JP2008010292A - Electric connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent flux and connection solder from being attached on a connector contact part or the like in soldering an electric connector on a printed circuit board. <P>SOLUTION: A connector lead 6 includes a flange part 7 for preventing flux rise in solder connection formed between a fixed part by a housing mold 2 and a solder connection terminal 16. In other case, a connector lead 26 includes a flange part 27 for preventing the flux and connection solder from rising in the solder connection, formed in a position of a solder connection terminal side of a space part 37 for housing the connector lead. The flange parts 7, 27 have areas for covering at least peripheries of through holes 8, 28, and includes recessed parts 10, 30 as flux or connection solder pools formed on the solder connection terminal side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electrical connector mounted on a printed circuit board, and more particularly to an electrical connector that prevents flux and connection solder from adhering to a contact portion of a connector lead when soldering.

  In recent years, restrictions on the environment such as RoHS (Restriction of Hazardous Substances) have been strengthened, and lead-free connection solder materials used when mounting components on a printed circuit board have become common. In connection with this, the connection solder material is moving from a conventional Sn-Pb to a lead-free connection solder material represented by SnAg0.5Cu. In general, the melting point of the lead-free connection solder material is about 220 to 230 ° C. in the case of SnAg0.5Cu compared to about 183 ° C. of conventional Sn—Pb. For this reason, the process temperature for soldering components to the printed circuit board is high, and the flux and solder are likely to be ejected through the connector lead of the electrical connector to be mounted.

  When the flux rises and adheres to the contact portion of the connector lead, the conductivity of the contact portion is remarkably lowered, and there is a risk of causing a contact failure of the electrical connector. For this reason, conventionally, after the soldering process, a post-process such as cleaning and removing the flux adhering to the contact portion of the connector lead has been required. Similarly, when the connection solder rises and adheres to the contact portion of the connector lead, the unevenness may occur, resulting in poor contact with the mating plug that fits into the electrical connector, resulting in poor contact. .

  Proposals have been made to devise the shape of the connector leads as a countermeasure against flux ejection. For example, in Patent Document 1, in the connector lead of an electrical connector, a portion between the upper surface of the printed circuit board and the bottom of the connector is formed widely and a flux pool is provided to prevent the flux from rising to the contact portion of the lead. The configuration is described.

JP-A-62-213069

  A problem caused by the ejection of flux and solder when the electrical connector is mounted on a printed board will be described with reference to the drawings.

  FIG. 4 is a cross-sectional view showing the structure of a conventional pin header type electrical connector 1. The straight type connector lead 6 is connected to the printed circuit board 3 by soldering while the middle part thereof is fixed by the housing mold 2. In order to mount the electrical connector 1 on the printed circuit board 3, the connector lead 6 protruding from the bottom 4 is inserted into the through hole 8 formed on the printed circuit board 3 and soldered to the printed circuit board 3 using the flux 11. Is done. Each connector lead 6 is fixed in the connector lead mounting hole 14 of the housing mold 2, but a slight gap 13 is easily formed between the connector lead 6 and the connector lead mounting hole 14. Therefore, when the connector lead 6 and the printed circuit board 3 are soldered using the flux 11, the melted flux penetrates into the gap 13 as shown by the arrow A due to the capillary phenomenon, and the connector lead 2 It will rise to the contact portion 9. As a result, the flux adheres to the contact portion 9 of the connector lead 6 and causes a contact failure of the electrical connector.

  FIG. 5 is a cross-sectional view showing a structure of a conventional electrical connector 21 of a type generally called a DIMM connector (or PCI connector). The connector lead 26 has a curved shape in which the contact portion 29 is bent so that the connector lead 26 is brought into contact with the spring when the plug on the mating counterpart side is inserted. A space 37 having a space for housing the connector lead 26 is provided in the housing mold 22 of the connector. In order to mount the electrical connector 21 on the printed circuit board 23, the connector lead 26 protruding from the lower surface 37 a of the space is inserted into the through hole 28 formed on the printed circuit board 23, and soldered to the printed circuit board using the flux 31. Attached. Since the space part 37 exists in the housing mold 22, the flux and the connecting solder 38 melted during the soldering process are changed from the space part lower surface 37 a to the space part upper surfaces 37 b and 37 c as indicated by arrows C and D. Erupts towards. As a result, the ejected matter is scattered not only inside the space portion 37 but also to peripheral components mounted adjacent to the electrical connector 21. If these scattered connection solder and flux adhere to components and patterns mounted at a narrow pitch, between component leads, or connector contacts, etc., there is a possibility that the circuit may short-circuit, and the connection solder debris is printed on the printed circuit board. As a result, the function of the mounting board may be impaired.

  These problems are caused by the structure of the entire electrical connector, and the technique described in Patent Document 1 is not necessarily effective when a large amount of flux and connection solder is ejected. In other words, it is difficult to sufficiently prevent the flux and the connection solder from being transmitted along the connector lead or scattered to the space and rising to adhere to the upper connector contact portion or the like. Therefore, it is necessary to clean the deposits after mounting the connector on the printed circuit board.

  An object of the present invention is to provide an electrical connector that can more effectively prevent a large amount of flux and connection solder from adhering to a connector contact portion or the like.

  The present invention provides an electrical connector in which a connector lead is fixed by a housing mold and can be mounted by solder connection to a printed board having a through hole. The connector lead is inserted into the through hole at one end and connected to the printed board. The solder connection terminal to be soldered has a contact portion for conducting to other electrical components at the other end, and the housing mold has a substantially intermediate portion between the solder connection terminal of the connector lead and the contact portion. The connector lead has a structure in which a flange portion for preventing an increase in flux at the time of solder connection is provided between the position fixed by the housing mold and the solder connection terminal.

  The present invention also provides an electrical connector in which a connector lead is housed in a housing mold and can be mounted by solder connection to a printed board having a through hole. The connector lead is inserted into the through hole at one end and the printed board. A solder connection terminal to be soldered to the other end, a curvilinear contact portion for electrical connection with other electrical components at the other end, and the housing mold has a space portion for housing the connector lead. The connector lead has a structure in which a flux at the time of solder connection and a flange for preventing the rise of the connection solder are provided at the position on the solder connection terminal side of the space portion.

  Here, the flange has at least an area covering the periphery of the through hole, and has a structure in which a concave for collecting flux or connection solder is provided on the solder connection terminal side.

  According to the present invention, it is possible to eliminate the occurrence of troubles such as contact failure of a contact portion after mounting an electrical connector and short circuit between peripheral components, and reliability is improved. In addition, the cleaning work after the soldering process becomes unnecessary, and the number of man-hours can be reduced.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a cross-sectional view showing an embodiment of a pin header type electrical connector 1 according to the present invention. The same elements as those in FIG. 4 are denoted by the same reference numerals. A straight type connector lead 6 is used and fixed by the housing mold 2 at a substantially intermediate position between the contact portion 9 for conducting with other electrical components and the solder connection terminal 16 connected to the printed circuit board 3 by connection solder. It is.

  Spacers 5 are provided on both leg portions of the housing mold 2 so that the bottom portion 4 of the housing mold 2 does not adhere to the printed circuit board 3 when the printed circuit board 3 is mounted. The connector lead 6 is provided with a flange 7 as a flux rise prevention member in a section of the height of the spacer 5, that is, between a location fixed by the housing mold 2 and the solder connection terminal 16. The size of the flange portion 7 has an area that covers at least the periphery of the through hole 8 of the printed circuit board 3 that faces the flange portion 7. The flange portion 7 is provided with a concave portion 10 for collecting flux on the solder connection terminal 16 side of the connector lead 6, that is, on the printed circuit board 3 side. Further, an inter-pin insulating portion 15 formed integrally with the housing mold 2 is provided between the connector leads 6 to prevent a short between the leads of the adjacent connector leads 6.

  The behavior of the flux 11 when soldering with the printed circuit board 3 in the electrical connector 1 of the present embodiment will be described. The flux 11 supplied through the through hole 8 rises along the periphery of the connector lead 6. The flux 11 first rises instantaneously to the upper surface of the printed circuit board 3 by capillary action. Since the space is formed here, the capillary action is released, and after that, according to the amount of the supplied flux 11, it gradually travels along the connector lead 6 and gets wet upward (arrow A '). However, further increase of the flux is prevented by the flange portion (flux rise prevention member) 7 of the connector lead 6 and the recess portion (flux reservoir) 10 provided in the flange portion. As a result, even if there is a gap 13 between the connector lead 6 and the connector lead mounting hole 14, the flux is prevented from adhering to the contact portion 9 of the connector lead 6. In the normal soldering of the printed circuit board 3, the supply of the flux 11 is completed in a short time (several seconds). The flux 11 does not rise to the part 9.

  As described above, according to the present embodiment, the connector lead 6 is provided with the flange portion (flux rise prevention member) 7 and the recess portion (flux reservoir) 10 so that the flux is effectively adhered to the connector contact portion and the like. Can be prevented.

  2A to 2D are cross-sectional views showing examples of various shapes of the connector lead 6 used in the electrical connector of this embodiment. In either case, the connector lead 6 has a flange 7 as a flux rise prevention part in the middle.

  1A, as described in the embodiment of FIG. 1, a concave portion 10 having a hollow inside is provided on the lower surface (solder connection terminal 16 side) of the flange portion 7. The recess 10 acts as a flux reservoir for retaining the flux rising from the solder connection terminal 16 side during solder connection. The flux used at the time of soldering rises from the solder connection terminal 16 side through the connector lead 6 as shown by an arrow B, but the contact of the connector lead 6 is caused by the recess 10 in the flange 7 provided on the connector lead 6. It is possible to prevent the flux from rising up to the portion 9.

  The shape of the collar portion 7 is not limited to (a), and various modifications are possible. (B) is a concave surface on the lower surface side of the collar portion 7, (c) is an umbrella shape, and (d) is a circular plate (or a rectangular plate). In any case, these flanges act as a flux pool and have an effect of preventing an increase in flux.

  The connector lead 6 is a straight type, but may include a curved portion in part. Various methods can be used to form the flange 7 on the connector lead 6. For example, the connector lead 6 having excellent mechanical strength and reliability can be provided by integral molding using a mold.

  FIG. 3 is a cross-sectional view showing an embodiment of an electrical connector 21 of the type called a DIMM connector (or PCI connector) according to the present invention. The same elements as those in FIG. The connector lead 26 has a curved shape in which the contact portion 29 is bent so that the connector lead 26 is brought into contact with the spring when the plug on the mating counterpart side is inserted. A space 37 for accommodating the connector lead 26 is provided in the housing mold 22 of the connector.

  The connector lead 26 is provided with a flange 27 as a flux and connection solder rise prevention member at the position of the lower surface 37a of the space 37, that is, the position on the solder connection terminal 36 side. The size of the flange 27 has an area covering at least the periphery of the through hole 28 of the printed circuit board 23. The flange portion 27 is provided with a concave portion 30 for collecting flux and connection solder on the solder connection terminal 36 side of the connector lead 26, that is, on the printed circuit board 23 side. In addition, an inter-pin insulating portion 35 formed integrally with the housing mold 22 is provided between the connector leads 26 to prevent a short-circuit between adjacent connector leads 26.

  In the electrical connector 21 of this embodiment, the behavior of the flux 31 and the connection solder 38 when soldering with the printed circuit board 23 will be described. The flux 31 and the connecting solder 38 supplied through the through hole 28 rise along the periphery of the connector lead 26. Moreover, it sprays out in the space part 37 through the space part lower surface 37a in the housing mold 22, and also tries to scatter to the outside through the space part upper surfaces 37b and 37c (arrow C, arrow D). This becomes conspicuous when the gap between the diameter of the through hole 28 and the diameter of the connector lead 26 is large, or when the soldering process time is long (conveyor feed speed of the solder process is slow).

  However, the flange 31 (flux / solder rise prevention member) 27 of the connector lead 6 and the recess (flux / solder reservoir) 30 provided on the connector lead 6 allow the flux 31 and the connecting solder 38 to be transmitted through the connector lead 6. It prevents it from rising. Furthermore, it is possible to prevent the air from being blown into the space portion 37 and sprayed to the outside. As a result, even if the space portion 37 exists, the flux and connection solder adhere to the contact portion 29 of the connector lead 26 and prevent the peripheral components mounted outside from adhering. In normal soldering of the printed circuit board 23, the supply of the flux 31 and the connection solder 38 is completed in a short time (several seconds). Therefore, even if the flux 31 and the connection solder 38 are ejected in large quantities, the recesses (flux / solder pool) It is trapped at 30 and will not rise or scatter.

  Thus, according to the present embodiment, the connector lead 26 is provided with the flange portion (flux / solder rise prevention member) 27 and the recess portion (flux / solder reservoir) 30 so that the flux and the connection solder can be It is possible to effectively prevent adhesion to peripheral parts.

  Also in the present embodiment, the shape of the collar portion 27 provided in the middle of the connector lead 26 is not limited to that of the embodiment of FIG. The thing of the various shapes shown to (a)-(d) of the said FIG. 2 can be used.

  Further, in this embodiment, as a surface treatment of the connector lead 26, by performing a treatment such as providing a nickel oxide layer in a section between the contact portion 29 and the soldering portion, the wettability with respect to the solder is reduced, It is possible to further suppress the solder rise.

  As described above, according to each embodiment, in the soldering process of the electrical connector, it is possible to effectively prevent the flux and the connection solder from adhering to the contact portion, and the reliability is improved. In particular, the present invention can be effectively applied even when a lead-free solder material having a higher process temperature than conventional ones is used. In addition, the cleaning operation for removing the flux adhering to the contact portion after soldering becomes unnecessary, and the number of steps can be reduced and the cost can be reduced.

Sectional drawing which shows one Example of the pin header type electrical connector by this invention. Sectional drawing which shows the example of the various shapes of the connector lead in a present Example. Sectional drawing which shows one Example of the DIMM type electrical connector by this invention. Sectional drawing which shows the structure of the conventional pin header type electrical connector. Sectional drawing which shows the structure of the conventional DIMM type electrical connector.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,21 ... Electrical connector 2,22 ... Housing mold 3,23 ... Printed circuit board 4 ... Bottom part 5 ... Spacer 6, 26 ... Connector lead 7, 27 ... Eaves part 8, 28 ... Through hole 9, 29 ... Contact part 10, DESCRIPTION OF SYMBOLS 30 ... Recess 11, 31 ... Flux 14, 34 ... Connector lead attachment hole 15, 35 ... Inter-pin insulation part 16, 36 ... Solder connection terminal 37 ... Space part 38 ... Connection solder.

Claims (3)

An electrical connector that can be mounted by soldering to a printed circuit board having a through hole with a connector lead fixed by a housing mold,
The connector lead has a solder connection terminal inserted into the through hole at one end and soldered to the printed circuit board, and a contact portion for conducting electrical connection with other electrical components at the other end.
The housing mold fixes the solder connection terminal of the connector lead and a substantially middle part of the contact part,
An electrical connector, wherein the connector lead is provided with a flange portion for preventing an increase in flux at the time of solder connection between a fixed portion by the housing mold and the solder connection terminal. An electrical connector that accommodates a connector lead in a housing mold and can be mounted by soldering to a printed circuit board having a through hole,
The connector lead has a solder connection terminal inserted into the through hole at one end and soldered to the printed circuit board, and a curved contact portion for conducting electrical connection with other electrical components at the other end.
The housing mold has a space for storing the connector lead,
The electrical connector according to claim 1, wherein the connector lead is provided with a flange portion for preventing the flux and solder from rising when solder is connected at the position on the solder connection terminal side of the space. The electrical connector according to claim 1 or 2,
The flange has an area that covers at least the periphery of the through hole, and is provided with a recess for collecting flux or connection solder on the solder connection terminal side.

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