shown in FIGS. 5 (f) and 5 (g), as shown in FIGS. 19 (f) and 19 (g). Such fine structures 18 and 19 are obtained. In this way, by using the moving mask X-ray exposure method in the partial exposure process, processing with a higher degree of freedom becomes possible and various fine structures can be obtained.
[0082]
Further, the partial exposure process may be performed by a multistage exposure system in which a moving mask X-ray exposure method is added to a configuration in which the PMMA substrate can be tilted and rotated to change the X-ray incident direction on the PMMA substrate surface. . As a result, processing with a higher degree of freedom becomes possible, and various fine structures can be obtained.
[0083]
【The invention's effect】
As is apparent from the above description, according to the method for manufacturing a fine structure according to claim 1, a partial exposure step of irradiating the resin layer with X-rays through an X-ray mask and exposing, and the entire surface of the resin layer Since there is a whole surface exposure step of irradiating and exposing X-rays and a development step of developing the resin layer exposed in the partial exposure step and the whole surface exposure step, the difference in the amount of X-ray absorption inside the resin layer after exposure Since the dissolution rate of the resin layer in the development process differs depending on the size, a fine structure having side walls inclined in the resin layer can be manufactured. In addition, since the resin layer is exposed by irradiating X-rays, a highly accurate fine structure having a high aspect ratio can be manufactured. Moreover, since a general simple X-ray exposure system can be used and it is not necessary to introduce a complicated X-ray exposure system, the introduction cost can be reduced, and a fine structure can be manufactured at low cost. . In addition, for example, by performing a partial exposure process through an X-ray mask having a pattern in which circular shapes are arranged in an array, a fine structure in which the same shape such as a cone is arranged in an array can be manufactured. By dividing individual parts, it is possible to mass-produce fine structure parts at low cost.
[0084]
According to the microstructure manufacturing method of claim 2, since the partial exposure process is performed a plurality of times using X-ray masks having different patterns, the difference in the amount of X-ray absorption inside the resin layer after exposure. Since the diversity of this aspect can be increased, processing with a higher degree of freedom is possible, and various microstructures can be manufactured.
[0085]
According to the microstructure manufacturing method of claim 3, the amount of X-ray irradiation in one exposure step is different from the amount of X-ray irradiation in the other exposure step. Since it is possible to increase the diversity of the modes of differences in the amount of linear absorption, processing with a higher degree of freedom is possible, and a variety of microstructures can be manufactured.
[0086]
According to the microstructure manufacturing method of claim 4, since the wavelength of X-rays irradiated in one exposure step is different from the wavelength of X-rays irradiated in another exposure step, X inside the resin layer after exposure Since it is possible to increase the diversity of the modes of differences in the amount of linear absorption, processing with a higher degree of freedom is possible, and a variety of microstructures can be manufactured.
[0087]
According to the method for manufacturing a fine structure according to claim 5, since exposure is performed by irradiating with X-rays from a direction inclined with respect to the surface of the resin layer in the partial exposure step or the overall exposure step, the inside of the resin layer after exposure Therefore, it is possible to increase the variety of aspects of the difference in the amount of X-ray absorption, so that processing with a higher degree of freedom is possible, and various fine structures can be manufactured.
[0088]
According to the method for manufacturing a fine structure according to claim 6, since the X-ray mask is irradiated and exposed while moving the X-ray mask relative to the surface of the resin layer in the partial exposure step, the resin layer after the exposure Since it is possible to increase the diversity of the aspects of the difference in the amount of internal X-ray absorption, processing with a higher degree of freedom is possible, and various microstructures can be manufactured.
[0089]
According to the fine structure manufacturing method of the seventh aspect, since X-rays are emitted from the synchrotron radiation source, high-energy X-rays can be easily generated and high-precision lithography is possible. The microstructure can be manufactured.
[0090]
According to the fine structure manufacturing method of the eighth aspect, since the resin layer is made of polymethylmethacrylate, the pattern is transferred with high accuracy by X-rays, and a highly accurate fine structure can be manufactured.
[0091]
According to the microstructure of the ninth aspect, since the microstructure is manufactured by the manufacturing method of the microstructure, the microstructure is inexpensive and can be suitably used as a highly accurate component.
[0092]
According to the method for producing a fine metal structure according to claim 10, since the fine metal structure is obtained by performing electroforming using the fine structure as a matrix, a highly accurate fine metal having a shape obtained by inverting the fine structure. A structure can be manufactured. Also, the closer to the surface of the resin layer in the development process, the faster the resin dissolves, so that it is possible to manufacture a fine structure that is inclined so that the side wall expands toward the surface, and is suitably used as a high-precision mold. A fine metal structure can be produced. Further, for example, a fine metal structure in which the same shape is arranged in an array can be manufactured. Therefore, by dividing the individual, high-precision fine metal structure parts can be mass-produced at low cost.
[0093]
According to the fine metal structure of the eleventh aspect, since the fine metal structure is manufactured by the method of manufacturing the fine metal structure, the fine metal structure is inexpensive and has high precision fine metal parts or high It can be suitably used as an accurate fine mold.
[0094]
According to the method of manufacturing a fine resin part of claim 12, since the fine metal structure is used as a fine mold to perform a molding process such as injection molding or hot embossing, a fine resin part is manufactured. Can be mass-produced at low cost. In addition, for example, if a fine mold in which the same shape is arranged in an array is used, the fine resin parts obtained by performing the molding process are divided into individual parts, and high-precision fine resin parts that are individually divided are obtained. It can be mass-produced at low cost.
[0095]
According to the fine resin component of the thirteenth aspect, since the fine resin component is manufactured by the method of manufacturing the fine resin component, the fine resin component is inexpensive and can be suitably used as a highly accurate component.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing a manufacturing method of a fine structure and an X-ray irradiation dose according to a procedure according to a first embodiment of the present invention.
FIG. 2 is an explanatory diagram showing the X-ray absorption amount inside the PMMA substrate according to the manufacturing method of the microstructure shown in FIG. 1 along the procedure.
FIG. 3 is an explanatory view showing a process of dissolving PMMA by the method for manufacturing a microstructure shown in FIG.
FIG. 4 is a graph showing the relationship between the molecular weight of PMMA and the dissolution rate.
FIG. 5 is an explanatory view showing another fine structure manufacturing method and X-ray irradiation dose according to the procedure according to the first embodiment of the present invention;
FIG. 6 is an explanatory view showing another fine structure manufacturing method and X-ray irradiation dose according to the procedure according to the first embodiment of the present invention.
FIG. 7 is an explanatory view showing another fine structure manufacturing method according to the first embodiment of the present invention along its procedure;
FIG. 8 is an explanatory view showing another fine structure manufacturing method according to the first embodiment of the present invention along its procedure;
FIG. 9 is an explanatory view showing a method of manufacturing a fine metal structure in which electroforming is performed on the fine structure along the procedure thereof.
FIG. 10 is an explanatory view showing a method of manufacturing a fine resin part for performing hot embossing on a fine mold along the procedure thereof.
FIG. 11 is an explanatory view showing another fine structure manufacturing method and X-ray irradiation dose according to the procedure according to the first embodiment of the present invention;
FIG. 12 is an explanatory diagram showing a microstructure manufacturing method and an X-ray irradiation dose according to the procedure according to the second embodiment of the present invention.
FIG. 13 is an explanatory diagram showing a microstructure manufacturing method and an X-ray irradiation dose according to the procedure of the third embodiment of the present invention.
FIG. 14 is an explanatory diagram showing the X-ray absorption amount inside the PMMA substrate by the method for manufacturing the microstructure shown in FIG. 13 along the procedure.
FIG. 15 is an explanatory view showing another fine structure manufacturing method and X-ray absorption amount according to the procedure of the third embodiment of the present invention.
FIG. 16 is an explanatory view showing the microstructure manufacturing method according to the fifth embodiment of the present invention along its procedure.
17 is an explanatory view showing the X-ray absorption amount inside the PMMA substrate according to the manufacturing method of the fine structure shown in FIG. 16 along the procedure thereof.
FIG. 18 is an explanatory diagram showing a microstructure manufacturing method and an X-ray irradiation dose according to the procedure according to the sixth embodiment of the present invention.
FIG. 19 is an explanatory view showing another microstructure manufacturing method and X-ray irradiation dose according to the procedure according to the sixth embodiment of the present invention.
FIG. 20 is an explanatory view showing a conventional microstructure manufacturing method and X-ray irradiation dose along the procedure thereof.
FIG. 21 is an explanatory diagram showing the X-ray absorption amount inside the PMMA substrate by the method for manufacturing the microstructure shown in FIG. 20 along the procedure;
FIG. 22 is an explanatory view showing a conventional method for manufacturing a microstructure along the procedure thereof.
FIG. 23 is an explanatory view showing another conventional method for manufacturing a microstructure along the procedure thereof.
FIG. 24 is an explanatory view showing another conventional microstructure manufacturing method and X-ray irradiation dose along the procedure thereof.
[Explanation of symbols]
1 PMMA substrate (resin layer)
2, 21-29 X-ray mask
2a, 21a to 29a X-ray non-permeable membrane
3-19, 30 microstructure
31 Fine metal structure (metal layer, fine mold)
32 resin plate
33 Metal plate
34 Resin layer
35, 36 Fine resin parts

Claims (13)

In the manufacturing method of the fine structure obtained by developing the exposed resin layer by irradiating X-rays,
A partial exposure step of irradiating and exposing the resin layer with an X-ray through a patterned X-ray mask;
An overall exposure step of exposing the entire surface of the resin layer by irradiating with X-rays;
And a development step of developing the resin layer exposed in the partial exposure step and the overall exposure step, thereby obtaining a fine structure having an inclined side wall in the resin layer. Body manufacturing method.   The method for manufacturing a microstructure according to claim 1, wherein the partial exposure step is performed a plurality of times using X-ray masks having different patterns formed thereon.   The amount of irradiation with the X-rays in one exposure step among the partial exposure step and the overall exposure step is different from the amount of irradiation with the X-rays in another exposure step. The manufacturing method of the microstructure described in 1.   4. The wavelength of the X-ray irradiated in one exposure step among the partial exposure step and the entire surface exposure step is different from the wavelength of the X-ray irradiated in another exposure step. The manufacturing method of the microstructure according to any one of the above.   5. The microstructure according to claim 1, wherein the X-ray is irradiated and exposed from a direction inclined with respect to a surface of the resin layer in the partial exposure step or the entire surface exposure step. Body manufacturing method.   6. The exposure according to claim 1, wherein the X-ray mask is irradiated and exposed while the X-ray mask is moved relative to the surface of the resin layer in the partial exposure step. A manufacturing method of a fine structure.   The method for manufacturing a microstructure according to any one of claims 1 to 6, wherein the X-ray is emitted from a synchrotron radiation source.   The method for producing a microstructure according to any one of claims 1 to 7, wherein the resin layer is made of polymethyl methacrylate.   A microstructure manufactured by the method for manufacturing a microstructure according to any one of claims 1 to 8.   A method for producing a fine metal structure, wherein the fine metal structure is obtained by performing electroforming using the fine structure according to claim 9 as a matrix.   A fine metal structure manufactured by the method for manufacturing a fine metal structure according to claim 10.   A method for producing a fine resin part, wherein the fine metal structure according to claim 11 is molded as a fine mold to obtain a fine resin part.   A fine resin part produced by the method for producing a fine resin part according to claim 12.

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