JP2008006593A - Recorder - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent malfunction of a driving IC chip mounted on a flexible flat cable, to prevent stripping of mounted circuit elements when the circuit elements such as capacitors and resistances are mounted in the vicinity of the driving IC chip for the prevention, and also to surely bring the driving IC chip and a heat sink in tight contact with each other. <P>SOLUTION: The circuit element 80 which supplies a current to the driving IC chip and a recording element together with a power source is mounted between the driving IC chip 12c and the power source on the flexible flat cable 12. The action of the driving IC chip and the recording element can be secured even if resistance increases due to the fact that a wiring pattern is made fine. A flexible part of the flexible flat cable 12 is drawn around while being bent once or a plurality of the number of times to trace the heat sink 60. The driving IC chip 12c and the circuit elements 80 mounted on the flexible part are mounted at such positions as to avoid bending positions 74 and 75 at the flexible part. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a recording apparatus including a flexible flat cable on which a driving IC chip is mounted.

As a recording apparatus, for example, Patent Document 1 discloses a head-side circuit board (corresponding to the head substrate of Patent Document 1) in which a body-side board is disposed in an apparatus housing and is connected to the body-side board by a flexible flat cable. ) Is arranged on a carriage that is scanned with a recording head mounted thereon, and the recording head and the head side circuit board are connected with another flexible flat cable, and a drive pulse signal is output to the flexible flat cable. A structure for mounting a driving IC chip (corresponding to the driver IC of Patent Document 1) is described.
JP 2004-98465 A (see FIGS. 6 and 7)

  As the recording elements of the recording head increase in density, the wiring pattern formed on the flexible flat cable connected to the recording head also becomes finer, and the resistance of the wiring pattern increases. For this reason, the drive IC chip is mounted on the flexible flat cable so that the drive IC chip is placed as close as possible to the recording head.

  In addition, when a plurality of recording elements are driven almost simultaneously, there is a concern about voltage drop. Therefore, a capacitor is arranged on the head side circuit board on the carriage to compensate for the voltage. However, when control is diversified, for example, the number of types of drive pulse signals for driving the recording head is increased to increase the number of gradations, the wiring pattern for connecting the drive IC chip and the head side circuit board is also miniaturized. The drive IC chip may malfunction due to the resistance component or inductance component of the wiring pattern.

  The present invention solves the above-mentioned problems, and in the case where a drive IC chip is mounted on a flexible flat cable, the drive IC chip is prevented from malfunctioning and flexible without affecting the circuit elements for the prevention. An object of the present invention is to realize a recording apparatus capable of satisfactorily arranging a flat cable.

  In order to achieve the above object, a recording apparatus according to claim 1 comprises a recording head comprising a plurality of recording elements and an actuator having a plurality of drive units for selectively driving the recording elements, and the actuator A flexible flat cable having a wiring pattern electrically connected to one end of the driving unit, and mounted on the flexible flat cable connected to the wiring pattern, and selectively driving voltage signals to the driving unit of the actuator And a head holder that holds the recording head so that the recording element is exposed to the outside, wherein the flexible flat cable is bent and disposed in the head holder. The other end of the wiring pattern is connected to a signal source and a power source, and the driving IC chip is connected. A circuit element connected to the wiring pattern between the power source and the power source and supplying current to the drive IC chip and the recording element together with the power source is mounted on the flexible flat cable, and the circuit element is connected to the flexible flat cable. It is characterized by being arranged avoiding the bent part of the cable.

  According to a second aspect of the present invention, in the recording apparatus according to the first aspect, the driving IC chip converts a signal transmitted from the signal source into a signal corresponding to the plurality of recording elements. And a drive voltage signal generation circuit that generates a drive voltage signal suitable for driving the actuator based on the signal converted by the signal conversion circuit, and the power supply includes the signal conversion circuit and the drive voltage signal generation circuit The circuit element is connected to the wiring pattern between the drive voltage signal generation circuit and the power source and mounted on the flexible flat cable. It is characterized by that.

  According to a third aspect of the present invention, in the recording apparatus according to the second aspect, the circuit element includes the wiring pattern between the signal conversion circuit and the power source and between the drive voltage signal generation circuit and the power source. Are respectively mounted on the flexible flat cable.

  According to a fourth aspect of the present invention, in the recording apparatus according to any one of the first to third aspects, the circuit element is a capacitor interposed between a pair of wiring patterns for supplying the power. It is characterized by.

  According to a fifth aspect of the present invention, in the recording apparatus according to any one of the first to fourth aspects, the actuator is a piezoelectric actuator, and the circuit element is heated and cooled when the piezoelectric actuator is polarized. It includes an element for discharging generated charges.

  According to a sixth aspect of the present invention, in the recording apparatus according to any one of the first to fifth aspects, the head holder is provided with a heat sink that comes into contact with the drive IC chip so as to conduct heat, and the flexible flat cable is provided. Is bent one or more times along the heat sink, and the drive IC chip and the circuit element are mounted at a position avoiding the bent portion.

  According to a seventh aspect of the present invention, in the recording apparatus according to the sixth aspect, the head holder has a bottom plate to which the recording head is attached on the front side facing the recording medium. A slit hole through which the flexible flat cable is inserted from the front side to the back side is formed, the heat sink is provided on the back side of the bottom plate, and the flexible flat cable is at least at a position where the driving IC chip contacts the heat sink It is characterized by bending before and after.

  According to an eighth aspect of the present invention, in the recording apparatus according to the seventh aspect, the heat sink has a contact surface in contact with a surface parallel to the flexible flat cable of the drive IC chip, and the flexible flat cable is connected to the head. A guide surface that guides to the back side of the holder, and the flexible flat cable includes a first region that rises from the actuator so as to pass through the slit hole, and a second region that follows the contact surface of the heat sink. The driving IC chip is mounted substantially at the center of the second region, and the circuit element is bent of the flexible flat cable. It is characterized by being mounted substantially in the middle between the positions.

  The invention according to claim 9 is the recording apparatus according to claim 8, wherein the contact surface of the heat sink has at least a size that covers the entire surface of the driving IC chip parallel to the flexible flat cable, The circuit element is mounted at a position that does not contact the heat sink on the surface of the flexible flat cable on which the driving IC chip is mounted.

  According to a tenth aspect of the present invention, in the recording apparatus according to any one of the first to ninth aspects, the circuit element is mounted on a surface of the flexible flat cable opposite to a surface on which the driving IC chip is mounted. It is characterized by that.

  According to the first aspect of the present invention, the circuit element for supplying current to the driving IC chip and the recording element together with the power source is mounted on the flexible flat cable between the driving IC chip and the power source. Even if the resistance is increased due to the miniaturization of the pattern, the operation of the driving IC chip and the recording element can be ensured. Further, even when the flexible flat cable is bent and disposed in the head holder, the circuit element can be prevented from being peeled off due to the stress caused by the bending of the flexible flat cable.

  According to the second aspect of the invention, the signal transmitted from the signal source is converted into a signal corresponding to a plurality of recording elements, and a drive voltage signal suitable for driving the actuator is generated based on the converted signal. . At that time, the circuit element contributes to the generation of the drive voltage signal. According to the third aspect of the present invention, it is possible to further prevent malfunction in signal conversion corresponding to a plurality of recording elements.

  According to the fourth aspect of the present invention, the above operation can be realized by a capacitor.

  According to the fifth aspect of the present invention, charges generated by heating and cooling when the piezoelectric actuator is polarized in the manufacturing process can be safely discharged without affecting the driving IC chip.

  According to the invention described in claim 6, the flexible flat cable can be bent to bring the driving IC chip into contact with the heat sink, and at that time, the circuit element is peeled off due to the stress caused by the bending of the flexible flat cable. Can be prevented.

  According to the seventh aspect of the invention, the recording head is attached to the bottom plate of the head holder, and the flexible flat cable is inserted through the slit hole of the bottom plate and bent before and after contacting the heat sink. More specifically, according to the invention described in claim 8, the flexible flat cable rises from the actuator, is inserted through the slit hole, contacts the heat sink, and moves toward the back side of the head holder along the guide surface of the heat sink. Guided. The circuit element is arranged at the center between the bending positions of the flexible flat cable, so that the bending arrangement of the flexible flat cable is not hindered.

  According to the ninth aspect of the present invention, the circuit element can be arranged without hindering the contact between the drive IC chip and the heat sink, and the heat generated by the drive IC chip can be efficiently discharged by the heat sink over a wide area.

  According to the invention described in claim 10, since the circuit element is mounted on the surface of the flexible portion opposite to the surface on which the driving IC chip is mounted, the flexible flat cable on the side on which the driving IC chip is mounted is mounted. Since it does not protrude from the surface, there is no possibility of contact with the heat sink regardless of the mounting height of the circuit element, and the contact between the heat sink and the drive IC chip is not hindered, so that the heat of the drive IC chip is surely secured. The heat can be dissipated by a heat sink.

  A basic embodiment of the present invention will be described below. FIG. 1 shows an example in which the recording apparatus of the present invention is embodied in an ink jet recording apparatus 100. The inkjet recording apparatus 100 according to the embodiment is applied not only as a single printer apparatus but also as a printer function of a multi-function device (MFD: Multi Function Device) having a copy function, a scanner function, a facsimile function, and the like. Is something that can be done. The ink jet recording apparatus 100 is provided inside the main body frame 2, and a recording head 1 that records ink by ejecting ink onto a paper PA that is a recording medium is mounted on the carriage 3, and extends along the main scanning direction (Y direction). Configured to travel.

  The carriage 3 is slidably mounted on a rear guide shaft 6 and a front guide shaft 7 provided in parallel in the main frame 2 along the main scanning direction (Y direction). The carriage drive motor 17 disposed on the right rear side and the timing belt 18 which is an endless belt are configured to reciprocate in the main scanning direction (Y direction). Ink is supplied to the carriage 3 side from ink supply sources (ink tanks) 5 a to 5 d that are stationary in the main body frame 2 through ink supply pipes 14 (14 a to 14 d). In this embodiment, four colors of ink are provided: yellow ink (Y), magenta ink (M), cyan ink (C), and black ink (Bk).

  The paper PA is transported horizontally on the lower surface side of the recording head 1 along a sub-scanning direction (X direction) orthogonal to the main scanning direction (Y direction) by a known paper transport mechanism (not shown) (FIG. 1). Arrow A direction). On this paper PA, ink is ejected downward from a nozzle (not shown) opened on the lower surface of the recording head 1 moving in the main scanning direction (Y direction), and recording is performed. In the description, the opening surface side of the nozzle of the recording head 1 is described as the front surface or the lower surface, and the opposite side is described as the back surface or the upper surface.

  As shown in FIG. 2, the carriage 3 is provided with a substantially box-shaped head holder 8, and the recording head 1 faces the nozzle downward in a concave portion 8 b that opens downward on the lower surface side of the bottom plate 8 a of the head holder 8. And is fixed so as to be substantially parallel to the bottom plate 8a (see FIG. 3).

  On the back side of the head holder 8, a head side circuit board 22 on which an electric circuit is formed which is electrically connected to a main body side board (not shown) arranged in the recording head 1 and the main body frame 2 is arranged. ing. The head side circuit board 22 is disposed at a position overlapping the recording head 1 in plan view from the back side of the head holder 8.

  A damper device 9 that stores ink supplied to the carriage 3 side is mounted between the recording head 1 and the head-side circuit board 22 and on the upper surface side of the bottom plate 8 a of the head holder 8. The interior of the damper device 9 is partitioned into a plurality of ink chambers, and ink is stored for each color in the ink chamber. The damper device 9 is also provided with an exhaust valve means 9b for removing bubbles remaining in the ink in the ink chamber.

  An opening (not shown) is formed through the bottom plate 8a of the head holder 8. Inside the opening, an ink outlet 9a of the damper device 9 and an ink intake 37 of the recording head 1 are provided. Ink is independently supplied for each color from the damper device 9 to the recording head 1 through a connection hole 15b of the reinforcing frame 15 described later and an elastic seal member 9c (see FIG. 2).

  As shown in FIGS. 2 and 3, the bottom plate 8a of the head holder 8 has a slit hole 55 through which a flexible portion 12b of the flexible flat cable 12 described later is inserted from the front side to the back side, and a front side of the bottom plate 8a. A through hole 56 for pouring the adhesive 19 for fixing the recording head 1 is also formed.

  The recording head 1 includes a cavity portion 10 having a plurality of nozzles open on the lower surface and having an ink flow path therein, an actuator 11 that selectively applies ejection pressure to the ink in the cavity portion 10, and a drive signal to the actuator 11. Is provided with a head unit 20 having a structure in which a flexible flat cable 12 for outputting is laminated, a heat conductive plate 13 and a reinforcing frame 15 are provided on the back side of the head unit 20, and a front frame 16 surrounding the outer periphery is provided. .

  The cavity portion 10 is individually supplied to each ink intake port 37 exposed on one end side in the X direction on the upper surface thereof, similar to those known in Japanese Patent Application Laid-Open Nos. 2001-246744 and 2005-313428. The ink is distributed to a number of pressure chambers (all not shown) through the manifold chambers. Then, when the drive unit of the actuator 11 is driven and the discharge pressure is selectively given to the pressure chamber, ink is discharged from the nozzle communicating with the pressure chamber.

  In this embodiment, the actuator 11 is sandwiched between a plurality of ceramic layers stacked in a direction perpendicular to the flat direction and the ceramic layers, as in the known one disclosed in Japanese Patent Application Laid-Open No. 2005-322850. The drive part, that is, the active part is formed in the region of the ceramic layer sandwiched between the internal electrodes (not shown).

  On the upper surface of the actuator 11, an external individual electrode 43 connected to an independent electrode for each pressure chamber among the internal electrodes through an electrical through hole, and an external electrode connected to an internal electrode common to each pressure chamber. A common electrode 44 is formed, and the active portion is displaced by a drive pulse signal applied to the external individual electrode 43 to selectively apply a discharge pressure to a number of pressure chambers. The external individual electrode 43 is individually electrically connected to the terminal electrode 12d (see FIG. 6) formed on the flexible flat cable 12, and the external common electrode 44 is connected to the common potential line COM formed on the flexible flat cable 12. Electrically connected.

  The reinforcing frame 15 is a member that reinforces the cavity portion 10, and has a frame shape made of a material (for example, a metal plate such as SUS) having higher rigidity than the cavity portion 10. It is formed to be slightly larger than 10. The reinforcing frame 15 is laminated so as to surround the actuator 11 along the back surface of the cavity portion 10, and is bonded and fixed to prevent deformation and distortion of the thin flat cavity portion 10. A connection hole 15b corresponding to the ink inlet 37 of the cavity portion 10 is formed on one end side in the X direction of the frame portion 15a of the reinforcing frame 15 so as to penetrate the front and back surfaces.

  The heat conductive plate 13 is laminated at a position corresponding to the actuator 11 on the back surface of the flexible flat cable 12. The heat conduction plate 13 is a flat plate material having a rectangular shape in plan view and having a size covering almost the entire surface of the actuator 11, has better heat conductivity than the actuator 11 and the flexible flat cable 12, and is more rigid than the flexible flat cable 12. For example, a metal plate such as aluminum, copper, or SUS is used. The heat conductive plate 13 is brought into close contact with the actuator 11 via the flexible flat cable 12, thereby dispersing the local heat generation of the actuator 11, suppressing variations in temperature distribution, and providing heat dissipation. Furthermore, there is an effect of increasing the rigidity of the entire head unit 20. The heat conductive plate 13 may be omitted.

  The front frame 16 is a flat plate material having a U-shape in plan view, is disposed so as to surround the cavity portion 10, and is fixed to the front surface of the reinforcing frame 15 (see FIGS. 2 and 3). The front frame 16 eliminates a step between the nozzle surface of the cavity portion 10 and the periphery of the head holder 8, and prevents the nozzle surface from being caught when the nozzle surface is cleaned with a wiping member or the like.

  The flexible flat cable 12 has a band shape, and one end thereof is a flat portion 12a that is electrically joined to the external individual electrode 43 and the external common electrode 44 of the actuator 11, and the other end continuous to the flat portion 12a is a flexible portion. 12b. A driving IC chip 12c for driving the actuator 11 is mounted on the upper surface of the flexible portion 12b. The distal end side of the flexible portion 12b is connected to the head side circuit board 22 by the connection terminal 12f.

  Although the flexible flat cable 12 can be constituted by a single continuous cable, in this embodiment, the first cable 121 and the second cable 122 are connected in the longitudinal direction via the connection terminal 12e. It has a structure to do. In the first cable 121, a terminal electrode 12 d electrically connected to the actuator 11, a common potential line COM, and a wiring pattern for connecting to the driving IC chip are printed on an insulating film. The second cable is a general-purpose cable having a plurality of wiring patterns in parallel. The flat portion 12 a overlapped with the actuator 11 is provided only in the first cable 121, but the flexible portion 12 b is configured by both cables 121 and 122.

  In the flat portion 12a, a plurality of terminal electrodes 12d for electrical connection with the piezoelectric actuator 11 are formed on the lower surface on the side facing the piezoelectric actuator 11 of the upper and lower surfaces (front and back surfaces) of the flexible flat cable 12. . In the flexible part 12b, a driving IC chip 12c and a circuit element 80 such as a capacitor and a resistor are mounted on the upper surface of the flexible flat cable 12 (on the side opposite to the lower surface on which the terminal electrode 12d is formed).

  A rubber-like elastic member 61 and a heat sink 60 facing the rubber elastic member 61 are attached to a position near one side plate on the back side of the bottom plate 8 a of the head holder 8, and a driving IC chip mounted on the flexible flat cable 12. 12c is parallel to the bottom plate 8a and is sandwiched between the elastic member 61 and the heat sink 60. That is, the wide surface of the drive IC chip 12c parallel to the flexible flat cable 12 is in close contact with the heat sink 60 so as to allow heat conduction.

  The heat sink 60 is substantially parallel to the bottom plate 8a and is in close contact with the driving IC chip of the flexible flat cable 12. The heat sink 60 is substantially parallel to the side wall of the head holder 8 and guides the flexible flat cable 12 to the head side circuit board 22 side. This is a metal member that is bent so that the surface 60b is L-shaped in a side view. The contact surface 60a has a length for allowing the flexible flat cable 12 to be inserted thereunder, and has an area in close contact with the entire wide surface of the drive IC chip 12c. Two cables constituting the flexible flat cable 12 are connected at a position near the lower end of the guide surface 60 b of the heat sink 60.

  As described above, the flexible flat cable 12 rises from the actuator 11, passes through the slit hole 55 of the bottom plate 8 a of the head holder 8, and is routed to the back side of the head holder 8 along the L shape of the heat sink 60. . That is, for this routing, the first cable 121 in the flexible flat cable 12 is bent twice in a stepped manner. That is, the first cable 121 includes a first region 71 rising from the piezoelectric actuator 11 to pass through the slit hole 55 and a second along the contact surface 60 a of the heat sink 60, as shown in FIGS. 5 and 6. The second region 72 and the third region 73 along the guide surface 60b of the heat sink are formed with the second bent position 75 as a boundary. The In this embodiment, the third region 73 is a region from the second bending position 75 to the end of the first cable 121 (connection terminal 12e).

  As shown in FIG. 6, the driving IC chip 12c has a mounting length L parallel to the longitudinal direction of the first cable 121 and a mounting width W shorter than a width orthogonal to the longitudinal direction of the first cable 121. The second region 72 is mounted at substantially the center.

  FIG. 9 shows an example of an electrical circuit applied to this embodiment. In the recording apparatus, the main body side substrate 90, the head side circuit substrate 22, the drive IC chip 12c, and the actuator 11 are connected to each other. A control circuit 93, a control signal power supply 94, and a drive pulse power supply 95 are mounted on the main body side substrate 90, and the drive IC chip 12c is formed of a signal conversion circuit 96 and a drive voltage signal generation circuit 97.

  The control circuit 93 outputs control signals such as enable, data, clock, and strobe signals to the signal conversion circuit 96 based on predetermined recording information, and is connected to the signal conversion circuit 96 via the control signal wiring 98. . The control signal power supply 94 supplies a voltage (for example, 5 volts) to the signal conversion circuit 96, and is connected to the signal conversion circuit 96 via a drive VDD1 wiring for applying a drive voltage and a ground VSS1 wiring. Has been. The drive pulse power supply 95 supplies a voltage (for example, 20 volts) to the drive voltage signal generation circuit 97, and the drive voltage signal generation circuit via the drive VDD2 wiring for applying the drive voltage and the ground VSS2 wiring. 97 is connected.

  Specifically, a flexible flat cable having a driving VDD1, VDD2 wiring, grounding VSS1, VSS2 wiring, and control signal wiring 98 in a planar shape in the width direction between the main body side substrate 90 and the head side circuit substrate 22. 99 is connected. Between the driving IC chip 12c mounted on the first cable 121 and the head side circuit board 22, the wirings and the common potential line COM connected to the external common electrode 44 of the actuator 11 are provided in a planar shape. The second cable 122 is connected.

  On the head side circuit board 22, the electrolytic capacitor 109 is bypass-connected to the drive VDD 2 wiring and the ground VSS 2 wiring, and charges supplied to the drive voltage signal generation circuit 97 are stored, and the drive voltage signal generation circuit 97 is instantaneously connected. The occurrence of a voltage drop in the drive pulse power supply 95 due to the large current flowing is suppressed. Further, the ground VSS2 wiring and the common potential line COM connected to the external common electrode 44 of the actuator 11 are connected to each other. On the first cable 121 or in the driving IC chip 12c, the grounding VSS2 wiring and the grounding VSS1 wiring are connected to each other via a resistor R, and the driving voltage signal generation circuit 97 and the signal conversion circuit 96 are connected to each other. It is held at the same potential.

  The signal conversion circuit 96 converts the control signal from the control circuit 93 into a control signal corresponding to each nozzle, and includes a shift register 106, a D flip-flop 107, and a gate circuit 108. A number of shift registers 106 and the like are prepared corresponding to the number of nozzles. Of the control signals transmitted from the control circuit 93 via the control signal wiring 98, the data and the clock signal are supplied to the shift register 106, the strobe signal is supplied to the D flip-flop 107, and the enable signal is supplied to the gate circuit 108. Supplied. The data is serially transferred from the control circuit 93, converted into a parallel signal corresponding to the nozzle row by the shift register 106, and output from the D flip-flop 107 based on the strobe signal. Then, an enable (drive waveform signal) corresponding to the data is output from the gate circuit 108.

  The drive voltage signal generation circuit 97 converts the enable (drive waveform signal) output from the gate circuit 108 into a voltage for driving the actuator 11 based on the voltage supplied from the drive pulse power supply 95 to drive pulses. Are generated and output, and 150 drivers 110 are prepared corresponding to the number of nozzles.

  According to the recording apparatus configured as described above, the voltage supplied from the control signal power supply 94 to the signal conversion circuit 96 is supplied to the signal conversion circuit 96 via the drive VDD1 wiring. Drive normally. On the other hand, the voltage supplied from the drive pulse power supply 95 to the drive voltage signal generation circuit 97 is supplied to the drive pulse generation circuit 97 via the drive VDD2 wiring, and the electrolytic capacitor 109 on the way is charged. . When ink is ejected, a current is supplied from the electrolytic capacitor 109 to the drive pulse generation circuit 97 via the drive VDD 2 wiring, and a sufficient current is supplied to the actuator 11.

  On the first cable 121, as a circuit element 80 arranged in the vicinity of the driving IC chip 12c, between the driving VDD1 wiring and the ground VSS1 wiring, and between the driving VDD2 wiring and the ground VSS2 wiring. In addition, each capacitor 80a is bypass-connected, and a resistor 80b is connected between the COM (ground) wiring and the VSS2 wiring.

  Since each transistor for ON / OFF of the actuator in the driver circuit 110 of the drive voltage signal generation circuit 97 is connected in series, a transient current flows through the ground VSS2 wiring when the actuator is ON. If the capacitor 80a is not provided, a relatively high voltage is generated in VSS2 due to the wiring resistance and inductance of the flexible flat cable 12, but a resistor R having a low resistance value is connected between VSS1 and VSS2. When the voltage of VSS2 rises, the VSS1 voltage rises, the relative voltage relationship with the control signal such as data is lost in the signal conversion circuit 96, the control signal is not recognized normally, and malfunction may occur. However, if the capacitor 80a is mounted in the vicinity of the driving IC chip 12c, the charging current at the time of driving the actuator is supplied from the capacitor 80a, so that the voltage increase of VSS2 and VSS1 can be suppressed to be small and malfunction in recognition of the control signal is prevented. It can be done.

  On the other hand, when the piezoelectric material of the actuator 11 is polarized in the manufacturing process, a charge is generated when heated and cooled. If this charge is short-circuited between the common potential line COM and the drive IC chip 12c or the control signal, the charge is generated. The driving IC chip 12c may be destroyed by a large current. Therefore, by mounting the resistor 80b in the vicinity of the driving IC chip 12c, the charge is discharged through the resistor 80b, and the driving IC chip 12c can be prevented from being destroyed.

  Thus, the effect is exhibited by mounting the capacitor 80a and the resistor 80b on the flexible flat cable 12 in the vicinity of the drive IC chip 12c. FIG. 6 shows a specific arrangement mode.

  Note that the VDD1, VDD2 wiring, VSS1, VSS2 wiring, and common potential line COM in FIG. 9 are actually symmetrical on the first cable 121 along both side edges parallel to the direction drawn from the actuator. Since it is formed, as shown in FIG. 6, the circuit element 80 is also mounted at positions along both side edges. In FIG. 6, the circuit element 80 is arranged on the actuator side of the driving IC chip 12c or on the extension in the width W direction of the driving IC chip 12c. It is possible to route the wiring to the actuator side with respect to the driving IC chip 12c.

  One or a plurality of circuit elements 80 are mounted in accordance with the driving IC chip 12c and wirings connected thereto, but none of them overlaps with the driving IC chip 12c, and the first bent position 74 and the second bending position 74. It is mounted avoiding the bent position 75.

  In the development view of the first cable 121 in FIG. 6, it is desirable that any circuit element 80 is mounted at the approximate center in the longitudinal direction (longitudinal direction of the cable 121) in each region 71, 72, 73. As a result, a mounting portion (a metal exposed portion such as a land) formed on the cable 121 for mounting the circuit element 80 is stressed by bending the cable 121 at the first and second bent positions 73 and 74. Can be prevented.

  Furthermore, as shown by the two-dot chain line in the developed view of FIG. 7, the mounting width W of the drive IC chip 12c in the first to third regions 71 to 73 is set in the longitudinal direction (Y direction). It is desirable not to mount the circuit element 80 in the extended region and the region in which the mounting length L of the chip-like circuit 12c is extended in the width direction (X direction). If the circuit element 80 having a higher mounting height than the driving IC chip 12c is mounted in these regions, the circuit element 80 having a higher mounting height is large enough to cover the entire planar area of the driving IC chip 12c. There is a risk of contact with the heat sink 60 having the contact surface 60a.

  Accordingly, the circuit element is previously divided into a region in which the mounting width W of the driving IC chip 12c is extended in the longitudinal direction (Y direction) and a region in which the mounting length L of the driving IC chip 12c is extended in the width direction (X direction). Since 80 is not mounted, the contact between the contact surface 60a of the heat sink 60 and the drive IC chip 12c is not hindered, and the heat radiation of the drive IC chip 12c can be reliably performed.

  In addition to the above, as shown in FIG. 8, all of the circuit elements 80 may be mounted on the surface of the flexible flat cable 12 opposite to the surface on which the drive IC chip 12c is mounted. In this case, the driver IC chip 12c and the flexible flat cable 12 may be mounted in an overlapping region.

  Of course, the arrangement of the circuit elements 80 shown in FIGS. 6 to 8 may be combined, or the arrangement of the circuit elements 80 may be appropriately displaced according to the planar shape of the flexible flat cable 12 or the presence or absence of a penetrating portion.

  In the above-described embodiment, an example in which the present invention is applied to an ink jet recording apparatus has been described. However, as long as a plurality of recording elements and a driving unit corresponding thereto are provided, the invention can be applied to various recording apparatuses such as an impact type. it can.

It is a top view of the inkjet recording device of this Embodiment. It is a disassembled perspective view of a carriage. It is sectional drawing which cut | disconnected the carriage along the Y direction. FIG. 3 is an exploded perspective view of a recording head. It is an expanded sectional view near a circuit element and a heat sink. It is an expanded view of a flexible flat cable. It is an expanded view of another example of a flexible flat cable. It is an expanded view of another example of a flexible flat cable. It is an electric circuit diagram of the ink jet recording apparatus of the present embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Recording head 3 Carriage 8 Head holder 10 Cavity part 11 Piezoelectric actuator 12 Flexible flat cable 12a Flat part 12b Flexible part 12c Drive IC chip 22 Head side circuit board 43 External electrode 60 Heat sink 71 1st area | region 72 2nd area | region 73 Third region 74 First bent position 75 Second bent position 80 Circuit element 100 Inkjet recording apparatus

Claims (10)

A recording head comprising a plurality of recording elements and an actuator having a plurality of drive units for selectively driving the recording elements;
A flexible flat cable having a wiring pattern in which one end is electrically connected to the actuator drive unit;
On the flexible flat cable, connected to the wiring pattern and mounted, a driving IC chip that selectively supplies a driving voltage signal to the driving unit of the actuator;
In a recording apparatus having a head holder for holding the recording head so that the recording element is exposed to the outside,
The flexible flat cable is bent and arranged in the head holder, and the other end of the wiring pattern is connected to a signal source and a power source.
A circuit element connected to the wiring pattern between the drive IC chip and the power supply and supplying current to the drive IC chip and the recording element together with the power supply is mounted on the flexible flat cable,
A recording apparatus, wherein the circuit element is arranged avoiding a bent portion of the flexible flat cable. The drive IC chip is suitable for driving the actuator based on a signal conversion circuit that converts a signal transmitted from the signal source into a signal corresponding to the plurality of recording elements, and a signal converted by the signal conversion circuit. A drive voltage signal generation circuit for generating a drive voltage signal, and the power supply supplies a current for operating the circuit to the signal conversion circuit and the drive voltage signal generation circuit.
The recording apparatus according to claim 1, wherein the circuit element is mounted on the flexible flat cable connected to the wiring pattern between the drive voltage signal generation circuit and the power source.   The circuit elements are respectively mounted on the flexible flat cable connected to the wiring patterns between the signal conversion circuit and the power supply and between the drive voltage signal generation circuit and the power supply. The recording apparatus according to claim 2.   The recording apparatus according to claim 1, wherein the circuit element is a capacitor interposed between a pair of wiring patterns for supplying the power.   5. The actuator according to claim 1, wherein the actuator is a piezoelectric actuator, and the circuit element includes an element for discharging electric charges generated by heating and cooling when the piezoelectric actuator is polarized. The recording device described in 1.   The head holder is provided with a heat sink that comes into contact with the drive IC chip so as to be capable of conducting heat, and the flexible flat cable is bent one or more times along the heat sink, and the drive IC chip and 6. The recording apparatus according to claim 1, wherein the circuit element is mounted at a position avoiding the bent portion. The head holder has a bottom plate to which the recording head is attached on the front side facing the recording medium, and the bottom plate has a slit hole through which the flexible flat cable is inserted from the front side to the back side. The heat sink is provided on the back side of the bottom plate,
The recording apparatus according to claim 6, wherein the flexible flat cable is bent at least before and after a position where the driving IC chip contacts the heat sink. The heat sink has a contact surface that contacts a surface parallel to the flexible flat cable of the drive IC chip, and a guide surface that guides the flexible flat cable to the back side of the head holder,
The flexible flat cable has a first region rising from the actuator so as to pass through the slit hole, a second region along the contact surface of the heat sink, and a third region along the guide surface of the heat sink. Bend to have
The driving IC chip is mounted substantially in the center of the second region,
The recording apparatus according to claim 7, wherein the circuit element is mounted substantially in the center between the bending positions of the flexible flat cable. The contact surface of the heat sink has at least a size that covers the entire surface of the drive IC chip parallel to the flexible flat cable,
9. The recording apparatus according to claim 8, wherein the circuit element is mounted at a position where the circuit element is not in contact with the heat sink on a surface on which the driving IC chip of the flexible flat cable is mounted. The recording apparatus according to claim 1, wherein the circuit element is mounted on a surface of the flexible flat cable opposite to a surface on which the driving IC chip is mounted.

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