JP2008041408A - Discharge gap apparatus and discharge gap forming method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a discharge gap apparatus which is inexpensive, improving durability for discharging, obtaining a long service life, securing strength in a small space and not deterring downsizing of a product. <P>SOLUTION: The discharge gap apparatus connects a copper-plated wire 10 between wiring patterns 6a and 6b connected to commercial power source circuit in a wiring substrate 2 and a grounding pattern 7 and an intermediate part 12 of the copper-plated wire is cut for a specified length. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a discharge gap device and a discharge gap forming method suitable for application to a commercial power source driven electronic device such as a television receiver having an antenna and connected to a commercial power line, and more particularly, to a lightning strike. The present invention relates to a technology that bypasses the high voltage caused by the above and prevents the destruction of the electronic device.

  Generally, in an electronic device driven by a commercial power source such as a television receiver or a video device that has an antenna and is connected to a commercial power line, some protection measures may be required due to lightning strikes on the antenna. For example, as an electronic device such as a television receiver, a configuration including a discharge gap device is known that bypasses a high voltage caused by a lightning strike by the discharge gap device. By providing such a discharge gap device, it is possible to prevent the electronic device from being destroyed by being bypassed by the discharge gap device when a high voltage due to lightning strikes inside the electronic device.

  FIG. 3 is a diagram illustrating an example of an electronic device driven by a commercial power source including the discharge gap device. In this example, a television receiver is assumed as the electronic device. In FIG. 3, reference numeral 1 denotes a power plug connected to a commercial power source, which is connected to an outlet (not shown) from which, for example, a 100V commercial AC power source is obtained. One end and the other end of the power plug 1 from which this commercial AC power is obtained are connected to the input side of an AC-DC converter 3 that converts AC voltage into DC voltage via the commercial power lines 1a and 1b of the wiring board 2. To do. In the AC-DC converter 3, for example, a commercial AC power supply such as 100V is converted into a DC low-voltage power supply.

  A DC voltage obtained on the output side of the AC-DC converter 3 is supplied to the electronic device main body 4, and the electronic device main body 4 is operated by this DC voltage (DC power supply). Further, a ground terminal 4a which is a ground potential portion of the electronic device body 4 is connected to a ground 5 which is insulated from the commercial power supply side.

  In FIG. 3, 6a and 6b are connected to the commercial power lines 1a and 1b of the wiring board 2, respectively, and show wiring patterns on the wiring board 2 drawn from the commercial power lines 1a and 1b. Reference numeral 7 denotes a ground pattern on the wiring board 2 connected to the ground 5. An antenna 9 is connected to the electronic device main body 4 that is a television receiver via an antenna line.

  In such a configuration, a discharge gap device that bypasses a high voltage caused by a lightning strike is provided between the wiring pattern 6 a and the ground pattern 7 and between the wiring pattern 6 b and the ground pattern 7.

  FIG. 6 shows an example of a conventional discharge gap device. In this example, as shown in FIG. 6, the discharge electrodes 8 a and 8 b of the copper foil wiring pattern on the wiring substrate 2 are arranged separated by a predetermined distance to form the discharge gap 8. In this case, the discharge electrodes 8a and 8b made of copper foil are shaped so as to protrude from each other, and by removing the insulating layer 9 covering the discharge electrodes 8a and 8b of the copper foil, discharge is facilitated. The solder is attached to the tip portions of the discharge electrodes 8a and 8b to increase the strength. The discharge gap device configured as described above is provided, for example, between the wiring pattern 6 a and the ground pattern 7 shown in FIG. 3 and also between the wiring pattern 6 b and the ground pattern 7.

  As another example of the discharge gap, Patent Document 1 includes a pair of discharge electrodes arranged in a line symmetry with a parallel discharge gap at a predetermined interval, and fixed to the outside of each of the discharge electrodes. There is disclosed a surge absorber that has an open lead leg, surrounds an opening in which a discharge gap is formed, and covers both sides of the discharge electrode with an insulating mold up to the base end of the lead leg.

FIG. 7 shows an example of a surge absorber as a discharge gap described in Patent Document 1. In FIG. The surge absorber 90 shown in FIG. 7 is synthesized so that a pair of metal plate-like discharge electrodes 91 and 91 sandwiching parallel discharge gaps with a predetermined gap g and maintaining the discharge electrodes 91 and 91 at a predetermined gap g. Legs 93 and 93 for lead wires are integrally provided at one end of the mold part 92 and the discharge electrodes 91 and 91 molded with resin or the like, respectively. Reference numeral 94 denotes an opening at the center of the mold portion 92, and the gap side of the discharge electrodes 91 and 91 is exposed from the mold portion 92.
JP-A-7-95728

  However, in the conventional discharge gap apparatus as shown in FIG. 6, the thickness of the copper foil constituting the discharge electrodes 8a and 8b is as thin as about 35 μm, for example, and when a discharge occurs between the discharge electrodes 8a and 8b, With this current, the discharge electrodes 8a and 8b were melted, and the discharge gap device was significantly deteriorated.

  Therefore, in order to suppress such deterioration, there is a method of increasing the strength by attaching solder to the tips of the discharge electrodes 8a and 8b shown in FIG. However, even if the solder is attached in this manner, the amount of solder attached is about several hundreds of micrometers, and it is difficult to completely suppress deterioration during discharge.

  Furthermore, in order to suppress this deterioration, there is also a method of increasing the strength by increasing the width of the opposing discharge electrodes 8a and 8b shown in FIG. However, this hinders downsizing of the product, and since the discharge gap device of FIG. 6 uses the wiring pattern of the wiring board 2, this discharge is performed unless the wiring board 2 is replaced with a new one. There is a disadvantage that the deterioration of the electrodes 8a and 8b cannot be regenerated.

  Further, as shown in Patent Document 1, when the surge absorbing device of the example of FIG. 7 is used, the discharge electrode 91 and the mold part 92 having a complicated shape are required. .

Furthermore, in the discharge gap device using the copper foil provided on the wiring board as shown in FIG. 4 as a conductor, the interval between the conductors is limited to a unique value when the wiring board is created, and the interval is changed later. It was difficult to adjust the discharge characteristics by adjusting.
Similarly, in the case of the surge absorbing device described in Patent Document 1 shown in FIG. 5, the discharge characteristics are determined by the shape of the surge absorbing device, and adjustment is made so that the gap interval is widened or conversely narrowed later. It was difficult to do.

  SUMMARY OF THE INVENTION In view of the above, the present invention provides a discharge gap device attached to an electronic device at a low cost, improving durability against discharge, extending its life, and ensuring strength in a small space. In order to prevent the downsizing of the product.

  The discharge gap device of the present invention has a configuration in which one end of a copper plated wire is connected to a wiring pattern connected to a commercial power supply line of a wiring board, and the other end of the copper plated wire is connected to a ground pattern. And the intermediate part of the copper plating wire connected to this commercial power line is cut by predetermined length, and the cut part is constituted as a gap.

  The discharge gap forming method of the present invention includes a copper plated wire connecting step of connecting one end of a copper plated wire to a wiring pattern connected to a commercial power line of a wiring board and connecting the other end of the copper plated wire to a ground pattern. Do. Furthermore, the cutting process which cuts the intermediate part of the copper plating line connected by the copper plating line connection process by predetermined length is performed.

  According to the present invention, the copper plating wire is connected between the wiring pattern connected to the commercial power supply line of the wiring board and the ground pattern, and the intermediate portion of the copper plating wire is simply cut to a predetermined length. It can be simple and inexpensive, can secure strength in a small space, and does not hinder downsizing of the product.

  According to the present invention, increasing the cross-sectional area of the copper-plated wire can be easily dealt with by selecting the copper-plated wire to be connected. By increasing the cross-sectional area, the durability against discharge can be improved, and the discharge gap can be improved. The life of the device can be extended.

  In addition, when it deteriorates as a discharge gap device, a new discharge is performed by removing the solder connecting the wiring pattern and ground pattern and the copper plating wire and soldering another copper plating wire. It can be reproduced as a gap device and can be easily reproduced.

  Furthermore, it is possible to freely select an arbitrary gap length by setting the length of the copper-plated wire attached to the wiring board and the length to be cut, and it is possible to easily cope with various standards.

  Hereinafter, an example of the best mode for carrying out the discharge gap device and the discharge gap forming method of the present invention will be described with reference to FIGS.

  In this example, the present invention is applied to the electronic apparatus as shown in FIG. That is, as shown in FIG. 3, one end and the other end of the power plug 1 connected to a commercial power source such as AC 100V are connected to a DC voltage via the commercial power lines 1a and 1b of the wiring board 2. Connected to the input side of the AC-DC converter 3 to be converted. A DC voltage obtained on the output side of the AC-DC converter 3 is supplied to the electronic device main body 4, and the electronic device main body 4 is operated with this DC voltage (DC power supply). The electronic device body 4 is a television receiver, for example, and is connected to an antenna 9 for receiving broadcast signals. Further, a ground terminal 4a which is a ground potential portion of the electronic device body 4 is connected to a ground 5 which is insulated from the commercial power supply side.

  And between one wiring pattern 6a connected to one commercial power supply line 1a on the wiring board 2 and the ground pattern 7 connected to the ground 5 insulated from the commercial power supply, it is shown in FIG. 1A. Thus, the copper plating wire 10 is connected. Further, another copper-plated wire 10 is connected between the other wiring pattern 6 b connected to the other commercial power line 1 b on the wiring board 2 and the ground pattern 7 connected to the ground 5. In FIG. 1A, only one copper-plated wire 10 is shown, but the two copper-plated wires have the same configuration.

  In this example, in this case, one end side 10a and the other end side 10b of one copper plated wire 10 are bent at substantially right angles, respectively, and the one end side 10a and the other end side 10b of the copper plated wire 10 are respectively connected to the wiring board. 2 penetrates the through hole formed in the wiring substrate 2 from one side surface, and the wiring pattern 6a (6b) and the ground pattern 7 formed on the other side surface of the wiring substrate 2 are connected to one end of the copper plated wire 10 The side 10a and the other end 10b are electrically connected and fixed by solder 11.

  In this example, next, as shown in FIG. 1A, the space between the arrows 12a and 12b corresponding to the discharge gap 12 at the intermediate portion of the connected and fixed copper-plated wire 10 is cut as shown in FIG. 1B. This portion is the discharge gap 12, and one end and the other end of the cut portion of the copper plated wire 10 are the discharge electrodes 10c and 10d.

  In this case, the durability (strength) due to the discharge of the discharge electrodes 10c and 10d of the copper-plated wire 10 is determined by the thickness (diameter Φ) of the copper-plated wire 10, and in this example, the copper-plated wire 10 The thickness (diameter Φ) can be arbitrarily selected, and it is easy to comply with various standards.

  According to this example, when there is a lightning strike and a high voltage is supplied from the power plug 1, a discharge occurs between the discharge electrodes 10c and 10d of the copper plated wire 10, and this high voltage is bypassed. This prevents a high voltage from entering the electronic device body 4 and destroying the electronic device body 4.

  In this example, since the discharge electrodes 10c and 10d are formed by the copper plating wire 10 as described above, the cross-sectional area of the discharge portions of the discharge electrodes 10c and 10d can be easily increased, and the durability against discharge is increased. It is possible to improve the service life.

  Moreover, according to this example, the cross-sectional area of the discharge part of the discharge electrodes 10c and 10d can be arbitrarily selected by the thickness (diameter Φ) of the copper-plated wire 10, so that various standards can be supported. Easy.

  Also, according to this example, when the discharge electrodes 10c and 10d are formed by the copper plating wire 10, the necessary cross-sectional area can be reduced in a small space, compared with the case where the discharge electrodes 8a and 8b are formed by the conventional copper foil. This can be ensured and does not hinder downsizing of the electronic device.

  Further, in this example, when the discharge electrodes 10c and 10d are deteriorated, they can be replaced and easily reproduced by removing the solder connection between the wiring pattern 6a (6b) and the ground pattern 7 of the copper plated wire 10. Can do.

  In addition, according to this example, the length of the discharge gap 12 can be freely selected according to the cut length of the intermediate portion of the copper-plated wire 10, and it is easy to comply with various standards.

  Furthermore, according to this example, the copper plating wire 10 is connected between the wiring patterns 6 a and 6 b connected to the commercial power supply lines 1 a and 1 b of the wiring substrate 2 and the ground pattern 7, and the middle of the copper plating wire 10. Since the portion is only cut by a predetermined length, this discharge gap device has a simple configuration and can be obtained at low cost.

  FIG. 2 shows another example of the best mode for carrying out the present invention. 2 will be described with the same reference numerals assigned to the portions corresponding to those in FIG.

  When one end side 10a and the other end side 10b of the copper plated wire 10 forming the discharge electrodes 10c and 10d are inserted and attached from one side of the wiring board 2 by an automatic insertion machine, as shown in FIG. 2A, One end side 10a and the other end side 10b of the copper-plated wire 10 are bent and attached to each other in order to prevent the other side of the wiring board 2 from falling off.

  In the example of FIG. 2, the opposite ends of one end side 10a and the other end side 10b of the copper plated wire 10 are discharge electrodes 10c and 10d, and a discharge gap 12 is formed between the discharge electrodes 10c and 10d. As shown in FIG. 2B, an intermediate portion of the copper plated wire 10 is cut between the arrows 13a and 13b. The cut length of the cut portion 13 (between the arrows 13a and 13b) is larger than the length of the discharge gap 12. It is a thing.

In the example of FIG. 2, the rest is configured in the same manner as in the example of FIG.
It can be easily understood that the same operational effects as in FIG. 1 can be obtained in this FIG. 2 example.

  4 and 5 show still another example of the best mode for carrying out the present invention. 4 and 5, parts corresponding to those in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

FIG. 4 shows an example of the overall configuration of the electronic apparatus of this example. In the case of this example, an electrical component is connected in parallel with the discharge gap as an EMC (Electro-Magnetic Compatibility) countermeasure.
That is, as shown in FIG. 4, one wiring pattern 6a connected to one commercial power line 1a on the wiring board 2 and a ground pattern 7 connected to a ground 5 that is insulated from the commercial power source. In addition, a discharge gap is formed between the other wiring pattern 6b connected to the other commercial power supply line 1b on the wiring substrate 2 and the ground pattern 7 connected to the ground 5. 3 is the same as the configuration of FIG.

  In this example, a resistor 20 and a capacitor 30 are connected in parallel between the other wiring pattern 6 b and the ground pattern 7 connected to the ground 5 as EMC countermeasure components.

  FIG. 5 shows an example in which a discharge gap is formed at the connection portion of the resistor 20. In the resistor 20, a copper plated wire 21 as a lead wire is connected to one end and the other end of a resistor main body 20a, and the tips of the two lead wires 21 are connected to a wiring board as shown in FIG. 2 is inserted into the through hole provided in the wiring pattern 6 b placement portion and the through hole provided in the ground pattern 7.

  Then, the insertion portions into the respective through holes are soldered and fixed with solder 11 as shown in FIG. 5 and are also electrically connected. Then, the lead wire 21 protruding from the through hole is bent inward by the bent portions 21a and 21b, and the tip portions 21c and 21d are opposed to each other in a state of being close to each other at a predetermined interval. With this configuration, the discharge gap 22 is formed between the tip portions 21c and 21d.

  In FIG. 5, the lead wire of the resistor 20 is used as an example, but the lead wire connecting the capacitor 30 may be similarly processed to form a discharge gap. Or you may make it form a discharge gap in both the connection part of the resistor 20, and the connection part of the capacitor | condenser 30. FIG.

Thus, by simply bending the tip of the lead wire of the element prepared as a part for EMC countermeasures, a discharge gap portion similar to the other examples described above is formed, and without preparing a dedicated copper plated wire Thus, the discharge gap portion can be configured more easily.
In the case of the examples of FIGS. 4 and 5, since the discharge gap is simultaneously formed at the mounting part of the EMC countermeasure parts on the wiring board, the installation space can be saved and the wiring board can be made compact. Can be configured.

  The present invention is not limited to the examples described in the above-described embodiments, and various other configurations can be adopted without departing from the gist of the present invention. For example, in the above-described embodiment, the discharge gap device is applied to the power supply unit of the television receiver to which the antenna is connected. However, the discharge gap device may be applied to other electronic devices that require the discharge gap device. Of course.

FIG. 1A is a cross-sectional view showing a state before cutting, and FIG. 1B is a cross-sectional view showing a state after cutting, illustrating an example of the best mode for carrying out the discharge gap device of the present invention. . 2A is a cross-sectional view showing another example of the best mode for carrying out the discharge gap apparatus of the present invention, FIG. 2A is a cross-sectional view showing a state before cutting, and FIG. 2B is a cross-sectional view showing a state after cutting It is. It is a block diagram which shows an example of an electronic device structure provided with the discharge gap apparatus. It is a block diagram which shows the other example of an electronic device structure provided with the discharge gap apparatus. It is sectional drawing which shows the further another example of the best form for implementing the discharge gap apparatus of this invention. It is a top view which shows the example of the conventional discharge gap apparatus. It is a perspective view which shows another example of the conventional discharge gap apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Power plug, 1a, 1b ... Commercial power supply line, 2 ... Wiring board, 3 ... AC-DC converter, 4 ... Electronic equipment main body, 4a ... Grounding terminal, 5 ... Ground, 6a, 6b ... Wiring pattern, 7 ... Ground pattern, 8 ... discharge gap, 9 ... antenna, 10 ... copper plated wire, 10a ... one end of copper plated wire, 10b ... other end of copper plated wire, 10c, 10d ... discharge electrode, 11 ... solder, 12 ... discharge gap 12a, 12b ... cutting position, 13a, 13b ... cutting position, 20 ... resistor, 21 ... copper plated wire (lead wire), 21a, 21b ... bent part, 21c, 21d ... tip part, 22 ... discharge gap, 30 ... Capacitor, 90 ... Surge absorber, 91 ... Discharge electrode, 92 ... Mold part, 93 ... Leg for lead wire, 94 ... Opening at the center of the mold part

Claims (6)

A copper-plated wire is connected between a wiring pattern connected to a commercial power line of the wiring board and a ground pattern, and a cut portion is provided with an intermediate portion of the copper-plated wire spaced apart by a predetermined length. Discharge gap device. The discharge gap device according to claim 1, wherein
A discharge gap device, wherein a cut portion of a predetermined length of the copper plated wire is used as a discharge gap. The discharge gap device according to claim 1, wherein
A discharge gap device characterized in that both ends of the copper-plated wire penetrate the wiring board and are bent inward from each other to form a discharge gap between both ends. The discharge gap device according to claim 1, wherein
A discharge gap device characterized in that a cross-sectional area of a discharge electrode can be selected according to a diameter of the copper plating wire. The discharge gap device according to claim 1, wherein
The copper plated wire is a lead wire of a circuit component connected in parallel with the discharge gap, and the discharge gap is formed by making one end and the other end of the lead wire face each other with a predetermined length. Discharge gap device. A copper-plated wire connecting step of connecting a copper-plated wire between the wiring pattern connected to the commercial power line of the wiring board and the ground pattern;
A discharge gap forming method comprising: a cutting step of cutting an intermediate portion of the copper-plated wire by a predetermined length.

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