JP2008082597A - Temperature adjustment system and temperature adjustment control method of equipment room - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To properly adjust equipment housed in an equipment room to a proper temperature as a whole. <P>SOLUTION: This temperature adjustment system comprises a temperature state acquiring portion 26 for acquiring a temperature state of the equipment 20, and a temperature adjustment device 30 for adjusting a temperature of the equipment room 10 under a determined temperature adjustment condition, the temperature states in the equipment room 10 under various temperature adjustment conditions are simulated, the optimum temperature adjustment condition is decided on the basis of the result, and the temperature adjustment device is operated under the decided optimum temperature adjustment condition. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a technique for adjusting the temperature of an equipment room containing equipment such as a computer.

  In an equipment room containing equipment such as a computer, an air conditioner is installed to adjust the room to a temperature environment appropriate for the computer. Such an air conditioner generally performs temperature control so that the suction temperature is constant.

  As a prior art related to the invention of the present application, for example, there is one described in Patent Document 1.

JP 2003-35411 A

  However, when air conditioning is performed by an air conditioner installed in the equipment room, temperature control is performed so that the suction temperature is constant, so that the temperature is not necessarily suitable for each equipment.

  Even if the air conditioning settings are set according to the high temperature equipment by measuring the temperature of each equipment in advance at the time of installation of the air conditioner, etc., as a result, it will be adjusted to the equipment that is most difficult to cool. Air conditioning was to be performed, and there was a tendency to overcool the entire device.

  Therefore, an object of the present invention is to make it possible to adjust a device housed in a device room to an appropriate temperature as much as possible.

  In order to solve the above-mentioned problem, this temperature adjustment system is a temperature adjustment system of an equipment room (10) containing a plurality of equipment (20), and a temperature state acquisition unit (26) for acquiring the temperature state of each of the devices. ), And at least one temperature adjustment condition can be adjusted, and the temperature adjustment device (30) that adjusts the temperature of the equipment room under the set temperature adjustment condition, and the temperature state acquired through the temperature state acquisition unit Based on the above, the temperature condition in the device room is predicted while changing the adjustable temperature adjustment condition from the initial state, and the optimum temperature adjustment condition for cooling each device is determined. And a temperature state prediction unit (40) for operating the temperature adjustment device under temperature adjustment conditions.

  In this case, the temperature state may include at least one of an air suction temperature, an air discharge temperature, a calorific value, and an ambient temperature of each device (20).

  The temperature adjustment condition may include at least one of a degree of cooling by the temperature adjusting device (30), a cooling air blowing strength, and a cooling air blowing direction.

  Further, when the temperature state prediction unit (40) predicts the temperature state in the equipment room (10), the temperature state prediction unit (40) may generate data visualizing the prediction result.

  The temperature state prediction unit (40) acquires a virtual temperature state added, deleted, or replaced with respect to the device (20) existing in the device room (10), and this virtual temperature state And based on the temperature state acquired through the said temperature state acquisition part, the temperature state in the said apparatus room may be estimated and the data which visualized the prediction result may be produced | generated.

  The device room temperature adjustment control method is a device room (10) temperature adjustment control method containing a plurality of devices (20), and (a) acquiring the temperature state of each device; (B) predicting a temperature state in the device room while changing an adjustable temperature adjustment condition from an initial state based on the acquired temperature listing pair; and (c) each device based on the prediction. And a step of (d) performing temperature adjustment under the determined optimum temperature adjustment condition.

  According to this temperature adjustment system, based on the temperature state acquired through the temperature state acquisition unit, the temperature state in the device room is predicted while changing the adjustable temperature adjustment condition from the initial state, and each device is In order to determine the optimum temperature adjustment conditions for cooling the device and operate the temperature adjustment device under the optimum temperature adjustment conditions thus determined, it is possible to adjust the equipment contained in the equipment room to an appropriate temperature as much as possible. .

  Moreover, if the said temperature state contains at least one among the air suction temperature of each said apparatus, air discharge temperature, and the emitted-heat amount, appropriate temperature adjustment according to them can be performed.

  Furthermore, when the temperature adjustment condition includes at least one of the degree of cooling by the temperature adjustment device, the cooling air blowing strength, and the cooling air blowing direction, it can be adjusted to an appropriate temperature by adjusting them. .

  In addition, when the temperature adjustment condition determination unit predicts the temperature state in the device room and generates data that visualizes the prediction result, the temperature adjustment condition determination unit looks at the visualized data to perform maintenance related to the temperature of the device room. It can be used as a reference for equipment expansion and replacement.

  The temperature state prediction unit acquires a virtual temperature state added to, deleted from, or replaced with a device existing in the device room, and the temperature state acquired through the virtual temperature state and the temperature state acquisition unit Based on the above, the temperature state in the device room is predicted, and the data that visualizes the prediction result is generated. By viewing the visualized data, the temperature state when the device is added, deleted, or replaced is predicted. And appropriate equipment installation can be performed.

  According to this device room temperature adjustment control method, (a) a step of acquiring the temperature state of each device, and (b) an adjustable temperature adjustment condition from the initial state based on the acquired temperature listing pair. Predicting a temperature state in the device room while changing, (c) determining an optimum temperature adjustment condition for cooling each device based on the prediction, and (d) the determined optimum And a step of adjusting the temperature under various temperature adjustment conditions, the device housed in the device room can be adjusted to an appropriate temperature as much as possible.

  Hereinafter, the temperature adjustment system and the temperature adjustment control method for the equipment room according to the embodiment will be described. FIG. 1 is a diagram showing the overall configuration of the temperature adjustment system.

  In this temperature control system, a plurality of devices 20 (1, 1), 20 (1, 2), 20 (1, 3), 20 (1, 4), 20 (2, 1), 20 (2, 2) , 20 (2, 3), 20 (2, 4) are accommodated in the equipment room 10 in a state of being accommodated in the racks 28 (1), 28 (2). The temperature adjustment system includes a temperature adjustment device 30 and a temperature state prediction device 40, and is configured as a system for adjusting the temperature in the device room 10.

  Here, x in parentheses of reference numeral 20 (x, y) indicating the following equipment indicates the number of the rack 28 (1), 28 (2) accommodated, and y is the rack 28 (1), 28. The step position accommodated in (2) is shown. Numbers “1”, “2”,... Are sequentially assigned to the racks 28 (1) and 28 (2) in order from the one closest to the temperature adjustment device 30. Further, numbers “1”, “2”,... Are sequentially assigned to the accommodation stages of the racks 28 (1) and 28 (2) from the bottom to the top. Each device 20 (1, 1), 20 (1, 2), 20 (1, 3), 20 (1, 4), 20 (2, 1), 20 (2, 2), 20 (2, 3), 20 (2, 4) and racks 28 (1), 28 (2) may be simply referred to as equipment 20 and rack 28 when it is not necessary to distinguish them.

  Here, in the equipment room 10, the rack 28 (1) closest to the temperature adjustment device 30 has equipment 20 (1, 1), 20 (1, 2), 20 (1, 3), 20 (1, 4) are accommodated in multiple stages (here, four stages), and the next rack 28 (2) has equipment 20 (2,1), 20 (2,2), 20 (2,3), 20 (2 , 4) are accommodated in multiple stages (here, 4 stages). Of course, fewer or more devices 20 may be accommodated.

  The device 20 is a device that performs processing while generating heat, and is, for example, a computer such as a server computer.

  Each device 20 is provided with a temperature state acquisition unit 26. Here, the acquired temperature state is, for example, the air suction temperature, the air discharge temperature, the heat generation amount, and the ambient temperature of each device 20. The temperature state acquisition unit 26 that acquires the air suction temperature or the air discharge temperature is realized, for example, by a configuration including a temperature detection sensor attached to a cooling fan provided in each device 20. In addition, as the temperature state acquisition unit for acquiring the heat generation amount, for example, the operation state of main heat generation components such as an arithmetic processing unit (CPU or the like) or a hard disk incorporated in each device 20 is monitored, and those heat generation components Based on the operating state (ON / OFF, operating frequency, etc.) and the rated power consumption, for example, a means for obtaining a heat generation amount estimated by multiplying the rated power consumption by a coefficient or the like can be used. Further, it is also possible to use means for acquiring the power consumption of each device 20 with a power meter or the like and acquiring the amount of heat generation based on this power consumption. Moreover, as a temperature state acquisition part which acquires ambient temperature, it is implement | achieved by the structure containing the temperature sensor provided in CPU of the apparatus 20 or a case, for example. In addition, the temperature sensor which comprises the temperature state acquisition part which acquires ambient temperature does not need to be attached to apparatus 20 itself, and may be provided in the surrounding rack 28 grade | etc.,. Further, the temperature state acquisition unit 26 is not necessarily provided in all the devices 20 and may be provided in some devices 20. Here, an example in which the temperature state acquisition unit 26 acquires the ambient temperature of each device 20 will be described.

  Each of these temperature state acquisition units 26 is connected to a temperature state prediction device 40 via a communication line 29. As the communication line 29, for example, a LAN wiring or the like that connects the devices 20 so that they can communicate with each other can be used.

  At least one of the air suction temperature, the air discharge temperature, the heat generation amount, and the ambient temperature of each device 20 exemplified above is acquired and given to the temperature state prediction device 40.

  The temperature adjustment device 30 can adjust at least one temperature adjustment condition (hereinafter referred to as a temperature adjustment condition), and is configured to adjust the temperature of the device room 10 under the set temperature adjustment condition. A typical example of such a temperature adjusting device 30 is an air conditioner that performs cooling by exchanging heat with the outside air using a heat exchange device of an outdoor unit (not shown).

  More specifically, the temperature adjustment device 30 includes a temperature adjustment control unit 32 and a temperature adjustment unit 34.

  The temperature control unit 34 performs cooling by exchanging heat with the outside air using a heat exchange device of an outdoor unit, for example. The cooling air blown out from the temperature control unit 34 is supplied toward each device 20. Here, the cooling air blown out from the temperature control unit 34 is supplied to each device 20 mounted on each rack 28 through the floor of the device room 10. Such a temperature control unit 34 can adjust at least one of temperature control conditions such as the degree of cooling (cooling temperature), the cooling air blowing strength, and the cooling air blowing direction. Here, an example in which the degree of cooling can be adjusted to two levels of strength and the cooling air blowing strength can be adjusted to two levels of strength and weakness will be described.

  The temperature control unit 32 includes a CPU, a ROM, a RAM, and the like, and controls the operation of the temperature control unit 34 so as to perform cooling under a predetermined temperature control condition by a software program stored in advance.

  The temperature state prediction device 40 simulates the temperature state of the equipment room 10 under a plurality of temperature adjustment conditions based on the acquired temperature state, and determines the optimum temperature adjustment condition based on the simulation result (prediction result). .

  More specifically, the temperature state prediction device 40 includes a prediction control unit 41 and a storage unit 44. The prediction control unit 41 includes a CPU, a ROM, a RAM, and the like, and executes processing operations as the simulation processing unit 42 and the temperature adjustment condition determination unit 43 by a software program stored in advance.

  The simulation processing unit 42 is capable of adjusting the temperature control conditions (here, two levels of cooling and two levels of strength) that can be adjusted based on the temperature state (here, the ambient temperature of each device 20) acquired through the temperature state acquisition unit 26. The temperature state of the equipment room 10 is predicted while changing the cooling air blowing strength) from the initial state. That is, the simulation processing unit 42 simulates the temperature state of the device room 10 under a plurality of adjustable temperature conditions based on the acquired temperature state.

  The simulation is performed as follows, for example. That is, based on the ambient temperature of each device 20 acquired through the temperature state acquisition unit 26, the current temperature of each device 20 can be obtained. And the temperature of each apparatus 20 after a predetermined time can be estimated by adding a cooling degree and the air blowing strength for cooling to this as temperature control conditions.

  For example, when cooling is performed under the condition that the degree of cooling is weak and the cooling air blowing strength is weak (condition 1), the flow rate of air passing through the air passage f2 from the temperature adjustment device 30 to the rack 28 (2). It is estimated that the flow rate of air passing through the air passage f1 toward the rack 28 (1) is larger than that. Therefore, after a predetermined time, the lowered temperature of each device 20 (1, 1), 20 (1, 2), 20 (1, 3), 20 (1, 4) mounted on the rack 28 (1) is A1. The lowering temperature of each device 20 (2, 1), 20 (2, 2), 20 (2, 3), 20 (2, 4) mounted on the rack 28 (2) is A2 degrees (however, It can be estimated that A2 <A1).

  Further, when cooling is performed under the condition that the degree of cooling is strong and the cooling air blowing strength is weak (condition 2), each device 20 is cooled better than the condition 1 described above. Therefore, after a predetermined time, the lowered temperature of each device 20 (1, 1), 20 (1, 2), 20 (1, 3), 20 (1, 4) mounted on the rack 28 (1) is B1. Degree (however, B1> A1), the reduction of each device 20 (2, 1), 20 (2, 2), 20 (2, 3), 20 (2, 4) mounted on the rack 28 (2) It can be estimated that the temperature is B2 (B2> A2, B2 <B1).

  Further, when cooling is performed under the condition that the degree of cooling is weak and the cooling air blowing strength is strong (condition 3), the flow rate of air passing through the air passage f1 from the temperature adjustment device 30 toward the rack 28 (1). It is estimated that the flow rate of the air passing through the air passage f2 toward the rack 28 (2) is larger than that. Therefore, after a predetermined time, the lowered temperature of each device 20 (1, 1), 20 (1, 2), 20 (1, 3), 20 (1, 4) mounted on the rack 28 (1) is C1. Degree (however, C1 <A1), the reduction of each device 20 (2, 1), 20 (2, 2), 20 (2, 3), 20 (2, 4) mounted on the rack 28 (2) The temperature is estimated to be C2 degrees (where C2> C1, C2> A2).

  Furthermore, when cooling is performed under the condition (condition 4) that the degree of cooling is strong and the cooling air blowing strength is strong, each device 20 is cooled more than the condition 3 described above. Therefore, after a predetermined time, the lowered temperature of each device 20 (1, 1), 20 (1, 2), 20 (1, 3), 20 (1, 4) mounted on the rack 28 (1) is D1. Decrease of each device 20 (2, 1), 20 (2, 2), 20 (2, 3), 20 (2, 4) mounted on the rack 28 (2) at a degree (however, D1> C1) The temperature is estimated to be D2 degrees (however, D2> D1, D2> C2).

  In the simulation processing unit 42, the above A1, A2, B1, B2, C1, C2, D1,. Temperature fluctuation prediction values for the conditions 1 to 4 such as D2 are set in advance. And the temperature state (predicted temperature) with respect to each temperature control condition can be simulated by adding the temperature fluctuation predicted value etc. with respect to each temperature control condition to the temperature state acquired through the said temperature state acquisition part 26. FIG. When the heat generation amount is acquired through the temperature state acquisition unit 26, the heat generation amount may be taken into account as a temperature increase factor.

  FIG. 2 is a diagram illustrating an example of a simulation result. Here, that is, each device 20 (1, 1), 20 (1, 2), 20 (1, 3), 20 (1, 4), 20 (2) after a predetermined time under a predetermined temperature control condition. , 1), 20 (2, 2), 20 (2, 3), 20 (2, 4) and the temperature are created. Such a simulation result is created for each temperature adjustment condition and stored in the storage unit 44.

  Note that the factors and processing procedures considered in the simulation are examples, and various other simulation processing procedures can be adopted in consideration of various other factors.

  The temperature adjustment condition determination unit 43 determines an optimum temperature adjustment condition for cooling each device 20 based on the simulation result. Then, a command according to the determination result is given to the temperature control unit 32 in order to operate the temperature adjusting device under the determined optimal temperature control condition.

  The reference for determining the optimum temperature adjustment condition by the temperature adjustment condition determination unit 43 is preferably a condition in which the temperature of each device 20 is within a predetermined operating temperature range and each device 20 can be set to the same temperature as much as possible. It is. For example, in a simulation result in which the temperature of all the devices 20 is within a predetermined operating temperature range, a dispersion value of the predicted temperature of all the devices 20 is obtained, and the temperature control condition according to the simulation result in which the dispersion value becomes the smallest is optimal. It can be determined as a temperature condition. When the temperature adjustment condition determination unit 43 determines the optimum temperature condition in this way, a command related to the optimum temperature condition is given to the temperature adjustment control unit 32.

  FIG. 3 is a flowchart showing the operation of the temperature state prediction apparatus.

  That is, the temperature state prediction device 40 determines the simulation conditions in step S1 after the processing is started.

  Next, in step S <b> 2, the simulation process as described above is executed, and the simulation result is stored in the storage unit 44.

  Next, in step S3, it is determined whether or not the simulation process has been completed, that is, whether or not the simulation process has been executed covering all simulation conditions (temperature control conditions). Note that it is not always necessary to judge that the simulation process has been completed only when all simulation conditions (temperature control conditions) are covered, and those that can be clearly excluded within the settable temperature control condition range (for example, more than the current state) The end of the simulation process may be determined by excluding a condition that it is clear that when the temperature condition is executed, the temperature rises more than the current state even though the device 20 to be cooled exists.

  If it is determined in step S3 that the simulation process has not ended, the process returns to step S1 and the processes in steps S1 to S3 are repeated. On the other hand, if it is determined in step S3 that the simulation process has been completed, the process proceeds to step S4.

  In step S4, the optimum temperature adjustment condition is determined based on the simulation result, and the process proceeds to the next step S5.

  In step S <b> 5, the temperature state prediction device 40 gives a command related to the determined optimum temperature condition to the temperature control unit 32. Thereby, the temperature control unit 32 controls the operation of the temperature control unit 34 under the temperature condition, and the devices 20 are cooled under the temperature condition.

  Such processing is repeated at predetermined time intervals set in advance, for example, whereby appropriate cooling of each device 20 is performed.

  The temperature state prediction device 40 may be installed inside or outside the equipment room 10, may be integrated into the temperature adjustment device 30, or may be one of the equipment 20 in the rack 28 or the like. It may be mounted as.

  According to the temperature adjustment system and the device room temperature adjustment control method configured as described above, the temperature adjustment condition that can be adjusted is changed from the initial state based on the temperature state acquired through the temperature state acquisition unit 26. In order to predict the temperature state in the device room 10, determine the optimum temperature control condition for cooling each device 20, and operate the temperature adjustment device 30 under the determined optimum temperature control condition, the device room 10 It is possible to adjust the temperature of the device 20 housed in the device to a suitable temperature as a whole.

  In particular, it is possible to avoid over-cooling and the like and to cool with as little energy as possible, which contributes to energy saving.

  In addition, since the above processing is performed by directly measuring the ambient temperature and the like of each device 20, more accurate and appropriate temperature adjustment becomes possible.

  In addition, you may make the data which visualized each said simulation result produced | generated, and can display this on display apparatuses, such as a display.

  As an example of displaying the visualized data, for example, as shown in FIG. 4, the temperature distribution is expressed by isothermal lines distinguished by color or the like on a vertical plane across each device 20 in the device room 10. Alternatively, the temperature distribution may be represented by a three-dimensional isotherm.

  When data that visualizes the simulation result is generated in this way, the manager or the like can view the visualized data, and can refer to maintenance related to the temperature of the equipment room 10, addition of equipment, replacement, and the like. For example, if there is a place that is difficult to cool, replace or remove the equipment 20 in that part, and perform maintenance, expansion of equipment, replacement, etc. so that proper cooling can be performed in the entire equipment room 10 it can.

  In addition, an input unit 48 such as a keyboard is connected to the temperature state prediction device 40, and a virtual, added, deleted, or replaced with respect to the device 20 existing in the device room 10 through the input unit 48. The temperature state can be entered. If it demonstrates with a specific example, the surrounding temperature according to the virtual apparatus 20 can be input instead of the surrounding temperature acquired according to the apparatus 20 which exists in the apparatus room 10, for example. Further, for example, by inputting that the existing device 20 in the device room 10 is replaced, the numerical data of the ambient temperature corresponding to the device 20 that is the replacement target is replaced. Thereby, the temperature state prediction device 40 performs the same simulation as above based on the virtual temperature state acquired through the input unit 48 and the temperature state acquired through the temperature state acquisition unit 26, and visualizes the result. Can be displayed.

  As a result, the administrator of the device can predict the temperature state when the device is added, deleted, or replaced by looking at the visualized data, and the temperature rising portion is not concentrated. As a result, appropriate equipment can be installed.

  FIG. 5 is a diagram illustrating a temperature adjustment system according to the first modification. In this temperature adjustment system, a plurality of racks 128 are accommodated in the equipment room 110, and the equipment 120 is accommodated in each rack 128 in multiple stages. Each of these devices 120 is connected to an external monitoring computer 160 through a communication line 129. Thereby, temperature conditions such as ambient temperature corresponding to each device 120 are given to the monitoring computer 160.

  An overall air conditioner 130 is installed in the equipment room 110. The overall air conditioner 130 is, for example, a general air conditioner, and adjusts the temperature of the entire equipment room 110 while monitoring the temperature of the air that has been sucked or discharged.

  In addition, a rack cooling device 137 is installed outside the equipment room 110, and each rack 128 is provided with a cooling unit 128a having a refrigerant pipe mounted on each rack 128. The rack cooling device 137 cools the refrigerant to an appropriate temperature using a heat exchange device or the like and sends it to the refrigerant pipe of the cooling unit 128a, collects the refrigerant, re-cools it appropriately, and supplies it to the cooling unit 128a. It comes to send. That is, the refrigerant temperature is adjustable. The cooling unit 128a corresponding to each rack 128 incorporates a flow rate adjusting unit such as an electromagnetic valve that adjusts the flow rate of the refrigerant, and these flow rate adjusting units are controlled by the monitoring computer 160. Yes. In this modification, the rack cooling device 137 and the cooling unit 128a use the refrigerant temperature and the refrigerant supply amount as temperature control conditions, and the temperature adjustment device that cools each device 120 mounted on each rack 128 under predetermined temperature control conditions. Function as.

  Then, for example, the monitoring computer 160 obtains the ambient temperature of each device 120 and the temperature adjustment condition by the overall air conditioner 130 as the temperature state prediction device, and changes the refrigerant supply amount to each rack 128. Below, a simulation process is performed and appropriate temperature control conditions are determined. Note that the temperature that can be lowered according to the refrigerant temperature, the flow rate of the refrigerant, and the like can be known experimentally, empirically, and speculatively, and thus can be simulated as described above. And according to the said decision content, it cools by setting a refrigerant | coolant temperature and the refrigerant | coolant supply amount with respect to each rack 128 to an appropriate condition.

  As described above, as the temperature adjusting device, in addition to the device that cools the device 20 via air as in the embodiment, each device 120 of each rack 128 is directly connected via the refrigerant or the like as in the first modification. It may be one that is cooled. In short, it is possible to use a temperature adjustment device that cools each device 20 under adjustable temperature control conditions.

  FIG. 6 is a view showing a temperature adjustment system according to the second modification. In this temperature control system, a plurality of racks 228 are accommodated in the equipment room 210, and the equipments 220 and 220A are accommodated in each rack 228 in multiple stages. One of these devices 220 and 220A, 220A, has a function as a temperature state prediction unit that performs a simulation process under each temperature adjustment condition and determines an optimum temperature adjustment condition according to the simulation result. is doing. Each of these devices 220 and 220A is connected to an external monitoring computer 260 through a communication line 229. The monitoring computer 260 is a computer for managing the temperature state in the equipment room 210 by an external monitor.

  An overall air conditioner 230 is installed in the equipment room 210. The overall air conditioner 230 is, for example, a general air conditioner, and adjusts the temperature of the entire equipment room 210 while monitoring the temperature of the air that has been sucked or discharged.

  In addition to the overall air conditioner 230, a plurality of task air conditioners 235 and 236 and a task cooling device 238 are provided. The task cooling device 238 is a device that supplies the cooled refrigerant to each of the task air conditioners 235 and 236, collects and recools the refrigerant, and supplies the recovered refrigerant to the task air conditioners 235 and 236 again. It is a device that sends air cooled by the refrigerant supplied to each of the task air conditioners 235 and 236 toward the inside of the equipment room 210 by driving a fan or the like, and its air volume is adjustable as a temperature control condition. The task air conditioners 236 and 236 are devices for partially concentrating and cooling the inside of the equipment room 210. These task air conditioners 235 and 236 function as a temperature adjusting device that cools each of the devices 220 and 220A as a temperature condition capable of adjusting the air volume for sending the cooled air.

  Then, for example, the device 220A, as a temperature state prediction device, acquires the ambient temperature of each device 220 and the temperature adjustment condition by the overall air conditioner 230, and changes the air volume by each task air conditioner 235, 236, and a plurality of temperature conditions Then, a simulation process is performed to determine an appropriate temperature control condition. And according to the said decision content, it cools by controlling the air volume by each task air conditioner 235,236.

  As described above, the task air conditioners 235 and 236 provided separately from the overall air conditioner 230 may be used as the temperature control devices.

It is a figure showing the whole temperature control system composition concerning an embodiment. It is a figure which shows an example of a simulation result. It is a flowchart which shows operation | movement of a temperature state prediction apparatus. It is a figure which shows the example of a display which visualized the simulation result. It is a figure which shows the temperature control system which concerns on the modification 1. It is a figure which shows the temperature control system which concerns on the modification 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Equipment room 20 Equipment 26 Temperature state acquisition part 30 Temperature adjustment apparatus 40 Temperature state prediction apparatus 41 Prediction control part 42 Simulation processing part 43 Temperature control condition determination part 44 Storage part 48 Input part

Claims (6)

A temperature control system for an equipment room (10) containing a plurality of equipment (20),
A temperature state acquisition unit (26) for acquiring a temperature state of each device;
At least one temperature adjustment condition is adjustable, and a temperature adjustment device (30) for adjusting the temperature of the device room under the set temperature adjustment condition;
Based on the temperature state acquired through the temperature state acquisition unit, the temperature state in the device room is predicted while changing the adjustable temperature adjustment condition from the initial state, and is optimal for cooling each device. A temperature state prediction unit (40) for determining a temperature adjustment condition and operating the temperature adjustment device under the determined optimum temperature adjustment condition;
Temperature control system with The temperature control system according to claim 1,
The temperature state includes at least one of an air suction temperature, an air discharge temperature, a calorific value, and an ambient temperature of each device (20). The temperature control system according to claim 1 or 2,
The temperature adjustment system includes a temperature adjustment system including at least one of a degree of cooling by the temperature adjustment device (30), a cooling air blowing strength, and a cooling air blowing direction. It is a temperature control system in any one of Claims 1-3,
The said temperature state prediction part (40) is a temperature control system which produces | generates the data which visualized the prediction result, when the temperature state in the said equipment room (10) is estimated. The temperature adjustment system according to any one of claims 1 to 4,
The temperature state prediction unit (40) acquires a virtual temperature state that has been added, deleted, or replaced with respect to the device (20) existing in the device room (10). A temperature adjustment system that predicts a temperature state in the device room based on a temperature state acquired through a temperature state acquisition unit and generates data that visualizes the prediction result. A temperature adjustment control method for a device room (10) containing a plurality of devices (20),
(A) obtaining a temperature state of each device;
(B) based on the acquired temperature listing pair, predicting a temperature state in the device room while changing an adjustable temperature adjustment condition from an initial state;
(C) determining an optimum temperature adjustment condition for cooling each of the devices based on the prediction;
(D) performing temperature adjustment under the determined optimum temperature adjustment condition;
Temperature control control method for equipment room equipped with.

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