JP2008009334A - Optical wiring module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical wiring module that facilitates positioning of an optical element and that enables introduction and positioning of an optical fiber definitely. <P>SOLUTION: By bending a frame 7 at fold sections 9a-9e, a positional relation is created introducing an end part 6d properly into an optical element 4, thereby enabling the positioning of the optical element 4 only through the bending operation. Also, an optical fiber 6 is introduced to the optical element 4 while being guided with a holding face 16a which is an upper face of a mold resin part 16. Further, by forming a receiving hole 14b which is tapered toward the optical element 4, the end part 6d is designed to be guided suitably to the optical element 4. Then, the end part 6d is held in a manner opposing the optical element 4 by the tapered receiving hole 14b, completing the positioning of the optical element. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical wiring module for transmitting or receiving light, which is used particularly for portable information terminals and personal computers.

As a conventional optical wiring module, a semiconductor integrated circuit (semiconductor element) and a carrier are provided on a substrate so as to be adjacent to each other, an optical fiber is fixed to the back surface of the semiconductor integrated circuit, and a light receiving element (optical element) is provided on the side of the carrier. ) Is known (for example, see Patent Document 1). According to this optical wiring module, the light propagating through the optical fiber is sent to the light receiving element by arranging the end of the optical fiber and the light receiving element to face each other.
JP 2000-196112 A JP 2004-117902 A

  Here, in the optical wiring module, since it is necessary to arrange the carrier to which the light receiving element is fixed at a predetermined position of the substrate module, it is difficult to position the light receiving element. Further, since it is necessary to introduce and fix the optical fiber while adjusting so that the end of the optical fiber and the light receiving element face each other, there is a problem in the reliability of the introduction and positioning operations of the optical fiber.

  The present invention has been made to solve such a problem, and provides an optical wiring module capable of easily positioning an optical element and capable of reliably introducing and positioning an optical fiber. Objective.

  The optical wiring module according to the present invention is an optical wiring module that transmits or receives light using an optical fiber as a waveguide, and has a head portion on one side and a base portion on the other side, and can be bent at a fold portion therebetween. An optical element that is mounted on the flexible substrate on the head portion side and that transmits and receives light to and from the optical fiber. And a semiconductor element mounted on a flexible substrate on the base side and electrically connected to the optical element via a wiring formed on the flexible substrate, so that the optical element is contained and the side surface extends toward the base. A first module having a receiving hole formed in the flexible substrate and introduced into the end of the optical fiber and narrowed toward the optical element. And a second mold resin portion that is formed on the flexible substrate so that the side surface expands toward the base while enclosing the semiconductor element, and when the frame is bent, the optical fiber is second. While being guided by the upper surface of the mold resin portion, the end portion is in a positional relationship to be introduced into the optical element.

  In this optical wiring module, the optical element is positioned by simply performing a simple operation of bending the frame at the crease, and the optical fiber end portion is in a positional relationship such that the end of the optical fiber is satisfactorily introduced into the optical element. In addition, the optical fiber is introduced to the optical element while being guided on the upper surface of the second mold resin portion, and the end of the optical fiber is guided to the optical element by the receiving hole narrowed toward the optical element. Become. When the optical fiber is completely inserted, its end is held and positioned so as to face the optical element by the narrowed receiving hole. In addition, since the first and second mold resin portions are formed so that the side surfaces of the first and second mold resin portions expand toward the base portion, they may interfere with each other during folding even when the component arrangement is compact. Is prevented. As described above, the optical element can be easily positioned with a compact structure, and the optical fiber can be reliably introduced and positioned.

  Here, the crease part is provided by forming a hole in the frame, and the flexible substrate is preferably fixed at least by the head part and the base part and preferably straddles the hole, and the wiring also has a hole. It is preferable to straddle. When such a configuration is adopted, when the frame is bent at the fold portion, the deflection of the flexible substrate escapes toward the hole, and the stress applied to the flexible substrate and the wiring near the fold portion is alleviated.

  The flexible substrate may be fixed at least at the base portion and movable with respect to the head portion. When such a configuration is adopted, when the frame is bent at the crease portion, the flexible substrate moves on the head portion side and escapes without causing excessive bending. Such stress is relieved. In addition, when introducing the optical fiber, even if there is a shift in the position of the optical element and the end of the optical fiber, the receiving hole is pushed as the optical fiber is introduced, and the optical element Since the position moves together with the flexible substrate, the optical fiber can be reliably introduced and positioned.

  The flexible substrate may be fixed at least at the head portion and movable with respect to the base portion. Even with such a configuration, the stress applied to the flexible substrate and the wiring near the crease is alleviated.

  Here, it is preferable that the frame has a guide portion at a position opposite to the head portion via the base portion, and a through hole into which the optical fiber is introduced is formed in the guide portion. When such a configuration is adopted, since the optical fiber is supported by the through hole, it is possible to reliably introduce and position the optical fiber.

  Moreover, it is preferable that a guide groove for guiding the optical fiber to the optical element is formed on the upper surface of the second mold resin portion. When such a configuration is employed, the optical fiber is reliably guided to the optical element by the guide groove.

  The guide groove is preferably narrowed toward the optical element. When such a configuration is adopted, the optical fiber is further easily guided to the optical element.

  According to the optical wiring module of the present invention, the optical element can be easily positioned, and the optical fiber can be reliably introduced and positioned.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of an optical wiring module according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing an internal structure of a shield case 2 of an optical wiring module 1 according to an embodiment of the present invention. As shown in FIG. 1, the optical wiring module 1 is configured by housing various electronic components and optical components inside a shield case 2 formed into a box-like hexahedron by molding and bending a single frame. The That is, a flexible substrate 3 provided so as to stick to the inner surface of the shield case 2, an optical element 4 and a semiconductor element 5 mounted thereon, and a mold resin portion 14 enclosing the optical element 4 and the semiconductor element 5, respectively. 16 are housed as main components. The end portion 6d of the optical fiber 6 inserted from the outside of the shield case 2 is optically coupled to the optical element 4, and the end portion adjacent portion 6c of the optical fiber 6 adjacent to the end portion 6d has the coating 6b removed. The diameter is reduced to be carried by the mold resin portion 16.

  Next, a detailed configuration of the optical wiring module 1 will be described with reference to FIG.

  FIG. 2 is a perspective view showing a state where the shield case 2 of the optical wiring module 1 according to the embodiment of the present invention is developed. As shown in FIG. 2, the plate-like frame 7 forming the shield case 2 has a rectangular base portion 7a, and the base portion 7a is extended toward both sides in the longitudinal direction so that one end side is formed. Is provided with a rectangular head portion 7b and a guide portion 7c having the same shape as the head portion 7b on the other end side. In the head part 7b and the guide part 7c, the side parallel to the longitudinal direction of the base part 7a is made shorter than the width in the direction perpendicular to the longitudinal direction of the base part 7a.

  Further, when the frame 7 is viewed from the surface on which the flexible substrate 3 or the like is provided, the base portion 7a is extended outward from the right end portion when the head portion 7b is upward and the guide portion 7c is downward. Thus, the rectangular side surface portion 7d, the rectangular fixing portion 7f, and the rectangular side surface portion 7e are connected in series. In the side surface portion 7d, the fixing portion 7f, and the side surface portion 7e, the side perpendicular to the longitudinal direction of the base portion 7a is the short side of the guide portion 7c along the longitudinal direction of the base portion 7a with respect to the side surface portion 7d and the side surface portion 7e. The width of the fixing portion 7f is the same as the width in the direction perpendicular to the longitudinal direction of the base portion 7a.

  In the portion of the frame 7 where the base portion 7a, the head portion 7b and the guide portion 7c are connected, two substantially oval long holes (holes) 8a and 8b are formed in a straight line. Thus, the crease portions 9a and 9b are provided. Further, in the portions where the base portion 7a and the side surface portion 7d, the side surface portion 7d and the fixing portion 7f, and the fixing portion 7f and the side surface portion 7e are connected, substantially oblong elongated holes (holes) 8c, 8d, 8e Are formed in four straight lines, so that the crease portions 9c, 9d, 9e are provided. By these crease portions 9a to 9e, the frame 7 can be bent accurately and easily. The long holes 8a to 8e may be through holes or may be concave.

  The shield case 2 is formed by bending the frame 7 at the crease portions 9a to 9e. At this time, the base portion 7a becomes the bottom surface of the shield case 2, and the head portion 7b and the guide portion 7c become side surfaces in the longitudinal direction. The fixing portion 7f is the upper surface of the shield case 2, and the side surface portion 7e and the side surface portion 7d are side surfaces in the short direction. The dimension A in the longitudinal direction of the shield case 2 is about 15 mm.

  Here, a circular through hole 11 serving as an entrance into which the optical fiber 6 is introduced is formed in the central portion of the guide portion 7c. The through hole 11 has an inner diameter that is substantially the same as the outer diameter of the optical fiber 6. The optical fiber 6 is reliably introduced and positioned by being supported by the through hole 11.

  The fixing portion 7f is provided with a fixing claw 13 by forming a long hole 12 as a through hole in a region closer to the guide portion 7c than the center line C with respect to the longitudinal direction of the shield case 2.

  The elongated hole 12 includes a rectangular slit portion 12a extending along the fold portion 9d on the side surface portion 7d side, a rectangular slit portion 12b extending along the fold portion 9e on the side surface portion 7e side, And a communication portion 12c that communicates with each other.

  The slit portion 12a and the slit portion 12b extend from the front of the end portion 7g on the guide portion 7c side to the front of the center line C in the fixed portion 7f. The communication portion 12c has an isosceles triangle shape, and its base is parallel to the short direction of the fixed portion 7f, and its apex angle is an obtuse angle and faces the end 7g. . The communication portion 12c is formed so that the two base angles thereof coincide with the end portions of the slit portion 12a and the slit portion 12b on the center line C side, thereby communicating the slit portion 12a and the slit portion 12b. Become.

  By forming the long hole 12 described above, the fixing claw 13 is provided in a region surrounded by the slit portion 12a, the slit portion 12b, and the communication portion 12c. A V-shaped holding portion 13a is formed on the center line C side of the fixing claw 13 by the apex angle of the communication portion 12c, and the optical fiber 6 is sandwiched and fixed by the holding portion 13a.

  Moreover, the crease | fold part 13b is formed by connecting the edge part on the opposite side to the communication part 12c in the slit part 12a and the slit part 12b with a straight line. The fixed claw 13 can be bent at the fold portion 13b, and the fixed claw 13 is cantilevered and held by the shield case 2 on the fold portion 13b side by being pushed inward in the shield case 2. The part 13a enters the inside of the shield case 2. Like the crease portions 9a to 9e, the crease portion 13b may be provided with a through hole or a substantially oblong oblong hole (hole) having a concave shape. By providing such a long hole, the fixed claw 13 can be more reliably bent at the crease portion 13b.

  The introduced optical fiber 6 is sandwiched between the holding portion 13a of the fixed claw 13 bent into the shield case 2 and the flexible substrate 3 on the base portion 7a side by the fixing claw 13 provided in this way. It is fixed by being gripped. As described above, since the optical fiber 6 is fixed by the fixing claw 13 provided directly on the shield case 2, the fixing position of the optical fiber 6 can be determined with high accuracy, and the fixing claw 13 is further moved into the shield case 2. The optical fiber 6 can be fixed only by an easy operation of bending. Further, since the flexible substrate 3 has elasticity, it acts as a cushion when the optical fiber 6 is pressed and fixed by the fixing claws 13.

  A flexible substrate 3 made of an elastic material is disposed on the frame 7 so as to overlap the head portion 7b, the base portion 7a, and the guide portion 7c, and the flexible substrate 3 and the frame 7 include the base portion 7a and It is fixed by the guide part 7c and is movable with respect to the head part 7b.

  The flexible substrate 3 includes a substantially rectangular mounting portion 3a on which the optical element 4, the semiconductor element 5, and the like are mounted, and a rectangular lead-out portion that is led out from the shield case 2 and connected to an external device. 3b.

  The mounting portion 3a extends from the end portion of the head portion 7b of the frame 7 opposite to the fold portion 9a to the end portion of the guide portion 7c opposite to the fold portion 9b, and the width thereof is formed in the frame 7. In addition, the two long holes 8a are provided so as not to exceed the respective outer end portions. A part of the mounting portion 3 a that overlaps with the guide portion 7 c is cut into a substantially rectangular shape so as to avoid the through hole 11.

  The lead-out portion 3b is provided at the end opposite to the fold portion 9c of the mounting portion 3a, and extends from the vicinity of the center line C to the front of the fold portion 9a.

  The optical element 4 is mounted on the head part 7b side of the mounting part 3a, and the semiconductor element 5 is mounted on the base part 7a side of the mounting part 3a. The semiconductor element 5 is electrically connected to the wiring 3d, and this wiring 3d extends to the lead-out part 3b. As a result, the semiconductor element 5 and the external device are electrically connected via the lead-out part 3b.

  The optical element 4 and the semiconductor element 5 are electrically connected via two wirings 3c formed on the flexible substrate 3, and the two wirings 3c straddle the two long holes 8a. It is out. Furthermore, a connecting portion 7h that connects the base portion 7a and the head portion 7b is formed between the two long holes 8a in the frame 7, and the portion of the flexible substrate 3 that overlaps the connecting portion 7h is rectangular. It has been cut out.

  On the side of the head portion 7b of the mounting portion 3a of the flexible substrate 3, a pyramid-shaped mold resin portion (first mold resin portion) 14 is formed so as to enclose the optical element 4, and the mold resin portion The side surface of 14 is made to expand toward the base. In addition, a circular receiving hole 14 b for introducing the end 6 d of the optical fiber 6 is formed at the center of the upper surface 14 a of the mold resin portion 14.

  The receiving hole 14b is provided by forming a recess from the upper surface 14a toward the optical element 4. Further, the diameter of the circle on the upper surface 14 a is larger than the diameter of the optical fiber body 6 a, and is made thinner toward the optical element 4. As a result, the end portion 6d of the introduced optical fiber 6 is surely inserted into the receiving hole 14b having an inlet larger than the diameter of the optical fiber main body 6a. It will be guided. When the optical fiber 6 is completely inserted into the receiving hole 14b, the end 6d is held at a position facing the optical element 4 by the narrowed receiving hole 14b. As described above, it is possible to reliably introduce and position the optical fiber 6.

  On the base portion 7a side of the mounting portion 3a, a truncated pyramid-shaped mold resin portion (second mold resin portion) 16 is formed so as to enclose the semiconductor element 5, and the length of the mold resin portion 16 is increased. Extends from the front of the crease portion 9a to the vicinity of the center line C.

  Further, the side surface of the mold resin portion 16 is extended toward the base portion. As described above, since the side surface of the mold resin portion 14 is also expanded, the side surface of the mold resin portion 14 and the side surface of the mold resin portion 16 are prevented from interfering with each other when the frame 7 is bent. Is done. As a result, the arrangement of components inside the shield case 2 can be made compact.

  In addition, a substantially U-shaped guide groove 16 b for guiding the optical fiber 6 to the optical element 4 is formed on the support surface (upper surface of the second mold resin portion) 16 a which is the upper surface of the mold resin portion 16. The guide groove 16b is narrowed toward the optical element 4, so that the end 6d is guided to the optical element 4 as it is introduced, and a receiving hole is formed. 14b is easily inserted. Thereby, it is possible to reliably introduce and position the optical fiber 6.

  Here, the guide groove 16b formed in the support surface 16a of the mold resin portion 16 is guided to the optical element 4 while directly supporting the optical fiber 6 when the optical fiber 6 is introduced, and is adjacent to the end portion even when fixed. 6c may be supported, or it acts as a guide only when the optical fiber 6 is bent or bent at the time of introduction, and the optical fiber 6 normally contacts the guide groove 16b. Alternatively, a configuration in which the light is guided to and fixed to the optical element 4 may be used.

  The optical fiber 6 introduced into the optical wiring module 1 is a multimode fiber. The optical fiber body 6a excluding the coating is a core made of acrylic such as PMMA and a clad made of a polymer containing fluorine. The diameter is about 1 mm. The coating 6b is made of polyvinyl chloride or the like and has a diameter of about 2.2 mm. In the optical fiber 6, the coating 6b of the end adjacent portion 6c (about 5 mm) is removed, and the optical fiber main body 6a is exposed. The end 6d is inserted into the receiving hole 14b and faces the optical element 4.

  FIG. 3 is a longitudinal sectional view showing a state in which the optical fiber 6 is introduced into the shield case 2 in the optical wiring module 1 configured as described above. As shown in FIG. 3, the crease portions 9a to 9e provided in the frame 7 and the respective components provided in the frame 7 are end portions 6d while the optical fiber 6 is guided to the guide groove 16b during bending. Is inserted into the receiving hole 14 b and is introduced into the optical element 4. Thus, even if the optical element 4 and the semiconductor element 5 remain electrically connected by the wiring 3c, the optical element 4 can be easily positioned by simply performing a simple operation of bending the frame 7. In addition, it is possible to reliably introduce the optical fiber 6.

  In addition, the flexible substrate 3 is movable with respect to the head portion 7b, and when the frame 7 is bent, the flexible substrate 3 moves on the head portion 7b side and escapes without causing excessive bending. The stress applied to the flexible substrate 3 and the wiring 3c is relaxed.

  Further, if the flexible substrate 3 is movable with respect to the head portion 7b, the receiving hole 14b can be moved even if the optical element 4 and the end portion 6d of the optical fiber 6 are displaced. Since the position of the optical element 4 moves together with the flexible substrate 3 in accordance with the introduction of the optical fiber 6 when the optical fiber 6 is brought into contact with and pushed, the optical fiber 6 can be reliably introduced and positioned. A stopper 15 for receiving the moved flexible substrate 3 is provided above the head portion 7b. Since the stopper 15 restricts the movement of the flexible substrate 3 when the frame 7 is bent, when the optical fiber 6 is introduced, its end 6d is reliably introduced into the receiving hole 14b.

  Next, the manufacturing method of the optical wiring module 1 mentioned above is demonstrated.

  After the frame 7, the long holes 8a to 8e, the through hole 11, and the long hole 12 are formed by stamping, the flexible substrate 3 on which the wiring pattern is formed is attached and fixed to the frame 7. In addition, since the long hole 12 is formed with respect to the flame | frame 7 which is a flat plate, the fixed nail | claw 13 will be provided with sufficient positional accuracy.

  In the flexible substrate 3, the optical element 4 is arranged on the head part 7b side of the mounting part 3a, and the semiconductor element 5 is arranged on the base part 7a side of the mounting part 3a. Then, the optical element 4 and the semiconductor element 5 and the wirings 3c and 3d are electrically connected by wire bonding or flip chip bonding. In addition, since the flexible substrate 3 is supported by the frame 7, wire bonding can be easily performed.

  Mold resin portions 14 and 16 are formed by transfer molding or injection molding of the optical element 4 and the semiconductor element 5. At this time, since the optical element 4 and the semiconductor element 5 are arranged on the same plane, the molding operations of the mold resin portions 14 and 16 can be performed simultaneously. The injection molding can be performed only when flip chip mounting without using a wire is performed.

  Thereafter, the frame 7 is bent at the crease portions 9 a to 9 e to form the shield case 2.

  When the shield case 2 is formed, the optical fiber 6 is introduced from the through hole 11 of the guide portion 7c, and is held in the receiving hole 14b so that the end portion 6d faces the optical element 4.

  After the optical fiber 6 is completely introduced in this manner, the optical fiber 6 is held by bending the fixing claw 13 into the shield case 2.

  FIG. 4 is a diagram showing a state in which an optical wiring module 100 in which a light receiving element is mounted as an optical element and an optical wiring module 200 in which a light emitting element is mounted as an optical element are connected by an optical fiber 6. In this way, it is used to exchange information inside an information device such as a portable information terminal or a personal computer or an electronic device. In particular, in an electronic device that handles a signal with a high frequency, the use of the optical wiring module according to the present invention enables good communication that is not affected by high-frequency noise.

  The present invention is not limited to the embodiment described above.

  For example, in the optical wiring module 1 according to the present embodiment, the flexible substrate 3 is fixed by the base portion 7a and is movable with respect to the head portion 7b, but is fixed by the head portion 7b and the base. It may be movable with respect to the part 7a. Even when such a configuration is adopted, when the frame 7 is bent, the flexible substrate 3 moves on the base portion 7a side and escapes without causing excessive bending, so that the flexible substrate 3 and the wiring 3c are applied. Stress is relaxed.

  The flexible substrate 3 may be fixed by the head portion 7b and the base portion 7a. When such a configuration is employed, when the frame 7 is bent at the crease portion 9a, the deflection of the flexible substrate 3 escapes toward the long hole 8a. Thereby, the stress applied to the flexible substrate 3 is relaxed. And since the wiring 3c of the flexible substrate 3 straddles the long hole 8a, the stress applied to the wiring 3c is relieved.

  The wiring 3c may be formed at a position that does not cross the long hole 8a.

  Further, a lens may be provided at the bottom of the receiving hole 14b, that is, in front of the optical element 4. At this time, the lens is integrally formed with the mold resin portion 14.

  The optical element 4 is not limited to a simple light receiving element or light emitting element, but may be a photo IC integrated with a signal processing circuit or a light emitting IC integrated with a drive circuit. Further, a signal processing IC or a driving IC may be provided separately from the light receiving element or the light emitting element.

  The optical fiber 6 may be a multi-core fiber. In this case, resistance to bending of the optical fiber can be improved.

It is the perspective view which cut | disconnected the shield case of the optical wiring module which concerns on embodiment of this invention, and showed the internal structure. It is a perspective view which shows a mode that the shield case of the optical wiring module which concerns on embodiment of this invention was expand | deployed. In the optical wiring module which concerns on embodiment of this invention, it is a longitudinal cross-sectional view which shows a mode that the optical fiber is introduce | transduced into the shield case. It is a figure which shows the usage example of the optical wiring module which concerns on embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Optical wiring module, 2 ... Shield case, 3 ... Flexible board, 3c ... Wiring, 4 ... Optical element, 5 ... Semiconductor element, 6 ... Optical fiber, 6d ... End part, 7 ... Frame, 7a ... Base part, 7b ... head part, 7c ... guide part, 8a, 8b, 8c, 8d, 8e ... elongate hole (hole), 9a, 9b, 9c, 9d, 9e ... crease part, 11 ... through hole, 14 ... mold resin part (first) 1 mold resin part), 14b ... receiving hole, 16 ... mold resin part (second mold resin part), 16a ... support surface (upper surface of second mold resin part), 16b ... guide groove.

Claims (8)

In an optical wiring module that transmits or receives light using an optical fiber as a waveguide,
A frame having a head portion on one side and a base portion on the other side, and being foldable at a fold portion therebetween,
A flexible substrate arranged to overlap the frame at least at the head portion and the base portion;
An optical element that is mounted on the flexible substrate on the head side and transmits or receives light to or from the optical fiber;
A semiconductor element mounted on the flexible substrate on the base portion side and electrically connected to the optical element via a wiring formed on the flexible substrate;
A first substrate having a receiving hole formed in the flexible substrate so as to enclose the optical element and having a side surface extending toward a base, and into which an end of the optical fiber is introduced and which is narrowed toward the optical element; Mold resin part of
A second mold resin portion formed on the flexible substrate so as to enclose the semiconductor element and have a side surface extending toward the base;
With
When the frame is bent, the optical fiber is guided by the upper surface of the second mold resin portion, and the end portion thereof is in a positional relationship to be introduced into the optical element. Optical wiring module. The fold portion is provided by forming a hole in the frame;
The optical wiring module according to claim 1, wherein the flexible substrate is fixed by at least the head portion and the base portion and straddles the hole. The fold portion is provided by forming a hole in the frame;
The optical wiring module according to claim 1, wherein the flexible substrate is fixed at least by the head portion and the base portion, and the wiring straddles the hole.   The optical wiring module according to claim 1, wherein the flexible substrate is fixed at least at the base portion and is movable with respect to the head portion.   The optical wiring module according to claim 1, wherein the flexible substrate is fixed at least by the head portion and is movable with respect to the base portion.   The frame has a guide portion at a position opposite to the head portion through the base portion, and the guide portion has a through hole into which the optical fiber is introduced. The optical wiring module as described in any one of Claims 1-5.   The optical wiring module according to claim 1, wherein a guide groove that guides the optical fiber to the optical element is formed on the upper surface of the second mold resin portion. .   8. The optical wiring module according to claim 7, wherein the guide groove is narrowed toward the optical element.

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