JP2007538384A5

JP2007538384A5 -

Info

Publication number: JP2007538384A5
Application number: JP2007500863A
Authority: JP
Filing date: 2005-02-14
Publication date: 2008-04-03

Claims

A cooling surface having a hot spot region that generates a high heat flow;
A sprayer that is spaced apart from the hot spot area and that primarily collides within the hot spot area and creates a cooling thin film that can convert the supply of cooling liquid into droplets of a non-increasing pattern When,
Including
The cooling thin film cools the hot spot region mainly by evaporation,
A spray cooling system in which a portion of the cooling thin film distributed in the hot spot area that does not evaporate creates a thicker cooling film on the remaining area of the cooling surface.

The spray cooling system of claim 1 , further comprising at least one secondary opening for adding the coolant in a continuous and non-increasing manner to the cooling thick film.

The spray cooling system according to claim 2 , wherein the secondary opening is a droplet discharge device.

The spray cooling system of claim 1 , further comprising a steam management protrusion surrounding the sprayer.

The spray cooling system of claim 1 , wherein at least a portion of the cooling surface comprises a plurality of microchannels.

The spray cooling system of claim 1 , wherein the sprayer is at an angle that is not perpendicular to the component.

The spray cooling system according to claim 1 , wherein the sprayer is an atomizer.

An electronic component with a cooling surface having a hot spot region that generates a high heat flow;
A nebulizer that is spaced apart from the hot spot area and that collides within the hot hot spot area to create a cooling thin film that can convert the supply of cooling liquid into droplets of a non-increasing pattern; ,
Including
The cooling thin film cools the hot spot region mainly by evaporation,
A spray cooling system in which a portion of the cooling thin film distributed in the hot spot area that does not evaporate creates a thicker cooling film on the remaining area of the cooling surface.

The spray cooling system of claim 8 , further comprising at least one secondary opening for adding the coolant in a continuous and non-incremental manner to the cooling thick film.

The spray cooling system of claim 9 , wherein the secondary opening is an additional droplet discharge device.

The spray cooling system of claim 8 , further comprising a steam management protrusion surrounding the sprayer.

The spray cooling system of claim 8 , wherein at least a portion of the cooling surface comprises a plurality of microchannels.

The spray cooling system of claim 8 , wherein the sprayer is at an angle that is not perpendicular to the component.

The spray cooling system according to claim 8 , wherein the sprayer is an atomizer.

A cooling surface having a hot spot area with a first heat flow;
At least one relationship that is spaced apart from the hot spot area and that can convert the supply of coolant into a continuous, non-increasing pattern of droplets that collide on the hot spot area to create a cooling thin film A nebulizer;
Including
The cooling thin film absorbs the first heat flow;
The radial flow of the cooling thin film creates a thicker cooling film on the second region of the electronic component, and the second region generates a second heat flow that is less than one third of the magnitude of the first heat flow. ,
The thicker cooling film absorbs the second heat flow.

The thermal management system of claim 15 , further comprising at least one secondary opening for adding the coolant in a continuous and non-increasing manner to the thicker cooling film.

The thermal management system of claim 16 , wherein the at least one secondary opening is a droplet ejection device.

The thermal management system of claim 15 , further comprising a steam management protrusion surrounding the at least one sprayer.

The thermal management system of claim 16 , wherein at least a portion of the cooling surface comprises a plurality of etched microchannels.

The thermal management system of claim 16 , wherein the nebulizer makes a substantial angle with the component.

The thermal management system of claim 16 , wherein the second heat flow is 100 watts per square centimeter or less.

The thermal management system of claim 16 , wherein the sprayer is an atomizer.

The thermal management system according to claim 16 , wherein a water jump phenomenon occurs between the cooling thin film and the thicker cooling film.

An electronic component comprising a cooling surface having a hot spot that generates a first heat flow, wherein the portion of the cooling surface that is not a hot spot generates a second heat flow and is cooled;
The first heat flow is at least three times as large as the second heat flow,
A continuous, non-increasing pattern that is spaced apart from the hot spot and forms a non- perpendicular angle, creating a thin cooling film on the hot spot and a thick film on the non- hot spot portion of the cooling surface. At least one atomizer that distributes droplets onto the hot spot, the cooling film can cool the hot spots, and the thick film can cool non-hot spots of the cooling surface; ,
A liquid cooling system comprising.

25. The liquid cooling system of claim 24 , wherein the first heat flow is at least three times larger in magnitude than the second heat flow.

25. The liquid cooling system of claim 24, further comprising at least one secondary nozzle for adding a supply of coolant in a continuous and non-incremental manner to the thick film.

An electronic component with a cooling surface having a hot spot region that generates a high heat flow;
  A nebulizer that is spaced apart from the hot spot area and that collides in the hot hot spot area and creates a cooling thin film that can convert the supply of cooling liquid into droplets of a non-increasing pattern; ,
Including
  The atomizer is an atomizer;
  The cooling thin film cools the hot spot region mainly by evaporation,
  The portion of the cooling thin film distributed in the hot spot area that does not evaporate creates a thicker cooling film on the remaining area of the cooling surface,
  Including at least one secondary opening for adding the coolant in a continuous and non-increasing manner to the cooling thick film;
  A spray cooling system comprising at least one steam management protrusion surrounding the sprayer.