JP2008062486A - Molding stamper and molding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding stamper which can adjust the temperature of each region of a surface part on the molding side and a molding apparatus. <P>SOLUTION: As regards the molding stamper 10F, the main surface part 21 of a substrate 19 is rugged to mold a molding material 12 with a channel 101 engraved in the substrate 19. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a molding stamper for molding a molded body such as a thermoplastic resin and a molding apparatus including the molding stamper.

  In recent years, in the technical fields of science and biotechnology, microchemical systems in which chemical reaction systems, biochemical reaction systems, and sample analysis systems have been miniaturized have been studied. In this microchemical system, for example, a chemical reaction is caused in a microchannel finely processed as compared with a conventional system, or a sample is analyzed. As a result, the reaction area per unit area of the sample can be increased, and the time for completing the reaction of the sample can be greatly reduced. In addition, the flow rate of the fluid flowing in the microchannel can be precisely controlled, and chemical reaction and sample analysis can be performed efficiently. The chemical reaction and sample analysis in such a microchemical system are performed in a chip called a microchemical chip in which a microchannel, a micropump, and a microreactor are formed.

  In order to spread such high-precision and fine microchemical chips for consumer use, a manufacturing apparatus capable of mass-producing microchemical chips has been developed to reduce the cost of microchemical chips associated with mass production. As a technology for mass production, for example, a molding method using a stamper to transfer a structure such as a projection of several tens to several hundreds of μm on a molded object such as resin and glass, and forming a microchannel is attempted. It has been.

  FIG. 29 is a front cross-sectional view showing a conventional molding apparatus 1. The molding apparatus 1 is an apparatus for transfer-molding a micro flow path on a molding target 3 using a stamper 2 by a hot embossing method. The molding apparatus 1 includes a stamper 2, a pressing unit 4 that presses the stamper 2 against the molding target 3, and a heating unit 5 that heats the stamper 2. The heating means 5 is composed of a single heating resistor that generates heat when a voltage is applied. For the mold such as the stamper 2, a silicon substrate whose surface is processed into a desired shape by using a photolithography technique is used. The stamper 2 is provided on the base 6 of the pressing means 4. When the photosensitive resin such as PMMA (polymethyl methacrylate) is used for the resist, glass or the like is used for the molded body 3.

JP 2004-288845 A JP 2004-71587 A JP 2004-160647 A

  The hot embossing method using the conventional molding apparatus 1 is performed by pressing the heated stamper 2 against the object to be molded with high pressure. When the molded body 3 is molded by the stamper 2, the stamper 2 has a desired temperature according to the molding status of the molded body, and the temperature of the stamper 2 is set to the desired temperature by controlling the heating means 5. Is retained. Although the temperature of the stamper 2 is controlled in this way, the temperature of the stamper 2 changes every moment according to the environment and the molding state, and may be heated by the heating means 5 to a desired temperature or higher. . If the molded body 3 is molded by the stamper 2 heated to a desired temperature or higher, a finished product with high processing accuracy cannot be obtained. The stamper 2 heated to a desired temperature or higher is naturally cooled to lower the temperature to a desired temperature. Since the temperature is lowered by natural cooling in this way, it takes time to cool the workpiece when it is processed.

  Further, when molding such a molded body, the stamper 2 has the lowest temperature (hereinafter referred to as “initial temperature”) before being pressed against the molded body, and the temperature at which molding is completed (hereinafter referred to as “ "Completion temperature") is the highest. Therefore, when continuously molding the object to be molded, after the molding is completed, the stamper 2 is allowed to stand for a certain period in order to mold the next stamper 2 and is naturally cooled from the completion temperature to the initial temperature. In such natural cooling, it takes time for cooling, and the time for the stamper 2 to fall to the initial temperature is long. Therefore, when manufacturing a to-be-molded body continuously, the interval at which the fabrication of the to-be-molded body is started becomes long, and the production amount per unit time is small.

  An object of the present invention is to provide a molding stamper and a molding apparatus capable of shortening the cooling time.

The present invention has a substrate on which the surface portion on the side for molding the molded body is formed in an uneven shape,
The molding stamper is characterized in that a flow path portion through which a coolant flows is formed inside the substrate.

  Further, the invention is characterized in that the convex portion of the surface portion is formed in a strip shape, and at least a part of the flow path is formed along the convex portion.

The present invention also includes the molding stamper and pressing means for pressing the object to be molded with the molding stamper.
Heating means for heating the molding stamper;
Temperature detecting means for detecting the temperature of the molding stamper;
A molding apparatus comprising: a flow rate control unit that controls a flow rate of the refrigerant according to a temperature detected by the temperature detection unit.

  According to the present invention, the flow path is formed inside the base body for molding the object to be molded. The base can be cooled by flowing a coolant through the flow path. By cooling the heated substrate, the substrate can be lowered to a desired temperature in a short period of time. As a result, the time required for continuously molding a plurality of molded objects can be shortened as compared with the conventional technique. Therefore, compared with the prior art, the number of molded articles per unit time, that is, the number of manufactured finished products can be increased.

  According to the present invention, at least a part of the flow path is formed along the convex portion formed in a band shape. Thereby, since the flow path used as the cooling mechanism is formed along the convex portion, the convex portion can be efficiently cooled. Thus, since a convex-shaped part can be cooled efficiently, the time when shape | molding a some to-be-molded body continuously can be further shortened.

  According to the present invention, power is supplied to the heating resistor by the power supply means, and the molding stamper is pressed against the molded body by the pressing means in a state where the temperature of the substrate is raised, thereby forming the molded body. can do.

  Hereinafter, a plurality of embodiments for carrying out the present invention will be described with reference to the drawings. Portions corresponding to the matters described in the preceding forms in each embodiment are denoted by the same reference numerals, and overlapping description may be omitted. When only a part of the configuration is described, the other parts of the configuration are the same as those described in the preceding section. In addition to the combination of parts specifically described in each embodiment, the embodiments may be partially combined as long as the combination is not particularly troublesome.

  FIG. 1 is a front sectional view showing a molding apparatus 11 including a molding stamper 10 according to a first embodiment. FIG. 2 is a perspective view showing the molding stamper 10. FIG. 3 is a cross-sectional view showing the molding stamper 10 as viewed by cutting along the cutting plane line III-III in FIG. 2. FIG. 4 is a cross-sectional view showing the molding stamper 10 viewed along the cutting plane line IV-IV in FIG. The molding apparatus 11 includes a molding stamper 10 and is a mold for molding the surface portion of the molding target 3 by pressing the molding stamper 10 against the molding target 12. In the present embodiment, the molding apparatus 11 is an apparatus capable of molding a microstructure on the surface portion of the molded body 3 by a nanoprinting method, and the microstructure is formed by pressing the molding stamper 10 against the molded body 3. For example, an apparatus for forming a microchemical chip. However, the molding device 11 is not limited to a device that can be molded by the nanoimprint method, and may be any device that presses the molding stamper 10 and molds the molded body 3. For example, an apparatus for molding a master of a stamp and a stamper may be used. The molding apparatus 11 includes a stage 13, a press unit 14, a molding stamper 10, a temperature control unit 15, and a housing 16. The stage 13, the press means 14, the molding stamper 10, and the temperature control means 15 are disposed in the housing 16.

  The stage 13 is a table for placing the molded body 12 that is the molded body. The stage 13 is a flat plate, is made of, for example, SUS403, has a mechanism for holding the molded body 12 and is configured to be relatively displaceable with respect to the stamper 10, and precisely controls the position of the molded body 12. I can do it. The molded body 12 is made of, for example, a thermoplastic resin, a thermosetting resin, or a mixed material obtained by mixing these materials. Specifically, it is acrylic resin or glass.

  The pressing means 14 that is a pressing means includes a press driving unit 17 and a base 18. The press drive unit 17 is provided in the housing 16. The press drive unit 17 is provided with a base 18 and is configured to drive the base 18 in a vertical direction Z (hereinafter sometimes referred to as “Z direction”). The base 18 is made of, for example, SUS403, and is configured so that the molding stamper 10 can be attached thereto.

  The molding stamper 10 includes a base 19 and a heating resistor 20. The substrate 19 is made of ceramic, which is alumina (Al 2 O 3) in the present embodiment, and is generally formed in a rectangular parallelepiped shape, and is formed in an uneven shape on the main surface portion 21 thereof. Specifically, the base body 19 has one or a plurality of convex portions 24 formed on the surface portion 23 of the base body 22. In the present embodiment, 4 extends in a second direction A2 (hereinafter also referred to as “A2 direction”) perpendicular to a first direction A1 (hereinafter also referred to as “A1 direction”), which is the thickness direction of the substrate. Two convex portions 24 are formed at equal intervals. However, the convex portion 24 is not limited to such a shape, and the shape thereof is changed according to the concave portion to be formed in the molded body 12, and may be a protrusion instead of the convex shape. The base 19 is mounted on the base 18 of the press means 14 so that the A1 direction and the Z direction coincide. A heating resistor 20 is formed inside the base body 19.

  The heating resistor 20 is a high-resistance resistor made of, for example, a mixed material of tungsten and ceramic, and is a resistor that generates heat when a current flows. In the present embodiment, the heating resistor 20 meanders in a continuous pulse wave shape from one end portion to the other end portion in the third direction A3 (hereinafter sometimes referred to as “A3 direction”) of the base body 19. It is arranged. The A3 direction is a direction perpendicular to the A1 direction and the A2 direction. However, the heating resistor 20 is not limited to the one arranged in such a shape. The one end portion 20a and the other end portion 20b of the heating resistor 20 arranged in this manner are provided on the side surface portion 26 of the base 19 from the respective end portions 20a and 20b, specifically, a surface portion perpendicular to the main surface portion 21. A power supply wiring 25 extending to 26 is formed. The power supply wiring 25, which is a power supply wiring, is made of a conductive material such as tungsten metallization, is electrically connected to the heating resistor 20, and is exposed outward at the side surface portion 26. Specifically, the power supply wiring 25 has a cut-off portion 25a and a horizontal portion 25b. The vertical portion 25a is formed so as to rise in the A1 direction from the end portions 20a and 20b of the heating resistor 20. The horizontal portion 25b is formed from the end portion of the vertical portion 25a toward the side surface portion 26 of the base body 19. In the embodiment, it is formed so as to extend in the A2 direction, and its end portion is exposed outward from the side surface portion 26.

  A power supply wiring 38 made of a conductive material is provided on the base 18 of the pressing means 14. In the present embodiment, the power supply wiring 38 is disposed outside the base 18. The power supply wiring 38 is electrically connected to the horizontal portion 25 b of each power supply wiring 25 of the molding stamper 10 with the base 19 of the molding stamper 10 mounted on the base 18. Further, the wiring 38 is electrically connected to the temperature control means 15.

  The temperature control means 15, which is a temperature detection means and a power supply means, is electrically connected to the wiring 38 and is electrically connected to a power source (not shown). The temperature control means 15 has a function of detecting the temperature of the molding stamper 10, controlling the voltage applied to the heating resistor 20 according to the detection result, and controlling the temperature of the molding stamper 10. Specifically, the temperature control means 15 calculates the temperature of the heating resistor 20 using the TCR resistance temperature characteristics of the heating resistor 20 because the heating resistor 20 is made of a mixed material of tungsten and ceramic. Based on the calculation result, the voltage applied to the heating resistor 20 is controlled to control the temperature of the molding stamper 10.

  In the stage 13, the processed surface portion 40, which is the surface portion to be molded of the mounted workpiece 12, is perpendicular to the direction in which the pressing means 14 drives the molding stamper 10, in this embodiment, the Z direction. Thus, the mounting surface part which mounts the to-be-molded body 12 is formed.

  5A, 5B, and 5C are diagrams illustrating a procedure for forming the molding stamper 10. FIG. Hereinafter, a method of forming the molding stamper 10 configured as described above will be described. The molding stamper 10 is formed by laminating first to third layered bodies 27, 28, and 29 and sintering the laminated body 30 while applying a large pressure. In the present embodiment, the case of the three layered bodies 27, 28, and 29 will be described. However, the molding stamper 10 may be formed by laminating and laminating a plurality of layered bodies. Hereinafter, a specific method for manufacturing the molding stamper 10 will be described.

  First, a process of forming the first layered body 27 will be described. A conductive paste is adhered on a sheet 32 made of polyethylene terephthalate (PET) to form the heating resistor 20 (see FIG. 5A (a)). Specifically, a conductive paste is adhered on the sheet 32 by a screen printing method or the like to form the heating resistor 20 having a continuous pulse wave shape. The conductor paste includes a conductor material, an organic binder, and an organic solvent. For example, tungsten (W) is used as the conductor material, acrylic resin, ethyl cellulose, methyl cellulose, or the like is used as the organic binder, and terpineol, dibutyl phthalate (DBP) is used as the organic solvent. It is done. However, it is not limited to such materials.

  A ceramic slurry in which ceramic powder, an organic binder, a solvent, and the like are mixed is applied onto the sheet 32 to form a ceramic green sheet (hereinafter sometimes referred to as “green sheet”) 31 (see FIG. 5A (b)). For example, Al 2 O 3 is used for the ceramic powder, acrylic resin, ethyl cellulose, methyl cellulose, or the like is used for the organic binder, and terpineol, dibutyl phthalate (DBP), or the like is used for the solvent. As a method of forming the green sheet 31 by applying the ceramic slurry to the sheet 32, for example, a die coater method in which a predetermined amount of ceramic slurry is supplied and a supply portion or an application surface is moved to apply a certain thickness, or A doctor blade method or the like is used in which a certain amount of ceramic slurry is supplied, excess ceramic slurry is removed with a blade, and coating is performed with a constant thickness. The thickness d1 of the green sheet 31 is formed to be thicker than the thickness d2 of the heating resistor 20.

  A through hole 33 for arranging the cut-off portion 25a of the power supply wiring 25 is formed (see FIG. 5A (c)). The through hole 33 penetrates in the thickness direction of the green sheet 31 and is formed so that both end portions 20 a and 20 b of the heating resistor 20 are exposed to the through hole 33. The through hole 33 is formed by performing punching processing or laser processing. After forming the through-hole 33, the through-hole 33 is filled with a conductor paste that is a precursor of the cut-off portion 25a of the power supply wiring 25 by a screen printing method or the like. In this way, the first layered body 27 is formed on the sheet 31 (see FIG. 5A (d)).

  Next, the process of forming the second layered body 28 will be described. An organic material is deposited on a sheet 34 made of PET to form an organic green sheet 35 (see FIG. 5E). Specifically, an organic material is attached on the sheet 32 by screen printing or the like, and a plurality of organic green sheets 35 extending in one direction are formed at equal intervals in a direction perpendicular to the one direction. An acrylic resin or the like is used as the organic material, and terpineol, dibutyl phthalate (DBP), or the like is used as the organic solvent. However, it is not limited to such materials.

  A ceramic slurry mixed with ceramic powder, an organic binder, a solvent, and the like is applied onto the sheet 34 to form a green sheet 36. As a method of forming a green sheet 36 by applying a ceramic slurry to the sheet 34, for example, a die coater method in which a required amount of ceramic slurry is supplied, and a constant thickness is applied by moving a supply unit or an application surface, Alternatively, a doctor blade method or the like in which a certain amount of ceramic slurry is supplied, excess ceramic slurry is removed using a blade, and coating with a certain thickness is applied. The thickness d3 of the green sheet 36 is formed to be thicker than the thickness d4 of the organic green sheet 35. In this way, the second layered body 28 is formed on the sheet 34 (see FIG. 5B (f)).

  Next, the process of forming the third layered body 29 will be described. A conductor paste is adhered on the sheet 36 made of PET to form the horizontal portion 25b of the power supply wiring 25 (see FIG. 5B (g)). Specifically, the horizontal portion 25b of the two power supply wirings 25 extending in one direction is formed by attaching a conductive paste on the sheet 36 by a screen printing method or the like. Further, a ceramic slurry is applied on the sheet 36 to form a green sheet 39. The thickness d5 of the green sheet 39 is formed to be thicker than the thickness d6 of the horizontal portion 25b of the power supply wiring 25. Further, the end exposed to the outside of the horizontal portion 25b is plated with nickel (Ni) or gold (Au) to prevent corrosion, and an external terminal electrically connected to the wiring 38 is formed. . In this way, the third layered body 29 is formed on the sheet 36 (see FIG. 5B (h)).

  Next, a process of sintering the laminated body 30 to form the molding stamper 10 will be described. The first layered body 27, the second layered body 28, and the third layered body 29 are stacked to form a stacked body 30. When the laminated body 30 is configured, the first and second layered bodies 27 and 28 are laminated so that the heating resistor 20 is formed inside the laminated body 30 and the organic green sheet 35 is exposed to the outside. The third layered body is stacked on the first layered body 28 so that each cut-off portion 25a of the wiring 25 is electrically connected to each horizontal portion 25b. Specifically, the second, first, and third layered bodies 28, 27, and 29 are laminated in this order, and the heating resistor 20 faces the surface portion opposite to the surface portion on which the organic green sheet 35 is formed. The horizontal portion 25b of the power supply wiring 25 is disposed so as to face the surface portion opposite to the side where the heating resistor 20 is formed. The laminated body 30 thus formed is pressed by the pressing device 37 so as to be sandwiched in the direction in which the first and second layered bodies 28 and 29 are laminated (see FIG. 5C (i)). After pressing, the laminate 30 is sintered. At this time, when the temperature reaches the binder removal region, the organic green sheet 35 burns, and the surface portion of the laminate 30 is formed in an uneven shape. When the temperature further rises, the temperature reaches the sintering temperature region, the laminated body 30 is baked, and the molding stamper 10 is formed (FIG. 5C (j)). By sintering in this way, it is possible to form the molding stamper 10 in which the main surface portion 21 is formed in an uneven shape.

  FIG. 6 is a diagram showing a procedure for molding the molded body 12 using the molding apparatus 11. FIG. 6 illustrates only the molding stamper 10 in the molding apparatus 11, and illustrations of components other than the molding stamper 10 are omitted. Below, the shaping | molding method which shape | molds the to-be-molded body 12 using the shaping | molding apparatus 11 is demonstrated, referring FIG. The molded body 12 is placed on the stage 13, a voltage is applied to the heating resistor 20 by the temperature control means 15, and the base 19 of the molding stamper 20 is heated (see FIG. 6A). When heated and reaches a predetermined temperature, the pressing means 14 lowers the molding stamper 20 in one direction in the Z direction, and the convex portion 24 of the molding stamper 20 is brought into contact with the processing surface portion 40 of the molded body 12.

  By pressing means 14, the molding stamper 20 is further lowered from the contact state, and the molding object 12 is pressed against the molding stamper 10. At this time, the temperature control means 15 controls the temperature of the base 19 of the molding stamper 10 according to the lowered position of the molding stamper 10, that is, according to the molding situation. The temperature control means 15 controls the temperature of the base 19 to increase as the molding stamper 10 moves down, for example. Further, when the molding stamper 10 is lowered to a predetermined molding position, for example, when the surface portion 23 of the base body 22 is lowered to a position where the processed surface portion 40 of the molded body 12 is reached, the pressing means 14 causes the molding stamper 10 to move. The descent is stopped (see the two-dot chain line in FIG. 1 and FIG. 6B). The temperature control is performed using the TCR characteristic of the heating resistor 20. That is, the temperature is controlled by continuously measuring the resistance value of the heating resistor and controlling the current value (or voltage value) to an appropriate value according to the resistance value. When the molding stamper 10 is lowered to the molding position in this way, the concave portion 41 is formed in the portion of the molded body 12 where the convex portion 24 of the molding stamper 10 is pressed, and the convex portion 42 is formed in the remaining portion. The Thus, the to-be-molded body 12 is shape | molded and a molded article is formed.

  Thereafter, the pressing means 14 raises the molding stamper 10 to a predetermined position, for example, an initial position (see FIG. 6C). At this time, the temperature control means 15 stops the voltage application to the heating resistor 20 and stops the heat generation of the heating resistor 20. When the next object to be molded 12 is formed, voltage is again applied to the heating resistor 20 to cause the heating resistor 20 to generate heat, and the molding stamper 10 is lowered to perform molding.

  Below, the effect which the molding stamper 10 comprised in this way and the shaping | molding apparatus 11 show | play is demonstrated. According to the molding stamper 10 of the present embodiment, since the heating resistor 20 is disposed on the base 19, the base 19 is directly heated. Since the base 19 is directly heated, the heat transmitted to the configuration other than the base 19, for example, the press drive unit 17 and the base 18 can be suppressed, and the heat loss can be reduced. Further, since the base body 19 is directly heated, the heat loss is small without providing heat insulation means for preventing heat from escaping to the outside. Therefore, there is no need to provide heat insulation means, the number of parts can be reduced, and the configuration can be simplified. Further, since the heating resistor 20 as a heat source is provided on the base body 19, the heat source is close to the molded body 12, and the main surface portion 21 of the base body 19 forms the molded body 12 with a current smaller than that of the conventional molding apparatus 1. To reach the required temperature. Further, since the base 19 is directly heated, thermal expansion of the base 18 and the like is suppressed, and more precise processing is possible.

  According to the molding stamper 10 of the present embodiment, since the heating resistor 20 is disposed inside the base body 19, the heating resistor 20 does not directly contact the molded body 12. As a result, the heating resistor 20 can be prevented from being damaged, and the heating resistor 20 can be prevented from being disconnected and the molding stamper 10 from becoming unusable. Furthermore, since the heating resistor 20 is not exposed to the outside, corrosion of the heating resistor 20 can be prevented. By disposing the heating resistor 20 in the base 19 as described above, the heating resistor 20 can be protected in terms of damage and corrosion.

  According to the molding apparatus 11 of the present embodiment, the base 19 is made of ceramic. Thereby, the integrity with the heating resistor 20 can be enhanced. Further, since the base 19 is made of ceramic, the molding stamper 10 having high wear resistance, corrosion resistance, and heat resistance, hardly damaged or corroded, suppressed by heat, and highly convenient can be realized. Thus, the base body 19 is not damaged even if the molding is repeatedly performed by the molding stamper 10, and the base body 19 is not damaged due to thermal stress or the like even if the base body 19 is repeatedly heated and cooled. . Further, since the molding stamper 10 is formed of ceramic, the base 19 is not chipped even if the molding stamper 10 is formed in direct contact with the molding stamper 10 as in this embodiment, and the molding stamper 10 is repeatedly used. be able to. By being composed of ceramic, it is possible to withstand repeated thermal stress even when the molded body 12 made of a material that must be molded at a high temperature such as glass can be repeatedly formed, and a good stamper is formed. Is done.

  According to the molding stamper 10 of the present embodiment, the base body 19 and the heating resistor 20 are integrally sintered, so that the base body 19 and the heating resistor 20 are separated from the base body due to thermal stress when the body 12 is repeatedly molded. The exfoliation of the heating resistor can be suppressed.

  According to the molding apparatus 11 of the present embodiment, by supplying power to the power supply wiring 25 led out from the side surface portion 26 of the base body 19, power is supplied to the heating resistor 20 and the heating resistor 20 generates heat. . As a result, the temperature of the substrate 19 can be raised. Further, since the power supply wiring 25 is led out from the side surface portion 26, it is not necessary to arrange the wiring 38 inside the pressing means 14, and the processing of the pressing means 14 becomes easy.

  According to the molding stamper 10 of the present embodiment, power is supplied to the heating resistor 20 by the temperature control means 15 and the molding stamper 10 is molded by the pressing means 14 in a state in which the temperature of the base 19 is raised. By pressing the body 12, the molded body 12 can be molded.

  According to the molding apparatus 11 of the present embodiment, the temperature of the molding stamper 10 is detected by the temperature control means 15, and the supply power supplied to the heating resistor 20 according to the detected temperature, specifically, is applied. Adjust the voltage. When there is a variation in the temperature of the molding stamper 10 for each molding apparatus 1 or each time a molded product rod is molded, the size of each molded product varies, and a molded product with good processing accuracy cannot be obtained. Since the power supply can be adjusted according to the temperature of the molding stamper 10, it is possible to suppress the temperature of the molding stamper 10 from varying every time the molding device 1 or the rod of the molded product is molded, and the dimensions of the molded product. Thus, it is possible to form a molded product with high processing accuracy.

  FIG. 7 is a perspective view showing a molding stamper 10A according to the second embodiment. The molding stamper 10A is similar in configuration to the molding stamper 10 of the first embodiment. Therefore, the configuration of the molding stamper 10A will be described only with respect to differences from the molding stamper 10 according to the first embodiment, and the same components will be denoted by the same reference numerals and description thereof will be omitted. In the molding stamper 10 </ b> A, the heating resistor 20 is not disposed inside the base 19, but is disposed on the convex portion 24 of the base 19. In the present embodiment, the heating resistor 20 is formed on the convex portion 24 of the base body 19. However, the shape is not limited to this, and a groove extending in the A2 direction may be formed in the convex portion 24 of the base 19 and the heating resistor 20 may be formed in the groove. The body 20 may be configured. Further, a protective film is formed on the heating resistor 20 in order to prevent corrosion and wear resistance of the heating resistor 20. Thus, even if the heating resistor 20 is formed on the convex portion 24, it can be prevented from being corroded and damaged.

  According to the molding stamper 10A of the present embodiment, since the heating resistor 20 is provided on the convex portion 24 that contacts and molds the molded body 12, heat is easily transmitted to the molded body 12. As a result, heat loss is small, and the molded body 12 can be molded with a smaller current than the molding apparatus 1 of the prior art. Moreover, since the heating resistor 20 is provided on the convex portion 24, the temperature control of the molding portion that shapes the molded body 12 can be precisely controlled.

  FIG. 8 is a front sectional view showing a molding apparatus 11B including the molding stamper 10B according to the third embodiment. The molding stamper 10B and the molding apparatus 11B are similar in configuration to the molding stamper 10 and the molding apparatus 11. Accordingly, the configurations of the molding stamper 10B and the molding apparatus 11B will be described only with respect to differences from the molding stamper 10 and the molding apparatus 11, and the same components are denoted by the same reference numerals and description thereof is omitted. An electromotive force generator 51 is provided in the molding stamper 10B. The electromotive force generation circuit 51 is formed of, for example, a loop coil or a metal solid pattern and is formed inside the base body 19. The electromotive force generation circuit 51 has a function of receiving an electromagnetic wave and generating an electromotive force. The electromotive force generation circuit 51 is electrically connected to each end 20a, 20b of the heating resistor 20. The electromotive force generation circuit 51 is formed by laminating a layered body in which a conductor paste is attached in a loop coil shape or a solid pattern shape on a green sheet on the first and second layered bodies 28 and 29 and sintering. Can do.

  The molding apparatus 11 further includes electromagnetic wave generating means 52. The electromagnetic wave generation means 52 has a function of radiating electromagnetic waves toward the electromotive force generation circuit 51. The electromagnetic wave generating means 52 includes a transmission circuit such as a recommended vibrator and an antenna, for example, and is configured to radiate an electromagnetic wave from the antenna based on a signal transmitted from the transmission circuit.

  Further, the molding stamper 10 is provided with temperature detecting means 53 on the convex portion 24. The temperature detecting means 53 is constituted by, for example, an alumel chromel thermocouple or a copper constantan thermocouple. The temperature detection means 53 has a function of detecting the temperature of the molded body 12 during molding. Based on the temperature detected by the temperature detecting means 53, the voltage to be applied to the heating resistor 20 is controlled. That is, the magnetic flux density of the electromagnetic wave radiated from the electromagnetic wave generating means 52 is determined.

  When the forming apparatus 11B configured as described above radiates electromagnetic waves from the electromagnetic wave generation means 52, the electromotive force generation circuit 51 receives the electromagnetic waves and generates an electromotive force. The generated electromotive force is supplied to the heating resistor 20, and the heating resistor 20 generates heat. The molded body 12 is molded in a state where such a heating resistor 20 is generating heat.

  According to the molding stamper 10B of the present embodiment, when an electromagnetic wave is radiated toward the electromotive force generation circuit 51 disposed on the base 19, the electromotive force generation circuit 51 receives the electromagnetic wave and generates an electromotive force. As a result, electric power is supplied to the heating resistor 20, the heating resistor 20 generates heat, and the temperature of the base 19 can be raised. By using the electromotive force generation circuit 51 in this way, it is not necessary to electrically connect the power source and the heating resistor 20, and external wiring can be omitted. Therefore, since the base body 19 is moved in the Z direction by the press device 14, such a problem can be solved by using the electromotive force generation circuit 51 although there are many restrictions on the position of the external wiring.

  According to the molding apparatus 11B of the present embodiment, when an electromagnetic wave is radiated to the electromotive force generation circuit 51 by the electromagnetic wave generation means 52, an electromotive force is generated in the electromotive force generation circuit 51, and power is supplied to the heating resistor 20. . As a result, the heating resistor 20 generates heat and raises the temperature of the base 19. In this way, the molded body 12 can be molded by pressing the molding stamper 10 against the molded body 12 by the pressing means 14 in a state where the temperature of the base body 19 is increased.

  In the present embodiment, the molding stamper 10 is made of ceramic, but is not limited to ceramic. For example, silicon (Si), silicon carbide (SiC), silicon nitride (SiN), polycrystalline silicon, glass, or the like may be used.

  In the present embodiment, the heating resistor 20 is formed by applying a conductive paste, but the heating resistor 20 may be formed by a CVD method.

  Moreover, in this Embodiment, although the uneven | corrugated shape of the main surface part 21 is formed using the organic green sheet 35, it is not necessarily limited to such a method. For example, the surface portion of the laminate obtained by laminating a flat green sheet on the first layered body 27 is formed into an uneven shape by laser processing using an yttrium aluminum garnet (abbreviated as YAG) laser, etc. The molding stamper 10 may be formed by sintering. In addition, after the laminate is sintered, the surface portion of the sintered laminate may be formed into an uneven shape by laser processing using a YAG laser or the like, and the molding stamper 10 may be formed.

  In the present embodiment, although the molding stamper 10 is pressed against the molded body 12, a resist is formed on the molded body 12, the resist is molded by the molding stamper 10, and the molded body 12 is etched. May be molded.

  In the present embodiment, the electromotive force generation circuit 51 is formed inside the base body 19 but may be formed outside.

  FIG. 9 is a perspective view showing a molding stamper 10C according to the fourth embodiment. FIG. 10 is a cross-sectional view showing a molding stamper 10 </ b> C as viewed by cutting along the cutting plane line XX in FIG. 9. FIG. 11 is a cross-sectional view showing a molding stamper 10C viewed by cutting along a cutting plane line XI-XI in FIG. The molding stamper 10C is included in the molding apparatus 11C. The molding apparatus 11C is similar in configuration to the molding apparatus 11 of the first embodiment, and the molding stamper 10C is similar in configuration to the molding stamper 10 of the first embodiment. The molding apparatus 11C and the molding stamper 10C will be described only with respect to differences from the molding apparatus 11 and the molding stamper 10 according to the first embodiment, and the same components are denoted by the same reference numerals and description thereof is omitted. To do. Below, it demonstrates, also referring FIG.

  The molding stamper 10 </ b> C includes a base 19 and four heating resistors 61, 62, 63, 64. The four heating resistors 61 to 64 are made of a mixed material of tungsten and ceramic. The four heating resistors 61 to 64 are disposed inside the base 19 and are formed on a first virtual plane 65 that is perpendicular to the A1 direction. The four heating resistors 61 to 64 include a second virtual plane 66 that includes the center in the A2 direction of the base 19 and is perpendicular to the A3 direction, and a third virtual plane 67 that includes the center of the base 19 in the A3 direction and is perpendicular to the A2 direction. The first to fourth areas 68 to 71, which are the four areas to be divided, are respectively arranged. The region on the one side surface 73 side in the A2 direction is defined as first and third regions 68 and 70, and the region on the other side surface portion 74 side in the A2 direction is defined as second and fourth regions 69 and 71. Hereinafter, the heating resistor 61 disposed in the first region 68 is referred to as a first heating resistor 61, and the heating resistor 62 disposed in the second region 69 is referred to as a second heating resistor 62. The heating resistor 63 disposed in the third region 70 is referred to as a third heating resistor 63, and the heating resistor 64 disposed in the fourth region 71 may be referred to as a fourth heating resistor 64.

  More specifically, each of the heating resistors 61 to 64 is formed to meander in a continuous pulse wave shape in the A3 direction. The first heat generating resistor 61 and the second heat generating resistor 62 are arranged symmetrically with respect to the second virtual plane 66, and the first heat generating resistor 61 and the third heat generating resistor 63 are arranged in the third virtual plane 67. With respect to the plane. Further, the first heat generating resistor 61 and the fourth heat generating resistor 64 are arranged point-symmetrically with respect to the intersection line 72 between the second virtual plane 66 and the third virtual plane. However, it is not limited to such an arrangement position.

  The first power supply wiring 81 is connected to both ends 61 a and 61 b of the first heating resistor 61, the second power supply wiring 82 is connected to both ends 62 a and 62 b of the second heating resistor 62, and both ends 63 a of the third heating resistor 63. , 63b and the fourth heating wire 64 are disposed at both ends 64a and 64b of the fourth heating resistor 64, respectively. Each of the power supply wirings 81 to 84 has the same configuration as that of the rising portion 25a and the horizontal portion 25b of the power supply wiring 25, and the first and third power supply wirings 81 and 83 are externally attached to one side surface portion 73 in the A2 direction of the base body 19. It is exposed towards. The second and fourth power supply wirings 82 and 84 are exposed outward at the other side surface portion 74 of the base 19 in the A2 direction. The first to fourth power supply wirings 81 to 84 are electrically connected to the temperature control means 15 </ b> C independently via the wiring 38.

  The temperature control means 15C is electrically connected to the first to fourth power supply wirings 81 to 84 independently of each other, and is electrically connected to a power source (not shown). The temperature control means 15C detects the temperature of the first to fourth regions 6 to 71 of the molding stamper 10C, and controls the voltage applied to each of the heating resistors 61 to 64 according to the detection result. Has a function of controlling the power supplied and controlling the temperature of each of the regions 68 to 71 of the molding stamper 10C. In the present embodiment, since the heating resistors 61 to 64 are made of a mixed material of tungsten and ceramic, the temperature control means 15C uses the TCR resistance temperature characteristics of the heating resistors 61 to 64 to generate each heating resistor. These temperatures are calculated based on the voltages applied to the bodies 61 to 64, the voltages applied to the heating resistors 61 to 64 are controlled based on the calculation results, and the temperature control of the molding stamper 10C is performed. .

  Hereinafter, the operation of the temperature control unit 15C when a temperature drop occurs in at least one of the regions 68 to 71 will be described. When at least one of the regions 68 to 71 falls below a predetermined temperature in the region 68 to 71, it is applied to the heating resistors 61 to 64 disposed in the regions 68 to 71 that are below the predetermined temperature. Increase the voltage. For example, when the temperature of the first region 68 decreases, the voltage applied to the first heating resistor 61 is increased. Further, when the temperature of the first and third regions 68 and 70 decreases, the voltage applied to the first heating resistor 61 and the third heating resistor 63 is increased. In this manner, the temperature control means 15 individually controls the voltage applied to each of the heating resistors 61 to 64, so that only a part of the main surface portion 21 where the temperature is decreasing can be increased in temperature. As a result, it is possible to suppress molding of only a part of the main surface portion 21 in a state where the temperature is low or high, and it is possible to suppress a molding defect caused by molding in such a state.

  According to the molding stamper 10C of the present embodiment, the four heating resistors 61 to 64 are disposed on the base body 19 for molding the molded body 12. Since the four heating resistors 61 to 64 are disposed, only a part of the first to fourth regions 68 to 71 of the base body 19 is generated by heating a part of the four heating resistors 61 to 64. The temperature can be raised. As a result, different temperatures can be set for the first to fourth regions 68 to 71 of the base 19. Further, even if the temperature of only a part of the first to fourth regions 68 to 71 of the base body 19 is lowered, a part of the four heating resistors 61 to 64 is caused to generate heat, whereby the first to fourth regions 68 are formed. The temperature of the part of ˜71 can be increased. This makes it possible to keep the temperature of the entire base 19 uniform.

  According to the molding stamper 10C of the present embodiment, the power supply wirings 81 to 84 are electrically connected to the heating resistors 61 to 64, respectively. As a result, power can be individually supplied to the heating resistors 61 to 64, and the heating resistors 61 to 64 can be individually heated.

  According to the molding stamper 10C of the present embodiment, the power supplied to the heating resistors 61 to 64 can be individually controlled by the temperature adjusting means 15C. As a result, each of the heating resistors 61 to 64 can individually generate heat, so that it is possible to adjust the temperature of the base 19 for each of the first to fourth regions 68 to 71. Accordingly, the temperature of the base 19 can be adjusted for each of the first to fourth regions 68 to 71 in accordance with the shape and temperature of the molded body 12.

  According to the molding stamper 10 </ b> C of the present embodiment, the first to fourth heating resistors 61 to 64 are arranged symmetrically with respect to the second virtual surface 66 and the third virtual surface 67, or arranged on the line object with respect to the intersection line 72. It is installed. As a result, when the same voltage is applied to each of the heating resistors 61 to 64, the temperature distribution of each of the regions 68 to 71 becomes point-symmetric with respect to the intersection line 72. Accordingly, it is possible to improve the processing accuracy of the molded body 12 that is symmetrical in the front-rear direction and the left-right direction. Furthermore, since it is formed on the same virtual plane, specifically, the first virtual plane 65, the main surface portion 21 is maintained at a uniform temperature without complicatedly controlling the voltage applied to each of the heating resistors 61-64. can do.

  In the present embodiment, the four heating resistors 61 to 64 are disposed symmetrically with respect to the second and third virtual planes 66 and 67, but are not necessarily disposed in this manner. A plurality of heating resistors may be formed on the first virtual plane 65. Further, it is not necessary that all the heating resistors are arranged on the first virtual plane 65, and they may be arranged on different virtual planes, and the plurality of heating resistors do not overlap each other electrically. If not connected.

  FIG. 12 is a front cross-sectional view of a fifth embodiment of the molding stamper 10D cut along a virtual plane perpendicular to the A2 direction. FIG. 13 is a cross-sectional plan view showing the molding stamper 10C as seen by cutting along the cutting plane line XIII-XIII in FIG. The molding stamper 10D is included in the molding apparatus 11D. The molding apparatus 11D is different from the molding apparatus 11B in the molding stamper 10B included therein, and the other configurations are the same. The molding stamper 10D is similar in configuration to the molding stamper 10 of the fifth embodiment. The molding stamper 10D will be described only with respect to differences from the molding stamper 10C according to the fourth embodiment, and the same components will be denoted by the same reference numerals and description thereof will be omitted. Below, it demonstrates, also referring FIG.

  The molding stamper 10 </ b> D includes a base 19, an inner heating resistor 91, and an outer heating resistor 92. The inner and outer heating resistors 91 and 92 are made of a mixed material of tungsten and ceramic, are formed inside the base body 19, and are formed on the first virtual plane 65. The inner heating resistor 91 is a substantially rectangular plate, and is disposed in the middle portion of the base 19 in the A2 and A3 directions. The outer heating resistor 92 is a substantially annular plate, and is arranged on the first virtual plane 92 so that the inner heating resistor 92 is disposed inside thereof. More specifically, the outer heat generating resistor 92 is formed in a square shape, and on the first virtual plane 65, the intervals a1, a2, a3, a4 between the outer edge and the outer edge of the base body 19 are equal. It is arranged like this.

  The molding apparatus 11 </ b> D having such a configuration radiates electromagnetic waves toward the inner and outer heating resistors 91 and 92 by the electromagnetic wave generating means 52. The inner and outer heating resistors 91 and 92 receive an electromagnetic wave radiated from the electromagnetic wave generating means 52 to generate an electromotive force and generate heat. The electromagnetic wave generating means 52 has an antenna with high directivity, and can emit electromagnetic waves separately from the antenna toward the inner and outer heating resistors 91 and 92, and can generate heat separately.

  The molding apparatus 11D configured in this way has the same effects as the molding apparatus 11B having the third configuration. Further, the molding stamper 10D has the same effect as the molding stamper 10C of the fourth embodiment. Further, according to the molding stamper 10D of the present embodiment, the rectangular inner heating resistor 91 is disposed at the center, and the outer heating resistor 92 is spaced at equal intervals a1, a2, a3, a4. Therefore, a uniform temperature can be obtained for the main surface portion 21.

  FIG. 14 is a perspective view showing a molding stamper 10E according to the sixth embodiment. FIG. 15 is a cross-sectional view of the molding stamper 10E viewed along the cutting plane line XV-XV in FIG. 16 is a cross-sectional view taken along the cutting plane line XVI-XVI of FIG. 17 is a cross-sectional view taken along the cutting plane line XVII-XVII in FIG. The molding stamper 10E according to the sixth embodiment is similar in configuration to the molding stamper 10C according to the fourth embodiment. The molding stamper 10E according to the sixth embodiment will be described only with respect to differences from the molding stamper 10C according to the fourth embodiment, and the same components will be denoted by the same reference numerals and the description thereof will be omitted. The molding apparatus 11E is different from the molding stamper 10C of the molding apparatus 11C according to the fourth embodiment, and the other configuration is the same. The molding apparatus 11E includes a molding stamper 10E. The molding stamper 10E further includes four heating resistors 85, 86, 87, and 88 in the configuration of the molding stamper 10C.

  The four heating resistors 85 to 88 are disposed on the fourth virtual plane 99. The fourth virtual plane 99 is a virtual plane that is parallel to the first virtual plane 65 and is closer to the main surface portion 21 than the first virtual plane 65. The heating resistors 85 to 88 are disposed in the regions 68 to 71 on the fourth virtual plane 99, respectively. Hereinafter, for each of the heating resistors 85 to 88 disposed on the fourth virtual plane 99, the heating resistor 85 disposed in the first region 68 is referred to as a fifth heating resistor 85, and the second region 69. The heating resistor 86 disposed in the third region 70 is referred to as a sixth heating resistor 86, and the heating resistor 87 disposed in the third region 70 is referred to as a seventh heating resistor 87, and disposed in the fourth region 71. The generated heating resistor 88 may be referred to as an eighth heating resistor 88. The fifth to eighth heating resistors 85 to 88 are formed to meander in a continuous pulse wave shape in the A3 direction in the same manner as the first to fourth heating resistors 61 to 64.

  More specifically, the fifth heating resistor 85 and the sixth heating resistor 86 are arranged symmetrically with respect to the second virtual plane 66, and the fifth heating resistor 85 and the seventh heating resistor 87 are The third virtual plane 67 is arranged symmetrically with respect to the plane. The fifth heating resistor 85 and the eighth heating resistor 88 are arranged point-symmetrically with respect to the intersection line 72. The fifth to eighth heating resistors 85 to 88 arranged in this way are arranged so as to coincide with the first to fourth heating resistors 61 to 64 when projected onto the first virtual plane 65. . However, the arrangement is not limited to this, and the projection may be performed on the first virtual plane 65 or may not coincide with the first to fourth heating resistors 61 to 64.

  A fifth power supply wiring 95 is provided at both ends 85 a and 85 b of the fifth heat generation resistor 85, a sixth power supply wiring 96 is provided at both ends 86 a and 86 b of the sixth heat generation resistor 86, and both ends of the seventh heat generation resistor 87. Seventh power supply lines 97 are disposed on the portions 87a and 87b, and eighth power supply lines 98 are disposed on both ends 88a and 88b of the eighth heating resistor 88, respectively. Further, the fifth and seventh power supply wirings 95 and 97 are exposed outward at one side surface portion 73 in the A2 direction of the base body 19. The sixth and eighth power supply wirings 96 and 98 are exposed outward at the other side surface portion 74 in the A2 direction of the base body 19. The fifth to eighth power supply wirings 95 to 98 are electrically connected to the temperature control means 15C independently through the wiring 38, respectively.

  The molding apparatus 11E configured as described above can independently control the voltage applied to each of the heating resistors 61 to 64 and 85 to 88, specifically, the power supplied to each. By controlling the power supplied to each heating resistor 61-64, 85-88, the temperature of each region 68-71 can be adjusted. The molding apparatus 11E configured as described above has the same effect as the molding apparatus 11C of the fourth embodiment. Further, the molding stamper 10E has the same effects as the molding stamper 10C of the fourth embodiment.

  Further, two heating resistors 61 to 64 and 85 to 88 that are separated in the A1 direction are formed in the regions 68 to 71, respectively. Therefore, for example, power supply to the first heating resistor 61 or the fifth heating resistor 85 out of the first heating resistor 61 and the fifth heating resistor 85 arranged in the first region 68 is stopped and supplied. The temperature of the first region 68 can be controlled only by controlling. In addition, since the distance between the first heating resistor 61 and the main surface portion 21 of the fifth heating resistor 85 is different, power is supplied only to the first heating resistor 61 and power to the fifth heating resistor 85. The temperature of the main surface portion 21 when is supplied is different. Thus, by changing the heating resistor supplied by the temperature control means 15C to the first heating resistor 61 or the fifth heating resistor 85, the temperature of the main surface portion 21 can be controlled. Such effects can be obtained by arranging the heating resistors 61 to 64 and 85 to 88 in two layers.

  FIG. 18 is a perspective view of a molding stamper 10F according to the seventh embodiment. FIG. 19 is a cross-sectional view showing the molding stamper 10F viewed along the cutting plane line X1-X1 in FIG. FIG. 20 is a cross-sectional view showing the molding stamper 10F viewed along the cutting plane line X2-X2 of FIG. The molding stamper 10F according to the seventh embodiment is similar in configuration to the molding stamper 10C according to the fourth embodiment. Specifically, the molding stamper 10F has the configuration of the molding stamper 10C of the fourth embodiment, and further, a flow path 101 is formed in the base 19 and a pump means 102 is provided. Hereinafter, only the flow path 101 and the pump unit 102 will be described, and the same reference numerals are given to the other same configurations, and the description thereof will be omitted. The molding stamper 10F is provided in the molding apparatus 11F. The molding apparatus 11F is the same as the molding apparatus 11C of the fourth embodiment except for the molding stamper 10C included therein. About the same structure, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  The channel 101 is formed in an S shape on the base body 19, and one end 101 a is opened at one side surface portion 73 in the A2 direction, and the other end 101 b is opened at one side surface portion 74 in the A2 direction. The channel 101 is formed on the first virtual plane 65 where the four heating resistors 61 to 64 are formed so as to avoid the four heating resistors 61 to 64. Specifically, the channel 101 is formed in an S shape having recesses 101c and 101d that are recessed in one and the other in the A2 direction on the first virtual plane 65. The channel 101 is formed such that the first and second heating resistors 61 and 62 are disposed in the recess 101c, and the third and fourth heating resistors 63 and 64 are disposed in the recess 101d. Yes. However, the channel 101 is not limited to such a shape. The pump means 102 is connected to one end 101a and the other end 101b of the channel 101.

  FIG. 21 is a cross-sectional view showing a diaphragm type micropump 102 </ b> A according to an embodiment of the pump means 102. FIG. 22 is a cross-sectional view showing an electroosmotic micropump 102B according to another embodiment of the pump means 102. The pump means 102 is a so-called micro pump and supplies refrigerant to the channel 101. As a micropump, a diaphragm type micropump 102A configured using a piezoelectric element, an electroosmotic flow type micropump 102B that generates an electroosmotic flow in the flow path 101 by applying an electric field to the refrigerant in the flow path 101, and Is mentioned.

  First, the diaphragm type micro pump 102A (hereinafter simply referred to as “micro pump 102A”) will be described. The micropump 102A has a piezoelectric element that deforms in response to an electrical signal, and the piezoelectric element deforms in response to a pulse signal, thereby discharging the refrigerant. Specifically, the micropump 102A includes a primary port 104 into which a refrigerant flows, a secondary port 105 through which the refrigerant is discharged, a pump passage 106 connected to the primary port 104 and the secondary port 105, and a refrigerant in the primary port 104. , A piezoelectric element 108 that can be deformed in the discharge direction B1 and the suction direction B2 in response to an electrical signal, and a control unit 109. The primary port 104 of the macro pump 102A is connected to the other end 101b of the flow path 101, and the secondary port 105 is connected to one end 101a of the flow path 101.

  The micro pump 102 </ b> A deforms the piezoelectric element 108 in the discharge direction B <b> 1 to apply pressure to the refrigerant in the pump passage 106 and discharge the refrigerant in the pump passage 106 from the secondary port 105. At this time, the primary port 104 is closed by the check valve 107, and the refrigerant in the pump passage 106 is prevented from flowing back to the primary port 104. When the piezoelectric element 108 is deformed in the suction direction B <b> 2, the micro pump 102 </ b> B opens the check valve 107 that has closed the primary port 104 and sucks the refrigerant from the primary port 104 into the pump passage 106. A pulse signal is transmitted from the control unit 109 to the piezoelectric element 108 to the micropump 102A having such a configuration, and the piezoelectric element 108 is deformed in the discharge direction B1 and the suction direction B2. Discharge is enabled. The frequency of the pulse signal transmitted to the piezoelectric element 108 is variable. The micropump 102 </ b> A configured as described above can change the flow rate of the refrigerant to be discharged per unit time (hereinafter simply referred to as “flow rate”) according to the frequency of the pulse signal transmitted from the control unit 109. Specifically, increasing the frequency increases the flow rate, and decreasing the frequency decreases the flow rate.

  Next, the electroosmotic flow type micro pump 102B (hereinafter simply referred to as “micro pump 102B”) will be described. The micropump 102B causes an electroosmotic flow by applying an electric field in the same direction as the direction in which the refrigerant should flow to the electrolyte refrigerant in the flow path. The micro pump 102B applies an electric field to the primary port 110 into which the refrigerant flows, the secondary port 111 through which the refrigerant flows out, the pump passage 112 connected to the primary port 110 and the secondary port 111, and the refrigerant in the pump passage 112. A pair of electrodes 113 and a control unit 115 are provided. The primary port 110 is connected to the other end 101 b of the flow path 101, and the secondary port 111 is connected to one end 101 a of the flow path 101. The pump passage 112 is formed in the base 114 of the micropump 102B made of ceramic. The pair of electrodes 113 are embedded in the base body 114 so as to face each other with a space therebetween. In the pair of electrodes 113, a cathode 113a is disposed on the downstream side in the refrigerant flow direction C1, and an anode 113b is disposed on the upstream side in the flow direction C1. The pair of electrodes 113 is electrically connected to the control unit 115. The control unit 115 is electrically connected to the temperature control means 15C and is configured to be able to vary the voltage applied to the pair of electrodes 113.

  The micropump 102B applies a voltage to the pair of electrodes 113 to generate an electric field, whereby the electric field acts on the refrigerant in the pump passage 112 and an electroosmotic flow is generated. By generating an electroosmotic flow, the refrigerant flows from the primary port 110 toward the secondary port 111 in the pump passage 112 in the flow-down direction C1. The micropump 102B configured as described above changes the flow rate of the discharged refrigerant by changing the strength of the electric field. In other words, the flow rate of the discharged refrigerant is controlled by controlling the voltage applied to the pair of electrodes 113.

  The refrigerant in the flow path 101 can be circulated by the pump means 102 having such a configuration. In the pump unit 102, the control units 109 and 115, which are flow rate control units, acquire the temperature of the base 19, and control the flow rate of the refrigerant discharged by the control units 109 and 115 according to the temperature of the base 19. Specifically, the flow rate of the refrigerant is controlled according to the temperature difference between the temperature of the base body 19 and a predetermined temperature, and the flow rate of the refrigerant is increased as the temperature difference increases to increase the cooling rate.

  The flow path 101 of the molding stamper 10 </ b> F configured as described above allows the conductive paste to adhere to the sheet 32 when the first layered body 27 is formed, and an organic binder according to the shape of the flow path 101 to be formed. To attach. That is, the organic binder is attached to the sheet 2 in an S shape. Thus, the 1st layered body 27 which an organic binder interposes is formed by apply | coating a ceramic slurry to the sheet | seat 32 to which a conductor paste and an organic binder adhere. When the first layered body 27, the second layered body 28, and the third layered body 29 formed in this way are stacked and sintered in a pressurized state, the organic binder is burned, and the flow path 101 is formed. The molding stamper 10F to be formed is obtained.

  Below, the effect which the stamper 10F for shaping | molding and the shaping | molding apparatus 11F which have such a structure show | play is demonstrated. According to the molding stamper 10F of the present embodiment, the flow path 101 is formed inside the base 19 for molding the body 12 to be molded. The base 19 can be cooled by flowing a coolant through the flow path 101. By cooling the heated substrate 19, the substrate 19 can be lowered to a desired temperature in a short period of time. As a result, it is possible to shorten the time required for continuously molding the plurality of molded bodies 12 as compared with the conventional technique. Therefore, compared with the prior art, the number of molded bodies 12 to be molded per unit time, that is, the number of manufactured finished products can be increased.

  According to the molding apparatus 11F of the present embodiment, power is supplied to the heating resistors 61 to 64 by the temperature control means 15C, and the molding stamper 10F is covered by the pressing means 14 in a state where the temperature of the base 19 is raised. By pressing the molded body 12, the molded body 12 can be molded.

  According to the molding apparatus 11F of the present embodiment, the pump means 102 is provided in the molding stamper 10F. Therefore, when molding the molded body 12, the pump means 102 can be displaced together with the molding stamper 10F. . As a result, the pipe 120 connecting the pump means 102 and the flow path 101 hardly deforms such as bending due to the displacement of the base 19, and the damage due to such deformation is suppressed. Therefore, it is not necessary to configure the pipe 120 with a flexible material that allows the deformation, and the degree of freedom in selecting the material is improved.

  In the present embodiment, the pump means 102 is provided in the molding stamp 10F, but it is not necessarily provided in the molding stamp 10F.

  According to the micropumps 102a and 102b of the present embodiment, the micropumps 102a and 102b can be provided in the molding stamper 10F, and the effects of the pump means 102 as described above can be realized.

  FIG. 23 is a front sectional view of a molding stamper 10G according to the eighth embodiment. FIG. 24 is a cross-sectional view showing the molding stamper 10G viewed along the cutting plane line X3-X3 in FIG. 25 is a cross-sectional view showing the molding stamper 10G viewed along the cutting plane line X4-X4 of FIG. The molding stamper 10G according to the eighth embodiment is similar in configuration to the molding stamper 10C according to the fourth embodiment. Specifically, the molding stamper 10G has the configuration of the molding stamper 10C of the fourth embodiment, and further, four flow paths 121 to 124 are formed in the base body 19, and four pump means 131 to 134 are formed. Is provided. Only the flow paths 121 to 124 will be described, and the same components are denoted by the same reference numerals and description thereof will be omitted. The molding stamper 10G is provided in the molding apparatus 11G. The molding apparatus 11G is the same as the molding apparatus 11C of the fourth embodiment except for the molding stamper 10C included therein. About the same structure, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  Each of the flow paths 121 to 124 is formed inside the base 19 and is formed to meander in a continuous pulse wave shape. Each flow path 121 to 124 is formed on the fifth virtual plane 125. The fifth virtual plane 125 is a virtual plane that is parallel to the first virtual plane 65 on which the respective heating resistors 61 to 64 are formed and is closer to the back side surface portion 126 than the first virtual plane 65. The back surface portion 126 is a surface portion opposite to the main surface portion 21 in the A1 direction. Each of the flow paths 121 to 124 is connected to pump means 131 to 134 at one end and the other end thereof, and the refrigerant discharged from the pump means 131 to 134 flows through the flow paths 121 to 124 to the pump means 131 to 134. It is formed to return. Each pump means 131-134 is comprised by micro pump 102A, 102B, for example.

  In the following, for convenience of explanation of each of the flow paths 121 to 124, the flow path 121 disposed on the upper left side of FIG. 25, that is, formed on the first heating resistor 61 is referred to as a first flow path 121. The flow path 122 disposed on the lower left side of FIG. 25, that is, formed on the second heating resistor 62 is referred to as a second flow path 122, and is disposed on the upper right side of FIG. The flow path 123 formed on the heating resistor 63 is referred to as a third flow path 123, and the flow path 124 disposed on the upper left side of FIG. 25, that is, formed on the fourth heating resistor 64, In some cases, the fourth flow path 124 is used. In other words, the first channel 121 is formed in the first region 68, the second channel 122 is formed in the second region 69, the third channel 123 is formed in the third region 70, and the fourth region 71 is formed. A fourth flow path 124 is formed. The pump means 131 connected to the first flow path 121 is referred to as the first pump means 131, and the pump means 132 connected to the second flow path 122 is referred to as the second pump means 132 and connected to the third flow path 123. The pump means 133 to be connected may be referred to as third pump means 133, and the pump means 134 connected to the fourth flow path 124 may be referred to as fourth pump means 134.

  Further, in the present embodiment, when the first to fourth flow paths 121 to 124 are projected onto the first virtual plane 65, the first to fourth heating resistors 61 to 64 formed below the first virtual plane 65 are aligned. It is in shape. Specifically, the first flow path 121 is the first heating resistor 61, the second flow path 122 is the second heating resistor 62, the third flow path 123 is the third heating element 63, and the fourth heating resistance. The body 64 is formed along the fourth heating resistor 64.

  The molding stamper 10 </ b> G configured as described above drives the first pump means 131 when the temperature of the first region 68 increases excessively, and causes the refrigerant to be discharged and circulated through the first flow path 121. As the refrigerant in the first flow path 121 circulates, heat absorption of the portion of the first region 68 of the base 19 by the refrigerant is promoted, and the temperature of the first region 68 is lowered. Similarly, when the temperature of the second region 69 rises, the second pump means 132 is driven to circulate the refrigerant in the second flow path 122, and when the temperature of the third region 69 rises, the third pump means 133 is driven. Then, the refrigerant is circulated in the third flow path 123, and similarly, when the temperature of the fourth region 69 rises, the fourth pump means 134 is driven to circulate the refrigerant in the fourth flow path 123. Thereby, the temperature of each area | region 68-71 can be lowered | hung.

  Below, the effect which the molding stamper 10G and the molding apparatus 11G configured as described above will do will be described. According to the molding stamper 10G of the present embodiment, the first to fourth flow paths 121 to 124 are formed closer to the back side surface portion 126 than the heating resistors 61 to 64. Accordingly, the heat conduction from the heating resistors 61 to 64 to the main surface portion 21 is not suppressed by the flow paths 121 to 124, and it is easy to maintain at a desired temperature, and heat loss during heating can be suppressed.

  Further, according to the molding stamper 10G of the present embodiment, the flow paths 121 to 124 are formed separately in the regions 68 to 71. Therefore, by individually driving the pump units 131 to 134, the temperature of each of the regions 68 to 71 can be individually adjusted. Specifically, the temperature can be lowered. Therefore, the temperature of the base 19 can be controlled for each of the first to fourth regions 68 to 71, and when the molded body 12 is molded, a finished product with high processing accuracy can be obtained.

  According to the molding stamper 10G and the molding apparatus 11G of the present embodiment, the same effects as the molding stamper 10F and the molding apparatus 11F of the seventh embodiment are exhibited.

  FIG. 26 is a front sectional view of a molding stamper 10H according to the ninth embodiment. FIG. 27 is a cross-sectional view of the molding stamper 10H viewed along the cutting plane line X5-X5 of FIG. FIG. 28 is a cross-sectional view showing the molding stamper 10H viewed along the cutting plane line X6-X6 of FIG. The molding stamper 10H according to the ninth embodiment is similar in configuration to the molding stamper 10A according to the second embodiment. Regarding the configuration of the molding stamper 10H, only the configuration different from the second molding stamper 10A of the embodiment will be described, and the same configuration is denoted by the same reference numeral and the description thereof is omitted. The molding stamper 10G is provided in the molding apparatus 11G. The molding apparatus 11G is the same as the molding apparatus 11A of the second embodiment except for the molding stamper 10A included therein. About the same structure, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  The molding stamper 10H includes a base 19H and a heating resistor 20H. As for base 19H, main surface part 21 is formed in unevenness. Specifically, the base body 19 </ b> H has a convex portion 24 </ b> H formed on the surface portion 23 of the base body 22. The convex portion 24H is formed to meander in a belt shape, specifically, in a continuous pulse wave shape. A heating resistor 20H is formed on the surface portion 135 of the convex portion 24 constituting a part of the main surface portion 21. The heating resistor 20H is formed along the convex portion 24, that is, formed so as to meander in a continuous pulse wave shape.

  Further, a flow path 101H is formed in the base body 19H along the heating resistor 20H. Specifically, the channel 101 </ b> H is formed to meander in a continuous pulse wave shape, and one end and the other end thereof are connected to the pump unit 102. The pump means 102 sucks the refrigerant flowing through the other end of the channel 101 and discharges the sucked refrigerant to one end of the channel 101. In this way, circulation of the refrigerant in the flow path 101H is realized.

  Below, the effect which the stamping stamper 10H comprised in this way has is demonstrated. According to the molding stamper 10H of the present embodiment, the flow path 101H is formed along the convex portion 24H formed in a strip shape. As a result, the channel 101H, which is a cooling mechanism, is formed along the convex portion 24H, so that the convex portion 24H can be efficiently cooled. Thus, since the convex part 24H can be cooled efficiently, the time when shape | molding the some to-be-molded body 12 continuously can be shortened further.

  According to the molding stamper 10H of the present embodiment, the same effects as those of the molding stamper 10A of the second embodiment are exhibited.

  In the present embodiment, only one belt-like convex portion 24H is formed on the base body 22, but two or more belt-like convex portions 24H may be formed, and the two flow paths 101H are the two. The same effect can be achieved if it is formed along the convex portion 24H. Further, the plurality of flow paths 101H may be formed along the convex portion 24H, and the same effect can be achieved by this.

  In the present embodiment, a closed circuit is formed by the flow paths 101 and 101H and the pump unit 102, but the closed circuit is not necessarily required. For example, the pump unit 102 may suck the refrigerant from the tank and discharge it to the flow path 101H. In this case, a cooling mechanism that supplies new refrigerant to the flow path 101H can be configured by configuring the refrigerant flowing through the flow path 101H to flow from the other end to the drain.

  In the present embodiment, although the channels 101 and 101H are formed using an organic binder, the present invention is not necessarily limited to such a method. For example, the flow paths 101 and 101H may be formed by forming through holes and grooves in the first layered body 27 using a mold and a tool. Further, the case of forming using a mold will be specifically described. The formed first layered body 27 is plastically deformed by a mold to form a groove. The first layered body 27 in which grooves are formed in this way is stacked, sandwiched between the second and third layered bodies 28 and 29, and sintered, whereby the flow paths 101 and 101H are formed.

  The shape of the flow path 101 is not limited to the shape as described above, and can be changed within a range where the same effect can be obtained.

It is front sectional drawing which shows the shaping | molding apparatus 11 containing the stamper 10 for shaping | molding of the 1st Embodiment. 1 is a perspective view showing a molding stamper 10. FIG. It is sectional drawing which shows the stamper 10 for a shaping | molding cut | disconnected by the cut surface line III-III of FIG. It is sectional drawing which shows the stamper 10 for a shaping | molding cut | disconnected and seen by the cutting surface line IV-IV of FIG. It is a figure which shows the procedure which forms the stamper 10 for shaping | molding. It is a figure which shows the procedure which forms the stamper 10 for shaping | molding. It is a figure which shows the procedure which forms the stamper 10 for shaping | molding. It is a figure which shows the procedure which shape | molds the to-be-molded body 12 using the shaping | molding apparatus 11. FIG. It is a perspective view which shows 10A of shaping | molding stampers of 2nd Embodiment. It is front sectional drawing which shows the shaping | molding apparatus 11B provided with the stamper 10B for shaping | molding of 3rd Embodiment. It is a perspective view which shows 10 C of shaping | molding stampers of 4th Embodiment. FIG. 10 is a cross-sectional view showing a molding stamper 10 </ b> C viewed by cutting along a cutting plane line XX in FIG. 9. FIG. 11 is a cross-sectional view showing a molding stamper 10 </ b> C viewed by cutting along a cutting plane line XI-XI in FIG. 10. It is front sectional drawing which cut | disconnected the stamper 10D for shaping | molding of 5th Embodiment from the virtual plane perpendicular | vertical to A2 direction, and was seen. FIG. 13 is a cross-sectional plan view showing a molding stamper 10 </ b> C viewed by cutting along a cutting plane line XIII-XIII in FIG. 12. It is a perspective view which shows the stamper 10E for shaping | molding of 6th Embodiment. It is sectional drawing which shows the stamper 10E for shaping | molding cut | disconnected and seen by the cut surface line XV-XV of FIG. It is sectional drawing seen by cut | disconnecting along the cutting plane line XVI-XVI of FIG. It is sectional drawing seen by cut | disconnecting by the cutting plane line XVII-XVII of FIG. It is a perspective view of the molding stamper 10F of the seventh embodiment. It is sectional drawing which shows the stamper 10F for shaping | molding seen by cut | disconnecting by the cut surface line X1-X1 of FIG. It is sectional drawing which shows the stamper 10F for shaping | molding seen by cut | disconnecting by the cut surface line X2-X2 of FIG.

It is sectional drawing which shows the diaphragm type micro pump 102A of one Embodiment of the pump means 102. FIG. It is sectional drawing which shows the electroosmotic flow type micro pump 102B of other embodiment of the pump means 102. FIG. It is front sectional drawing of the stamper 10G for shaping | molding of 8th Embodiment. FIG. 24 is a cross-sectional view showing a molding stamper 10G viewed along the cutting plane line X3-X3 in FIG. FIG. 24 is a cross-sectional view showing a molding stamper 10G viewed along the cutting plane line X4-X4 of FIG. It is front sectional drawing of the stamper 10H for shaping | molding of 9th Embodiment. It is sectional drawing which shows the stamper 10H for shaping | molding seen by cut | disconnecting by the cut surface line X5-X5 of FIG. It is sectional drawing which shows the stamper 10H for shaping | molding seen by cut | disconnecting by the cut surface line X6-X6 of FIG. It is front sectional drawing which shows the shaping | molding apparatus 1 of a prior art.

Explanation of symbols

10F, 10H Molding stamper 11F, 10H Molding device 12 Molded body 14 Press means 15C Temperature control means 19 Base body 21 Main surface part 24, 24H Convex part 101, 101H Flow path 109 Control part 115 Control part

Claims (3)

The surface portion on the side for molding the object to be molded has a base formed in an uneven shape,
A molding stamper characterized in that a flow path portion through which a refrigerant flows is formed inside the substrate.   2. The molding stamper according to claim 1, wherein the convex portion of the surface portion is formed in a belt shape, and at least a part of the flow path is formed along the convex portion. A molding stamper according to claim 1 or 2, and a pressing means for pressing a molding object with the molding stamper,
Heating means for heating the molding stamper;
Temperature detecting means for detecting the temperature of the molding stamper;
A molding apparatus comprising: a flow rate control unit that controls a flow rate of the refrigerant according to a temperature detected by the temperature detection unit.

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