JP2008050835A - Heat insulating floor panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat insulating floor panel which can prevent warpage from being caused by a hollowed portion. <P>SOLUTION: In this heat insulating floor panel, the hollowed portion 2a is formed on the backside of a wooden flooring material 2 with a laminated structure, so that a heat insulating material can be housed in the hollowed portion 2a. A laminated structure of an unhollowed portion 2b after the formation of the hollowed portion 2a is set vertically symmetrical. Thus, since a warpage balance of the unhollowed portion 2b is maintained at the stage of the formation of the hollowed portion 2a, the warpage of the heat insulating floor panel 9A can be prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat insulating floor panel that can prevent warping caused by a dug portion.

  As shown in FIG. 5 (a), the heat insulating floor panel 1 has standardized length L (for example, 1818 mm... 6 scale), width W (for example 303 mm... 1 scale), and thickness T (for example 12 mm). As shown in FIG. 5B, the upper surface of the floor base is spread vertically and horizontally without any gap (see Patent Document 1).

  As shown in FIG. 6 (a), which is a cross-sectional view taken along the line II of FIG. 5 (a), the heat insulating floor panel 1 as described above is formed with a dug portion 2a on the back surface of the wooden flooring 2, If only the heat insulating material is stored in the digging portion 2a, it becomes a “heat insulating floor panel”, and if a sheet heating element (planar heater, cord heater, hot water pipe, etc.) and the heat insulating material are stored, "Heating panel".

As shown in FIG. 6 (b), the wooden flooring 2 is generally formed from the bottom to the top, for example, a plywood regular layer 2c, a plywood cloth layer 2d, a plywood regular layer 2c, a plywood cloth layer 2d, and a plywood regular layer 2c. In addition, a medium density fiber board (hereinafter abbreviated as MDF) 2e and a wet single plate 2f are laminated and adhered in this order.
JP 2004-245518 A

  However, when the digging portion 2a is formed on the back surface of the wooden flooring 2 having a laminated structure, as shown exaggerated below the arrow in FIG. Is likely to occur. This is because when the uppermost wet single plate 2f is bonded, the moisture of the medium density fiber board 2e, which is the lower layer, is blown off together with the wet single plate 2f in order to press at a high temperature (about 110 ° C.). This is because the internal stress that tends to shrink in the state before digging remains [see arrow a in FIG. 6 (b)].

  That is, before the dug portion 2a is dug, the medium density fiber board 2e is kept in a state of not warping by the bending rigidity of the plywood regular layer 2c and the plywood cloth layer 2d below the medium density fiber board 2e. The warpage occurs when the balance of force is lost by digging. This warp occurs both in the length direction and in the width direction of the wooden flooring 2.

  The present invention has been made to solve the above problems, and an object of the present invention is to provide a heat insulating floor panel that can prevent warping caused by a dug portion.

  In order to solve the above-mentioned problem, claim 1 of the present invention provides a heat insulating floor panel in which a dug portion is formed on the back surface of a wooden floor material having a laminated structure, and the heat insulating material is accommodated in the dug portion. It is an object of the present invention to provide a heat-insulating floor panel characterized in that the laminated structure of the unexcavated portion after forming the recessed portion is symmetrical in the vertical direction.

  According to a second aspect of the present invention, there is provided a heat insulating floor panel in which a dug portion is formed on the back surface of a wooden floor material having a laminated structure and the heat insulating material is accommodated in the dug portion, and the bottom surface of the dug portion is in accordance with the degree of moisture. It is intended to provide a heat insulating floor panel characterized in that a plate material that expands and contracts is pasted in a state where the moisture content is higher than the equilibrium moisture content.

  As in claim 3, in claim 2, a moisture-proof layer can be provided between the bottom surface of the digging portion and the plate material.

  According to a fourth aspect of the present invention, there is provided a heat insulating floor panel in which a dug portion is formed on a back surface of a wooden floor material having a laminated structure, and the heat insulating material is accommodated in the dug portion. The present invention provides a heat-insulating floor panel characterized in that a plate material that expands and contracts depending on the degree is stuck in a state where the moisture content is higher than the equilibrium moisture content.

  As in claim 5, in claims 1 to 4, the unexcavated portion is a laminated structure having at least one medium density fiber board that is a plate material that expands and contracts according to the degree of moisture. It is particularly effective.

  As in claim 6, in claim 1 to 5, a heat generating body can be arranged near the bottom surface of the digging portion to provide a heat insulation floor heating panel.

  According to claim 1, since the laminated structure of the unexcavated portion after the digging portion is formed in the wooden floor material is symmetric in the vertical direction, the warpage balance of the unexcavated portion is formed at the stage of forming the digging portion. Since it is removed, it becomes possible to prevent warping of the insulating floor panel.

  According to claim 2, after sticking the plate material which expands and contracts according to the degree of moisture on the bottom surface of the dug portion formed in the wooden floor material in a state of high moisture content, it is cured until the equilibrium moisture content is reached. Thus, the warping of the unexcavated portion is corrected by the shrinkage force accompanying the drying of the adhered plate material, so that the heat insulation floor panel can be prevented from warping.

  In addition, when a heating element is arranged between a plate material and a heat insulating material to form a heat insulating floor heating panel, it is possible to determine whether the heat insulating floor panel is warped in the state before the heating element is arranged. In addition, it is possible to reduce the occurrence loss of the heat-insulated floor heating panel due to warping.

  According to claim 3, since the moisture contained in the plate material that expands and contracts according to the degree of moisture can be prevented from penetrating from the bottom surface of the dug portion to the floor material side, the effect of correcting the warpage of the remaining dug portion is obtained. It becomes more stable.

  According to claim 4, after pasting the plate material that expands and contracts according to the degree of moisture on the back surface of the heat insulating material or the wooden floor material in a high moisture content state, this is cured until it reaches the equilibrium moisture content. Since the warp of the unexcavated portion is corrected by the shrinkage force accompanying the drying of the stuck plate material, the warp of the heat insulation floor panel can be prevented.

  Moreover, since the board | plate material stuck on the back surface of the heat insulating material or the wooden floor material also serves as the back surface material, the back surface material becomes unnecessary, so that the cost can be reduced.

  According to claim 5, the undigged portion is particularly effective when it is a laminated structure having at least one medium density fiber board (MDF), which is a plate material that expands and contracts according to the degree of moisture. It is.

  According to the sixth aspect, the heat insulating floor panel can be made into the heat insulating floor heating panel only by arranging the heating element.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings. Note that portions having the same configuration and operation as those of the background art are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIG. 1 is a cross-sectional view of a heat insulating floor heating panel 9A according to the first embodiment. The wooden flooring 2 has a plywood regular layer (first layer) 2c, a plywood cloth layer (second layer) 2d, a plywood regular layer (third layer) 2c, and a wet veneer (fourth layer) 2f from bottom to top. , MDF (5th layer) 2e, plywood regular layer (6th layer) 2c, plywood cloth layer (7th layer) 2d, plywood regular layer (8th layer) 2c, MDF (9th layer) 2e, wet veneer (10th layer) It has a laminated structure in which the layers are laminated in the order of 2f.

  And the dug part 2a formed in the back surface of the wooden flooring 2 is made from the lowermost (first) plywood regular layer 2c to the third upper plywood regular layer 2c, and the fourth wet single plate From the 2f to the uppermost (10th layer) wet veneer 2f is a left uncut portion 2b.

  Therefore, the laminated structure of the undigged portion 2b is symmetrical in the vertical direction. That is, if the 7th plywood cloth layer 2d is set as the center in the vertical direction, the 6th and 8th layers are respectively laminated with the regular plywood layer 2c, and the 5th and 9th layers are MDF2e. This is because the wet single plates 2f are respectively laminated in the fourth and tenth layers.

  A thick heat insulating material 3 is accommodated in the digging portion 2a. As the heat insulating material 3, foamed urethane, foamed polystyrene, foamed polyethylene, glass wool, vacuum heat insulating material, or the like can be used.

  Further, a planar heating element 4 is disposed between the bottom surface of the dug portion 2 a and the heat insulating material 3. Furthermore, a heat insulating space is formed on the back surface of the wooden floor material 2 by sticking the back material 5 and closing the dug portion 2a. As the back material 5, paper, wood, an aluminum sheet, or the like can be used.

  If it is the heat insulation floor heating panel 9A of 1st Embodiment, since the laminated structure of the undigging part 2b after forming the dug part 2a in the wooden flooring 2 was made symmetrical in the up-down direction, the dug part 2a was formed. At this stage, the warpage balance of the undigged portion 2b is balanced, so that the warpage of the heat insulating floor heating panel 9A can be prevented.

  In other words, when internal stress (see arrow a) to be contracted is generated in the fifth and ninth MDFs 2e, the fifth MDF 2e warps downward, and at the same time, the ninth MDF 2e faces upward. If it is set to warp, the warping in the opposite directions of the fifth and ninth layers of MDF 2e will balance, and as a result, the wooden flooring 2 will not warp, so that the insulated floor heating panel 9A warpage can be prevented.

  Drawing 2 is a sectional view of heat insulation floor heating panel 9B of a 2nd embodiment. From the bottom to the top, the wooden flooring 2 includes a plywood regular layer (first layer) 2c, a plywood cloth layer (second layer) 2d, a plywood regular layer (third layer) 2c, and a plywood cloth layer (fourth layer) 2d. A laminated structure in which a plywood regular layer (fifth layer) 2c, an MDF (sixth layer) 2e, and a wet single plate (seventh layer) 2f are laminated and adhered in this order.

  And the dug part 2a formed in the back surface of the wooden flooring 2 is from the lowermost (first) plywood regular layer 2c up to the lower half of the thickness of the fourth plywood cloth layer 2d. From the upper half of the thickness of the plywood cloth layer 2d to the uppermost (seventh layer) wet veneer 2f is an unremoved portion 2b.

  On the bottom surface of the dug portion 2a, a plate material 7 that expands and contracts according to the degree of moisture is attached in a state where the moisture content is higher than the equilibrium moisture content. MDF, plywood, wet veneer, paper, or the like can be used as the plate material 7 that expands and contracts according to the degree of moisture. As a method for increasing the moisture content of the plate material 7 (wetting method), water spray coater, water spray, steam spray, curing in a humid chamber, spraying, etc. can be used.

  Further, a thick heat insulating material 3 is accommodated in the digging portion 2a, and a planar heating element 4 is disposed between the plate material 7 that expands and contracts according to the degree of moisture and the heat insulating material 3. Furthermore, a heat insulating space is formed on the back surface of the wooden floor material 2 by sticking the back material 5 and closing the dug portion 2a.

  If it is the heat insulation floor heating panel 9B of 2nd Embodiment, after sticking the board | plate material 7 which expands / contracts according to the degree of moisture to the bottom face of the dug part 2a formed in the wooden flooring 2 in a state with high moisture content. By curing until reaching the equilibrium moisture content, the warping of the unexcavated portion 2b is corrected by the shrinkage force a accompanying the drying of the adhered plate material 7, so that the warpage of the heat insulating floor heating panel 9B can be prevented. become.

  Moreover, when arrange | positioning the heat generating body 4 between the board | plate material 7 and the heat insulating material 3 and setting it as the heat insulation floor heating panel 9B, in the state of the in-process before arrange | positioning the heat generating body 4, of the heat insulation floor heating panel 9B. Since it is possible to determine whether the warp is good or not, it is possible to reduce the occurrence loss of the heat-insulating floor heating panel 9B due to the warp.

  FIG. 3 is a cross-sectional view of a heat insulating floor heating panel 9C of the third embodiment. The laminated structure of the wooden flooring 2 is the same as that of the second embodiment. The difference from the second embodiment is that a moisture-proof layer 6 is provided between the bottom surface of the dug portion 2 a and the plate material 7. As the moisture-proof layer 6, an aluminum sheet, a resin sheet, or the like can be used.

  If it is the heat insulation floor heating panel 9C of 3rd Embodiment, in addition to the effect of 2nd Embodiment, the water | moisture content contained in the board | plate material 7 which expands-contracts according to the degree of moisture will make the moisture-proof layer 6 digging part 2a. Can be prevented from penetrating to the floor material [plywood cross layer (fourth layer) 2d, etc.] side, so that the effect of correcting the warp of the unexcavated portion 2b becomes more stable.

  FIG. 4 is a cross-sectional view of a heat insulation floor heating panel 9D of the fourth embodiment. The laminated structure of the wooden flooring 2 is the same as that of the second embodiment. The difference from the second embodiment is that a planar heating element 4 is arranged between the bottom surface of the digging portion 2a and the heat insulating material 3, and the back surface of the heat insulating material 3 is expanded and contracted according to the degree of moisture. It is the point which has stuck the board | plate material 7 to perform in the state whose moisture content is higher than an equilibrium moisture content. In addition, the board | plate material 7 can also be stuck on the back surface of the wooden flooring 2. FIG.

  If it is the heat insulation floor heating panel 9D of 4th Embodiment, after sticking the board | plate material 7 which expands / contracts according to the degree of moisture to the back surface of the heat insulating material 3 or the wooden flooring 2 in a state with a high moisture content, it will equilibrate water content. By curing until reaching the rate, the warping of the unexcavated portion 2b is corrected by the contraction force a accompanying the drying of the adhered plate material 7, so that the warpage of the heat insulating floor heating panel 9D can be prevented.

  Moreover, since the board | plate material 7 stuck on the back surface of the heat insulating material 3 or the wooden flooring material 2 also serves as the back surface material 5, the back surface material 5 becomes unnecessary, so that the cost can be reduced.

  Although each said embodiment was the heat insulation floor heating panel which has arrange | positioned the heat generating body 4 between the bottom face of the digging part 2a, and the heat insulating material 3, or between the board | plate material 7 and the heat insulating material 3, If is not arranged, the heat insulation floor heating panel can be a heat insulation floor panel.

It is sectional drawing of the heat insulation floor panel of 1st Embodiment of this invention. It is sectional drawing of the heat insulation floor panel of 2nd Embodiment of this invention. It is sectional drawing of the heat insulation floor panel of 3rd Embodiment of this invention. It is sectional drawing of the heat insulation floor panel of 4th Embodiment of this invention. It is the conventional heat insulation floor heating panel, (a) is a perspective view, (b) is a perspective view of the state laid down. (A) is the II sectional view taken on the line of FIG. 5 (a) of the conventional heat insulation floor heating panel, (b) is sectional drawing which shows the laminated structure of a wooden flooring.

Explanation of symbols

2 Wood flooring 2a Excavated portion 2b Unexcavated portion 2c Plywood regular layer 2d Plywood cloth layer 2e Medium density fiber board (MDF)
2f Wet veneer 3 Heat insulating material 4 Heating element 5 Back surface material 6 Moisture proof layer 7 Plate materials 9A to 9D which expand and contract depending on the degree of moisture Heat insulating floor heating panel (heat insulating floor panel)

Claims (6)

In the heat insulation floor panel that forms a digging portion on the back of the wooden flooring of the laminated structure and stores the heat insulating material in the digging portion,
The heat insulation floor panel characterized by the laminated structure of the unremaining digging part after forming the digging part being symmetrical in the up-down direction. In the heat insulation floor panel that forms a digging portion on the back of the wooden flooring of the laminated structure and stores the heat insulating material in the digging portion,
The heat insulation floor panel characterized by sticking the board | plate material which expands-contracts according to the degree of moisture to the bottom face of the said digging part in the state whose moisture content is higher than an equilibrium moisture content.   The heat-insulating floor panel according to claim 2, wherein a moisture-proof layer is provided between a bottom surface of the digging portion and a plate material. In the heat insulation floor panel that forms a digging portion on the back of the wooden flooring of the laminated structure and stores the heat insulating material in the digging portion,
A heat insulating floor panel, characterized in that a plate material that expands and contracts depending on the degree of moisture is attached to the back surface of the heat insulating material or the wooden floor material in a state where the moisture content is higher than the equilibrium moisture content.   The said undigged part is a laminated structure which has at least 1 medium density fiber board which is a board | plate material which expands-contracts according to the grade of moisture, The any one of Claims 1-4 characterized by the above-mentioned. Insulated floor panel as described in.   The heat-insulating floor panel according to any one of claims 1 to 5, wherein a heating element is arranged near the bottom surface of the dug portion to form a heat-insulating floor heating panel.

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