JP2007300266A - Ic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC component with high directivity which can perform radio communication with another IC component. <P>SOLUTION: On a package substrate 100, a first conductor pattern 110 (comprising partial patterns 111 and 112) fed from high frequency input and output terminals 211 and 212 of an IC chip 200 through a metal wire 511 to function as a radiator and a second conductor pattern 120, parallel to the first conductor pattern 110, functioning as a reflector are provided. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an IC component suitable as an antenna or the like for ultrashort-range wireless communication, and more particularly, to an improvement in an IC component having directivity.

There has been proposed an IC component configured such that a bonding wire mounted on a substrate functions as a small antenna. I which functions as an RF tag by setting a specific bonding wire on the substrate to a size suitable for functioning as an antenna and covering with an organic cover together with a semiconductor circuit (IC chip) from which these bonding wires are derived.
C parts are configured (see, for example, Patent Document 1).

On the other hand, there has been proposed a structure in which a conductor pattern formed on a substrate functions as an antenna element without using such a wire. As an example, a dipole antenna having a planar structure in which two conductor wires and two antenna conductors that are parallel to each other are formed on a dielectric substrate (for example, a glass epoxy substrate) has been proposed. In this proposal, the antenna conductor can be bent and the antenna length can be increased while realizing a reduction in the size of the entire antenna, and the portion where the electric fields cancel each other can be reduced, thereby increasing the gain. (For example, refer to Patent Document 2).

On the other hand, dipole antennas using various conductor patterns capable of transmitting circularly polarized signals as antennas for configuring RFID system tags have also been proposed (see, for example, Patent Document 3).
JP-A-8-88581 (paragraphs 0010 to 0014, FIG. 1) JP 2005-167327 A (paragraphs 0024 to 0032, FIG. 1) Japanese Patent Laying-Open No. 2005-341149 (paragraph 0034 to paragraph 0045, FIG. 1)

In the conventional IC components as described above, the bonding wire on the mounting substrate can function as an antenna, or the conductor pattern formed on the substrate can be used as a dipole antenna to perform wireless communication between IC components. It is to make.
However, with regard to these conventional technologies in general, when focusing on the radiation pattern of radio waves, for example, in the case of short-distance communication applied to a specific application, basically the positions of the transmitting side and the receiving side that perform communication Because the relationship is fixed, it will inevitably communicate with each other in a specific direction, so it is energy inefficient to radiate radio waves in all directions like conventional antennas. is there.

All of the antennas described in the above-mentioned literatures are basically dipoles and do not set directivity, and the recognition of the problem of giving directivity has not been pointed out yet.
The present invention has been made in view of the above situation, and an object thereof is to provide an IC component with high directivity.

In order to solve the above-described problems, the present application proposes the following techniques.
(1) An IC chip having a high-frequency input / output terminal and mounted on a predetermined substrate; a first conductor pattern formed on the substrate and connected to a predetermined high-frequency input / output terminal of the IC chip; And an antenna having a second conductor pattern formed at a predetermined distance from the first conductor pattern and substantially parallel to the longitudinal direction of the first conductor pattern.
C parts.
The IC component (1) is an antenna in which parallel elements are formed by the first conductor pattern and the second conductor pattern, and has directivity in the direction from the second conductor pattern toward the first conductor pattern. Is realized.

(2) The IC component according to (1), wherein the first conductor pattern constitutes a dipole antenna as a radiator.
In the IC component of the above (2), the first conductor pattern constitutes a dipole antenna as a radiator particularly in the IC component of (1).

(3) The second conductor pattern is a linear pattern having a length in the longitudinal direction longer than that of the first conductor pattern, and is configured to substantially constitute a reflector for a radiator configured by the first conductor pattern. The IC component according to any one of (1) to (2), wherein
In the IC component of (3) above, particularly in any one of the IC components of (1) to (2), the second conductor pattern is a linear pattern having a longer dimension in the longitudinal direction than the first conductor pattern. In other words, a reflector for the radiator constituted by the first conductor pattern is configured.

(4) The IC component according to any one of (1) to (3), wherein the IC chip is disposed between the first conductor pattern and the second conductor pattern.
In the IC component of the above (4), in particular, in the IC component of any one of (1) to (3), the IC chip is disposed between the first conductor pattern and the second conductor pattern, so that a space efficient layout is achieved. Is realized.

(5) The IC component according to any one of (1) to (4), wherein the high frequency input / output terminal of the IC chip and the first conductor pattern are connected by a metal wire.
In the IC component of (5) above, in particular, in any one of the IC components of (1) to (4), I
The high frequency input / output terminal of the C chip and the first conductor pattern are connected by a metal wire, and I
The C chip and the first conductor pattern exchange power for transmission and reception through the metal wire.

(6) A third conductor pattern formed so as to extend substantially parallel to the longitudinal direction of the first conductor pattern at a predetermined distance away from the first conductor pattern on the side opposite to the second conductor pattern. The IC according to any one of (1) to (5), further comprising:
parts.
In the IC component of (6) above, the third conductor pattern can function as a director in the antenna, particularly in any one of the IC components of (1) to (5).

(7) A third conductor pattern formed to extend substantially parallel to the longitudinal direction of the first conductor pattern at a predetermined distance away from the first conductor pattern on the side opposite to the second conductor pattern. The third conductor pattern is a linear pattern having a dimension in the longitudinal direction shorter than that of the first conductor pattern, and is a waveguide for a radiator substantially constituted by the first conductor pattern. The IC component as defined in any one of (1) to (5), characterized in that:
In the IC component of (7) above, the third conductor pattern functions as a waveguide in the antenna, particularly in any one of the IC components of (1) to (5).

(8) The IC component according to (1), wherein the first conductor pattern constitutes a loop antenna as a radiator.
In the IC component of (8) above, the first conductor pattern functions as a loop antenna as a radiator, particularly in the IC component of (1).

(9) An IC chip having a high-frequency input / output terminal and mounted on a predetermined substrate; a first conductor wire formed on the substrate and connected to a predetermined high-frequency input / output terminal of the IC chip; And an antenna having a second conductor wire formed at a predetermined distance from the first conductor wire and substantially parallel to the longitudinal direction of the first conductor wire. parts.
In the IC component of (9) above, an antenna in which parallel elements are configured by the first conductor wire and the second conductor wire, and directing in the direction from the second conductor wire to the first conductor wire. An antenna having the characteristics is realized.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings to be referred to below, for the sake of convenience, the main part that is the subject of the description is exaggerated as appropriate, and other than the main part is appropriately simplified or omitted.
FIG. 1 is a diagram showing an IC component as an embodiment of the present invention. In FIG. 1, antenna 1
The layout of each part on the package substrate 100 in the IC component 10 having 1 is shown.

That is, an IC chip 200 having a plurality of predetermined external terminals 210 including high-frequency input / output terminals 211 and 212 is mounted on the package substrate 100.
That is, the plurality of external terminals 210 and 210 of the IC chip 200 are electrode pads 410 and 410 arranged on the package substrate 100 by bonding wires 310 and 310, respectively.
It is connected to the.

A pair of partial patterns 111 and 112 divided into two so as to form elements of a predetermined antenna 11 (elements constituting a dipole antenna as a radiator of the antenna 11 in the case of illustration) are provided on the package substrate 100. A first conductor pattern 110 is formed,
The high frequency input / output terminals 211 and 212 of the IC chip 200 are the first conductor pattern 110.
The partial patterns 111 and 112 are connected correspondingly.

The high frequency input / output terminals 211 and 212 of the IC chip 200 and the first conductor pattern 111 (the respective partial patterns 111 and 112) are connected by metal wires 511 and 512, and the IC chip 200 and the first conductor pattern 110 are Power is transmitted and received through the metal wires 511 and 512.

Other elements of the antenna 11 (in the case of illustration, a reflector of the antenna 11) are extended on the package substrate 100 at a predetermined distance from the first conductor pattern 110 and substantially parallel to the longitudinal direction of the first conductor pattern 110. The 2nd conductor pattern 120 formed so that it may comprise is provided. As shown in the figure, the dimension of the second conductor pattern 120 in the longitudinal direction is the first conductor pattern 1.
This is a linear pattern longer than the longitudinal dimension of 10 (a combination of the partial patterns 111 and 112).

As described above, the antenna 11 in which the radiator is formed by the first conductor pattern 110 and the reflector is formed by the second conductor pattern 120 has directivity in the direction from the second conductor pattern 120 toward the first conductor pattern 110. Have.
Further, as is apparent from the figure, the IC chip 200 is disposed between the first conductor pattern 110 and the second conductor pattern 120 to realize a space efficient layout on the package substrate 100, and the directivity is improved as described above. The IC component 10 having the antenna 11 provided on the package substrate 100 is itself sealed by a well-known resin seal.
An IC component 10 in which the C chip 200 and the package substrate 100 are integrated is configured.

FIG. 2 is a diagram showing another embodiment of the present invention. In FIG. 2, the same reference numerals are assigned to the corresponding parts in FIG. 1 described above, and description of each part is omitted. In the example of FIG.
The second conductor pattern 120a corresponding to the second conductor pattern 120 in FIG. 1 is disposed on the package substrate 100 at a position where a part thereof is covered by the IC chip 20 (that is, a part thereof is below the IC chip 20). It has become).

In the layout as shown in FIG. 2, the external size of the IC component 10 including the region where the electrode pads 410 and 410 are arranged has a first conductor pattern 110 as a radiator of the antenna 11 and a second conductor pattern 120 as a reflector. If it is adopted in a case where the distance is larger than the desired interval, ideal characteristics of the antenna 11 are ensured.

FIG. 3 is a diagram showing another embodiment of the present invention. In FIG. 3, the same reference numerals are given to the corresponding parts to the above-described figures, and the explanation of each part is omitted, but in the example of FIG.
The first conductor pattern 110 corresponding to the first conductor pattern 110 in FIG. 1 (a combination of the partial patterns 111 and 112) is slightly different from the first conductor pattern 110 in FIG. Is different.

That is, in the embodiment of FIG. 3, the first conductor pattern 110 a (a combination of the partial patterns 111 a and 112 a) is the high-frequency input / output terminal 21 of the IC chip 200.
Both the above-mentioned portions (patterns 111a and 112a) once enter parallel to the lower surface side of the IC chip 200 from the end where 1 and 212 are electrically connected by the metal wires 511 and 512, and both of them enter from a predetermined distance. Is bent at right angle in the opposite direction and IC
It is formed as a putter that extends in parallel with the second conductor pattern 120 so as to protrude outside a certain region of the chip 200.

In the layout as shown in FIG. 3 as well, the outer size of the IC component 10 including the region where the electrode pads 410 and 410 are arranged has the first conductor pattern 110 as the radiator of the antenna 11 and the second conductor pattern 120 as the reflector. If it is adopted in a case where the distance is larger than the desired interval, ideal characteristics of the antenna 11 are ensured.

FIG. 4 is a diagram showing still another embodiment of the present invention. In FIG. 4, the same reference numerals are given to the corresponding parts to the above-described drawings, and the description of these parts is omitted, but in the example of FIG. A third conductor pattern 130 is provided on the opposite side of the conductor pattern 120 so as to be separated from the conductor pattern 120 by a predetermined distance and to extend substantially parallel to the longitudinal direction of the first conductor pattern 110. The third conductor pattern 130 is the antenna 11
It can function as a director.

Further, the first conductor pattern 110b (a combination of the partial patterns 111b and 112b) does not enter the back side of the IC chip 200 as in the example of FIG.
00 high-frequency input / output terminals 211 and 212 extend in parallel toward the third conductor pattern 130 from the ends electrically connected by the metal wires 511 and 512, and both of them extend from the predetermined distance. It is formed as a putter that is bent at a right angle in the opposite direction and extends in parallel with the second conductor pattern 120.

The layout as shown in FIG. 4 also has a first conductor pattern 110 as a radiator, a second conductor pattern 120 as a reflector, and a third conductor pattern 130 as a director according to characteristics required for the antenna 11. Can be selected as appropriate and the antenna 1
The ideal characteristic of 1 is ensured.
In particular, since the third conductor pattern 130 serving as a director is provided, a Yagi / Uda antenna is formed, and a more directional characteristic can be obtained.

FIG. 5 is a diagram showing another embodiment of the present invention. In FIG. 5, the same reference numerals are assigned to the corresponding parts in the above-described drawings, and the description of these parts is omitted. Since the three-conductor pattern 130 is provided, the Yagi / Uda antenna is configured.
However, the first conductor pattern 110b in FIG. 4 (its partial patterns 111b and 1b
12b), a first conductor pattern 110a similar to that in FIG. 3 (a combination of the partial patterns 111a and 112a) is applied, and a part of the first conductor pattern 110a is an IC. Since the layout entering the back side of the chip 200 is taken, the overall size can be reduced as compared with the example of FIG.

FIG. 6 is a diagram showing still another embodiment of the present invention. In FIG. 6, the same reference numerals are given to the corresponding parts to the respective drawings described above, and description of those parts is omitted, but in the example of FIG.
As the first conductor pattern 110b constituting the radiator of the antenna 11, the package substrate 10
A line pattern formed on 0 is applied. The metal wire 511 is connected to the line pattern (first conductor pattern) 110b from the high frequency input / output terminal 211 of the IC chip 200.
The inverted F type antenna is configured by supplying power through the line pattern, with one end 151 side of the line pattern being an open end and the other end 152 side being grounded. Also in this example, the second conductor pattern 120 as a reflector is provided and has a corresponding directivity.

FIG. 7 is a diagram showing another embodiment of the present invention. In FIG. 7, the same reference numerals are assigned to the corresponding parts to the above-described drawings, and the description of these parts is omitted. However, in the example of FIG. A line pattern formed on the package substrate 100 is applied as the first conductor pattern 110c constituting the radiator.
However, unlike the first conductor pattern 110b in FIG. 6, one end 151 side of such a line pattern (first conductor pattern) 110c is an open end, and the other end 152 side is connected to the high frequency input / output terminal 211 of the IC chip 200. Power is supplied through the metal wire 511,
It constitutes a whip antenna. Also in this example, the second conductor pattern 120 as a reflector is used.
It has a suitable directivity.

FIG. 8 is a diagram showing still another embodiment of the present invention. In FIG. 8, the same reference numerals are assigned to the corresponding parts to the above-described figures, and the description of each part will be omitted. As shown in the figure, the first conductor pattern 110b (a combination of the partial patterns 111b and 112b)
The second conductor pattern 120 is the same as the example already described with reference to FIG. 4, but in this example, in particular, there are a plurality of third conductor patterns as a director such as 130a, 130b, and 130c. (3) provided. For this reason, compared with the example of FIG. 4, while having a stronger directivity, the characteristic of a higher gain is shown.

FIG. 9 is a diagram showing still another embodiment of the present invention. In FIG. 9, the same reference numerals are given to the corresponding parts to the above-described figures, and the explanation of each part is omitted, but the example of FIG. 9 is the example already described with reference to FIG. The second conductor pattern 120 as a reflector and the third conductor pattern 130 as a director are configured in the same manner, but a loop dipole antenna is applied as the first conductor pattern 110c as a radiator. . In this case, the overall size is reduced by adopting a layout in which a part of the loop dipole antenna enters the back side of the IC chip 200.

Note that the first conductor pattern 110c constituting the loop dipole antenna is separated from the feeding end fed through the metal wires 511 and 512 in a loop and separated from the feeding end, and the arrows M in FIG. The locations shown in the lines may be short-circuited or open, and this point may be selected at the time of design according to the required specifications.

As described above, the first conductor pattern, the second conductor pattern, and the third conductor pattern in each example described with reference to the drawings are all or part of the foil formed on the package substrate as required. Instead of the pattern, it may be formed in the form of a line (forms a line). In this case, the line may be the same wire as the bonding wire.

It is a figure showing IC components as an embodiment of the invention. It is a figure showing other embodiment of this invention. It is a figure showing other embodiment of this invention. It is a figure showing other embodiment of this invention. It is a figure showing other embodiment of this invention. It is a figure showing other embodiment of this invention. It is a figure showing other embodiment of this invention. It is a figure showing other embodiment of this invention. It is a figure showing other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... IC component 11 ... Antenna 100 ... Package board 110, 110a, 11
0b, 110c, 110d ... 1st conductor pattern 120, 120a ... 2nd conductor pattern
130, 130a, 130b, 130c ... third conductor pattern 200 ... IC chip 21
1,212 ... High frequency input / output terminal 511,512 ... Metal wire

Claims (9)

An IC chip having a high frequency input / output terminal mounted on a predetermined substrate, a first conductor pattern formed on the substrate and connected to a predetermined high frequency input / output terminal of the IC chip, and the first conductor pattern on the substrate And an antenna having a second conductor pattern formed at a predetermined distance and substantially parallel to the longitudinal direction of the first conductor pattern. The IC component according to claim 1, wherein the first conductor pattern constitutes a dipole antenna as a radiator. The second conductor pattern is a linear pattern having a length in the longitudinal direction longer than that of the first conductor pattern, and is configured to substantially constitute a reflector for a radiator configured by the first conductor pattern. The IC component according to claim 1, wherein the IC component is a component. 4. The IC component according to claim 1, wherein the IC chip is disposed between the first conductor pattern and the second conductor pattern. 5. 5. The IC component according to claim 1, wherein the high frequency input / output terminal of the IC chip and the first conductor pattern are connected by a metal wire. And a third conductor pattern formed to extend substantially parallel to the longitudinal direction of the first conductor pattern at a predetermined distance from the first conductor pattern on the opposite side of the second conductor pattern. It is comprised by these, The I as described in any one of Claim 1 thru | or 5 characterized by the above-mentioned.
C parts. And a third conductor pattern formed to extend substantially parallel to the longitudinal direction of the first conductor pattern at a predetermined distance from the first conductor pattern on the opposite side of the second conductor pattern. The third conductor pattern is a linear pattern having a length in the longitudinal direction shorter than that of the first conductor pattern, and substantially forms a waveguide for the radiator configured by the first conductor pattern. 6. The IC component according to claim 1, wherein the IC component is configured as follows. The IC component according to claim 1, wherein the first conductor pattern constitutes a loop antenna as a radiator. An IC chip having a high frequency input / output terminal mounted on a predetermined substrate, a first conductor wire formed on the substrate and connected to a predetermined high frequency input / output terminal of the IC chip, and the first on the substrate
An IC component comprising: an antenna having a second conductor wire formed at a predetermined distance from the conductor wire and substantially parallel to the longitudinal direction of the first conductor wire.

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