JP2007310313A - Method of manufacturing liquid crystal panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a liquid crystal panel that increases the productivity and yield of a liquid crystal panel. <P>SOLUTION: The method of manufacturing the liquid crystal panel includes the steps of: disposing a sealing agent 5 discharged from a nozzle onto a first base substrate 1 where a plurality of array substrate areas 2 to be cut as substrates of liquid crystal panels while changing the relative positions of the top of the first base substrate 1 and the nozzle; and sticking the first base substrate 1 and a second base substrate together across the sealing agent 5. In the step of disposing the sealing agent 5 on the first base substrate 1, the sealing agent 5 begins to be disposed from a peripheral edge area part 3 on the first base substrate 1 and is disposed continuously in a looped shape on at least two adjacent array substrate areas 2 on the first base substrate 1 via areas 3 and 3 outside substrates, and the disposition of the sealing agent 5 is ended in a peripheral edge area part 3 on the first base substrate 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a liquid crystal panel, and more specifically, an adhesive discharged from a discharge unit is disposed on a first base substrate, and the first base substrate and the second base substrate are bonded to each other. The present invention relates to a method for manufacturing a liquid crystal panel to be bonded via a sheet.

  In general, a liquid crystal panel has a structure in which an array substrate and a color filter substrate are overlapped in parallel with a certain minute gap (gap) and liquid crystal is filled in the gap. As a method for manufacturing such a liquid crystal panel, for example, the following method is conventionally known. As shown in FIG. 8, the sealing agent 12 is disposed on the first base substrate 10 in which a plurality of array substrate regions 11 to be cut out as an array substrate are formed. On the plurality of array substrate regions 11, the sealant 12 is arranged in an open loop shape so that one place becomes a liquid crystal injection port. 8, the liquid crystal injection port is provided on the short side of the first base substrate 10, and in FIG. 9, the liquid crystal injection port is provided on the long side of the first base substrate 10. Yes.

  Then, after disposing the sealant 12 on the first base substrate 10, the second base is formed with a plurality of color filter substrate regions to be cut out as the first base substrate 10 and a color filter substrate (not shown). The substrate is bonded through a sealant 12. Then, the liquid crystal panels having the array substrate 11 and the color filter substrate are individually separated by cutting the bonded first base substrate 10 and second base substrate. A liquid crystal material is injected into the cut liquid crystal panel by using, for example, a vacuum injection method through an injection port formed between the array substrate 11 and the color filter substrate. A liquid crystal panel is manufactured by such a manufacturing method.

  By the way, as shown in FIG. 8 or FIG. 9, as a method of arranging the sealing agent 12 on the first base substrate 10, a conventional method of arranging by using screen printing and a dispenser (drawing distributor). There is known a method of arranging by using.

  In the screen printing method, a screen plate is placed on the first base substrate 10, a sealing agent 12 is placed on the screen plate, and the sealing agent 12 is pushed out from the opening of the screen plate with a squeegee (first spatula). This is a method of forming the sealing agent 12 on the base substrate 10. This screen printing method can be realized with a simple configuration and is excellent in productivity, but has the following problems. The problem is that since the screen plate is in contact with the first base substrate 10, dirt attached to the screen plate may adhere. Further, since it is necessary to place the sealing agent 12 on the entire screen plate, it is necessary to place more sealing agent 12 than necessary. Furthermore, since the sealing agent 12 placed on the screen plate is exposed to air, the sealing agent 12 may change over time, and the original characteristics of the sealing agent 12 may be lost.

  In order to solve this problem of the screen printing method, a dispenser method is used in which the sealant 12 is drawn on the first base substrate 10 by a dispenser (see, for example, Patent Documents 1 to 5). In the dispenser method, since the sealing agent 12 is disposed in a state where the nozzle of the dispenser and the first base substrate 10 are not in contact with each other, dirt from the dispenser does not adhere to the first base substrate 10. Further, unlike the screen printing method, it is not necessary to supply more sealing agent 12 than necessary. Further, since the sealant 12 is contained in the dispenser, the sealant 12 is not exposed to air. For this reason, a dispenser method is becoming mainstream as a method of disposing the sealing agent 12 on the first base substrate 10.

In the dispenser method, the sealant 12 is discharged from the nozzle by pressurizing air to the dispenser. Generally, since the viscosity of the sealant 12 is high, the response of the sealant 12 discharged from the nozzle is delayed even when air is pressurized to the dispenser. Therefore, it is particularly difficult to control the arrangement of the sealing agent 12 when starting or ending the arrangement of the sealing agent 12 on the first base substrate 10. In other words, when the placement of the sealing agent 12 is started or ended on the first base substrate 10, if the placement of the sealing agent 12 is not properly controlled, the sealant 12 is sealed from the place where the placement of the sealing agent 12 should not be started. The placement of the sealant 12 is started (for example, the sealant 12a in FIG. 8), or the placement of the sealant 12 is ended at a place where the placement of the sealant 12 should not be finished (for example, the sealant 12b in FIG. 8). There are things to do. For this reason, when the arrangement of the sealing agent 12 is started or ended on the first base substrate 10, it is necessary to adjust the nozzle speed. Further, in place of or in addition to adjusting the nozzle speed, when starting or ending the placement of the sealing agent 12 on the first base substrate 10, an amount of pressurizing air to the dispenser (pressure amount) is set. It needs to be adjusted. For example, before the placement of the sealant 12 is started on the first base substrate 10, air is pressurized to the dispenser in advance. In addition, the pressure applied to the dispenser is reduced in advance before the placement of the sealant 12 is completed on the first base substrate 10. Thereby, control of arrangement | positioning of the sealing agent 12 can be performed appropriately.
JP-A-8-240807 (FIGS. 1 to 2) Japanese Patent Laying-Open No. 2003-222883 (FIGS. 1 to 4) JP 2002-122870 A (FIGS. 1 to 22) JP 2003-344863 A (FIGS. 1 to 3) JP 2003-156724 A (FIGS. 1 to 21)

  However, adjusting the speed of the dispenser nozzle when starting or finishing the placement of the sealant on the first base substrate can result in the placement of the sealant being an individual array, for example as shown in FIG. 8 or FIG. When it is performed for each substrate region, since there are many places where the placement of the sealing agent starts or ends, there is a problem that it takes time to place the sealing agent on the first base substrate. In addition, for each array substrate region, the distance between the nozzle and the first base substrate is measured, and the nozzle is normal to the first base substrate so that the sealant is appropriately disposed on the first base substrate. It needs to be adjusted by moving in the direction. Further, the movement of the nozzle in the normal direction relative to the first base substrate is very slow compared to the movement in the direction parallel to the surface of the first base substrate due to complicated control and the like. . For this reason, the problem that productivity of a liquid crystal panel falls arises.

  Further, when the amount of pressurized air to the dispenser is adjusted when starting or ending the placement of the sealing agent on the first base substrate, for example, as shown in FIG. When the process is started, the sealant may be in a so-called ball state (for example, the sealant 12c in FIG. 8). Further, when the arrangement of the sealing agent is finished on the array substrate region, the sealing agent may become thin (smeared). For this reason, there is a problem that liquid crystal cannot be injected from the liquid crystal injection port by, for example, a vacuum injection method. In addition, since the width of the sealant is non-uniform, in the cutting process, for example, when cutting a bonded substrate using a scribe / break method, pressure is applied to the bonded substrate non-uniformly. Defects occur. For this reason, the problem that the yield of a liquid crystal panel falls arises.

  By the way, the above Patent Documents 1 to 4 disclose a method of disposing a closed loop sealant by a dropping injection method. For this reason, it cannot be applied to, for example, a method of disposing an open loop sealant by a vacuum injection method. Further, Patent Documents 1 to 5 do not disclose a configuration that solves the above problem.

  The present invention has been made in view of the above problems, and its purpose is to start the placement of the adhesive from an area outside the base substrate in which a plurality of substrate areas to be cut out are formed as substrates for a liquid crystal panel. Then, the adhesive is continuously arranged in an open loop shape with respect to at least two adjacent substrate regions, and the placement of the adhesive is terminated in the region outside the substrate, thereby improving the productivity and yield of the liquid crystal panel. The object is to provide a method of manufacturing a liquid crystal panel.

  In order to achieve the above object, the method of manufacturing a liquid crystal panel according to the present invention changes the relative position between the first base substrate on which a plurality of substrate regions to be cut out as the substrate of the liquid crystal panel are formed and the discharge portion. A step of disposing an adhesive discharged from the discharge unit on the first base substrate, and a step of bonding the first base substrate and the second base substrate through the adhesive. In the liquid crystal panel manufacturing method, in the step of arranging the adhesive on the first base substrate, the placement of the adhesive is started from a region outside the substrate region of the first base substrate. The adhesive is continuously arranged in an open loop shape with respect to at least two substrate regions adjacent to each other on the first base substrate, passing through the region outside the substrate, and on the first base substrate. Characterized in that to end the arrangement of the adhesive in the plate outside the area.

  As described above, in the method for manufacturing a liquid crystal panel according to the present invention, the placement of the adhesive is started from a region outside the base substrate where a plurality of substrate regions to be cut out as the substrate of the liquid crystal panel are formed, and at least two adjacent regions are formed. Adhesives are continuously arranged in an open loop shape with respect to one substrate region, and the placement of the adhesive is finished in the region outside the substrate. For this reason, according to the manufacturing method of the liquid crystal panel of this invention, there exists an effect that the productivity and yield of a liquid crystal panel can be improved.

  In order to achieve the above object, the method of manufacturing a liquid crystal panel according to the present invention changes the relative position between the first base substrate on which a plurality of substrate regions to be cut out as the substrate of the liquid crystal panel are formed and the discharge portion. A step of disposing an adhesive discharged from the discharge unit on the first base substrate, and a step of bonding the first base substrate and the second base substrate through the adhesive. In the liquid crystal panel manufacturing method, in the step of arranging the adhesive on the first base substrate, the placement of the adhesive is started from a region outside the substrate region of the first base substrate. The adhesive is continuously arranged in an open loop shape with respect to at least two substrate regions adjacent to each other on the first base substrate, passing through the region outside the substrate, and on the first base substrate. Characterized in that to end the arrangement of the adhesive in the plate outside the area.

  In the liquid crystal panel manufacturing method of the present invention, the placement of the adhesive is started from the area outside the substrate, and the adhesive is continuously arranged in an open loop shape with respect to at least two adjacent substrate areas. The placement of the adhesive is complete. Therefore, unlike the conventional manufacturing method, since the placement of the adhesive is not started or finished for each substrate region, the time for placing the adhesive on the first base substrate can be shortened. Further, unlike the conventional manufacturing method, the liquid crystal injection port in the open loop adhesive disposed on the substrate region does not become a so-called ball state or a blurred state. Furthermore, since the width of the adhesive becomes uniform, the base substrate does not have a division failure when the bonded substrates are cut. As a result, the productivity and yield of the liquid crystal panel can be improved.

  In the liquid crystal panel manufacturing method according to the present invention, the outside-substrate region includes a peripheral region formed between an outer periphery of the first base substrate and the substrate region, and the peripheral region and the substrate It is preferable that the region does not have a step. According to this aspect, when the placement of the adhesive is started from the peripheral region portion, for example, with a dispenser, the normal direction is set with respect to the peripheral region portion so as to appropriately dispose the adhesive on the first base substrate. It needs to be moved and adjusted. However, since there is almost no step between the peripheral region portion and the substrate region, it is possible to easily adjust the position (position control) between the peripheral region portion and the dispenser, and the dispenser again adjusts the position in the substrate region. There is no need to do.

  In the method for manufacturing a liquid crystal panel according to the present invention, the region outside the substrate further includes a gap formed between the substrate regions, and the gap and the substrate region do not have substantially a step. Is preferred. According to this aspect, since the gap has almost no step with the substrate region, the two base substrates are bonded to each other when the first base substrate and the second base substrate are bonded together with the adhesive. A uniform gap (gap) can be formed.

  In the method for manufacturing a liquid crystal panel according to the present invention, the bonding disposed on the substrate region after the step of bonding the first base substrate and the second base substrate through the adhesive. An aspect further comprising a step of cutting the bonded substrates so that an open loop-shaped portion of the agent forms an opening, and a step of injecting a liquid crystal material from the injection port using the opening as an injection port Is preferable. According to this aspect, unlike the conventional manufacturing method, the injection port does not become a so-called ball state or a faded state, so that the liquid crystal can be reliably injected from the liquid crystal injection port.

  In the method for manufacturing a liquid crystal panel according to the present invention, the adhesive disposed in the outer region connecting the openings of two adjacent substrate regions, and the opening side of the substrate region on the opening side. It is preferable that the adhesive disposed substantially parallel to the adhesive in the region outside the substrate is disposed at a substantially equal distance across a cutting line in the cutting step. According to this aspect, when the substrate bonded together in the cutting step is made to scratch the surface of the glass along the cutting line with a glass wheel by a scribe break method, for example, the cutting line is the above-mentioned each Since it is located in the approximate center of this adhesive agent, it becomes easy to produce a crack in the advancing direction of a glass wheel. For this reason, the bonded substrates can be cut well along the cutting line.

  In the method for manufacturing a liquid crystal panel according to the present invention, the adhesive that enters the substrate region from the outside region of the substrate, and the adhesive that advances from the substrate region to the outside region of the substrate are applied to the cutting line. Therefore, it is preferable to adopt a mode in which they are arranged substantially vertically. According to this aspect, when the substrate bonded together in the cutting step is made to scratch the surface of the glass along the cutting line with a glass wheel by a scribe break method, for example, the glass wheel When crossing the adhesive, cracks occur in the traveling direction of the glass wheel, but cracks do not occur along the direction in which the adhesive is disposed. For this reason, the bonded substrates can be cut well along the cutting line.

  In the manufacturing method of the liquid crystal panel in the said invention, it is preferable to set it as the aspect by which the run-up part for making the width | variety of the said adhesive agent constant is formed in the starting end side of the said adhesive agent. According to this aspect, it is possible to earn a distance for the adhesive to reach the substrate region after the placement of the adhesive is started. For this reason, the width | variety of the adhesive agent arrange | positioned at a board | substrate area | region can be made constant.

  A more specific embodiment of the present invention will be described in detail.

  In the following description, the configuration of a liquid crystal panel manufactured by the method for manufacturing a liquid crystal panel in the present embodiment will be briefly described before describing the method for manufacturing the liquid crystal panel in the present embodiment. That is, the liquid crystal panel is a liquid crystal panel used for a liquid crystal display device such as a mobile phone, a television, a digital camera, and a fax machine, and includes an array substrate, a color filter substrate, a liquid crystal material, a polarizing plate, and the like.

  The array substrate is a substrate in which TFTs (Thin Film Transistors) as switching elements are formed in a matrix on a transparent glass substrate. The color filter substrate is a substrate in which, for example, red, green and blue color filter layers are formed on a transparent glass substrate. A liquid crystal material is sandwiched between the array substrate and the color filter substrate. A polarizing plate is an optical film having a function of allowing only one of light composed of orthogonal polarization components to pass as linearly polarized light and removing the other by absorption or the like. These constitute a liquid crystal panel.

  In addition, said structure is an example and the structure of the liquid crystal panel which concerns on this embodiment is not limited to this. For example, a liquid crystal panel is not limited to a combination of an array substrate and a color filter substrate. A passive matrix liquid crystal panel that does not use TFTs, a monochrome display liquid crystal panel that does not have a color filter layer, and a backlight. Of course, the present invention can be applied to a reflection type liquid crystal panel which is not required.

  Next, a manufacturing method of the liquid crystal panel in the present embodiment will be described in detail with reference to FIGS. FIG. 1 is a plan view showing a first base substrate in which a plurality of array substrate regions to be cut out as substrates of a liquid crystal panel in the present embodiment are formed. In FIG. 1, the sealing agent is continuously arranged with respect to a plurality of array substrate regions adjacent in the row direction of the first base substrate (direction parallel to the short side of the first base substrate). An example is shown. FIG. 2 is an enlarged view of a part of the first base substrate shown in FIG. FIG. 3 is a drawing showing that an L-shaped running portion is formed on the start end side of the sealant. FIG. 4 is a view showing that a U-shaped width stabilizing portion is formed on the start end side of the sealing agent. FIG. 5 is a plan view showing a first base substrate in which a plurality of array substrate regions to be cut out as the substrate of the liquid crystal panel in the present embodiment are formed. In FIG. 5, the sealing agent is continuously arranged with respect to a plurality of array substrate regions adjacent in the column direction of the first base substrate (direction parallel to the long side of the first base substrate). An example is shown. FIG. 6 is an enlarged view of a part of the first base substrate shown in FIG. FIG. 7 is a plan view showing a first base substrate in which a plurality of array substrate regions to be cut out as substrates of the liquid crystal panel in the present embodiment are formed. FIG. 7 shows an example in which the sealing agent is continuously arranged from the first to fifth rows along the row direction of the first base substrate. In FIG. 1, FIG. 5 or FIG. 7, for simplification of the drawing, only the array substrate region in the first row is given a graphic symbol, and the other array substrate regions in the second to fifth rows are Graphic symbols are omitted. Further, in FIG. 5, the symbols are also omitted for the sealant (auxiliary sealant for bonding the first base substrate and the second base substrate) disposed in the peripheral region. .

  As shown in FIG. 1, the first base substrate 1 includes a plurality of array substrate regions 2 that are to be cut out as an array substrate, and a space between the outer periphery of the first base substrate 1 and the plurality of array substrate regions 2. Peripheral region 3 (outside substrate region) formed on the substrate and gap portions 4 (outside substrate region) formed between the plurality of array substrate regions 2 respectively. The array substrate region 2 has a wiring pattern 2a for mounting a driver circuit for driving and controlling the gate line or the source line. The first base substrate 1 includes a glass substrate, and this glass substrate is formed by a conventionally used float method, fusion method, or the like. The first base substrate 1 may include a plastic substrate instead of the glass substrate. In FIG. 1, for the sake of convenience of explanation, a case where 25 (regions) of the array substrate region 2 are formed in a so-called 5 rows and 5 columns is illustrated, but of course, the number of the array substrate regions 2 is limited. Alternatively, an arbitrary number of array substrate regions 2 can be formed on the first base substrate 1 in accordance with the size of the liquid crystal panel and the like.

  The glass substrate surface of the first base substrate 1 is cleaned by brush cleaning, ultrasonic cleaning, ultraviolet cleaning, solvent cleaning, and the like to remove particles such as organic substances and inorganic substances attached to the glass substrate surface. . Patterns such as TFTs and insulating films are laminated in multiple layers on the cleaned glass substrate in the array substrate region 2 using a photolithography method or the like. More specifically, a metal film such as a gate electrode is stacked on the glass substrate by sputtering or the like. Then, a gate electrode is formed by photolithography. Thereafter, a first interlayer insulating film is stacked by chemical vapor deposition. Subsequently, a semiconductor layer for improving the film quality, a channel protective film, and a semiconductor layer are stacked. Then, a second interlayer insulating film is stacked by chemical vapor deposition. Next, a transparent metal film is laminated by sputtering or the like. Finally, a metal film region is formed by photolithography. As a result, the array substrate region 2 is formed, but the method of forming the array substrate region 2 is not limited to this.

An interlayer insulating film made of SiO ₂ or an acrylic film is formed in the peripheral region portion 3 and the gap portion 4 in the first base substrate 1. The interlayer insulating film formed in the peripheral region portion 3 and the gap portion 4 is formed so as to have almost no step with the array substrate region 2. In this embodiment, the level difference is about 0.3 μm. The interlayer insulating film formed in the peripheral region portion 3 and the gap portion 4 is formed simultaneously with the formation of the first interlayer insulating film or the second interlayer insulating film of the TFT in the array substrate region 2. 2 may be formed irrespective of the step of forming the interlayer insulating film of the TFT. In the peripheral region portion 3 and the gap portion 4, a photolithography spacer may be formed instead of the interlayer insulating film, or a photolithography spacer may be formed on the interlayer insulating film.

  On the other hand, a second base substrate (not shown) facing the first base substrate 1 is further provided. The second base substrate includes a glass substrate, but may include a plastic substrate instead of the glass substrate. In the second base substrate, a plurality of color filter substrate regions to be cut out as color filter substrates are formed facing the array substrate region 2. Further, the second base substrate has a peripheral region portion and a gap portion on the color filter side facing the peripheral region portion 3 and the gap portion 4. Hereinafter, the peripheral area and the gap on the color filter side are referred to as areas other than the color filter substrate area.

  In a region other than the color filter substrate region, a chrome-based or resin-based black matrix is formed. The chrome-based or resin-based black matrix formed in a region other than the color filter substrate region is formed so as to have almost no steps from the color filter substrate region. When the chrome black matrix is formed in a region other than the color filter substrate region, the chrome black matrix generally has a thickness of about 0.1 μm. On the other hand, the color filter resin material formed in the color filter substrate region generally has a thickness of around 1 μm. For this reason, even if a chrome black matrix is formed in a region other than the color filter substrate region, a step is generated from the color filter resin material formed in the color filter substrate region. This step is about 0.9 μm. Therefore, when forming a chrome black matrix in a region other than the color filter substrate region, a chrome black matrix is formed in a region other than the color filter substrate region, and further on the upper surface of the formed chrome black matrix. Preferably, the color filter resin material is formed using a photolithography method or the like. The color filter resin material formed on the upper surface of the chrome black matrix may be a film of any one of RGB or all of RGB.

  The black matrix is formed at the same time when the black matrix is formed in the color filter substrate region, but may be formed before or after the black matrix is formed in the color filter substrate region. The black matrix does not have to be formed over the entire area other than the color filter substrate area. For example, the black matrix faces a sealant 5 described later disposed in the peripheral area 3 and the gap 4. The sealant 5 may be formed along the shape. Further, in areas other than the color filter substrate area, a photolithography spacer may be formed instead of the black matrix, or a photolithography spacer may be formed on the black matrix.

  Next, the first base substrate 1 and the second base substrate are formed by performing an alignment film forming process and an alignment process (rubbing process) on the glass substrate on which the above patterns are stacked. Here, the alignment film forming process is a process of applying a polyimide resin. The alignment process is a process of forming grooves in a certain direction in the alignment film in order to align liquid crystal molecules in a certain direction after forming the alignment film. The alignment film is generally very thin with a thickness of 0.05 to 0.1 μm. For this reason, even if the alignment film is not formed in the peripheral region portion 3 and the gap portion 4, the step does not become a problem in the peripheral region portion 3 and the gap portion 4 and the array substrate region 2. Therefore, the first base substrate 1 may be formed in the peripheral region 3 and the gap 4 without forming an alignment film. Similarly, the second base substrate may be formed without forming the alignment film in a region other than the color filter substrate region.

  Next, a sealing agent 5, which is an adhesive for bonding the first base substrate 1 and the second base substrate, is disposed on the first base substrate 1. As the sealant 5, for example, a thermosetting epoxy resin or a phenol resin is used, but is not limited thereto. Moreover, the arrangement | positioning method of the sealing agent 5 is performed by the dispenser system known conventionally.

  A dispenser (not shown) used in the dispenser system includes a nozzle as a discharge unit, a measurement member that measures a distance between the nozzle and the first base substrate 1, for example, an optical sensor, and the nozzle as the first base substrate 1. The moving member moves in a direction parallel to or normal to the surface, and a delivery member that delivers pressurized air to eject the sealant 5 from the nozzle.

When the dispenser starts to place the sealing agent 5, the distance between the nozzle and the first base substrate 1 is measured by the measuring member, and the sealing agent 5 is appropriately placed on the first base substrate 1. As described above, the nozzle is moved in the normal direction with respect to the surface of the first base substrate 1. And the sealing agent 5 is discharged from a nozzle by sending out the air pressurized with the sending member. That is, dispenser, the peripheral region 3 as a starting point P _S, starts the arrangement of the sealant 5 (drawing).

By the way, there is a case where the interlayer insulating film is not formed at all or in the vicinity of the outer periphery of the first base substrate 1 in the peripheral region portion 3 or the interlayer insulating film is not sufficiently formed. Assuming that the location where the interlayer insulating film is not formed as such is the starting point of the arrangement of the sealant 5, for example, even if the distance between the nozzle and the first base substrate 1 is measured by an optical sensor in the measurement member Since the interlayer insulating film is not formed at all or sufficiently, sufficient optical reflection from the glass substrate cannot be obtained, and appropriate position control between the nozzle and the first base substrate 1 cannot be performed. If the position control of the nozzle cannot be performed properly, the nozzle and the first base substrate 1 may come into contact with each other, so that the nozzle dirt may adhere to the first base substrate 1 or the first base substrate 1 may be damaged. This is not preferable because it causes problems such as Further, even if the position of the nozzle and the first base substrate 1 can be controlled at a location where the interlayer insulating film is not formed, and the placement of the sealant 5 is started from that location, this start point and the array substrate Since there is a level difference with the region 2, it is necessary to adjust again by moving the nozzle in the normal direction with respect to the first base substrate 1 in the array substrate region 2. Therefore, in the present embodiment, it is preferable that the starting point P _{S at} which the sealing agent 5 starts to be disposed is a location where the interlayer insulating film is formed in the peripheral region 3.

  Further, in order to provide a run-up period for making the width of the sealant 5 to be arranged constant, that is, the distance from the start of the placement of the sealant 5 until the sealant 5 reaches the array substrate region 2 is increased. For example, as shown in FIG. 3, the starting end of the sealant 5 may be formed in an L shape. Moreover, instead of the L shape shown in FIG. 3, for example, as shown in FIG. 4, the starting end portion of the sealant 5 may be formed in a U shape. Further, the shape of the starting end portion of the sealing agent 5 may be any shape other than the L shape or the U shape, provided that the sealing agent 5 does not form a closed loop. That is, when the sealing agent 5 is disposed in a closed loop shape, air in the closed loop is not released to the outside when the first base substrate 1 and the second base substrate, which will be described later, are bonded together. This is because cutting occurs.

In this embodiment, first, the sealant 5 is continuously arranged by so-called one-stroke writing on the five array substrate regions 2 in the first row (L _{1 in} FIG. 1). That is, the arrangement of the sealant 5 is started with the peripheral region 3 in the vicinity of the array substrate region 2 in the first row as the starting point P _S1 . Then, the sealant 5 is disposed in an open loop shape with respect to each of the five array substrate regions 2 in the first row while passing through the peripheral region portion 3. And arrangement _{| positioning} of the sealing compound 5 is complete _| finished in the end point _PE1 on the peripheral area | region part 3. FIG. From the start point P _S1 to the end point P _E1 , the sealing agent 5 is continuously arranged on the first base substrate 1 (in a so-called one-stroke pattern). Next, the nozzle of the dispenser is moved relatively to the vicinity of the array substrate region 2 in the second row. Then, the peripheral region 3 in the vicinity of the array substrate region 2 in the second row is set as the starting point P _S2 , and in the same manner as described above, each of the five array substrate regions 2 in the second row is in an open loop shape. The sealant 5 is disposed, and the disposition of the sealant 5 is finished at the end point P _E2 on the peripheral region 3. This is further repeated along the row direction of the array substrate region 2 in the third to fifth rows.

According to the above method, the position adjustment of the nozzle of the dispenser in the normal direction relative to the first base substrate 1 may be performed only at the five points of the starting points P _{S1 to} P _S5 . Thereby, compared with the conventional method, since the number of position adjustments can be reduced, the production efficiency of the liquid crystal panel is improved.

  In the present embodiment, as shown in FIG. 2, the sealant 5a connecting the adjacent array substrate regions 2 and the sealant 5c disposed in the array substrate region 2 sandwich a cutting line A described later. , So that the distance is approximately equal. That is, the distance H between the sealing agent 5a and the cutting line A and the distance H ′ between the sealing agent 5c and the cutting line A are substantially equal. Further, the sealant 5b that enters the array substrate region 2 from the substrate outer regions 3 and 4 and the sealant 5d that advances from the array substrate region 2 to the substrate outer regions 3 and 4 are substantially perpendicular to the cutting line A. Deploy. The effect will be described later.

In the above description, the example in which the sealant 5 discharged from the nozzles is continuously arranged along the row direction of the array substrate region 2 has been described. For example, as shown in FIG. The agent 5 may be continuously arranged along the column direction of the array substrate region 2. Even in this case, as in the case shown in FIG. 1, from the start point 30 to the end point 31 of the first row (C _{1 in} FIG. 5), the sealant 5 is formed in an open loop on the plurality of array substrate regions 2. The sealing agent 5 is disposed continuously (so-called with a single stroke) along the column direction.

Also in the present embodiment, as shown in FIG. 6, the sealant 5 a that connects the adjacent array substrate regions 2 and the sealant 5 c that is disposed in the array substrate region 2 are approximately equal distances across the cutting line B. Arrange so that That is, the distance H between the sealing agent 5a and the cutting line B and the distance H ′ between the sealing agent 5c and the cutting line B are substantially equal. Further, the sealant 5b that enters the array substrate region 2 from the outside-substrate regions 3 and 4 and the sealant 5d that advances from the array substrate region 2 to the outside-substrate regions 3 and 4 are substantially perpendicular to the cutting line B. Deploy. Further, an interlayer insulating film is formed at the starting point P _S.

  1 is an example in which the sealant 5 discharged from the nozzles is continuously arranged for each row along the row direction of the array substrate region 2, and in FIG. 5 above, the sealant discharged from the nozzles. Although the example which arrange | positions 5 continuously for every column along the column direction of the array substrate area | region 2 was demonstrated, for example, as shown in FIG. 7, the sealing agent 5 is arrange | positioned continuously over all the lines. Alternatively, as in FIG. 7, the sealing agent 5 may be continuously arranged over all rows. That is, in this embodiment, the sealing agent 5 may be disposed in an open loop shape with respect to at least two adjacent substrate regions.

  Next, the first base substrate 1 and the second base substrate are bonded together with a sealant 5 interposed therebetween. In this bonding, spacers are spread on the first base substrate 1 in advance in order to make the gap (gap) between the two base substrates uniform. As a bonding method, first, the first base substrate 1 and the second base substrate are overlaid through the sealant 5. The superposed first base substrate 1 and second base substrate are heated while being pressurized. Thereby, since the sealing agent 5 is hardened, the first base substrate 1 and the second base substrate are bonded together via the sealing agent 5.

  Here, in the present embodiment, the interlayer insulating film formed in the gap portion 4 is formed so as not to have a substantially step difference from the array substrate region 2. That is, since the surface of the gap 4 does not have a substantially step difference from the surface of the array substrate region 2, when the first base substrate 1 and the second base substrate are bonded together via the sealant 5, 2 A uniform gap (gap) can be formed in one base substrate.

  Next, the bonded substrate is cut along cutting lines A and B. That is, it cuts so that the open loop-shaped location of the sealing agent 5 arrange | positioned on the array substrate area | region 2 may form an opening. As a cutting method, for example, a conventionally known scribe / break method is used. This scribing / breaking method uses a glass wheel or the like to scratch the surface of the glass along the cutting lines A and B, and to remove the glass on the opposite side (back surface) from the scratched glass. It is a method of cutting by pressing with a urethane rod or the like. In addition, it replaces with a glass wheel and you may make a linear damage | wound on the surface of glass using super hard materials, such as a diamond.

  Here, in the present embodiment, as shown in FIG. 2 or FIG. 6, the sealing agent 5 a that connects the adjacent array substrate regions 2 and the sealing agent 5 c that is arranged in the array substrate region 2 include the cutting line A or They are arranged so as to have substantially the same distance via B. For this reason, for example, when making a line-shaped damage | wound on the surface of glass along the cutting lines A and B using a glass wheel etc., the cutting lines A and B are between the sealing agent 5a and the sealing agent 5c. Since it is located substantially at the center, cracks are likely to occur in the traveling direction of the glass wheel (the direction of the cutting lines A and B). Therefore, the bonded substrates can be satisfactorily cut along the cutting lines A and B.

  By the way, the sealing agent 5b that enters the array substrate region 2 from the outside-substrate regions 3 and 4 and the sealing agent 5d that advances from the array substrate region 2 to the outside-substrate regions 3 and 4 are substantially the same as the cutting line A or B. When not arranged vertically, when the glass wheel crosses the sealing agents 5b and 5d when the surface of the glass is linearly scratched along the cutting lines A and B using a glass wheel or the like, Further, cracks are generated in the traveling direction of the glass wheel (directions of the cutting lines A and B), and cracks are also generated along the arrangement direction of the sealing agent 5b or 5d. As a result, the yield of the liquid crystal panel is reduced. On the other hand, in the present embodiment, as shown in FIG. 2 or FIG. 6, the sealing agent 5b or 5d is disposed substantially perpendicular to the cutting line A or B. When crossing the sealing agents 5b and 5d, cracks occur in the traveling direction of the glass wheel (directions of the cutting lines A and B), but no cracks occur along the arrangement direction of the sealing agents 5b and 5d. Accordingly, the bonded substrates can be favorably cut along the cutting lines A and B. As a result, the yield of the liquid crystal panel is improved.

  Finally, a liquid crystal material is injected into the cut substrate. That is, the opening between the array substrate region 2 and the color filter substrate region is used as an injection port, and a liquid crystal material is injected from the injection port. As an injection method, for example, a conventionally known vacuum injection method is used. In this vacuum injection method, the cut substrate and the liquid crystal material are placed in a vacuum chamber, the air in the bath is discharged to reach a desired degree of vacuum, and the inlet of the cut substrate and the liquid crystal material are connected. In this method, the liquid crystal material is injected from the injection port by bringing it into contact and returning the inside of the tank to atmospheric pressure. And various optical films including a polarizing plate are bonded together. In this way, the liquid crystal panel is completed.

  As described above, in the liquid crystal panel manufacturing method according to the present embodiment, the relative position between the nozzle and the first base substrate 1 on which a plurality of array substrate regions 2 to be cut out as the substrate of the liquid crystal panel are formed. The step of disposing the sealing agent 5 discharged from the nozzle on the first base substrate 1 while changing the thickness, and the step of bonding the first base substrate 1 and the second base substrate through the sealing agent 5 In the step of disposing the sealant 5 on the first base substrate 1, the disposition of the sealant 5 is started from the peripheral region portion 3 in the first base substrate 1. The sealing agent 5 is continuously arranged in an open loop shape with respect to at least two array substrate regions 2 adjacent to each other on the first base substrate 1 through the substrate outer regions 3 and 4. of It terminates the placement of the sealant 5 at the peripheral region 3 on the over scan the substrate 1.

  That is, in the method for manufacturing a liquid crystal panel of the present invention, the arrangement of the sealing agent 5 is started from the peripheral region 3, and the sealing agent 5 is continuously formed in an open loop shape on at least two adjacent array substrate regions 2. It arrange | positions and the arrangement | positioning of the sealing agent 5 in the peripheral area | region part 3 is complete | finished. Therefore, unlike the conventional manufacturing method, the arrangement of the sealing agent 5 is not started or ended for each array substrate region 2, so that the time for arranging the sealing agent 5 on the first base substrate 1 is shortened. Can do. Further, unlike the conventional manufacturing method, the liquid crystal injection port in the open loop sealant 5 arranged on the array substrate region 2 does not become a so-called ball state or a blurred state. Further, since the width of the sealant 5 is uniform, the base substrate does not have a division failure when the bonded substrates are cut. As a result, the productivity and yield of the liquid crystal panel can be improved.

  In this embodiment, the example in which the sealant is disposed on the first base substrate on which a plurality of array substrate regions are formed has been described. However, a plurality of color filter substrate regions are formed instead of the first base substrate. The first base substrate and the second base substrate may be bonded to each other by disposing the sealant on the second base substrate that is used.

  In the present embodiment, the example in which the step between the peripheral region portion and the gap portion in the first base substrate and the array substrate region in the first base substrate is within about 0.3 μm has been described. It is not limited to. That is, since the liquid crystal panel is used in a liquid crystal display device, the above step may be 0.3 μm or more as long as an abnormality in transmittance cannot be observed by human eyes.

  Furthermore, in the present embodiment, an example in which a dispenser method is used as an arrangement method of the sealing agent, a scribe / break method is used as a method of cutting a bonded substrate, and a vacuum injection method is used as a method of injecting a liquid crystal material has been described. It is not limited to. That is, as long as the sealing agent can be disposed, not only the dispenser method but also an inkjet method in which the sealing agent is sprayed from a nozzle may be used. Further, as a method of cutting the bonded substrates, the laser beam may be used instead of the scribe / break method. Furthermore, as long as the liquid crystal material can be injected, the liquid crystal material may be injected using, for example, a capillary phenomenon without being limited to the vacuum injection method. Further, the liquid crystal material may be injected using the following method. First, a liquid crystal material inlet and a vacuum device are connected with a pipe interposed therebetween, and the liquid crystal panel is evacuated. Then, a liquid crystal supply device is connected instead of the vacuum device, and a liquid crystal material is injected into the liquid crystal panel.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  Hereinafter, specific examples will be described, but the present invention is not limited to the following examples.

Example 1
In the present embodiment, the sealing agent 5 is continuously arranged along the row direction of the array substrate region 2 in the first base substrate 1. That is, as shown in FIG. 1, the sealing agent 5 is arranged so that the liquid crystal injection port is provided on the short side of the first base substrate.

  First, a base substrate having a length of 320 mm, a width of 400 mm, and a thickness of 0.7 mm was prepared as the first base substrate 1. On the first base substrate 1, 25 (regions) of so-called 5 rows and 5 columns of array substrate regions 2 are formed.

In the peripheral region 3 and the gap 4 in the first base substrate 1, an interlayer insulating film made of SiO ₂ is formed. On the other hand, a black matrix is formed in a region other than the color filter substrate region in the second base substrate. More specifically, the black matrix is formed along the shape of the sealing agent 5 so as to face a sealing agent 5 described later disposed in the peripheral region 3 and the gap 4. The black matrix has a thickness of 1.2 μm and a width of 1 mm.

  Next, the sealant 5 is arranged on the first base substrate 1 by a dispenser. Further, the dispenser is adjusted so that the width of the sealing agent 5 disposed on the first base substrate 1 is 1 mm. A thermosetting epoxy resin is used as the sealant 5.

As shown in FIG. 1, the sealing agent 5 is continuously arranged on the first base substrate 1 from the start point P _S1 to the end point P _E1 in the first row (in a so-called one-stroke pattern). This is further repeated along the row direction of the array substrate region 2 in the second to fifth rows.

Here, as shown in FIG. 2, the distance H between the sealing agent 5a connecting the adjacent array substrate regions 2 and the cutting line A is 2 mm. The distance H ′ between the sealing agent 5c arranged in the array substrate region 2 and the cutting line A is 2 mm. Further, the sealant 5b that enters the array substrate region 2 from the substrate outer regions 3 and 4 and the sealant 5d that advances from the array substrate region 2 to the substrate outer regions 3 and 4 are substantially perpendicular to the cutting line A. Deploy. Note that the location of 10mm as a starting point P _S from the first outer periphery of the base substrate 1.

  Next, the first base substrate 1 and the second base substrate are bonded together with a sealant 5 interposed therebetween. Thereafter, the first base substrate 1 and the second base substrate to be bonded are cut to be individually separated as a liquid crystal panel having an array substrate and a color filter substrate. As described above, as a cutting method, the scribing / breaking method is used.

  Finally, a liquid crystal material was injected into the cut liquid crystal panel using a vacuum injection method through an injection port formed between the array substrate and the color filter substrate. And the liquid crystal panel was manufactured by bonding together various optical films containing a polarizing plate.

  When the liquid crystal panel manufactured in Example 1 was observed with a sodium lamp, no interference fringes like Newton's ring were generated, and good results were obtained. In addition, the sealing agent 5a generated in the vicinity of the injection port 5 was not defective (blurred, in a ball state) or was not separated due to this, and good results were obtained.

(Example 2)
In the present embodiment, the sealing agent 5 is continuously arranged along the column direction of the array substrate region 2 in the first base substrate 1. That is, as shown in FIG. 5, the sealing agent 5 is arranged so that the liquid crystal injection port is provided on the long side of the first base substrate.

  Compared with the first embodiment, this embodiment is different from the first embodiment in that the sealant 5 is continuously arranged along the column direction of the array substrate region 2 as shown in FIG. For this reason, since it is the same as that of Example 1, such as the dimension of the 1st base substrate 1, and the arrangement position of the sealing agent 5, it abbreviate | omits.

That is, as shown in FIG. 5, the sealing agent 5 is continuously arranged on the first base substrate 1 from the start point P _S1 to the end point P _E1 in the first row (in a so-called one-stroke pattern). This is further repeated along the column direction of the array substrate regions 2 in the second to fifth columns.

  When the liquid crystal panel manufactured in Example 2 was observed with a sodium lamp, interference fringes like Newton rings were not generated as in Example 1, and good results were obtained.

  By the way, the time for disposing the sealing agent 5 on the first base substrate 1 by the dispenser in Example 2 and the time for disposing the sealing agent 5 on the first base substrate 1 by the conventional dispenser were measured. The results are shown below.

First, the starting point P _S and the end point P _E of the sealant 5 of the first base substrate 1 in the second embodiment, for example, as shown in FIG. 5, using a base substrate having 42 points. On the other hand, as shown in FIG. 8, for example, a base substrate having 190 points is used as the starting point P _S and the end point P _E of the sealant of the first base substrate in the related art.

  Under such a base substrate, the time for disposing the sealant 5 on the first base substrate 1 in Example 2 was 93 seconds, whereas the seal was placed on the first base substrate 1 in the past. The time for placing the agent 5 was 167 seconds. That is, in Example 2, the time for disposing the sealant 5 per base substrate could be shortened by 74 seconds compared to the conventional example.

  As described above, the present invention starts the arrangement of the adhesive from the outside region of the base substrate in which a plurality of substrate regions to be cut out as the substrate of the liquid crystal panel is formed, and at least two adjacent substrate regions. The present invention can be applied to a method for manufacturing a liquid crystal panel in which an adhesive is continuously arranged in an open loop shape and the arrangement of the adhesive is finished in an area outside the substrate.

It is a top view which shows the 1st base substrate in which multiple array board | substrate area | regions which should be cut out as a board | substrate of the liquid crystal panel in this embodiment are formed, Comprising: A sealing agent continues along the row direction of a 1st base substrate. An example is shown. It is drawing which expanded and showed a part of 1st base substrate shown in FIG. It is drawing which showed that the L-shaped run-up part was formed in the starting end side of sealant. It is drawing which showed that the U-shaped run-up part was formed in the starting end side of a sealing agent. It is a top view which shows the 1st base substrate in which multiple array board | substrate area | regions which should be cut out as a board | substrate of the liquid crystal panel in this embodiment are formed, Comprising: A sealing agent continues along the column direction of a 1st base substrate. An example is shown. 6 is an enlarged view of a part of the first base substrate shown in FIG. 5. It is a top view which shows the 1st base substrate in which multiple array board | substrate area | regions which should be cut out as a board | substrate of the liquid crystal panel in this embodiment are formed, Comprising: 1-5 rows along the row direction of a 1st base substrate An example in which the sealant is continuously arranged up to the eyes is shown. It is a top view which shows the 1st base substrate in which the array substrate area | region which should be cut out as a board | substrate of the conventional liquid crystal panel is formed, Comprising: A sealing agent continues along the row direction of a 1st base substrate. An example is shown. It is a top view which shows the 1st base substrate in which the array substrate area | region which should be cut out as a board | substrate of the conventional liquid crystal panel is formed, Comprising: A sealing agent continues along the row direction of a 1st base substrate. An example is shown.

Explanation of symbols

1 First base substrate 2 Array substrate region (substrate region)
3 Peripheral area (outside board area)
4 Gap (outside substrate area)
5 Sealing agent (adhesive)

Claims (7)

Adhesion discharged from the discharge unit onto the first base substrate while changing a relative position between the discharge unit and the first base substrate on which a plurality of substrate regions to be cut out as substrates of the liquid crystal panel are formed A method of manufacturing a liquid crystal panel, comprising: arranging an agent; and bonding the first base substrate and the second base substrate through the adhesive,
In the step of disposing an adhesive on the first base substrate,
Starting the placement of the adhesive from a region outside the substrate region of the first base substrate,
An adhesive is continuously arranged in an open loop shape with respect to at least two substrate regions adjacent to each other on the first base substrate while passing through the region outside the substrate,
A method of manufacturing a liquid crystal panel, comprising disposing an adhesive in an area outside the substrate on the first base substrate. The region outside the substrate includes a peripheral region formed between the outer periphery of the first base substrate and the substrate region,
The method for manufacturing a liquid crystal panel according to claim 1, wherein the peripheral region portion and the substrate region do not have substantially a step. The region outside the substrate further includes a gap formed between the substrate regions,
The method for manufacturing a liquid crystal panel according to claim 1, wherein the gap portion and the substrate region do not have substantially a step. After the step of bonding the first base substrate and the second base substrate through the adhesive, an open loop portion of the adhesive disposed on the substrate region forms an opening. Cutting the bonded substrates so as to perform,
The method for manufacturing a liquid crystal panel according to claim 1, further comprising a step of injecting a liquid crystal material from the injection port with the opening as an injection port.   The adhesive disposed in the outer region connecting the openings of two adjacent substrate regions, and disposed substantially parallel to the adhesive in the outer region on the opening side in the substrate region The method for manufacturing a liquid crystal panel according to claim 4, wherein the adhesive is arranged at a substantially equal distance across a cutting line in the cutting step.   6. The adhesive that enters the substrate region from the outside region of the substrate and the adhesive that advances from the substrate region to the outside region of the substrate are disposed substantially perpendicular to the cutting line. The manufacturing method of the liquid crystal panel of description.   The manufacturing method of the liquid crystal panel as described in any one of Claims 1-6 in which the run-up part for making the width | variety of the said adhesive agent constant is formed in the starting end side of the said adhesive agent.

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