JP2008065017A - Method for manufacturing electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electro-optical device by which effects of dust produced upon forming segmentation grooves are decreased and a yield can be improved. <P>SOLUTION: The method includes a step of forming segmentation grooves G1 to G3 in a cover glass substrate 103 on its face opposite to a mother substrate 101 for a device substrate, so that even when a plurality of material substrates (a lens array substrate 102 and the cover glass substrate 103) are laminated to constitute a mother substrate 105 for a counter substrate, the mother substrate 105 for a counter substrate can be reliably segmented. The method also includes a step of forming a dust holding film 112 within the segmentation grooves G1 to G3, so that even when dust produced upon forming the segmentation grooves G1 to G3 remains in the grooves, the dust is not scraped out by a rubbing processing or the like, and therefore, dust such as glass chips are prevented from damaging an alignment layer 112 or from mixing into a liquid crystal in steps after forming the segmentation grooves. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a method for manufacturing an electro-optical device, and more particularly, to a method for manufacturing an electro-optical device that manufactures a plurality of electro-optical devices by dividing an apparatus base material formed by bonding a plurality of substrates.

2. Description of the Related Art Conventionally, liquid crystal devices have been widely used as electro-optical devices in electronic devices such as display monitor devices and projection projector devices. In particular, in a projection type projector device, a liquid crystal device of a TFT (Thin Film Transistor) driving system is often used in order to meet the demand for high definition and large screen display.

In the TFT driving type liquid crystal device, the TFT and the signal wiring are shielded by a light shielding layer. The light shielding layer has a stripe structure or a matrix structure.
The latter matrix-like structure is called a black matrix. Further, in order to realize a high-definition display, if the number of pixels is increased while keeping the size of the liquid crystal device as it is, the aperture ratio decreases, so that a microlens is used to increase the light use efficiency. This is because the light utilization efficiency is improved by condensing the light in the region including the black matrix region by the microlens.

As a method of manufacturing a liquid crystal device including such a microlens, for example, Patent Document 1 discloses a process of bonding a lens wafer and a cover glass wafer with an adhesive so as to form a microlens, and a cover glass. A step of forming a counter electrode film on the wafer, a step of forming a dividing groove in the cover glass wafer and the counter electrode film, a step of forming an alignment film using an ink jet method or a flexographic printing method, a cover glass and a TFT A process of bonding a wafer, a process of dividing a TFT substrate bonded by making a crack along the dividing line, and a lens wafer and a cover glass wafer bonded by putting a crack along the dividing line A technique including a process for performing the above is disclosed.
JP 2005-91643 A

By the way, in the manufacturing method of the electro-optical device including the step of forming the dividing groove as in the technique disclosed in Patent Document 1 described above, fine dust such as glass fragments generated when the dividing groove is formed is divided. There is a risk that it will remain inside and affect subsequent processes. For example, in the manufacture of a liquid crystal device, if dust remains in the dividing groove, the dust may be swept away in the alignment film rubbing process, damaging the alignment film or mixed into the liquid crystal, and the yield may be reduced. is there.

Therefore, in order to prevent the influence of dust such as broken glass and improve the yield of the electro-optical device, it is desirable to completely remove the dust generated when the dividing groove is formed by washing or the like. . However, as described above, the adhesive may be exposed at the bottom or the like in the dividing groove formed in the wafer or the like bonded via the adhesive. If glass fragments or the like sink into the adhesive exposed in the dividing groove in this way, it may be difficult to completely remove dust from the dividing groove even if cleaning or the like is performed.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a method of manufacturing an electro-optical device capable of reducing the influence of dust generated when forming a dividing groove and improving the yield.

The method for manufacturing an electro-optical device according to the present invention includes a first mother substrate forming step of forming a first mother substrate by laminating a plurality of material substrates in layers via an adhesive, and the first mother substrate includes: Forming a dividing groove on at least one of the plurality of material substrates to be configured; applying an organic material to the dividing groove; and forming a second groove on a formation surface of the dividing groove on the first mother substrate. And a step of forming a device base material by bonding the mother substrate and a step of dividing the device base material.

According to such a configuration, even when the first mother substrate has a laminated structure of a plurality of material substrates, the device base material is formed by forming the dividing groove before bonding to the first mother substrate. Can be accurately divided. In addition, by applying an organic material to the dividing groove, even if dust remains in the dividing groove, the dust can be prevented from adversely affecting other processes.

In the method of manufacturing an electro-optical device according to the aspect of the invention, the first mother substrate may include a lens array substrate having a plurality of lens curved surfaces formed on one surface as the material substrate, and the lens array substrate. A cover glass substrate bonded to the one surface via the adhesive;
It is desirable to comprise.

According to such a configuration, a plurality of microlenses can be easily formed in the first mother substrate.

In the method of manufacturing an electro-optical device according to the aspect of the invention, it is preferable that the first mother substrate includes a dust-proof glass substrate on a surface different from a surface on which the dividing grooves are formed as the material substrate.

According to such a configuration, the dust-proof glass can be easily bonded to the electro-optical device.

In the method of manufacturing an electro-optical device according to the aspect of the invention, the dividing groove may be a groove that penetrates at least one material substrate and the bottom reaches the adhesive, and the organic material includes at least the dividing groove. Desirably it is applied to the bottom.

According to such a structure, the adhesive agent which becomes a big factor which makes dust remain in a dividing groove can be coated, and the movement of the remaining dust can be prevented exactly.

The electro-optical device manufacturing method of the present invention is applied to a method of manufacturing an electro-optical device in which liquid crystal is interposed between the first mother substrate and the second mother substrate to form the dividing groove. After the step, the step of forming the first mother substrate by applying an alignment film material to the alignment film for aligning the liquid crystal, the step of applying an organic material to the dividing groove, the alignment film material It is desirable to use it as an organic material in the same step as the step of forming the alignment film.

According to such a configuration, the organic material can be applied to the dividing groove without increasing the number of steps.

In the electro-optical device manufacturing method of the present invention, the coating amount per unit area of the alignment film material to the dividing groove is set to be relatively larger than the coating amount for forming the alignment film. It is desirable.

According to such a configuration, it is possible to realize suitable film formation for the dividing groove that is recessed in the first mother substrate.

In the electro-optical device manufacturing method of the present invention, the alignment film material is preferably applied by a flexographic printing method.

According to such a configuration, even when the film formation conditions are different between the formation of the alignment film and the application of the organic material to the dividing groove, both can be achieved.

In the electro-optical device manufacturing method of the present invention, the alignment film material is preferably applied by an inkjet method.

According to such a configuration, even when the film formation conditions are different between the formation of the alignment film and the application of the organic material to the dividing groove, both can be achieved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings relate to one embodiment of the present invention.
2 is a plan view of the liquid crystal device, FIG. 2 is a cross-sectional view of the liquid crystal device of FIG. 1 cut along the line HH ′, FIG. 3 is a plan view of a mother substrate for element substrates, and FIG. FIG. 5 is a cross-sectional view of the base material of the liquid crystal device taken along line AA ′ in FIGS. 3 and 4, and FIG. 6 is a cross-sectional view along line BB ′ in FIGS.
7 and 8 are diagrams for explaining the state of the substrate in each manufacturing process of the liquid crystal device, and FIG. 9 shows the main part of the mother substrate for the counter substrate and the flexographic plate. 10 is a cross-sectional view, FIG. 10 is a diagram for explaining a modification of the process shown in FIG. 7 (f), FIG. 11 is a flowchart showing the manufacturing process of the liquid crystal device, and FIG. It is principal part sectional drawing of a board | substrate.

As shown in FIG. 1 and FIG. 2, a liquid crystal device such as a liquid crystal panel as an example of an electro-optical device
A liquid crystal 50 is interposed between the element substrate 10 such as a TFT substrate and the counter substrate 20 to constitute a main part. On the element substrate 10, a plurality of transparent pixel electrodes (ITO) 9a constituting pixels are arranged in a matrix. The counter substrate 20 includes a micro lens array (MLA) substrate 70 having a plurality of lens curved surfaces recessed on one surface, and a cover glass 71 is attached to an adhesive 74 on one surface of the MLA substrate 70. It is pasted through. In the present embodiment, a transparent adhesive having a refractive index higher than that of the MLA substrate 70 is used for the adhesive 74, and thus, between the MLA substrate 70 and the cover glass 71, each pixel electrode 9a is provided. A microlens 20a that collects incident light is formed. Further, a black matrix (not shown in FIG. 2) and a counter electrode (ITO) 21 as a light shielding film are provided on the entire surface corresponding to the display area of the cover glass 71.

The element substrate 10 is made of, for example, a quartz substrate, a glass substrate, or a silicon substrate, and the counter substrate 20 is made of, for example, a glass substrate or a quartz substrate. On the element substrate 10, data lines and scanning lines are provided in a grid pattern along the vertical and horizontal boundaries of the counter electrode 9 a. In this embodiment, the data line and the scan line also have a function as a light shielding film, and the data line and the scan line prevent reflected light from entering the channel region, the source region, and the drain region of the TFT. .

On the other hand, the counter substrate 20 is provided with a light shielding film (not shown) in a region facing the data line, the scanning line, and the TFT formation region of the element substrate 10, that is, in the peripheral region of each pixel. The light shielding film prevents incident light from the counter substrate 20 from entering the channel region, the source region, and the drain region of the TFT. On the light shielding film, a counter electrode (common electrode) is formed over the entire surface.

As shown in FIGS. 1 and 2, the counter substrate 20 is provided with a light shielding film 42 as a frame for partitioning the display area. The light shielding film 42 is formed of, for example, the same or different light shielding material as the above-described light shielding film for each pixel.

Further, the surfaces of the element substrate 10 and the counter substrate 20 on which the liquid crystal is sealed (that is, the element substrate 1).
An alignment film made of a polyimide-based polymer resin is laminated on each of the inner surfaces 0 and the counter substrate 20 and is rubbed in a predetermined direction.

In a region outside the light shielding film 42, there is a liquid crystal 50 between the element substrate 10 and the counter substrate 20.
Is formed. In the present embodiment, the seal member 41 is
It arrange | positions so that it may correspond with the outline shape of the opposing board | substrate 20, and the element substrate 10 and the opposing board | substrate 20 are mutually fixed.

Further, a data line driving circuit 61 and a plurality of mounting terminals 62 are provided along one side of the element substrate 10 in a region outside the seal member 41 of the element substrate 10, and 2 adjacent to this one side.
A scanning line driving circuit 63 is provided along each side. On the remaining one side of the element substrate 10, a plurality of wirings 64 are provided for electrically connecting the scanning line driving circuits 63 provided on both sides of the screen display area. In addition, a conductive material 65 for electrically connecting the element substrate 10 and the counter substrate 20 is provided in at least one corner of the counter electrode 21.

In such a liquid crystal device, the liquid crystal 5 sealed between the element substrate 10 and the counter substrate 20 is used.
0 is aligned at a predetermined pretilt angle by the alignment film. When an image signal supplied from the data line is written to the pixel electrode 9a at a predetermined timing, the orientation and order of the molecular assembly of the liquid crystal 50 change according to the potential difference between the written pixel electrode 9a and the counter electrode. Thus, the light is modulated to enable gradation display. That is, if the liquid crystal 50 is in a normally white mode, the transmittance for incident light is reduced according to the voltage applied in units of pixels,
In the normally black mode, the transmittance for incident light is increased according to the voltage applied in units of pixels. As a result, light having a contrast corresponding to the image signal is emitted from the liquid crystal device as a whole.

In the present embodiment, the liquid crystal device includes one large counter substrate mother substrate 105 (see FIG. 4) as a first mother substrate in which a plurality of counter substrates 20 are integrally formed, and a plurality of element substrates. A large-sized element substrate mother substrate 101 (see FIG. 3) as a second mother substrate 10 formed integrally with the substrate 10 is bonded to the liquid crystal device base material 107 through a seal member 41.
(Refer to FIGS. 5 and 6), and the liquid crystal device base material 107 is divided into dividing lines L1, L2, and L3 (FIGS. 3 and 3).
4)).

As shown in FIGS. 5 and 6, in the liquid crystal device base material 107 of this embodiment, the mother substrate 105 for the counter substrate is a lens in which lens curved surfaces corresponding to a plurality of liquid crystal devices are integrally formed on one surface. An array substrate 102 and a cover glass substrate 103 having the same shape in plan view as the lens array substrate 102 are provided as material substrates. The cover glass substrate 103 is bonded to one surface of the lens array substrate 102 via an adhesive 74 and is disposed on the side facing the element substrate mother substrate 101. Further, the cover glass substrate 103 is provided with a black matrix 111, and a counter electrode 21 and an alignment film 112 are laminated.

Further, as described later, the cover glass substrate 103 and the counter electrode 21 of the counter substrate mother substrate 105 are respectively connected to the dividing lines L1, L2, and L3 in the step before being bonded to the element substrate mother substrate 101. Corresponding dividing grooves G1, G2, G3 are formed by dicing, for example. In each of the dividing grooves G1, G2, and G3, for example, a dust holding film 112a that is the same layer as the alignment film 112 is formed. By forming the dust holding film 112a in this way, even when dust such as glass fragments generated during dicing remains in the dividing grooves G1 to G3, the dust is not scattered and is divided. It is held in the grooves G1 to G3.
In addition, after the element substrate mother substrate 101 and the counter substrate mother substrate 105 are bonded together, the element substrate mother substrate 101 is formed with scribe grooves G4 and G5 corresponding to the dividing lines L1 and L2, respectively. The lens array substrate 102 of the substrate mother substrate 105 is formed with scribe grooves G6, G7, G8 corresponding to the dividing lines L1, L2, L3, respectively.

Next, the process for manufacturing the above-described liquid crystal device will be described in detail according to the flowchart shown in FIG. Note that the flowchart shown in FIG. 11 particularly describes the manufacturing process of the counter substrate mother substrate 105 in detail. Here, in the present embodiment, the counter substrate 2
An annular seal member 41 that substantially matches the contour shape of 0 is formed, the liquid crystal 50 is dropped inside the seal member 41 at the time of manufacture, and the element substrate 10 and the counter substrate 20 are bonded together to form the liquid crystal 5.
As an example of a manufacturing method of a liquid crystal device of a drop bonding method in which 0 is enclosed, a sealing member 4
1 is removed at a part of one side of the element substrate 10, and a liquid crystal injection port for injecting the liquid crystal 50 is formed in the gap between the bonded element substrate 10 and the counter substrate 20. After injecting the liquid crystal, a method for manufacturing a liquid crystal device of a sealing port method in which the liquid crystal injection port is sealed with a sealing material may be used.

As shown in FIG. 11, in this manufacturing method, first, in step S1, a lens array substrate 102 and a cover glass substrate 103 are bonded together to form a counter substrate mother substrate 105 (first mother substrate). Forming step). That is, in the step S1, for example, as shown in FIG. 7A, first, the lens array substrate 102 that becomes the MLA substrate 70 of each liquid crystal device and the cover glass that becomes the cover glass 71 of each liquid crystal device. Substrate 10
3 is prepared. The thickness of the lens array substrate 102 is, for example, 1.2 mm, and the thickness of the cover glass substrate 103 is, for example, 1.2 mm.

FIG. 7A shows only a cross section in the direction of the line BB ′ in FIG.
A cross-sectional view in the line direction is omitted. Hereinafter, FIGS. 7B to 7F and FIGS. 8G to 8I.
The same applies to.

Further, in the step S1, for example, as shown in FIG. 7B, the lens array substrate 102 and the cover glass substrate 103 are bonded to each other while being aligned with an ultraviolet curable resin or the like having a high refractive index. Bonding is performed via the agent 74. The thickness of the adhesive 74 is, for example, 10 μm
m. Then, after the lens array substrate 102 and the cover glass substrate 103 are bonded together, the surface of the cover glass substrate 103 opposite to the surface facing the lens array substrate 102 is ground, whereby FIG. As shown in c), the thickness of the cover glass substrate 103 is processed to 30 μm, for example.

In the subsequent step S2, the lens array substrate 102 of the cover glass substrate 103 is used.
A black matrix 111 having a thickness of 100 nm (1000 angstroms), that is, a light shielding film is formed on the surface opposite to the surface opposite to the surface by, for example, sputtering (see FIG. 7D). The black matrix 111 is, for example, Cr, Al, Al alloy, Ni,
It is formed by forming a photoresist on a film formed using a resin material in which a metal such as Zn or Ti, carbon, titanium, or the like is dispersed, and performing an etching process.

In the subsequent step S3, the counter electrode 21, that is, the counter electrode film is formed on the upper layer of the black matrix 111 (see FIG. 7D). The counter electrode 21 is, for example, about 100 nm (1000 angstroms) of a transparent conductive material such as ITO by sputtering or the like.
It is formed by depositing to a thickness of.

In the subsequent step S4, for example, the cover glass substrate 10 is obtained by dicing or the like.
3 and the dividing grooves G1, G2 for full-cutting the counter electrode 21 along the dividing lines L1, L2, L3
, G3 (see FIG. 7E). At this time, the adhesive 74 is exposed in the dividing grooves G1, G2, and G3. However, since the black matrix 111 and the counter electrode 21 are already formed, there is no problem of contamination due to the adhesive component.

In the subsequent step S5, for example, by applying a polyimide organic material using a film forming method capable of predetermined patterning, 50 to 100 nm (500 to 10 nm).
An alignment film 112 having a thickness of 00 angstroms is stacked on the upper layer of the counter electrode 21 (see FIG. 7F). In this embodiment, for example, a droplet discharge method (that is, an ink jet method) or a flexographic printing method is suitably used as a method for forming the alignment film 112, and the alignment film 112 is formed in a region surrounded by the dividing grooves G1 and G2. It is formed. In the step of forming the alignment film 112, the organic material is also applied to the dividing grooves G1, G2, G3, and the dividing grooves G1,
A dust holding film 112a in the same layer as the alignment film 112 is formed on G2 and G3.

Here, in order to realize suitable film formation in each of the recessed grooves G1, G2, and G3, the coating amount per unit area of the organic material for each of the divided grooves G1, G2, and G3 is the orientation. It is desirable that the amount is set relatively larger than the amount applied to the film forming region. For example, in the case of adopting an ink jet method, the organic material is applied by setting the discharge amount of the organic material droplets to the dividing grooves G1, G2, and G3 to be relatively larger than the alignment film forming region. Realized. For example, when the flexographic printing method is adopted, as shown in FIG. 9, the volume of the ink reservoir 200b on the flexographic plate 200 facing the dividing grooves G1, G2, G3 is set to the ink facing the alignment film forming region. This is realized by setting the volume relatively larger than the volume of the pool 200a.

The applied organic material can be cured by, for example, using a method of standing drying, vacuum drying, heat drying, UV curing with UV light, or any one method alone. In order to secure a sufficient time for the organic material to diffuse into the divided grooves G1, G2, and G3, it is particularly desirable to employ standing drying. Also, the dividing grooves G1, G2, G3
Considering that the adhesive 74 exposed inside greatly affects the dust residue, the dust holding film 112a in the present embodiment may be formed at least at the bottom of each of the dividing grooves G1, G2, G3. .

By the way, in the process of step S5, the formation of the alignment film 112 and the formation of the dust holding film 112a can be performed in separate processes. That is, for example, after forming the alignment film 112 using an inkjet method or a flexographic printing method (see FIG. 10 (f ′)), the dust holding film 112a is formed using a dispensing method or the like (FIG. 10 (f ″)). In this case, as the organic material for forming the dust holding film 112a, the alignment film 11 is used.
It is desirable to use the same material as 2, but it is also possible to use an organic material having an acrylic or epoxy adhesive force that is different from the alignment film 112.

In the subsequent step S6, for example, the alignment film 11 is formed using a rubbing roll (not shown).
2 is rubbed. At that time, the ends of the rubbing cloth are separated by the dividing grooves G1, G2, and so on.
Although it penetrates into G3, the dividing grooves G1, G2, G3 are coated with the dust holding film 112a, so even if dust generated during dicing or the like remains in the groove, the dust is It is accurately held by the dust holding film 112a and is not swept out of the groove.

In the subsequent step S7, the element substrate mother substrate 101 to be the element substrate (TFT substrate) 10 and the counter substrate mother substrate 105 are bonded together via the seal member 41 (see FIG. 6).
(Refer FIG.8 (g)). That is, an annular seal member 41 corresponding to each liquid crystal device is formed on one of the opposing surfaces of the element substrate mother substrate 101 and the counter substrate mother substrate 105, and the liquid crystal 50 is dropped inside the seal member 41. After that, the surface on which the dividing grooves G1, G2, and G3 of the counter substrate mother substrate 105 are formed is bonded to the element substrate mother substrate 101 while being positioned.

In the subsequent step S8, first, as shown in FIG. 8 (h), scribe grooves G4, G5 are formed on the outer surface of the element substrate mother substrate 101, and at positions corresponding to the scribe grooves G4, G5, The break bars are sequentially pressed from the counter substrate mother substrate 105 side. Thereby, the mother substrate 101 for element substrates is divided into substrates (element substrates 10) for each liquid crystal device.

Further, in step S8, as shown in FIG. 8I, the counter substrate mother substrate 1 is formed.
On the outer surface of 05, scribe grooves G6, G7, G8 are formed, and the scribe grooves G6, G7,
The break bar is sequentially pressed from the element substrate mother substrate 101 side at a position corresponding to G8. As a result, the counter substrate mother substrate 105 is divided into substrates (counter substrates 20) for each liquid crystal device. Thereby, each liquid crystal device integrally formed as the liquid crystal device base material 107 is made into a single product.

In such an embodiment, a plurality of material substrates (the lens array substrate 102 and the cover glass are formed by forming the dividing grooves G1 to G3 in the cover glass substrate 103 from the side facing the element substrate mother substrate 101. Mother substrate 1 for the opposite substrate by bonding the substrate 103)
Even when 05 is configured, the counter substrate mother substrate 105 can be reliably divided.
Further, by forming the dust retaining film 112a in the dividing grooves G1 to G3, the dividing grooves G1 to G3 are formed.
Even when dust generated when forming the film 3 remains in the groove, the dust is not swept away by rubbing or the like, and dust such as glass fragments is deposited in the alignment film 112 in the step after the dividing groove is formed. The yield reduction of the liquid crystal device caused by damage to the liquid crystal or mixing in the liquid crystal can be accurately suppressed.

Here, the number of material substrates bonded as the counter substrate mother substrate 105 is not limited to two, and may be three or more. As an example in which the three material substrates are bonded together, the dust-proof glass substrate 210, the lens array substrate 102, and the cover glass substrate 103 are sequentially stacked and bonded to each other in FIG. The counter substrate mother substrate 105 is shown. In the counter substrate mother substrate 105, for example, dividing grooves G <b> 1 to G <b> 3 are formed for two material substrates positioned on the element substrate mother substrate 101 side. That is, each of the dividing grooves G1 to G3 includes, for example, a cover glass substrate 103, an adhesive 74,
And a groove that penetrates the lens array substrate 102 and reaches the adhesive 211. In this case, since the adhesive 211 is exposed also on the side walls of the dividing grooves G1 to G3, the dividing grooves G1 to G3 are exposed.
It is important that the dust holding film 112a is accurately formed not only on the bottom but also on the side wall.

Note that the liquid crystal device described in the above embodiment as an example of the electro-optical device is not limited to the illustrated example, and various changes can be made without departing from the scope of the present invention. is there. For example, the above-described liquid crystal device has been described by taking an active matrix type liquid crystal display module using an active element (active element) such as a TFT (thin film transistor) as an example. An active matrix type liquid crystal display module using the active element (active element) may be used.

The present invention also provides a display device for forming an element on a semiconductor substrate, such as an LCOS (Liqu
id Crystal On Silicon). In LCOS, a single crystal silicon substrate is used as an element substrate, and a transistor is formed on a single crystal silicon substrate as a switching element used for a pixel or a peripheral circuit. In addition, a reflective pixel electrode is used for the pixel, and each element of the pixel is formed under the pixel electrode.

Plan view of liquid crystal device Sectional drawing when the liquid crystal device of FIG. 1 is cut along the line H-H ′. Plan view of mother substrate for element substrate Plan view of mother substrate for counter substrate Sectional drawing of the base material of the liquid crystal device along the line A-A 'in FIGS. Sectional drawing of the base material of the liquid crystal device along the line B-B 'in FIGS. The figure for demonstrating the state of the board | substrate in each manufacturing process of a liquid crystal device The figure for demonstrating the state of the board | substrate in each manufacturing process of a liquid crystal device Sectional view showing the main parts of the mother substrate for the counter substrate and the flexographic plate The figure for demonstrating the modification of the process shown in FIG.7 (f). Flow chart showing manufacturing process of liquid crystal device Cross-sectional view of the main part of the mother substrate for the counter substrate with a dust-proof glass substrate attached

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Element substrate, 20 ... Counter substrate, 20a ... Micro lens, 21 ... Counter electrode, 50 ...
Liquid crystal, 70 ... micro lens array substrate, 71 ... cover glass, 74, 211 ... adhesive,
DESCRIPTION OF SYMBOLS 101 ... Mother board | substrate for element substrates (2nd mother board | substrate), 102 ... Substrate for lens arrays (material board | substrate), 103 ... Substrate for cover glass (material board | substrate), 105 ... Mother board | substrate for counter substrates (
First mother substrate), 107 ... Liquid crystal device base material (device base material), 112a ... Dust holding film, 11
2 ... Alignment film, 200 ... Flexographic plate, 210 ... Dust-proof glass substrate (material substrate), G1, G2
, G3 ... Dividing groove

Claims (8)

A first mother substrate is formed by laminating a plurality of material substrates in layers via an adhesive.
Mother board formation process,
Forming a dividing groove in at least one of the plurality of material substrates constituting the first mother substrate;
Applying an organic material to the dividing groove;
Forming a device base material by bonding a second mother substrate to the formation surface of the dividing groove in the first mother substrate;
Dividing the device base material;
An electro-optical device manufacturing method comprising: The first mother substrate is bonded as a material substrate to a lens array substrate having a plurality of lens curved surfaces formed on one surface, and the one surface of the lens array substrate via the adhesive. The method for manufacturing an electro-optical device according to claim 1, further comprising: a cover glass substrate. 3. The electro-optical device according to claim 1, wherein the first mother substrate includes a dust-proof glass substrate on a surface different from a surface on which the dividing groove is formed as the material substrate. Production method. The dividing groove is a groove that penetrates at least one of the material substrates and reaches a bottom portion of the adhesive,
The organic material is applied to at least a bottom portion of the dividing groove.
The method of manufacturing an electro-optical device according to claim 1. Applied to a method of manufacturing an electro-optical device in which a liquid crystal is interposed between the first mother substrate and the second mother substrate;
After the step of forming the dividing groove, the step of forming the first mother substrate by applying an alignment film material to the alignment film for aligning the liquid crystal,
The step of applying an organic material to the dividing groove uses the alignment film material as the organic material,
The method of manufacturing an electro-optical device according to claim 1, wherein the method is performed in the same step as the step of forming the alignment film. 6. The electro-optical device according to claim 5, wherein a coating amount per unit area of the alignment film material to the dividing groove is set to be relatively larger than a coating amount for forming the alignment film. Manufacturing method. The method of manufacturing an electro-optical device according to claim 5, wherein the alignment film material is applied by a flexographic printing method. 6. The alignment film material is applied by an inkjet method.
Alternatively, a method of manufacturing the electro-optical device according to claim 6.

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