JP2007310684A - Lead wire connection method of touch panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the lead wire connection method of a touch panel, which is capable of enhancing connection strength of lead wires without performing considerable design changes. <P>SOLUTION: In the lead wire connection method of the tough panel wherein an upper electrode plate and a lower electrode plate have peripheries stuck to each other by an insulating adhesive layer and a connection part for connecting electrode ends which are extended from electrodes of respective resistance films and are collectively disposed, to lead wires is provided in edge parts of these electrode plates, the adhesion layer is provided with air vents communicating with connection holes and a touch panel end face, correspondingly to respective electrode ends in the connection part, and through holes reaching respective connection holes are bored in the lower electrode plate, and an FPC with pins is inserted to the lower electrode plate, and pin shaft parts and the electrode ends are electrically connected by a moisture curable conductive adhesive. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a touch panel lead wire connecting method used as a means for inputting coordinates on a screen in a mobile phone, a personal digital assistance (PDA) as a personal digital assistant, a car navigation system, and the like.

  Conventionally, a touch panel display in which a touch panel is laminated on a liquid crystal display can save space by combining a screen and coordinate input means, and is therefore often used for small devices such as mobile phones and PDAs.

  As the touch panel, a resistive film type that is simple in structure, thin in thickness and excellent in mass productivity is generally used. The configuration is such that the flexible upper electrode plate on the operation side and the lower electrode plate on the fixed side are arranged facing each other with a predetermined gap provided by a spacer, and the X direction and Y direction are arranged on the inner surface of each electrode plate. An electric circuit is wired in the direction.

  When the surface of the upper electrode plate is pressed with a stylus pen or the like, the upper electrode plate and the lower electrode plate come into contact with each other to create a potential gradient between the electrodes. This voltage is taken out and the X-axis position and Y-axis position are calculated by the controller. Thus, the pressed input point is specified.

  FIG. 8 shows a method for assembling the touch panel. A lower electrode plate 51 is disposed to face the upper electrode plate 50. The upper electrode plate 50 is provided with strip-like electrodes 50a and 50b in the X direction, and the lower electrode plate 51 is provided with strip-like electrodes 51a and 51b in the Y direction. Is provided.

  Each electrode 50a, 50b, 51a, 51b is extended to the connection part 52 provided in the edge part of the touch panel, and is gathered in one place, The lead wire 53 which consists of FPC (flexible printed wiring board) is connected to this connection part 52. Conductive wire 53a is connected.

  Specifically, the conductive wire 53a is connected to each electrode by a conductive paste and then fixed in a state of being sandwiched between the upper electrode plate 50 and the lower electrode plate 51 (see, for example, FIG. 8 of Patent Document 1). ). In the figure, reference numerals 50 c and 51 c denote resistance films formed on the inner surfaces of the upper electrode plate 50 and the lower electrode plate 51.

  In this type of lead wire connection method, the lead wire is drawn directly from the side surface of the touch panel, and the upper electrode plate 50 is formed of a resin sheet, and each electrode is made of silver paste, so the electrode itself However, since the lead wire 53a of the lead wire 53 is connected to the electrode with a conductive paste having a weak fixing force, there is a possibility that the connection portion 52 may break if a little strong force acts on the lead wire. There was a need for careful handling.

  On the other hand, the following method has also been proposed which is easy to handle without fear of damage at the lead wire connecting portion.

  For example, in the touch panel shown in FIG. 9, four through holes 51 d to 51 g for forming a connection portion at the edge of the lower electrode plate 51 are formed. After the conductive paste 54 is poured into each through-hole, a concave (female-type) connection fitting 55 is embedded and electrically connected to the electrodes 50a, 50b, 51a, 51b, respectively (for example, , See FIG. 1 of Patent Document 1).

  In such a touch panel, signals from the electrodes 50a, 50b, 51a, 51b can be extracted outside without directly pulling out the lead wires from the side surface of the touch panel and maintaining an excellent electrical connection.

Japanese Patent Laid-Open No. 9-50731 (see FIGS. 1 and 8)

  However, in such a signal extraction method using the connection fitting 55, when the touch panel is attached to a device such as an interface board or a liquid crystal display, the connection fitting 55 is inserted into the device at a position corresponding to the through holes 51d to 51g. There is a disadvantage in that four connection pins must be erected and the lead wire connection structure must be changed for both the touch panel and the device.

  SUMMARY OF THE INVENTION The present invention provides a touch panel lead wire connection method that can increase the connection strength of lead wires without significant design changes in consideration of the above-described problems in the conventional touch panel lead wire connection method. It is.

  In the present invention, an upper electrode plate and a lower electrode plate which are opposed to each other with a predetermined gap and have a resistance film on the inner surface are bonded together with an insulating adhesive layer. In the lead wire connecting method for a touch panel, in which a connection portion for connecting the electrode ends extending from the electrodes of the resistance film to the lead wires is provided, corresponding to each electrode end in the connection portion. The adhesive layer is provided with an air vent that communicates with the connection hole and the end face of the touch panel, and a through hole that reaches each connection hole is formed in the lower electrode plate so that the pin shaft portion has a larger diameter than the outer diameter of the pin shaft portion. Using a formed metal pin having a disk-shaped head, the pin shaft portion is inserted into each metal pin fixing hole formed corresponding to the through hole in the lead wire portion at the connection side end of the lead wire. To do The pin shaft portion is erected at the connection-side end portion of the lead wire, the pin shaft portions are inserted into the through holes, and the pin shaft portion and the electrode ends inserted into the lower electrode plate Are electrically connected via a moisture-curing conductive adhesive.

  In the above configuration, the moisture curable conductive adhesive is composed mainly of a silicon resin.

  Moreover, in the said structure, it was comprised so that a non-solvent thing might be used as said moisture hardening type and conductive adhesive of a silicon resin main component.

  In each of the above configurations, the air vent is bent in a crank shape.

  Moreover, in each said structure, it comprised so that the said contact bonding layer might be a frame-shaped double-sided tape.

  Further, in the above configuration, the upper electrode plate and the lower electrode plate further include a wiring overcoat layer, and the wiring overcoat layer is also connected to the connection hole and the touch panel end surface corresponding to each electrode end in the connection portion. It comprised so that each might be equipped.

  In each of the above configurations, when inserting the pin shaft portion into the through hole, set the pin shaft portion of each metal pin in a state corresponding to the through hole, and apply the ultrasonic vibration and pressure to the pin. By inserting the shaft portion into the through hole, the wall surface of the through hole was melted, and the inserted pin shaft portion was fixed to the lower electrode plate by re-solidification of the wall surface.

  Further, in each of the above configurations, a concave groove is formed in the pin shaft portion of the metal pin, and when the pin shaft portion is inserted into the through hole while applying ultrasonic vibration and pressure, a melted portion of the wall surface of the through hole Is configured to be guided in the groove.

  According to the present invention, the pin shaft portion is provided through the lead wire, and the pin shaft portion protruding from the lead wire is inserted into the through hole of the lower electrode plate. A reliable connection can be achieved via the shaft. In addition, no major design changes are required in devices such as interface boards and liquid crystal display devices.

  In addition, since the metal pin has a pin head formed with a large diameter, it can be connected to a conductive portion of the lead wire in a wide range. In addition, since the pin head is locked at the edge of the metal pin fixing hole in the lead wire, the insertion depth of the pin shaft portion inserted into the through hole of the lower electrode plate can be restricted.

  In addition, the pin shaft part inserted into the through hole of the lower electrode plate and the electrode end are connected by spot coating with a conductive adhesive in a connection hole provided in an adhesive layer for bonding the upper electrode plate and the lower electrode plate around. However, since the conductive adhesive is moisture-curing and an air vent is provided from each connection hole to the end face of the touch panel, no heat treatment is required and the production cost is low.

  Hereinafter, the present invention will be described in detail based on the embodiments shown in the drawings.

  FIG. 1 is an exploded view showing a configuration of a touch panel to which the present invention is applied.

  In the figure, a touch panel 1 includes a flexible transparent insulating film, for example, an upper electrode plate 2 made of a polyethylene terephthalate film, an inflexible glass plate, an engineering plastic such as polycarbonate, polyamide, polyether ketone, It has a lower electrode plate 3 made of a plastic plate such as acrylic, polyethylene terephthalate, polybutylene terephthalate or the like, or a laminated plate thereof, and has an insulating property (not shown) in a state where both electrode plates face each other with a predetermined gap. The periphery is bonded by an adhesive layer.

  On the inner surfaces of the electrode plates 2 and 3, ITO (indium oxide / tin) or the like is formed as the resistance films 4 and 5 by sputtering or vacuum deposition.

The upper electrode plate 2 has a strip-shaped electrode 6a made of silver paste connected to the resistance films 4 and 5,
6b is formed in the X direction, and strip electrodes 7a and 7b are formed on the lower electrode plate 3 in the Y direction.

  Each electrode 6a, 6b, 7a, 7b is extended to the connection part 8 provided in the edge of the upper electrode plate 2, and is gathered in one place.

  Corresponding to the electrode ends 6c, 7c, 6d, and 7d in the connection portion 8, through holes 9a to 9d are formed in the lower electrode plate 3 in parallel with the Z direction.

  Further, four metal pins 11 to 14 are erected on the connection side end portion of an FPC (flexible printed wiring board) 10 as a lead wire corresponding to these through holes 9a to 9d. Are electrically connected to the electrode ends 6c, 7c, 6d, and 7d through a conductive adhesive (not shown).

  FIG. 2 is an enlarged view of the structure of the connection side end portion of the FPC 10, and shows a cross section viewed from the direction of arrow A in FIG.

  In the figure, at the connection side end 10a of the FPC, four recesses 10d in which the circuit 10c is exposed by removing a part of the coverlay film 10b are arranged in the thickness direction of the paper surface. A metal pin fixing hole 10e is formed in the center.

  A conductive pin, for example, a metal pin 14 made of brass, iron, copper, or the like is inserted into the metal pin fixing hole 10e, and the disk-shaped head portion 14a of the metal pin 14 is inserted into the bottom surface (circuit) of the recess 10d. 10c), whereby the insertion depth of the neck portion (pin shaft portion) 14b of the metal pin 14 is regulated. In addition, 10f has shown the base material in the figure.

  When the metal pin 14 is implanted in the FPC 10, a method of fixing the metal pin 14 using solder on the circuit 10 c of the FPC 10 is usually considered. However, in this type of fixing method, when a strong tensile force acts on the FPC 10, there is a possibility that the metal pin 14 and the circuit 10c are separated from the boundary surface.

  On the other hand, in the fixing method of the metal pin 14 shown in the present embodiment, the metal pin 14 is passed through the metal pin fixing hole 10e provided in the FPC 10, and the connection side end portion 10a of the FPC 10 is formed by the head portion 14a of the metal pin 14. Since the FPC 10 is fixed to the lower electrode plate 3 in a state where is pressed, the connection strength of the lead wire can be increased compared to the connection method using solder.

  In addition, although the connection method of FPC10 was represented on behalf of the metal pin 14 in the said embodiment, it connects by the same method also about the connection method of FPC10 by the metal pins 11-13 other than that.

  Incidentally, the lead wire connection strength when the four metal pins 11 to 14 are fixed to the FPC 10 with solder and connected to the lower electrode plate 3 is about 10 N, whereas the lead wire connection method of the present embodiment is used. When the FPC 10 is connected to the lower electrode plate 3, the lead wire connection strength is about 15N, and it was confirmed that the lead wire connection strength was improved. In addition, the connection strength test method was performed by the test method equivalent to the "peeling adhesion strength test method" prescribed | regulated to JISK6854-1.

  Further, the neck portion 14b of the metal pin 14 used in the present embodiment is formed with a concave groove 14c in the circumferential direction, and the concave groove 14c is formed in multiple stages in the axial direction of the neck portion 14b.

  In addition, as shown in FIG. 2, the adhesive layer (16 in FIG. 2) for bonding the upper electrode plate 2 and the lower electrode plate 3 around each other is composed of the conductive adhesive (in FIG. 2, It is necessary to form each connection hole for injecting 15) corresponding to each said electrode end 6c, 7c, 6d, 7d in the said connection part 8. FIG. That is, the through holes 9a to 9d drilled in the lower electrode plate 3 reach these connection holes, and the conductive adhesive 15 is injected from the through holes 9a to 9d.

  As the adhesive layer 16, for example, a frame-like double-sided tape in which at least the portion 18 for inputting through the screen of an LCD or the like and the connection holes 16a, 16a, 16a, 16a are punched (see FIG. 4) is used. it can. In place of the double-sided tape, an insulating adhesive such as water-based or acrylic printing paste may be used.

  The conductive adhesive 15 contains a conductive filler in the adhesive, and as the conductive filler, in addition to conductive metal powders such as silver, gold, copper, nickel, platinum, and palladium, Examples of the core material include inorganic insulators such as alumina and glass, organic polymers such as polyethylene, polystyrene, and divinylbenzene, and the core material surface covered with a conductive layer such as gold and nickel, carbon, and graphite. . In addition, the conductive filler may have a flake shape, a spherical shape, a short fiber shape, or the like. Examples of the method for applying the conductive adhesive include a dispenser method.

  In the present invention, the conductive adhesive 15 is a moisture curing type. The moisture curing type is a type that cures by chemically reacting with moisture in the air at room temperature, and this type of conductive adhesive 15 does not require heat treatment after the metal pins 11 to 14 are connected. In the case of the heat-curing type, there are problems such as poor appearance due to thermal deformation of the upper electrode plate 2 and circuit deterioration, increased man-hours, production costs due to heat treatment rack preparation and the like. These problems do not occur by using a curable type.

  In addition, the moisture-curing conductive adhesive 15 is cured by a chemical reaction with moisture in the air with one liquid, and therefore it is not necessary to apply the mixture after bringing the main agent and the curing agent into contact with each other. In the case of the two-component type, there is a mixing operation, and since the curing time is short, it is often impossible to sufficiently clean the syringe and the nozzle after the operation. When completely cured, cleaning is incomplete. In general, the usable time (pot life) after mixing two liquids is about 4 to 8 hours, but since the change in viscosity with time is large, it is difficult to apply quantitatively by the dispensing method. However, these problems do not occur by making the conductive adhesive 15 one-component.

  As the moisture curable conductive adhesive 15, for example, an adhesive mainly composed of silicone (one-component) or cyanoacrylate generally called an instantaneous adhesive can be used. In particular, an adhesive mainly composed of silicone (one-component) does not have a too short time for curing, and until the pin shaft portions 11b, 12b, 13b, and 14b are inserted into the through holes 9a to 9d. It is more preferable in that there is no risk of being hardened.

  Further, when the moisture-curing conductive adhesive 15 is a solvent-free adhesive, the electrode ends 6c, 7c, 6d, 7d and the pin shaft portions 11b, 12b, 13b are caused by outgas (volatile solvent). , 14b, which is more preferable without adversely affecting the circuit such as floating. In addition, the environmental load can be reduced by using a solventless adhesive.

  In the present invention, each of the connection holes 16a, 16a, 16a, 16a of the adhesive layer 16 communicates with the end surface of the touch panel 1 through the air vent 16b (see FIGS. 2 and 4). As described above, since the conductive adhesive 15 of the present invention is a moisture curing type, the conductive adhesive 15 is injected from the through holes 9a to 9d, and the pin shaft portions 11b, 12b, 13b, and 14b are connected to the above. It is necessary to be able to take in moisture in the air even after being inserted into the through holes 9a to 9d. By providing the air vents 16b, 16b, 16b, and 16b from the connection holes 16a, 16a, 16a, and 16a to the end face of the touch panel 1 in the adhesive layer 16, the through-holes 9a to 9d are sealed in the air. The moisture (humidity 17) is taken in, and the conductive adhesive 15 can be sufficiently cured by moisture, so that the connection is ensured.

  The air vent 16b is preferably bent in a crank shape as shown in FIG. By bending the air vent 16b in a crank shape, the conductive adhesive 15 is touched through the air vent 16b when the pin shaft portions 11b, 12b, 13b, and 14b are inserted into the through holes 9a to 9d. It can prevent jumping out of 1. Note that the crank shape is not limited to a straight line, and may be partially or entirely curved. For example, it may be S-shaped.

  The upper electrode plate 2 and the lower electrode plate 3 are further provided with a wiring overcoat layer, and the wiring overcoat layer also corresponds to the electrode ends 6c, 7c, 6d, and 7d in the connection portion 8. And an air vent that communicates with the end face of the touch panel 1. The wiring overcoat layer has been conventionally used for the purpose of preventing the wiring of the electrodes 6a, 6b, 7a, 7b, etc. and insulating the wirings arranged side by side with a slight space therebetween. Resin, film etc. are used. Examples of the method for forming the wiring overcoat layer include screen printing, offset printing, gravure printing, flexographic printing, and other printing methods, brush coating methods, and film lamination.

  FIG. 3 illustrates a method of fixing the metal pin 14 having the above configuration to the lower electrode plate 3 by an ultrasonic insert.

  However, the arrangement of the touch panel 1 and the FPC 10 shown in FIG. 1 is reversed upside down from that shown in FIG. 1 for convenience of explanation in accordance with the manufacturing process.

  In FIG. 3, the diameters of the through holes 9 a to 9 d formed in the lower electrode plate 3 are set in the range of the same diameter to about 30% smaller than the outer diameter of the metal pins 11 to 14. .

  In addition, the conductive adhesive 15 for injecting electrical connection to the electrode ends is injected into the portions where the electrode ends 6c, 7c, 6d, 7d are disposed in the through holes 9a to 9d. deep.

  Next, the metal pins 11 to 14 are lowered in the direction of arrow B, and are set in contact with the opening edges of the through holes 9a to 9d of the lower electrode plate 3, respectively.

  In addition, since each said metal pin 11-14 is fixed to the said lower electrode plate 3 all at once by the ultrasonic insert apparatus 17, the fixing method is demonstrated on behalf of the metal pin 11 below.

  The horn 17a of the ultrasonic insert device 17 is lowered in the direction of arrow C, and the horn 17a is brought into contact with the outer surface of the head 11a of the metal pin 11.

  Next, when the neck portion 11b of the metal pin 11 is press-fitted into the through hole 9a while applying ultrasonic vibration and pressure to the head portion 11a through the horn 17a, the boundary surface between the neck portion 11b and the through hole 9a. Local frictional heat is generated, and the metal pin 11 is inserted while melting the resin (or glass) forming the wall surface of the through hole 9a.

  At this time, the molten resin flows into the plurality of recessed grooves 11c formed in the neck portion 11b of the metal pin 11.

  FIG. 6 is an enlarged view of the fixed state of the metal pin 11, and as shown in the figure, the molten resin flows into the concave groove 11c in the range D surrounded by the broken line, so that the wall surface of the through hole 9a is obtained. A protrusion 9 a ′ having a U-shaped cross section is formed in an annular shape along the concave groove 11 c of the metal pin 11.

  Thereafter, when the resin on the wall surface of the through hole is re-solidified by retracting the ultrasonic insert device 17, the resin flowing into the concave groove 11 c, that is, the protruding portion 9 a ′ has a throwing effect on the metal pin 11, and the metal It functions to increase the tensile strength of the pin 11.

  Further, the metal pin 11 is inserted into the metal pin fixing hole 10e from the outer surface side (upper side in the drawing) at the connection side end 10a of the FPC 10, and the head 11a of the metal pin 11 is inserted into the recess 10d of the FPC 10, that is, after the insertion is completed. In contact with the circuit 10c. As a result, the circuit 10c is sandwiched between the head portion 11a of the metal pin 11 and the base material 10f, and the circuit is formed in a wide area (ring-shaped range) of the head portion 11a of the metal pin 11. 10c can be connected.

  In this way, the FPC 10 is in close contact with the lower electrode plate 3, and the depth at which the neck portion 11b of the metal pin enters the through hole 9a can be defined. Thereby, the tip of the neck 11b of the metal pin is prevented from colliding with the electrode 6c, and a gap suitable for connecting the metal pin 11 and the electrode 6c by the conductive adhesive 15 can be secured. It has become.

  Specifically, the metal pin 11 is 0.1 to 0.2 mm shorter than the thickness of the lower electrode plate 3. Preferably, the length is 0.125 mm shorter than the thickness of the lower electrode plate 3.

  The other metal pins 12 to 14 are also fixed in the same manner as described above, and the FPC 10 in which the four metal pins 11 to 14 are erected on the connection side end portion 10a is securely fixed to the lower electrode plate 3 and A stable electrical connection can be obtained for the electrodes 6c, 6, 7c, 6d, and 7d.

  FIG. 7 shows a connection method between the electrodes 7a and 7b of the lower electrode plate 3 and the FPC 10, and the metal pin 12 is shown as a representative connection method.

  Since the end portion of the electrode 7a of the lower electrode plate 3 is terminated before the through hole 9b, a connecting electrode 7c (see FIG. 5) formed on the inner surface of the upper electrode plate 2 through a conductive adhesive 15 '. 1), the conductive path E is generally in the order of electrode 7a → conductive adhesive 15 ′ → connecting electrode 7c → conductive adhesive 15 → metal pin 12.

  If the connection electrode 7c is provided and the metal pin 12 is connected to the connection electrode 7c via the conductive adhesive 15, the metal pin 12 is connected to the lower electrode under the same conditions as the other electrodes 6c and 6d. It becomes possible to connect to the plate 3. Further, similarly to the above-described method for connecting the metal pins 11, a certain gap suitable for interposing the conductive adhesive 15 between the connecting electrode 7c and the tip of the metal pin 12 can be secured.

  In the above embodiment, the pin shaft portion of the metal pin is fixed to the lower electrode plate by the ultrasonic insert. However, the present invention is not limited to this, and it can be fixed to the through hole of the lower electrode plate using a conductive adhesive. In that case, each hole diameter of the through holes 9a to 9d formed in the lower electrode plate 3 is set in a range of 50 to 100 μm larger than the outer diameter of the metal pins 11 to 14, and the metal pins are inserted into the through holes 9a to 9d. When 11 to 14 are inserted, the conductive adhesive 15 also flows into the gaps between the through holes 9a to 9d and the neck portions 11b to 14b of the metal pins 11 to 14.

  In the present invention, the surface of the lower electrode plate 3 on the side having the resistance film may be provided with a dummy electrode 19a to 19d around the through holes 9a to 9d to increase the connection area (FIG. 5). reference).

It is a disassembled perspective view which shows the structure of the touchscreen to which this invention is applied. FIG. 2 is an enlarged cross-sectional view of a lead wire connecting portion shown in FIG. 1. It is explanatory drawing which shows the fixing method of the metal pin shown in FIG. It is a principal part enlarged plan view of the contact bonding layer shown in FIG. It is a principal part enlarged plan view which shows the example which provides a dummy electrode around a through-hole. It is a principal part expanded sectional view which shows the fixed state of a metal pin. FIG. 3 is a view corresponding to FIG. It is a perspective view which shows the lead wire connection structure of the conventional touch panel. It is an expanded sectional view which shows another lead wire connection structure of the conventional touch panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Touch panel 2 Upper electrode plate 3 Lower electrode plate 4,5 Resistive film 6a, 6b Electrode 7a, 7b Electrode 8 Connection part 9a-9d Through-hole 10 FPC
10a Connection side end 10b Coverlay film 10c Circuit 10d Recess 10e Metal pin fixing hole 11-14 Metal pin 11a Head 11b Neck 11c Groove 15 Conductive adhesive 16 Double-sided tape 16a Connection hole 16b Air vent 17 Humidity 18 See through Part 19a-19d Dummy electrode

Claims (8)

An upper electrode plate and a lower electrode plate, which are opposed to each other with a predetermined gap and have a resistance film on the inner surface, are bonded together by an insulating adhesive layer, and the electrodes of each of the resistance films are attached to the edges of these electrode plates. In the lead wire connection method of the touch panel provided with a connection portion for connecting the electrode ends that are extended and arranged from the lead wire to the lead wire,
Corresponding to each electrode end in the connection portion, the adhesive layer includes an air vent that leads to the connection hole and the touch panel end surface, and a through hole reaching the connection hole is formed in the lower electrode plate, Using a metal pin having a disk-shaped head portion formed larger in diameter than the outer diameter of the pin shaft portion, the pin shaft portion corresponds to the through hole in the lead wire portion at the connection side end portion of the lead wire. The pin shaft portion is erected at the connection side end portion of the lead wire, and the pin shaft portions are inserted into the through holes, respectively. A lead wire connecting method for a touch panel, wherein the pin shaft portion inserted into the lower electrode plate and the electrode end are electrically connected through a moisture-curing conductive adhesive. The touch wire lead wire connecting method according to claim 1, wherein the moisture curable conductive adhesive is composed mainly of silicone. The touch-wire lead wire connecting method according to claim 1, wherein a solvent-free adhesive is used as the moisture curable conductive adhesive. The lead wire connecting method for a touch panel according to claim 1, wherein the air vent is bent in a crank shape. The lead wire connecting method for a touch panel according to claim 1, wherein the adhesive layer is a frame-shaped double-sided tape. The upper electrode plate and the lower electrode plate further include a wiring overcoat layer, and the wiring overcoat layer also includes an air vent that leads to a connection hole and a touch panel end surface corresponding to each electrode end in the connection portion. Item 5. A method for connecting lead wires of a touch panel according to any one of Items 1 to 4. When inserting the pin shaft portion into the through hole, set the pin shaft portion of each metal pin in a state corresponding to the through hole, and apply the ultrasonic vibration and pressure to the pin shaft portion into the through hole. The lead wire of the touch panel according to any one of claims 1 to 6, wherein the wall surface of the through-hole is melted by being inserted and the inserted pin shaft portion is fixed to the lower electrode plate by re-solidification of the wall surface. Connection method. A concave groove is formed in the pin shaft portion of the metal pin, and when the pin shaft portion is inserted into the through hole while applying ultrasonic vibration and pressure, the molten portion of the wall surface of the through hole is guided to the concave groove. The lead wire connecting method for a touch panel according to claim 7.

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