JP2008053842A - Component mounting substrate, electronic circuit device, and non-reciprocal circuit element, and communication device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting substrate that reduces size, thickness, and costs effectively and has a structure that can be manufactured with stable characteristics and a high yield, and to provide a non-reciprocal circuit element and a communication device having the non-reciprocal circuit element. <P>SOLUTION: The component mounting substrate has a conductive substrate 10 and an insulating film 11. The insulating film 11 has ground electrodes 110-116 for exposing the surface of the conductive substrate 10 on at least one surface of the conductive substrate 10, and covers the entire surface of the conductive substrate 10 except the ground electrodes 110-116. The conductive substrate 10 has a recess 100 within the surface. Terminals 117, 118 are buried inside the recess 100. The terminals 117, 118 are electrically insulated from the conductive substrate 10 by the insulating film 11 adhering onto the inner-wall surface of the recess 100. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component mounting board, an electronic circuit device, a non-reciprocal circuit element, and a communication device.

  In general, a component mounting substrate of an electronic circuit device has a ground pattern formed on a surface of an insulating substrate together with a signal pattern, and a functional component (electronic component) is soldered to these patterns. However, for example, when it is necessary to add a function for dissipating heat generated in a functional component to a component mounting board, such as a power supply device, For example, when it is necessary to use both as a yoke and a grounding member, it is necessary to correspond to the structure of the component mounting board.

  For example, when a heat dissipation function is added to the component mounting board, a heat dissipation plate made of aluminum having good heat dissipation is lined on the back surface of the original component mounting board. However, this structure increases costs and becomes an obstacle to miniaturization and thinning. In addition, when a heat radiating plate having good conductivity such as aluminum is lined, it is difficult to electrically insulate the terminal serving as the external connection portion from the heat radiating plate while ensuring sufficient mechanical strength.

  Further, as disclosed in Patent Document 1, nonreciprocal circuit elements such as isolators and circulators, which are a kind of magnetic device, incorporate necessary functional components in a magnetic metal container that functions as a yoke and a ground member. It is like that. The main functional parts are magnetic parts such as a magnetic rotor and a permanent magnet composed of a soft magnetic substrate and a central conductor, circuit parts such as a matching capacitor, and a termination resistor. These circuit components usually have a ground electrode on the side opposite to the electrode to which one end of the center conductor is soldered, and this ground electrode is fixed to the bottom surface of the magnetic metal container by soldering. .

  As described above, the magnetic metal container must satisfy the function as a ground member for soldering the ground electrode of the center conductor and the ground electrode of the circuit component in addition to the function as the yoke.

  More importantly, since it is necessary to form a terminal for external connection on a magnetic metal container used as a ground member, the magnetic metal container has a complicated structure in which a conductive magnetic material is molded into an insulating resin. There is a need.

However, the complexity of the structure of the magnetic metal container increases the cost and becomes an obstacle to miniaturization and thinning. In addition, since the ground electrode of the circuit component and the ground electrode of the central conductor must be soldered on the bottom of the magnetic metal container having a depth, it is difficult to perform the soldering operation and the functional component is being inserted. Therefore, it is easy to produce position shift. For this reason, there arises a problem that misalignment, poor soldering, and the like that cannot be confirmed from the outside occur, leading to variations in characteristics and a decrease in yield.
JP 2002-141709 A

  An object of the present invention is to provide a component mounting substrate and an electronic circuit device that are effective in reducing the size, the thickness, and the cost.

  Another object of the present invention is to provide a component mounting substrate, a non-reciprocal circuit device, and a communication device using the component mounting substrate having a structure capable of manufacturing a product having stable characteristics with a high yield.

In order to solve the above-described problem, a component mounting board according to the present invention includes a conductive substrate, an insulating film, and a terminal. The conductive substrate has a recess in its surface.
The insulating film has a window portion that exposes the surface of the conductive substrate on at least one surface of the conductive substrate, and covers the entire surface of the conductive substrate including the inner wall surface of the recess except for the window portion. ing. The terminal is electrically insulated from the conductive substrate by the insulating film embedded in the recess and attached to the inner wall surface of the recess.

  The component mounting board according to the present invention is combined with a functional component to constitute various electronic circuit devices. The functional component is bonded to the conductive base of the component mounting substrate through the window portion. Here, the component mounting board according to the present invention has a conductive base and an insulating film, and the insulating film has a window portion that exposes the surface of the conductive base on at least one surface of the conductive base. Therefore, the functional component can be bonded to the conductive substrate through the window portion.

  Moreover, since the conductive substrate is usually made of a metal material, it can be used as it is as a heat dissipation member or as a ground substrate. For this reason, since it is not necessary to line the ground substrate or the heat sink on the back surface of the circuit board having the conductor pattern, it is possible to achieve downsizing, thickness reduction, and cost reduction.

  Since the insulating film covers the entire surface of the conductive substrate except for the window part, the live part can be limited to a minimum size only in a necessary region, and electrical stability can be ensured. .

  Furthermore, the component mounting board according to the present invention includes a terminal, and the terminal is embedded in the recess. Although this terminal is used for connection with the outside, since it is embedded in a recess formed in the surface of the conductive substrate, a sufficiently large mechanical strength can be secured. In addition, since the terminals only have to be embedded in the recesses formed in the surface of the conductive substrate, the thickness does not increase and the manufacture is easy.

  In addition, since the terminal is electrically insulated from the conductive substrate by the insulating film attached to the inner wall surface of the recess in a multi-state embedded in the recess, the terminal is electrically The insulation process is complete. The terminal is composed of a metal ball, preferably a metal ball mainly composed of Cu. Such a metal ball is excellent in spreadability and electrical conductivity, and since it has a spherical shape, it is useful for forming a terminal with low electrical resistance without damaging the insulating film.

  The insulating film is preferably composed of an electrodeposition film. Unlike the applied insulating film, the electrodeposition film is a thin and uniform film. For this reason, it is possible to form a high-quality insulating film with little variation in thickness dimension and high electrical insulation reliability.

  The conductive substrate can be composed of either a magnetic material or a non-magnetic material. In the case of a magnetic material, it can be used not only as a ground substrate and a heat dissipation substrate but also as a yoke. This is a great advantage when a magnetic device such as a non-reciprocal circuit element is configured. Next, this point will be described.

  The nonreciprocal circuit device usually includes a component mounting board and a functional component. The component mounting board is according to the present invention described above, and is composed of a flat magnetic material. The functional component is mounted on one surface of the component mounting board, and at least a part thereof is bonded to the conductive base of the component mounting board through the window portion.

  As described above, in the non-reciprocal circuit device according to the present invention, the component mounting board is a flat plate and the functional component is mounted on one surface of the component mounting board. Unlike the case of using a metal container, the structure is simplified and the cost is reduced.

  Since the functional component is mounted on one surface of the component mounting substrate, the functional component can be positioned with high accuracy. Even if a positional deviation occurs at the time of mounting, it can be confirmed and corrected, so that a product with stable characteristics can be manufactured with a high yield.

  Furthermore, since the component mounting board on which the functional components are mounted is flat, it is smaller and thinner than conventional magnetic metal containers. Moreover, since the component mounting board is a magnetic plate, it can satisfy the function as a yoke.

  At least one surface of the component mounting board is covered with an insulating film, and a window portion without the insulating film is provided in the surface of the insulating film. According to this structure, the ground electrode of the circuit component, the ground electrode of the center conductor, and the like can be directly soldered on one surface of the component mounting substrate through the window portion. Portions other than the window are covered with an insulating film. Therefore, it is possible to avoid the occurrence of an unnecessarily active part on the component mounting board.

  In the nonreciprocal circuit device according to the present invention, the functional component may have a general configuration. That is, the functional component can include a magnetic rotor, a permanent magnet, and a circuit component. The magnetic rotor has a central conductor disposed on a soft magnetic substrate, and the permanent magnet applies a DC magnetic field to the magnetic rotor. The circuit component includes a capacitor, which is connected to the central conductor of the magnetic rotor.

  The nonreciprocal circuit device according to the present invention also includes a cover member as in the conventional case. The cover member is made of a magnetic material and constitutes a yoke against a magnetic field generated by the permanent magnet together with the component mounting board.

  Furthermore, the present invention also discloses a communication device including the above-described non-reciprocal circuit element, such as a mobile wireless device such as a mobile phone.

According to the present invention described above, the following effects can be obtained.
(A) It is possible to provide a component mounting board and an electronic circuit device that are effective in reducing the size, the thickness, and the cost.
(B) It is possible to provide a component mounting board, a non-reciprocal circuit device, and a communication device using the component mounting substrate having a structure capable of manufacturing a product having stable characteristics with a high yield.

  Other features of the present invention and the operational effects thereof will be described in more detail by embodiments with reference to the accompanying drawings.

  1 is a plan view showing an example of a component mounting board according to the present invention, FIG. 2 is a partially enlarged plan view of the component mounting board shown in FIG. 1, and FIG. 3 is an enlarged cross-sectional view taken along line 3-3 in FIG. FIG. The component mounting board 1 includes a conductive substrate 10 and an insulating film 11.

  The conductive substrate 10 is basically a flat metal (including alloy) plate. The metal material used may be either a magnetic material or a non-magnetic material. Specific examples of the magnetic material include those containing Fe as a main component, and non-magnetic materials include those containing Al, Cu, or the like as a main component.

  The conductive substrate 10 has a recess 100 at an appropriate position such as the periphery thereof. The concave portion 100 may be cut out at the periphery, or may be formed in the surface of the conductive substrate 10 as a through hole or a non-through hole. The number, size, formation position, etc. may be arbitrary. In the illustrated embodiment, a plurality of recesses 100 are provided at intervals along the periphery of the conductive substrate 10 as shown in an enlarged view in FIG. Each of the recesses 100 has a narrow width W1 at the entrance and increases in width toward the depth direction. That is, the width W2 of the enlarged bottom surface is larger than the width W1 of the entrance.

  The insulating film 11 is an electrodeposited film, and has window portions 111 to 116 that expose the surface of the conductive substrate 10 on at least one surface of the conductive substrate 10. The entire surface of the conductive substrate 10 including the inner wall surface is covered. The number, size, shape, and the like of the windows 111 to 116 are in accordance with the number, size, shape, etc. of the functional components to be mounted, and are not limited to the illustration.

  Furthermore, input / output terminals 117 and 118 are provided on the component mounting board 1. The input / output terminals 117 and 118 shown in the embodiment have a structure in which metal balls are embedded in the recesses 100 provided on opposite sides of the component mounting board 1. As the metal balls, those having high spreadability and low electric resistance, for example, Cu balls are suitable. In addition, solder balls, Au balls, and the like can be used. When these metal balls are embedded, the surface in the concave portion 100 of the component mounting board 1 is covered with the insulating film 11, so that the input / output terminals 117 and 118 serve as the conductive substrate 10 constituting the component mounting board 1. Is electrically insulated.

  The terminals 117 and 118 are used for connection to the outside. However, since the terminals 117 and 118 are embedded in the recesses 100 formed in the surface of the conductive substrate 10, a sufficiently large mechanical strength can be secured. In addition, since the terminals 117 and 118 need only be embedded (pushed) into the recesses 100 formed in the surface of the conductive substrate 10, the thickness is not increased and the manufacture is easy.

  Further, since the terminals 117 and 118 are electrically insulated from the conductive substrate 10 by the insulating film 11 embedded in the concave portion 100 and attached to the inner wall surface of the concave portion 100 in multiple states, Simultaneously with the internal embedding, the electrical insulation process for the terminals 117 and 118 is completed.

  In the embodiment shown in FIGS. 1 to 3, each of the recesses 100 in which the terminals 117 and 118 are embedded has a narrow width W1 at the entrance and increases in width in the depth direction. 117 and 118 can be securely held.

  The component mounting board 1 according to the present invention is combined with a functional component to constitute various electronic circuit devices. FIG. 4 is a diagram conceptually showing the configuration of such an electronic circuit device. Referring to the figure, functional parts 221 and 222, which are various electronic parts, have their electrodes 241 and 242 joined to the conductive substrate 10 of the component mounting board 1 through, for example, solders 51 and 52 through window portions 111 to 116. Is done. In the figure, the functional components 221 and 222 are also joined to the input / output terminals 117 and 118.

  Here, the component mounting substrate 1 according to the present invention includes a conductive base 10 and an insulating film 11, and the insulating film 11 covers the surface of the conductive base 10 on at least one surface of the conductive base 10. Since the window portions 111 to 116 to be exposed are provided, the functional components 221 and 222 can be bonded to the conductive substrate 10 through the window portions 111 to 116.

  Moreover, since the conductive substrate 10 is usually made of a metal material, it can be used as it is as a heat radiating member or as an earth substrate. For this reason, since it is not necessary to line the ground substrate or the heat sink on the back surface of the circuit board having the conductor pattern, it is possible to achieve downsizing, thickness reduction, and cost reduction.

  Since the insulating film 11 covers the entire surface of the conductive substrate 10 including the inner wall surface of the recess 100 except for the windows 111 to 116, the live part is limited to a minimum size only in a necessary region. In addition, electrical stability can be ensured. Further, in the case of the embodiment, since the insulating film 11 is an electrodeposited film, unlike the applied insulating film, it becomes a thin and uniform film. For this reason, it is possible to form the high-quality insulating film 11 with less thickness dimension variation and high electrical insulation reliability.

  The conductive substrate 10 can be composed of either a magnetic material or a non-magnetic material. In the case of a magnetic material, it can be used not only as a ground substrate and a heat dissipation substrate but also as a yoke.

  Next, a method for manufacturing a component mounting board according to the present invention will be described with reference to FIGS. First, as shown in FIG. 5 and FIG. 6 which is an enlarged sectional view taken along the line 6-6 in FIG. 5, a conductive substrate 10 made of a metal plate and having recesses 100 on both opposing sides is prepared. The number and shape of the recesses 100 may be arbitrary.

  Next, an insulating film is electrodeposited on the conductive substrate 10 shown in FIGS. Electrodeposition is performed by the method illustrated in FIGS.

First, as shown in FIG. 7, the conductive substrate 10 is suspended from a support 53 attached to the transport body 52. The support 53 is made of a metal material having conductivity as a whole, and also serves as a cathode. The suspended conductive substrate 10 is carried into the container 51 and subjected to a pretreatment process. In this pretreatment process, processes such as degreasing, water washing, acid treatment and water washing on the surface of the conductive substrate 10 are performed. Washing with water is performed with pure water, and acid treatment is performed by immersing the conductive substrate 10 in, for example, a 3% H ₂ SO ₄ solution. The washing with water is performed by jetting pure water from the nozzle 54.

  The conductive substrate 10 that has been subjected to the pretreatment step is subjected to an electrodeposition step as shown in FIG. In the electrodeposition step, the conductive substrate 10 supported by the carrier 52 and the support 53 is immersed in an electrodeposition liquid stored in a container (tank) 51, and the conductive substrate 10 is used as a cathode. This is performed by electrodepositing the insulating coating component in the electrodeposition liquid onto the surface of the conductive substrate 10 by applying a direct current from a DC power source 56 with the electrode 55 immersed in the liquid deposition as an anode. As an electrodeposition liquid, for example, a polyimide aqueous solution is known. As an example, energization is 100 V for about 5 minutes, and the electrodeposition solution is at a liquid temperature of 25 ° C. and a pH of about 4.3.

  Next, as shown in FIG. 9, the component mounting substrate 1 in which an insulating film is electrodeposited on a conductive substrate is subjected to a post-processing step. The post-treatment step preferably includes two treatment steps of primary water washing and subsequent main water washing. For this cleaning, it is preferable to use pure water.

  Then, as shown in FIG. 10, the electrodeposition-coated component mounting board 1 is placed in a heating furnace 57 and subjected to a baking process. The baking treatment step preferably includes two steps of preliminary drying and main curing. The temperature condition and treatment time depend on the components of the electrodeposition liquid. In an example in which a polyimide aqueous solution is used as the electrodeposition solution, the preliminary drying step is performed, for example, at a temperature condition of 90 ° C. for 10 minutes, and the main curing step is performed at 210 ° C. for 40 minutes.

  The advantages of electrodeposition coating over other coating techniques such as electrostatic coating, spray coating or powder coating are already mentioned.

  11 is a plan view of the component mounting board obtained through the electrodeposition process shown in FIGS. 7 to 10, and FIG. 12 is an enlarged sectional view taken along the line 12-12 in FIG.

  Next, as shown in FIG. 13, a necessary window 111 is formed by irradiating the insulating film 11 electrodeposited on the surface of the conductive substrate 10 with a laser. The other window portions 112 to 116 shown in FIG. 1 are also formed by similar laser processing. Thereby, the surface of the electroconductive base | substrate 10 is exposed inside the windows 111-116.

  Next, as shown in FIG. 14, the metal balls 117 and 118 are pushed into the concave portion 100, and the upper and lower surfaces thereof are crushed and flattened by the mold 61 as indicated by the arrow F <b> 1. As a result, as shown in FIG. 15, input / output terminals 117 and 118 whose upper and lower surfaces are flattened are obtained. Through the above steps, the component mounting board shown in FIGS. 1 to 3 is obtained.

  Next, an example of the nonreciprocal circuit device according to the present invention will be described. 16 is an exploded perspective view showing an embodiment of a nonreciprocal circuit device according to the present invention, FIG. 17 is a perspective view showing an internal structure arrangement, and FIG. 18 is a perspective view showing a completed state. 17 and 18 are different from FIG. 16 in the viewing direction by 180 degrees. The illustrated non-reciprocal circuit element illustrates two possible types, that is, an isolator of an isolator or a circulator, and includes a component mounting board 1 and a functional component 2.

  The component mounting board 1 is composed of a flat conductive magnetic substrate 10. Specifically, a conductive magnetic material mainly composed of Fe or the like is used, and the insulating film 11 is thinly deposited on the entire surface by electrodeposition such as electrostatic coating. No window portions 110 to 116 are formed. This point is as shown in FIGS. However, since the surfaces of the conductive magnetic bodies constituting the component mounting substrate 1 are exposed in the window portions 110 to 116 to form a ground electrode, the window portions 110 to 116 are hereinafter expressed as the ground electrodes 110 to 116. I decided to.

  Furthermore, input / output terminals 117 and 118 are provided on the component mounting board 1. The input / output terminals 117 and 118 shown in the embodiment have a structure in which metal balls are embedded in the recesses 100 provided on opposite sides of the component mounting board 1. As described above, the input / output terminals 117 and 118 are electrically insulated from the conductive magnetic base 10 constituting the component mounting substrate 1 by the insulating film 11.

  Next, the functional component 2 includes a magnetic rotor 21, a permanent magnet 23, and circuit components 221 to 224. Such a combination of functional components is well known for this type of non-reciprocal circuit device. In the magnetic rotor 21, first to third central conductors 211 to 213 are arranged on a soft magnetic base 210. The soft magnetic base 210 is preferably a soft magnetic material such as yttrium / iron / garnet (YIG). As an example, the soft magnetic substrate 210 is formed in a flat plate shape with a side of several mm and a thickness of about 0.2 to 0.5 mm.

  The first to third center conductors 211 to 213 are made of a conductor plate obtained by punching a copper foil having a thickness of about 10 to 50 μm, for example, and intersect each other at a predetermined angle on one surface of the soft magnetic substrate 210. So that they are combined at an appropriate angle. Both ends of the first to third central conductors 211 to 213 serve as terminal portions 201 to 206 connected to the circuit components 221 to 224. The first to third central conductors 211 to 213 are electrically insulated from each other at the intersection. The electrical insulation can be realized by interposing an insulating film formed by applying an insulating paint, an insulating film or the like in the overlapping portion. In the embodiment, the first to third central conductors 211 to 213 are flat plate pieces independent of each other, but are branched from a common ground electrode arranged on the other surface side of the soft magnetic substrate 210. Alternatively, it may be configured as an integrated body that is raised along the side surface of the soft magnetic substrate 210 and bent so as to overlap on one surface of the soft magnetic substrate 210.

  The permanent magnet 23 applies a DC magnetic field to the magnetic rotor 21. The permanent magnet 23 is formed in a square shape slightly larger than the soft magnetic base 210 using a ferrite magnet or the like, and faces the first to third central conductors 211 to 213 so as to face the soft magnetic base 210. It is arranged on one side.

  The circuit components include capacitors 211 to 223 and a resistor 224, which are mounted on the support substrate 1 and soldered. Specifically, the capacitor 221 has two terminal electrodes 241 and 242 on one surface and terminal electrodes 243a and 243b that are independent of each other on the opposite surface. The terminal portion 201 of the first central conductor 211 is connected to the terminal electrode 241 by soldering, and the terminal portion 204 of the second central conductor 212 is connected to the terminal electrode 242 by soldering. The terminal electrode 243a is soldered to the ground electrode 111 of the support substrate 1, and the terminal electrode 234b is soldered to the input / output terminal 117.

  The capacitor 222 has a terminal electrode 244 on one surface and a terminal electrode 245 on the other surface on the opposite side. The terminal portion 206 of the third central conductor 213 is soldered to the terminal electrode 244, and the terminal electrode 245 on the opposite side is soldered to the ground electrode 112 of the support substrate 1.

  The capacitor 223 has two terminal electrodes 246 and 247 on one surface, and terminal electrodes 248a and 248b that are independent from each other on the opposite surface. The terminal portion 203 of the second center conductor 212 is connected to the terminal electrode 246 by soldering, and the terminal portion 202 of the first center conductor 211 is connected to the terminal electrode 247 by soldering. The terminal electrode 248 a is soldered to the ground electrode 114 of the support substrate 1, and the terminal electrode 248 b is soldered to the input / output terminal 118.

  FIG. 19 is a partially enlarged sectional view showing an example of the capacitors 221 and 223. FIG. 19 directly shows the structure and mounting structure of the capacitor 221, and for the capacitor 223, the corresponding portion is shown in parentheses. However, FIG. 19 is only an example of the capacitors 221 and 223, and is not limited thereto.

  Referring to FIG. 19, the capacitor 221 has a plurality of internal electrodes 41, 42 that form a pair inside the ceramic substrate, and the end portions of the internal electrodes 41, 42 opposite to each other are connected to the through-hole conductor 43, 44. The through-hole conductor 43 has one end connected to the terminal electrode 241 and the other end connected to the terminal electrode 243a. The terminal electrode 243 a is connected to the conductive substrate 10 of the support substrate 1 by soldering 51. Further, the terminal electrode 243 b is connected to the input / output terminal 117 by soldering 52.

  The resistor 224 has terminal electrodes 249 and 250 at opposite ends, and is disposed on the side of the capacitor 222. The terminal portion 206 of the third central conductor 213 is soldered to the terminal electrode 249, and the terminal electrode 250 is soldered to the ground electrode 113 of the support substrate 1. The terminal portion 205 of the third center conductor 213 is soldered to a metal block 119 fixed on one surface of the support substrate 1 by means such as adhesion. The metal block 119 is soldered to the ground electrode 110.

  Furthermore, the nonreciprocal circuit device according to the present invention also includes the cover member 3 as in the conventional case. The cover member 3 is made of a magnetic material mainly composed of Fe or the like, and constitutes a yoke for a magnetic field generated by the permanent magnet 23 together with the component mounting board 1. The illustrated cover member 3 has side plates 32 and 33 that are continuously bent from the top surface 31 on opposite sides. The edge of the side plate 33 is coupled to the support base 1 through ground electrodes 115 and 116 provided on the side of the component mounting board 1.

  FIG. 20 is a circuit diagram of the isolator shown in FIGS. In the figure, the end 204 of the second central conductor 212 is connected to the input / output terminal 117, and a capacitance C11 is generated between the end 204 and the ground electrode. The capacitance C11 is acquired by the internal electrodes 41 and 42 between the terminal electrodes (242 and 243b) and the terminal electrodes (242 and 243a) of the capacitor 221, and is grounded to the conductive base 10 of the support substrate 1 by the terminal electrode 243a. Is done.

  Next, the end portion 202 of the first center conductor 211 is connected to the input / output terminal 118, and a capacitance C31 is generated between the end portion 202 and the ground electrode. The capacitance C31 is acquired by the internal electrodes 41 and 42 between the terminal electrodes (247 and 248b) of the capacitor 223 and the terminal electrodes (247 and 248a), and is connected to the conductive base 10 of the support substrate 1 by the terminal electrode 248a. Grounded.

  Further, the end 206 of the third central conductor 213 is connected to the terminal electrode 244 of the capacitor 222 and the terminal electrode 249 of the resistor 224. A capacitance C21 is generated between the end 206 of the third central conductor 213 and the ground electrode. Capacitance C <b> 21 is acquired by the terminal electrode 244 of the capacitor 222 and its counter electrode, and taken out by the terminal electrode 245. In addition, a resistor R by a resistor 224 is connected in parallel to the capacitance C21. Further, the end 205 of the third central conductor 213 is connected to the metal block 119.

  As described above, since the nonreciprocal circuit device of the illustrated embodiment uses the component mounting board 1 according to the present invention, the operational effects of the component mounting board 1 can be obtained as they are.

  In addition to the above-described effects, in the non-reciprocal circuit device according to the present invention, the component mounting board 1 has a flat plate shape, and the functional component 2 is mounted on one surface of the component mounting board 1. Thus, unlike the case of using a conventional magnetic metal container, the structure is simplified and the cost is reduced.

  In addition, since the functional component 2 is mounted on one surface of the component mounting substrate 1, positioning of the functional component 2 on one surface of the component mounting substrate 1 can be executed with high accuracy. Even if the functional component 2 is misaligned during mounting, it can be confirmed and corrected. Therefore, a product with stable characteristics can be manufactured with a high yield.

  Further, since the component mounting board 1 on which the functional component 2 is mounted is flat, it is smaller and thinner than a conventional magnetic metal container. Moreover, since the component mounting board 1 is a magnetic plate, it can satisfy the function as a yoke.

  Furthermore, according to the structure in which at least one surface of the component mounting substrate 1 is covered with an insulating film and the ground electrodes 110 to 116 having no insulating film are provided in the surface of the insulating film, the ground electrodes 110 to 116 are passed through. The ground electrodes of the circuit components 221 to 224 and the ground electrode of the central conductor can be directly soldered on one surface of the component mounting board 1. Parts other than the ground electrodes 110 to 116 are covered with the insulating film 11. By doing so, it is possible to avoid the occurrence of an unnecessarily active part in the component mounting board 1.

  The nonreciprocal circuit device according to the present invention is used as a component of a communication device. FIG. 21 is a communication apparatus using the nonreciprocal circuit device according to the present invention, and shows the configuration of a mobile wireless device such as a mobile phone. The illustrated communication device includes an antenna 71, a transmission circuit 75, a reception circuit 74, and a nonreciprocal circuit element 73. Reference numeral 72 is a duplexer. The transmission circuit 75 and the reception circuit 74 perform transmission / reception using the antenna 71 in common.

  The nonreciprocal circuit element 73 is according to the present invention, and is incorporated in a circuit from the duplexer 72 to the transmission circuit 75. The nonreciprocal circuit element 73 may be incorporated in a circuit that reaches the receiving circuit 74. Since the functions of the transmission circuit 75, the reception circuit 74, the nonreciprocal circuit element 73, and the duplexer 72 are well known, no particular description is required.

  However, since the non-reciprocal circuit element 73 is a non-reciprocal circuit element according to the present invention, it is obvious that the above-described operational effects can be obtained even on a communication device.

  Although the contents of the present invention have been specifically described with reference to the preferred embodiments, various modifications can be made by those skilled in the art based on the basic technical idea and teachings of the present invention. It is self-explanatory.

It is a top view which shows an example of the component mounting board | substrate which concerns on this invention. FIG. 2 is a partially enlarged plan view of the component mounting board shown in FIG. 1. FIG. 3 is an enlarged sectional view taken along line 3-3 in FIG. 1. It is a figure which shows notionally the structure of the electronic circuit apparatus which concerns on this invention. It is a top view which shows the manufacturing method of the component mounting board which concerns on this invention. FIG. 6 is an enlarged sectional view taken along line 6-6 in FIG. FIG. 7 is a diagram showing a step after the step shown in FIGS. 5 and 6. It is a figure which shows the process after the process shown in FIG. It is a figure which shows the process after the process shown in FIG. FIG. 10 is a diagram showing a step after the step shown in FIG. 9. It is a top view of the component mounting board | substrate obtained through the electrodeposition process shown in FIGS. FIG. 12 is an enlarged sectional view taken along line 12-12 of FIG. FIG. 13 is a diagram showing a step after the step shown in FIGS. 11 and 12. FIG. 14 is a diagram showing a step after the step shown in FIG. 13. It is a figure which shows the process after the process shown in FIG. It is a disassembled perspective view which shows one Embodiment of the nonreciprocal circuit device based on this invention. FIG. 17 is a perspective view showing an internal structure arrangement of the non-reciprocal circuit device shown in FIG. 16, and is a view in which the viewing direction is different from that of FIG. 16 by 180 degrees. FIG. 18 is a perspective view illustrating a completed state of the non-reciprocal circuit device illustrated in FIGS. 16 and 17. It is an expanded sectional view of the capacitor | condenser part which comprises the nonreciprocal circuit device shown in FIGS. FIG. 20 is a circuit diagram of the non-reciprocal circuit device shown in FIGS. 16 to 19. It is a block diagram of the communication apparatus using the nonreciprocal circuit device based on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting board 2 Functional component 10 Conductive base | substrate 11 Insulating film 21 Magnetic rotor 100 Recessed part 117,118 Terminal 210 Soft magnetic base | substrate

Claims (10)

A component mounting board having a conductive substrate, an insulating film, and a terminal,
The conductive substrate has a recess in its surface,
The insulating film has a window portion that exposes the surface of the conductive substrate on at least one surface of the conductive substrate, and covers the entire surface of the conductive substrate including the inner wall surface of the recess except for the window portion. And
The terminal is electrically insulated from the conductive substrate by the insulating film embedded in the recess and attached to the inner wall surface of the recess.
Component mounting board.   2. The component mounting board according to claim 1, wherein the terminal is made of a metal ball.   2. The component mounting board according to claim 1, wherein the terminal is made of a metal ball mainly composed of Cu.   4. The component mounting board according to claim 1, wherein the conductive substrate is a magnetic body.   4. The component mounting board according to claim 1, wherein the conductive base is a non-magnetic material. An electronic circuit device including a component mounting board and a functional component,
The component mounting board is described in any one of claims 1 to 5,
The functional component is bonded to the conductive base of the component mounting substrate through the window portion.
Electronic circuit device. A non-reciprocal circuit device including a component mounting board and a functional component,
The component mounting board is described in any one of claims 1 to 4, and is made of a flat magnetic material.
The functional component is mounted on one surface of the component mounting board, and at least a part thereof is joined to the conductive base of the component mounting board through the window portion.
Non-reciprocal circuit element. The nonreciprocal circuit device according to claim 7, wherein the functional component includes a magnetic rotor, a permanent magnet, and a circuit component.
The magnetic rotor has a central conductor disposed on a soft magnetic substrate,
The permanent magnet applies a DC magnetic field to the magnetic rotor,
The circuit component includes a capacitor, and the capacitor is joined to the central conductor of the magnetic rotor.   The nonreciprocal circuit device according to claim 7 or 8, comprising a cover member, wherein the cover member is made of a magnetic material, and constitutes a yoke against a magnetic field generated by the permanent magnet together with the component mounting board. Non-reciprocal circuit element. A communication device including an antenna, a transmission circuit, a reception circuit, and a nonreciprocal circuit element,
The nonreciprocal circuit device is described in any one of claims 7 to 9,
In combination with at least one of the transmission circuit or the reception circuit,
Communication device.

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