JP2008014903A - Probe control apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe control apparatus capable of automatically performing an operation of making the tips of a plurality of probes approach a predetermined distance. <P>SOLUTION: A probe driving section 111 drives a probe P. A probe control section 134 outputs a driving command to the probe driving section 111, and controls the position of the probe P. Using image data (template) of the tip of a previously registered probe, the probe control section 134 repeatedly controls the positions of the plurality of probes while changing the image magnification of an electron microscope into high magnification using an electron microscope control section 132 so that the distance between the tips of the plurality of probes is a predetermined value. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a probe control apparatus that controls the position of a probe. For example, the present invention relates to a probe control apparatus suitable for use in a semiconductor inspection apparatus that performs inspection or defect analysis of a semiconductor having a scanning electron microscope (SEM) function.

  In a semiconductor inspection apparatus, a chip is inspected by making probe contact with a defective portion of a circuit among elements formed on a semiconductor chip. For example, two probes are used for two-terminal elements such as resistors and capacitors, and three probes are used for three-terminal elements such as transistors. The position where the probe is brought into contact is a portion of the plug where the insulating film is removed and the conductor is exposed in the surface of the semiconductor chip. Here, since the size of the plug is small and the distance between the plugs to be contacted is very small, a skilled operator can perform positioning of the probe and contact with the plug by a scanning electronic head microscope (SEM). It takes a long time to operate while looking at the observation image.

  In particular, since the contact with the plug changes the position of the probe in the height direction while viewing the two-dimensional SEM observation image, it is not easy to determine whether or not the tip of the probe has contacted the plug. Proposals have been made of detecting the contact of the probe (for example, see Patent Document 1) or electrically detecting the contact of the probe (for example, see Patent Document 2) by changing the brightness of the imaging of the head microscope. Yes.

JP-A-5-52721 W099-05506

  Patent Documents 1 and 2 both determine whether or not the probe has come into contact with the plug. Prior to contact of the probe with the plug, the operator places the probe in a position above the plug. In order to position the probe, an operation to bring the probe tip close is necessary. However, the operation itself to bring the probe tip close to a minute distance of about 0.1 μm, for example, requires skill and takes a long time. there were.

  An object of the present invention is to provide a probe control apparatus capable of automatically performing an operation of bringing the tips of a plurality of probes close to a predetermined distance.

In the present invention, the probe control unit uses the electron microscope control unit so that the distance between the tips of the plurality of probes becomes a predetermined value using the image data of the tip of the probe registered in advance. The positions of a plurality of probes are repeatedly controlled while changing the image magnification to a high magnification.
With this configuration, an operation of bringing the tips of a plurality of probes close to a predetermined distance can be automatically performed.

Hereinafter, the configuration and operation of the probe control apparatus according to an embodiment of the present invention will be described with reference to FIGS.
First, the configuration of the semiconductor inspection apparatus using the probe control apparatus according to the present embodiment will be described with reference to FIG.
FIG. 1 is a system configuration diagram showing a configuration of a semiconductor inspection apparatus using a probe control apparatus according to an embodiment of the present invention.

  Electrons emitted from the electron gun 100 become an electron beam 1 by the condenser lens 101 and the objective lens 106 and are focused on the sample 2 such as a semiconductor wafer or a semiconductor chip. Between the two lenses 101 and 106, a variable aperture 102, an aligner stigma 103, a blanker 104, and a deflector 105 are arranged. The variable aperture 102 is provided with a diaphragm drive unit 102a, the blanker 104 is provided with a blanking amplifier 104a, and the deflector 105 is provided with a deflection control unit 105a.

  The sample 2 is fixed on a rotating shaft of a sample rotating device 120 mounted on the stage 108 on a stage 108 that can move in two axial (X, Y) directions. The stage 108 is moved through the X and Y driving units based on the stage control unit 108a. In this embodiment, the rotation axis of the sample rotating device 120 is set parallel to the stage 108.

  Secondary electrons generated from the surface of the sample 2 by the irradiation of the electron beam are detected by the secondary electron detector 109. The secondary electron signal from the secondary electron detector 109 is A / D converted, and is taken into the image memory of the computer 130 in synchronization with the FIB deflection control, whereby a secondary electron image is displayed on the image display device 140. Is done.

  The three-axis drive mechanism 112 is capable of driving three axes of X, Y, and Z. A metal probe P is attached to the tip of the triaxial drive mechanism 112. The triaxial drive mechanism 112 includes a probe drive unit 112a. Although only one probe P is illustrated, a plurality of probes P are provided, and each probe is provided with a triaxial drive mechanism and a probe drive unit.

  The computer 130 includes an SEM control unit 132 and a probe control unit 134. The SEM control unit 132 performs various controls such as aperture driving of the variable aperture 102, beam deflection operation by the deflector 105, signal detection from the secondary electron detector 109, movement of the stage 108, etc. Control to display the secondary electron signal from the electron detector 109 on the image display device 140 is performed.

  The probe control unit 134 controls the triaxial drive mechanism 112 based on a command from the input operation unit 150 such as a mouse or a keyboard to control the driving of the probe P, and the lens power supply via the SEM control unit 132. Control for changing the magnification by controlling 106a is performed.

Next, the control contents of the probe control apparatus according to the present embodiment will be described with reference to FIGS.
First, the entire control content of the probe control apparatus according to the present embodiment will be described with reference to FIG.
FIG. 2 is a flowchart showing the entire control content of the probe control apparatus according to the embodiment of the present invention.

  The main processes of the probe control unit 134 shown in FIG. 1 are the “register object to template” process (step S100), the “proximity approach process” (step S200), and the “object contact process” ( Step S400).

  As described above, the semiconductor inspection apparatus shown in FIG. 1 has a plurality of probes P. Two probes are used for two-terminal elements such as resistors and capacitors, and three probes are used for three-terminal elements such as transistors.

  In step S100, the probe control unit 134 selects each probe from the images displayed on the image display device in order to identify each of the plurality of probes that are objects, and the reference image before moving. Register in advance as (image data: template). Details of the processing will be described later with reference to FIG.

  In step S200, for example, the probe control unit 134 executes processing for bringing the tips of two probes (target objects) close to a predetermined distance. Here, for example, when a two-terminal element is inspected using two probes, if the distance between plugs at both ends of the two terminals is 0.1 μm, the distance between the tips of the two probes is set to 0. Approach 1 μm. Details of the proximity processing will be described later with reference to FIGS. 4 and 5. The present embodiment is characterized by this proximity processing. That is, when trying to bring the tips of the two probes closer to, for example, 0.1 μm, conventionally, a driving signal is sent to the probe driving unit while viewing the images of the two probes displayed on the image display device, and the probe In the present embodiment, the process is performed by the probe control unit 134, whereas the operation of moving the tip of the probe is very skilled.

  In step S300, the probe control unit 134 determines that the proximity process is completed when the distance between the objects reaches a predetermined distance from the display magnification of the obtained image as a result of the proximity process in step S200. It switches to the contact process of s400, and when that is not right, it is determined whether the proximity process of step s200 is continued.

  In step S400, the probe control unit 134 executes a process of bringing the tip of the probe (object) into contact with the surface of a semiconductor chip or the like. Here, the tip of the probe is merely brought into contact with the oxide film or the like on the surface of the semiconductor chip or the like, and is not necessarily brought into contact with the plug which is a portion where the conductor is exposed. By bringing the tip of the probe into contact with the surface of a semiconductor chip or the like, the movement distance in the Z-axis direction by the probe driving unit can be accurately grasped. Details of the contact processing will be described later with reference to FIGS. 6 and 7.

Next, the contents of the template registration process in the probe control apparatus according to the present embodiment will be described with reference to FIG.
FIG. 3 is an explanatory diagram of the contents of the template registration process in the probe control apparatus according to the embodiment of the present invention.

  FIG. 3 shows a display example of the image display device 140. A secondary electron image is displayed on the upper part of the image display device. Here, two probe images P2 and P5 are displayed on the left and right sides of the screen. The display magnification at this time is “50 times” as “Mag: 50” is displayed below the display part of the secondary electron image. As shown in FIG. 3, the template registration process is performed in a state where a plurality of probes (two probes P2 and P5 in the illustrated example) are displayed on the display unit of the secondary electron image. The display magnification at that time is a low magnification such as 50 times.

  Here, the contents of the template registration process will be described. In the template registration process, for example, the mouse of the input operation unit 150 shown in FIG. 1 is operated to select the buttons “1” to “6” displayed in the “Template” column in the display screen. It starts with that. The six buttons “1” to “6” are provided in the semiconductor inspection apparatus shown in FIG. 1 so that six probes are provided and can be identified by numbers. Because.

  Here, for example, when the button “2” is pressed, a rectangular frame F1 is shown on the display unit of the secondary electron image. When the tip of the probe displayed on the secondary electron image display unit is clicked with the mouse, the center of the frame F1 is set as the center coordinate of the template. Next, the size of the image area to be registered in the template is designated from “Template Size”. The size of the template is determined by clicking on the black triangle on the right side of the place where the number “80” is displayed, and a pull-down menu is displayed, from which an arbitrary template size is designated. In the illustrated example, “80” is designated as the template size.

  In the example shown in FIG. 3, the display unit of the secondary electron image has the horizontal direction as the X-axis drive direction of the triaxial drive mechanism 112 in FIG. 1, and the vertical direction as the X-axis drive direction. Is the origin (0, 0). The display unit of the secondary electron image has a display area of 640 pixels wide and 480 pixels high, and the template size of “80” indicates that the horizontal and vertical widths of the frame F1 are each 80 pixels. Yes.

  Next, by clicking the “Set” button at the lower right of the “Template” column, the template registration for the designated number is completed. Here, in the case of the probe P2, the registered template is a secondary electron image in the region indicated by the frame F1. That is, an image of 80 pixels in length and width, and the state in which the tip of the probe P2 is displayed from the left side is registered as a template with the number “2”.

  Here, as shown in the “Image Information” column, the center coordinates of the frame F1 corresponding to the number “2” are in the X direction with the upper left corner of the display part of the secondary electron image as the origin (0, 0). Is the position of “86” pixels and the Y direction is “109” pixels. Note that since the probe P5 is already registered as a template for the number “5”, the center coordinate of the frame corresponding to the number “5” is the position of “439” pixels in the X direction, and the Y direction is “179” pixels. Since the center positions of the templates “2” and “5” are the tip positions of the probes P2 and P5, respectively, the distance between the tips of the probes P2 and P5 is the coordinates (86, 109) and the coordinates (438, 179) and the display magnification (in this example, 50 times). In this example, “360” μm is displayed in the “Distance” column.

  In the “proximity approach processing” in step S200, the probe control unit 134 causes the probe driving unit 111 to the triaxial driving mechanism 112 so that the distance between the tips of the two probes P2 and P5 is, for example, 0.1 μm. Is driven, and the probes P2 and P5 are gradually moved to approach each other.

Next, the contents of the proximity processing of the object in the probe control apparatus according to the present embodiment will be described with reference to FIGS.
FIG. 4 is a flowchart showing the contents of the object proximity processing in the probe control apparatus according to the embodiment of the present invention. FIG. 5 is an explanatory diagram of the contents of the proximity processing of the object in the probe control device according to the embodiment of the present invention.

  First, in step S210 of FIG. 4, the probe control unit 134 calculates the required movement distance accuracy for the object to approach. The left half of FIG. 5 corresponds to FIG. As described in FIG. 3, in the example of FIG. 5 (FIG. 3), the distance between the tips of the probe P2 and the probe P5 is 360 μm. Although this distance is finally reduced to 0.1 μm, it is difficult to reduce the distance to 0.1 μm at a time, so the distance is gradually reduced. Here, the required movement distance accuracy is, for example, 1/5 of the current distance, and is 72 μm (= 360 × (1/5)). The required movement distance is displayed as “72” μm in the “Next Step” column in the center of FIG. Here, the probe P2 and the probe P5 move away from the center position of the display unit. That is, since the secondary electron image display section is 640 pixels wide and 480 pixels long, the center position is (320, 240), so the one far from the center position, that is, in the example of FIG. The probe P2 is moved.

  In step S215, the probe control unit 134 outputs a drive command to the probe drive unit 111, drives the triaxial drive mechanism 112, and moves the probe P2 by 72 μm. However, even if a movement command for 72 μm is output to the probe driving unit 111, the actual moving distance is different. This point will be described later in step S235.

  When the movement is completed, in step S220, the probe control unit 134 captures an image obtained by imaging the object (probe) after the movement. The captured image is displayed under “Moved Image” in the upper right part of FIG.

  Next, in step S225, the probe control unit 134 performs a test on the template image registered in step S100 with the current image captured in step S220. In step S100, the image within the frame indicated by the frame F1 in FIG. 3 is registered as a template image for the probe P2. Therefore, the image taken in step S220, that is, the image data displayed under “Moved Image” in the upper right part of FIG. 5 is searched to find a portion that matches the template for the probe P2.

  In step S230, the probe control unit 134 determines whether the search is successful. That is, it is determined whether or not a portion matching the template for the probe P2 is found from the image captured in step S220. If found, the process proceeds to step S240, and if not found, the process is terminated.

  If the search is successful, in step S235, the probe control unit 134 obtains how much the template image has moved on the current image, and becomes the actual moving distance. That is, when the center position of the tip of the probe P2 is determined to be “156” in the X-axis direction and “123” in the Y-axis direction in the “Image Information” column on the right side of FIG. The distance between the tip and the tip of the probe P5 that has not moved is calculated and displayed as “270” μm as shown in the “Distance” column. A command to move 72 μm from what was originally 360 μm away was issued, but the actual moving distance can be calculated as 90 μm (= 360 μm−270 μm). In other words, the fact that the actual movement of 90 μm is performed in response to the movement request of 72 μm means that if a movement of 90 μm is desired, a movement request of 72 μm may be issued. The triaxial drive mechanism 112 does not have a coordinate system (scale) relating to the movement distance, but can subsequently control the movement with high accuracy by comparing the required movement distance with the actual movement distance. The movement here relates to the movement of the X-axis direction and the Y-axis direction combined by the triaxial drive mechanism 112. The learning in the Z-axis direction will be described in the contact process in step S400.

  Next, in step S240, the probe control unit 134 determines whether the template of the object falls within the range when the image magnification is enlarged to the next image magnification. This is because when the objects (probes P2, P5) are closer, the current imaging magnification is increased so that the area between the objects can be seen wider, and the distance between the probes P2, P5 is set to the target 0. This is in order to approach 1 μm. Here, the display magnification of the example shown in FIG. 5 is 50 times, and the next image magnification is, for example, 100 times. The display area of “Moved Image” on the right side of FIG. 5 is 640 × 480 pixels. Accordingly, when the image magnification is set to 100, the displayed area is the central 320 × 240 pixel area (the area indicated by the frame F2 in the figure) of the “Moved Image” display area on the right side of FIG. ) In step S240, it is determined whether or not the template of the object (probes P2 and P5) enters the area of the frame F2. In the example shown on the right side of FIG. 5, since the probe P5 is outside the frame F2, the process returns to step S210, and steps S210 to S235 are executed, and the process is repeated until the probe P5 enters the frame F2. For example, when the probe moves to the probe P5 indicated by the broken line in the “Moved Image” display area on the right side of FIG. 5, it is determined that the template of the object (probes P2, P5) has entered the area of the frame F2. If the area is entered, the process proceeds to the next step S245.

  Next, in step S245, the probe control unit 134 cuts out the next image magnification enlargement region and stores an image enlarged to the image size. That is, the image inside the frame “F2” of the “Moved Image” display area on the right side of FIG. 5 is cut out, and the display magnification is changed from 50 times to 100 times. Store the image.

  On the other hand, in step S250, the probe control unit 134 executes the next image magnification enlargement and stores the image with the magnification enlarged. That is, the probe control unit 134 sends an image enlargement command to the SEM control unit 132, and the SEM control unit controls the lens 106a to increase the magnification of the lens 106 to 100 times. At that time, an image of the secondary electron signal detected by the secondary electron detector 109 is stored.

  Next, in step S255, the probe control unit 134 compares the image stored in step S245 with the image stored in step S250 and recognizes that the template of the object is the same. Cognition is intended to align the object so as not to lose sight of the object when the image is magnified.

  In step S260, the probe control unit 134 determines whether or not the recognition is successful. If the recognition is successful, the process proceeds to step S265.

  Next, in step S265, the probe control unit 134 registers a template to be a reference image for the next object movement. That is, the template registered in FIG. 3 is the one when the image magnification is 50 times. On the other hand, when the image magnification is 100 times as a result of the processing in step S250, the image is magnified twice as long and horizontally as when the image magnification is 50 times. On the other hand, since the same object can be recognized in step S255, the center positions of the probes P2 and P5 ′ are known, and an image in a rectangular range of, for example, 80 pixels designated by “Template Size” from the center positions. Is overwritten on the templates for the original probes P2 and P5, respectively, thereby creating and registering a template for an image magnification of 100 times.

  Next, in step S270, the probe control unit 134 determines whether or not the distance between the objects has reached the final target distance. If the final target distance is 0.1 μm, since the final target distance has not yet been reached in the example of FIG. 5, steps S210 to S265 are further repeated, and the magnification is further increased to 200 times and 400 times. . When the magnification is 10,000 times, 0.1 μm becomes, for example, probes P2 and P5 displayed in the display area of “Moved Image” on the right side of FIG. 5, and at this point, the process is terminated. Become.

  As described above, by performing the proximity process shown in FIG. 4 by the probe control unit 134, the distance between the tips of the two probes can be automatically brought close to, for example, 0.1 μm.

Next, the contents of the object contact process in the probe control apparatus according to the present embodiment will be described with reference to FIGS. 6 and 7.
FIG. 6 is a flowchart showing the contents of the object contact processing in the probe control apparatus according to the embodiment of the present invention. FIG. 7 is an explanatory diagram of the contents of the object contact processing in the probe control device according to the embodiment of the present invention.

  In step S410 in FIG. 6, the probe control unit 134 moves the object down to bring it into contact with the surface of the semiconductor chip or the like. Here, the object uses the template registered in step S265 of FIG. As shown in FIG. 7B1, for example, the probe control unit 134 outputs a drive command to the probe drive unit 111, drives the triaxial drive mechanism 112, and moves the probe P2 in the arrow direction (Z-axis direction). Descent at low speed. At this time, the secondary electron image displayed on the image display device is as shown in FIG.

  In step S415, the probe control unit 134 captures an image of the object while lowering the object.

  In step S420, the probe control unit 134 compares the registered template image with the captured image in step S415, and detects whether there is a change in brightness in step S425. FIG. 7B2 shows a state in which the tip of the probe P2 is in contact with the surface of the semiconductor chip or the like. In the secondary electron image obtained at this time, as shown in FIG. A dark portion S2 such as a shadow is generated around. This dark portion S2 appears not only when the tip of the probe P2 comes into contact with the surface of the semiconductor chip or the like but also when it approaches the surface of the semiconductor chip or the like. The area where the shadow appears is a range of 2 to 5 pixels around the probe P2. Therefore, the probe control unit 134 compares the registered template image with the image captured in step S415, and particularly detects a change in brightness in the area around the probe P2, and changes the brightness. If there is no change, the change is not detected and the process returns to step S410 to continue the lowering of the object. On the other hand, if a change in brightness is detected, the process proceeds to step S435 because the target probe P2 is approaching the surface of the semiconductor chip or the like.

  In step S435, the probe control unit 134 compares the positional deviation between the registered template image and the image captured in step S415. Here, FIG. 7B2 shows a state where the probe P2 is in contact with the surface of a semiconductor chip or the like. Since the probe drive unit 111 is instructed to descend, if the probe P2 further descends, a force in the Z-axis direction is applied to the probe P2, but the tip of the probe P2 contacts the surface of the semiconductor chip or the like. As a result, the force in the Z-axis direction is dispersed in the X- and Y-axis directions, and the tip of the probe P2 moves in the extension direction of the probe P2, as shown in FIGS. 7B3 and 7B4. This movement can be detected in the secondary electron image as a misalignment of the captured image with respect to the template image, as shown in FIGS. 7 (A2), (A3), and (A4).

  In step S440, the probe control unit 134 determines whether or not a positional deviation has been detected, and returns to step S410 until the positional deviation is detected, and continues to lower the object. On the other hand, if a position shift is detected, the process proceeds to step S445, and the lowering of the object is stopped.

  In step S445, the probe control unit 134 determines whether or not the stop due to the positional deviation detection is the first time. If it is the first time, the probe control unit 134 temporarily raises the object in step S455, and then starts from step S410. Repeat the process. If it is the second time, the process proceeds to step S460, where it is determined whether the same result as in the first time is obtained, and the accuracy of contact detection is improved.

  When the contact process ends, the probe control unit 134 raises the probe that is the object, and avoids contact between the semiconductor chip and the probe.

  Since the probe control unit 134 holds the amount of movement from the start of the lowering of the probe, which is the object, to the contact with the surface of the semiconductor chip or the like as the lowering drive command value for the probe driving unit 111, next, the semiconductor When contacting the surface of the chip or the like, the probe can be brought into contact with the surface of the semiconductor chip or the like by instructing the command value.

  As described with reference to FIG. 3, the distance between the probe tips can be set to a predetermined value (for example, 0.1 μm) by the proximity processing by the probe control unit 134. The probe control unit 134 also grasps the relationship between the movement command value in the X and Y axis directions and the actual movement amount. Therefore, when a semiconductor chip or the like is inspected by the semiconductor inspection apparatus, an operator of the inspection apparatus can easily move the probe to the position of the plug of the semiconductor chip or the like by instructing the moving direction from the input operation unit 150. Can be positioned. In addition, since the necessary amount of descent to the surface of the semiconductor chip or the like is obtained by the contact process of FIG. 6, the probe can be easily brought into contact with the plug. Here, what is obtained by the contact treatment of FIG. 6 is the distance until the probe contacts the insulating film on the surface of the semiconductor chip or the like, but since the thickness of the insulating film can be known in advance, the descent distance to the plug Is easy to understand.

  As described above, according to this embodiment, the distance between the probes can be set to a predetermined distance by easily bringing the tips of the probes close to each other regardless of the skill of the person who operates the apparatus. Further, contact with a semiconductor chip or the like can be easily performed.

Furthermore, it is possible to accurately control a control mechanism in which a coordinate system cannot be defined by reflecting the control result in the control request.

It is a system configuration figure showing the composition of the semiconductor inspection device using the probe control device by one embodiment of the present invention. It is a flowchart which shows the control content of the whole probe control apparatus by one Embodiment of this invention. It is explanatory drawing of the content of the template registration process in the probe control apparatus by one Embodiment of this invention. It is a flowchart which shows the content of the proximity | contact process of the target object in the probe control apparatus by one Embodiment of this invention. It is explanatory drawing of the content of the proximity | contact process of the target object in the probe control apparatus by one Embodiment of this invention. It is a flowchart which shows the content of the contact process of the target object in the probe control apparatus by one Embodiment of this invention. It is explanatory drawing of the content of the contact process of the target object in the probe control apparatus by one Embodiment of this invention.

Explanation of symbols

2 ... Sample 106 ... Objective lens 106a ... Lens power supply 112 ... Triaxial drive mechanism 112a ... Probe drive unit 130 ... Computer 132 ... SEM control unit 134 ... Probe control unit 140 ... Image display device 150 ... Input operation unit P ... Probe

Claims (9)

A probe for making electrical contact between the electron microscope and the sample, and an electron that takes in secondary electrons obtained by irradiating the sample with an electron beam as an image, and controls the objective lens of the electron microscope to change the image magnification. Used in an electron beam apparatus having a microscope control unit,
A probe driving unit for driving the probe;
A probe control device having a probe control unit that outputs a drive command to the probe drive unit and controls the position of the probe,
The probe control unit uses the electron microscope control unit to adjust the distance between the tips of the plurality of probes to a predetermined value using image data of the tip of the probe registered in advance. A probe control apparatus that repeatedly controls positions of the plurality of probes while changing an image magnification to a high magnification. The probe control device according to claim 1,
The probe control unit obtains a correlation between a command value and an actual movement amount from a movement command value for the probe driving unit and a movement amount of the probe obtained from an image by the secondary electrons. Control device. The probe control device according to claim 1,
The probe control unit determines whether or not the tip of the probe has contacted the sample using image data of the tip of the probe registered in advance. A probe for making electrical contact between the electron microscope and the sample, and an electron that takes in secondary electrons obtained by irradiation of the electron beam to the sample as an image, and controls the objective lens of the electron microscope to change the image magnification. Used in an electron beam apparatus having a microscope control unit,
A probe control method for controlling the position of the probe by outputting a drive command to a probe drive unit that drives the probe,
Using the pre-registered image data of the tip of the probe, the electron microscope control unit is used to increase the image magnification of the electron microscope so that the distance between the tips of the probes becomes a predetermined value. A probe control method characterized by repeatedly controlling the positions of the plurality of probes while changing. The probe control method according to claim 4, wherein
A probe control method, wherein a correlation between a command value and an actual movement amount is obtained from a movement command value for the probe driving unit and a movement amount of the probe obtained from an image by the secondary electrons. The probe control method according to claim 4, wherein
A probe control method comprising: determining whether or not the tip of the probe has contacted the sample by using image data of the tip of the probe registered in advance. A probe for making electrical contact between the electron microscope and the sample, and an electron that takes in secondary electrons obtained by irradiating the sample with an electron beam as an image, and controls the objective lens of the electron microscope to change the image magnification. Used in an electron beam apparatus having a microscope control unit,
A program that outputs a drive command to a probe drive unit that drives the probe to control the position of the probe,
Using the pre-registered image data of the tips of the probes, the electron microscope control unit is used to increase the image magnification of the electron microscope so that the distance between the tips of the probes becomes a predetermined value. A program characterized by repeatedly controlling the positions of the plurality of probes while changing. The program according to claim 7, wherein
A program for obtaining a correlation between a command value and an actual movement amount from a movement command value for the probe driving unit and a movement amount of the probe obtained from an image of the secondary electrons. The program according to claim 7, wherein
A program for determining whether or not the tip of the probe has contacted the sample by using image data of the tip of the probe registered in advance.

Images