JP2007317339A - Optical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical device capable of preventing an optical component from being deviated in posion and posture caused by heat without reducing the dimentional accuracy of the optical component. <P>SOLUTION: The optical device 1 is provided with: the optical component 8; a holder 10 for holding the optical component 8; and a temperature adjusting means 12 for adjusting temperatures of the optical componentt and the holder 10. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical device and an electronic apparatus.

  An optical pickup apparatus records information by condensing a light beam emitted from a light emitting element on an information recording surface of an optical recording medium such as a compact disc (abbreviation CD) and a digital versatile disc (abbreviation DVD). The present invention is provided in an optical recording medium recording / reproducing apparatus for reproducing information recorded on the recording medium.

  In the optical pickup device, for example, a semiconductor laser element or the like is used as a light emitting element that emits laser light. For example, when the optical recording medium is a DVD, the semiconductor laser element requires a larger output than the infrared laser light used when the optical recording medium is a CD, and emits red laser light with much heat generation. As a result, the semiconductor laser element becomes very hot.

  Air produces a difference in density with a difference in temperature. When a high temperature portion and a low temperature portion are generated in the optical pickup device due to heat generated by light emission from the semiconductor laser element, an irregular air flow is generated in the air in the optical pickup device according to the temperature distribution. When high temperature air and low temperature air enter and mix in the optical pickup device due to the irregular air flow, air having different densities enters the optical pickup device and is mixed. When the density of air is different, the refractive index of light is also different, and the emitted light from the semiconductor laser passing through the air is refracted irregularly. When the laser beam is refracted, it becomes difficult to focus the laser beam on the information recording surface of the optical recording medium. As a result, it becomes impossible to reproduce and record a good optical recording medium, and the reliability of the device is lowered. Further, the resistance value of the semiconductor laser element changes with temperature. As a result, when the temperature of the semiconductor laser element becomes high, there is a problem that the operating current increases and the life is shortened.

  As an optical pickup device that solves the above problems, an optical pickup device that can alleviate the temperature rise of the semiconductor laser element has been proposed (see, for example, Patent Documents 1 to 4).

  Patent Document 1 describes an optical pickup device including a heat radiating plate that transfers heat generated from a light source to a housing. In the optical pickup device described in Patent Document 1, the heat generated from the light source is conducted to the heat radiating plate, and the heat conducted to the heat radiating plate is further conducted to the housing. The heat conducted to the housing is released outside the housing. Thereby, the temperature rise of the light source can be mitigated.

  Patent Document 2 describes an optical pickup device in which a heat sink that releases heat generated from a hologram laser including a light emitting element and a holder that supports the hologram laser are integrally formed. In the optical pickup device described in Patent Literature 2, the heat generated from the hologram laser can be quickly released from the heat sink to the outside of the hologram laser, so that the temperature rise of the hologram laser can be mitigated.

  In Patent Document 3, the temperature of a metal holding member that holds a light source can be adjusted. For example, the optical pickup can adjust the light direction of light emitted from the light source by cooling and contracting the holding member. An apparatus is described. In the optical pickup device described in Patent Document 3, the light source held by the holding member can be cooled by cooling the holding member, and the temperature rise of the light source can be mitigated.

  Patent Document 4 describes a method of operating an optical recording medium recording / reproducing apparatus in which the temperature of a light source is monitored and a step in which the temperature of the light source is decreased when the temperature of the light source becomes higher than a predetermined temperature is described. In the operation method of the optical recording medium recording / reproducing apparatus described in Patent Document 4, for example, the rotation speed of the motor of the disk drive is reduced so that the temperature of the light source is decreased when the temperature of the light source is higher than a predetermined temperature. The Thereby, the temperature rise of the light source can be mitigated.

  According to the operation methods of the optical pickup device and the optical recording medium recording / reproducing device disclosed in Patent Documents 1 to 4 as described above, the configuration is such that heat generated from the light source is easily released, or the light source can be cooled. By adopting the configuration, the temperature rise of the light source can be mitigated. As a result, the reliability of the device can be improved and the life of the light source can be extended.

  In the operation methods of the optical pickup device and the optical recording medium recording / reproducing device disclosed in Patent Documents 1 to 4, although the temperature rise of the light source can be mitigated, the heat generated from the light source is also transmitted to the housing and optical components. Increase the temperature of the entire optical pickup device. When the temperature of the entire optical pickup device rises, the optical component has a positional deviation and a posture deviation due to different linear expansion coefficients of the housing, the optical component, the holder that holds the optical component, and the adhesive that bonds the holder and the housing. As a result, good recording and reproduction cannot be performed.

  In view of such a problem, there has been proposed an optical pickup device that can prevent a positional shift and a positional shift of an optical component due to heat (see, for example, Patent Document 5). In an optical pickup device described in Patent Document 5, a housing that is a device body and optical components such as a collimating lens, a reflecting prism, a condensing lens, and a knife edge prism are molded integrally with light-transmitting plastic or glass. Has been. According to such an optical pickup device, since the housing and the optical component are formed of the same material, there is no difference in linear expansion coefficient between the housing and the optical component. As a result, it is possible to prevent the occurrence of positional deviation and posture deviation of the optical component.

JP 2000-3527 A JP 2003-187461 A JP 2001-14700 A JP 2005-518621 A JP-A-6-4893

  However, in the optical pickup device described in Patent Document 5, since the housing and the optical component are provided by integral molding, the dimensional accuracy of the lens is lower than when the housing and the optical component are separately formed, Reading accuracy of information recorded on the recording medium is low. Therefore, there is a demand for an optical pickup device that can prevent the positional deviation and the attitude deviation of the optical component due to heat without reducing the dimensional accuracy of the optical component such as a lens.

  An object of the present invention is to provide an optical device and an electronic apparatus that can prevent positional deviation and posture deviation of an optical component due to heat without reducing the dimensional accuracy of the optical component.

The present invention includes an optical component,
A holder for holding optical components;
An optical apparatus comprising temperature adjusting means for adjusting the temperature of the optical component and the holder.

  According to the present invention, the optical device includes an optical component and a holder that holds the optical component. Further, the temperature of the optical component and the holder is adjusted by the temperature adjusting means.

In the present invention, the temperature adjusting means is
It is characterized in that at least one of the heating flow rate and the endothermic flow rate can be controlled by electrical control.

  According to the present invention, the temperature adjusting means controls at least one of the heating flow rate and the endothermic flow rate by electrical control to adjust the temperature of the optical component and the holder. The electrical control is control of the voltage value of the applied voltage or the current value of the energized current.

Further, in the present invention, the temperature adjustment means has a temperature adjustment unit,
The temperature adjustment unit is embedded in an adhesive that bonds the optical component to the holder.

  According to the present invention, the temperature adjusting unit of the temperature adjusting means is embedded in the adhesive that bonds the optical component to the holder, whereby the temperature of the adhesive can be adjusted.

Further, the present invention provides a temperature detection means for detecting the temperature of at least one of the optical component and the holder;
And control means for controlling the temperature adjusting means so that the temperature detected by the temperature detecting means becomes the reference temperature.

  According to the present invention, the temperature adjusting means is controlled so that the temperature of at least one of the optical component and the holder, which is the detected temperature detected by the temperature detecting means, becomes the reference temperature.

Further, in the present invention, the temperature detecting means has a temperature sensing part,
The temperature sensing part is embedded in an adhesive that bonds the optical component to the holder.

  According to the present invention, the temperature of the temperature detecting means is embedded in the adhesive that bonds the optical component to the holder, so that the temperature of the adhesive can be detected.

In the present invention, the optical component is bonded to the holder with an adhesive,
As the adhesive, a material having high thermal conductivity is selected.

  According to the present invention, the temperature difference between the optical component and the holder can be reduced by selecting a material with high thermal conductivity as the adhesive for bonding the optical component to the holder.

Further, in the present invention, the holder is formed with a recess in which the optical component is accommodated,
The optical component is held by being filled with a translucent resin material in the remaining region of the recess while being accommodated in the recess.

  According to the present invention, the optical component is accommodated in the recess formed in the holder, and is held in the holder by the translucent resin material filled in the remaining region of the recess.

Further, in the present invention, the temperature adjustment means has a temperature adjustment unit,
The temperature adjusting unit is embedded in a translucent resin material.

  According to the present invention, the temperature adjusting unit of the temperature adjusting means is embedded in the translucent resin material, so that the temperature of the translucent resin material can be adjusted.

Further, in the present invention, the temperature detecting means has a temperature sensing part,
The temperature sensitive part is embedded in a translucent resin material.

  According to the present invention, the temperature of the temperature detecting means is embedded in the translucent resin material, so that the temperature of the translucent resin material can be detected.

In addition, the present invention is an optical pickup device.
According to the present invention, the optical device is used as an optical pickup device that records information or reproduces information by condensing light emitted from a light source on an information recording surface of an optical recording medium.

Moreover, this invention is an electronic device provided with the optical apparatus of the said this invention.
According to the present invention, the electronic apparatus can include an optical device that achieves the above-described action.

  According to the present invention, the optical device includes an optical component and a holder that holds the optical component. Further, the temperature of the optical component and the holder is adjusted by the temperature adjusting means. By providing the optical device with the optical component and the holder, respectively, the dimensional accuracy of the optical component can be improved as compared with the case where the optical component and the holder are integrally formed. Further, the temperature of the optical component and the holder can be adjusted by the temperature adjusting means so that the positional deviation and the attitude deviation of the optical component do not occur due to the difference in the linear expansion coefficient between the optical component and the holder.

  According to the invention, the temperature adjusting means controls at least one of the heating flow rate and the endothermic flow rate by electrical control to adjust the temperature of the optical component and the holder. When the temperature adjusting means has a configuration that controls at least one of the heating flow rate and the endothermic flow rate by electrical control, the optical component and the holder can be forcibly heated or cooled, and the temperature of the optical component and the holder can be reduced. It can be adjusted quickly.

  Moreover, according to this invention, the temperature adjustment part of a temperature adjustment means is embed | buried in the adhesive agent which adhere | attaches an optical component to a holder, and can adjust the temperature of an adhesive agent. When the temperature of the adhesive is adjusted by the temperature adjusting unit of the temperature adjusting means, the temperature of the optical component and the holder is adjusted by the temperature-adjusted adhesive. Accordingly, the temperature of the optical component, the temperature of the holder that holds the optical component, and the temperature of the adhesive that bonds the optical component and the holder can be adjusted, thereby preventing the occurrence of positional deviation and posture deviation of the optical component. be able to. Also, by embedding the temperature adjusting portion of the temperature adjusting means in the adhesive, it becomes easy to assemble an optical device including the temperature adjusting means.

  According to the present invention, the temperature adjusting means is controlled so that the temperature of at least one of the optical component and the holder, which is the detected temperature detected by the temperature detecting means, becomes the reference temperature. As the reference temperature, for example, the environmental temperature when the optical component is mounted with its position adjusted with respect to the holder is set. If the temperature is adjusted so that the temperature of at least one of the optical component and the holder becomes the reference temperature, it is possible to prevent the optical component from being displaced due to the difference in linear expansion coefficient.

  According to the present invention, the temperature of the temperature detecting means is embedded in the adhesive that bonds the optical component to the holder, so that the temperature of the adhesive can be detected. Since the adhesive bonds the optical component and the holder, it can be considered that the temperature is substantially equal to that of the optical component and the holder. Therefore, the temperature of the adhesive can be detected by detecting the temperature of the adhesive at the temperature sensing part of the temperature detecting means. Further, the optical device can be easily assembled by embedding the temperature sensing portion of the temperature detecting means in the adhesive.

  Moreover, according to this invention, the temperature difference between an optical component and a holder can be reduced by selecting material with high heat conductivity as an adhesive agent which adhere | attaches an optical component to a holder. For example, when the temperature of the adhesive is adjusted by the temperature adjusting unit of the temperature adjusting means, if a material having high thermal conductivity is selected as the adhesive, the temperature of the optical component and the holder is adjusted by adjusting the temperature of the adhesive. It can be adjusted quickly. Further, even when there is a temperature difference between the optical component and the holder, heat is easily transferred from the high temperature side to the low temperature side via the adhesive, and the temperatures of the optical component, the holder, and the adhesive can be made substantially equal. . Thereby, when the temperature of at least one of the optical component and the holder is obtained by detecting the temperature of the adhesive, the reliability of the detected temperature can be obtained.

  According to the invention, the optical component is housed in the recess formed in the holder, and is held in the holder by the translucent resin material filled in the remaining area of the recess. When the optical component is accommodated in the recess formed in the holder and the resin material having translucency is filled in the recess, it is possible to prevent the environmental temperature in the holder from affecting the temperature of the optical component. Thus, when adjusting the temperature of the optical component to the reference temperature, it is possible to prevent the occurrence of a problem that the actual temperature of the optical component becomes a temperature different from the reference temperature due to the influence of the environmental temperature in the holder.

  Moreover, according to this invention, the temperature of the translucent resin material can be adjusted by embedding the temperature adjusting part of the temperature adjusting means in the translucent resin material. Further, when the temperature of the translucent resin material is adjusted by the temperature adjusting unit of the temperature adjusting means, the temperatures of the optical component and the holder are adjusted by the translucent resin material. Further, the optical device can be easily assembled by embedding the temperature adjusting portion of the temperature adjusting means in the translucent resin material.

  According to the present invention, the temperature of the light-transmitting resin material can be detected by embedding the temperature-sensitive portion of the temperature detecting means in the light-transmitting resin material. Since the translucent resin material is in contact with the optical component and the holder, it can be considered that the temperature is substantially equal to that of the optical component and the holder. Therefore, the temperature of at least one of the optical component and the holder can be detected by detecting the temperature of the translucent resin material at the temperature sensing part of the temperature detecting means. Further, the optical device can be easily assembled by embedding the temperature sensing portion of the temperature detecting means in a translucent resin material.

  According to the invention, the optical device is used as an optical pickup device that records information or reproduces information by condensing light emitted from a light source on an information recording surface of an optical recording medium. In such an optical device, the temperature of the optical component and the holder is adjusted, thereby preventing the positional shift and the posture shift of the optical component. In addition, the dimensional accuracy of the optical component is excellent. Therefore, when such an optical device is used as an optical pickup device, it is excellent in reading accuracy of information recorded on an optical recording medium, and good recording or reproduction is possible.

  According to the invention, the electronic device can include an optical device that achieves the above-described effect. When the electronic device can be provided with an optical pickup device that is an optical device that achieves the above-described effect, for example, an electronic device that is excellent in the accuracy of reading information recorded on an optical recording medium and that can perform good recording or reproduction is obtained. Can do.

  FIG. 1 is a perspective view showing a configuration of an optical device 1 according to a first embodiment of the present invention. FIG. 2 is an enlarged perspective view of a main part of the optical device 1. In the perspective view of the main part of FIG. 2, the periphery of the spot adjustment lens 8 of the optical pickup device 1 is shown. The optical device 1 is used as an optical pickup device in the present embodiment. Therefore, the optical device 1 may be hereinafter referred to as “optical pickup device 1”.

  1 and 2, the direction of light emitted from the semiconductor laser element 2 is defined as the X direction. The X direction and the direction perpendicular to the information recording surface 11a of the optical recording medium 11 are defined as the Y direction. A direction perpendicular to the X direction and the Y direction is taken as a Z direction. A direction rotating around a rotation axis extending in the Z direction is defined as an R direction.

  The optical pickup device 1 includes a semiconductor laser element 2 as a light source, a grating 3, a beam splitter 4, a collimator lens 5, a rising mirror 6, a condenser lens 7, a spot adjustment lens 8, and a light receiving element 9. It is comprised including. In the optical pickup device 1, the semiconductor laser element 2, the light receiving element 9 and the above-described optical components are accommodated in a holder 10.

The semiconductor laser element 2 is a flexible printed circuit board (FPC).
The circuit is electrically connected to an external circuit through a wiring board. The semiconductor laser element 2 emits red laser light having a wavelength of 650 nm, for example, when power is supplied.

  The grating 3 separates light emitted from the semiconductor laser element 2 into 0th-order diffracted light, −1st-order diffracted light, and + 1st-order diffracted light. The beam splitter 4 reflects the outward light emitted from the semiconductor laser element 2 and directed to the optical recording medium 11, and transmits the backward light reflected by the optical recording medium 11. The collimating lens 5 emits the diffused light emitted from the semiconductor laser element 2 and made incident as parallel light. The rising mirror 6 reflects the outward light from the collimating lens 5 toward the condenser lens 7 and reflects the backward light from the condenser lens 7 toward the collimating lens 5.

  The condensing lens 7 condenses light on the information recording surface 11 a of the optical recording medium 11. The condenser lens 7 is supported by the holder 10 via the lens holder 7a. The lens holder 7a is driven by electromagnetic force so as to correct errors in the focus direction and tracking direction due to the thickness error and inclination of the optical recording medium 11 by a driving means including a magnetic member and a coil.

  The spot adjustment lens 8 causes the return light reflected by the optical recording medium 11 and transmitted through the beam splitter 4 to enter the predetermined light receiving region of the light receiving element 9. The spot adjustment lens 8 gives astigmatism to incident light so that the light receiving element 9 can output a focus error signal (FE signal). The light receiving element 9 is a signal conversion means in which a predetermined light receiving region is formed. The light receiving element 9 converts the incident laser light into an electrical signal, and outputs the FE signal, the information reproduction signal (RF signal), and the tracking error signal (TE signal) by performing an operation.

  The divergent light emitted from the semiconductor laser element 2 enters the grating 3 and is separated into 0th-order diffracted light, −1st-order diffracted light, and + 1st-order diffracted light. The light incident on the grating 3 is reflected by the beam splitter 4, enters the collimating lens 5, and is converted into parallel light. The light converted into parallel light is reflected by the upright mirror 6 so as to be guided to the condenser lens 7. The light reflected by the upright mirror 6 passes through the condenser lens 7, whereby the parallel light is converted into convergent light and is collected on the information recording surface 11 a of the optical recording medium 11.

  The light reflected by the information recording surface 11 a of the optical recording medium 11 enters the condenser lens 7 again and is reflected by the rising mirror 6. The light reflected by the rising mirror 6 passes through the collimating lens 5, the beam splitter 4, and the spot adjustment lens 8 and enters the light receiving element 9. Light incident on the light receiving element 9 is converted from an optical signal to an electrical signal.

  In such an optical pickup device 1, a semiconductor laser element 2, an optical component including a grating 3, a beam splitter 4, a collimating lens 5, a rising mirror 6, and a spot adjustment lens 8, and a light receiving element 9 are provided with a holder 10. Are fixed with an adhesive so as to be in a predetermined reference position and in a predetermined reference posture.

  Optical components are fixed to the optical pickup device 1 at a predetermined reference position and reference posture. In each optical component, the relative position and the posture with respect to the holder 10 are precisely determined in each of the X direction, the Y direction, the Z direction, and the R direction which is the rotational direction in the XY plane.

  In this way, the optical component is fixed and adjusted with respect to the holder 10 precisely, but the holder 10, the optical component and the optical component are bonded to the holder 10 by the heat generated from the semiconductor laser element 2. As a result, the temperature of the adhesive to be raised rises, and the optical component is displaced in position and posture. This is because the linear expansion coefficients of the holder 10, the optical component, and the adhesive are different. When the positional deviation and the attitude deviation of the optical component occur, a deviation occurs between the optical axis of the optical member and the optical axis emitted from the semiconductor laser element 2, and the light incident on the condenser lens 7 is centered on the condenser lens 7. The maximum intensity is not affected, and the recording / reproducing characteristics with respect to the optical recording medium 11 are affected. Therefore, in the optical pickup device 1 according to the present embodiment, the temperature of the optical component is adjusted in order to prevent the occurrence of positional deviation and posture deviation of the optical component.

  FIG. 3 is a block diagram illustrating an electrical configuration of the optical pickup device 1. The optical pickup device 1 according to the present embodiment includes a temperature adjustment unit 12, a temperature detection unit 13, and a control unit 14. The temperature adjusting means 12 controls the temperature of the optical component and the holder 10 in order to prevent the optical component and the optical component and the holder 10 from being displaced due to different linear expansion coefficients of the holder 10, the optical component, and the adhesive. adjust. The temperature detection means 13 detects the temperature of at least one of the optical component and the holder 10. The control unit 14 controls the operation of the temperature adjustment unit 12 so that the temperature detected by the temperature detection unit 13 becomes the reference temperature.

  The temperature adjusting means 12 of this embodiment includes a temperature adjusting unit 15 and a voltage applying unit 16. The temperature adjusting means 12 is configured such that the heating flow rate can be controlled by electrical control. The electrical control is to control the voltage value of the applied voltage or to control the current value of the energized current. In the present embodiment, the heating flow rate is configured to be controllable by controlling the voltage value of the applied voltage. If the temperature adjustment means 12 has a configuration in which the heating flow rate is controlled by electrical control, the optical component and the holder 10 can be forcibly heated, and the temperature of the optical component and the holder 10 can be adjusted quickly. it can.

  The temperature adjusting unit 15 adjusts the temperature of the temperature controlled object that is thermally connected by increasing or decreasing the temperature of the temperature adjusting unit 15. The temperature adjustment unit 15 of the present embodiment is a resistance heating element that generates heat when a voltage is applied from the voltage application unit 16. For example, a resistance heating element such as a copper heating element, an iron-chromium-aluminum heating element, or a nickel-chromium heating element can be used as the temperature adjustment unit 15. Further, as the temperature adjusting unit 15, a sheathed heater in which the resistance heating element is accommodated in a metal cylindrical container and an insulator is filled in the cylindrical container accommodating the resistance heating element may be used. As the resistance heating element, a wire can be used, and a coil shape is preferable.

  The temperature adjusting unit 15 generates heat when a voltage is applied by the voltage applying unit 16, and heats the optical component and the holder 10 by the generated heat. The heating flow rate at this time is determined by the voltage value of the voltage applied by the voltage application unit 16. The voltage application unit 16 applies a voltage to the temperature adjustment unit 15 to cause the temperature adjustment unit 15 to generate heat. The operation of the voltage application unit 16 is controlled by the control means 14.

  As the temperature detection means 13, for example, a thermocouple or a sensor can be used. In the present embodiment, a thermocouple is used as the temperature detection means 13. The temperature detection unit 13 includes a temperature sensing unit 17. The temperature sensing unit 17 is thermally connected to the temperature detection object, and the temperature detection means 13 detects the temperature of the temperature detection object. The temperature detected by the temperature detection means 13 is input to the control means 14.

The control means 14 is implement | achieved by CPU (Central Processing Unit; Central processing unit), for example. The control unit 14 determines the voltage value of the voltage to be applied to the temperature adjustment unit 15 according to the detected temperature detected by the temperature detection unit 13, and applies the voltage of the determined voltage value to the temperature adjustment unit 15. The operation of the voltage application unit 16 is controlled. The temperature detected by the temperature detection unit 13 and the voltage value of the voltage applied to the temperature adjustment unit 15 are stored in a memory 18 attached to the control unit 14 in the form of table data. For example, the memory 18 is an LSI.
(Large Scale Integration).

  The voltage value of the voltage applied to the temperature adjustment unit 15 is determined in advance by a test or the like, and is determined according to a temperature difference between the detected temperature and the reference temperature, for example. When the temperature difference between the detected temperature and the reference temperature is large, the voltage value of the voltage to be applied to the voltage application unit 16 is set large. When the temperature difference between the detected temperature and the reference temperature is small, the voltage value of the voltage to be applied to the voltage application unit 16 is set small. As a result, when the temperature difference between the detected temperature and the reference temperature is large, the voltage value applied from the voltage application unit 16 can be increased, and the temperatures of the optical component and the holder 10 can be quickly brought close to the reference temperature. When the temperature difference between the detected temperature and the reference temperature is small, the applied voltage value from the voltage application unit 16 is reduced, and the temperature is adjusted so that the temperature of the optical component and the holder 10 does not rise too much above the reference temperature. can do.

  In the present embodiment, the temperature adjustment unit 12 adjusts the temperature of the spot adjustment lens 8. Further, the temperature detection means 13 detects the temperature of the spot adjustment lens 8.

  FIG. 4 is a cross-sectional view of the optical pickup device 1 as viewed from the cutting plane line IV-IV. In FIG. 4, the dimensions of the holder 10 in the X direction are partially changed. The spot adjustment lens 8 is fixed to the holder 10 so as to be accommodated in a recess 19 formed in the holder 10. The spot adjustment lens 8 is fixed to the holder 10 with an adhesive 20.

  As the adhesive 20 for adhering the spot adjustment lens 8 to the holder 10, a material having high thermal conductivity is preferably selected. By selecting a material having high thermal conductivity as the adhesive 20, the temperature difference between the spot adjustment lens 8 and the holder 10 can be reduced. Further, as described later, when the temperature of the adhesive 20 is adjusted by the temperature adjusting unit 15 of the temperature adjusting means 12, if a material having high thermal conductivity is selected as the adhesive 20, the spot adjustment is performed by the adhesive 20. The temperature of the lens 8 and the holder 10 can be quickly adjusted. Even when there is a temperature difference between the spot adjustment lens 8 and the holder 10, heat easily moves from the high temperature side to the low temperature side via the adhesive 20, and the spot adjustment lens 8, the holder 10, and the adhesive 20 The temperatures can be made approximately equal. As a result, when the temperature of the adhesive 20 is detected to obtain the temperature of at least one of the spot adjustment lens 8 and the holder, the reliability of the detected temperature can be obtained.

  A material having high thermal conductivity is a material having a thermal conductivity of several W / (m · K) or more. As a specific example of such a material, for example, a material obtained by adding an appropriate amount of metal powder to a silicone resin or epoxy resin having heat dissipation properties can be given. However, if the content of the metal powder added to the silicone resin or the epoxy resin is too large, the thermal conductivity becomes high and preferable. However, the metal powder is weak against elastic stress and may deteriorate the adhesion performance. The powder content is preferably determined in consideration of thermal conductivity and adhesive performance.

  In the present embodiment, the temperature adjustment unit 15 of the temperature adjustment unit 12 and the temperature sensing unit 17 of the temperature detection unit 13 are embedded in the adhesive 20. In the present embodiment, the temperature adjusting means 12 includes two temperature adjusting units 15, and each temperature adjusting unit 15 bonds the spot adjusting lens 8 and the holder 10 on one end side in the X direction of the spot adjusting lens 8. And the adhesive 20 on the side where the spot adjusting lens 8 and the holder 10 are bonded to each other on the other end side in the X direction of the spot adjusting lens 8. Further, the temperature detection means 13 includes one temperature sensing portion 17, and the temperature sensing portion 17 is embedded in the adhesive 20 on the side where the spot adjustment lens 8 and the holder 10 are bonded on one end side in the X direction of the spot adjustment lens 8. Is done.

  By embedding the temperature adjusting unit 15 of the temperature adjusting unit 12 in the adhesive 20, the temperature adjusting unit 12 can adjust the temperature of the adhesive 20. When the temperature of the adhesive 20 can be adjusted by the temperature adjusting means 12, the temperature of the spot adjusting lens 8 and the holder 10 can be adjusted by the temperature-adjusted adhesive 20. Thereby, the temperature of the spot adjustment lens 8, the temperature of the holder 10 that holds the spot adjustment lens 8, and the temperature of the adhesive 20 that bonds the spot adjustment lens 8 and the holder 10 can be adjusted. In this adjustment, the temperature of the spot adjustment lens 8, the holder 10 and the adhesive 20 is adjusted to a reference temperature at which the spot adjustment lens 8, the holder 10 and the adhesive 20 do not swell. It is possible to prevent the occurrence of positional deviation and posture deviation. Further, embedding the temperature adjusting unit 15 of the temperature adjusting unit 12 in the adhesive 20 facilitates the assembly of the optical pickup device 1 including the temperature adjusting unit 12.

  Further, the temperature detecting unit 13 can detect the temperature of the adhesive 20 by embedding the temperature sensing portion 17 of the temperature detecting unit 13 in the adhesive 20. Since the adhesive 20 bonds the spot adjustment lens 8 and the holder 10, it can be considered that the temperature is substantially equal to that of the spot adjustment lens 8 and the holder 10. Therefore, the temperature of the adhesive 20 can be detected by the temperature sensing unit 17 of the temperature detection means 13, so that the temperature of at least one of the spot adjustment lens 8 and the holder 10 can be detected. Further, embedding the temperature sensing portion 17 of the temperature detecting means 13 in the adhesive 20 facilitates the assembly of the optical pickup device 1 including the temperature adjusting means 12.

  FIG. 5 is a flowchart showing a control procedure of the control means 14 when adjusting the temperatures of the spot adjusting lens 8 and the holder 10. If the power of the optical pickup device 1 is on in step s0, the process proceeds to step s1 for starting temperature adjustment of the spot adjustment lens 8 and the holder 10.

  In step s 1, the control unit 14 controls the operation of the temperature detection unit 13 so that the temperature detection unit 13 detects the temperature of the adhesive 20. In step s1, a command is given to the temperature detection means 13, and the temperature of the adhesive 20 is detected to detect the temperature of at least one of the spot adjustment lens 8 and the holder 10. The detected temperature is input to the control means 14. When the temperature of at least one of the spot adjustment lens 8 and the holder 10 is obtained, the process proceeds to step s2.

  In step s2, the control means 14 determines whether or not the detected temperature is lower than the reference temperature. Here, as the reference temperature, for example, it is possible to set an environmental temperature when the spot adjusting lens 8 is mounted with its position adjusted with respect to the holder 10. As the reference temperature, when the environmental temperature when the spot adjusting lens 8 is mounted with its position adjusted with respect to the holder 10 is set, the temperature of at least one of the spot adjusting lens 8 and the holder 10 becomes the reference temperature. The temperature is adjusted, and the relative position and posture of the spot adjustment lens 8 with respect to the holder 10 can be held at the position and posture of the spot adjustment lens 8 at the time of position adjustment. The reference temperature may be defined as a reference temperature range having a certain range.

  If it is determined in step s2 that the detected temperature is not lower than the reference temperature, the process returns to step s1. If it is determined in step s2 that the detected temperature is lower than the reference temperature, the process proceeds to step s3.

  In step s3, the control means 14 determines the voltage value of the voltage to be applied to the voltage application unit 16 from the detected temperature obtained in step s1 and determined in step s2. This voltage value can be obtained from table data stored in the memory 18. When the voltage value of the voltage to be applied to the voltage application unit 16 is determined, the process proceeds to step s4.

  In step s4, the control unit 14 controls the operation of the voltage application unit 16 and causes the temperature adjustment unit 15 to apply a voltage. As a result, the temperature adjusting unit 15 generates heat and the adhesive 20 is heated. Further, when the adhesive 20 is heated, the spot adjusting lens 8 and the holder 10 are heated. When a voltage is applied to the temperature adjusting unit 15 in step s4, the process proceeds to step s5.

  In step s5, the control means 14 controls the operation of the temperature detection means 13 so that the temperature detection means 13 detects the temperature of the adhesive 20. In step s5, a command is given to the temperature detection means 13, and the temperature of the adhesive 20 is detected to detect the temperature of at least one of the spot adjustment lens 8 and the holder 10. The detected temperature is input to the control means 14. When the temperature of at least one of the spot adjustment lens 8 and the holder 10 is obtained, the process proceeds to step s6.

  In step s6, the control means 14 determines whether or not the detected temperature is lower than the reference temperature. As the reference temperature used in the determination in step s6, the same temperature as the reference temperature in step s2 is used. If it is determined in step s6 that the detected temperature is not equal to or higher than the reference temperature, the process returns to step s5. Thereby, the spot adjustment lens 8 and the holder 10 are further heated. If it is determined in step s6 that the detected temperature is equal to or higher than the reference temperature, the temperature of the optical component and the holder 10 is equal to the reference temperature or a temperature included in the reference temperature range, and the process proceeds to step s7.

  In step s <b> 7, the control unit 14 controls the operation of the voltage application unit 16 and stops the application of the voltage to the temperature adjustment unit 15. Thereby, the heat generation of the temperature adjusting unit 15 is stopped, and the heating of the adhesive 20 is stopped. Further, when the heating of the adhesive 20 is stopped, the heating of the spot adjusting lens 8 and the holder 10 is stopped. When the application of the voltage to the temperature adjustment unit 15 is stopped in step s7, the process proceeds to step s8 to end the control operation. Such a series of operations from step s0 to s8 is performed, for example, every predetermined time while the optical pickup device 1 is powered on.

  According to the optical pickup device 1 of the present embodiment, the temperature of the spot adjustment lens 8 and the holder 10 is adjusted without forming the spot adjustment lens 8 and the holder 10 with the same material. Even if there is a difference in linear expansion coefficient between the holder 10 and the holder 10, it is possible to prevent the positional adjustment and posture deviation of the spot adjustment lens 8. Further, since the spot adjustment lens 8 and the holder 10 can be formed separately, the dimensional accuracy of the spot adjustment lens 8 can be improved as compared with the case where the spot adjustment lens 8 and the holder 10 are formed integrally. .

  Further, according to the optical pickup device 1 of the present embodiment, the occurrence of positional deviation and posture deviation of the spot adjustment lens 8 is prevented, and the dimensional accuracy of the spot adjustment lens 8 is excellent, so that it is recorded on the optical recording medium 11. The information can be read and recorded with good accuracy.

  The configuration of the optical pickup device 1 is not limited to the above configuration, and various changes can be made. For example, the optical component whose temperature is adjusted by the temperature adjusting unit 12 is not limited to the spot adjusting lens 8, but other optical components such as the grating 3, the beam splitter 4, the collimating lens 5, or the rising mirror 6. It may be. Further, the number of optical components whose temperature is adjusted by the temperature adjusting means 12 is not limited to one, but may be plural.

  In the present embodiment, the semiconductor laser element 2, the grating 3, and each optical component are accommodated in one holder 10, and the holder 10 forms a housing. It is not limited to the structure accommodated in. For example, the semiconductor laser element 2, the grating 3, and each optical component may be accommodated in a plurality of holders, and a plurality of holders may be accommodated, and a housing for integrally forming the plurality of holders may be provided. .

  In the present embodiment, the voltage applied to the temperature adjustment unit 15 is determined by the table data stored in the memory 18 of the control unit 14. However, the present invention is not limited to this. For example, the detected temperature is lower than the reference temperature. In such a case, it may be set to always apply a voltage having a constant voltage value.

  The temperature adjusting means 12 is not limited to means for heating the optical component using a heating resistor, and means for cooling the optical component can also be used. Examples of means for cooling the optical component include a Peltier element.

  The means for heating the optical component using the heating resistor as in this embodiment can be used, for example, when the environmental temperature is lower than a preset reference temperature. The means for cooling the optical component using the Peltier element increases the temperature of the holder 10 and the optical component when, for example, the environmental temperature is higher than a preset reference temperature and when the light from the semiconductor laser element 2 is emitted. It can be used when the temperature of the optical component is higher than a preset reference temperature.

  Further, in the present embodiment, the reference temperature is set to the environmental temperature when the optical component is positioned and attached to the holder. However, the reference temperature is not limited to this, and is set to room temperature (25 ° C.), for example. The temperature may be set to a temperature other than the environmental temperature at the time of position adjustment.

  FIG. 6 is a sectional view of an optical pickup device 21 according to the second embodiment of the present invention. FIG. 6 is a cross-sectional view of the optical pickup device 21 around the spot adjustment lens 8 which is a temperature adjustment object. The optical pickup device 21 has the same configuration as that of the optical pickup device 1 according to the first embodiment described above except that the Peltier element 22 is used as the temperature adjusting unit 22 and the position where the temperature adjusting unit 22 is provided is different. It is. In FIG. 6, the same reference numerals are given to portions having the same configuration as that of the optical pickup device 1 of FIG. 1. Also, the description of the parts with the same reference numerals is omitted. Also, a configuration diagram of the entire optical pickup device 21 is omitted.

  In the present embodiment, the Peltier element 22 is used as the temperature adjusting means 22. In FIG. 6, the Peltier element 22 which is the temperature adjusting means 12 is largely described. The Peltier element 22 is formed by directly connecting an n-type semiconductor 23 and a p-type semiconductor 24 based on a thermoelectric material such as bismuth-tellurium (Bi-Te) with an electrode 25 made of copper or aluminum. The holding members 26 and 27 are used. In the Peltier element 22, the positive electrode (+ pole) of the power source is connected to the n-type semiconductors connected in series, and the negative electrode (− pole) of the power source is connected to the p-type semiconductor.

  When a current is passed through the Peltier element 22, heat moves in the direction opposite to the direction of current flow in the n-type semiconductor 23, and heat moves in the direction of current flow in the p-type semiconductor 24. As a result, heat is transferred from the first holding member 26 to the second holding member 27. Utilizing this, when the first holding member 26 and the temperature adjustment object are thermally connected, the heat of the temperature adjustment object moves to the first holding member 26, so that the temperature adjustment object is cooled. be able to. Hereinafter, the first holding member 26 may be referred to as the heat absorption side holding member 26. Further, the second holding member 27 may be referred to as the heat generation side holding member 27.

  In the present embodiment, the temperature adjusting means 22 adjusts the temperature by cooling the spot adjusting lens 8 and the holder 10. Therefore, the heat absorbing side holding member 26 of the Peltier element 22 which is a portion for cooling the spot adjusting lens 8 and the holder 10 of the temperature adjusting unit 22 is a temperature adjusting unit of the temperature adjusting unit 22.

  In the present embodiment, the heat absorption side holding member 26, which is a temperature adjustment unit of the temperature adjustment means 22, is provided so that the outer surface 10 a of the holder 10 and the heat absorption side holding member 26 are in contact with each other. Further, the heat absorption side holding member 26 is not embedded in the adhesive 20 that bonds the spot adjustment lens 8 to the holder 10. The heat generation side holding member 27 is provided with a heat sink that makes it easy to release the heat of the heat generation side holding member 27.

  According to the optical pickup device 21 of the present embodiment, when the detected temperature detected by the temperature detecting means 13 exceeds the reference temperature, a voltage is applied by the voltage applying unit 16 and the temperature of the heat absorption side holding member 26 is lowered. Let Since the heat absorption side holding member 26 is in contact with the outer surface 10a of the holder 10, the holder 10 is cooled by the temperature of the heat absorption side holding member 26 decreasing. When the holder 10 is cooled, the adhesive 20 and the spot adjustment lens 8 are cooled. When the temperature adjustment is performed by cooling the spot adjustment lens 8 and the holder 10 in this manner, the temperature of the holder 10 and the spot adjustment lens 8 whose temperature is increased by the heat generated by the light emission from the semiconductor laser element 2 is lowered. It is possible to prevent the position adjustment and the position deviation of the spot adjustment lens 8 from occurring.

  In the present embodiment, the Peltier element 22 is used as the temperature adjusting unit 22, but a configuration using a heating unit such as a heating resistor may be used.

  Further, in the present embodiment, the temperature detecting means 13 is embedded in the adhesive 20, but the temperature detecting means 13 is also brought into contact with the outer surface 10 a of the holder 10 without being embedded in the adhesive 20. The structure etc. which are provided may be sufficient. Further, the temperature detected by the temperature detection means 13 may be an environmental temperature or the like instead of the temperature of at least one of the spot adjustment lens 8 and the holder 10.

  In the present embodiment, the heat absorption side holding member 26 of the Peltier element 22 is in contact with the holder 10. However, the present invention is not limited to this, for example, a housing (not shown) provided outside the holder 10. It may be provided so as to be in contact with the heat sink attached to the.

  FIG. 7 is a cross-sectional view of an optical pickup device 31 according to the third embodiment of the present invention. FIG. 7 is a cross-sectional view of the optical pickup device 31 around the spot adjustment lens 8 which is a temperature adjustment object. In the optical pickup device 31, the spot adjusting lens 8 is accommodated in the recess 19 of the holder 10 and the spot adjusting lens 8 is accommodated in the recess 19, so that a translucent resin material is formed in the remaining area of the recess 19. Is the same as that of the optical pickup device 1 of the first embodiment described above except that it is held by being filled. In FIG. 7, parts having the same configuration as that of the optical pickup device 1 of FIG. Also, the description of the parts with the same reference numerals is omitted. Also, a configuration diagram of the entire optical pickup device 31 is omitted.

  In the present embodiment, the resin layer 32 is formed by filling the remaining region of the recess 19 with a translucent resin material in a state where the spot adjustment lens 8 is accommodated in the recess 19.

  The temperature adjustment unit 15 of the temperature adjustment unit 12 and the temperature sensing unit 17 of the temperature detection unit 13 are embedded in the resin layer 32 as follows. In a state where the spot adjusting lens 8 is accommodated in the recess 19 and positioned and positioned, the height in the Y direction from the bottom 33 of the recess 19 to the translucent resin material is the depth dimension of the recess 19. Fill with a translucent resin material until half of it. The layer of translucent resin material formed here is referred to as a first resin layer 34.

  After the formation of the first resin layer 34, the temperature adjustment unit 15 of the temperature adjustment unit 12 and the temperature sensing unit 17 of the temperature detection unit 13 are disposed on the surface of the first resin layer 34. In the present embodiment, the temperature adjustment unit 12 includes two temperature adjustment units 15, and each temperature adjustment unit 15 is arranged on one side and the other side in the X direction with respect to the spot adjustment lens 8. Further, the temperature sensing unit 17 of the temperature detection unit 13 is disposed on one side in the X direction with respect to the spot adjustment lens 8.

  After the temperature adjusting unit 15 of the temperature adjusting unit 12 and the temperature sensing unit 17 of the temperature detecting unit 13 are disposed, the height in the Y direction from the bottom 33 of the recess 19 to the translucent resin material is the depth of the recess 19. Fill with translucent resin material until equal to dimensions. The layer of translucent resin material formed here is referred to as a second resin layer 35. As described above, the temperature adjustment unit 15 and the temperature sensing unit 17 are embedded in the resin layer 32 formed by the first resin layer 34 and the second resin layer 35.

  According to the optical pickup device 31 of the present embodiment, the spot adjustment lens 8 is housed in the recess 19 formed in the holder 10 and is made of a translucent resin material that fills the remaining area of the recess 19. It is fixed to the formed resin layer 32 and held by the holder 10. When the spot adjustment lens 8 is accommodated in a recess 19 formed in the holder 10 and the recess 19 is filled with a resin material having translucency, the environmental temperature in the holder 10 affects the temperature of the spot adjustment lens 8. Can be prevented. As a result, when the temperature of the spot adjustment lens 8 is adjusted to the reference temperature, the occurrence of a problem that the actual temperature of the spot adjustment lens 8 is different from the reference temperature due to the influence of the environmental temperature in the holder 10 is prevented. can do.

  In the present embodiment, the temperature adjustment unit 15 of the temperature adjustment unit 12 can adjust the temperature of the spot adjustment lens 8 and the holder 10 by adjusting the temperature of the resin layer 32. In the present embodiment, the temperature sensing unit 17 of the temperature detecting means 13 can detect the temperature of the resin layer 32, thereby detecting the temperature of at least one of the spot adjustment lens 8 and the holder 10. Furthermore, the optical pickup device 31 can be easily assembled by embedding the temperature adjustment unit 15 of the temperature adjustment unit 12 and the temperature sensing unit 17 of the temperature detection unit 13 in a translucent resin material.

  FIG. 8 is a sectional view of an optical pickup device 41 according to the fourth embodiment of the present invention. FIG. 8 is a cross-sectional view of the optical pickup device 41 around the spot adjustment lens 8 which is a temperature adjustment object. The optical pickup device 41 has the same configuration as that of the optical pickup device 31 of the third embodiment described above, except that a means including a heating resistor and a Peltier element is used as the temperature adjusting means. In FIG. 8, parts having the same configuration as the optical pickup device 31 of FIG. 7 are denoted by the same reference numerals. Also, the description of the parts with the same reference numerals is omitted. Also, a configuration diagram of the entire optical pickup device 41 is omitted.

  In the present embodiment, the temperature adjusting means 42 includes a heating resistor 43 that is a heating means and a Peltier element that is a cooling means. The heating resistor 43 has the same configuration as the temperature adjustment unit 15 of the first embodiment described above. Further, the temperature adjusting portion 44 of the Peltier element has the same configuration as the heat absorption side holding member 26 of the Peltier element 22 described above except that the shape thereof is different. A heating resistor 43 that is a heating unit of the temperature adjustment unit 42 and a temperature adjustment unit 44 of a Peltier element that is a cooling unit are embedded in the resin layer 45.

  The heating resistor 43 serving as the heating means, the temperature adjusting portion 44 of the Peltier element serving as the cooling means, and the temperature sensing portion 17 of the temperature detecting means 13 are embedded in the resin layer 45 as follows. In a state where the spot adjusting lens 8 is accommodated in the recess 19 and positioned and positioned, the height in the Y direction from the bottom 33 of the recess 19 to the translucent resin material is the depth dimension of the recess 19. The light-transmitting resin material is filled until it becomes one third of the above. The layer of translucent resin material formed here is referred to as a first resin layer 46.

  After the formation of the first resin layer 46, the heating resistor 43, which is a heating means, and the temperature sensing part 17 of the temperature detection means 13 are arranged on the surface of the first resin layer 46. In the present embodiment, the heating means has two heating resistors 43, and each heating resistor 43 is arranged on one side and the other side in the X direction with respect to the spot adjustment lens 8. Further, the temperature sensing unit 17 of the temperature detection unit 13 is disposed on one side in the X direction with respect to the spot adjustment lens 8.

  After the placement of the heating resistor 43 and the temperature sensing part 17 of the temperature detecting means 13, the height in the Y direction from the bottom 33 of the recess 19 to the translucent resin material is 3 minutes of the depth dimension of the recess 19. Fill with translucent resin material until 2. The layer of translucent resin material formed here is referred to as a second resin layer 47.

  After the formation of the second resin layer 47, the temperature adjusting portion 44 of the Peltier element that is a cooling means is disposed on the surface of the second resin layer 47. The shape of the temperature adjusting unit 44 of the Peltier element is formed so that at least the heat generation side holding member is disposed outside the holder 10. In the present embodiment, the Peltier element has two temperature adjustment units 44, and each temperature adjustment unit 44 is disposed on one side and the other side in the X direction with respect to the spot adjustment lens 8.

  After the arrangement of the temperature adjusting portion 44 of the Peltier element, the translucent resin material is used until the height in the Y direction from the bottom 33 of the recess 19 to the translucent resin material becomes equal to the depth dimension of the recess 19. Fill. The layer of translucent resin material formed here is referred to as a third resin layer 48. As described above, with respect to the resin layer 45 formed by the first resin layer 46, the second resin layer 47, and the third resin layer 48, the heating resistor 43 as a heating means and the Peltier element as a cooling means. The temperature adjusting unit 44 and the temperature sensing unit 17 of the temperature detecting means 13 are embedded.

  FIG. 9 is a flowchart showing the control procedure of the control means when adjusting the temperatures of the spot adjustment lens 8 and the holder 10 in the optical pickup device 41. In step t0, if the optical pickup device 1 is powered on, the process proceeds to step t1 where temperature adjustment of the spot adjustment lens 8 and the holder 10 is started.

  In step t <b> 1, the control unit controls the operation of the temperature detection unit 13 such that the temperature detection unit 13 detects the temperature of the resin layer 45. In step t1, an instruction is given to the temperature detection means 13, and the temperature of the resin layer 45 is detected to detect the temperature of at least one of the spot adjustment lens 8 and the holder 10. The detected temperature is input to the control means. When the temperature of at least one of the spot adjustment lens 8 and the holder 10 is obtained, the process proceeds to step t2.

  In step t2, the control means determines whether or not the detected temperature is lower than the reference temperature. If it is determined in step t2 that the detected temperature is lower than the reference temperature, the process proceeds to step t3. If it is determined in step s2 that the detected temperature is not lower than the reference temperature, the process proceeds to step t8.

  When it is determined in step t2 that the detected temperature is lower than the reference temperature and the process proceeds to step t3, the control unit 14 controls the operation of the voltage application unit 16 to apply a voltage to the heating resistor 43 in step t3. As a result, the heating resistor 43 generates heat and the resin layer 45 is heated. Moreover, the spot adjustment lens 8 and the holder 10 are heated by heating the resin layer 45. In step t3, when a voltage is applied to the heating resistor 43, the process proceeds to step t4.

  In step t <b> 4, the control unit 14 controls the operation of the temperature detection unit 13 so that the temperature detection unit 13 detects the temperature of the resin layer 45. In step t4, a command is given to the temperature detection means 13, and the temperature of the resin layer 45 is detected to detect the temperature of at least one of the spot adjustment lens 8 and the holder 10. The detected temperature is input to the control means 14. When the temperature of at least one of the spot adjustment lens 8 and the holder 10 is obtained, the process proceeds to step t5.

  In step t5, the control means determines whether or not the detected temperature is equal to or higher than the reference temperature. If it is determined in step t5 that the detected temperature is not equal to or higher than the reference temperature, the process returns to step t4. If it is determined in step t5 that the detected temperature is equal to or higher than the reference temperature, the process proceeds to step t6.

  In step t <b> 6, the control unit controls the operation of the voltage application unit 16 and stops the application of the voltage to the heating resistor 43. As a result, the heat generation of the heating resistor 43 is stopped, and the heating of the resin layer 45 is stopped. Further, when the heating of the resin layer 45 is stopped, the heating of the spot adjustment lens 8 and the holder 10 is stopped. When the application of the voltage to the heating resistor 43 is stopped in step t6, the process proceeds to step t7 to end the control operation.

  When it is determined in step s2 that the detected temperature is not lower than the reference temperature and the process proceeds to step t8, in step t8, the control means determines whether or not the detected temperature exceeds the reference temperature. If it is determined in step t8 that the detected temperature does not exceed the reference temperature, the detected temperature is equal to the reference temperature or a temperature included in the reference temperature range, and the temperatures of the spot adjustment lens 8 and the holder 10 are set. Since there is no need to adjust, the process proceeds to step t7 and the control operation is terminated. If it is determined in step t8 that the detected temperature exceeds the reference temperature, the process proceeds to step t9.

  In step t9, the control means controls the operation of the voltage application unit 16 to apply a voltage to the Peltier element. As a result, the temperature adjusting unit 44 can cool the resin layer 45, and the spot adjusting lens 8 and the holder 10 are cooled by cooling the resin layer 45. When a voltage is applied to the Peltier element at step t3, the process proceeds to step t10.

  In step t <b> 10, the control unit controls the operation of the temperature detection unit 13 so that the temperature detection unit 13 detects the temperature of the resin layer 45. In step t10, a command is given to the temperature detection means 13, and the temperature of the resin layer 45 is detected to detect the temperature of at least one of the spot adjustment lens 8 and the holder 10. The detected temperature is input to the control means 14. When the temperature of at least one of the spot adjustment lens 8 and the holder 10 is obtained, the process proceeds to step t11.

  In step t11, the control means determines whether or not the detected temperature is equal to or lower than a reference temperature. If it is determined in step t11 that the detected temperature is not lower than the reference temperature, the process returns to step t10. If it is determined in step t11 that the detected temperature is equal to or lower than the reference temperature. Move to step t12.

  In step t12, the control means controls the operation of the voltage application unit 16 and stops the application of the voltage to the Peltier element. Thereby, the cooling of the resin layer 45 by the Peltier element is stopped, and the cooling of the spot adjustment lens 8 and the holder 10 is stopped. When the application of the voltage to the Peltier element is stopped in step t12, the process proceeds to step t7 to end the control operation. A series of operations as described above are performed, for example, every time a predetermined time elapses while the optical pickup device 41 is powered on.

  According to the optical pickup device 41 of the present embodiment, since the temperature adjusting means 42 includes the heating means and the cooling means, when the temperature of the spot adjusting lens 8 and the holder 10 is higher than the reference temperature, these are provided. When the temperature of the spot adjusting lens 8 and the holder 10 is lower than the reference temperature, these are heated. As a result, the temperature of the spot adjustment lens 8 and the holder 10 can be brought closer to the reference temperature more reliably, and the occurrence of positional deviation and posture deviation of the spot adjustment lens 8 can be prevented more reliably.

1 is a perspective view showing a configuration of an optical device 1 according to a first embodiment of the present invention. 2 is an enlarged perspective view of a main part of the optical device 1. FIG. 2 is a block diagram illustrating an electrical configuration of the optical pickup device 1. FIG. It is sectional drawing seen from the cut surface line IV-IV of the optical pick-up apparatus 1. FIG. 6 is a flowchart showing a control procedure of the control means 14 when adjusting the temperatures of the spot adjustment lens 8 and the holder 10. It is sectional drawing of the optical pick-up apparatus 21 which is the 2nd Embodiment of this invention. It is sectional drawing of the optical pick-up apparatus 31 which is the 3rd Embodiment of this invention. It is sectional drawing of the optical pick-up apparatus 41 which is the 4th Embodiment of this invention. 4 is a flowchart illustrating a control procedure of a control unit when adjusting the temperatures of the spot adjustment lens 8 and the holder 10 in the optical pickup device 41.

Explanation of symbols

1, 21, 31, 41 Optical device (optical pickup device)
DESCRIPTION OF SYMBOLS 2 Semiconductor laser element 3 Grating 4 Beam splitter 5 Collimating lens 6 Standing mirror 7 Condensing lens 8 Spot adjustment lens 9 Light receiving element 10 Holder 11 Optical recording medium 12, 42 Temperature adjustment means 13 Temperature detection means 14 Control means 15, 44 Temperature Adjustment unit 16 Voltage application unit 17 Temperature sensing unit 18 Memory 19 Recess 20 Adhesive 22 Peltier element 32, 45 Resin layer 43 Heating resistor

Claims (11)

Optical components,
A holder for holding optical components;
An optical apparatus comprising temperature adjusting means for adjusting the temperature of the optical component and the holder. The temperature adjustment means
The optical apparatus according to claim 1, wherein at least one of a heating flow rate and an endothermic flow rate can be controlled by electrical control. The temperature adjustment means has a temperature adjustment unit,
The optical device according to claim 1, wherein the temperature adjustment unit is embedded in an adhesive that adheres the optical component to the holder. Temperature detecting means for detecting the temperature of at least one of the optical component and the holder;
The optical apparatus according to claim 1, further comprising a control unit that controls the temperature adjusting unit such that the temperature detected by the temperature detecting unit becomes a reference temperature. The temperature detection means has a temperature sensing part,
The optical device according to claim 4, wherein the temperature sensing unit is embedded in an adhesive that bonds the optical component to the holder. The optical component is bonded to the holder with an adhesive,
6. The optical device according to claim 1, wherein a material having high thermal conductivity is selected as the adhesive. The holder is formed with a recess for accommodating the optical component,
6. The optical component is held by being filled with a translucent resin material in a remaining region of the recess while being accommodated in the recess. The optical device described. The temperature adjustment means has a temperature adjustment unit,
The optical device according to claim 7, wherein the temperature adjustment unit is embedded in a translucent resin material. The temperature detection means has a temperature sensing part,
The optical device according to claim 7 or 8, wherein the temperature sensitive part is embedded in a translucent resin material.   It is an optical pick-up apparatus, The optical apparatus as described in any one of Claims 1-9 characterized by the above-mentioned.   An electronic apparatus comprising the optical device according to claim 1.

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