JP2008068490A - Method for manufacturing structure and its apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a structure which can form a structure with a degree of freedom in shape, and to provide its apparatus. <P>SOLUTION: The method for manufacturing a structure extrudes a structure forming material through a through-hole of a mold and molds it to manufacture the structure with a two-dimensional shape corresponding to the through-hole on a substrate. The method for manufacturing the structure and its apparatus comprises heating the structure forming material, making the structure forming material flow to the reverse face of the mold through the through-holes of the mold equipped with one or a plurality of the through-holes with required profiles, bringing the substrate into contact with or close to the mold to stick a structure forming face of the substrate with the structure forming material together, extruding the structure forming material and while making it flow to the reverse face of the mold through the through-holes of the mold, by moving the mold and/or the substrate in the mutually separating direction, extruding it on the substrate to form a molded structure, and completing formation of the structure by stopping flow of the structure forming material to the reverse face of the mold through the through-holes. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a structure for forming a structure having an arbitrary number of materials in any place, simply and without any kind of material, and having a degree of freedom in shape, and The present invention relates to a processing apparatus that can be used. More specifically, the present invention extrudes and molds through a through hole of a mold, and has a degree of freedom in workability on a surface of a substrate as compared with a conventional processing method. In other words, a structure having a two-dimensional shape with a high aspect ratio that is not particularly limited in the height of the structure, or a structure having a three-dimensional shape obtained by deforming the structure in an arbitrary direction. The present invention relates to a method for manufacturing a structure formed on a substrate that can be formed at an arbitrary position on the surface of the substrate, and a processing apparatus for the structure.

  In today's industry, processing of various shapes is required in various fields such as micromachines, medical devices, sensor devices, and electronic devices. In this field, in order to respond to diversifying technical demands, the components that make up each device can be freely shaped, such as complex shapes, especially structures with a high aspect ratio and structures with a three-dimensional shape. There is a need for the development of processing technology that enables high-level processing. Examples of components having such a shape include a heat sink, an array structure incorporated in a DNA analysis chip (Non-Patent Document 1), and a contact probe (Non-Patent Document 2) for inspecting a semiconductor integrated circuit. The

  A typical lathe, milling machine, and grinding machine, which is a typical machining method that uses a solid tool, that is, a cutting tool or a grindstone to scrape off unnecessary parts of the material. When a high structure is manufactured, in a lathe, only one structure can be formed on the surface. When the height of the structure is increased, the structure itself is rotated and a higher structure is manufactured. Is difficult. In a milling machine, an arbitrary number of machinings can be performed at an arbitrary place, but the height of the tool is a limitation on the height of the structure. In a grinding machine, the same thing as a lathe is mentioned as a problem in a cylindrical grinding machine, and the same thing as a milling machine is mentioned as a problem in a surface grinding machine. When producing a structure with a three-dimensional shape, it is not possible with a lathe or a cylindrical grinder. With a milling machine or a surface grinder, a certain degree of three-dimensional machining is possible by changing the angle between the machining tool and the material. However, in this case, the number of steps increases because the angle needs to be changed each time. Furthermore, it is necessary to change the rotation speed, feed speed, and the like of the tool and the material depending on the material to be processed, and skilled techniques are required.

  Next, in electric discharge machining, a wire electric discharge grinding method (WEDG method) can be considered as a method for manufacturing a structure having a high height. However, in this case as well, similarly to the lathe, only one columnar shape can be formed on the surface. When the aspect ratio is high, the structure itself is rotated to produce a higher structure. Have difficulty. In addition, it is impossible to process a three-dimensional shape. In wire-cut electric discharge machining, a structure with a high height can be produced, and generally, a degree of machining called 2.5-dimensional shape is possible, but 3-dimensional shape machining is impossible. . Furthermore, the target material in electric discharge machining is limited to a conductive material.

  In addition, when forging, casting, pressing, injection molding, and imprinting using a mold are used, when producing a high-height structure, an arbitrary number of processing can be performed at an arbitrary location. When the ratio is high, a filling failure occurs, and even if the filling can be performed, deformation and breakage of the structure due to adhesion to the mold and the like are cited as problems when releasing. In the imprint method, as a method for solving the shape collapse due to adhesion, a method of performing surface treatment on the mold is taken, but it is in the development stage, and effective materials are limited to resin-based materials (non- Patent Documents 3 and 4).

  Furthermore, as an improved method of the imprint method, there is a method of manufacturing a structure having a high aspect ratio by extending a material filled in a mold concave portion of the structure at the time of mold peeling (Non-patent Document 5). . The method solves insufficient filling of the structure material into the mold due to the frictional force between the mold and the structure material and the influence of the remaining gas when producing a high aspect ratio structure with the mold. Is the method. However, since this method is a method of increasing the structure by elongating the material filled in the mold recess during mold release, the amount of material that can be pooled in the recess is constant. Body height is limited. Moreover, the metal mold | die used for this method needs surface treatment, and only the resin material can be adapted at this stage. Moreover, it is difficult to produce a structure having a three-dimensional shape in processing using these molds.

  Further, for example, in the technical field of micromachines, electronic parts, etc., the lithography method, the deposition method such as electroplating, and the removal method such as ion shower are used mainly for the part processing. With regard to the processing technology for manufacturing parts, when manufacturing a structure having a high height, for example, the use of lithography such as deep PMMA using synchrotron radiation X-ray has been attempted (Non-patent Document 6). . However, in this method, the height of about several millimeters is the limit, and in the case of producing a structure higher than that, after the resist layer is formed on the surface, the resist layer is exposed using a mask as a pattern. Then, development is performed, a resist pattern is formed, and a process of depositing a metal structure on the surface having the resist pattern by electroplating or the like must be repeatedly performed to a desired height. In addition, it is necessary to perform alignment, and attention is required.

  Furthermore, in general, a processing level called a 2.5-dimensional shape is possible, but it is necessary to incline the surface, and since the above-described steps are necessary repeatedly, a high technique is required for alignment. Become. Also, in removal processing by lithography and ion shower, the resist layer and the resist layer are removed and the material on the surface is processed at the same time, so the height of the structure is determined when the resist layer disappears In general, the height is lower than the height of the resist layer, and a structure with a high height cannot be manufactured. Therefore, the degree of freedom in shape is limited.

  Further, there is a focused ion beam (FIB) as a processing apparatus that enables removal processing and deposition processing. In the removal processing, almost all materials can be processed in the removal processing. However, since the depth of the beam reaches is small, it is difficult to produce a structure with a high height. Processing is also difficult. However, in deposition processing, processing with a considerable degree of freedom is possible (Non-Patent Document 7). However, the material is limited to tungsten and carbon.

  At the same time that a metal microstructure is produced by electroplating, a mold having a through hole is driven on the substrate, and plating is performed on the substrate through the through hole. There is a method for producing a metal-based fine structure in which a metal-based structure is formed on a substrate by moving the mold in a direction away from the substrate. However, in this method, since the mold is limited to the insulator material, the structure forming material is also limited to the type of material that can be electroplated, and the periphery of the formation site is exposed to the plating solution. It is necessary to consist of. In addition, if the substrate and the mold are not in close contact with each other, the plating solution will flow into the surface other than the formation area, and plating will be applied to areas other than the formation area, making it impossible to form the desired structure. Therefore, it takes time to form a structure with a high height, and the driving means moves the structure forming material adhesion position and the through hole position on the surface of the substrate so as to change relative to each other. Therefore, a three-dimensional structure cannot be formed (Patent Document 1).

Japanese Patent Application No. 2006-078125 J. Tsuda, Y. Tada, G. Hashiguchi, K. Hirano, N. Kaji and Y. Baba, Micro Total Analysis System 2002, Vol. 1, 109-111 Precision Member Molding Material Creation / Processing Process Technology Project Results Report (FY 2004) p. 243 Y. Saotome, K. Itoh, T. Zhang and A. Inoue, Scripta mater. 41 (2001) 1541 Y. Hirai, S. Yoshida, A. Okamoto, Y. Tanaka, M. Endo, S. Irie, H. Nakagawa and M. Sasago, Journal of Photopolymer Science and Technology, Vol. 14, No. 3 (2001) 457 -462 Monthly Takarajima November issue pp. 52-53 (2003) O. Bakajin, Anal. Chem, 73 (2001), 6053-6056 Nature Interface, No. 9 (2002), 54-55

  Under such circumstances, the present inventor, in view of the above-described conventional technology, can easily select any number of materials at any location on the substrate surface, and can freely select the type of material. As a result of intensive research aimed at developing research on a method of manufacturing the structure capable of forming a structure having a structure and an apparatus for realizing the structure, through the through hole of the mold It has been found that the intended purpose can be achieved by adopting the extrusion and molding methods, and the present invention has been completed. According to the present invention, a structure-forming material is extruded through a through-hole of a mold and molded, and a structure having a two-dimensional shape corresponding to the through-hole is formed on a substrate, or an arbitrary structure. It is an object of the present invention to provide a method for manufacturing a structure having a three-dimensional shape deformed in a direction and an apparatus therefor.

The present invention for solving the above-described problems comprises the following technical means.
(1) A method of producing a structure having a two-dimensional shape corresponding to the through hole on a substrate by extruding and forming the structure forming material through the through hole of the mold,
1) heating the structure forming material,
2) flowing the structure-forming material to the opposite surface of the mold through the through-hole of the mold having one or more through-holes having a desired contour;
3) The substrate is brought into contact with or close to the mold, and the structure forming surface of the substrate and the structure forming material are bonded.
4) Extrude the structure forming material and move it to the opposite side of the mold through the through hole of the mold, and move the mold and / or the substrate in a direction away from each other, thereby moving the material on the substrate. Extruded to form a shaped structure,
5) Terminate the formation of the structure by stopping the flow of the structure forming material to the opposite surface of the mold through the through hole.
A structure manufacturing method characterized by the above.
(2) Extrude the structure forming material and move it to the opposite side of the mold through the through hole of the mold while moving the mold and / or the substrate away from each other, and on the forming surface The structure producing method according to (1), wherein the structure forming material bonding position and the through hole position of the mold are relatively changed to be extruded onto a substrate to form a molded structure.
(3) The method for producing a structure according to (1), wherein the structure forming material is a resin-based, metal-based, semiconductor, ceramic-based material, or a composite material thereof.
(4) The method for manufacturing a structure according to (1), wherein a structure having a two-dimensional shape corresponding to a through hole of a mold is formed on a substrate.
(5) On the substrate, a structure having a shape obtained by further regularly or irregularly deforming a structure having a two-dimensional shape corresponding to the through hole of the mold in an arbitrary direction is produced. The manufacturing method of the structure as described in said (1).
(6) A processing apparatus for extruding a structure-forming material through a through-hole of a mold and forming a structure having a two-dimensional shape corresponding to the through-hole on a substrate. A substrate having a surface on which an object is formed, a mold having a desired through-hole for forming a structure on the surface of the substrate, a heating means for heating a structure-forming material, the mold and And / or drive means for moving the substrate away from each other, and means for continuously flowing the structure forming material to the opposite surface of the mold through the through hole and stopping the flow. The above processing apparatus.
(7) The method according to (6), further including a driving unit that relatively changes a direction in which the mold and / or the substrate are separated from each other, a structure forming material adhesion position and a through hole position on the surface of the substrate. Processing equipment.
(8) The processing apparatus according to (7), wherein the driving unit is a screw, a gear, a piezo element, or a composite driving system thereof.

Next, the present invention will be described in more detail.
The method of the present invention is a method for producing a structure having a two-dimensional shape corresponding to the through hole on a substrate by extruding and forming the structure forming material through the through hole of the mold. (1) heating the structure forming material, (2) the structure forming material on the opposite surface of the mold through the through hole of the mold having one or a plurality of through holes having a desired contour. (3) The substrate is brought into contact with or close to the mold, and the structure forming surface of the substrate and the structure forming material are adhered to each other. (4) The structure forming material is extruded and the through hole of the mold The mold and / or the substrate are moved away from each other while flowing to the opposite surface of the mold, and extruded onto the substrate to form a molded structure (5) By stopping the flow of the structure forming material to the opposite side of the mold through the through hole, the structure To end the formation, it is characterized in.

  The method of the present invention will be specifically described with reference to the schematic view of the structure manufacturing apparatus shown in FIG. 1, which enables the structure of the present invention to be manufactured. The apparatus of the present invention comprises a substrate (12) having a surface on which a structure is formed, a mold (13) having a through hole substantially corresponding to a desired shape to be formed on the surface of the substrate, A drive unit (11) having means for three-dimensionally moving the mold and the forming surface to move so as to relatively change the structure forming material adhesion position and the through hole position on the substrate surface; A structure having a heating means (14) for supplying the structure forming material (15) stably and a driving means for applying a load to the mold and pushing out the structure forming material (15). A forming material flow means section (16).

  The drive unit (11) having means for driving three-dimensionally can be used by appropriately selecting any type of drive means depending on the size and number of desired structures. For example, the drive system may be a system using screws, gears, piezo elements, or a composite drive system thereof.

  The material of the substrate (12) is appropriately selected and used, but the structure forming material can be bonded onto the substrate surface, and the structure is formed at a temperature at which the mold and the structure forming material are heated. Any material such as a resin material, a metal material, a semiconductor material, a ceramic material, or a composite material thereof can be used as long as the surface shape is maintained and the material does not react with the mold.

  The material of the mold (13) is appropriately selected and used. At the temperature at which the structure forming material is heated, there is no reaction with the structure and the substrate material, and the structure forming material is the mold. Any material such as resin-based material, metal-based material, semiconductor material, ceramic-based material, or composite material can be used as long as the material retains its shape under the load applied when flowing on the opposite surface. is there. The shape and size of the through hole of the mold can be arbitrarily designed according to the shape of the target structure.

  There is no problem with the heating means section (14), but the heating means section should be selected as appropriate depending on the heating temperature. Examples include nichrome wire, carbon, tungsten wire, and Peltier element. Is done. Further, it is preferable to take a method of measuring the temperature with a thermocouple, a radiation thermometer, etc., and feeding back the result, and to take a temperature control means. In the schematic view of the apparatus, the structure forming material (15) is surrounded by the heating means (14), the structure forming material flow means (16), and the mold (13). In order to avoid direct contact between 14) and the structure-forming material (15), it is desirable to install a block or the like between the structure-forming material. In this case, the block is a resin-based material, a metal-based material, or a semiconductor material as long as the shape is maintained at the heated temperature and does not react with the heating unit, the mold, and the structure-forming material. There is no problem with any material such as ceramic materials and composite materials thereof.

  The material of the structure forming material (15) is appropriately selected and used, but does not react with the mold or block at a heated temperature, and passes through the through hole of the mold under load. There is no problem with any material such as resin material, metal material, semiconductor material, ceramic material, and composite material as long as it is a material that can flow on the opposite surface and can be bonded to the substrate. In addition, when adhering the structure forming material (15) and the substrate (12), it is preferable to appropriately provide a holding time in order to sufficiently promote the adhesion.

  The structure forming material flow means section (16), which is a means for causing the structure forming material to flow to the opposite side through the through hole of the mold, is appropriately selected and used depending on the size and number of desired structures. However, any method can basically form the structure, and examples of the driving method include a screw, a gear, a piezo element, or a combined driving method thereof. In the schematic view of the apparatus, the structure forming material is surrounded by the heating means, the structure forming material flow means, and the mold, but the structure forming material and the structure forming material flow means are in direct contact with each other. In order to avoid this, it is desirable to install a block or the like between the structure forming material. In this case, the shape of the block is maintained at a temperature at which the mold and the structure forming material are heated, and the block, the mold, and the structure forming material between the heating unit and the structure forming material There is no problem with any material such as a resin material, a metal material, a semiconductor material, a ceramic material, or a composite material thereof as long as it does not react.

  Next, the steps of the present invention will be described in detail with reference to the schematic diagrams of the steps for producing a structure that enables the production of the structure of the present invention shown in FIGS. First, as a two-dimensional structure manufacturing method, the structure forming material is heated in FIG. In FIG. 2 (b), the structure forming material flow means part causes the structure forming material to flow to the opposite side of the mold through the through hole of the mold and stops the structure forming material flow means part. In FIG. 2C, the substrate is driven in a direction approaching the mold, and the formation surface is brought into contact with or close to the mold to bond the structure forming material and the substrate. In FIG. 2D, the structure forming material flow means part causes the structure forming material to flow to the opposite side of the mold through the through hole of the mold and away from the mold and the forming surface. Move to. In FIG.2 (e), a structure is formed on a board | substrate by stopping the flow to the metal mold | die reverse surface of a structure formation material.

  Next, as a method for manufacturing a three-dimensional structure, the steps are the same as the method for manufacturing a two-dimensional structure up to FIG. Thereafter, in FIGS. 3A and 3B, the structure forming material flow means moves the structure forming material to the opposite surface of the mold and moves away from the mold and the forming surface. In FIG. 2 (c), the flow of the structure forming material to the opposite surface of the mold is stopped by relatively changing the adhesion position of the structure forming material on the forming surface and the through hole position of the mold. Thus, a structure is formed on the substrate.

  The above steps up to bonding the structure forming material and the substrate can be appropriately changed. For example, (a) the structure forming material is heated, then (b) the substrate is driven in a direction approaching the mold, and the formation surface is brought into contact with or close to the mold, and (c) the structure is formed. There is a process procedure in which the structure forming material is caused to flow to the opposite surface of the mold through the through hole of the mold and the structure forming material and the substrate are adhered by the material flow means unit.

  Alternatively, for example, (a) the substrate is driven in a direction approaching the mold, and the forming surface is brought into contact with or close to the mold, and then (b) the structure forming material is heated, and then (c) the structure There is a process procedure in which the structure forming material is caused to flow to the opposite side of the mold through the through hole of the mold and the structure forming material and the substrate are bonded by the body forming material flow means unit.

  In the schematic diagram of the apparatus of FIG. 1, the substrate (11) and the drive unit (3-axis drive) (11) are in the upper part, the mold (13), the structure forming material (15), and the structure forming material flow are in the lower part. Although the means part (16) is used, the upper part and the lower part may be reversed, and the triaxial driving part may be installed on the mold, the structure forming material, and the structure forming material flow means part side. Furthermore, the three-axis drive may be divided. For example, in the schematic diagram of the apparatus in FIG. 1, a drive unit only in the direction in which the mold and the substrate are separated from each other is installed at the three-dimensional drive unit. The drive unit in the direction to relatively change the adhesion position of the structure forming material on the forming surface and the position of the through hole of the mold is installed on the mold, the structure forming material, and the structure forming material flow means side. May be. Depending on the case, it is also possible to adopt a method in which both sides are driven three-dimensionally.

  The shape, size, number, etc. of one or more through holes having a contour corresponding to the bottom shape of the desired structure in the mold are arbitrarily designed according to the shape, structure, etc. of the target structure can do. The speed of separating the mold and the substrate is the size and number of the designed through holes, the speed of the structure forming material flow means section, the heating means section, or the structure forming material constituting the block. It is almost determined according to the degree of change in the cross-sectional area of the portion and the cross-sectional area of the through hole. That is, the speed at which the mold and the substrate are separated is the same speed as the speed at which the structure-forming material comes out to the opposite surface of the mold through the through hole.

  In addition, by making the speed at which the mold and the substrate are separated from each other slower than the speed at which the structure-forming material comes out to the opposite side of the mold through the through-hole, the cross-section of the structure can be made larger than the cross-sectional shape of the through-hole. By making the shape larger and making the speed of separating the mold and the substrate faster than the speed at which the structure-forming material comes out of the mold through the through-hole, the cross-sectional shape of the through-hole However, the cross-sectional shape of the structure can be reduced, and the cross-sectional shape of the structure can be changed with a single mold. Furthermore, by making constant the speed and direction of changing the structure forming material adhesion position on the forming surface and the through hole position of the mold, a three-dimensional shape structure having a regular shape, or relative The three-dimensional shape structure having an irregular shape can be produced by changing the speed and direction of the change at each location.

  Completion of molding is possible by stopping the driving of the structure forming material flow means section, thereby arbitrarily designing the height of the structure, so that the height of the structure can be adjusted with one mold. A changed structure can be manufactured. Table 1 shows a comparison table between the conventional structure manufacturing method and the structure manufacturing method of the present invention. The present invention relates to parts such as micromachines, medical devices, sensor devices, and electronic devices that require processing of various shapes, in particular, a structure having a two-dimensional shape with a high aspect ratio and the structure in an arbitrary direction. A deformed structure having a three-dimensional shape can be formed in any number of locations on the substrate, in any number, simply and without any kind of material, and with freedom in shape. For example, it is useful as a processing technique for heat sinks, array structures for DNA analysis, probes for testing semiconductor integrated circuits, and the like.

The following effects are produced by the manufacturing method and the manufacturing apparatus of the present invention.
(1) A structure having a two-dimensional shape and a three-dimensional shape having a particularly high aspect ratio can be produced by extruding and forming the structure-forming material through a through-hole of a mold.
(2) A structure having a two-dimensional shape corresponding to the through hole of the mold can be produced and provided on the substrate.
(3) Producing and providing a structure having a three-dimensional shape obtained by regularly or irregularly deforming the structure having the two-dimensional shape on a substrate in an arbitrary direction. Can do.
(4) Lathes, grinders, and milling machines, which are typical machining machines, wire electric discharge grinding method (WEDG method), and wire cut electric discharge machining methods, which are electric discharge machines, forging and casting using conventional molds , Press, injection molding, imprint method, lithography method mainly used for producing fine structures, LIGA method, focused ion beam device (FIB), and apparatus for producing metal-based fine structures by electroplating method In the prior invention relating to the method (Japanese Patent Application No. 2006-078125), the present invention relates to a structure having a high aspect ratio, which is considered to be difficult to manufacture. By using the method of extruding and forming through, it is possible to select any number of materials in any place on the surface of the substrate, simply, without any kind of material, and to have flexibility in shape. It can provide a manufacturing apparatus of a manufacturing method and the structure of the structure can be fabricated structure.
(5) It is possible to provide an apparatus that can produce structures of more material types than the above method.

  EXAMPLES Next, although this invention is demonstrated concretely based on an Example, this invention is not limited at all by the following Examples.

(1) Construction of Structure Manufacturing Device In this example, a 1 mm thick SUS303 plate having one through hole having a diameter of 500 μm was used as a mold. A block made of SUS303 was used between the heating unit and the structure forming material and between the structure forming material flow unit and the structure forming material. Tin alloy was used as the structure forming material, and brass and nickel were used as the substrate. The substrate is installed at the top and driven upward to form a structure.

(2) Formation of structure Next, molding was performed under the conditions shown in Table 2. 20 minutes after bonding the substrate and the structural material, the substrate was driven upward. FIG. 4 shows a photograph during molding. The flow of the structure forming material to the opposite surface of the mold was terminated at an arbitrary position.

(3) Evaluation of structure Substrate moving speed 10 mm / min. And 20 mm / min. The appearance photograph of the structure obtained in Fig. 5 is shown in FIG. It can be seen that molding is possible regardless of the substrate material. Scanning electron micrographs of the structures obtained at the respective substrate moving speeds are shown in FIG. Each of the diameters has a substrate moving speed of 5 mm / min. 900 μm, substrate moving speed 10 mm / min. 650 μm, substrate moving speed 20 mm / min. In this case, the substrate moving speed is 30 mm / min. In this case, it is 400 μm, and the diameter of the structure can be changed by changing the substrate speed. Since the pushing of the structure forming material is finished at an arbitrary position and the formation of the structure is finished, it is possible to produce a longer structure, but for example, the substrate moving speed is 20 mm / min. In this case, the length was 147 mm, the aspect ratio was about 327, and a structure having a high aspect ratio could be produced.

(1) Construction of Structure Manufacturing Device In this example, a 1 mm thick SUS303 plate having one through hole having a diameter of 500 μm was used as a mold. A block made of SUS303 was used between the heating unit and the structure forming material and between the structure forming material flow unit and the structure forming material. A tin alloy was used as the structure forming material, and aluminum was used as the substrate. The substrate was installed at the upper part, and the structure was formed by driving upward, and the lower part having the mold was driven in the X and Y directions.

(2) Formation of structure Subsequently, molding was performed under the conditions shown in Table 3. 20 minutes after bonding the substrate and the structural material, the substrate was driven upward. The flow of the structure forming material to the opposite surface of the mold was terminated at an arbitrary position.

(3) Evaluation of structure The external appearance photograph of the obtained structure is shown in FIG. It can be seen that a structure having a three-dimensional shape could be produced.

(1) Construction of Structure Manufacturing Device In this example, a 1 mm thick SUS303 plate having one through hole having a diameter of 500 μm was used as a mold. A block made of SUS303 was used between the heating unit and the structure forming material and between the structure forming material flow unit and the structure forming material. A tin alloy was used as the structure forming material, and aluminum was used as the substrate. The substrate was placed at the bottom and the structural mold was placed at the top, and the structural body was formed by driving the structural mold upward, and the lower part was driven in the X and Y directions.

(2) Formation of structure Next, molding was performed under the conditions shown in Table 4. 20 minutes after bonding the substrate and the structural material, the substrate was driven upward. FIG. 8 shows a photograph during molding. The flow of the structure forming material to the opposite surface of the mold was terminated at an arbitrary position.

(3) Evaluation of structure The external appearance photograph of the obtained structure is shown in FIG. It can be seen that a structure having a three-dimensional shape could be produced. From Examples 1, 2, and 3, it can be seen that the installation position of the mold, the substrate, and the mechanism that drives in the X, Y, and Z directions may be either the upper part or the lower part.

(1) Construction of Structure Manufacturing Device In this example, a 2 mm thick brass plate having one through hole having a diameter of 500 μm was used as a mold. A block made of SUS303 was used between the heating unit and the structure forming material and between the structure forming material flow unit and the structure forming material. Polyester resin was used for the structure forming material, and acrylic resin was used for the substrate. The substrate is installed at the top and driven upward to form a structure.

(2) Formation of structure Next, molding was performed under the conditions shown in Table 5. The substrate and the structural material were adhered, and the substrate was immediately driven upward. The flow of the structure forming material to the opposite surface of the mold is terminated at an arbitrary position.

(3) Evaluation of structure Substrate moving speed 10 mm / min. And 20 mm / min. The appearance photograph of the structure obtained in is shown in FIG. It can be seen that the resin material can also be molded.

(1) Construction of Structure Manufacturing Device In this example, a 2 mm thick brass plate having two through holes with a diameter of 500 μm was used as a mold. A block made of SUS303 was used between the heating unit and the structure forming material and between the structure forming material flow unit and the structure forming material. Polyester resin was used for the structure forming material, and acrylic resin was used for the substrate. The mechanism is formed by placing the substrate at the bottom and the structural mold at the top and driving the structural mold upward.

(2) Formation of Structure Next, molding was performed under the conditions shown in Table 6. The substrate and the structural material were adhered, and the substrate was immediately driven upward. The flow of the structure forming material to the opposite surface of the mold is terminated at an arbitrary position.

(3) Evaluation of structure The external appearance photograph of the obtained structure is shown in FIG. It can be seen that a plurality of structures can be formed.

  As described above in detail, the present invention relates to a method of manufacturing a structure and an apparatus therefor. The present invention extrudes and forms a structure-forming material through a through-hole of a mold to form a substrate. A method for manufacturing the structure, and a method for manufacturing the structure, which can form a structure having an arbitrary number of materials and a degree of freedom in shape, in an arbitrary number on a surface, simply and in any number It is possible to provide a device. The present invention makes it possible to produce a structure having a high aspect ratio, particularly with respect to a processing technique of a structure such as a heat sink, an array structure for DNA analysis, a probe for testing a semiconductor integrated circuit, and the like. This is useful as a technique for processing the structure.

1 is a schematic view of a manufacturing apparatus according to the present invention. It is a schematic diagram which shows the process of the manufacturing method which concerns on this invention. It is a schematic diagram which shows the process of the manufacturing method which concerns on this invention. 2 is an appearance photograph during structure formation in Example 1. FIG. 2 is an external appearance photograph of a structure in Example 1. (A) Substrate moving speed 10 mm / min. (B) Substrate moving speed 20 mm / min. . 2 is a structure scanning electron micrograph in Example 1. FIG. (A) Substrate moving speed 5 mm / min. (B) Substrate moving speed 10 mm / min. (C) Substrate moving speed 20 mm / min. (D) Substrate moving speed 30 mm / min. . 3 is a structural appearance photograph in Example 2. Each shot was taken at a different angle. 6 is an appearance photograph during structure formation in Example 3. FIG. 6 is a structural appearance photograph in Example 3. Each shot was taken at a different angle. 6 is a structural appearance photograph in Example 4. 7 is a structural appearance photograph in Example 5.

Explanation of symbols

(Reference in FIG. 1)
11 Drive unit (3-axis drive)
DESCRIPTION OF SYMBOLS 12 Substrate 13 Mold 14 Heating means 15 Structure forming material 16 Structure forming material flow means

Claims (8)

A method of producing a structure having a two-dimensional shape corresponding to the through hole on a substrate by extruding and forming a structure forming material through a through hole of a mold,
(1) heating the structure-forming material;
(2) The structure-forming material is caused to flow to the opposite surface of the mold through the through-hole of the mold having one or a plurality of through-holes having a desired contour.
(3) The substrate is brought into contact with or close to the mold to bond the structure forming surface of the substrate and the structure forming material.
(4) Extruding the structure forming material and moving the mold and / or the substrate in a direction away from each other while flowing to the opposite surface of the mold through the through hole of the mold. To form a molded structure,
(5) Terminate the formation of the structure by stopping the flow of the structure forming material to the opposite surface of the mold through the through hole.
A structure manufacturing method characterized by the above.   The structure forming material is extruded, and the mold and / or the substrate are moved away from each other while flowing to the opposite side of the mold through the through hole of the mold, and the structure on the forming surface. The method for producing a structure according to claim 1, wherein the structure formed by extrusion is formed on the substrate by relatively changing the forming material adhesion position and the through hole position of the mold.   The method for producing a structure according to claim 1, wherein the structure forming material is a resin-based, metal-based, semiconductor, ceramic-based material, or a composite material thereof.   The method for producing a structure according to claim 1, wherein a structure having a two-dimensional shape corresponding to the through hole of the mold is produced on the substrate.   2. A structure having a shape obtained by regularly or irregularly deforming a structure having a two-dimensional shape corresponding to a through hole of a mold on an arbitrary direction on a substrate is produced. A method for manufacturing the structure described in 1.   A processing apparatus for extruding a structure-forming material through a through-hole of a mold and forming it to produce a structure having a two-dimensional shape corresponding to the through-hole on a substrate. A substrate having a surface to be formed, a mold having a desired through hole for forming a structure on the surface of the substrate, a heating means for heating the structure forming material, and the mold and / or the substrate Drive means for moving in a direction away from each other, and means for continuously flowing the structure forming material to the opposite surface of the mold through the through hole and stopping the flow, The above processing device.   The processing apparatus according to claim 6, further comprising a driving unit that relatively changes a direction in which the mold and / or the substrate are separated from each other, a structure forming material adhesion position on the surface of the substrate, and a through hole position. The processing apparatus according to claim 7, wherein the driving unit is a screw, a gear, a piezo element, or a composite driving system thereof.