JP2007328158A - Image heating device and heating body used therefor - Google Patents

Image heating device and heating body used therefor Download PDF

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JP2007328158A
JP2007328158A JP2006159652A JP2006159652A JP2007328158A JP 2007328158 A JP2007328158 A JP 2007328158A JP 2006159652 A JP2006159652 A JP 2006159652A JP 2006159652 A JP2006159652 A JP 2006159652A JP 2007328158 A JP2007328158 A JP 2007328158A
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substrate
end side
conductive
image
heating
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JP2007328158A5 (en
JP5074711B2 (en
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Noriyuki Ito
紀之 伊藤
Masashi Komata
将史 小俣
Yusuke Nakazono
祐輔 中園
Satoshi Nishida
聡 西田
Kan Takeda
敢 竹田
Eiji Uekawa
英治 植川
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Canon Inc
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Canon Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an image heating device capable of uniformizing the generated heat distribution of a heat generating element, moderating temperature rise in an area through which recording material does not pass and improving the throughput of the recording material, and a heating body used therefor. <P>SOLUTION: The image heating device 29 heats the recording material to carry an image by heat from the heating body 5, wherein the heating body 5 has conductive parts 53b, 52b and 53c on one end side, on the other end side of a substrate 51 and between the one end side and the other end side respectively in a width direction orthogonal to the longitudinal direction of the substrate 51. Then, it has heat generating parts 54 and 55 between the conductive parts in the width direction of the substrate respectively. The heat generating element is connected in parallel with the conductive part in the width direction of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子写真方式の画像形成装置に搭載されている加熱定着装置として用いれば好適な像加熱装置及びその装置に用いられる加熱体に関する。   The present invention relates to an image heating apparatus suitable for use as a heat fixing apparatus mounted on an electrophotographic image forming apparatus and a heating body used in the apparatus.

電子写真方式のプリンタや複写機に搭載する像加熱装置（定着装置）として、セラミックス製の基板上に発熱体を有するヒータと、このヒータに接触しつつ移動する可撓性部材と、可撓性部材を介してヒータとニップ部を形成する加圧ローラと、を有するものがある。特許文献１、２にはこのタイプの定着装置が記載されている。未定着トナー画像を担持する記録材は定着装置のニップ部で挟持搬送されつつ加熱され、これにより記録材上の画像は記録材に加熱定着される。この定着装置は、ヒータへの通電を開始し定着可能温度まで昇温するのに要する時間が短いというメリットを有する。したがって、この定着装置を搭載するプリンタは、プリンタ指令の入力後、一枚目の画像を出力するまでの時間（FPOT:first printout time)を短くできる。またこのタイプの定着装置は、プリント指令を待つ待機中の消費電力が少ないというメリットもある。   As an image heating device (fixing device) mounted on an electrophotographic printer or copying machine, a heater having a heating element on a ceramic substrate, a flexible member that moves while contacting the heater, and flexibility Some have a heater and a pressure roller that forms a nip portion via a member. Patent Documents 1 and 2 describe this type of fixing device. The recording material carrying the unfixed toner image is heated while being nipped and conveyed by the nip portion of the fixing device, whereby the image on the recording material is heated and fixed on the recording material. This fixing device has an advantage that the time required to start energization of the heater and to raise the temperature to a fixable temperature is short. Therefore, a printer equipped with this fixing device can shorten the time (FPOT: first printout time) after the printer command is input until the first image is output. This type of fixing device also has an advantage that power consumption during standby for waiting for a print command is small.

ところで、可撓性部材を用いた定着装置を搭載するプリンタで小サイズの記録材を大サイズの記録材と同じプリント間隔で連続プリントすると、ヒータの記録材が通過しない領域（非通紙領域）が過度に昇温（いわゆる非通紙部昇温）することが知られている。ヒータの非通紙領域が過昇温すると、ヒータを保持するホルダや加圧ローラが熱により損傷する場合がある。   By the way, when a small-size recording material is continuously printed at the same print interval as a large-size recording material with a printer equipped with a fixing device using a flexible member, the area where the recording material of the heater does not pass (non-sheet passing area) Is known to increase excessively (so-called non-sheet passing portion temperature increase). If the non-sheet passing area of the heater is excessively heated, the holder and the pressure roller that hold the heater may be damaged by heat.

そこで、上記定着装置を搭載するプリンタは、小サイズの記録材を連続プリントする場合、大サイズの記録材に連続プリントする場合よりもプリント間隔を広げる制御を行いヒータの非通紙領域の過昇温を抑えている。   Therefore, a printer equipped with the above fixing device has a control to widen the print interval when continuously printing a small size recording material than when continuously printing a large size recording material, and overheats the non-sheet passing area of the heater. Keeping the temperature down.

しかしながら、プリント間隔を広げる制御は単位時間当りの出力枚数いわゆるスループットを減らすものであり、単位時間当たりの出力枚数を大サイズの記録材の場合と同等或いは若干少ない程度に抑えることが望まれる。
特開２０００−１７３７５２号公報 特開２００１-１００５５６号公報 However, the control to increase the print interval is to reduce the number of output sheets per unit time, so-called throughput, and it is desired to suppress the number of output sheets per unit time to the same level or slightly less than the case of a large size recording material.
JP 2000-173752 A Japanese Patent Laid-Open No. 2001-100556

本発明は、上記従来技術をさらに発展させたものである。本発明の目的は、発熱体の発熱分布の均一化を図れるとともに、記録材が通過しない領域の昇温を緩和でき、その記録材のスループットを向上できる像加熱装置及びその装置に用いられる加熱体を提供することにある。   The present invention is a further development of the above prior art. SUMMARY OF THE INVENTION An object of the present invention is to provide an image heating apparatus that can uniformize the heat generation distribution of the heat generating element, can alleviate the temperature rise in the area where the recording material does not pass, and can improve the throughput of the recording material, and the heating element used in the apparatus Is to provide.

本発明に係る像加熱装置の代表的な構成は、細長い基板と、前記基板の長手方向に沿って基板面に設けられた発熱体と、を有する加熱体を有し、前記加熱体からの熱により、画像を担持する記録材を加熱する像加熱装置において、
前記加熱体は、前記基板の長手方向と直交する短手方向における一端側、他端側、及び、前記一端側と前記他端側の間にそれぞれ導電部を有するとともに、前記基板の短手方向において前記導電部間に前記発熱体をそれぞれ有し、前記発熱体は前記導電部と並列に接続されていることを特徴とする像加熱装置である。 A typical configuration of an image heating apparatus according to the present invention includes a heating body having an elongated substrate and a heating element provided on a substrate surface along the longitudinal direction of the substrate, and heat from the heating body. In an image heating apparatus for heating a recording material carrying an image,
The heating element has one end side and the other end side in a short direction perpendicular to the longitudinal direction of the substrate, and a conductive portion between the one end side and the other end side, and the short direction of the substrate. In the image heating apparatus, the heating elements are respectively provided between the conductive parts, and the heating elements are connected in parallel with the conductive parts.

本発明に係る加熱体の代表的な構成は、細長い基板と、前記基板の長手方向に沿って基板面に設けられた発熱体と、を有し、前記発熱体からの熱により、画像を担持する記録材を加熱する像加熱装置に用いられる加熱体において、
前記基板の長手方向と直交する短手方向における一端側、他端側、及び、前記一端側と前記他端側の間にそれぞれ導電部を有するとともに、前記基板の短手方向において前記導電部間に前記発熱体をそれぞれ有し、前記発熱体は前記導電部と並列に接続されていることを特徴とする加熱体である。 A representative configuration of the heating element according to the present invention includes an elongated substrate and a heating element provided on the substrate surface along the longitudinal direction of the substrate, and carries an image by heat from the heating element. In a heating element used in an image heating apparatus for heating a recording material to be recorded,
One end side in the short direction perpendicular to the longitudinal direction of the substrate, the other end side, and a conductive portion between the one end side and the other end side, and between the conductive portions in the short direction of the substrate Each of the heating elements, and the heating elements are connected in parallel to the conductive portion.

本発明によれば、発熱体の発熱分布の均一化を図れるとともに、記録材が通過しない領域の昇温を緩和でき、その記録材のスループットを向上できる像加熱装置及びその装置に用いられる加熱体の提供を実現できる。   According to the present invention, an image heating apparatus capable of uniformizing the heat generation distribution of the heat generating element, mitigating the temperature rise in the area where the recording material does not pass, and improving the throughput of the recording material, and the heating element used in the apparatus Can be provided.

以下、本発明を図面に基づいて詳しく説明する。   Hereinafter, the present invention will be described in detail with reference to the drawings.

（１）画像形成装置例
図１は本発明に係る像加熱装置を画像加熱定着装置として搭載できる画像形成装置の一例の概略構成模型図である。この画像形成装置は、転写式電子写真プロセス利用のレーザービームプリンタである。 (1) Example of Image Forming Apparatus FIG. 1 is a schematic configuration diagram of an example of an image forming apparatus in which the image heating apparatus according to the present invention can be mounted as an image heating fixing apparatus. This image forming apparatus is a laser beam printer using a transfer type electrophotographic process.

２１は像担持体としての回転ドラム型の電子写真感光体（以下、感光ドラムと記す）であり、矢印の時計方向に所定の周速度をもって回転される。この感光ドラム２１は、ＯＰＣ、アモルファスシリコン等の感光材料をアルミニウムやニッケル等のシリンダ状の基板上に形成して構成されている。   Reference numeral 21 denotes a rotating drum type electrophotographic photosensitive member (hereinafter referred to as a photosensitive drum) as an image carrier, which is rotated at a predetermined peripheral speed in the clockwise direction of an arrow. The photosensitive drum 21 is configured by forming a photosensitive material such as OPC or amorphous silicon on a cylindrical substrate such as aluminum or nickel.

回転中において感光ドラム２１は、まず、その外周面（表面）が帯電装置としての帯電ローラ２２によって一様に帯電される。次に、感光ドラム２１の一様帯電面に対して、像露光手段であるレーザースキャナー２３から出力される、画像情報に対応して変調されたレーザー光Ｌによる走査露光がなされる。これにより感光ドラム２１表面に画像情報に対応した静電潜像が形成される。この静電潜像は現像装置２４によりトナー（現像剤）によってトナー画像として現像（可視化）される。   During rotation, first, the outer peripheral surface (surface) of the photosensitive drum 21 is uniformly charged by a charging roller 22 as a charging device. Next, the uniformly charged surface of the photosensitive drum 21 is subjected to scanning exposure with a laser beam L that is modulated in accordance with image information output from a laser scanner 23 that is an image exposure unit. As a result, an electrostatic latent image corresponding to the image information is formed on the surface of the photosensitive drum 21. The electrostatic latent image is developed (visualized) as a toner image by toner (developer) by the developing device 24.

一方、記録材Ｐはカセット２５から給紙ローラ２６によって取り出され、レジストローラ２７に送られる。レジストローラ２７によって記録材Ｐは感光ドラム２１の表面に形成されたトナー画像と同期を取られて、感光ドラム２１と転写ローラ２８とで形成される転写ニップ部に供給される。転写ニップ部における感光ドラム２１表面のトナー画像と記録材Ｐの同期取りはレジストセンサ（不図示）で行っても良い。   On the other hand, the recording material P is taken out from the cassette 25 by the paper feed roller 26 and sent to the registration roller 27. The recording material P is synchronized with the toner image formed on the surface of the photosensitive drum 21 by the registration roller 27 and supplied to a transfer nip portion formed by the photosensitive drum 21 and the transfer roller 28. The registration of the toner image on the surface of the photosensitive drum 21 and the recording material P in the transfer nip portion may be performed by a registration sensor (not shown).

転写ニップ部において、感光ドラム２１上のトナー画像は不図示の電源による転写バイアスの作用で記録材Ｐに転写される。感光ドラム２１面から分離され、未定着のトナー画像を保持した記録材Ｐは定着装置２９へ搬送される。定着装置２９において未定着のトナー画像が記録材Ｐ上に定着される。そしてこの記録材Ｐ上は定着装置２９から機外へ排出される。   In the transfer nip portion, the toner image on the photosensitive drum 21 is transferred to the recording material P by the action of a transfer bias by a power source (not shown). The recording material P separated from the surface of the photosensitive drum 21 and holding an unfixed toner image is conveyed to the fixing device 29. An unfixed toner image is fixed on the recording material P in the fixing device 29. Then, the recording material P is discharged from the fixing device 29 to the outside of the apparatus.

転写後に感光ドラム２１上に残留する転写残留トナーは、クリーニング装置３０により感光ドラム２１表面より除去される。これによって感光ドラム２１は次の画像形成に供される。   Transfer residual toner remaining on the photosensitive drum 21 after the transfer is removed from the surface of the photosensitive drum 21 by the cleaning device 30. As a result, the photosensitive drum 21 is used for the next image formation.

（２）定着装置
図２は定着装置２９の要部の横断面模型図である。この定着装置２９は、フィルム加熱方式、バックアップ部材駆動方式の所謂テンションレスタイプの像加熱装置である。 (2) Fixing Device FIG. 2 is a schematic cross-sectional view of the main part of the fixing device 29. The fixing device 29 is a so-called tensionless type image heating device using a film heating method or a backup member driving method.

以下の説明において、定着装置又はこの定着装置を構成している部材について長手方向とは記録材の面において記録材搬送方向と直交する方向をいう。また、幅方向（短手方向）とは記録材搬送方向をいう。また、幅とは記録材搬送方向における寸法をいう。   In the following description, the longitudinal direction of the fixing device or the members constituting the fixing device means a direction orthogonal to the recording material conveyance direction on the surface of the recording material. The width direction (short direction) refers to the recording material conveyance direction. The width is a dimension in the recording material conveyance direction.

１は保持部材としてのヒータホルダ、２は可撓性部材としての円筒状の耐熱性フィルム（定着フィルム）、３は加圧部材としての加圧ステー、４はバックアップ部材としての弾性加圧ローラ、５は加熱体としてのセラミックヒータである。   1 is a heater holder as a holding member, 2 is a cylindrical heat-resistant film (fixing film) as a flexible member, 3 is a pressure stay as a pressure member, 4 is an elastic pressure roller as a backup member, 5 Is a ceramic heater as a heating element.

図３はホルダ１を上側から見た外観斜視模型図である。図４はホルダ１とフィルム２とヒータ５の関係を表す分解斜視図である。   FIG. 3 is an external perspective model view of the holder 1 as viewed from above. FIG. 4 is an exploded perspective view showing the relationship among the holder 1, the film 2, and the heater 5.

ホルダ１は横断面略半円樋型の耐熱性部材である。ホルダ１下面の幅方向略中央には長手方向に沿って溝１ａが設けてある。ヒータ５はこのホルダ１の溝１ａ内に嵌め込んで保持させてある。円筒状のフィルム２はヒータ５を保持させたホルダ１にルーズに外嵌させてある。加圧ローラ４は、芯金４ａと、シリコンゴム等の離型性の良い耐熱ゴム層４ｂと、を有する。   The holder 1 is a heat-resistant member having a substantially semicircular shape in cross section. A groove 1a is provided along the longitudinal direction substantially at the center of the lower surface of the holder 1 in the width direction. The heater 5 is fitted and held in the groove 1 a of the holder 1. The cylindrical film 2 is loosely fitted on the holder 1 holding the heater 5. The pressure roller 4 includes a cored bar 4a and a heat-resistant rubber layer 4b having good releasability such as silicon rubber.

この加圧ローラ４は芯金４ａの長手両端部をそれぞれ不図示の装置側板対に軸受を介して回転自由に支持させて配設される。この加圧ローラ４に対して上記のホルダ１とヒータ５とフィルム２とを一体化したフィルム・アセンブリ１０が並列に装置側板対に配設されている。そしてフィルム２内に貫通させ、ホルダ１上に配したステー３を加圧手段としての図示しない加圧バネにより加圧することにより、ホルダ１をフィルム２を挟んで加圧ローラ４に加圧させている。この加圧バネによるステー３の加圧力に応じて加圧ローラ４が弾性変形することによって、この加圧ローラ４と加圧ローラ４と接触するフィルム２との間に所定幅のニップ部（定着ニップ部）Ｎを形成させている。   The pressure roller 4 is arranged with its longitudinal end portions of the cored bar 4a rotatably supported by a pair of device side plates (not shown) via bearings. A film assembly 10 in which the holder 1, the heater 5, and the film 2 are integrated with respect to the pressure roller 4 is disposed in parallel on the apparatus side plate pair. Then, the stay 3 disposed on the holder 1 is pressed by a pressing spring (not shown) as a pressing means so that the holder 1 is pressed against the pressing roller 4 with the film 2 interposed therebetween. Yes. The pressure roller 4 is elastically deformed according to the pressure applied to the stay 3 by the pressure spring, whereby a nip portion (fixing) having a predetermined width is formed between the pressure roller 4 and the film 2 in contact with the pressure roller 4. Nip portion) N is formed.

フィルム２は熱容量を小さくしてクイックスタート性を向上させるために、フィルム膜厚は１００μｍ以下、好ましくは５０μｍ以下２０μｍ以上の耐熱性フィルムが好ましい。例えば、ＰＴＦＥ、ＰＦＡ、ＦＥＰの単層、あるいはポリイミド、ポリアミドイミド、ＰＥＥＫ、ＰＥＳ、ＰＰＳ等の外周表面にＰＴＦＥ、ＰＦＡ、ＦＥＰ等をコーティングした複合層フィルムを使用できる。金属フィルムを使用することもできる。本例ではポリイミドフィルムの外周表面にＰＴＦＥをコーティングしたものを用いている。   The film 2 is preferably a heat resistant film having a film thickness of 100 μm or less, preferably 50 μm or less and 20 μm or more in order to reduce the heat capacity and improve the quick start property. For example, a single layer of PTFE, PFA, or FEP, or a composite layer film in which PTFE, PFA, FEP, or the like is coated on the outer peripheral surface of polyimide, polyamideimide, PEEK, PES, PPS, or the like can be used. A metal film can also be used. In this example, the outer peripheral surface of the polyimide film is coated with PTFE.

加圧ローラ４は回転駆動系Ｍにより矢印の反時計方向に所定の周速度にて回転される。加圧ローラ４の回転によりニップ部Ｎにおける加圧ローラ４とフィルム２外面との摩擦力でフィルム２に回転力が作用する。フィルム２はその内面側がニップ部Ｎにおいてヒータ５の表面に密着して摺動しながらホルダ１の周りを矢印の時計方向に加圧ローラ４の回転周速度とほぼ同じ周速度で従動回転する。ホルダ１は従動回転するフィルム２のガイド部材の役目もしている。   The pressure roller 4 is rotated by the rotational drive system M in a counterclockwise direction indicated by an arrow at a predetermined peripheral speed. As the pressure roller 4 rotates, a rotational force acts on the film 2 by a frictional force between the pressure roller 4 and the outer surface of the film 2 in the nip portion N. The film 2 is driven to rotate around the holder 1 in the clockwise direction indicated by the arrow at the same peripheral speed as that of the pressure roller 4 while the inner surface of the film 2 slides in close contact with the surface of the heater 5 at the nip portion N. The holder 1 also serves as a guide member for the film 2 that is driven to rotate.

そして、加圧ローラ４とフィルム２が回転され、ヒータ５に通電がなされて所定の定着温度に温調された状態において、ニップ部Ｎに未定着トナー画像ｔを担持した記録材Ｐを導入し挟持搬送させる。これにより、フィルム２を介して付与されるヒータ５からの熱とニップ部Ｎの圧力により、未定着トナー画像ｔが記録材Ｐ上に永久固着画像ｔａとして定着される。   Then, the recording material P carrying the unfixed toner image t is introduced into the nip portion N in a state where the pressure roller 4 and the film 2 are rotated and the heater 5 is energized to adjust the temperature to a predetermined fixing temperature. It is nipped and conveyed. As a result, the unfixed toner image t is fixed on the recording material P as the permanently fixed image ta by the heat from the heater 5 applied through the film 2 and the pressure of the nip portion N.

（３）ヒータ５の構成
図５において、（ａ）はヒータ５の構成、及びヒータ５を温調制御する温調制御系を表す説明図、（ｂ）は（ａ）に示すｂ−ｂ線断面図である。 (3) Configuration of Heater 5 In FIG. 5, (a) is an explanatory diagram showing the configuration of the heater 5 and a temperature control system for controlling the temperature of the heater 5, and (b) is a bb line shown in (a). It is sectional drawing.

ヒータ５は、Ａｌ２Ｏ３、ＡｌＮ等のセラミック材でできた絶縁性の細長いヒータ基板５１の表面（基板面）に導電体としての導電パターン５２，５３を有する。導電パターン５２，５３は、銀を多く含む電気抵抗の小さい導電性材料から構成され、基板５１表面にスクリーン印刷等により塗工して形成してある。導電パターン５２，５３のうち、一方の導電パターン５２は、基板５１の長手方向の一端部に電極部５２ａを有するとともに基板５１の短手方向における中央部に導電部５２ｂを有する。他方の導電パターン５３は、基板５１の長手方向の他端部に電極部５３ａを有し、かつ基板５１の短手方向における一端側に導電部５３ｂを有するとともに他端側に導電部５３ｃを有する。導電部５２ｂ，５３ｂ，５３ｃは、それぞれ基板５１の短手方向に並列に配設され、かつ基板５１の長手方向に沿って形成してある。 The heater 5 has conductive patterns 52 and 53 as conductors on the surface (substrate surface) of an insulating elongated heater substrate 51 made of a ceramic material such as Al 2 O 3 or AlN. The conductive patterns 52 and 53 are made of a conductive material containing a large amount of silver and having a low electrical resistance, and are formed by coating the surface of the substrate 51 by screen printing or the like. Of the conductive patterns 52 and 53, one conductive pattern 52 has an electrode part 52 a at one end in the longitudinal direction of the substrate 51 and a conductive part 52 b at the center in the short direction of the substrate 51. The other conductive pattern 53 has an electrode portion 53a at the other end in the longitudinal direction of the substrate 51, and has a conductive portion 53b at one end in the short direction of the substrate 51 and a conductive portion 53c at the other end. . The conductive portions 52 b, 53 b, and 53 c are arranged in parallel in the short direction of the substrate 51 and are formed along the longitudinal direction of the substrate 51.

５４，５５は基板５１の表面において長手方向に沿って形成された発熱体としての抵抗パターンである。抵抗パターン５４，５５は、例えばＡｇ／Ｐｄ（銀パラジウム）等の電気抵抗材料を基板５１表面にスクリーン印刷等により塗工して形成してある。抵抗パターン５４，５５のうち、一方の抵抗パターン５４は基板５１の短手方向において導電パターン５２の導電部５２ｂと導電パターン５３の導電部５３ｂとの間に形成されている。この抵抗パターン５４は、基板５１の短手方向において導電部５２ｂ，５３ｂと並列に接続されている。他方の抵抗パターン５５は基板５１の短手方向において導電パターン５２の導電部５２ｂと導電パターン５３の導電部５３ｃとの間に形成してある。この抵抗パターン５５は、基板５１の短手方向において導電部５２ｂ，５３ｃと並列に接続されている。つまり、抵抗パターン５４，５５は基板５１の短手方向において導電部５２ｂ，５３ｂ，５３ｃを介して並列に接続されている。抵抗パターン５４，５５間の導電部５３ｂは両抵抗パターン５４，５５の共通導電部となっている。   Reference numerals 54 and 55 denote resistance patterns as heating elements formed along the longitudinal direction on the surface of the substrate 51. The resistance patterns 54 and 55 are formed by applying an electric resistance material such as Ag / Pd (silver palladium) to the surface of the substrate 51 by screen printing or the like. One of the resistance patterns 54 and 55 is formed between the conductive portion 52 b of the conductive pattern 52 and the conductive portion 53 b of the conductive pattern 53 in the short direction of the substrate 51. The resistance pattern 54 is connected in parallel with the conductive portions 52 b and 53 b in the short direction of the substrate 51. The other resistance pattern 55 is formed between the conductive portion 52 b of the conductive pattern 52 and the conductive portion 53 c of the conductive pattern 53 in the short direction of the substrate 51. The resistance pattern 55 is connected in parallel with the conductive portions 52 b and 53 c in the short direction of the substrate 51. That is, the resistance patterns 54 and 55 are connected in parallel via the conductive portions 52b, 53b, and 53c in the short direction of the substrate 51. The conductive portion 53b between the resistance patterns 54 and 55 is a common conductive portion for both the resistance patterns 54 and 55.

５６は保護層である。保護層５６は、導電パターン５２，５３の導電部５２ｂ，５３ｂ，５３ｃと抵抗パターン５４，５５を覆うように導電部５２ｂ，５３ｂ，５３ｃ及び抵抗パターン５４，５５上に形成してある。保護層５６は、例えばガラスやフッ素樹脂等により形成してある。   Reference numeral 56 denotes a protective layer. The protective layer 56 is formed on the conductive portions 52b, 53b, 53c and the resistance patterns 54, 55 so as to cover the conductive portions 52b, 53b, 53c of the conductive patterns 52, 53 and the resistance patterns 54, 55. The protective layer 56 is made of, for example, glass or fluororesin.

ヒータ５０において、導電パターン５２，５３と抵抗パターン５４，５５を有する基板５１表面（ヒータ表面）とは反対側の基板５１裏面（ヒータ裏面）に、温度検知手段としてのサーミスタＴＨが設けてある。サーミスタＴＨは、ニップ部Ｎの長手方向における記録材搬送領域の所定の位置に配置してある。ヒータ３は、保護層５６面側がフィルム２の内面と密着して摺動するように保護層５６面側を下向きにしてホルダ１の溝１ａ（図２）に嵌め込んで保持させてある。   In the heater 50, a thermistor TH as temperature detecting means is provided on the back surface of the substrate 51 (heater back surface) opposite to the surface of the substrate 51 (heater surface) having the conductive patterns 52 and 53 and the resistance patterns 54 and 55. The thermistor TH is disposed at a predetermined position in the recording material conveyance area in the longitudinal direction of the nip portion N. The heater 3 is fitted and held in the groove 1 a (FIG. 2) of the holder 1 with the protective layer 56 surface side facing downward so that the protective layer 56 surface side slides in close contact with the inner surface of the film 2.

ヒータ５において、導電パターン５２，５３の電極部５２ａ，５３ａには電源１０２から通電がなされ、その電極部５２ａ，５３ａから導電部５２ｂ，５３ｂ，５３ｃを通じて抵抗パターン５４，５５に通電される。これにより抵抗パターン５４，５５には基板５１の短手方向（記録材搬送方向）に電流が流れる。これによって抵抗パターン５４，５５が発熱してヒータ５は迅速に昇温する。ヒータ５の温度はサーミスタＴＨで検知される。サーミスタＴＨが検知する温度情報に基づき制御回路（ＣＰＵ）１０４は、トライアック１０３により電源１０２のＡＣ電圧を位相制御、波数制御して抵抗パターン５４，５５への通電電流を制御し、ヒータ５を所定の定着温度（目標温度）に温調制御する。   In the heater 5, the electrode portions 52a and 53a of the conductive patterns 52 and 53 are energized from the power source 102, and the resistor portions 54 and 55 are energized from the electrode portions 52a and 53a through the conductive portions 52b, 53b and 53c. As a result, a current flows through the resistance patterns 54 and 55 in the short direction of the substrate 51 (recording material conveyance direction). As a result, the resistance patterns 54 and 55 generate heat and the heater 5 quickly rises in temperature. The temperature of the heater 5 is detected by the thermistor TH. Based on the temperature information detected by the thermistor TH, the control circuit (CPU) 104 controls the current supplied to the resistance patterns 54 and 55 by controlling the phase and the wave number of the AC voltage of the power source 102 by the triac 103, and setting the heater 5 to a predetermined value. The temperature is controlled to the fixing temperature (target temperature).

ここで、図７を参照して、基板の短手方向に電流が流れるように構成された従来のヒータ６について説明する。   Here, with reference to FIG. 7, a conventional heater 6 configured to allow current to flow in the short direction of the substrate will be described.

図７において、（ａ）はヒータ６の構成を表す説明図、（ｂ）はヒータ６の構成を簡略的に表した回路図である。   7A is an explanatory diagram illustrating the configuration of the heater 6, and FIG. 7B is a circuit diagram schematically illustrating the configuration of the heater 6.

ヒータ６において、６１はヒータ基板、６２，６３は導電パターン、６４は抵抗パターン、６５は保護層である。基板６１表面に設けられた導電パターン６２，６３のうち、一方の導電パターン６２は、基板６１の長手方向の一端部に電極部６２ａを有するとともに基板６１の短手方向における他端側に導電部６２ｂを有する。他方の導電パターン６３は、基板６１の長手方向の他端部に電極部６３ａを有するとともに基板６１の短手方向における一端側に導電部６３ｂを有する。基板６１表面において導電部６２ｂ，６３ｂ間に形成された抵抗パターン６４は、基板６１の短手方向において導電部６２ｂ，６３ｂと並列に接続されている。   In the heater 6, 61 is a heater substrate, 62 and 63 are conductive patterns, 64 is a resistance pattern, and 65 is a protective layer. Of the conductive patterns 62, 63 provided on the surface of the substrate 61, one conductive pattern 62 has an electrode portion 62 a at one end portion in the longitudinal direction of the substrate 61 and a conductive portion on the other end side in the short direction of the substrate 61. 62b. The other conductive pattern 63 has an electrode portion 63 a at the other end in the longitudinal direction of the substrate 61 and a conductive portion 63 b at one end in the short direction of the substrate 61. The resistance pattern 64 formed between the conductive portions 62 b and 63 b on the surface of the substrate 61 is connected in parallel with the conductive portions 62 b and 63 b in the short direction of the substrate 61.

このヒータ６は、抵抗パターン６４の抵抗値を低くすると、導体パターン６２，６３の抵抗値が無視できない抵抗値となる。そのため、基板６１長手方向において抵抗パターン６４の両端部に電流が集中して通電され、抵抗パターン６４の発熱分布が均一にならないことがある。その理由を（ｂ）に示すヒータ回路図を用いて説明する。   In the heater 6, when the resistance value of the resistance pattern 64 is lowered, the resistance values of the conductor patterns 62 and 63 become non-negligible. For this reason, in the longitudinal direction of the substrate 61, current is concentrated and applied to both ends of the resistance pattern 64, and the heat distribution of the resistance pattern 64 may not be uniform. The reason will be described with reference to the heater circuit diagram shown in FIG.

ヒータ回路図において、導電パターン６２，６３の抵抗をｒ、抵抗パターン６４において基板６１の長手方向中央部の抵抗値をＲａ、基板６１の長手方向両端部の抵抗値をＲｂとし、ＲａとＲｂの抵抗値は同じ値とする。抵抗パターン６４における中央部抵抗値Ｒａと端部抵抗値Ｒｂの発熱比は以下の式で表す事ができる。   In the heater circuit diagram, the resistance of the conductive patterns 62 and 63 is r, the resistance value at the central portion of the substrate 61 in the longitudinal direction of the resistance pattern 64 is Ra, the resistance value at both longitudinal ends of the substrate 61 is Rb, and Ra and Rb The resistance value shall be the same value. The heat generation ratio between the central portion resistance value Ra and the end portion resistance value Rb in the resistance pattern 64 can be expressed by the following equation.

（中央部抵抗発熱）：（端部抵抗発熱）＝Ｒｂ：Ｒａ＊（１＋ｒ／Ｒａ）２
すなわち、ｒ／Ｒａの値が０の時に発熱比はＲｂ：Ｒａ（１：１）となり、この場合には抵抗パターン６４の発熱分布は均一になることがわかる。 (Center part resistance heat generation): (End part resistance heat generation) = Rb: Ra * (1 + r / Ra) 2
That is, when the value of r / Ra is 0, the heat generation ratio is Rb: Ra (1: 1), and in this case, the heat generation distribution of the resistance pattern 64 is uniform.

そこで、抵抗パターン６４の発熱分布の均一化を実現する為に、ｒ／ＲａにおいてＲａの値を大きくする場合は、抵抗パターン６４の総抵抗値が大きくなってしまうため、消費電力が増えてしまう。又、ｒの抵抗値を小さくする場合は、導電パターン６２，６３の断面積を大きくとらなければならない。そのためには基板６１を幅広に形成する必要があることから、定着装置自体の大型化、ヒータの製造コストの増加を招くことになってしまう。   Therefore, in order to realize the uniform heat generation distribution of the resistance pattern 64, when the value of Ra is increased in r / Ra, the total resistance value of the resistance pattern 64 increases, resulting in an increase in power consumption. . Further, when the resistance value of r is reduced, the cross-sectional areas of the conductive patterns 62 and 63 must be increased. For this purpose, since the substrate 61 needs to be formed wide, the fixing device itself is increased in size and the manufacturing cost of the heater is increased.

本実施例のヒータ５は、基板５１の短手方向において一端側の導電部５３ｂと中央部の導電部５２ｂとの間に抵抗パターン５４を配置するとともに、その中央部の導電部５２ｂと他端側の導電部５３ｃとの間に抵抗パターン５５を配置したものである。そして、抵抗パターン５４，５５の厚みは従来のヒータ６の抵抗パターン６４の厚みと同じにしてある。このように抵抗パターン５４，５５を配置することによって、従来方式の抵抗パターン６４と比較すると、抵抗パターン５４，５５は断面積が２倍で長さが半分の抵抗パターンが形成されることと等価な構成となる。   In the heater 5 of this embodiment, a resistance pattern 54 is disposed between the conductive portion 53b at one end and the conductive portion 52b at the central portion in the short direction of the substrate 51, and the conductive portion 52b at the central portion and the other end. A resistance pattern 55 is arranged between the conductive portion 53c on the side. The thickness of the resistance patterns 54 and 55 is the same as the thickness of the resistance pattern 64 of the conventional heater 6. By arranging the resistance patterns 54 and 55 in this manner, the resistance patterns 54 and 55 are equivalent to the formation of a resistance pattern having a double cross-sectional area and a half length compared to the resistance pattern 64 of the conventional method. It becomes the composition.

よって、従来方式と同じ抵抗値を得る為の抵抗パターン５４，５５の体積抵抗値は、従来方式の抵抗パターン６４の４倍の値とすることが出来る。つまり、基板５１の短手方向において対向する導電部５３ｂ，５２ｂ、５２ｂ，５３ｃ間の抵抗パターン５４，５５の断面積は、それぞれ従来方式の抵抗パターン６４と同じで長さが半分になっている。そのため、導電部５３ｂ，５２ｂ間における抵抗パターン５４の抵抗値と、導電部５２ｂ，５３ｃ間のおける抵抗パターン５５の抵抗値は、それぞれ従来方式の抵抗パターン６４の２倍の抵抗値となる。従って、抵抗パターン５４，５５の抵抗値を積算すれば、その抵抗パターン５４，５５の体積抵抗値は従来方式の抵抗パターン６４の４倍となる。   Therefore, the volume resistance values of the resistance patterns 54 and 55 for obtaining the same resistance value as in the conventional method can be set to four times the resistance pattern 64 of the conventional method. That is, the cross-sectional areas of the resistance patterns 54 and 55 between the conductive portions 53b, 52b, 52b, and 53c facing each other in the short direction of the substrate 51 are the same as the resistance pattern 64 of the conventional method, and the length is halved. . Therefore, the resistance value of the resistance pattern 54 between the conductive portions 53b and 52b and the resistance value of the resistance pattern 55 between the conductive portions 52b and 53c are double the resistance values of the resistance pattern 64 of the conventional method, respectively. Therefore, if the resistance values of the resistance patterns 54 and 55 are integrated, the volume resistance value of the resistance patterns 54 and 55 is four times that of the resistance pattern 64 of the conventional method.

このように抵抗パターン５４，５５は体積抵抗値が従来方式の抵抗パターン６４の体積抵抗率に比べ格段に高いことから、抵抗パターン５４，５５が均一に発熱する為の条件を得ることが容易となる。つまり、抵抗パターン５４，５５の発熱分布の均一化を図れる。   As described above, the resistance patterns 54 and 55 have much higher volume resistance values than the volume resistivity of the resistance pattern 64 of the conventional method, so that it is easy to obtain conditions for the resistance patterns 54 and 55 to generate heat uniformly. Become. That is, the heat distribution of the resistance patterns 54 and 55 can be made uniform.

また、基板５１の短手方向中央部の導電部５２ｂは、抵抗パターン５４，５５への通電の総電流が流れることになる。その為、基板５１の短手方向における一端側と他端側のそれぞれの導電部５３ｂ，５３ｃに対して２倍の断面積が必要となる。即ち、基板５１の短手方向端部の導電部５３ｂ，５３ｃの抵抗値は、短手方向中央部の導電部５２ｂの抵抗値に対して２倍の値となる。この場合、抵抗パターン５４，５５の温度係数は正特性であれば従来方式に対して改善効果が得られるが、十分な効果を得る為には１０００ｐｐｍ／℃以上の特性を有することが望ましい。   Further, the total current for energization of the resistance patterns 54 and 55 flows through the conductive portion 52b at the center in the short direction of the substrate 51. Therefore, a double cross-sectional area is required for each of the conductive portions 53b and 53c on one end side and the other end side in the short direction of the substrate 51. That is, the resistance value of the conductive portions 53b and 53c at the short-side end of the substrate 51 is twice the resistance value of the conductive portion 52b at the short-side central portion. In this case, if the temperature coefficients of the resistance patterns 54 and 55 are positive characteristics, an improvement effect can be obtained as compared with the conventional method.

また、小サイズの記録材を大サイズの記録材と同じプリント間隔で連続プリントした場合にはヒータ５の記録材が通過しない領域が昇温する。この場合、抵抗パターン５４，５５へは導電部５３ｂ，５２ｂ、５２ｂ，５３ｃより電圧が印加されていて抵抗値が大きくなった部分は電流が少なくなるように作用する。従って、ヒータ５の記録材が通過しない領域の発熱量は低下して過度の昇温を緩和できる。   In addition, when a small size recording material is continuously printed at the same print interval as a large size recording material, the temperature of the heater 5 in which the recording material does not pass is raised. In this case, a voltage is applied to the resistance patterns 54 and 55 from the conductive portions 53b, 52b, 52b and 53c, and the portion where the resistance value is increased acts to reduce the current. Therefore, the amount of heat generated in the area of the heater 5 where the recording material does not pass is reduced, and excessive temperature rise can be mitigated.

本実施例ではヒータ５の他の例を説明する。   In this embodiment, another example of the heater 5 will be described.

図６において、（ａ）は本実施例に係るヒータ５の基板５１表面側の構成を表す説明図、（ｂ）はヒータ５の基板５１裏面側の構成を表す説明図、（ｃ）は（ｂ）に示すｃ−ｃ線断面図である。本実施例では実施例１のヒータ５と同じ部材・部分には同一符号を付して再度の説明を省略する。   6A is an explanatory diagram illustrating the configuration of the front surface side of the substrate 51 of the heater 5 according to the present embodiment, FIG. 6B is an explanatory diagram illustrating the configuration of the back surface side of the substrate 51 of the heater 5, and FIG. It is a cc line sectional view shown in b). In the present embodiment, the same members and portions as those of the heater 5 of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

本実施例のヒータ５は、基板５１の表面において短手方向における一端側の導電部５３ｂを基板５１裏面に設けた導電部５３ｂ１と接続させている。また、他端側の導電部５３ｃを基板５１裏面に設けた導電部５３ｃ１と接続させている。また、中央部の導電部５２ｂを基板５１裏面側に設けた導電部５２ｂ１と接続させている。基板５１裏面の導電部５３ｂ１，５３ｃ１，５２ｂ１は、それぞれ基板５１表面の導電部５３ｂ，５３ｃ，５２ｂと基板５１厚み方向で対向している。したがって、導電部５３ｂ１，５３ｃ１，５２ｂ１は、基板５１の短手方向で並列に設けてある。ｈは基板５１を厚み方向で貫通する孔である。孔ｈは基板５１長手方向の表裏面において導電部５３ｂ，５３ｃ，５２ｂ、５３ｂ１，５３ｃ１，５２ｂ１の両端部に設けてある。したがって、基板５１表面の導電部５３ｂ，５３ｃ，５２ｂと基板５１裏面の導電部５３ｂ１，５３ｃ１，５２ｂ１は対応する孔ｈを通じて接続されている。   In the heater 5 of the present embodiment, the conductive portion 53 b on one end side in the short direction on the surface of the substrate 51 is connected to the conductive portion 53 b 1 provided on the back surface of the substrate 51. The conductive portion 53c on the other end side is connected to the conductive portion 53c1 provided on the back surface of the substrate 51. The central conductive portion 52b is connected to the conductive portion 52b1 provided on the back side of the substrate 51. The conductive portions 53b1, 53c1, and 52b1 on the back surface of the substrate 51 are opposed to the conductive portions 53b, 53c, and 52b on the surface of the substrate 51 in the thickness direction of the substrate 51, respectively. Therefore, the conductive portions 53 b 1, 53 c 1, 52 b 1 are provided in parallel in the short direction of the substrate 51. h is a hole penetrating the substrate 51 in the thickness direction. The holes h are provided at both ends of the conductive portions 53b, 53c, 52b, 53b1, 53c1, and 52b1 on the front and back surfaces in the longitudinal direction of the substrate 51. Therefore, the conductive portions 53b, 53c, 52b on the surface of the substrate 51 and the conductive portions 53b1, 53c1, 52b1 on the back surface of the substrate 51 are connected through the corresponding holes h.

このように基板５１の表面と裏面を用いて通電パターン５２，５３を構成して並列に接続することによって、通電パターン５２，５３の抵抗値をさらに下げる事が可能となる。   Thus, by configuring the energization patterns 52 and 53 using the front and back surfaces of the substrate 51 and connecting them in parallel, the resistance values of the energization patterns 52 and 53 can be further reduced.

〔その他〕
１）可撓性部材はエンドレスのものに限られない。ロール巻きの長尺の有端フィルムを繰出し側から巻取り側にニップ部を経由させて走行移動させる装置構成にすることができる。 [Others]
1) The flexible member is not limited to an endless one. It is possible to adopt a device configuration in which a long end film with roll winding is moved from the feeding side to the winding side via a nip portion.

２）加圧部材はローラ体に限られず、回動ベルト体にすることもできる。また、可撓性部材は加圧部材以外の駆動部材で移動させて、加圧部材を従動させる装置構成にすることもできる。   2) The pressure member is not limited to a roller body, and may be a rotating belt body. In addition, the flexible member can be moved by a driving member other than the pressure member, so that the pressure member is driven.

３）本発明の像加熱装置は、実施例の画像加熱定着装置としてばかりでなく、画像を担持した記録材を加熱してつや等の表面性を改質する像加熱装置、記録材上の未定着画像を仮定着させる像加熱装置としても使用することができる。   3) The image heating apparatus of the present invention is not only an image heating and fixing apparatus of the embodiment, but also an image heating apparatus that heats a recording material carrying an image to improve surface properties such as gloss, and an unfixed image on the recording material. It can also be used as an image heating device that presupposes an image.

画像形成装置の一例の概略構成模型図Schematic model diagram of an example of an image forming apparatus 実施例１に係る定着装置の要部の横断面模型図Cross-sectional schematic diagram of the main part of the fixing device according to the first embodiment. ホルダを上側から見た外観斜視模型図External perspective model view of holder viewed from above ホルダとフィルムとヒータの関係を表す分解斜視図Exploded perspective view showing relationship between holder, film and heater ヒータの一例を表す説明図Explanatory drawing showing an example of a heater ヒータ５の他の例を表す説明図Explanatory drawing showing other examples of heater 5 従来のヒータを表す説明図Explanatory drawing showing a conventional heater

符号の説明Explanation of symbols

５：ヒータ、５１：基板、５２，５３：導電パターン、５２ｂ，５３ｂ，５３ｃ：基板表面の導電部、５２ｂ１，５３ｂ１，５３ｃ１：基板裏面の導電部、５４，５５：抵抗パターン、２９：定着装置 5: heater, 51: substrate, 52, 53: conductive pattern, 52b, 53b, 53c: conductive portion on the front surface of the substrate, 52b1, 53b1, 53c1: conductive portion on the back surface of the substrate, 54, 55: resistance pattern, 29: fixing device

Claims (8)

細長い基板と、前記基板の長手方向に沿って基板面に設けられた発熱体と、を有する加熱体を有し、前記加熱体からの熱により、画像を担持する記録材を加熱する像加熱装置において、
前記加熱体は、前記基板の長手方向と直交する短手方向における一端側、他端側、及び、前記一端側と前記他端側の間にそれぞれ導電部を有するとともに、前記基板の短手方向において前記導電体間に前記発熱体をそれぞれ有し、前記発熱体は前記導電部と並列に接続されていることを特徴とする像加熱装置。 An image heating apparatus having a heating body having an elongated substrate and a heating element provided on a substrate surface along the longitudinal direction of the substrate, and heating a recording material carrying an image by heat from the heating body In
The heating element has one end side and the other end side in a short direction perpendicular to the longitudinal direction of the substrate, and a conductive portion between the one end side and the other end side, and the short direction of the substrate. The image heating apparatus according to claim 1, wherein the heating element is provided between the conductors, and the heating element is connected in parallel with the conductive portion. 前記基板の短手方向における一端側と他端側に有する前記導電部の抵抗値は、一端側と他端側の間に有する前記導電部の抵抗値の２倍であることを特徴とする請求項１に記載の像加熱装置。   The resistance value of the conductive part on one end side and the other end side in the short direction of the substrate is twice the resistance value of the conductive part between the one end side and the other end side. Item 2. The image heating apparatus according to Item 1. 前記発熱体の温度係数は正特性を有することを特徴とする請求項１に記載の像加熱装置。   The image heating apparatus according to claim 1, wherein the temperature coefficient of the heating element has a positive characteristic. 前記基板の短手方向における一端側の前記導電部は前記基板面と反対側の基板面に設けられた導電部と、他端側の前記導電部は前記基板面と反対側の基板面に設けられた導電部と、一端側と他端側の間に有する前記導電部は前記基板面と反対側の基板面に設けられた導電部と、それぞれ接続していることを特徴とする請求項１に記載の像加熱装置。   The conductive portion on one end side in the short side direction of the substrate is provided on the substrate surface opposite to the substrate surface, and the conductive portion on the other end side is provided on the substrate surface opposite to the substrate surface. The conductive portion provided between the one end side and the other end side is connected to a conductive portion provided on a substrate surface opposite to the substrate surface, respectively. The image heating apparatus described in 1. 細長い基板と、前記基板の長手方向に沿って基板面に設けられた発熱体と、を有し、前記発熱体からの熱により、画像を担持する記録材を加熱する像加熱装置に用いられる加熱体において、
前記基板の長手方向と直交する短手方向における一端側、他端側、及び、前記一端側と前記他端側の間にそれぞれ導電部を有するとともに、前記基板の短手方向において前記導電部間に前記発熱体をそれぞれ有し、前記発熱体は前記導電部と並列に接続されていることを特徴とする加熱体。 Heating used in an image heating apparatus that has an elongated substrate and a heating element provided on the substrate surface along the longitudinal direction of the substrate, and heats a recording material carrying an image by heat from the heating element In the body,
One end side in the short direction perpendicular to the longitudinal direction of the substrate, the other end side, and a conductive portion between the one end side and the other end side, and between the conductive portions in the short direction of the substrate Each of the heating elements, and the heating elements are connected in parallel with the conductive portion. 前記基板の短手方向における一端側と他端側に有する前記導電部の抵抗値は、一端側と他端側の間に有する前記導電部の抵抗値の２倍であることを特徴とする請求項５に記載の加熱体。   The resistance value of the conductive part on one end side and the other end side in the short direction of the substrate is twice the resistance value of the conductive part between the one end side and the other end side. Item 6. The heating body according to Item 5. 前記発熱体の温度係数は正特性を有することを特徴とする請求項５に記載の加熱体。   The heating element according to claim 5, wherein the temperature coefficient of the heating element has a positive characteristic. 前記基板の短手方向における一端側の前記導電部は前記基板面と反対側の基板面に設けられた導電部と、他端側の前記導電部は前記基板面と反対側の基板面に設けられた導電部と、一端側と他端側の間に有する前記導電部は前記基板面と反対側の基板面に設けられた導電部と、それぞれ接続していることを特徴とする請求項５に記載の加熱体。   The conductive portion on one end side in the short side direction of the substrate is provided on the substrate surface opposite to the substrate surface, and the conductive portion on the other end side is provided on the substrate surface opposite to the substrate surface. 6. The conductive portion provided between the one end side and the other end side is connected to a conductive portion provided on a substrate surface opposite to the substrate surface, respectively. The heating body according to 1.
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