JP2007299815A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of positively conducting a conductive layer formed in the plane of an enclosure and a reference potential portion of a substrate. <P>SOLUTION: A rib 29 abutting on a second mounting surface is provided on the internal surface of a transmitting enclosure of a cellular phone as one of an electronic device, so as to segment the inside of the transmitting enclosure into a substrate side region SP1 on the second mounting surface and a hinge side region SP2 outside the second mounting surface; and a conductive layer 30 is formed from the substrate side region SP1 to the hinge side region SP2. A tub for conducting a ground pattern layer of the substrate to the conductive layer 30 is provided on the substrate side region SP1, a void for communicating the substrate side region SP1 to the hinge side region SP2 is provided on the rib 29, and the conductive layer 30 is continuously formed from the substrate side region SP1 to the hinge side region SP2 via the void. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic device such as a mobile phone.

A technology is known in which ribs are provided on the inner surface of the housing so as to divide the mounting surface of the substrate into a plurality of regions and a conductive layer is formed over the plurality of regions to shield the plurality of regions on the mounting surface of the substrate. (For example, Patent Document 1). The rib is formed in the same pattern as the ground pattern layer (reference potential portion) formed on the mounting surface of the substrate, and the rib end surface and the ground pattern layer are in close contact with each other so that the rib is formed on the inner surface of the housing. The conductive layer is electrically connected to the ground pattern layer.
JP 2004-274466 A

  However, the rib end face that is in close contact with the ground pattern layer of the substrate may be rubbed by vibration or the like, resulting in minute peeling of the conductive layer, which may increase the contact resistance, and noise current cannot be appropriately supplied to the ground pattern layer. There is a fear.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic apparatus that can reliably connect a conductive layer formed on the inner surface of a housing and a reference potential portion of a substrate.

  An electronic apparatus according to an aspect of the invention includes a housing and a substrate housed in the housing. The inner surface of the housing on the side facing the mounting surface of the substrate has a first interior of the housing. A rib that contacts the mounting surface is provided so as to be divided into a first region and a second region, and a conductive layer is formed from the first region to the second region. Is provided with a conducting member that conducts between the reference potential portion of the substrate and the conductive layer, and the rib is provided with a space that communicates the first region and the second region. The layer is formed continuously from the first region to the second region through the void.

  Preferably, the first region is a region on the mounting surface of the substrate, and the second region is a region outside the mounting surface of the substrate.

  Preferably, the void is a gap formed between the rib and the mounting surface by forming a notch in a rib end surface that contacts the mounting surface of the rib.

  Preferably, a ridge portion between the surface on which the conductive layer is formed and the wall surface of the rib among the formation surfaces of the voids is a curved surface.

  According to the present invention, the conductive layer formed on the inner surface of the housing and the reference potential portion of the substrate can be reliably conducted.

  FIG. 1 is a perspective view showing an external appearance of a mobile phone 1 according to an embodiment of the present invention in an open state. The mobile phone 1 is configured as a so-called foldable mobile phone, and includes a reception case 2 and a transmission case 3 that are rotatably connected to each other between an open state and a closed state. The receiving case 2 and the transmitting case 3 are connected to each other by a connecting portion 4 that is the center of rotation, thereby constituting the entire case of the mobile phone 1.

  The receiving housing 2 and the transmitting housing 3 are each formed in a generally thin rectangular parallelepiped shape. The receiving case 2 is provided with, for example, a speaker for call (not shown) and a display unit 6 for displaying images and characters. The transmitter case 3 is provided with, for example, a call microphone (not shown), an operation unit 7 for accepting a user operation, and a notification speaker (not shown).

  The connecting portion 4 is configured by fitting a convex portion 9 formed in the receiving housing 2 into a concave portion 10 formed in the transmitting housing 3. The concave portion 10 is formed at an end portion of the transmission case 3, and both sides of the concave portion 10 at the end portion of the transmission case 3 constitute a support portion 11 connected to the convex portion 9. A cylindrical member (not shown) is inserted through the sliding surface between the convex portion 9 and the support portion 11, and the receiving housing 2 and the transmitting housing 3 rotate relative to each other with the cylindrical member as a rotation axis.

  The transmitter case 3 includes a front case 21 on the side facing the receiver case 2 in the closed state, a rear case 22 on the rear side, and a lid 23 that covers the rear side of the rear case 22. I have. Various electronic components are stored between the front side case 21 and the back side case 22, and a battery is stored between the back side case 22 and the lid body 23. The front side case 21, the back side case 22, and the lid body 23 are each formed of, for example, a non-conductive resin.

  FIG. 2 shows a back side case 22 of the transmitter case 3 and a substrate 25 accommodated in the transmitter case 3, FIG. 2 (a) is an exploded perspective view, and FIG. Shows a state where the back side case 22 and the substrate 25 are assembled.

  The substrate 25 is constituted by a printed wiring board based on a resin, for example. For example, although not shown, the substrate 25 is provided with a control unit that controls the display unit 6 and the like based on a wireless communication unit including a high-frequency circuit and a signal from the operation unit 7.

  The substrate 25 is disposed between the front side case 21 and the back side case 22 in a stacked manner. That is, the substrate 25 is laminated on the back side case 22 as shown in FIG. 2, and an FPC (not shown) provided thereon with, for example, a shield case (not shown) and a press switch corresponding to the key of the operation unit 7. ), A key sheet (not shown) on which the keys of the operation unit 7 are arranged, etc. are stacked, and finally the front case 21 is put on to be accommodated in the transmitter case 3. The substrate 25 is formed in, for example, a rectangular shape that is slightly smaller than the transmitter case 3, and the front side case 21 and the back side are viewed in the stacking direction of the front side case 21, the back side case 22, and the substrate 25. Although most of the side case 22 overlaps with the substrate 25, the portion forming the support portion 11 does not overlap with the substrate 25 and protrudes out of the substrate 25.

  The substrate 25 has a first mounting surface 25a on the front case 21 side (upper side in the drawing in FIG. 2) and a second mounting surface 25b on the back surface side. A ground pattern layer 27 (only the first mounting surface 25a is shown) is provided on the first mounting surface 25a and the second mounting surface 25b so as to partition each mounting surface into a plurality of regions AR. . The ground pattern layer 27 on the first mounting surface 25 a and the second mounting surface 25 b has an outer peripheral portion 27 a that extends along the edge of the substrate 25 and surrounds the outer periphery of the substrate 25. In FIG. 2, only the ground pattern layer 27 on the first mounting surface 25a is shown, but the ground pattern layer 27 on the second mounting surface 25b has a shape and size other than the specific shape and size of the area AR. The shape of the outer peripheral portion 27a of the second mounting surface 25b is substantially the same as the shape of the outer peripheral portion 27a of the first mounting surface 25a.

  On the other hand, a rib 29 protruding toward the substrate 25 is provided on the inner surface of the rear case 22, in other words, on the inner surface of the transmitter housing 3 on the side facing the second mounting surface 25 b of the substrate 25. Yes. The ribs 29 extend in the same pattern as the ground pattern layer 27 on the second mounting surface 25b. When the substrate 25 is stacked on the back side case 22, the rib 29 contacts the ground pattern layer 27 on the second mounting surface 25b. . The rib 29 partitions the space on the second mounting surface 25b into a plurality of regions. Further, the portion of the rib 29 corresponding to the outer peripheral portion 27a of the ground pattern layer 27 includes a space inside the transmitter housing 3 in an area on the second mounting surface 25b and an area outside the second mounting surface 25b. Divide into The area outside the second mounting surface 25b is an internal area of the support portion 11, for example.

  A conductive layer 30 is formed on the inner surface of the back side case 22. The conductive layer 30 is a metal film such as copper, for example, and is formed by vapor deposition or sputtering. The conductive layer 30 is formed over a region partitioned by the ribs 29 and is also formed on the ribs 29. That is, the conductive layer 30 is formed not only on the surface of the back side case 22 facing the substrate 25 but also on the wall surfaces 29 b and end surfaces 29 c of the ribs 29. The conductive layer 30 is in contact with the ground pattern layer 27 at the end face 29 c of the rib 29 and is electrically connected to the ground pattern layer 27. Therefore, the region surrounded by the ribs 29 is shielded by the surface of the back side case 22 facing the substrate 25 and the conductive layer 30 formed on the ribs 29.

  3 is an enlarged view showing the support portion 11 and the vicinity thereof in the rear side case 22, FIG. 3 (a) is a perspective view, FIG. 3 (b) is a plan view, and FIG. It is an enlarged view.

  A hinge-side rib 29 a that contacts a part of the outer peripheral portion 27 a of the ground pattern layer 27 among the ribs 29 is provided at the base of the support portion 11. The hinge-side ribs 29a are hinged inside the transmission housing 3 inside the support portion 11 outside the board-side region SP1 on the second mounting surface 25b of the board 25 and outside the second mounting surface 25b of the board 25. It is partitioned into a side region SP2. As described above, the hinge-side rib 29a is formed with the conductive layer 30 and shields a predetermined region defined by the rib 29 including the hinge-side rib 29a.

  The surface 11a which forms the recessed part 10 of the support part 11 is a sliding surface with the convex part 9, and the hole part 11b for inserting the cylindrical member which connects the convex part 9 and the support part 11 (FIG. 3 ( In b), only the semicircle of the back case 22 is shown out of the semicircle of the front case 21 and the semicircle of the back case 22 that form the hole 11b. Accordingly, it is preferable that static electricity easily enters the support portion 11 from the hole portion 11 b and that the static electricity is released to the ground pattern layer 27 of the substrate 25.

  Further, a signal line (not shown) that connects the electronic circuit of the receiving housing 2 and the electronic circuit of the transmitting housing 3 is inserted through the cylindrical member inserted through the hole 11b. Therefore, in order to prevent noise from entering the signal line, the support portion 11 is preferably shielded.

  Therefore, a conductive layer 30 is formed on the inner surface of the back side case 22 from the hinge side region SP2 to the substrate side region SP1. The hatched area in FIG. 3B indicates an area where the conductive layer 30 is formed. The conductive layer 30 is also formed on the wall surface 29b and the end surface 29c of the hinge side rib 29a, and the conductive layer 30 in the hinge side region SP2 is electrically connected to the ground pattern layer 27 of the substrate 25 at the end surface 29c.

  The noise current in the hinge-side region SP2 is induced to the ground pattern layer 27 through the conductive layer 30 on the end surface 29c of the hinge-side rib 29a. However, the end surface 29c and the substrate 25 are rubbed by vibration or the like and are minutely applied to the conductive layer 30. Peeling may occur, and the contact resistance between the conductive layer 30 and the ground pattern layer 27 may increase.

  Therefore, in the mobile phone 1, the conductive layer 30 in the hinge side region SP2 is reliably conducted to the ground pattern layer 27 as follows.

  A notch 29d is formed on the end surface 29c of the hinge side rib 29a. The step d1 of the notch 29d is, for example, 0.05 to 0.2 mm. As shown in FIG. 3C, a ridge 29e between the surface constituting the notch 29d and the wall surface 29b of the hinge-side rib 29a is a curved surface with a so-called angle R attached thereto. In other words, the surface is chamfered. The conductive layer 30 is also formed on the surface of the notch 29d. Therefore, the conductive layer 30 in the hinge-side region SP2 and the conductive layer 30 in the substrate-side region SP1 are continuous via the conductive layer 30 in the notch 29d.

  4A is a plan view showing the back side case 22 and the substrate 25, and FIG. 4B is a cross-sectional view in the direction of arrows IVb-IVb in FIG. 4A, and FIG. Fig. 4 (a) is a sectional view in the direction of arrows IVc-IVc in Fig. 4 (a), Fig. 4 (d) is an enlarged view of region a in Fig. 4 (b), and Fig. 4 (e) is Fig. 4 (c). ) Is an enlarged view of region b.

  4B and 4D are cross-sectional views in the substrate side region SP1. A tab 35 for electrically connecting the ground pattern layer 27 of the second mounting surface 25b of the substrate 25 and the conductive layer 30 of the back side case 22 is provided in the substrate side region SP1. The tab 35 is formed by bending a metal plate, for example, and is fixed to the substrate 25 by fixing means such as solder. The tab 35 is elastically deformed by being sandwiched between the substrate 25 and the back side case 22 when the substrate 25 is laminated on the back side case 22, and is reliably brought into contact with the conductive layer 30 by a restoring force. In addition, area | region C1 of Fig.3 (a) has shown an example of the contact position of the tab 35. FIG.

  4C and 4E are cross-sectional views of the position of the hinge-side rib 29a. The end surface 29c of the hinge side rib 29a is in contact with the substrate 25, but in the cutout portion 29d, a gap is formed between the hinge side rib 29a and the substrate 25 to form a void 36.

  According to the above embodiment, the noise current in the hinge side region SP2, for example, the noise current at the position indicated by the region C2 in FIG. 3A flows from the conductive layer 30 in the hinge side region SP2 to the hinge side rib 29a side. , Flows to the ground pattern layer 27 in contact with the end face 29c of the rib 29, and flows to the conductive layer 30 in the substrate side region SP1 via the conductive layer 30 of the notch 29d, and passes through the tab 35 to the ground. It flows to the pattern layer 27. The notch 29d is not in contact with the substrate 25, or even if it contacts the substrate 25 due to elastic deformation or the like of the substrate 25, the frequency of contact is lower than the end surface 29c around the notch 29d. The possibility of peeling due to vibration or the like is lower than that of the surrounding end face 29c. Therefore, the noise current in the hinge side region SP2 can be surely passed from the hinge side region SP2 side to the substrate side region SP1 side, and further to the ground pattern layer 27.

  In addition, it is preferable not to make the level | step difference d1 of the notch part 29d too large so that the shielding effect in board | substrate side area | region SP1 may not fall. The step d1 needs to be set appropriately in consideration of the wavelength of noise to be cut off by the hinge-side rib 29a. However, in the case of a mobile phone, the step d1 is in the range of 0.05 to 0.2 mm as described above. From experience, the shielding effect of the substrate-side region SP1 does not deteriorate so much.

  The conductive layer 30 in the substrate side region SP1 and the conductive layer 30 in the hinge side region SP2 are connected by the conductive layer 30 formed in the space 36, and the space 36 is formed in the end surface 29c of the hinge side rib 29a. Since it is constituted by the notch 29d, it is easier to form a void and provide a conductive material to the void as compared with a case where a hole is formed in the hinge side rib 29a to form a void. It is also easy to form a conductive layer by adhering.

  Since the ridge 29e between the surface constituting the notch 29d and the wall surface 29b of the hinge-side rib 29a has a corner R, it is easy to form the conductive layer 30 with a uniform thickness. That is, if the ridge 29e has a corner, the conductive material does not adhere to the corner and there is a risk that conduction may be hindered, but there is no such risk.

  In the above embodiment, the mobile phone 1 is an example of the electronic device of the present invention, the substrate side area SP1 is an example of the first area of the present invention, and the hinge side area SP2 is the second area of the present invention. The ground pattern layer 27 is an example of the reference potential portion of the present invention, and the tab 35 is an example of the conducting member of the present invention.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  For example, in the present embodiment, the hinge side region SP2 inside the support portion 11 outside the second mounting surface 25b of the substrate 25 is set as the second region, but the present invention is not limited to this, for example, the substrate mounting surface The upper region may be used. By doing in this way, the noise current in the second region is formed through the end face of the rib or in the second region and the rib, as described above, without providing a conducting member in the second region. Since it can be made to conduct to the reference potential part via the conducting member provided in the first region that is continuously electrically conducted through the void, the noise current can be reliably transmitted to the reference potential part. In addition to being able to escape, the number of parts can be reduced. In addition, it is difficult or impossible to provide a conductive member in the second region due to a problem in board mounting, and the noise current in the region is released to the reference potential portion in the region. This is particularly effective when it is difficult or impossible.

  The electronic apparatus of the present invention is not limited to a mobile phone as long as it includes a substrate and a housing. For example, a digital camera or a notebook computer may be used. The voids provided in the rib are not limited to those formed by notches formed on the rib end surface. For example, the void may be a hole formed in the rib.

1 is an external perspective view showing a mobile phone according to an embodiment of the present invention. The figure which shows a part of transmission frame of the mobile telephone of FIG. The figure which shows the connection part vicinity of the transmission housing | casing of the mobile telephone of FIG. The figure explaining the conduction | electrical_connection method vicinity of the connection part of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mobile phone (electronic device), 2 ... Reception housing, 3 ... Transmission housing, 25 ... Substrate, 25b ... Second mounting surface, 29 ... Rib, 30 ... Conductive layer, SP1 ... Substrate side region (first 1 region), SP2 hinge region (second region), 27 ground pattern layer (reference potential portion), 35 tab (conducting member), 36 space.

Claims (4)

A housing,
A substrate housed in the housing;
With
On the inner surface of the housing on the side facing the mounting surface of the substrate, a rib that contacts the mounting surface is provided so as to partition the inside of the housing into a first region and a second region, A conductive layer is formed from the first region to the second region;
In the first region, a conductive member that conducts the reference potential portion of the substrate and the conductive layer is provided,
The rib is provided with a space that communicates the first region and the second region,
The electronic device, wherein the conductive layer is formed continuously from the first region to the second region through the void. The first region is a region on the mounting surface of the substrate;
The electronic device according to claim 1, wherein the second region is a region outside the mounting surface of the substrate. The void is a gap formed between the rib and the mounting surface by forming a notch in a rib end surface that contacts the mounting surface of the rib. The electronic device as described in. The electronic device according to any one of claims 1 to 3, wherein a ridge portion between a surface on which the conductive layer is formed and a wall surface of the rib among the formation surfaces of the voids is a curved surface.

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