JP2008042544A - Image sensor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image sensor module in which a light source can be suitably fitted to a substrate. <P>SOLUTION: The image sensor module includes a substrate 1, the light source 2, a light guide 4, and a plurality of sensor IC chips 3. The light source 2 has a plurality of terminals 22 having portions extending at right angles to both a main scanning direction (x) and a subscanning direction (y), and a plurality of leads 7 projecting from one end of the substrate 1 in its main scanning direction (x) are fixed to the substrate 1, the terminals 22 and leads 7 being connected to each other. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an image sensor module.

  For example, a scanner is used to read the contents described in the document as image data. In many cases, an image sensor module including a light source device, a light guide, and a light receiving element is mounted on the scanner (see, for example, Patent Document 1). FIG. 19 shows an example of such an image sensor module. The image sensor module X shown in the figure includes a substrate 91, a light source device 92, and a plurality of sensor IC chips 93. The image sensor module X irradiates the original with light from the light source device 92 as linear light extending in the main scanning direction x by a light guide (not shown). The reflected light from the original is received by a plurality of sensor IC chips 93, whereby the contents described in the original are read as image data.

  The substrate 91 is made of glass epoxy resin, for example. A plurality of terminals 91 a are formed on the substrate 1. The terminal 91a is obtained by forming a metal film on the inner surface of a through hole provided in the substrate 91. The light source device 92 includes a resin package 92a that is molded. In the resin package 92a, a lead frame (not shown) and an LED chip (not shown) mounted on the lead frame are stored. Light from the LED chip is emitted to the light guide through the lens 92b. A plurality of leads 92c protrude from the resin package 92a. In order to attach the light source device 92 to the substrate 91, soldering is performed with the leads 92c inserted into the terminals 91a.

  However, the material of the substrate 91 is limited to a material that does not crack even if a hole forming operation for providing the terminal 91a is performed. For example, the substrate 91 made of glass epoxy resin is not easily cracked, but is unsuitable for dissipating heat generated during the operation of the image sensor module X to the outside of the apparatus.

JP-A-9-275469

  The present invention has been conceived under the circumstances described above, and an object of the present invention is to provide an image sensor module capable of appropriately attaching a light source device to a substrate.

  An image sensor module provided by the present invention includes a long rectangular substrate extending in the main scanning direction, a light source device, a light incident surface extending in the main scanning direction, and facing the light source device, and from the light incident surface. A light guide having a light exit surface that emits incident light as linear light extending in the main scanning direction to a reading target that is relatively moved in the sub scanning direction, and is arranged on the substrate along the main scanning direction. An image sensor module including one or more light receiving sensors for receiving reflected light from the reading object, wherein the light source device is perpendicular to both the main scanning direction and the sub-scanning direction. One or more terminals having a portion extending in the main scanning direction are fixed to the substrate, and the terminals and the leads are in contact with each other. It is characterized in that it is.

  According to such a configuration, there is no need to perform a drilling operation or the like for inserting the terminal of the light source device on the substrate. For this reason, it is possible to select from various materials without limiting the material of the substrate to a material in which cracks or the like hardly occur. The terminals and the leads can be joined in a relatively short time by, for example, soldering. Therefore, the light source device and the substrate can be easily and reliably fixed.

  In a preferred embodiment of the present invention, a straight portion is formed at an end of the lead on the substrate side, and the straight portion is soldered to the substrate. According to such a configuration, the lead can be easily fixed to the substrate.

  In a preferred embodiment of the present invention, a clip portion is formed at an end portion on the substrate side of the lead, and an end portion in the main scanning direction of the substrate is sandwiched by the clip portion. According to such a configuration, the lead can be more firmly fixed to the substrate using the clamping force of the clip portion.

  In a preferred embodiment of the present invention, a ring-shaped portion is formed at an end of the lead on the light source device side, and the terminal is inserted into the ring-shaped portion of the lead. . According to such a configuration, when the terminal and the lead are soldered, there is little possibility that the terminal is unjustly displaced.

  In a preferred embodiment of the present invention, a surface facing the main scanning direction is formed at an end of the lead on the light source device side, and the terminal is a surface facing the main scanning direction of the lead. Is joined to. According to such a structure, the said terminal can be joined easily.

  In a preferred embodiment of the present invention, the one or more leads are configured as a part of a printed wiring board having a resin base material. According to such a configuration, the position of the lead can be made more accurate.

  In a preferred embodiment of the present invention, the substrate is made of ceramics. According to such a configuration, heat generated when the image sensor module is used can be appropriately dissipated outside the apparatus.

  In a preferred embodiment of the present invention, the apparatus further includes a case for accommodating the substrate, the light source device, and the light guide, and the case includes both the main scanning direction and the sub-scanning direction. A recess opened in a direction perpendicular to the right angle is formed, and the light source device is accommodated in the recess. According to such a configuration, the light source device can be accurately positioned with respect to the case.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 and 2 show a first embodiment of an image sensor module according to the present invention. The image sensor module A1 of the present embodiment includes a substrate 1, a light source device 2, a plurality of sensor IC chips 3, a light guide 4, a lens array 5, and a case 6. As shown in FIG. 2, the image sensor module A1 reads the description content of the document Dc as image data while being relatively moved in the sub-scanning direction y with respect to the document Dc placed on the document table St, for example. It is configured as.

  The substrate 1 is made of ceramic such as alumina or aluminum nitride, and has a long rectangular shape extending in the main scanning direction x. The substrate 1 is attached to the lower end of the case 6 and is positioned with respect to the case 6. A plurality of sensor IC chips 3 are mounted on the substrate 1. A plurality of leads 7 are attached to one end of the substrate 1 in the main scanning direction x.

  As shown in FIG. 3, the light source device 2 includes a lead frame 21, three LED chips 23, a resin package 24, and a translucent member 25. The lead frame 21 is composed of a plurality of strip members made of, for example, Cu or Ni. Portions of the lead frame 21 exposed from the resin package 24 are a plurality of terminals 22. The three LED chips 23 emit red light, green light, and blue light, for example, and are bonded to the lead frame 21. As shown in FIG. 2, the three LED chips 23 are arranged in series along the emission direction of the light guide 4. As shown in FIG. 1, the resin package 24 is made of, for example, a white resin, covers a part of the lead frame 21, and surrounds the three LED chips 23. The reflection surface 24a of the resin package 24 is divergent in the main scanning direction x. Part of the light emitted from the three LED chips 23 is reflected in the main scanning direction x by the reflecting surface 24a. The translucent member 25 is made of, for example, a transparent epoxy resin and fills an area surrounded by the resin package 24. A lens 25 a is formed on the translucent member 25. The lens 25 a is for increasing the directivity of light from the three LED chips 23.

  The plurality of leads 7 are for fixing the light source device 2 to the substrate 1. FIG. 4 shows a process of manufacturing the image sensor module A1. As shown in the figure, the lead 7 is made of Cu or Ni, for example, and has a straight portion 71 and a ring-shaped portion 73. The straight portion 71 is formed at one end of the lead 7 and joined to the wiring pattern 12 of the substrate 1 by solder 8. As means for joining the straight portion 71, for example, a resin may be used instead of the solder 8. The ring-shaped part 73 is formed at the other end opposite to the straight part 71 and projects from the substrate 1 in the main scanning direction x. The terminal 22 of the light source device 2 is inserted through the ring-shaped portion 73. In this state, the terminal 22 and the inner peripheral surface 73a of the ring-shaped portion 73 are joined by the solder 8 as shown in FIG.

  6 to 8 show the process of forming and attaching the lead 7. As shown in FIG. 6, a substrate material 1A having grooves 11 is prepared, and a lead frame 7A is placed on the substrate material 1A. The groove 11 is formed, for example, by forming a plurality of non-through holes by irradiating the substrate material 1A with a laser. The lead frame 7 </ b> A has a shape in which a plurality of straight portions 71 and a ring-shaped portion 73 are connected by a frame 70. Next, the plurality of straight portions 71 are soldered to the wiring pattern 12. Next, as shown in FIG. 7, the substrate material 1A is divided by bending the substrate material 1A along the grooves 11. Further, the lead frame 7A is cut along the cutting line CL. Thus, four leads 7 can be created from the lead frame 7A as shown in FIG. The four leads 7 are attached to the substrate 1.

  The plurality of sensor IC chips 3 are semiconductor chips each having a rectangular shape in plan view, each having a light receiving portion (not shown), and is an example of a light receiving sensor referred to in the present invention. The plurality of sensor IC chips 3 are mounted on the substrate 1 along the main scanning direction x, and are arranged immediately below the lens array 5 as shown in FIG. The sensor IC chip 3 has a photoelectric conversion function and is configured to output an image signal having an output level corresponding to the amount of received light.

  The light guide 4 is a highly transparent member made of, for example, PMMA (polymethyl methacrylate). As shown in FIGS. 1 and 2, the light guide 4 has a light incident surface 4a, a light reflecting surface 4b, and a light emitting surface 4c. The light incident surface 4 a is a surface for introducing light from the light source device 2 into the light guide 4, and is constituted by one end surface of the light guide 4 in the main scanning direction x. The light incident surface 4a is mirror-finished to prevent light from the light source device 2 from being scattered. The light reflecting surface 4b is a surface for reflecting the light traveling from the light incident surface 4a along the main scanning direction x toward the light emitting surface 4c. A plurality of grooves each extending in the sub-scanning direction y are formed in the light reflecting surface 4b. The light emitting surface 4c is a surface that emits light toward the document Dc, and extends in the main scanning direction x. The light exit surface 4c has an arc shape in cross section, and exhibits a light collecting effect on a surface orthogonal to the main scanning direction x. As a result, linear light extending in the main scanning direction x is emitted from the light emitting surface 4c. As shown in FIG. 2, the light guide 4 is attached to the case 6 via a spacer 41. The spacer 41 is made of, for example, a white resin, and an internal space along the cross-sectional shape of the light guide 4 is formed. The spacer 41 exhibits a function of reflecting the light emitted from the side surface of the light guide 4 and returning it to the light guide 4 again. Further, the spacer 41 plays a role of fixing the light guide 4 to an appropriate position with respect to the case 6. Thereby, the light guide 4 is positioned in the main scanning direction x and the sub-scanning direction y.

  The lens array 5 is for focusing the light reflected by the document Dc on the plurality of sensor IC chips 3 at the same erect magnification. The lens array 5 includes a holder 51 and a plurality of lenses 52. The holder 51 has a block shape extending in the main scanning direction x, and is made of, for example, a synthetic resin. The plurality of lenses 52 are arranged along the main scanning direction x and are held by the holder 51.

  The case 6 is made of a synthetic resin and has a substantially block shape extending in the main scanning direction x. The case 6 accommodates the substrate 1, the light source device 2, the plurality of sensor IC chips 3, the light guide 4, and the lens array 5. A partition wall 61 is formed near one end of the case 6 in the main scanning direction x. An opening 61 a is formed in the partition wall 61. The opening 61 a is for allowing the light from the light source device 2 to pass through and entering the light incident surface 4 a of the light guide 4. As shown in FIG. 5, the case 6 has an opening 6a. The opening 6 a is a portion that opens in a direction perpendicular to both the main scanning direction x and the sub-scanning direction y and accommodates the light source device 2. In the present embodiment, the opening 6 a is shaped to fit with the resin package 24. Thereby, by positioning the light source device 2 in the opening 6a, the positioning of the light source device 2 with respect to the case 6 in the main scanning direction x and the sub scanning direction y is completed.

  Next, the operation of the image sensor module A1 will be described.

  According to the present embodiment, in order to attach the lead 7 to the substrate 1, it is not necessary to perform a drilling operation or the like on the substrate 1. For this reason, it is possible to prevent the substrate 1 from being unduly cracked. Further, the material of the substrate 1 is not limited to a material that does not easily cause cracks. If the substrate 1 is made of ceramic as in the present embodiment, the heat generated when the image sensor module A1 is used can be appropriately dissipated outside the apparatus. Further, the substrate 1 made of ceramic is less likely to be thermally deformed. This is advantageous in reducing the reading error of the image sensor module A1.

  Soldering with the terminal 22 inserted into the ring-shaped portion 73 of the lead 7 is convenient because it is possible to prevent the terminal 22 from being extremely separated from the ring-shaped portion 73. Moreover, since this operation can be performed relatively easily, the substrate 1 and the light source device 2 can be easily and reliably fixed. In addition, the positioning of the light source device 2 and the light guide 4 can be accurately performed by fitting the light source device 2 into the opening 6 a formed in the case 6.

  9 to 18 show another embodiment of the present invention. In these drawings, the same or similar elements as those in the above embodiment are denoted by the same reference numerals as those in the above embodiment.

  FIG. 9 shows a second embodiment of the image sensor module according to the present invention. The image sensor module A2 of this embodiment is different from the above-described embodiment in the configuration of the leads 7 and the fixing method to the substrate 1. In the present embodiment, a clip portion 72 is formed at one end of the lead 7. The clip portion 72 sandwiches the end portion of the substrate 1, so that the substrate 1 and the lead 7 are fixed.

  10 to 12 show a process of manufacturing the image sensor module A2. FIG. 10 shows an operation of attaching the lead frame 7 </ b> A to the substrate 1. The lead frame 7 </ b> A has a plurality of ring-shaped portions 73 and clip portions 72 connected by a frame 70. The lead frame 7 is attached to the substrate 1 by pushing a plurality of clip portions 72 against the substrate 1. Next, as shown in FIG. 11, the lead frame 7A is cut along the cutting line CL. Thereby, as shown in FIG. 12, four leads 7 can be created. Each of the four leads 7 is in a state where the substrate 1 is held between the clip portions 72.

Also according to such an embodiment, the light source device 2 can be easily and reliably fixed to the substrate 1. Since the light source device 2 is fixed to the substrate 1 by using the force of holding the substrate 1 by the clip portion 72, the light source device 2 can be firmly fixed to the substrate 1. In addition to the clamping force of the clip portion 72, the fixing of the lead 7 may be reinforced with solder, resin, or the like.

  FIG. 13 shows a third embodiment of the image sensor module according to the present invention. The image sensor module A3 of the present embodiment is different from any of the above-described embodiments in the configuration of the leads 7. In addition, in this figure, the light guide 4, the lens array 5, and the case 6 are omitted. In the present embodiment, a U-shaped portion 74 is formed at one end of the lead 7. The terminal 22 is soldered in a state attached to the inner side surface 74 a of the U-shaped portion 74. Such a lead 7 can be produced and fixed to the substrate 1 by a procedure similar to the procedure described with reference to FIGS. As shown in FIG. 14, after joining the lead frame 7A to the substrate material 1A, the lead frame 7A is cut along the cutting line CL so as to divide the ring-shaped portion 73. Thereby, the ring-shaped part 73 is divided | segmented and the U-shaped part 74 shown in FIG. 13 is obtained.

  When manufacturing the image sensor module A3 of the present embodiment, the light source device 2 is perpendicular to both the main scanning direction x and the sub-scanning direction y with respect to the plurality of leads 7 attached to the substrate 1. In addition to approaching from a certain direction, the light source device 2 can approach the plurality of leads 7 along the main scanning direction x. For this reason, the image sensor module A3 can be configured by using the case 6 formed so as to open the opening that fits the resin package 24 of the light source device 2 in the main scanning direction x.

  As another example of the lead used in the present invention, for example, one having a T-shaped portion formed at one end can be cited. As shown in FIG. 15, a lead frame 7 </ b> A in which a plurality of rectangular portions 75 </ b> A and a straight portion 71 are connected by a frame 70 is prepared. After cutting the lead frame 7A along the cutting line CL, each rectangular portion 75A is bent downward. Then, the lead 7 having the T-shaped portion 75 can be formed as shown in FIG. In order to join the terminal 22 to the lead 7, soldering is performed with the terminal 22 facing the side surface 75 a of the T-shaped portion 75. Even in such an embodiment, the light source device 2 can be easily and reliably fixed to the substrate 1.

  Still another example of the lead used in the present invention includes a configuration in which a plurality of leads are connected by a base material, for example. As shown in FIG. 17, in the present embodiment, a printed wiring board 7B is used. In the printed wiring board 7B, a plurality of leads 7 are formed on a base material 76 made of glass epoxy resin or polyimide resin by using a printing technique or a patterning technique. A plurality of through holes 76 a are formed in the base material 76. Each through hole 76 a coincides with the hole of the ring-shaped portion 73 of the lead 7. The plurality of leads 7 are partially covered with a resist film 77. A plurality of holes are formed in the resist film 77. The ring-shaped part 73 is exposed from these holes. Further, the straight portion 71 is exposed so as to extend from the edge of the resist film 77. The printed wiring board 7B is attached to the board material 1A using, for example, solder or conductive resin. When the substrate material 1A is divided along the groove 11 after the respective straight portions 71 and the wiring pattern 12 are bonded together, the portion where the ring-shaped portion 73 is formed protrudes from the substrate 1 as shown in FIG. Thus, the printed wiring board 7B can be attached to the board 1. Even in such an embodiment, the light source device 2 can be easily and reliably fixed to the substrate 1. In addition, the plurality of leads 7 formed on the base material 76 have an accurate positional relationship with each other.

  The image sensor module according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the image sensor module according to the present invention can be varied in design in various ways.

  The clip portion referred to in the present invention may be any clip portion suitable for sandwiching the substrate, and the specific shape thereof is not limited to the above-described embodiment. The portion of the lead 7 to which the terminal 22 is joined is not limited to the ring-shaped portion 73, the U-shaped portion 74, and the T-shaped portion 75, but has a shape suitable for soldering the terminal 22, for example. It only has to be a part.

It is principal part sectional drawing which shows 1st Embodiment of the image sensor module which concerns on this invention. It is sectional drawing which follows the II-II line | wire of FIG. It is a perspective view which shows the light source device used for 1st Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 1st Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 1st Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 1st Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 1st Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 1st Embodiment of the image sensor module which concerns on this invention. It is principal part sectional drawing which shows 2nd Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 2nd Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 2nd Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 2nd Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows 3rd Embodiment of the image sensor module which concerns on this invention. It is a principal part perspective view which shows one process of the manufacturing process of 3rd Embodiment of the image sensor module which concerns on this invention. It is a perspective view which shows one process of the manufacturing process of an example of the lead | read used for the image sensor module which concerns on this invention. It is a perspective view which shows an example of the lead | read | reed used for the image sensor module which concerns on this invention. It is a principal part perspective view which shows the other example of the lead | read used for the image sensor module which concerns on this invention. It is a principal part perspective view which shows the other example of the lead | read used for the image sensor module which concerns on this invention. It is a principal part perspective view which shows an example of the conventional image sensor module.

Explanation of symbols

A1, A2, A3 Image sensor module Dc Document St Document placement table x Main scanning direction y Sub scanning direction 1 Substrate 2 Light source device 3 Sensor IC chip (light receiving element)
4 light guide 4a light incident surface 4b light reflecting surface 4c light emitting surface 5 lens array 6 case 6a opening 7 lead 8 solder 21 lead frame 22 terminal 23 LED chip (light source)
24 Resin package 25 Translucent member 25a Lens 41 Spacer 51 Holder 52 Lens 61 Partition 71 Straight part 72 Clip part 73 Ring-like part 73a Inner peripheral surface (surface facing main scanning direction)
74 U-shaped portion 74a Inner side surface (surface facing main scanning direction)
75 T-shaped portion 75a side surface (surface facing main scanning direction)

Claims (8)

A long rectangular substrate extending in the main scanning direction;
A light source device;
A light incident surface that extends in the main scanning direction and directly faces the light source device, and a reading object that is relatively moved in the sub-scanning direction as linear light extending in the main scanning direction from the light incident surface. A light guide having a light exit surface to be emitted;
One or more light receiving sensors arranged along the main scanning direction on the substrate and receiving reflected light from the reading object;
An image sensor module comprising:
The light source device has at least one terminal having a portion extending in a direction perpendicular to both the main scanning direction and the sub-scanning direction,
One or more leads protruding from one end in the main scanning direction are fixed to the substrate,
The image sensor module, wherein the terminals and the leads are joined to each other.   The image sensor module according to claim 1, wherein a straight portion is formed at an end portion of the lead on the substrate side, and the straight portion is soldered to the substrate.   2. The image sensor module according to claim 1, wherein a clip portion is formed at an end portion on the substrate side of the lead, and an end portion in the main scanning direction of the substrate is sandwiched by the clip portion. A ring-shaped portion is formed at the end of the lead on the light source device side,
The image sensor module according to claim 1, wherein the terminal is inserted through the ring-shaped portion of the lead. A surface facing the main scanning direction is formed at the end of the lead on the light source device side,
The image sensor module according to claim 1, wherein the terminal is bonded to a surface of the lead facing the main scanning direction.   The image sensor module according to claim 1, wherein the substrate is made of ceramics.   The image sensor module according to claim 1, wherein the one or more leads are configured as a part of a printed wiring board including a resin base material. A case for accommodating the substrate, the light source device, and the light guide;
The case is formed with a recess opened in a direction perpendicular to both the main scanning direction and the sub-scanning direction,
The image sensor module according to claim 1, wherein the light source device is accommodated in the recess.

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