JP2008068322A - Process and apparatus for joining at least two elements - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process and apparatus for efficiently joining many joining parts in at least two elements, in particular an electronic component such as an LED with a substrate, such as a PCB. <P>SOLUTION: An imaging means divides a light beam 10 using a diffractive optical element (DOE) 5 also enabling essentially desired beam shaping and beam processing, and images these partial divided light beams, forming a plurality of discrete light spots, which form a plurality of discrete material joining portions 14a, 14b... A plurality of material joining portions can be formed simultaneously enabling a high process rate. Thus, the method is suited for laser soldering of components. These discrete light spots can also be used for material processing, in particular for simultaneously forming a plurality of preweakened material zones or perforations in a substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

Detailed Description of the Invention

[Related Invention]
The present invention relates to two applications (US Provisional Application No. 60 / 840,199 filed Aug. 25, 2006, and July 2007) having the same title “Method and apparatus for joining at least two elements”. And claims the priority of the two above-mentioned applications in relation to US application 11 / 828,377, filed on May 26. The entirety of the two above applications is hereby incorporated by reference herein.

(Field of the Invention)
The present invention generally relates to the joining or connection of two elements. More particularly, the present invention relates to the joining or connection of two elements by a method of joining materials in which soldering with soft solder is most preferably used. A further related aspect of the invention generally relates to a method of processing a substrate using laser light. More particularly, a further related aspect of the invention relates to a method of preferably reticulated or lamellar material such as plastic, sheet metal, paper, cardboard or textile, said method preferably comprising: Forming a softened section or making a hole in the substrate or material as described above using laser light.

BACKGROUND OF THE INVENTION
Currently, in the integration of electronic devices, it is necessary to solder 40,000 parts per hour. For this reason, reflow soldering or remelting soldering is mainly used in mass production of electronic devices, particularly in mass production of printed circuit boards (PCBs). Reflow soldering is a method of soldering components of a surface mounted component (SMD) using soft solder. In the first stage of soldering with soft solder, the soft solder is applied onto the surface of the printed circuit board before placing the SMD components. In the next stage, the above components of the SMD are placed. Since the soft solder paste used is sticky, the components of the SMD are held directly by the solder paste during placement. In this way, it is not necessary to fix the above SMD components before soldering with soft solder. During the subsequent remelting of the soldering agent, the above components of the SMD automatically collect on the bonding pad and stabilize themselves due to the surface tension of the soldering agent.

  Although high throughput can be achieved using reflow soldering, the parts to be soldered are subjected to high temperature additions during reflow soldering. Due to the ever-increasing degree of integration and functionality, microelectronic components become increasingly temperature sensitive. This is especially true in micro electrical equipment systems (MEMS). Furthermore, it is necessary to take into account that the Waste Electrical and Electronic Equipment (WEEE) Directive in the European Community, which requires a switch to lead-free electrical products, will enter into force on 1 July 2006. Lead-free soldering defined in the future by WEEE usually causes higher soldering temperatures. And, by lead-free soldering, the soldering temperature is easily increased by about 20K. Furthermore, lead-free soldering increases the above-described heat application during soldering. Therefore, a soldering technique relating to electronic device manufacturing that enables the temperature application to be reduced is sought for these reasons.

  In order to obtain a high tensile strength, solder containing a large amount of antimony is preferable. Because antimony (Sb) has a high melting point, antimony-rich solder causes a higher soldering temperature that also increases the temperature addition to the part.

  Other soldering techniques such as fluid soldering cannot solve the above problem.

  Laser light soldering is well known in other technical fields. In laser light soldering, the solder is heated using laser light. It can be concentrated with high accuracy and a large amount of energy can be transferred to the solder. In this way, the solder is heated at a very high spatial resolution allowing for a short soldering time of, for example, less than 1 second. Therefore, it is possible to substantially eliminate the temperature applied to the component.

  German utility model DE 20 2004 013 136 U1 discloses a modular fiber cable optical unit used in welding robots for welding in the manufacture of motor vehicles. The optical unit is held by the robot's hand, which moves the beam into the appropriate geometric shape by linear motion and panning to form a weld seam along the joining gap.

  US application 2005/0082265 A1 discloses a laser welding process for use in manufacturing a hydraulic control device in a vehicle. In this method, one type of metal and one type of resin are welded or joined together. Each of the beams needs to be moved to form the required closed weld seam.

  The use of a robot that utilizes a deflected beam makes the welding or soldering time relatively long. And it takes time for welding or soldering, which is not suitable for mass production of electronic devices.

  Another possible galvano scanner is used to deflect the beam because the galvano scanner has substantially no rotational inertia. And the fact that it has substantially no rotational inertia allows a higher deflection speed compared to a kinetic beam deflection unit. For this reason, such a galvano scanner can be normally used for manufacture of an electronic device.

  US application 2004/0190294 A1 discloses a method of laser soldering high power light emitting diodes (LEDs). In the above method, a plurality of solders are formed along a curve named an annular curved portion. Laser beam deflection is performed using a scanner having two movable mirrors. However, the processing speed achieved in this way is not sufficient for the manufacture of electronic devices with a high processing capacity. Because such a soldering process also performs a continuous procedure and spans at least 0.5 to 2 seconds (not including the time required to move to the substrate etc.) Continue. If the method is used with an increased number of scanners, the method requires very complex control of the scanner, which increases the manufacturing cost.

  Similar problems arise in the processing of substrates, for example, the formation of multiple holes, hole coverings, and / or pre-softened compartments for geometrical relative placement.

  A conventional method for drilling holes in a substrate is disclosed in US 4,568,815. A plurality of holes arranged at a uniform distance from each other are formed by using laser ablation or thermal melting on a net-like substrate that passes the laser at a uniform speed. In order to determine the position where the hole is to be formed, the laser light is radiated with high frequency using a shutter and deflected using a rotating scanner mirror. The mechanical inertia of the scanner mirror inherently limits processing speed and increases maintenance costs.

  Similar devices using a scanner mirror for beam deflection that forms pre-softened sections or holes in the material are disclosed in German utility model DE 200 13 469 U1 and German utility model DE 199 45 022 A1. Yes.

  If the pre-softened sections or holes are formed at positions apart from each other on the substrate, the processing speed of the apparatus is not particularly limited by the rotational inertia of the scanner mirror. One way to increase the processing speed is the simultaneous use of multiple lasers imaged using an associated scanner mirror and imaging optics. However, this method further increases processing costs.

[Summary of the Invention]
It is an object of the present invention to provide an apparatus and a device for joining at least two elements or parts using a beam in order to easily realize a high processing speed or production speed and a reduction in temperature applied to the elements of parts to be joined simultaneously. Is to provide a method. According to a particularly preferred application of the invention, an electronic, optoelectronic or microelectronic (MEMS) element or component is soldered using laser light.

  According to an aspect of the present invention, there is provided a method and apparatus for forming a plurality of pre-softened sections or holes using laser light to achieve a high processing speed in a simple method.

  In one process according to the present invention, the imaging optical system splits the beam (particularly a laser beam) into parts of a plurality of beams that are imaged onto elements or parts that are connected to each other. Some of the plurality of beams form a plurality of discrete spots of light. In accordance with the present invention, the plurality of light spots form a plurality of discontinuous material joints between the elements or parts to be joined by the movement of a large amount of energy. It is preferable that the elements or parts are joined to each other at the joining portion by melting soft solder. However, the present invention is suitable for the soldering, welding and photocuring of hard solders by means of the light spots.

  Thus, according to the invention, a plurality of material joints or connections are formed simultaneously (especially by soldering). According to the present invention, time consuming and expensive beam deflection is not necessary. As is well known, a beam can be easily split into portions of multiple beams. When forming material joints between elements, particularly using soldering, a minimum output per joint is required, so that the method according to the invention allows each part of the beam to be Essentially, it has the only restriction that it must have sufficient strength or power. However, the restriction can be realized in any way that is required by appropriate arrangement of beam splitting means and appropriate selection of the light output of the input beam.

  According to the invention, a part of the beam is imaged and diffracted in front of the imaging optics to form a plurality of junctions simultaneously. The use of a diffractive optical element (DOE) associated with the imaging optics has been found to be a special use for proper beam splitting. This is because this means can split the intensity of strong light into a part of the beam with the same properties without damaging the proper beam characteristics. More particularly, the influence of the additional beam shape can be achieved by using a diffractive optical element, in particular for each of the beam parts, in particular for the beam cross section, intensity, shape or beam properties, and / or dispersion. Can be achieved.

  According to another embodiment, the joints are arranged in a predetermined geometric arrangement. This can be done, for example, on the holding means for aligning the elements or parts to be joined during processing, for example the arrangement of elements or parts to be joined and / or the geometrical nature of these elements or parts. Determined by placement. According to the invention, the diffractive optical element is arranged in such a way that the part of the beam is generated to coincide with a predetermined arrangement of joints and is guided and imaged in a corresponding direction. Is done.

  A portion of the beam is generated based on the predetermined array of joints and imaged in a corresponding direction. The advantage is that more expensive polarization of part of the beam is not necessary. The diffractive optical element can be moved (e.g. held in a revolver unit or other rotating or exchange unit) to achieve adjustment of the process to other geometric arrangements of the joint May be.

  The plurality of diffractive optical elements may be normally connected to the imaging optical system. For example, the plurality of diffractive optical elements may be held directly inside the imaging optical system in order to divide the input beam into a part of the plurality of beams. However, according to other embodiments, a single part comprising a plurality of diffractive optical sections, or so-called active sections, having a sequence through which a portion of the input beam passes and coincides with the predetermined sequence. It is preferable to use a diffractive optical element. The diffractive optical element can comprise a single diffractive optical section or a plurality of diffractive optical sections or active sections. A single diffractive optical section, or multiple diffractive optical sections or active sections, have different refractive indices, for example, as alternating protruding and recessed sections having a linear, circular or elliptical shape. It may be formed as alternating portions, or in any other manner as a structure capable of diffracting light in an appropriate manner. These active compartments are preferably arranged on a single substrate that is transparent to the input beam. The substrate may be movably held in the beam path of the input beam in a suitable manner.

  According to a preferred aspect of the present invention, each of the diffractive optical sections of the diffractive optical element has an appropriate intensity, an appropriate beam cross-section, an appropriate beam property, and a corresponding beam portion, and Arranged to provide beam dispersion. In this way, the individual diffractive optical sections may be arranged in any different manner.

  Also, in particular, in this way, portions of the beam with different intensities are such that material bonding (eg, soldering) is formed simultaneously by different energy inputs for different locations using a single input beam. May be realized in a simple manner.

  According to another aspect of the present invention, the imaging optical system includes at least one input lens and output lens that are separated from each other in the beam traveling direction. Note that the diameter of the laser beam can be adjusted larger or smaller by changing the distance between the input lens and the output lens. If an optical waveguide (especially an optical fiber) is used to couple the input beam to the imaging optics, the distance between the input lens and the output end of the optical waveguide However, it may be changed. This allows the diameter of the laser beam to be freely adjusted to an additional degree.

  According to another aspect of the present invention, the diffractive optical element is disposed between the input lens and the output lens. This facilitates adjustment and reduces the tolerance of adjustment. At the same time, the diffractive optical element may be housed in a modular optical system unit together with the input lens and the output lens, and may be sealed. The housing of the imaging optics uses, for example, a revolver unit, or other rotation and displacement unit, to allow the transition of the diffractive optical element to produce an array of different geometric junctions , May be arranged. Various diffractive optical elements having different arrangements are applied.

  A particularly preferred application of the above method relates to the soldering of soft solders of electronic or optoelectronic components, microelectronic systems (MEMS) or connectors to a carrier (eg printed circuit board). In these applications according to the present invention, the plurality of solderings appropriately divides the beam (particularly the laser beam) into a plurality of parts of the plurality of beams, while at the same time the part of the beam comprises an array of the elements or the parts, And / or may be done simultaneously by being diffracted and imaged in a suitable manner on solder that conforms to these geometrical arrangements. According to the present invention, an expensive series of polarization of the laser beam using a scanner is not required. In this way, a high processing speed is realized. At the same time, the temperature load of the element or part to be soldered is negligible. The diffractive optical elements used may be arranged so that a plurality of elements or parts can be soldered simultaneously. In addition, thereby, the processing according to the present invention is suitable for the production of electronic equipment or electronic components having high processing capacity. In such a process, for example, one of the beams is arranged in such a way that different arrangements of soldering are carried out at the same time in order to eliminate the above-mentioned elements or parts, such as connection connectors, element pull-outs or connectors. Parts may be generated with different strengths or outputs.

  According to another aspect of the invention for forming a pre-softened material section or hole, the imaging optics uses light diffraction to split a beam (preferably a laser beam) into a plurality of Divide into parts of the beam. A portion of the beam is imaged onto the substrate or material being processed. A part of the beam forms a plurality of discontinuous light spots. As a result of the energy input resulting from such processing, according to the present invention, a plurality of discrete, pre-softened sections or holes are formed in the substrate or material.

 That is, as a result of such processing, temperature melting or laser ablation of the substrate material occurs at the positions of a plurality of discontinuous light spots. The method according to the relevant aspect of the invention is usually suitable for the treatment of any material. The method is preferably applied to a thin material having a flat surface in the area to be treated. It is preferable that the material has a reflectance as small as possible with respect to the wavelength of the light source or the laser beam so that optimum energy is input to the material.

  Thus, according to the present invention, a plurality of pre-softened material sections or holes may be formed simultaneously for the material to be treated. The time and cost of polarization of the beam is not necessary according to the invention. As is well known, a beam can be easily split into portions of multiple beams. In order to form pre-softened material sections or holes, a minimum output is required for each discontinuous spot of light, so that the method according to the present invention is at a desired plurality of discontinuous locations. In order to process the above materials simultaneously, it is essential to limit only that each part of the beam must have sufficient intensity or power. The conditions relating to the restriction may be realized in any manner required by appropriate arrangement of beam splitters and appropriate selection of the input beam.

  According to other embodiments, the pre-softened material compartments or holes are in a predetermined geometric arrangement, for example as required by the substrate being processed or the intended use of the material. Be placed. For example, if the enclosed line is formed below the surface of the substrate, it consists of a section of material previously southed, such as the enclosed break line in the plastic material of the airbag lid. According to the invention, it is preferred if all of the pre-softened material sections of the enclosed line are formed simultaneously in the substrate or the material. According to the invention, the diffractive optical element is formed such that a part of the beam corresponds to a predetermined arrangement of pre-softened material sections or holes (a), and (b) each direction. And (c) formed and arranged so as to be imaged. This is advantageous in that no additional complex polarization of part of the beam is required anymore. The diffractive optical element can be held in a revolver unit or other rotation or displacement unit, for example, in order to accommodate processing of other soft arrangements of pre-softened material sections or holes to other geometrical arrangements. If it is)

  Further, the properties of the imaging optical system may influence certain factors that are important for the processing of the material, such as the intensity of the light and the properties of the beam. According to another embodiment, the nature of the imaging optics is such that the pre-softened section faces the imaging optics below the surface of the substrate (e.g. below the substrate of the material to be processed). Alternatively, it is such that it is formed deep enough to reach the backside of the substrate or material being processed on the opposite side of the imaging optics.

  According to another embodiment, the geometric shape of the pre-softened section or hole is such that the diffraction pattern is formed to form a corresponding spot of light that forms each of the pre-softened sections or holes. It is directly determined by the diffractive properties of the image optical system (in particular the corresponding diffractive section of the diffractive optical element). For example, if the pre-softened section or hole contour is shaped into an oval shape, the beam polarization and / or relative movement between the substrate and the laser beam by additional equipment can be controlled. Without being necessary, a part of the beam is pre-softened by the diffractive imaging optical system (especially the corresponding diffractive section of the diffractive imaging optical system) to have the desired shape by laser ablation or thermal melting of the substrate material. Segmented and imaged such that a defined section or hole is formed directly.

[Brief description of the drawings]
In the following, the invention will be described with respect to exemplary embodiments with reference to the enclosed drawings. From the following description, further features, advantages and problems to be solved of the present invention can be understood.

  FIG. 1 is a schematic view showing a laser soldering apparatus for electronic components according to the present invention.

  FIG. 2 is an enlarged cross-sectional view of the imaging optical system of the apparatus according to FIG.

  FIG. 3 is a schematic partial cross-sectional view of the LED laser soldering method according to the present invention.

  FIG. 4 is a plan view showing the distribution of solder electrically connected on a carrier such as a printed circuit board.

  FIG. 5 is a schematic diagram illustrating an apparatus according to related aspects of the present invention for simultaneously forming a plurality of pre-softened areas or holes in a reticulated material.

  FIG. 6 is a schematic partial plan view showing a substrate on which processing according to a related aspect of the present invention is performed.

  Throughout the six drawings, the same reference numbers refer to the same or essentially equivalent elements or groups of elements.

[Detailed Description of Embodiments of the Present Invention]
As shown in FIG. 1, the laser beam of the diode laser 8 is coupled to an optical fiber 9 and is provided in an apparatus including a processing head that supports an imaging optical system 1 having an associated diffractive optical element (DOE) 5. Led. The input beam 10 is divided into a plurality of beam portions 12 a to 12 c by the imaging optical system 1. At the same time, portions of the plurality of beams 12a-12c are collected at the focal point. For this reason, the distance between the processing head and the printed circuit board (PCB) 13 is adjusted according to the focal length of the imaging optical system 1 and the desired diameter of the beam spot on the printed circuit board 13. Has been. For example, the distance between the processing head and the beam spot is processed so as to be about 10 cm to about 50 cm. As shown in FIG. 1, a plurality of components (not shown) are arranged on the printed circuit board 13 as a periodic array. The periodic arrangement is shown only as three connection pins 14a, 14b and 14c that are electrically connected to a plurality of the above components. The connecting pins are arranged in a suitable geometric arrangement, which may be determined, for example, by the design of the circuit, for example on a soldering pad or a bonding pad of the printed circuit board circuit 13. The geometric arrangement of the connection pins may be essentially arbitrary with respect to the plane of the printed circuit board 13. In order to achieve proper imaging and diffraction of the beam portions 12a-12c, only the imaging optical system 1 and the diffractive optical element 5 are appropriately used as described in detail below. Need to be deployed.

  The adjusting device 4 is provided for adjusting the imaging optical system 1. As shown in FIG. 2, the adjusting device 4 is configured to adjust the diameter of the input beam 10, the diameters of the beam portions 12 a to 12 c, and the light spot in an appropriate manner. The distance z1 between the input lens 2 and the output side of the optical fiber 9 and / or the distance z2 between the input lens 2 and the output lens 3 connected to the imaging optical system 1 can be particularly changed. it can.

  According to FIG. 1, the DOE 5 can be supported on a manual or automatic variable unit 7, such as a revolver unit or similar rotating unit. By actuation of the variable unit 7, the DOE may be modified to position it in another suitable geometric arrangement of soldering.

  According to FIG. 1, the printed circuit board 13 is supported by a translation device 15 such as a conveyor belt or an xy-direction movement table. The translation device 15 is driven by the drive unit 16.

  In the process, the components to be soldered on the printed circuit board 13 are preferably arranged in a periodic, repeating arrangement. During the first processing step, a plurality of solders are made on the first portion of the printed circuit board 13, such as where the connection pins 14a-14c are shown. These solders may be placed on the part. However, these solders may also be formed on different parts. These solders may be formed simultaneously during the first process as a result of splitting the beam into a plurality of beam portions 12a-12c. Next, the adjustment device 15 is driven and the alignment of the parts in which adjacent parts have the same geometric arrangement or are arranged in the same geometric arrangement comprises Move to the work area of DOE5. The working area is an area where the beam portions 12a to 12c are imaged, for example, on the connecting pins 14a ', 14b' and 14c 'shown in the drawing. This together constitutes a second processing step and may be repeated in a similar manner. During each individual processing step, the substrate is moved by the same distance, which is determined by the distance between the individual periodic arrays of the components on the substrate.

  In order to control the laser soldering device according to FIG. 1, the adjusting device 4, the variable device 7, the translation device 15 having a connected drive unit 16, and the laser diode 8 are particularly controlled, for example a CPU A control device such as (not shown) is provided.

  Further details of the imaging optical system 1 will be described with reference to FIG. Between the lenses 2 and 3, which are arranged along the optical axis 11 and spaced apart from each other, a DOE 5 which divides the input beam 10 into a part of the beam shown by diffraction is arranged. Has been. As a result of the imaging properties of lens 2, lens 3, and / or DOE 5, the beam portions 12a-12c are focused or imaged in an appropriate manner. Due to the different diffraction in the sub-compartments 6a-6c of the DOE 5, the beam portions 12a-12c are diffracted in the appropriate direction. According to FIG. 2, a plurality of different diffractive optical sections 6a-6c have different intensities, beam cross-sections, beam properties or beam shapes, and / or divergences for the plurality of beam portions 12a-12c. It is provided in the DOE 5 to be given. One skilled in the art can select an appropriate arrangement of DOE 5 and diffractive optical sections 6a-6c. Similarly, a very large number of beam portions 12a-12c may be formed simultaneously by appropriately spreading the input beam 10 and by appropriate arrangement of the diffractive optical sections 6a-6c, It will be clear to those skilled in the art.

  FIG. 3 shows a method according to the invention for laser soldering the LEDs 20. The LED 20 includes a socket 21 in which a light emitter 23 connected via a bonding wire 24 is formed. Furthermore, an optical lens element 22 is provided on the socket 21 in order to determine the shape of the emitted beam. The light emitter 23 is disposed on a heat sink 25 having high thermal conductivity in order to minimize heat application of the light emitter 23. According to FIG. 3, the connection pins 14 a and 14 b are supplied through a socket 21 for electrically connecting the p side and the n side of the light emitter 23. The LED 20 is disposed on the printed circuit board 13. As shown in FIG. 3 and described with reference to FIGS. 1 and 2, the laser light is split into two laser parts L1 and L2 and is connected to the connection pins 14a and 14b by the imaging optics. Imaged on top. As a result, in these regions, the softened solder is melted and the solders 17a and 17b shown in the figure are formed in accordance with the geometric arrangement of the connecting pins 14a and 14b. Of course, in this method, multiple LEDs may be soldered simultaneously using a single processing step.

  In addition, the above-described method according to the present invention is applied to connection of a connector, a microelectric device element, and the like as described with reference to FIG. According to FIG. 4, the connector 30 shown in plan view comprises three connection pins 14a-14c and two tongues 18a and 18b that facilitate the opening of the drawer. As shown in the figure, the three connection pins 14a to 14c and the two tongues 18a and 18b are contacted or connected by solders 17a to 17e. In order to connect the drawer opening tongues 18a and 18b, a laser with a stronger output may be required. This may be achieved by appropriate beam splitting using the DOE of the imaging optical system. The splitting of the input beam may usually be achieved with any beam splitting ratio. In the embodiment according to FIG. 3, the contact or fixing of the heat sink 25 may require higher laser power or laser intensity.

  An apparatus and method for forming a plurality of pre-softened sections or holes in a substrate will be described below with reference to FIGS.

  According to FIG. 5, a period in which a plurality of light spots is only each of the three light spots forming, for example, the previously southed compartments or holes 114a, 114 and 114c, as shown in the figure. As a typical arrangement, it is formed on the substrate 13. The spot of light on the substrate 13 is formed as a suitable geometric arrangement, for example as required by normal use of the substrate. The geometric arrangement of the light spots may be essentially arbitrary in the plane of the substrate 13. In order to achieve proper imaging and diffraction of the beam portions 12a-12c, only the imaging optics 1 and the diffractive optical element 5 are in essentially the same manner as described for laser soldering. What is necessary is just to arrange appropriately. For this purpose, diffractive imaging optics may be used as described above for laser soldering.

  The above process according to the present invention, which forms a plurality of pre-softened sections or holes on the substrate, is essentially the same as described above for laser soldering, and the light spots are discontinuous multiples. The main difference is that instead of the solder, it leads to the formation of a plurality of discontinuous pre-softened sections or holes on the substrate.

  In addition, the above method according to a related aspect of the present invention is usually suitable for processing a substrate in which a substrate is processed simultaneously at a plurality of positions. For this purpose, the input beam is split into some of the plurality of beams in the manner described above. Some of the plurality of beams form a plurality of discontinuous processing positions on the workpiece 40, such as holes, hole coverings and / or softened portions as shown in FIG. The method is suitable for the treatment of any substrate, for example paper or cardboard, plastic material, or sheet metal. The plurality of processing positions 41 may be formed along an arbitrary line as shown in FIG. 6 and, for example, in a plastic cover of an air bag module of a motor vehicle or in a paper or cardboard box A predetermined breaking line may be formed. This detail is described in, for example, EP 0 566 722 B1.

  The method according to the above-mentioned aspect related to the present invention may be claimed as follows.

A method of forming a plurality of pre-softened sections or holes in a substrate (13 and 40) comprises:
The following steps:
Providing a beam (10); and a plurality of discontinuous light spots formed on the substrates (13 and 40), wherein the discontinuous light spots are a plurality of pre-softened sections or The beam is imaged using imaging optics (1 and 5) so that holes (14a-14c and 41) are formed simultaneously, and the beam is part of a plurality of beams using light diffraction. The process of dividing into (12a-12c) is included.

  According to another embodiment of the method, the spot of light forms a hole, a hole covering or a softened part.

  According to another embodiment of the method, the imaging optical system comprises a diffractive element (5) that divides the beam into a plurality of parts (12a-12c) of the beam by diffraction.

  Thus, according to another aspect of the present invention, a plurality of discontinuous light spots are also formed, which are supplied with a beam, in particular a laser beam, and realize the respective processing of the substrate. It is provided that the substrate is processed in such a way that an imaging optical system images the beam and divides the beam into a part of a plurality of beams.

  Examining this specification in detail, it will be apparent to those skilled in the art that discontinuous connections or processing portions may partially overlap one another. A portion of the beam may be directed in any manner on the bonding or processing portion on the front side and / or back side of the carrier or substrate. For this purpose, holes may be drilled in the carrier or the substrate, or the carrier may be transparent at least in part so that light can enter and exit the joining or processing part. For further details of laser soldering of optoelectronic components such as, for example, high power LEDs or high power laser diodes, reference is made to US 2004/0190294 A1. The entirety of US 2004/0190294 A1 is hereby incorporated by reference herein, in particular with regard to the arrangement of printed circuit boards (PCBs) for connecting elements or connecting components.

It is the schematic which shows the laser soldering apparatus of the electronic component which concerns on this invention. It is sectional drawing to which the imaging optical system of the apparatus which concerns on FIG. 1 was expanded. 1 is a schematic partial cross-sectional view of an LED laser soldering method according to the present invention. For example, it is a plan view showing the distribution of solder electrically connected on a carrier such as a printed circuit board. FIG. 2 is a schematic diagram illustrating an apparatus according to a related aspect of the invention for simultaneously forming a plurality of pre-softened areas or holes for a reticulated material. 1 is a schematic partial plan view showing a substrate on which a method according to a related aspect of the present invention is applied. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Imaging optical system 2 Input lens 3 Output lens 4 Adjustment apparatus 5 Diffraction optical element 6a-6c Diffraction optical element or diffraction optical division 7 Variable (replacement) apparatus 8 Light source (laser diode, LED)
DESCRIPTION OF SYMBOLS 9 Optical waveguide 10 Input beam 11 Optical axis 12a-12c Part of beam 13 Printed circuit board 14a-14c Connection pin 14a'-14c 'Connection pin 114a-114c formed in the next processing step Compartment softened beforehand, Or holes 114a 'to 114c' pre-softened sections or holes 15 formed in the next processing step or holes 15 translation device 16 drive units 17a to 17e solders 18a to 18e drawer opening tongue 20 LED
21 Socket 22 Lens 23 Semiconductor component / light emitting body 24 Bonding wire 25 Heat sink 30 Connector 31 Socket 40 Processed object 41 Hole / softening area 42 Wire

Claims (20)

A method of joining at least two elements (13 and 20) comprising:
Providing a beam (10) and a plurality of discontinuous light spots to form a plurality of discontinuous material joints (17a-17e) between at least two of the elements (13 and 20). Forming the beam (10) using the imaging optical system (1 and 5), and dividing the beam into a plurality of beam portions (12a to 12c). how to.   The method according to claim 1, wherein the imaging optical system comprises a diffractive optical element (5) for dividing the beam (10) into the parts of a plurality of beams by diffraction. The joining portions (17a-17e) are formed in an arrangement predetermined by the arrangement of the elements (13 and 20) to be joined and / or the geometric arrangement of the elements;
The diffractive optical element (5) splits the input beam into the portions (12a-12c) of the beam that coincide with the predetermined array of joints and directs the input beam in different directions. Item 3. The method according to Item 2.   4. The method according to claim 3, wherein the diffractive optical element (5) comprises a plurality of diffractive optical sections (6a-6c) that coincide with the predetermined arrangement of the joints.   The diffractive optical section (6a-6c) is based on different intensities, different beam cross-sections, different beam shapes and / or beam divergences of the part (12a-12c) of the beam. Method. The beam (10) is emitted from the optical waveguide (9),
The imaging optical system includes an input lens (2) and an output lens (3).
The beam diameter of the beam or part of the beam is determined by the distance (z1) between the input lens and the optical waveguide and / or the distance (z2) between the input lens and the output lens. 6. The method according to any one of claims 2 to 5, wherein the method is adjusted by changing.   The method according to claim 6, wherein the diffractive optical element (5) is arranged between the input lens (2) and the output lens (3).   The method according to claim 1, wherein the material joint portion is formed by soft soldering, soldering, welding, or photocuring of an adhesive.   2. The joining portion is formed by melting solder for joining the connection pin and the carrier on the connection pin (14a-14c) of at least one electronic component or optoelectronic component or at least one connector. The method of any one of -8.   The method according to claim 9, wherein the carrier is a printed circuit board (13; PCB).   The method according to claim 1, wherein the beam is a laser beam.   12. Method according to claims 1 to 11, wherein the elements (13 and 20) comprise electronic components, microelectronic components, optoelectronic components, optical components and MEMS (microelectronic device systems). A device for joining at least two elements (13 and 20),
Holding means (15) for aligning said element or substrate;
A light source (8) providing a beam (10); and a plurality of discontinuous spots of light joining at least two elements (13 and 20) in a plurality of discontinuous material joints (17a-17e) Imaging means (1 and 5) for imaging the beam and splitting the beam (10) into parts of a plurality of beams such that
A device equipped with.   14. An apparatus according to claim 13, wherein the imaging means comprises a diffractive optical element (5) for dividing the beam into the parts of a plurality of beams by diffraction. The holding means (15) aligns the elements (13 and 20) in a predetermined array;
15. The diffractive optical element (5) divides the beam into the portions (12a-12c) of a beam that coincide with the predetermined array and directs the beam in different directions. apparatus.   16. The apparatus according to claim 15, wherein the diffractive optical element (5) comprises a plurality of diffractive optical sections (6a-6c) that coincide with the predetermined arrangement of the joints.   17. The diffractive optical section (6a-6c) is based on different intensities, different beam cross sections, different beam shapes and / or beam divergences of the part (12a-12c) of the beam. apparatus. Further comprising an optical waveguide (9),
The imaging optical system has an input lens (2) and an output lens (3),
The beam diameter of the beam or part of the beam is determined by the distance (z1) between the input lens and the optical waveguide and / or the distance (z2) between the input lens and the output lens. 18. Apparatus according to any one of claims 13 to 17, which is adjusted by changing.   The apparatus according to claim 18, wherein the diffractive optical element (5) is arranged between the input lens (2) and the output lens (3).   20. Apparatus according to any one of claims 13 to 19, wherein the light source is configured to supply at least one laser beam.

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