JP2007335575A - Lead-out unit of circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead-out unit of a circuit board which can simplify the structure of each of lead-out units of a plurality of flexible lead-out boards, even when the flexible circuit boards are to be used. <P>SOLUTION: The lead-out unit is provided with a first lead-out unit 11 formed by leading out a first lead-out pattern 17 from a circuit pattern 15 formed on a first flexible circuit board 10, and a second lead-out unit 51, formed by leading out a second lead-out pattern 57 from a circuit pattern 55 formed on a second flexible circuit board 50. The periphery of roots of each of the first and second lead-out units 11, 51 are covered with a molded case 100, in a state where the first and the second lead-out patterns 17, 57 of the first and second lead-out units 11, 51 are arranged in parallel so as to face the same surface side, thereby integrating the first and second lead-out units 11, 51. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a lead-out portion of a circuit board provided at a predetermined position of a flexible circuit board.

  Conventionally, a flexible circuit board is provided with a lead-out portion for connecting a circuit pattern formed on the surface thereof to a circuit of another electronic component (for example, a main board) (see, for example, Patent Document 1).

  On the other hand, different types of flexible circuit boards may be used depending on applications. For example, as a flexible circuit board that requires soldering, a circuit board is formed by etching a copper foil pasted on a synthetic resin film made of high heat-resistant polyimide (hereinafter referred to as “PI”), This is a case where a flexible circuit board that does not require soldering is one in which a circuit pattern is formed by screen printing a conductive paste on a synthetic resin film made of inexpensive polyethylene terephthalate (hereinafter referred to as “PET”). .

  However, as described above, when a plurality of flexible circuit boards are used in one device, lead-out portions are pulled out from the respective flexible circuit boards, and the plurality of lead-out portions are connected to other electronic components at different positions. There is a problem that not only the connection work becomes complicated, but also a plurality of connectors for connection are required, resulting in an increase in cost.

Here, the connector is configured by installing a contact portion made of a metal clamping piece or the like in parallel in an insertion port provided in a housing made of synthetic resin or the like, and inserting the tip of the lead-out portion into the insertion port. Thus, each lead-out pattern on the lead-out portion is brought into contact with each contact portion of the connector to electrically connect the two, thereby each circuit pattern on the flexible circuit board connected to each lead-out pattern And another circuit connected to each contact portion are electrically connected.
JP 200487710 A

  The present invention has been made in view of the above points, and an object thereof is to provide a lead-out portion of a circuit board that can simplify the structure of the lead-out portions even when a plurality of flexible circuit boards are used. It is in.

  The invention according to claim 1 of the present application is based on a first lead-out portion obtained by drawing out a first lead-out pattern from a circuit pattern formed on a first flexible circuit board, and a circuit pattern formed on a second flexible circuit board. A second lead-out portion formed by pulling out the second lead-out pattern, wherein the first and second lead-out patterns of the first and second lead-out portions are arranged in parallel toward the same surface side. It is in the lead-out portion of the circuit board characterized by being integrated.

  The invention according to claim 2 is characterized in that the first and second lead-out portions are integrated by attaching a reinforcing plate across both the first lead-out portion and the second lead-out portion. It exists in the lead-out part of the circuit board of Claim 1.

  According to a third aspect of the present invention, the circuit board lead-out according to claim 2, wherein the reinforcing plate is provided with a projecting pressing portion that presses the lead-out portion toward the distal end thereof. In the department.

  In the invention described in claim 4 of the present application, the first and second lead-out portions are integrated by covering the periphery of the base side portion of the first and second lead-out portions installed in parallel with a case by molding. The circuit board according to claim 1, wherein the circuit board has a lead-out portion.

  According to a fifth aspect of the present invention, the first flexible circuit board is formed by forming the circuit pattern and the first lead-out pattern by etching or metal vapor deposition of a metal foil attached on a synthetic resin film. 5. The circuit according to claim 1, wherein said circuit pattern and said second lead-out pattern are formed by applying a conductive paste on a synthetic resin film. Located in the lead-out portion of the board.

  According to the first aspect of the present invention, since the first and second lead-out patterns of the first and second lead-out portions are integrated in a state of being installed in parallel toward the same surface side, Even when a plurality of flexible circuit boards are used, their lead-out portions can be concentrated into one, and the structure can be simplified. Further, since there is only one lead-out portion, connection work to a connector or the like of the lead-out portion (in addition to the connector, there is a connection structure using solder or a conductive adhesive) is simplified.

  According to invention of Claim 2, the 1st, 2nd lead-out part installed in parallel can be integrated easily and can be reinforced.

  According to the third aspect of the present invention, it is easy to press and pull out the lead-out portion when the lead-out portion is connected to a connector or the like.

  According to the fourth aspect of the present invention, the first and second lead-out portions installed in parallel can be reliably fixed and integrated. Further, by gripping the case, the handling of the lead-out portion is facilitated, and for example, attachment / detachment work to / from a connector or the like can be easily performed.

  According to the fifth aspect of the present invention, the structure of the lead-out portion can be easily simplified even between flexible circuit boards using different printing methods, and the connection work of the lead-out portion to a connector or the like can be simplified. it can.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
1 and 2 are views showing a lead-out portion 1-1 of the circuit board according to the first embodiment of the present invention. FIG. 1 is a perspective view seen from the upper side, and FIG. 2 is a perspective view seen from the lower side. It is. 4 is a cross-sectional view taken along line AA in FIG. As shown in FIGS. 1 and 2, the lead-out unit 1-1 includes a first lead-out unit 11 in which a first lead-out pattern 17 is drawn from a circuit pattern 15 formed on the first flexible circuit board 10, 2 includes a second lead-out portion 51 formed by drawing the second lead-out pattern 57 from the circuit pattern 55 formed on the flexible circuit board 50, and the first and first lead-out portions 11, 51 have first and first leads. The first and second lead-out portions 11 and 51 are covered with a case 100 by molding the first and second lead-out portions 11 and 51 in a state where the two lead-out patterns 17 and 57 are arranged in parallel facing the same surface side. The second lead-out portions 11 and 51 are integrated. In addition, the first and second lead-out portions 11 and 51 are integrated by attaching a reinforcing plate 70 across the back surfaces of both the first lead-out portion 11 and the second lead-out portion 51. A case reinforcing plate 80 described below is attached in the case 100. Each component will be described below.

  FIG. 3 is an exploded perspective view of the lead-out portion 1-1 of the circuit board (however, the description of the case 100 is omitted). As shown in the figure, the first flexible circuit board 10 is formed with a circuit pattern 15 on the surface of a flexible synthetic resin film (in this embodiment, a PI film) 13 and the circuit pattern 15 is exposed at the tip thereof. Thus, the first lead-out pattern 17 formed is provided. Here, the portion to be the first lead-out portion 11 of the first flexible circuit board 10 is a strip-like lead-out pattern forming portion 19 that forms the first lead-out pattern 17 at the tip, and the base side of the lead-out pattern forming portion 19. And a case forming portion 21 provided wider than the lead-out pattern forming portion 19. A belt-like flat cable portion 23 is drawn from the base side of the case forming portion 21. In addition, although described as "the root side" above, "the root side" means a direction farther from the tip end side of the lead-out portion 1-1, that is, the inner side of the lead-out portion 1-1. The “root side” described below also indicates this.

  The circuit pattern 15 (including the first lead-out pattern 17) is formed by etching a metal foil (copper foil in this embodiment) attached to the surface of the synthetic resin film 13. A plurality of (four in this embodiment) first lead-out patterns 17 are formed in parallel at the same pitch (0.5 mm pitch in this embodiment).

  The case forming portion 21 is formed so as to pass through a plurality (four) of circuit patterns 15 connected to each of the first lead-out patterns 17, and the surface on which the circuit patterns 15 are provided has an insulating layer 25. It is configured to cover with. The insulating layer 25 is formed by applying an insulating paint (urethane resin or ultraviolet curable synthetic resin) or by applying an insulating synthetic resin film. In this embodiment, the insulating layer 25 is formed by applying a urethane resin. Has been. Positioning holes 27 penetrating in a circular shape are provided in the vicinity of both sides at approximately the center of the case forming portion 21. One positioning hole 27 is provided in the attachment piece 29 protruding in the shape of a tongue from one side of the case forming portion 21 (the side not facing the second flexible circuit board 50). A resin insertion portion 31 that penetrates in a slit shape is provided at an intermediate position between the positioning holes 27 of the case forming portion 21.

  The flat cable portion 23 has a belt-like shape, and the circuit patterns 15 that have passed through the case forming portion 21 are provided in parallel. The base side of the flat cable portion 23 is a main body (not shown) on which various electronic components of the first flexible circuit board 10 are mounted. It is connected to the. The insulating layer 25 is also formed on the surface of the flat cable portion 23 on the side where the circuit pattern 15 is provided.

  The second flexible circuit board 50 is formed by forming a circuit pattern 55 on the surface of a flexible synthetic resin film (PET film in this embodiment) 53 and exposing the circuit pattern 55 at the tip thereof. A two lead-out pattern 57 is provided. Here, the second lead-out portion 51 which becomes the lead-out portion 1-1 of the second flexible circuit board 50 includes a strip-like lead-out pattern forming portion 59 for forming the second lead-out pattern 57 at the tip thereof, and lead-out pattern formation. And a case forming portion 61 provided wider on the base side of the portion 59 than the lead-out pattern forming portion 59. A band-shaped flat cable portion 63 is drawn from the base side of the case forming portion 61.

  The circuit pattern 55 (including the second lead-out pattern 57) is formed by applying a conductive paste to the surface of the synthetic resin film 53 by screen printing or the like. Examples of the conductive paste include silver paste (a urethane-based or phenol-based resin material dissolved in a solvent) and carbon paste (a urethane-based or phenol-based resin material dissolved in a solvent, carbon powder). Etc.) are used. Furthermore, a conductive paste using other conductive powder such as a gold paste may be used, or a plurality of conductive pastes may be overlaid to form the circuit pattern 55. A plurality of (four in this embodiment) second lead-out patterns 57 are formed in parallel at the same pitch (0.5 mm pitch in this embodiment).

  The case forming portion 61 is formed so as to pass through a plurality of (four) circuit patterns 55 connected to each of the second lead-out patterns 57, and the surface on which the circuit patterns 55 are provided has an insulating layer 65 as a surface. It is configured to cover with. The insulating layer 55 is formed by applying an insulating paint (urethane resin or ultraviolet curable synthetic resin) or by applying an insulating synthetic resin film. In this embodiment, the insulating layer 55 is formed by applying a urethane resin. Has been. Positioning holes 67 penetrating in a circular shape are provided in the vicinity of both sides at approximately the center of the case forming portion 61. One positioning hole 67 is provided in a mounting piece 69 that protrudes in a tongue-like shape from one side of the case forming portion 61 (the side that does not face the first flexible circuit board 10). A resin insertion portion 71 penetrating like a slit is provided at an intermediate position between the positioning holes 67 of the case forming portion 61.

  The flat cable portion 63 has a belt-like shape, and the circuit patterns 55 that have passed through the case forming portion 61 are provided in parallel. The base side of the flat cable portion 63 is a main body (not shown) on which various electronic components of the second flexible circuit board 50 are mounted. It is connected to the. The insulating layer 65 is also formed on the surface of the flat cable portion 63 on the side where the circuit pattern 55 is provided.

  The reinforcing plate 70 is made of a synthetic resin film (PET film in this embodiment) and has substantially the same outer shape as the region including the lead-out pattern forming portions 19 and 59 of the first and second flexible circuit boards 10 and 50. Is formed.

  The case reinforcing plate 80 is a thin plate-like rectangular plate, and tongue-like attachment pieces 81 are provided so as to protrude from both ends in the longitudinal direction. The length of the case reinforcing plate 80 in the longitudinal direction is substantially the same as the width dimension of the entire case forming portions 21 and 61 of the first and second flexible circuit boards 10 and 50 installed in parallel, and the both attachments The pieces 81 are provided in substantially the same shape at positions facing the attachment pieces 29 and 69, respectively. Further, the positioning holes 27 and 67 are the same as the positioning holes 27 and 67 at positions facing the positioning holes 27 and 67 provided at the case forming portions 21 and 61 of the case reinforcing plate 80 and positions facing the resin insertion portions 31 and 71, respectively. A positioning hole 83 that penetrates the shape and a resin insertion portion 85 that penetrates the same shape as the resin insertion portions 31 and 71 are provided. Specifically, for example, a metal plate (for example, a stainless plate) having a thickness of about 150 μm or a synthetic resin plate (for example, an ABS resin plate or a PBT resin plate) is used as the case reinforcing plate 80. Various materials other than those described above may be used.

  The case 100 is made of a synthetic resin formed in a substantially rectangular shape so as to cover the entire periphery of the case forming portions 21 and 61 which are the base side portions of the first and second lead-out portions 11 and 51 installed in parallel. It is configured. That is, the first and second lead-out portions 11 and 51 are integrated by covering the first and second flexible circuit boards 10 and 50 with the case 100 formed by this molding. As the synthetic resin constituting the case 100, for example, a polybutylene terephthalate (PBT) resin, an ABS resin, a POM resin, or the like which is a thermoplastic resin is used. At positions facing the respective positioning holes 27, 67, 83 at the four positions of the case 100, through holes 101 penetrating all of them are provided.

  In order to manufacture the lead-out portion 1-1 of the circuit board, as shown in FIG. 3, the first and second lead-out patterns 17 and 57 of the first and second lead-out portions 11 and 51 are arranged on the same surface side. In the first and second molds 110 and 130 shown in FIG. 5, those that are installed in parallel with the case reinforcing plate 80 on the back side thereof are installed. As a result, a cavity C1 having the shape of the case 100 is formed around the first and second flexible circuit boards 10 and 50 and the case reinforcing plate 80 in the mold including the first and second molds 110 and 130. Is done. At this time, rod-like positioning members 111 projecting from the first mold 110 into the cavity C1 are inserted into the positioning holes 27, 67, 83 provided in the case reinforcing plate 80 and the first and second flexible circuit boards 10, 50, respectively. Inserted, the positioning between each member is accurately performed, and thereby, the positions of the resin insertion portions 31, 71, 85 provided in the first and second flexible circuit boards 10, 50 and the case reinforcing plate 80 respectively coincide with each other, Further, the opposing outer sides of the first and second flexible circuit boards 10 and 50 are in contact with each other. On the other hand, a resin injection port 131 is provided on the surface of the second mold 130 facing the cavity C1.

  Then, a high-temperature (for example, 230 to 260 ° C. in this embodiment) melt-molded resin is press-fitted from the resin inlet 131 to fill the cavity C1, and after the melt-molded resin is cured, the first and second molds 110 and 130 are filled. Is removed, the molding of the case 100 shown in FIGS. 1 and 2 is completed. By forming the case 100, the first and second lead-out portions 11 and 51 installed in parallel are securely fixed and integrated. If the reinforcing plate 70 is attached to the back surface of the lead-out pattern forming portions 19 and 59 (the back surface of the surface on which the first and second lead-out patterns 17 and 57 are provided) with an adhesive or the like, the lead-out of this circuit board Part 1-1 is completed. At this time, the through hole 101 of the case 100 is formed by the positioning member 111 shown in FIG.

  The lead-out portion 1-1 manufactured as described above is attached to the connector side by inserting the lead-out pattern forming portions 19 and 59 at the tip of the lead-out portion 1-1 into an insertion portion of a connector (female connector) (not shown), for example. Connected to another circuit (circuit board). At this time, since the lead-out pattern forming portions 19 and 59 are provided with reinforcing plates 70 extending over both, the lead-out pattern forming portions 19 and 59 installed in parallel are integral, and at the same time, are difficult to bend and attach / detach to / from the connector. Can be easily and reliably performed. In addition, when the lead-out pattern forming portions 19 and 59 of the lead-out portion 1-1 are attached to and detached from the connector, both ends in the longitudinal direction of the hard case 100 can be picked and operated with fingers, so that the flexible first As compared with the case where the first and second flexible circuit boards 10 and 50 are operated alone, the handling operation is facilitated, and the attachment / detachment work to the connector is facilitated. In addition, as a method for connecting the lead-out portion 1-1 according to the present embodiment to another circuit, a connection method using solder or a conductive adhesive may be used in addition to the connector.

  As described above, according to the lead-out portion 1-1 of this circuit board, the first and second lead-out patterns 17 and 57 of the first and second lead-out portions 11 and 51 are directed to the same surface side (this In the case of the embodiment, the formation surface of the first lead-out pattern 17 of the first lead-out portion 11 and the formation surface of the second lead-out portion 57 of the second lead-out portion 51 are located on the same plane) Since they are integrated in a state of being installed in parallel, even when a plurality of flexible circuit boards are used in one device, their lead-out portions can be concentrated on one, and the structure is simplified (simple). be able to. Further, since there is only one lead-out portion, connection work to a connector or the like of the lead-out portion (in addition to the connector, there is a connection structure using solder or a conductive adhesive) is simple and simple. Note that the structure of the lead-out portion 1-1 can be easily achieved even between the flexible circuit boards 10 and 50 having different circuit pattern forming methods such as the first and second flexible circuit boards 10 and 50 used in the embodiment. In addition, it is possible to easily connect the lead-out portion 1-1 to the connector or the like.

[Second Embodiment]
FIG. 6 is a perspective view showing the lead-out portion 1-2 of the circuit board according to the second embodiment of the present invention. In the lead-out portion 1-2 of the circuit board shown in the same figure, the same or corresponding parts as those of the lead-out portion 1-1 of the circuit board shown in FIG. 1 to FIG. Is attached. Note that matters other than those described below are the same as those in the embodiment shown in FIGS. The lead-out portion 1-2 shown in FIG. 6 is a first lead-out portion 11-2 in which the first lead-out pattern 17-2 is drawn from the circuit pattern 15-2 formed on the first flexible circuit board 10-2. And a second lead-out portion 51-2 obtained by drawing the second lead-out pattern 57-2 from the circuit pattern 55-2 formed on the second flexible circuit board 50-2. In a state where the first and second lead-out patterns 17-2 and 57-2 of the lead-out portions 11-2 and 51-2 are installed in parallel toward the same surface side, The first and first reinforcing plates 70-2 are attached across the back surfaces of the two lead-out portions 51-2 (the back surfaces of the surfaces on which the first and second lead-out patterns 17-2 and 57-2 are provided). 2 leads It is integrated sparse part 11-2,51-2. Each component will be described below.

  FIG. 7 is an exploded perspective view of the lead-out portion 1-2 of the circuit board. The first and second flexible circuit boards 10-2 and 50-2 shown in the figure are different from the first and second flexible circuit boards 10 and 50 in that the case 100 is not molded as in the first embodiment. Therefore, the case forming portions 21 and 61 necessary for forming the case 100 are omitted, and the resin insertion portions 31 and 71, the positioning holes 27 and 67, and the mounting pieces 29 and 61 provided in the case forming portions 21 and 61 are omitted. 69, the lead-out pattern forming portions 19-2 and 59-2 are used as the first and second lead-out portions 11-2 and 51-2 as they are, and the first and second lead-out portions 11-2 and 51-2 are used as they are. -2 is directly connected to the flat cable portions 23-2 and 63-2, while one side of the base side of the first lead-out portion 11-2 (the side not facing the second flexible circuit board 50-2) ) From tongue Of the second lead-out part 51-2 and a tongue-like pressing part 73 from one side (the side not facing the first flexible circuit board 10-2) of the second lead-out part 51-2. -2 projectingly. Both pressing portions 33-2 and 73-2 press the lead-out portion 1-2 toward the tip thereof.

  The point of difference between the reinforcing plate 70-2 and the reinforcing plate 70 corresponds to the pressing portions 33-2 and 73-2 provided on the first and second flexible circuit boards 10-2 and 50-2. A tongue-shaped pressing portion 71-2 is further provided so as to protrude outward from both side portions on the base side of the substantially rectangular reinforcing plate 70-2. Both pressing parts 71-2 are provided at positions facing both pressing parts 33-2 and 73-2. That is, the pressing portion 71-2 is provided so as to protrude outward from both sides on the base side of the first and second lead-out portions 11-2 and 51-2 of the reinforcing plate 70-2. The portion 1-2 (first and second lead-out portions 11-2 and 51-2) is pressed toward the tip direction.

  Next, in order to manufacture the lead-out portion 1-2 of this circuit board, the first flexible circuit board 10-2 and the second flexible circuit board 50-2 are connected to the first and second lead-out portions 11-2, A state in which the first and second lead-out patterns 17-2 and 57-2 of 51-2 are arranged in parallel toward the same surface (in this embodiment, the first and second flexible circuit boards 10-2 and 50- 2, the reinforcing plates 70-2 are bonded to the back surfaces thereof (the back surfaces of the surfaces on which the first and second lead-out patterns 17-2 and 57-2 are provided). Affix together and fix with one another. As a result, the lead-out portion 1-2 of the circuit board shown in FIG. 6 is completed.

  For example, the lead-out portion 1-2 manufactured as described above is inserted by inserting lead-out pattern forming portions 19-2 and 59-2 at the tip thereof into an insertion portion of a connector (female connector) (not shown). It is connected to another circuit (circuit board) attached to the connector side. At this time, since the lead-out pattern forming portions 19-2 and 59-2 are attached with the reinforcing plate 70-2 over the both, the lead-out pattern forming portions 19-2 and 59-2 installed in parallel are integrated. At the same time, it is difficult to bend, and it can be easily and reliably attached to and detached from the connector. Further, when the lead-out pattern forming portions 19-2 and 59-2 are attached to and detached from the connector, the pressing portions 71-2, 33-2 and 73-2 can be operated by pressing with fingers, so that the handling operation is easy. become. In addition, you may comprise a press part only with the press part 71-2 or only the press parts 33-2 and 73-2. Further, as a method for connecting the lead-out portion 1-2 according to the present embodiment to another circuit, a connection method using solder or a conductive adhesive material may be used in addition to the connector.

  As described above, according to the lead-out portion 1-2 of this circuit board, the first and second lead-out patterns 17-2 and 57-2 of the first and second lead-out portions 11-2 and 51-2 are changed. Since they are integrated in the state of being installed in parallel toward the same surface side, even when multiple flexible circuit boards are used in one device, their lead-out portions can be concentrated in one, and the structure is It can be made simple. Further, since there is only one lead-out portion, connection work to a connector or the like of the lead-out portion (in addition to the connector, there is a connection structure using solder or a conductive adhesive) is simple and simple.

[Third Embodiment]
FIG. 8 is a perspective view showing a lead-out portion 1-3 of a circuit board and another electronic component (hereinafter referred to as “third flexible circuit board”) 150 connected to the circuit board according to the third embodiment of the present invention. In the lead-out portion 1-3 of the circuit board shown in the same figure, the same or corresponding parts as the lead-out portions 1-1 and 1-2 of the circuit board shown in FIGS. "). Note that matters other than those described below are the same as those in the embodiment shown in FIGS. 8 is provided in the middle of the first and second flexible circuit boards 10-3 and 50-3. That is, the lead-out portion 1-3 includes a first lead-out portion 11-3 that is obtained by drawing the first lead-out pattern 17-3 from the middle of the circuit pattern 15-3 formed on the first flexible circuit board 10-3. And a second lead-out portion 51-3 in which the second lead-out pattern 57-3 is drawn from the middle of the circuit pattern 55-3 formed on the second flexible circuit board 50-3. In the state where the first and second lead-out patterns 17-3 and 57-3 of the two lead-out portions 11-3 and 51-3 are installed in parallel toward the same surface side, By attaching the reinforcing plate 70-3 across the back surfaces of both of the second lead-out portions 51-3 (the back surfaces of the surfaces on which the first and second lead-out patterns 17-3 and 57-3 are provided), Second It is integrated the Doauto part 11-3,51-3. That is, the lead-out portion 1-3 of the circuit board according to the present invention may be provided not only at the end portions of the first and second flexible circuit boards 10-3 and 50-3, but also at the internal position thereof. Each component will be described below.

  Also in this embodiment, since the case 100 used in the first embodiment is not molded, the case forming portions 21 and 61 necessary for forming the case 100 are omitted, and the case forming portions 21 and 61 are provided. The resin insertion parts 31, 71, the positioning holes 27, 67 and the mounting pieces 29, 69 are eliminated, and the lead-out pattern forming parts 19-3, 59-3 are left as they are, the first and second lead-out parts 11-3, 51. -3, the flat cable portions 23-3 and 63-3 are directly connected to both sides of the first and second lead-out portions 11-3 and 51-3. The flat cable portions 23-3 and 63-3 are not necessarily required, and the first and second flexible circuit boards 10 on which various electronic components are directly mounted around the first and second lead-out portions 11-3 and 51-3. It is good also as a main-body part of -3 and 50-3. In this embodiment, the first and second lead-out patterns 17-3 and 57-3 are insulating layers provided in the insulating layers 25-3 and 65-3 covering the circuit patterns 15-3 and 55-3. The circuit patterns 15-3 and 55-3 are exposed in the rectangular exposed portions 35-3 and 75-3. The exposed portions 35-3 and 75-3 are formed so as to cross (cross) the circuit patterns 15-3 and 55-3.

  Next, in order to manufacture the lead-out part 1-3 of this circuit board, the first flexible circuit board 10-3 and the second flexible circuit board 50-3 are connected to the first and second lead-out parts 11-3, A state in which the first and second lead-out patterns 17-3 and 57-3 of 51-3 are arranged in parallel toward the same surface side (in this embodiment, the first and second flexible circuit boards 10-3 and 50- 3, the reinforcing plates 70-3 are bonded to the back surfaces thereof (the back surfaces of the surfaces on which the first and second lead-out patterns 17-3 and 57-3 are provided). Affix together and fix with one another. As a result, the lead-out portion 1-3 of the circuit board shown in FIG. 8 is completed.

  On both lead-out pattern forming portions 19-3 and 59-3 installed in parallel with the lead-out portion 1-3 manufactured as described above, for example, as shown in FIG. A lead-out portion 151 provided at the lower end of the third flexible circuit board 150 is joined via an anisotropic conductive adhesive 160 and is electrically and mechanically connected. Here, the third flexible circuit board 150 is formed with a circuit pattern 155 on the surface (lower surface in the figure) of a flexible synthetic resin film (PET film in this embodiment) 153, and the circuit pattern 155 is exposed at the tip. Thus, a lead-out pattern 157 is provided, and a portion where the lead-out pattern 157 is provided is configured as a lead-out portion 151. An insulating layer 159 is formed on the surface of the circuit pattern 155 other than the lead-out pattern 157. There are eight lead-out patterns 157, that is, the same number as the first and second lead-out patterns 17-3 and 57-3, and the first and second lead-out patterns 17-3 and 57-3 have the same number. It is provided at each facing position.

  Then, the lead-out portion 151 of the third flexible circuit board 150 is joined to the lead-out portion 1-3 via an anisotropic conductive adhesive 160, and heated and pressurized, so that each of the first and second leads The out patterns 17-3 and 57-3 and the lead-out patterns 157 are electrically connected, and at the same time, mechanically connected. At this time, since the lead-out pattern forming portions 19-3 and 59-3 are provided with reinforcing plates 70-3 extending over both, the lead-out pattern forming portions 19-3 and 59-3 installed in parallel are integrated. At the same time, it is difficult to bend, and the third flexible circuit board 150, which is another electronic component, can be easily and reliably attached. Further, as a method for connecting the lead-out portion 1-3 according to the present embodiment to other electronic components, a connection method other than the above may be used.

  As described above, according to the lead-out portion 1-3 of this circuit board, the first and second lead-out patterns 17-3 and 57-3 of the first and second lead-out portions 11-3 and 51-3 are changed. Since they are integrated in the state of being installed in parallel toward the same surface side, even when multiple flexible circuit boards are used in one device, their lead-out portions can be concentrated in one, and the structure is It can be made simple. Also, since there is only one lead-out portion, the connection work with the conductive adhesive material of the lead-out portion (other than that, there are solder, mechanical clamping means, etc.) can be done in one place, which is easy.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above embodiment, the case 100 and the reinforcing plate 70 (70-2, 3) are used as a method for integrating the first and second lead-out portions 11, 51 (11-2, 3, 51-2, 3). However, the present invention is not limited to these fixing methods, and may be integrated using, for example, fixing by mechanical clamping means or other various connection fixing means. Moreover, in the said embodiment, the formation surface of the 1st lead-out pattern 17 (17-2, 3) of the 1st lead-out part 11 (11-2, 3) and the 2nd lead-out part 51 (51-2, 3). The second lead-out pattern 57 (57-2, 3) is formed on the same plane as the first lead-out pattern 57 (57-2, 3). However, the present invention is not limited to this, and the first lead-out pattern 17 (17- 2, 3) and the formation surface of the second lead-out pattern 57 (57-2, 3) may not be on the same plane but may be installed with a step. In short, it is only necessary that both surfaces face the same surface. Further, the sides of the first lead-out portion 11 (11-2, 3) and the second lead-out portion 51 (51-2, 3) may not be in contact with each other.

  Moreover, in the said embodiment, the circuit pattern 15 (15-2, 3) of the 1st flexible circuit board 10 (10-2, 3) is formed by etching of metal foil, and the circuit pattern 55 (55 of the 2nd flexible circuit board 50). -2, 3) was formed by applying conductive paste, but both circuit patterns 15 (15-2, 3) and 55 (55-2, 3) may be formed by the same method and material, You may form by various other methods and materials other than the above, such as metal vapor deposition.

  Further, the synthetic resin films 13, 53 (13-2, 3, 53-2, 3) constituting the first and second flexible circuit boards 10, 50 (10-2, 3, 50-2, 3) are For example, polyphenylene sulfide (PPS) film, PI film, PET film, polyethylene naphthalate (PEN) film, polyetherimide (PEI) film, polyether ether ketone (PEEK) A film, a polyether ketone (PEK) film, a polycarbonate (PC) film, a polybutylene naphthalate (PBN) film, a polybutylene terephthalate (PBT) film, or the like can also be used.

  In the above embodiment, the PET film is used as the material of the reinforcing plate 70 (70-2, 3). However, the reinforcing plate may be a film made of other various materials, or a synthetic resin plate other than the film. Or a resin layer cured after applying a paste-like resin material (for example, a UV curable resin material).

It is the perspective view which looked at the lead-out part 1-1 of the circuit board from the upper side. It is the perspective view which looked at the lead-out part 1-1 of the circuit board from the lower side. It is a disassembled perspective view of the lead-out part 1-1 of the circuit board (however, the description of the case 100 is omitted). It is sectional drawing of the AA line part of FIG. FIG. 6 is an explanatory diagram of a method for forming the case 100. It is a perspective view which shows the lead-out part 1-2 of a circuit board. It is a disassembled perspective view of the lead-out part 1-2 of a circuit board. It is a perspective view which shows the lead-out part 1-3 of a circuit board, and the 3rd flexible circuit board 150. FIG.

Explanation of symbols

1-1 Lead-out part 10 First flexible circuit board 11 First lead-out part 13 Synthetic resin film 15 Circuit pattern 17 First lead-out pattern 50 Second flexible circuit board 51 Second lead-out part 53 Synthetic resin film 55 Circuit pattern 57 second lead-out pattern 70 reinforcing plate 80 case reinforcing plate 100 case 1-2 lead-out portion 33-2 pressing portion 70-2 reinforcing plate 71-2 pressing portion 73-2 pressing portion 1-3 lead-out portion 150 third Flexible circuit board (other electronic components)
151 Lead-out part 157 Lead-out pattern 160 Conductive adhesive

Claims (5)

A first lead-out portion formed by drawing out a first lead-out pattern from a circuit pattern formed on the first flexible circuit board;
A second lead-out portion formed by drawing a second lead-out pattern from a circuit pattern formed on the second flexible circuit board;
A circuit board lead-out portion, wherein the first and second lead-out portions of the first and second lead-out portions are integrated in a state of being arranged in parallel toward the same surface.   2. The circuit board lead according to claim 1, wherein the first and second lead-out portions are integrated by attaching a reinforcing plate across both the first lead-out portion and the second lead-out portion. Out part.   The lead-out portion of the circuit board according to claim 2, wherein a pressing portion that presses the lead-out portion toward the distal end thereof is provided on the reinforcing plate so as to protrude.   The first and second lead-out portions are integrated by covering the periphery of the base side portion of the first and second lead-out portions installed in parallel with a case by molding. The circuit board lead-out portion.   The first flexible circuit board is formed by forming the circuit pattern and the first lead-out pattern by etching or metal deposition of a metal foil attached on a synthetic resin film, and the second flexible circuit board is formed on the synthetic resin film. 5. The circuit board lead-out portion according to claim 1, wherein the circuit pattern and the second lead-out pattern are formed by applying a conductive paste.

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