JP2008078112A - Switching constituent and electronic device using the same - Google Patents

Switching constituent and electronic device using the same Download PDF

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Publication number
JP2008078112A
JP2008078112A JP2007107947A JP2007107947A JP2008078112A JP 2008078112 A JP2008078112 A JP 2008078112A JP 2007107947 A JP2007107947 A JP 2007107947A JP 2007107947 A JP2007107947 A JP 2007107947A JP 2008078112 A JP2008078112 A JP 2008078112A
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movable contact
insulating layer
graphite sheet
pressing movable
switch structure
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JP2007107947A
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JP4973295B2 (en
Inventor
Norihiro Kawamura
典裕 河村
Mitsuru Tamaoki
充 玉置
Kazuhiko Kubo
和彦 久保
Masashi Senba
正志 船場
Takahiro Nishimura
貴裕 西村
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2007107947A priority Critical patent/JP4973295B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts

Abstract

<P>PROBLEM TO BE SOLVED: To enhance the effects of heat dissipation. <P>SOLUTION: The structure of a switching entity used for electronic devices is constituted of a graphite sheet 6 with an insulating layer 5 formed therein, a plurality of depressing movable contacts 4 formed on the surface of the insulating layer 5, and a spacer 10 formed in the graphite sheet 6 and/or the insulating layer 5 around the depressing movable contact 4. The depression movable contact 4 is formed of a domed shape, and structurally held with the insulating layer 5 on its outer surface. Since the graphite sheet 6 is provided at the depression movable contact which is further lower than conventional key tops and closer to a semiconductor as thermal distance, enhancement in the effects of heat dissipation can be made. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明はスイッチ構成体とそれを用いた、例えば携帯電話等の電子機器に関するものである。   The present invention relates to a switch structure and an electronic device using the switch structure, such as a mobile phone.

例えば携帯電話等の電子機器においても、その機能が高くなるに従って内蔵する半導体（たとえばアンプや処理装置用）からの発熱量も大きくなり、その放熱が大きな課題となっている。   For example, even in an electronic device such as a mobile phone, the amount of heat generated from a built-in semiconductor (for example, for an amplifier or a processing device) increases as its function increases, and the heat dissipation is a major issue.

そこで近年提案された電子機器、例えば携帯電話によれば、番号を入力する為のキートップにＡｌからなる放熱層を形成し、この放熱層を介して上記半導体の熱を放熱させようとしている。   Therefore, according to recently proposed electronic devices such as mobile phones, a heat dissipation layer made of Al is formed on a key top for inputting a number, and the heat of the semiconductor is radiated through the heat dissipation layer.

なお、本出願の発明に関連する先行技術文献情報としては特許文献１が知られている。
特開２００４−３１１３３２号公報 Patent Document 1 is known as prior art document information related to the invention of the present application.
JP 2004-311332 A

上記従来例によれば、半導体の熱は確かにキートップに形成したＡｌからなる放熱層から放熱させる事が出来るが、半導体とキートップの熱的な距離が大きく、よってその放熱効果を高める事が困難であった。   According to the above conventional example, the heat of the semiconductor can surely be radiated from the heat dissipation layer made of Al formed on the key top, but the thermal distance between the semiconductor and the key top is large, and thus the heat dissipation effect can be enhanced. It was difficult.

そこで本発明は、放熱効果を高める事を目的とするものである。   Then, this invention aims at improving the heat dissipation effect.

そしてこの目的を達成するために本発明は、電子機器に用いるスイッチ構成体の構成を、絶縁層を設けたグラファイトシートと、前記絶縁層の表面に設けた複数の押圧可動接点と、この押圧可動接点の周囲の前記グラファイトシートおよび／または前記絶縁層に設けたスペーサを有し、前記押圧可動接点は、ドーム形状としこの外表面にて前記絶縁層に保持される構成としたものである。   In order to achieve this object, the present invention relates to a switch structure used in an electronic device, a graphite sheet provided with an insulating layer, a plurality of pressing movable contacts provided on the surface of the insulating layer, and the pressing movable member. A spacer provided on the graphite sheet and / or the insulating layer around the contact is provided, and the pressing movable contact is formed in a dome shape and held on the insulating layer on the outer surface.

以上のように本発明は、従来のキートップよりもさらに下方で、より半導体に熱的距離として近くなる押圧可動接点部分にグラファイトシートを設けたので、その放熱効果を高める事ができる。   As described above, according to the present invention, the graphite sheet is provided at the pressing movable contact portion which is further lower than the conventional key top and closer to the semiconductor as a thermal distance, so that the heat dissipation effect can be enhanced.

本発明のスイッチ構成体とそれを用いた電子機器について実施の形態および図面を用いて説明する。   A switch structure and an electronic device using the same according to the present invention will be described with reference to embodiments and drawings.

（実施の形態１）
図１は、実施の形態１における電子機器である携帯電話の正面図である。図１において、表示部２１と入力部２２を有し、この入力部２２にはスイッチ２３が設けられている。 (Embodiment 1)
FIG. 1 is a front view of a mobile phone which is an electronic device according to the first embodiment. In FIG. 1, a display unit 21 and an input unit 22 are provided, and a switch 23 is provided in the input unit 22.

図２は、本発明の実施の形態１におけるスイッチ構成体の要部断面図であり、図３は、同スイッチ構成体を基板に実装した状態の断面図、すなわち、図１におけるスイッチ２３の要部断面図である。図３において、基板１上に固定接点２、３が設けられており、この固定接点３と対向するように押圧可動接点４が設けられている。   2 is a cross-sectional view of a main part of the switch structure according to Embodiment 1 of the present invention, and FIG. 3 is a cross-sectional view of the switch structure mounted on a substrate, that is, a main part of the switch 23 in FIG. FIG. In FIG. 3, fixed contacts 2 and 3 are provided on the substrate 1, and a pressing movable contact 4 is provided so as to face the fixed contact 3.

以下、スイッチの動作について説明する。上記押圧可動接点４は、固定接点２とは電気的に接続されており、固定接点３とは通常の状態では電気的に接続されていない（スイッチＯＦＦの状態）。ここで押圧可動接点４が押圧されることにより固定接点３と電気的に接続され、固定接点２と固定接点３が導通し、スイッチＯＮの状態になる。   Hereinafter, the operation of the switch will be described. The pressing movable contact 4 is electrically connected to the fixed contact 2 and is not electrically connected to the fixed contact 3 in a normal state (switch OFF state). Here, when the pressing movable contact 4 is pressed, it is electrically connected to the fixed contact 3, and the fixed contact 2 and the fixed contact 3 are brought into conduction, and the switch is turned on.

そして、押圧をやめると押圧可動接点４は弾力により再び固定接点３とは電気的に接続されなくなりスイッチＯＦＦの状態になる。   When the pressing is stopped, the pressing movable contact 4 is not electrically connected to the fixed contact 3 again due to elasticity, and the switch is turned off.

この押圧可動接点４はドーム形状となっており、この外表面が絶縁層５を介してグラファイトシート６に保持されている。ここで絶縁層５としてポリエチレンテレフタレートフィルム（以下、ＰＥＴフィルムと記す）を用い、押圧可動接点４側のＰＥＴフィルム表面に設けた粘着層７で押圧可動接点４を保持する構造にしている。   The pressing movable contact 4 has a dome shape, and its outer surface is held by a graphite sheet 6 via an insulating layer 5. Here, a polyethylene terephthalate film (hereinafter referred to as a PET film) is used as the insulating layer 5 and the pressing movable contact 4 is held by the adhesive layer 7 provided on the surface of the PET film on the pressing movable contact 4 side.

そして、グラファイトシート６の表面にはさらに絶縁層８が設けられ、グラファイトシート６の保護という機能も有している。この絶縁層８としてはＰＥＴフィルム等の樹脂フィルムを用いることができ、粘着層（図示せず）を介してグラファイトシート６の表面に形成することができる。   An insulating layer 8 is further provided on the surface of the graphite sheet 6 and has a function of protecting the graphite sheet 6. A resin film such as a PET film can be used as the insulating layer 8 and can be formed on the surface of the graphite sheet 6 via an adhesive layer (not shown).

また、上記押圧可動接点４の周囲部の基板１上には粘着層９を介してスペーサ１０を設けている。このスペーサ１０を設けることにより、押圧可動接点４の形状に合わせてグラファイトシート６を加工するのが容易になり、グラファイトシート６と押圧可動接点４がより密着しやすくなり、その結果、放熱効果をさらに向上させることができるという作用効果を有する。   A spacer 10 is provided on the substrate 1 around the pressing movable contact 4 via an adhesive layer 9. By providing this spacer 10, it becomes easy to process the graphite sheet 6 in accordance with the shape of the pressing movable contact 4, and the graphite sheet 6 and the pressing movable contact 4 are more easily brought into close contact with each other. Furthermore, it has the effect that it can be improved.

また、このスペーサ１０の基板からの高さを、前記押圧可動接点４の高さと同程度にすることにより押圧可動接点４の形状に合わせた加工も不要とすることもできる。   Further, by making the height of the spacer 10 from the substrate approximately the same as the height of the pressing movable contact 4, it is possible to eliminate the processing according to the shape of the pressing movable contact 4.

以上のような構成のスイッチ構成体は、グラファイトシート６を基板１の対向する面全面に設けているため熱拡散に有利であり、放熱作用が優れるという作用効果を有するものである。   The switch structure having the above-described configuration is advantageous in heat diffusion because the graphite sheet 6 is provided on the entire surface of the substrate 1 that faces the substrate 1, and has an effect of being excellent in heat dissipation.

図４は、実施の形態１における他のスイッチ構成体を基板に実装した状態の断面図である。   FIG. 4 is a cross-sectional view of a state in which the other switch structure in the first embodiment is mounted on a substrate.

図４のスイッチ構成体が図３のものと異なる点は、押圧可動接点４を保持する部分にグラファイトシート６を設けず絶縁層５，８のみとした点である。このように押圧可動接点４の頭頂中央部を絶縁層のみにすることによりクリック感を向上させることができるという作用効果を有する。すなわち、この押圧可動接点４上に積層するものが少ないほど押圧可動接点４を押圧する際の感触が得られやすいが、この部分のみにグラファイトシート６を非形成とすることにより放熱効果を大きく犠牲にすることなくクリック感を向上させることができる。   4 differs from that shown in FIG. 3 in that the graphite sheet 6 is not provided in the portion holding the pressing movable contact 4 and only the insulating layers 5 and 8 are provided. Thus, it has the effect that a click feeling can be improved by using only the insulating layer at the center of the top of the pressing movable contact 4. That is, the fewer the layers stacked on the pressing movable contact 4, the easier it is to feel when pressing the pressing movable contact 4. However, the heat dissipation effect is greatly sacrificed by not forming the graphite sheet 6 only on this portion. The click feeling can be improved without making it.

このグラファイトシート６の非形成部は、押圧可動接点４とその上方に設けられるキートップ（図示せず）との接触部の面積等に応じて設けることができる。   The non-formed portion of the graphite sheet 6 can be provided according to the area of the contact portion between the pressing movable contact 4 and a key top (not shown) provided above the pressing movable contact 4.

（実施の形態２）
図５は、本発明の実施の形態２におけるスイッチ構成体を基板に実装した状態の断面図である。 (Embodiment 2)
FIG. 5 is a cross-sectional view of a state in which the switch structure according to Embodiment 2 of the present invention is mounted on a substrate.

本実施の形態２が実施の形態１と異なる点は、グラファイトシート６の表面のみに絶縁層を設け、裏面には絶縁層を設けていない点である。   The second embodiment is different from the first embodiment in that an insulating layer is provided only on the surface of the graphite sheet 6 and no insulating layer is provided on the back surface.

すなわち、グラファイトシート６の表面にはＰＥＴフィルムからなる絶縁層８を粘着層（図示せず）を介して設け、グラファイトシート６の裏面には粘着層１１を設けてスペーサ１０および押圧可動接点４を接続している。また、グラファイトシート６は導電体であるので、押圧可動接点４との絶縁を確実なものにするために押圧可動接点４上にはグラファイトシート６を設けていない。   That is, an insulating layer 8 made of a PET film is provided on the surface of the graphite sheet 6 via an adhesive layer (not shown), and an adhesive layer 11 is provided on the back surface of the graphite sheet 6 to provide the spacer 10 and the pressing movable contact 4. Connected. Further, since the graphite sheet 6 is a conductor, the graphite sheet 6 is not provided on the pressing movable contact 4 in order to ensure insulation from the pressing movable contact 4.

以上のような構成では、押圧可動接点４の上にはＰＥＴフィルムが一層のみ設けられた構成であるためスイッチ構成体として簡便な構成とすることができ、さらにはクリック感を向上させることもできるという作用効果を有するものである。   In the above configuration, since only one layer of the PET film is provided on the pressing movable contact 4, it is possible to make a simple configuration as a switch structure, and it is possible to improve the click feeling. It has the effect of.

以上のように本発明は、従来のキートップよりもさらに下方で、より半導体に熱的距離として近くなる押圧可動接点部分にグラファイトシートを設けたので、その放熱効果を高める事ができる。   As described above, according to the present invention, the graphite sheet is provided at the pressing movable contact portion which is further lower than the conventional key top and closer to the semiconductor as a thermal distance, so that the heat dissipation effect can be enhanced.

なお、グラファイトシート６としては、天然黒鉛を用いたグラファイトシートを用いてもよく、また、ポリイミド等の樹脂フィルムを熱分解して得られるグラファイトシートを用いることもできる。   The graphite sheet 6 may be a graphite sheet using natural graphite, or a graphite sheet obtained by thermally decomposing a resin film such as polyimide.

また、絶縁層５，８としてＰＥＴフィルムを用いたが、ポリイミドフィルム、ポリエチレンフィルム等の絶縁性樹脂フィルムであれば特に限定されない。   Moreover, although PET film was used as the insulating layers 5 and 8, if it is insulating resin films, such as a polyimide film and a polyethylene film, it will not specifically limit.

本発明のスイッチ構成体は放熱効果に優れ、パワーアンプ、ＩＣ等の発熱部品を搭載する電子機器に特に有用である。   The switch structure of the present invention has an excellent heat dissipation effect, and is particularly useful for an electronic device in which a heat-generating component such as a power amplifier or an IC is mounted.

本発明の実施の形態１における電子機器の正面図The front view of the electronic device in Embodiment 1 of this invention 本発明の実施の形態１におけるスイッチ構成体の要部断面図Sectional drawing of the principal part of the switch structure in Embodiment 1 of this invention 同スイッチ構成体を基板に実装した状態の要部断面図Sectional view of the main part of the switch assembly mounted on the board 同他のスイッチ構成体を基板に実装した状態の要部断面図Cross-sectional view of the relevant part with the other switch components mounted on the board 本発明の実施の形態２におけるスイッチ構成体を基板に実装した状態の要部断面図Sectional drawing of the principal part of the state which mounted the switch structure in Embodiment 2 of this invention on the board | substrate.

符号の説明Explanation of symbols

１ 基板
２、３ 固定接点
４ 押圧可動接点
５、８ 絶縁層
６ グラファイトシート
７、９、１１ 粘着層
１０ スペーサ
２１ 表示部
２２ 入力部
２３ スイッチ DESCRIPTION OF SYMBOLS 1 Board | substrate 2, 3 Fixed contact 4 Press movable contact 5, 8 Insulating layer 6 Graphite sheet 7, 9, 11 Adhesive layer 10 Spacer 21 Display part 22 Input part 23 Switch

Claims (4)

絶縁層を設けたグラファイトシートと、前記絶縁層の表面に設けた複数の押圧可動接点と、この押圧可動接点の周囲の前記グラファイトシートおよび／または前記絶縁層に設けたスペーサを有し、前記押圧可動接点は、ドーム形状としこの外表面にて前記絶縁層に保持されるスイッチ構成体。 A graphite sheet provided with an insulating layer; a plurality of pressing movable contacts provided on a surface of the insulating layer; and the spacer provided on the graphite sheet and / or the insulating layer around the pressing movable contact. The movable contact is a dome-shaped switch structure that is held on the insulating layer on the outer surface. 押圧可動接点を保持するグラファイトシートの保持部は、絶縁層のみとした請求項１記載のスイッチ構成体。 The switch structure according to claim 1, wherein a holding portion of the graphite sheet holding the pressing movable contact is only an insulating layer. グラファイトシートの両面に絶縁層を設けた請求項１記載のスイッチ構成体。 2. The switch structure according to claim 1, wherein an insulating layer is provided on both surfaces of the graphite sheet. 請求項１〜３のいずれか一つに記載のスイッチ構成体を、半導体を実装した基板上に配置し、この基板の前記スイッチ構成体の押圧可動接点に対応する部分には固定接点を設けた電子機器。 The switch structure according to any one of claims 1 to 3 is arranged on a substrate on which a semiconductor is mounted, and a fixed contact is provided in a portion corresponding to the pressing movable contact of the switch structure of the substrate. Electronics.
JP2007107947A 2006-08-22 2007-04-17 Switch structure and electronic device using the same Active JP4973295B2 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011244161A (en) * 2010-05-17 2011-12-01 Nec Casio Mobile Communications Ltd Electronic apparatus
KR101165736B1 (en) * 2012-02-09 2012-07-18 주식회사 두성테크 Flexible Printed Circuit Board

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Publication number Priority date Publication date Assignee Title
JPS6387730U (en) * 1986-11-28 1988-06-08
JPH08267647A (en) * 1995-01-11 1996-10-15 Matsushita Electric Ind Co Ltd Graphite-clad structural material and graphite part using it
JP2001297657A (en) * 2000-04-13 2001-10-26 Matsushita Electric Ind Co Ltd Switch and electronic equipment using the same
JP2005026006A (en) * 2003-06-30 2005-01-27 Fujikura Ltd Switch sheet and switch
JP2005129734A (en) * 2003-10-23 2005-05-19 Sony Corp Electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6387730U (en) * 1986-11-28 1988-06-08
JPH08267647A (en) * 1995-01-11 1996-10-15 Matsushita Electric Ind Co Ltd Graphite-clad structural material and graphite part using it
JP2001297657A (en) * 2000-04-13 2001-10-26 Matsushita Electric Ind Co Ltd Switch and electronic equipment using the same
JP2005026006A (en) * 2003-06-30 2005-01-27 Fujikura Ltd Switch sheet and switch
JP2005129734A (en) * 2003-10-23 2005-05-19 Sony Corp Electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011244161A (en) * 2010-05-17 2011-12-01 Nec Casio Mobile Communications Ltd Electronic apparatus
KR101165736B1 (en) * 2012-02-09 2012-07-18 주식회사 두성테크 Flexible Printed Circuit Board
CN103249244A (en) * 2012-02-09 2013-08-14 斗星电子有限公司 Flexible printed circuit board
WO2013118943A1 (en) * 2012-02-09 2013-08-15 Doo Sung Tech Co., Ltd. Flexible printed circuit board

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