JP2008016105A - Optical disk and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical disk to which a non-contact IC chip is mounted, and which is manufactured in a simplified manufacturing process and high in substrate strength. <P>SOLUTION: Recessed parts 14 and 15 for storing RFID (Radio Frequency Identification) tags are formed concentrically with a center hole 13 at the same depths in disk substrates 11 and 12, respectively. The recessed part 14 of the disk substrate 11 is formed in a clamp region between the center hole 13 and a signal recording region slightly apart from the center hole 13. The recessed part 15 of the disk substrate 12 is formed in a position corresponding to the sticking surface of the disk substrate 11. After the disk substrates 11 and 12 are stuck, a space left between the recessed parts 14 and 15 and the RFID tag is filled with a filler injected from an aperture 16 to complete the optical disk. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical disc on which an RFID (Radio Frequency Identification) tag, which is an IC (Integrated Circuit) chip capable of non-contact and exchange of information with the outside, is mounted by bonding two disc substrates together, and the same More particularly, the present invention relates to an optical disc in which a recess is provided in each of two disc substrates and an RFID tag is accommodated therein, and a method for producing the same.

  In recent years, DVD (Digital Versatile Disk) has been widely used as an optical disk medium capable of recording large-capacity data such as video. Recently, the development of an optical disc using a blue semiconductor laser as a light source has been promoted for the purpose of recording images with higher image quality and longer time. As one type, Blu-ray Disc (Sony shares) has already been developed. A registered trademark of the company (hereinafter abbreviated as BD) is commercialized.

  As described above, as high-quality digital content can be easily stored in a portable recording medium, the importance of protecting the copyright of the digital content is increasing. In a BD ROM (Read Only Memory) disc, a unique ID for each disc is recorded as a barcode pattern on the innermost periphery of a signal recording area called BCA (Burst Cutting Area), and this ID is read by the player. Thus, it is possible to manage so that an illegal disc is not reproduced. However, technology for creating illegal discs is becoming more sophisticated year by year, and it is said that more robust copyright protection measures are required.

  On the other hand, in recent years, RFID tags equipped with antennas capable of exchanging information with the outside without contact have come to be used for admission cards, traffic tickets, electronic money, and the like. An RFID tag receives a radio wave or magnetic field from a reader / writer (R / W) with an antenna and converts it into an electromotive force. Therefore, the RFID tag does not have a built-in battery, is lightweight, has excellent portability, and can be used semipermanently. It has the characteristics. In addition to this, there is a feature that replication is very difficult.

  From such a background, it is considered that an RFID tag is mounted on an optical disc to strengthen copyright protection measures. For example, by mounting an RFID tag having a disc ID recorded in a read-only state on an optical disc, the risk of duplicating an optical disc having the same disc ID is greatly reduced as compared to the case where the above BCA pattern is used. Can do.

  Furthermore, when there is a margin in the storage capacity of the RFID tag, it is possible to store an application that provides a benefit to the user in the remaining storage area and generate a new added value to the optical disc. For example, an RFID tag is provided on a ROM-type optical disc in which game software is stored, and the state of the game is stored in the RFID tag, or the recorded contents in the optical disc are recorded on the RFID tag and the optical disc is stored in the player. For example, it is possible to know the recorded contents by simply holding it over the R / W without inserting it.

  By the way, in the case of an optical disc equipped with an RFID tag, it is necessary to form an antenna for wireless communication and power supply on the optical disc. A plurality of frequency bands are considered for wireless communication of the RFID tag, and the length and shape of the antenna differ depending on the frequency band. Generally, a coiled antenna is used in the long wave band (125 to 135 kHz) and the short wave band (13.56 MHz), and a half wavelength is used from the UHF (Ultra High Frequency) band (near 900 MHz) to the microwave band (2.45 GHz). A linear antenna (dipole antenna) or a planar antenna (microstrip antenna) having a length corresponding to is used.

  Since an optical disk is a disk that rotates around a center hole (center hole), it is compatible with a loop or spiral antenna from the viewpoint of weight balance. For this reason, there have been many cases in which a loop-shaped or spiral-shaped antenna pattern has been formed on the inner side (clamp region) or the back side of the signal recording region further than the signal recording region on the optical disk.

FIG. 28 is a diagram showing a configuration for mounting an RFID tag on a conventional optical disc.
Here, as an example, an optical disc in which two disc substrates 101 and 102 are bonded together and an RFID tag can be mounted on the inner circumference side of the disc will be described. In the optical disc, a central hole (center hole) 110 is formed at the center of each of the disc substrates 101 and 102, and a concave portion 120 for accommodating an RFID tag is formed concentrically with the central hole 110 in one disc substrate 101. Is done. Each of the disk substrates 101 and 102 is coated with a UV curable resin (UV resin) or the like on the bonding surface to complete the optical disk. At this time, a signal recording portion provided with a reflective film is formed between the center hole 110 and the outermost peripheral portion of each disk substrate 101, 102, and the concave portion 120 is an inner side where the reflective film of the signal recording portion is not formed. Provided in the clamping region.

  By the way, since the thickness of the optical disk is limited to about 1.2 mm, even if the recess 120 for inserting the IC chip is formed therein, if the groove is formed only on the disk substrate 101 on one side, the recess 120 is formed. The disc thickness is reduced at the base of the disk. For this reason, the disk substrate 101 not only has insufficient strength but also has a problem that it is difficult to form a signal recording portion flat by resin injection molding.

Therefore, after forming a recess in each of the two disk substrates, an IC chip and its transmitting / receiving antenna are integrated into a gap formed between the recesses when the disk substrates are bonded together. Arrangement is considered (see, for example, Patent Document 1).
JP 09-245381 A (paragraph numbers [0011] to [0014], FIG. 1)

  In the case of the optical disk as described in the above-mentioned Patent Document 1, IC chips having greatly different chip sizes and thicknesses are formed by forming recesses of the same size on the bonding surfaces of the two disk substrates. Even when an RFID tag equipped with is mounted, it is possible to avoid the complexity of manufacturing the disk substrate, such as forming grooves of different sizes for each IC chip.

  However, when a concave portion is formed on each of the disk substrates to be bonded, the strength of the optical disk decreases at that portion. Therefore, when the optical disk is fixed and held by the recording / reproducing apparatus, the optical disk is clamped by the center hole and rotates, so that there is a problem that the risk of being destroyed is increased if a large force is applied thereto.

  In addition, when two disk substrates are bonded to each other with a UV resin, a method of applying a thin UV resin by a technique such as spin coating is generally used. However, stripes and unevenness are likely to occur in the coating layer of the UV resin due to the influence of the grooves formed on the bonding surface of the disk substrate. In particular, in the case of an optical disc having a structure in which a recording layer exists on the bonding surface side of two disc substrates and a signal of one recording layer is read through a transparent disc substrate and an adhesive layer, such as a single-sided dual-layer DVD, There has been a problem in that the optical characteristics are deteriorated.

  Furthermore, the mold used when the disk substrate is injection-molded with a resin is provided with a convex part for forming a concave part for chip mounting. Due to such a convex part, the resin flow during the injection molding is not uniform. As a result, the optical characteristics of the optical disk may be deteriorated.

  The present invention has been made in view of these points, and an object thereof is to provide a non-contact type IC chip-mounted optical disc and a method for manufacturing the same, in which the manufacturing process is simplified and the substrate strength is increased. To do.

  In the present invention, in order to solve the above problem, in an optical disk having a structure in which two disk substrates are bonded together, an IC chip and an antenna for the IC chip to communicate with the outside in a non-contact manner are mounted. A recess for accommodating the antenna and the IC chip is formed at a corresponding position on each bonding surface of the disk substrate, and the space generated in the recess is filled with the antenna and the IC chip. An optical disc characterized by being embedded by is provided.

  In such an optical disc, a recess is formed in the inner periphery of each of the two disc substrates of the optical disc, and an IC chip and an antenna are housed in the recess. In addition, the two disk substrates are bonded together, and the space generated there is filled with a filler. With such a structure, it becomes possible to increase the thickness of the bottom surface of each concave portion of the two disk substrates, and the strength of that portion is increased.

  In addition, for example, by forming the recess so that the inner wall surface of the recess is connected to at least the bonding surface on the outer peripheral side of the disk substrate by a curved surface, deterioration of optical characteristics at the time of injection molding of the disk substrate, or UV resin The unevenness of the UV resin coating at the time of spin coating can be eliminated, and the optical characteristics of the optical disk can be secured.

  According to the present invention, since the bottom surface of the recess can be formed thick, the substrate strength of the optical disk on which the IC chip is mounted can be increased. At the same time, whatever sizes of IC chip and antenna are used, IC chips and antennas of various sizes and shapes from the same disk substrate, as long as they fit within the recesses formed in the disk substrate. Can be manufactured, and the manufacturing process can be simplified.

Embodiments of the present invention will be described below with reference to the drawings. In the following embodiments, a DVD is assumed as an example of an optical disk.
[First Embodiment]
FIG. 1 is a diagram showing a disk substrate constituting the optical disk according to the first embodiment.

  As shown in FIG. 1, the optical disk is configured by bonding two disk substrates 11 and 12 made of resin having the same thickness of 0.6 mm. A central hole (center hole) 13 is provided in the center of each of the disk substrates 11 and 12, and an RFID tag is mounted between the disk substrates 11 and 12. A reflective film (not shown) made of a material such as silver (Ag) or aluminum (Al) is formed in a region outside the center hole 13 of the disk substrates 11 and 12 by a predetermined distance, and this region is a signal. It is a recording area. In the case of a single-sided recording type optical disk, the reflective film is formed only on one of the disk substrates 11 and 12.

  Each disk substrate 11, 12 is formed with recesses 14, 15 for accommodating RFID tags concentrically with the center hole 13. As shown in the lower part of FIG. 1, the concave portion 14 of the disk substrate 11 is formed in the clamping region between the central hole 13 and the signal recording region, and is slightly separated from the central hole 13. Further, the recess 15 of the disk substrate 12 is formed at a position corresponding to the bonding surface of the disk substrate 11. These recesses 14 and 15 have the same depth, and are set so as to form a space in which any of various RFID tags mounted on the optical disk can be stored.

FIG. 2 is a diagram showing an optical disc on which an RFID tag is mounted.
As shown in FIG. 2, an RFID chip having an IC chip 20a having a non-contact communication function and a spiral antenna pattern 20b is integrated into an IC chip module 20 on a PET (Poly Ethylene Terephthalate) substrate 20c. Prepared as. Such an IC chip module 20 differs greatly in chip size and thickness depending on the size of the memory mounted on the IC chip 20a and the presence or absence of a cryptographic processing function. Therefore, it is necessary to form grooves (that is, recesses 14 and 15) with a size and depth corresponding to the IC chip 20a in the disk substrates 11 and 12 for housing the IC chip module 20.

  Here, the optical disk of FIG. 1 is characterized in that one of the recesses 14 and 15 of each disk substrate 11 and 12 communicates with the surface opposite to the bonding surface of the disk substrate 11 to provide three The through-hole 16 is formed. These through holes 16 are spaced apart from each other with an equal central angle on the disk substrate 11, and are all disposed in the recess 14 at positions away from the center hole 13 in the outer circumferential direction. Then, after storing RFID tags capable of exchanging information in a non-contact manner in these recesses 14 and 15 and attaching the disk substrates 11 and 12 with an adhesive layer (not shown) interposed therebetween, the recesses 14 and 15 and the RFID tag The space left between is filled with a filler injected from the through hole 16 to complete the optical disc.

  In the optical disk described above, even when the size or the like of the IC chip module 20 mounted in the space of the recesses 14 and 15 changes depending on the circuit configuration and chip arrangement, the IC chip module is interposed between the same disk substrates 11 and 12. 20 can be mounted. That is, by forming spaces of the same depth on the two disk substrates 11 and 12, respectively, it is possible to secure a space for mounting the IC chip module 20 without making one of them extremely thin, Compared with the case where the groove is formed only on one side of the substrate, the base portions of the recesses 14 and 15 of the disk substrates 11 and 12 can be made thick, so that the strength of the optical disk is increased. Moreover, since the volume of the IC chip mounting space can be made larger than the conventional one in which the concave portion is formed only on either of the disk substrates 11 and 12, it is easy to incorporate a module on which a thick IC chip is mounted. It becomes.

Next, a procedure for producing such an optical disc will be described.
3 to 6 are process explanatory diagrams for manufacturing an optical disk using the disk substrate of FIG. In these process explanatory diagrams, only the circular portion A of FIG. 1 is shown enlarged.

  First, two types of disk substrates 11 and 12 are formed by injection molding. In the vicinity of the center hole 13 of the disk substrates 11 and 12, recesses 14 and 15 are formed concentrically with the center hole 13 on the bonding surface, respectively, and when the bonding surfaces face each other, a predetermined space is formed. (FIG. 3A). It is assumed that a recording film, a protective film, and a conductor reflection film (not shown) have already been formed in the signal recording areas of the disk substrates 11 and 12.

  Next, an adhesive UV resin 17 is applied to the bonding surface of the disk substrate 12 that does not have the through holes 16 with a predetermined thickness. The UV resin 17 is applied by spin coating from the center hole 13 side of the optical disc to the outer peripheral side of the disc. At this time, the UV resin 17 is simultaneously applied to the bottom surface of the recess 15 for housing the RFID tag with the same thickness (FIG. 3B).

  Next, the IC chip module 20 is attached to the bottom surface of the recess 15 of the disk substrate 12 (FIG. 4A). Thereafter, the disk substrate 11 is aligned from above the disk substrate 12 and bonded by the applied UV resin 17. Then, the UV resin 17 is cured as an adhesive layer by irradiating ultraviolet rays from the front side of the disk substrate 12 (FIG. 4B). In this state, a space remains in the recesses 14 and 15 in which the IC chip module 20 is accommodated.

  Next, a solution-like UV resin 18 is injected from any two of the three through holes 16 into the space in which the IC chip module 20 is accommodated (FIG. 5A). At this time, not only the solution UV resin 18 but also resin beads such as polycarbonate resin and PET, or flakes may be injected. Further, holes other than the two through holes 16 serving as the injection holes become the air discharge through holes 16, but the UV resin 18 continues to inject the resin from the respective through holes 16 until the resin rises due to the surface tension ( FIG. 5 (B)). These are later cured and function as stack ribs of the optical disc at a position close to the signal recording area.

  The stack rib is for avoiding the signal recording surface of the disk substrate from coming into contact with another disk when temporarily storing a plurality of disk substrates stacked on a stocker or the like in the manufacturing process of the optical disk. is there.

  Finally, as shown in FIG. 6, the UV resin 18 filled in the recesses 14 and 15 is cured by irradiating ultraviolet rays from both sides of the optical disk. As a result, not only the IC chip module 20 is fixed in the recesses 14 and 15 but also the hardened resin layer 19 fills the space inside the optical disk generated between the IC chip module 20 and the optical disk of the optical disk. Strength can be secured.

  In the above optical disk, even when the size or the like of the IC chip module 20 to be mounted changes depending on the circuit configuration or chip arrangement, the disk substrates 11 and 12 having the concave portions 14 and 15 having the same shape are prepared. The IC chip module 20 can be mounted between them. Therefore, there is an advantage that the optical disk manufacturing process can be simplified.

[Second Embodiment]
In the first embodiment, the disk substrate 12 is prepared, and the adhesive UV resin 17 is applied to the bottom surface and the bonding surface of the concave portion 15 at the same time. In this case, if the volume occupied by the IC chip module 20 mounted in the recess 15 is small, a large amount of filler to be injected later is required, and a long time is required for the filling.

Therefore, it is conceivable to separate the process of attaching the IC chip module 20 to the bottom surface of the recess 15 and the process of attaching the disk substrates 11 and 12 together.
FIG. 7 is a diagram showing a disk substrate constituting the optical disk according to the second embodiment.

  As shown in FIG. 7, the optical disk is composed of two resin-made disk substrates 21 and 22 having the same thickness of 0.6 mm, and an RFID tag is mounted between them. A central hole 23 is provided in each central portion. The disk substrates 21 and 22 are irradiated with laser light, and a signal recording area is formed so as to read a recording signal in accordance with the amount of reflected light therefrom.

  Recesses 24 and 25 for accommodating RFID tags are concentrically formed with the center hole 23 in the clamp area between the center hole 23 and the signal recording area at corresponding positions on the bonding surfaces of the disk substrates 21 and 22. Is formed. The depths of the recesses 24 and 25 are set as a space that can store any of various RFID tags mounted thereon, as in the optical disc of the first embodiment.

  In the optical disk of FIG. 7, two through holes 26 a are formed such that one of the recesses 24, 25 of each of the disk substrates 21, 22 communicates with a surface opposite to the bonding surface of the disk substrate 21. , 26b are formed. These through-holes 26a and 26b are provided at positions near the center hole 23 on the disk substrate 21 so as to communicate with the recess 24 at positions facing each other across the center hole 23. Then, with the IC chip module 20 attached to the recess 25 of the other disk substrate 22, the disk substrates 21 and 22 are bonded together with an adhesive layer interposed therebetween, and then the recesses 24 and 25 and the IC are connected to the through holes 26a and 26b. A filler is injected into a space generated between the chip module 20 and the optical disc is completed.

Next, a procedure for producing such an optical disc will be described.
8 to 11 are process explanatory diagrams for manufacturing an optical disk using the disk substrate of FIG. In these process explanatory diagrams, only the circular portion B of FIG. 7 is shown enlarged.

  First, two types of disk substrates 21 and 22 are prepared. Recesses 24 and 25 are formed in the disk substrates 21 and 22 together with the center hole 23, respectively, and when the bonding surfaces face each other, a space is formed between the disk substrates 21 and 22 with a predetermined size. (FIG. 8A). In one of the disk substrates 21, a through hole 26 b is formed at a position close to the center hole 23 so as to communicate with the recess 24.

  Next, a UV resin 27 is applied to the bottom surface of the recess 25 in order to place the RFID tag on the disk substrate 22 in which the through holes 26a and 26b are not provided. At this time, the thickness of the UV resin 27 to be applied is determined in accordance with the maximum thickness of the IC chip module 20 bonded thereto and the thickness of the UV resin to be applied to the entire surface of the disk substrate 21 later (FIG. 8). (B)).

  Next, by irradiating ultraviolet rays from the front side (lower surface side) of the disk substrate 22, the UV resin 27 on the bottom surface of the recess 25 is cured, and the IC chip module 20 is fixed to the recess 25 (FIG. 9A). . On the other hand, the adhesive UV resin 28 is applied to the bonded surface of the disk substrate 21 having the through holes 26a and 26b with a predetermined thickness (FIG. 9B). The UV resin 28 is applied by spin coating from the vicinity of the outer periphery of the recess 24 to the outer periphery of the disk. At this time, the bonding UV resin 28 slightly enters the recess 24 of the disk substrate 21, but does not reach the through holes 26a and 26b.

  Next, the disk substrate 22 to which the IC chip module 20 is fixed is aligned from above the disk substrate 21 and fixed to each other by the UV resin 28 applied to the bonding surface of the disk substrate 21. Then, by irradiating ultraviolet rays from the front side (upper surface side) of the disk substrate 22, the UV resin 28 is cured as an adhesive layer (FIG. 10A). In this state, a space remains in the recesses 24 and 25 in which the IC chip module 20 is accommodated, but the ratio is small compared to the case of the first embodiment.

  Next, resin beads 29a such as polycarbonate or PET are injected into the spaces of the recesses 24 and 25 with the disk substrate 21 having the through holes 26a and 26b turned upside down (FIG. 10 ( B)). At this time, the size of the resin beads 29a can be determined in consideration of the viscosity of the resin used.

  Next, a solution-like UV resin 29b is injected from the through holes 26a and 26b so as to fill the gaps between the resin beads 29a (FIG. 11A). At this time, like the optical disc of the first embodiment, the stack rib may be formed by raising the UV resin 29b. Finally, as shown in FIG. 11B, by irradiating ultraviolet rays from both sides of the optical disk, the UV resin 29b is cured in a state of being integrated with the resin beads 29a filled in the recesses 24 and 25, and the resin layer 29 Thus, the space inside the optical disk generated between the IC chip module 20 and the IC chip module 20 can be filled. Thereby, the IC chip module 20 is fixed in the recesses 24 and 25, and the strength of the optical disk can be secured by the cured resin layer 29. Further, by filling the space with the resin beads 29a prior to the injection of the UV resin 29b, it is possible to make it difficult for bubbles to remain in the space after the injection of the UV resin 29b, and even if bubbles remain, the bubbles are inconspicuous. There is also an effect.

  In the above optical disk, even when the size of the IC chip module 20 to be mounted is small, by applying a large amount of adhesive resin to the bottom surface of the recess 25 in advance and fixing the IC chip module 20 there, Less resin is required to fill the internal space after the other disk substrate 21 is bonded. On the contrary, when the IC chip module 20 to be mounted is large, a small amount of adhesive resin may be applied to the recess 25. Therefore, there is an advantage that the various IC chip modules 20 to be mounted can be accommodated and the optical disk manufacturing process can be simplified.

[Third Embodiment]
In the optical discs of the first and second embodiments described above, a through hole is formed so that the space inside the optical disc communicates with the surface opposite to the bonding surface of the disc substrate. A space in which the RFID tag is stored is filled with a resin layer by injecting a filler. For this reason, when two disk substrates are bonded together, one having a through hole formed on one side and one having no through hole formed on the other are used, which are different from each other as a mold for molding the disk substrate. I had to prepare something.

  On the other hand, in the optical disk of the following third embodiment, a RFID substrate is mounted by bonding together a disk substrate having a recess having the same shape, in which no through hole is formed. .

FIG. 12 is a diagram showing a disk substrate constituting the optical disk according to the third embodiment.
As shown in FIG. 12, the optical disk of the present embodiment is configured by bonding two disk substrates 31a and 31b made of resin having the same thickness of 0.6 mm. Each of the disk substrates 31a and 31b has a central hole (center hole) 32 penetrating through the central portion thereof, and a concave portion 33 formed concentrically with a predetermined width and depth continuously on the outer peripheral side of the central hole 32. The RFID tag is mounted in the recess 33. On the disk substrates 31a and 31b, the outer peripheral portion of the concave portion 33 is a signal recording area, and when the signal recording area is irradiated with a laser beam, a recording signal is read according to the amount of reflected light therefrom. be able to.

  In the optical disk of the third embodiment, the IC chip can be mounted by bonding the same disk substrates 31a and 31b regardless of the circuit configuration of the IC chip or the chip arrangement of the IC chip module on which the IC chip and the antenna are mounted. Therefore, the manufacturing process of the disk substrate can be simplified.

Next, a procedure for producing such an optical disc will be described.
13 to 16 are process explanatory diagrams for manufacturing an optical disk using the disk substrate of FIG. In these process explanatory views, the circular portion C of FIG. 12 is shown in an enlarged manner.

  First, two identical disk substrates 31a and 31b on which a recording film, a protective film, a conductor reflection film, and the like are formed are prepared (FIG. 13A). Next, the adhesive UV resin 34 is thinly applied only to the bonding surface of one of the disk substrates 31b by spin coating or the like (FIG. 13B).

  Next, the IC chip module 20 serving as an RFID tag is installed in the recess 33 of the disk substrate 31b coated with the UV resin 34 (FIG. 14A). The RFID tag housed in this space is configured as an IC chip module 20 as shown in FIG. 2 comprising an IC chip on which elements for storing information are integrated and an antenna for signal transmission / reception. It is. Next, the disk substrate 31a is positioned from above the disk substrate 31b and bonded together by the applied UV resin 34. Then, the UV resin 34 is cured as an adhesive layer by irradiating ultraviolet rays from the front side of the disk substrate 31b (FIG. 14B).

  Next, a cylindrical nozzle 35 having the same thickness is inserted into the central hole 32 that passes through the two disk substrates 31a and 31b (FIG. 15A). The cylindrical nozzle 35 is made of Teflon (registered trademark), silicon rubber, or the like, and has a plurality of resin injection ports 35a. Then, a solution-like UV resin 36 is injected from the resin injection port 35a of the inserted cylindrical nozzle 35 until the space formed by the recesses 33 between the two disk substrates 31a and 31b is filled. (FIG. 15B).

  Next, the UV resin 36 injected into the internal space of the disk substrates 31a and 31b is cured by irradiating ultraviolet rays from both sides of the optical disk (FIG. 16A). When the UV resin 36 is sufficiently cured, the cylindrical nozzle 35 is pulled out from the center hole 32 of the optical disk. Thus, in a state where the IC chip module 20 serving as the RFID tag is accommodated in each of the concave portions 33 of the disk substrates 31a and 31b, the space generated therein is buried with the filler (FIG. 16B).

  In the filling step of the UV resin 36, filling is performed under a substantially vacuum condition, or the remaining air is sucked out in parallel with the injection of the UV resin 36 using one of the nozzles 35 as an intake nozzle. It is desirable to suppress the generation of bubbles in the space where the IC chip module 20 is mounted.

  In the optical disk manufacturing method described above, after the disk substrates 31a and 31b having the same shape are bonded together, an ultraviolet curable resin liquid (UV) is inserted into the gap between the recess 33 and the RFID tag from the center hole 32 formed at the center thereof. Resin 36) and the like are injected. As a result, the types of mold patterns used during the injection molding of the disk substrates 31a and 31b can be reduced, and the manufacturing cost of the optical disk can be reduced.

[Fourth Embodiment]
In the third embodiment, the UV resin is injected from the center hole 32 side of the optical disk using the cylindrical nozzle 35, and the internal space is filled with the resin. Therefore, it takes time for the resin filling process and the resin curing process.

  Therefore, if the filler is integrated into a module with an RFID or antenna so as to match the groove shape of the disk substrate in advance, two disk substrates can be manufactured in the same process as an optical disk not equipped with an RFID tag. Can be bonded together, and the manufacturing process can be further simplified.

First, a process for forming an IC chip module to be mounted on an optical disk will be described.
FIG. 17 is a diagram illustrating a process for molding a filler-integrated module of an RFID tag according to the fourth embodiment.

  First, an IC chip module 20 serving as an RFID tag and a molding die 40 are prepared. A molding die 40 shown in FIG. 17A is made of a material such as fluororesin or silicon rubber, and includes an annular groove 41 corresponding to the internal space of the optical disk. A cylindrical projection 42 is formed at the center of the mold 40 with a size corresponding to the center hole of the optical disk.

  Next, the IC chip module 20 is fixed in a state where the center hole 20h is fitted in the cylindrical protrusion 42 of the mold 40. Then, a liquid UV resin 43 is injected into the groove 41, and the whole is cured by irradiating ultraviolet rays from the surface side (FIG. 17B). Then, it removes from the type | mold 40 and the filler integrated module 44 is completed (FIG.17 (C)).

  As a method of processing the RFID tag into the same shape as that of the filler integrated module 44, in addition to the above-described method, the IC chip module 20 is made of resin by, for example, a method by insert molding or a method similar to the manufacture of an IC card. A method of punching the outer periphery and the center hole portion after being sandwiched between the sheets and forming it into an annular shape is conceivable.

Next, a procedure for creating an optical disk using the filler integrated module 44 will be described.
18 to 20 are explanatory views showing the manufacturing process of the optical disc on which the filler integrated module according to the fourth embodiment is mounted. In these process explanatory diagrams, an example in which the IC chip module 20 shown in FIG. 17 is mounted using the disk substrates 31a and 31b of the optical disk according to the third embodiment shown in FIG. 12 will be described. 12 shows an enlarged part of the optical disk corresponding to the circular portion C in FIG.

  FIG. 18A shows two identical disk substrates 31a and 31b on which a signal recording film or the like is formed, as in the case of the third embodiment. Here, the UV resin 34 is thinly applied to both the disk substrates 31a and 31b by spin coating or the like (FIG. 18B). Unlike the third embodiment in which the UV resin 34 is applied only to the bonding surface of one of the disk substrates, the UV resin 34 is applied to the bottom surface of the recess 33 while setting its thickness to about half.

  Next, the disk-shaped filler integrated module 44 is attached to the bottom surface of the concave portion 33 of the disk substrate 31b (FIG. 19A). Next, the disk substrate 31a is aligned from above the disk substrate 31b, and the disk substrates 31a and 31b are bonded together by the applied UV resin 34 (FIG. 19B).

  Next, the UV resin 34 as an adhesive layer for the two disk substrates 31a, 31b and the filler integrated module 44 is cured by irradiating ultraviolet rays from the outside of the respective disk substrates 31a, 31b (FIG. 20A). )). In this manner, in the step of bonding the two disk substrates 31a and 31b, the filler integrated module 44 can be accommodated in such a manner that the concave portion 33 formed therein is simultaneously filled (FIG. 20B).

  In the optical disk manufacturing method described above, the RFID tag is modularized into a predetermined size with a filler by resin molding or the like, and the RFID tag is not mounted when the two disk substrates 31a and 31b are bonded together. Since the RFID tag is housed in the space of the recess 33 of the disk substrates 31a and 31b by the same operation process as that of the optical disk, the manufacturing process can be further simplified.

[Fifth Embodiment]
FIG. 21 is an explanatory diagram showing the relationship between the spacers used in the fifth embodiment and the components on the IC chip module.

  In the fifth embodiment, instead of the resin mold material used in the fourth embodiment, a spacer corresponding to the shape of the space between the substrates is used, and an integrated module having substantially the same shape as that space. (Spacer integrated module) is formed. The spacer is formed as a resin substrate, for example, and when a component such as the IC chip 20a protrudes and is mounted on the PET substrate 20c of the IC chip module 20, it functions to flatten the top surface of the module according to the height of the component. Fulfill.

  When one component (IC chip 20a) is mounted on the IC chip module 20 as in each of the above embodiments, or when only a component having the same height is mounted, it is substantially the same as the PET substrate 20c. It is only necessary to prepare a single spacer having a horizontal cross-sectional shape and a thickness that matches the height of the component, and having a through hole formed at a position corresponding to the component. By laminating such a spacer on the PET substrate 20c with the through hole aligned with the position of the component, the upper surface is flattened according to the height of the component.

  In addition to the IC chip 20a and the antenna pattern 20b, other electronic components such as a capacitor may be mounted on the IC chip module 20. In such a case, a plurality of spacers corresponding to differences in the height of the parts are prepared. For example, as shown in FIG. 21, when a plurality of components 45a to 45c having different heights are mounted on the surface on which the antenna coil 20b of the IC chip module 20 is formed, according to the difference in height. Three spacers 46a to 46c are prepared.

  Assuming that the height of each component 45a to 45c is Ha, Hb, Hc, the thickness of the spacer 46a is Ha, the thickness of the spacer 46b is Hb-Ha, and the thickness of the spacer 46c is Hc-Hb. The lowermost spacer 46a has through holes corresponding to the three components 45a to 45c, the middle spacer 46b has through holes corresponding to the components 45b and 45c, and the upper spacer 46c has only the component 45c. A through hole corresponding to is provided. By sequentially laminating such spacers 46a to 46c in accordance with the positions of the corresponding parts 45a to 45c, the total thickness of the laminated spacers matches the height of the highest part 45c, The upper surface is flattened at the height.

22 and 23 are explanatory views showing a manufacturing process of the spacer integrated module according to the fifth embodiment.
In this example, a capacitor 47 having a height lower than that of the IC chip 20a is mounted on the IC chip module 20 together with the IC chip 20a. Therefore, the two spacers 48 and 49 that match these height differences are molded in advance by injection molding or the like. The spacer 48 has the same thickness as the capacitor 47, and through holes 48a and 48b are formed at the mounting positions of the IC chip 20a and the capacitor 47, respectively. Such a spacer 48 is arranged on the IC chip module 20 with the positions of the components and the through holes 48a and 48b being aligned (FIG. 22). As a result, the upper surface of the capacitor 47 and the upper surface of the spacer 48 become flat, and the IC chip 20 a protrudes from the upper surface of the spacer 48.

  The spacer 49 has the same thickness as the IC chip 20a, and a notch 49a is formed at the mounting position of the IC chip 20a. A through hole similar to the spacer 48 may be formed instead of the notch 49a. Such a spacer 49 is arranged on the IC chip module 20 with the positions of the IC chip 20a and the notch 49a aligned (FIG. 23). Thus, a spacer integrated module whose upper surface is flattened according to the upper surface of the IC chip 20a is formed.

  Such a spacer integrated module is formed, for example, before being arranged on the disk substrate. In that case, the spacers are fixed with an adhesive such as UV resin. And the formed spacer integrated module is arrange | positioned in the space between board | substrates in the same procedure as what was demonstrated in FIGS. 18-20 in the bonding process of disk board | substrates. In addition, it is necessary to regulate the thickness of the spacer in consideration of the thickness of the adhesive applied for fixing the spacers.

  Further, at the time of placement on one disk substrate, the IC chip module 20 and each spacer are sequentially stacked, and after stacking all the spacers, the other disk substrate is bonded together, and the space where the module is disposed is placed in the UV resin. The spacer-integrated module may be fixed by filling with, for example.

  As described above, by preparing a plurality of spacers according to the difference in component height, the space generated in the component mounting portion can be minimized. For this reason, the amount of UV resin used can be reduced when the spacer integrated module is disposed between the disk substrates and filled with the UV resin for fixing. As a result, bubbles are less likely to be generated during filling, and the aesthetic appearance is not impaired. In addition, it is possible to prevent a decrease in strength and aesthetics due to insufficient filling of the UV resin.

[Sixth Embodiment]
As described in the third and fourth embodiments, in the optical disk manufacturing method, when the two disk substrates 31a and 31b are bonded together by the UV resin, the UV resin 34 is thinly applied by a technique such as spin coating. The However, since the concave portions 33 are formed on the bonding surfaces of the disk substrates 31a and 31b, streaks and unevenness are generated in the coating layer of the UV resin 34 due to the steps, and optical characteristics are deteriorated. Prone to occur.

  Therefore, in order to smoothly connect the step formed between the bonding surfaces of the disk substrates 31a and 31b and the recess 33, the cross-sectional shape of the recess is a curved surface. That is, the deterioration of the optical characteristics of the applied adhesive layer can be reduced by forming a shape in which the inner wall surface of the recess is connected by a curved surface at least between the bonded surfaces on the outer peripheral side of the disk substrates 31a and 31b. Further, the influence of the mold on the optical characteristics of the disk substrate during injection molding can be reduced.

FIG. 24 is a diagram showing a disk substrate constituting the optical disk according to the sixth embodiment.
FIG. 24A shows a resin disk substrate 51 having a thickness of 0.6 mm. A central hole (center hole) 52 is provided at the center of the disk substrate 51, and a recess 53 for mounting the RFID tag is formed concentrically with the central hole 52. In this optical disc, two disc substrates 51 are bonded together, and an RFID tag is accommodated in a space formed by the recess 53, so that information can be exchanged with the outside in a non-contact manner.

  FIG. 5B shows an enlarged view of the DD cross section of the disk substrate 51. Here, the recess 53 of the disk substrate 51 is formed slightly apart from the center hole 52 in the clamp area between the center hole 52 and the signal recording area 54 as shown in FIG. The step 53a on the inner peripheral side and the step 53b on the outer peripheral side are both smoothly connected by a curved surface.

  With such a shape, when the adhesive UV resin 34 is thinly applied from the inner peripheral side to the disk substrate by spin coating or the like in the optical disk manufacturing method shown in the third embodiment, etc. Unevenness is less likely to occur. Therefore, the adhesive layer that bonds the two disk substrates 51 reduces the possibility that the optical characteristics of the optical disk will deteriorate. Further, since the convex portion of the mold used for injection molding is a curved surface, the possibility of non-uniformity in the resin flow in the mold is reduced, and the flatness of the signal recording area 54 is improved.

  It should be noted that when the adhesive layer is applied to both sides of the disk substrate as in the case of the optical disk of the fourth embodiment, it is necessary that the two concave portions 53 are formed in the two disk substrates 51. In the case of the first to third embodiments, since the adhesive layer is applied only to one of the disk substrates, if only one of the disk substrates is configured in the above-described concave shape. It ’s enough.

[Seventh Embodiment]
In each of the six embodiments described above, the recess for accommodating the RFID tag is formed concentrically with the center hole of the disk substrate. However, some RFID tags are configured as an IC chip module in which an antenna is integrated with an IC chip.

FIG. 25 is a diagram showing a disk substrate constituting the optical disk according to the seventh embodiment.
Here, a recess 63 having a rectangular horizontal cross section is provided at a predetermined depth in the vicinity of the center hole 62 of the disk substrates 61a and 61b. When the center holes 62 of the two disk substrates 61a and 61b are made to coincide with each other, the RFID tags can be stored in the recesses 63 thereof. And the cross-sectional shape of this recessed part 63 is what the level | step difference with the bonding surface was smoothly connected by the curved surface.

FIG. 26 is a diagram showing the recess of the disk substrate and the IC chip module accommodated therein.
The IC chip module 64 is an RFID tag in which an IC chip and an antenna are integrated into a module. When the communication frequency is 13.56 MHz, the spiral antenna 64a is formed on the surface of the substantially square-shaped IC chip 64b. It is formed in the vicinity. The disc substrate 61 is formed with a rectangular recess 63 in which each corner is curved in the horizontal cross-sectional shape, and the IC chip module 64 is accommodated therein.

FIG. 27 is an enlarged plan view and cross-sectional view showing the vicinity of a concave portion of a mold for manufacturing a disk substrate.
In the injection molding of the disk substrate 61b as shown in FIG. 26, the resin is injected into the space 73 sandwiched between the mold 71 and the stamper 72 from the center hole 62 side. Here, the flow of the resin is indicated by arrows. In the optical disc of the above-described embodiment, the concave portions are formed on both sides of the disc substrate 61 to be bonded, so that the height at which the convex portion 71a of the mold 71 projects in the space 73 can be lowered. In addition, the shape of the recess 63 itself is not only connected to the bonding surface of the disk substrate 61 by a curved surface, but is also formed in a rectangular shape in which each corner portion forms a curve.

  Therefore, as compared with a conventional optical disc (see FIG. 28) in which a concave portion is formed only on one side of the disc substrate 61 to be bonded, the flow of the resin in the space 73 is less likely to be inhibited during injection molding. The flatness of the signal recording surface by the stamper 72 can be easily ensured.

  As described above, in the optical disc of the seventh embodiment, the type of mold pattern used at the time of injection molding can be reduced and the manufacturing cost of the optical disc can be reduced even if the disc substrate is formed with a recess. It becomes. Further, since the flatness of the surface of the disk can be kept higher than when the IC chip module is attached to the surface of the disk, the shape standards of various disks such as DVD and BD can be easily satisfied. . Furthermore, by configuring the concave portion with a curved surface, the influence of the mold on the optical characteristics of the substrate during injection molding can be reduced, and a disk substrate having excellent optical characteristics can be produced.

  In each of the above embodiments, a DVD is assumed as an optical disk. However, the present invention is not limited to this, and can be applied to various optical disks such as a CD and a BD. Further, the present invention can be applied not only to a read-only optical disc but also to a writable optical disc. However, in the case of BD, the signal recording film is formed on the surface opposite to the bonding surface of each disk substrate.

It is a figure which shows the disk substrate which comprises the optical disk which concerns on 1st Embodiment. It is a figure which shows the optical disk with which the RFID tag was mounted. It is a figure which shows the process (the 1) for manufacturing an optical disk with the disk board | substrate of FIG. It is a figure which similarly shows the process (the 2) for manufacturing an optical disk. It is a figure which similarly shows the process (the 3) for manufacturing an optical disk. It is a figure which similarly shows the process (the 4) for manufacturing an optical disk. It is a figure which shows the disk board | substrate which comprises the optical disk which concerns on 2nd Embodiment. FIG. 8 is a diagram showing a process (No. 1) for manufacturing an optical disc using the disc substrate of FIG. It is a figure which similarly shows the process (the 2) for manufacturing an optical disk. It is a figure which similarly shows the process (the 3) for manufacturing an optical disk. It is a figure which similarly shows the process (the 4) for manufacturing an optical disk. It is a figure which shows the disc substrate which comprises the optical disc which concerns on 3rd Embodiment. It is a figure which shows the process (the 1) for manufacturing an optical disk with the disk board | substrate of FIG. It is a figure which similarly shows the process (the 2) for manufacturing an optical disk. It is a figure which similarly shows the process (the 3) for manufacturing an optical disk. It is a figure which similarly shows the process (the 4) for manufacturing an optical disk. It is a figure which shows the process for the filler integrated module molding of the RFID tag which concerns on 4th Embodiment. It is explanatory drawing which shows the manufacturing process (the 1) of the optical disk carrying the filler integrated module which concerns on 4th Embodiment. It is a figure which similarly shows the process (the 2) for manufacturing an optical disk. It is a figure which similarly shows the process (the 3) for manufacturing an optical disk. It is explanatory drawing which shows the relationship between the spacer used in 5th Embodiment, and the component on an IC chip module. It is explanatory drawing (the 1) which shows the manufacturing process of the spacer integrated module which concerns on 5th Embodiment. It is explanatory drawing (the 2) which shows the manufacturing process of the spacer integrated module which concerns on 5th Embodiment. It is a figure which shows the disc substrate which comprises the optical disc which concerns on 6th Embodiment. It is a figure which shows the disk board | substrate which comprises the optical disk which concerns on 7th Embodiment. It is a figure which shows the recessed part of a disk substrate, and the IC chip module accommodated there. It is the top view and sectional drawing which expand and show the recessed part vicinity of the metal mold | die for manufacturing a disk substrate. It is a figure which shows the structure for mounting an RFID tag in the conventional optical disk.

Explanation of symbols

  11, 12: Disc substrate, 13: Center hole, 14, 15: Recess, 16: Through hole, 17, 18 ... UV resin, 19, 29 ... Resin layer, 20 ... IC chip module, 20a: IC chip, 20b: Antenna pattern, 20c: PET substrate, 21, 22 ... Disc substrate, 23: Center hole, 24, 25 ... Recess, 26a, 26b ... Through hole, 27, 28 29b: UV resin, 29a: Resin beads, 31a, 31b: Disc substrate, 32: Center hole, 33: Recess, 34: UV resin, 35: Cylindrical nozzle, 36: UV resin , 40... Molding mold, 41... Circular groove, 42... Cylindrical protrusion, 44... Integrated filler material module, 45 a to 45 c, parts, 46 a to 46 c, 48, 49. , 47 …… Conde 48a, 48b ... through hole, 49a ... notch, 51 ... disc substrate, 52 ... center hole, 53 ... concave, 54 ... signal recording area, 61a, 61b ... disc substrate, 62 …… Center hole, 63 …… Recess, 64 …… IC chip module, 71 …… Mold, 72 …… Stamper

Claims (26)

In an optical disc having a structure in which two disc substrates are bonded, and an IC chip and an antenna for the IC chip to communicate with the outside in a contactless manner,
A recess for accommodating the antenna and the IC chip is formed at a corresponding position on each bonding surface of the disk substrate, and the space generated in the recess is filled with the antenna and the IC chip. An optical disc characterized by being embedded by.   2. The optical disk according to claim 1, wherein the antenna and the IC chip are integrated into a module.   The optical disk according to claim 1, wherein the filler is an ultraviolet curable resin. The recess formed in one of the disk substrates is formed with a through hole communicating with the surface opposite to the bonding surface,
2. The optical disk according to claim 1, wherein the antenna and the IC chip are embedded in the concave portion of the other disk substrate, and the filler is injected from the through hole.   5. The optical disk according to claim 4, wherein the filler injected from the through hole is in a protruding state on a surface opposite to the bonding surface.   5. The optical disk according to claim 4, wherein a granular solid resin material is injected into the space generated in the concave portion together with an ultraviolet curable resin liquid as the filler, and the filler is solidified.   The concave portion is formed concentrically with the center hole on the inner peripheral side of the data recording area of the disk substrate, and the inner wall surface on the outer peripheral side is connected to the bonding surface of the disk substrate by a curved surface. 2. The optical disc according to claim 1, wherein   2. The optical disc according to claim 1, wherein the concave portion is formed in a rectangular shape in which the IC chip can be mounted on the inner circumference side of the data recording area of the disc substrate.   9. The optical disc according to claim 8, wherein the concave portion is formed in a rectangular shape in which each corner portion forms a curve in a horizontal sectional shape.   10. The optical disc according to claim 9, wherein the recess has an inner wall surface on the outer peripheral side connected by a bonding surface and a curved surface of the disc substrate.   An IC chip module in which the IC chip and the antenna are covered with the filler so as to have a module shape so as to have substantially the same outer shape as the space generated in the recess when the disk substrate is bonded is formed in the recess. The optical disk according to claim 2, wherein the optical disk is disposed in a generated space. The IC chip and the antenna are
A module substrate on which the circuit component including the IC chip and the antenna are mounted on the same surface;
The module substrate is disposed on the surface of the module substrate on which the IC chip is mounted as at least a part of the filler, and substantially fills the space generated in the recess when the disk substrate is bonded together with the thickness of the module substrate. A spacer substrate with a thickness of only
3. The optical disk according to claim 2, wherein the optical disk is integrated into a module and stored in the recess.   When the circuit components having different heights are mounted on the module substrate, a plurality of the spacer substrates corresponding to the height differences of the circuit components are disposed on the module substrate, and the spacer 13. The optical disk according to claim 12, wherein the total height of the substrates matches the height of the circuit component having the highest height. In a method of manufacturing an optical disc having a structure in which two disc substrates are bonded, and an IC chip and an antenna for communicating the IC chip with the outside in a non-contact manner,
Forming the disk substrate in which recesses for embedding the antenna and the IC chip are respectively formed at corresponding positions on the bonding surface;
Fixing the antenna and the IC chip in the recess formed in one of the disk substrates;
Aligning the recesses with each other and bonding the disk substrates via an adhesive layer;
A step of injecting a filler into a space generated in the concave portion of the bonded disc substrate, and solidifying;
A method of manufacturing an optical disc, comprising: In the recess formed in one of the disk substrates, a through hole communicating with the surface opposite to the bonding surface is formed,
The antenna and the IC chip are fixed to the concave portion where the through hole is not formed,
After laminating the disk substrates, an ultraviolet curable resin liquid is injected as the filler from the through holes into the gaps of the recesses.
The method of manufacturing an optical disk according to claim 14.   16. The method of manufacturing an optical disk according to claim 15, wherein the ultraviolet curable resin liquid is injected from the through hole until a protruding state is formed on a surface opposite to the bonding surface.   A granular solid resin material together with an ultraviolet curable resin liquid as the filler is introduced from a through-hole formed in the disk substrate, and the ultraviolet curable resin liquid is solidified by irradiating with ultraviolet light so as to fill the gaps in the recesses. The method of manufacturing an optical disk according to claim 14.   15. The method of manufacturing an optical disk according to claim 14, wherein after the disk substrates are bonded together, an ultraviolet curable resin liquid is injected as the filler into a gap between the recesses from a center hole formed at the center thereof. . The recesses are formed concentrically with the center hole on the inner circumference side of the data recording area of the disk substrate,
The adhesive layer is formed by applying a liquid adhesive by spin coating from the center hole side to the bonding surface of one of the disk substrates.
The method of manufacturing an optical disk according to claim 14.   20. The method of manufacturing an optical disc according to claim 19, wherein the concave portion is formed such that an inner wall surface thereof is connected to a bonding surface of the disc substrate by a curved surface.   The concave portion is formed in a rectangular shape in which each corner portion is curved in a horizontal cross-sectional shape, and a liquid resin material is introduced from an inner peripheral side of the disc substrate, thereby forming the disc substrate together with the shape of the concave portion by injection molding. The method of manufacturing an optical disk according to claim 14.   15. The method of manufacturing an optical disk according to claim 14, wherein the antenna and the IC chip are formed as an IC chip module having an outer shape matching the shape of the recess. In a method of manufacturing an optical disc having a structure in which two disc substrates are bonded, and an IC chip and an antenna for communicating the IC chip with the outside in a non-contact manner,
Forming the disk substrate in which recesses for embedding the antenna and the IC chip are respectively formed at corresponding positions on the bonding surface;
Forming an IC chip module that is modularized by covering the IC chip and the antenna with a filling member so as to have substantially the same outer shape as the space formed by the recess when the disk substrate is bonded;
Fixing the IC chip module in the recess formed in one of the disk substrates;
Aligning the recesses with each other and bonding the disk substrates via an adhesive layer;
A method of manufacturing an optical disc, comprising: The step of forming the IC chip module includes:
Mounting the IC chip and the antenna on a module substrate;
The module substrate on which the IC chip and the antenna are mounted is disposed in a molding die having a space having substantially the same shape as the space generated by the recess, and a resin is used as the filling member in the molding die. Filling the material and performing injection molding;
24. The method of manufacturing an optical disc according to claim 23, comprising: The step of forming the IC chip module includes:
Mounting the circuit component including the IC chip and the antenna on a module substrate;
A step of disposing a spacer substrate on the surface of the module substrate on which the circuit component is mounted, and having a thickness sufficient to substantially fill the space generated by the concave portion together with the thickness of the module substrate;
24. The method of manufacturing an optical disc according to claim 23, comprising: In the step of disposing the spacer substrate,
When the circuit components having different heights are mounted on the module substrate, a plurality of the spacer substrates corresponding to the difference in height of the circuit components are arranged on the module substrate, and the spacer 26. The method of manufacturing an optical disk according to claim 25, wherein the total height of the substrates is made to coincide with the height of the highest circuit component.

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