JP2008087338A - Inkjet head driving board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inkjet head driving board which permits a board size to be reduced and permits space to be saved on. <P>SOLUTION: The inkjet head driving board has: a plurality of head driving circuits 11a to 11h with common functions provided for every head to drive a plurality of heads 10a to 10h; and a plurality of circuits 13, 14, 15 and 16 with different functions employed to control the head driving circuits 11a to 11h. The head driving circuits 11a to 11h are grouped into head driving circuit groups 11, the head driving circuit groups 11 are arranged in boards 1A and 1B, respectively, and the circuits 13, 14, 15 and 16 with different functions are separately arranged in the boards 1A and 1B, respectively. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a drive substrate for an ink jet head, and more particularly, to a drive substrate for an ink jet head that can reduce the size of the substrate and save space.

  Inkjet printers that record on the recording material by ejecting ink droplets from the nozzles of the head are equipped with a plurality of dedicated heads for each color, thereby providing high-definition full-color images comparable to photographic images. It is possible to record.

  Usually, a plurality of heads are mounted on a common carriage together with a drive board provided with a circuit necessary for driving the heads, and ink droplets are ejected from the nozzles of each head in the process of reciprocating the carriage in the main scanning direction. By discharging, images are continuously recorded on the recording material.

  By the way, considering the configuration of the drive substrate for driving the head, when the head is a piezo element, when performing an operation of ejecting droplets such as ink from the head, a constant voltage is applied to the piezo element for a certain period of time. The piezo element is operated to give a discharge force to the ink. However, each head has a drive circuit that configures such a drive waveform like an electric circuit. Each head also has a data transfer circuit system for determining which nozzle of each head ejects ink and which nozzle is not ejected. Further, there are also control circuits for controlling the applied voltage and time, and of course, there are power supply circuits, and these circuits exist separately with different functions.

  As described above, the drive substrate for driving the heads is different from each other in the drive circuit portion provided for each head for driving each head, the control circuit for controlling these drive circuits, the power supply circuit, and the like. It is divided into a plurality of circuits having functions, and the drive circuit portion has a common circuit configuration for each head, and circuits having various different functions exist individually.

  These circuit configurations are the same even when the head is not a piezo element but is, for example, thermal.

  FIG. 5 shows an example of a conventional driving substrate for driving a plurality of heads.

  A single substrate 100 is roughly provided with a common circuit block 101 having a configuration common to the plurality of heads H1 to H2n, and an individual functional circuit block 102 having circuits having different functions.

  In the common circuit block 101, head driving circuits 101a for individually driving the heads H1 to H2n are provided corresponding to the heads H1 to H2n. Each head drive circuit 101a has a common configuration, and each head drive circuit 101a is electrically connected to the corresponding head H1-H2n by a connector 101b having the same specification.

On the other hand, the individual function circuit block 102 includes a voltage setting circuit 102a that supplies a driving voltage to each head driving circuit 101a, a driving waveform creation circuit 102b that supplies a driving waveform to each head driving circuit 101a, and these voltage setting circuits 102a. And a control circuit 102c for controlling the drive waveform generation circuit 102b and a power supply circuit 102d for supplying a power supply voltage to each circuit. The control circuit 102c and the power supply circuit 102d are electrically connected to the outside by a connector or the like (not shown) so that various control signals and power supply input are performed.
JP 2004-42427 A JP 2004-50742 A JP-A-2005-74702 JP 2005-138428 A

  In recent years, the demand for image quality has been increasing, and accordingly, the number of heads and the number of nozzles are increasing. For this reason, the number of heads mounted on the carriage is increased, and the heads are also increased in size, and it is possible to secure a space for mounting the drive substrate together with these heads in a limited space on the carriage. It has become difficult.

  For example, in the case of a driving substrate composed of a single substrate connected to eight heads with 512 nozzles, the provision of each circuit usually requires a size of 170 mm × 140 mm in plan view. The maximum length of 170 mm on one side depends on the installation space of a plurality of connectors that electrically connect each drive circuit and each head. This is because the plurality of connectors are arranged in a line on one side of the substrate in order to facilitate connection between each head and each head drive circuit.

  Further, when the number of heads and nozzles increases, the size of the connector increases, and the number of parallel arrangements also increases. Accordingly, the length of one side of the board on which the connectors are arranged in a row is increased accordingly. As a result, the drive substrate is further increased in size. Therefore, it is difficult to install the drive board close to each head on the carriage in order to install the drive board in a good manner, and it is necessary to install it at a position away from each head, and the carriage must be enlarged. There is a problem that disappears.

  In general, a plurality of heads are mounted on a common carriage and reciprocate at a constant speed in the main scanning direction by driving a main scanning motor. However, increasing the size of the carriage increases the mass of the entire carriage. Will lead to. The increase in the mass of the carriage inevitably requires not only that the main scanning motor has a large driving force so that the carriage can be moved at a constant speed, but also the inertia is increased. There is a problem that it becomes difficult to move the carriage at high speed, and as a result, it is difficult to perform high-speed printing operation.

  Increasing the number of heads is generally considered to be a preferable configuration for high-speed printing because the printing width increases accordingly. However, the increase in the mass of the carriage thereby causes high-speed printing in this way. Above, it is a serious minus, and how to keep the increase in the mass of the carriage low is a major issue.

  Patent Document 1 includes a first voltage adjusting unit that adjusts a voltage to be applied commonly to a plurality of heads, and a second voltage adjusting unit that adjusts a voltage to be applied according to individual differences between individual heads. In the provided head driving circuit, it is disclosed that the first voltage adjusting means and the second voltage adjusting means are provided on different circuit boards to reduce the size of the board.

  However, even if some of the individual functional circuit blocks are divided into different boards in this way, the maximum length of one side of the board depends on the length of one side where a plurality of connectors are arranged in a row. Therefore, there is a limit to the downsizing of the substrate, and it has been desired to provide a driving substrate that can further reduce the installation space by reducing the installation space on the carriage.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a drive substrate for an ink jet head that can be reduced in size and further save space.

  Other problems of the present invention will become apparent from the following description.

  The above problems are solved by the following inventions.

  The invention according to claim 1 has a plurality of head drive circuits having a common function provided for each head for driving the plurality of heads, and a different function for controlling the plurality of head drive circuits. In a drive substrate of an inkjet head having a plurality of circuits, the plurality of head drive circuits are divided into a plurality of head drive circuit groups, each head drive circuit group is disposed on a plurality of substrates, and the plurality of different functions are provided. This circuit is divided into the plurality of substrates and is a drive substrate for an inkjet head.

  According to a second aspect of the present invention, a plurality of first connectors for electrically connecting the plurality of heads and the plurality of head drive circuits are respectively associated with the plurality of substrates corresponding to the head drive circuits. 2. The ink jet head drive substrate according to claim 1, wherein the drive substrate is disposed separately.

  According to a third aspect of the present invention, the first connector is arranged in parallel on one side of each of the plurality of substrates, and the plurality of substrates has one side in which the first connector is arranged in parallel, respectively. 3. The inkjet head drive substrate according to claim 2, wherein the substrate is aligned and overlapped in the same direction.

  According to a fourth aspect of the present invention, the power supply circuit includes a second connector for electrically connecting a plurality of circuits respectively arranged on the plurality of substrates, and the plurality of circuits having the different functions generate a voltage. Each of the plurality of substrates is arranged on any one of the plurality of substrates, and a power supply voltage output generated by the power supply circuit is arranged on another substrate by the second connector. The drive substrate of the ink jet head according to claim 1, wherein the drive substrate is supplied to the ink jet head.

  According to a fifth aspect of the invention, there are provided a plurality of nozzle drive circuits having a common function provided for each nozzle for driving the plurality of nozzles provided in the head, and for controlling the plurality of nozzle drive circuits. In an inkjet head drive substrate having a plurality of circuits each having a different function, the plurality of nozzle drive circuits are divided into a plurality of nozzle drive circuit groups, each nozzle drive circuit group is disposed on a plurality of substrates, and A drive substrate for an ink jet head, wherein a plurality of circuits having different functions are arranged separately on the plurality of substrates.

  According to a sixth aspect of the present invention, a first connector for electrically connecting each nozzle of the head and the plurality of nozzle drive circuits is divided into a plurality of parts, and the plurality of first connectors are divided into a plurality of first connectors. The inkjet head drive substrate according to claim 5, wherein the substrate is divided into the plurality of substrates.

  According to a seventh aspect of the present invention, the first connector is arranged in parallel on one side of each of the plurality of substrates, and each of the plurality of substrates has one side in which the first connectors are arranged in parallel. 7. The ink jet head drive substrate according to claim 6, wherein the substrate is aligned in the same direction so as to overlap each other.

  The invention according to claim 8 has a second connector for electrically connecting a plurality of circuits respectively arranged on the plurality of substrates, and the plurality of circuits having the different functions is a power supply circuit for generating a voltage Each of the plurality of substrates is arranged on any one of the plurality of substrates, and a power supply voltage output generated by the power supply circuit is arranged on another substrate by the second connector. 8. The inkjet head drive substrate according to claim 5, wherein the drive substrate is supplied to the inkjet head.

  According to the first to fourth aspects of the present invention, the substrate size of the drive substrate for driving each of the plurality of heads can be reduced, and further space saving can be achieved.

  According to the fifth to eighth aspects of the present invention, the substrate size of the drive substrate for driving each of the plurality of nozzles provided in the head can be reduced, and further space saving can be achieved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a first embodiment of a drive substrate of an ink jet head according to the present invention, FIG. 2 is a block diagram showing a schematic configuration of the drive substrate shown in FIG. 1, wherein 1 is a drive substrate, Reference numerals 10a to 10h denote ink jet heads (hereinafter simply referred to as heads).

  The drive substrate 1 according to the first embodiment is a drive substrate for driving each of the plurality of heads 10a to 10h. Although eight heads 10a to 10h are shown here, the number of heads is not particularly limited as long as it is plural.

  Here, the drive substrate 1 is composed of two substrates 1A and 1B of the same size, and each of the substrates 1A and 1B corresponds to each of the heads 10a to 10h in order to individually drive the heads. Eight head drive circuits 11a to 11h are provided separately for each of the substrates 1A and 1B.

  Here, one head drive circuit group 11, 11 is constituted by four head drive circuits, and each head drive circuit group 11, 11 is arranged on each of two substrates 1A, 1B. That is, the four head drive circuits 11a to 11d are provided on the substrate 1A, and the remaining four head drive circuits 11e to 11h are provided on the substrate 1B.

  In the present invention, the head driving circuits 11a to 11h are circuits having the same number as the number of heads corresponding to the respective heads 10a to 10h, and all have a common function.

  Each board 1A, 1B is provided with a total of eight connectors 12a-12h, which are first connectors for electrically connecting the heads 10a-10h and the head drive circuits 11a-11h, By using these connectors 12a to 12h, the heads 10a to 10h corresponding to one-to-one and the head drive circuits 11a to 11h are electrically connected by the signal line 2 such as FPC. Yes.

  The eight connectors 12a to 12h are divided into two sets in the same manner as the head drive circuit groups 11 and 11, and are arranged on the substrates 1A and 1B. That is, the four connectors 12a to 12d are provided on the substrate 1A, and the remaining four connectors 12e to 12h are provided on the substrate 1B.

  As shown in FIG. 1, the connectors 12 a to 12 h are arranged in a line on one side of each of the boards 1 </ b> A and 1 </ b> B.

  In addition to the head drive circuits 11a to 11h, the drive substrate 1 is provided with a plurality of circuits having different functions for controlling the plurality of head drive circuits 11a to 11h. In the present embodiment, a control circuit 13, a voltage setting circuit 14, a power supply circuit 15, and a drive waveform generation circuit 16 are provided as a plurality of circuits having different functions, and these are divided into the substrates 1A and 1B. It is arranged.

  The substrate 1A is provided with a control circuit 13 and a voltage setting circuit 14 among them. The control circuit 13 is constituted by a CPU, for example, and outputs a control signal for setting a predetermined drive voltage to each of the head drive circuits 11a to 11h to the voltage setting circuit 14 and also to a drive waveform generation circuit 16 to be described later. Also outputs a signal. Various signals are input to the control circuit 13 from the outside through a connector 17A provided on one side different from the side on which the connectors 12a to 12d of the board 1A are arranged in parallel. .

  The voltage setting circuit 14 outputs a predetermined driving voltage to each of the head driving circuits 11a to 11h in response to the input of a control signal from the control circuit 13.

  On the other hand, the substrate 1B is provided with a power supply circuit 15 and a drive waveform generation circuit 16. The power supply circuit 15 is a circuit in the drive board 1 from a power supply input from the outside via a connector 17B provided on one side different from the side on which the connectors 12e to 12h of the board 1B are arranged in parallel. Create the voltage used. The power supply voltage created here is supplied to each circuit in the drive substrate 1.

  The drive waveform generating circuit 16 outputs a predetermined drive waveform to each of the head drive circuits 11a to 11h based on the control signal sent from the control circuit 13. Each head drive circuit 11a to 11h creates a drive signal based on the drive waveform sent from the drive waveform creation circuit 16 and the drive voltage sent from the voltage setting circuit 14, and each corresponding head 10a to 11h. 10h and driving the nozzles individually controls the ejection of ink droplets.

  The board 1A is provided with one connector 18A as a second connector for electrically connecting each circuit provided on the board 1A and each circuit provided on the board 1B. The substrate 1B is provided with the other connector 18B as a second connector that can be electrically connected to the connector 18A.

  Accordingly, here, the signals from the control circuit 13 and the voltage setting circuit 14 on the substrate 1A are also output to the drive waveform generation circuit 16 and the head drive circuits 11e to 11h on the substrate 1B via the connectors 18A and 18B. Then, the power supply voltage output from the power supply circuit 15 on the substrate 1B and the signal from the drive waveform generation circuit 16 are transmitted via the connectors 18B and 18A to the control circuit 13, the voltage setting circuit 14 and the head drive circuit 11a on the substrate 1A. To 11d.

  As shown in FIG. 1, the boards 1A and 1B are arranged such that one side where the connectors 12a to 12d and 12e to 12h are arranged in parallel is aligned and overlapped in the same direction, and the connectors 18A and 18B are overlapped. Is electrically connected. Since each of the connectors 12a to 12h, which are the first connectors, faces all in the same direction, there is no significant problem in connection workability between the heads 10a to 10h. Further, the connectors 18A and 18B, which are the second connectors, function as a supporting member that supports the substrates 1A and 1B by being connected to each other.

  Since each of the substrates 1A and 1B includes a plurality of circuits having different functions in addition to the plurality of head drive circuits 11a to 11h, the size of each of the substrates 1A and 1B can be reduced. Therefore, by superimposing these substrates 1A and 1B, the size of the drive substrate 1 as a whole becomes compact.

  In particular, the connectors 12a to 12h that electrically connect the head driving circuits 11a to 11h and the heads 10a to 10h are arranged separately on the respective substrates 1A and 1B, so that all of them are formed as one driving substrate. The length of one side of the drive substrate can be made shorter than in the case where the drive substrate is arranged in parallel.

  For example, according to the first embodiment, when the drive board 1 is connected to eight heads having 512 nozzles, each circuit and connectors are provided separately on the boards 1A and 1B as described above. Thus, each size of the substrates 1A and 1B, that is, the size as the driving substrate 1 can be accommodated in 100 mm × 140 mm in a plan view, and the maximum length of one side (conventional: 170 mm) compared with the conventional driving substrate. The drive substrate 1 can be reduced in size because it can be greatly reduced.

  Since the size of the drive substrate 1 can be reduced in this manner, when the drive substrate 1 is mounted on a common carriage together with a plurality of heads, the drive substrate 1 can be disposed in the vicinity of the head and electrically connected to each head. As a result, the carriage can be reduced in size and weight, and the carriage can be reduced in mass, so that high-speed printing is possible.

  In general, the power supply circuit 15 is often equipped with a heat sink or a circuit pattern as a heat dissipation measure. However, the head drive circuits 11a to 11h are divided into a plurality of substrates 1A and 1B, and others. A plurality of circuits having different functions are also divided into the boards 1A and 1B, so that the circuit installation space for each of the boards 1A and 1B is provided, and it is easy to secure a space for mounting a heat sink and a space for increasing a circuit pattern. There are also advantages.

  In the first embodiment, the control circuit 13 and the voltage setting circuit 14 are arranged on the substrate 1A, and the power supply circuit 15 and the drive waveform generating circuit 16 are arranged on the substrate 1B. However, the present invention is not limited to this. The separation mode of the plurality of circuits having different functions can be changed as appropriate.

  Further, the number of substrates constituting the drive substrate 1 is not limited to two, and can be a plurality of three or more. The number of heads, the number of circuits arranged on the substrate, and the entire drive substrate when a plurality of substrates are used. The thickness may be determined by appropriately taking into account the thickness, the installation space on the carriage, and the like.

  Further, the above embodiment is an example of a drive substrate that individually controls driving of a plurality of heads. However, as described below, in the present invention, each of a plurality of nozzles arranged in one head is individually provided. The present invention can also be applied to a driving substrate for driving control.

  FIG. 3 is a perspective view showing a second embodiment of the drive substrate of the ink jet head according to the present invention, and FIGS. 4A and 4B are examples of the circuit arrangement of each substrate constituting the drive substrate shown in FIG. FIG.

  In FIG. 3, 3 is a drive substrate, 20 is one inkjet head (head chip; hereinafter simply referred to as a head), and 20 a is a number of nozzles that eject ink droplets arranged on the head 20. Here, a case where 128 nozzles 20a are arranged in the head 20 will be described, but there is no limitation as long as the number of nozzles is plural.

  Here, the driving substrate 3 is composed of two substrates 3A and 3B having the same size, and 128 substrates 20A provided on the head 20 are individually driven on each of the substrates 3A and 3B. In addition, 128 nozzle drive circuits corresponding to each of the nozzles 20a are provided on each of the substrates 3A and 3B.

  Here, 64 nozzle drive circuits constitute one nozzle drive circuit group 31A, 31B, and each nozzle drive circuit group 31A, 31B is arranged on each of two substrates 3A, 3B. That is, one nozzle drive circuit group 31A is composed of 64 nozzle drive circuits, and each nozzle drive circuit is provided on the substrate 3A. The remaining 64 nozzle drive circuits constitute another nozzle drive circuit group 31B, and each nozzle drive circuit is provided on the substrate 3B.

  In the present invention, the nozzle drive circuit is a circuit that is provided in the same number as the number of nozzles corresponding to each of the nozzles 20a of the head 20, and all have a common function.

  Each of the substrates 3A and 3B is provided with connectors 32a to 32d as first connectors for each of a plurality of 128 nozzle drive circuits. Normally, one long connector having connection pins as many as the number of nozzles is used for electrical connection between the nozzles of one head and the nozzle drive circuit. The long connector is divided into a plurality of parts, which are divided into the respective boards 3A and 3B.

  Here, in each of the nozzle drive circuit groups 31A and 31B, a total of four connectors 32a to 32d are provided so that one short connector corresponds to each of the 32 nozzle drive circuits. The number is not limited to four, and it is sufficient to provide one for each of a plurality of nozzle drive circuits.

  Of the four connectors 32a to 32d, two connectors 32a and 32b are provided on the substrate 3A in correspondence with 32 nozzle drive circuits in the nozzle drive circuit group 31A, and the remaining two connectors 32c. , 32d are provided on the substrate 3B in correspondence with 32 nozzle drive circuits in the nozzle drive circuit group 31B. By means of these connectors 32a to 32d, the corresponding nozzles 20a and the respective nozzle drive circuits are electrically connected by signal lines 4 such as FPC.

  Each connector 32a-32d is arranged in parallel by one side of each of board | substrate 3A, 3B.

  In addition to the plurality of nozzle drive circuits divided into the nozzle drive circuit groups 31A and 31B, the drive substrate 3 is provided with a plurality of circuits having different functions for controlling the plurality of nozzle drive circuits. Yes. As in the first embodiment, the plurality of circuits having different functions include a control circuit 33, a voltage setting circuit 34, a power supply circuit 35, and a drive waveform generation circuit 36. It is divided into 3B. These correspond to the control circuit 13, the voltage setting circuit 14, the power supply circuit 15, and the drive waveform generation circuit 16 in the first embodiment, respectively.

  In the present embodiment, the voltage setting circuit 34 and the drive waveform generation circuit 16 are divided into two sets, and the voltage setting circuit 34A and the drive waveform generation circuit 16A are provided on the substrate 3A, and 64 in the nozzle drive circuit group 31A. The nozzle setting circuit 34B and the drive waveform creation circuit 16B are provided on the substrate 3B to control each of the 64 nozzle drive circuits in the nozzle drive circuit group 31B. Arranged in good balance.

  Here, the board 3A is provided with a connector 37 for exchanging signals with the outside on one side different from the side on which the connectors 32a and 32b are arranged in parallel.

  The board 3A is provided with one connector 38A as a second connector, and the board 3B is provided with the other connector 38B as a second connector that can be electrically connected to the connector 38A. Yes. Accordingly, here, the signal from the control circuit 33 on the substrate 3A is transmitted through the connectors 38A and 38B to the voltage setting circuit 34B, the power supply circuit 35, the drive waveform generation circuit 36B, and the nozzle drive circuit group 31B on the substrate 3B. The power supply voltage output from the power supply circuit 35 on the board 3B is supplied to the control circuit 33, the voltage setting circuit 34A, and the drive waveform generation circuit 35B on the board 3A via the connectors 38B and 38A. And also output to each nozzle drive circuit in the nozzle drive circuit group 31A.

  Further, the power input from the outside to the power supply circuit 36 provided on the board 3B is once sent to the board 3A by the connector 37 provided on the board 3A, and then sent through these connectors 38A and 38B. ing. That is, in the second embodiment, a connector 37 for exchanging signals with the outside is provided only on one of the two boards 3A and 3B, and the connection of signal lines with the outside is provided. However, only one place of the connector 37 is required.

  As in the case of the first embodiment, there is also an advantage that it is easy to secure a space for mounting a heat sink for heat dissipation measures of the power supply circuit 35 and a space for increasing the circuit pattern.

  As shown in FIG. 3, these boards 3A and 3B are arranged so that one side where connectors 32a and 32b, 32c and 32d are arranged in parallel is aligned and overlapped in the same direction, and connectors 38A and 38B are overlapped. Is electrically connected. Since the connectors 32a to 32d, which are the first connectors, all face the same direction, there is no significant problem in connection workability with the nozzles 20a. Further, the connectors 38A and 38B, which are the second connectors, function as a support member that supports the space between the boards 3A and 3B by being connected to each other.

  Since each of the substrates 3A and 3B includes a plurality of nozzle drive circuits and a plurality of circuits having different functions, the substrates 3A and 3B can be formed small in size. Therefore, by superimposing these substrates 3A and 3B, the size of the drive substrate 3 as a whole becomes compact as in the case of the first embodiment.

  In particular, the connector for electrically connecting each nozzle drive circuit and each nozzle 20a is divided into a plurality of (connectors 32a to 32d) and arranged separately on the respective substrates 3A and 3B, so that a long length is obtained. Compared with the case of using one connector, the length of one side of the drive substrate 3 can be made shorter.

  For example, according to the second embodiment, when the driving board 3 is connected to each of 128 nozzles, the circuit 3A is divided into the boards 3A and 3B as described above, thereby providing the board 3A. Each size of 3B, that is, the size of the drive substrate 3 can be accommodated in 70 mm × 80 mm (conventional: 70 mm × 150 mm) in plan view, and the drive substrate 3 can be downsized.

  Therefore, when such a drive substrate 3 is housed in a single casing together with the head 20 to form a head unit, the head unit can be reduced in size and weight. A reduction in the size and weight of the head unit can reduce the installation space on the carriage and reduce the size of the carriage, leading to a reduction in the mass of the carriage, thereby enabling high-speed printing.

  In the second embodiment as well, the separation mode of a plurality of circuits having different functions can be changed as appropriate.

  In addition, the number of substrates constituting the drive substrate 3 is not limited to two, and may be a plurality of three or more. The number of nozzles, the number of circuits arranged on the substrate, and the entire drive substrate when a plurality of substrates are used. What is necessary is just to determine by considering suitably the thickness of this, a housing | casing size, etc.

1 is a perspective view showing a first embodiment of a drive substrate of an inkjet head according to the present invention. 1 is a block diagram showing a schematic configuration of the drive board shown in FIG. The perspective view which shows 2nd Embodiment of the drive substrate of the inkjet head which concerns on this invention. (A) (b) is a figure which shows an example of the arrangement configuration of the circuit of each board | substrate which comprises the drive board | substrate shown in FIG. A block diagram showing an example of a conventional driving substrate for driving a plurality of heads

Explanation of symbols

1: Drive board 1A, 1B: Board 11: Head drive circuit group 11a-11h: Head drive circuit 12a-12h: Connector (first connector)
13: Control circuit 14: Voltage setting circuit 15: Power supply circuit 16: Drive waveform generation circuit 17A, 17B: Connector 18A, 18B: Connector (second connector)
2: Signal line 3: Drive substrate 3A, 3B: Substrate 31A, 31B: Nozzle drive circuit group 32a to 32d: Connector (first connector)
33: Control circuit 34, 34A, 34B: Voltage setting circuit 35: Power supply circuit 36, 36A, 36B: Drive waveform generation circuit 37: Connector 38A, 38B: Connector (second connector)
4: Signal line

Claims (8)

An inkjet head having a plurality of head drive circuits having a common function provided for each head for driving the plurality of heads and a plurality of circuits having different functions for controlling the plurality of head drive circuits In the drive board,
The plurality of head drive circuits are divided into a plurality of head drive circuit groups, each head drive circuit group is arranged on a plurality of substrates, and the plurality of circuits having different functions are arranged on the plurality of substrates. A drive substrate for an ink-jet head, characterized by comprising:   A plurality of first connectors for electrically connecting the plurality of heads and the plurality of head drive circuits, respectively, are arranged separately on the plurality of substrates in correspondence with each head drive circuit. 2. A drive substrate for an ink jet head according to claim 1, wherein The first connectors are arranged in parallel on one side of each of the plurality of substrates,
3. The drive substrate for an ink jet head according to claim 2, wherein the plurality of substrates are arranged such that one side where the first connectors are arranged side by side is aligned in the same direction and overlaps each other. A second connector for electrically connecting a plurality of circuits respectively disposed on the plurality of substrates;
The plurality of circuits having different functions include a power supply circuit that performs voltage generation, the power supply circuit is disposed on any one of the plurality of substrates, and a power supply voltage output generated by the power supply circuit is: 4. The ink jet head drive substrate according to claim 1, wherein the second connector is supplied to each circuit arranged on another substrate. A plurality of nozzle drive circuits having a common function provided for each nozzle to drive a plurality of nozzles provided in the head, and a plurality of circuits having different functions for controlling the plurality of nozzle drive circuits In an inkjet head drive substrate having
The plurality of nozzle drive circuits are divided into a plurality of nozzle drive circuit groups, each nozzle drive circuit group is arranged on a plurality of substrates, and the plurality of circuits having different functions are arranged on the plurality of substrates. A drive substrate for an ink-jet head, characterized by comprising:   A first connector for electrically connecting each nozzle of the head and the plurality of nozzle drive circuits is divided into a plurality of parts, and the plurality of first connectors are arranged on the plurality of substrates. 6. A drive substrate for an ink jet head according to claim 5, wherein The first connectors are arranged in parallel on one side of each of the plurality of substrates,
7. The ink jet head drive substrate according to claim 6, wherein the plurality of substrates are arranged such that one side where the first connectors are arranged side by side is aligned and overlapped in the same direction. A second connector for electrically connecting a plurality of circuits respectively disposed on the plurality of substrates;
The plurality of circuits having different functions include a power supply circuit that performs voltage generation, the power supply circuit is disposed on any one of the plurality of substrates, and a power supply voltage output generated by the power supply circuit is: 8. The ink jet head drive substrate according to claim 5, wherein the second connector is supplied to each circuit disposed on another substrate.

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