JP2007296379A - Printed wiring board for game machine - Google Patents

Printed wiring board for game machine Download PDF

Info

Publication number
JP2007296379A
JP2007296379A JP2007189543A JP2007189543A JP2007296379A JP 2007296379 A JP2007296379 A JP 2007296379A JP 2007189543 A JP2007189543 A JP 2007189543A JP 2007189543 A JP2007189543 A JP 2007189543A JP 2007296379 A JP2007296379 A JP 2007296379A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
board
gaming machine
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007189543A
Other languages
Japanese (ja)
Inventor
Shuichi Kobayashi
修一 小林
Hiroshi Takahashi
寛 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heiwa Corp
Original Assignee
Heiwa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heiwa Corp filed Critical Heiwa Corp
Priority to JP2007189543A priority Critical patent/JP2007296379A/en
Publication of JP2007296379A publication Critical patent/JP2007296379A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Pinball Game Machines (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To make an identification mark easily visible when a printed wiring board is attached to a game machine. <P>SOLUTION: Identification marks 2c, 3c, 4c and 5c indicating a game machine manufacturer, identification marks 2d, 3d, 4d and 5d indicating a printed wiring board manufacturer and identification marks 2e, 3e, 4d and 5d indicating the kind of the printed wiring board are provided on the board surfaces of the printed wiring boards 2a-5a by the same material as printed wires 19-22, and the printed wiring boards 2a-5a or a case housing the printed wiring boards 2a-5a is attached to the back part of the game machine 1 so that the identification marks 2c-5c, 2d-5d and 2e-5e are visible from the back part of the game machine 1. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、プリント配線基板が遊技機に取り付けられた場合、識別標識が容易に視認できる遊技機用プリント配線基板に関する。   The present invention relates to a printed wiring board for gaming machines in which an identification mark can be easily visually recognized when the printed wiring board is attached to a gaming machine.

遊技機の背部には、端子板、中継基板、遊技制御回路、枠制御回路等を個別に形成する複数のプリント配線基板が設けられている。それらのプリント配線基板にそれの種類を表す識別標識を付すことは周知である。
特開平10−215041号公報
A plurality of printed wiring boards that individually form terminal boards, relay boards, game control circuits, frame control circuits, and the like are provided on the back of the gaming machine. It is well known to attach an identification mark indicating the type of the printed wiring board.
JP-A-10-215041

しかし、従来の識別標識は、プリント配線基板の種類を表すだけであると共に、プリント配線基板に塗布されたソルダーレジストの表面に印刷又は捺印した形態である。このため、プリント配線基板が組み込まれたパチンコ機のような遊技機を遊技店に設置した後において、プリント配線基板に実装された電気的な機能部品を不正品に交換する際、上記識別標識を払拭により消去する不正行為を受けやすい。又、遊技店から使用済み遊技機として破棄された廃棄台は、各地の自治体のごみ処理行政に委ねられており、或る自治体では事業所から出される事業系一般廃棄物として扱われたり、別の自治体では産業廃棄物として扱われている。それから、廃棄台が熱硬化合成樹脂、熱可塑性合成樹脂、木材、鉄系金属、非鉄系金属、ガラス、電子回路、電線等の種々雑多な材料で構成されており、廃棄台の解体処理に莫大な費用を要することから、中小都市では廃棄台を或る程度解体してからごみ処理場に持ち込むように行政指導している。このようなことから、廃棄台の集荷業者や産業廃棄物業者の内で、少数の心ない業者が解体処理に費用を掛けずに野積み状態に不法投棄する場合、その不法投棄品から投棄者を特定しにくくするために、上記識別標識を払拭消去することがある。   However, the conventional identification mark only represents the type of the printed wiring board and is printed or stamped on the surface of the solder resist applied to the printed wiring board. For this reason, after installing a gaming machine such as a pachinko machine in which a printed wiring board is incorporated in an amusement store, when replacing an electrical functional component mounted on the printed wiring board with a fraudulent product, the above identification mark is used. Susceptible to fraud that is erased by wiping. In addition, disposal tables discarded as used gaming machines from amusement stores are entrusted to the local governments' waste disposal administration. Are treated as industrial waste in local governments. In addition, the disposal table is composed of various materials such as thermosetting synthetic resin, thermoplastic synthetic resin, wood, ferrous metal, non-ferrous metal, glass, electronic circuit, electric wire, etc. Because of the high cost, administrative guidance is given in small and medium-sized cities to dismantle the disposal table to some extent and then bring it to the landfill. For this reason, when a small number of unsavvy contractors out of the collection platform or industrial waste traders dispose of illegally dumping in an unstacked state without incurring costs for dismantling, the illegal dumped goods are discarded. In order to make it difficult to specify the identification mark, the identification mark may be wiped off.

本発明に係る遊技機用プリント配線基板は、製造者や種別の表す識別標識が遊技機に設けられるプリント配線基板の基板面にプリント配線と同材料により設けられ、識別標識が遊技機の背部より視認可能となるように、プリント配線基板が遊技機の背部に取り付けられたか、または、製造者や種別の表す識別標識が遊技機に設けられるプリント配線基板の基板面にプリント配線と同材料により設けられ、プリント配線基板が透視性を有するケースに収納され、識別標識が遊技機の背部より視認可能となるように、ケースが遊技機の背部に取り付けられたことを最も主要な特徴とする。プリント配線基板の基板面にはプリント配線を覆うソルダーレジストが設けられ、ソルダーレジストには識別標識を露出する窓が設けられたり、または、識別標識がプリント配線に同化されたり、または、プリント配線基板が枠情報外部端子板または遊技板情報外部端子板または遊技制御回路または枠制御回路を構成したりするものであってもよい。   The printed wiring board for a gaming machine according to the present invention is provided with an identification mark representing the manufacturer or type on the board surface of the printed wiring board provided on the gaming machine using the same material as the printed wiring, and the identification mark is formed from the back of the gaming machine The printed wiring board is attached to the back of the gaming machine so that it can be seen, or an identification mark indicating the manufacturer or type is provided on the board surface of the printed wiring board provided on the gaming machine with the same material as the printed wiring. The main feature is that the case is attached to the back of the gaming machine so that the printed wiring board is housed in a transparent case and the identification mark is visible from the back of the gaming machine. A solder resist covering the printed wiring is provided on the substrate surface of the printed wiring board, and a window for exposing the identification mark is provided on the solder resist, or the identification sign is assimilated into the printed wiring, or the printed wiring board. May constitute a frame information external terminal board, a game board information external terminal board, a game control circuit, or a frame control circuit.

本発明に係る遊技機用プリント配線基板は、プリント配線基板が遊技機の背部に取り付けられた状態において、識別標識が機能部品と同様に容易に視認できるという利点がある。   The printed wiring board for gaming machines according to the present invention has an advantage that the identification mark can be easily visually recognized in the same manner as the functional component in a state where the printed wiring board is attached to the back of the gaming machine.

図1〜図4は第1実施形態であって、図1が遊技機1の背面を示し、図2が電気的な機能部品11〜15を実装したプリント配線基板10の外観を示し、図3がエッチング工程が終了したプリント配線基板10の部品側面を平面的に示し、図4がエッチング工程が終了したプリント配線基板10の半田側面を平面的に示す。   1 to 4 show the first embodiment, FIG. 1 shows the back of the gaming machine 1, FIG. 2 shows the appearance of the printed wiring board 10 on which the electrical functional components 11 to 15 are mounted, and FIG. FIG. 4 is a plan view showing the component side surface of the printed wiring board 10 after the etching process is completed, and FIG. 4 is a plan view showing the solder side surface of the printed wiring board 10 after the etching process is completed.

図1に示すように、この実施形態の遊技機1は、背部に、枠情報外部端子板2、遊技板情報外部端子板3、遊技制御回路4、枠制御回路5、タンクセット6、賞球払出機構7、球発射駆動機構8、流し9等の各種の遊技機能部品を有する。これらの遊技機能部品のうちで、枠情報外部端子板2、遊技板情報外部端子板3、遊技制御回路4、枠制御回路5は、それぞれに対応して個別に形成されたプリント配線基板2a,3a,4a,5aに、コネクター、ヒューズ、スイッチ、発光ダイオード、リレー、ハイブリッドIC、マイクロコンピューター、ROM、RAM等のうちの幾つかの必要な電気的な機能部品2b,3b,4b,5bを実装している。これらのプリント配線基板2a〜5aの基板面には、遊技機製造者を表す識別標識2c,3c,4c,5c、プリント配線基板製造者を表す識別標識2d,3d,4d,5d、プリント配線基板の種別を表す識別標識2e,3e,4e,5eを、後述のプリント配線19〜22と同材料により直接的に設けている。これらの識別標識2c〜5c,2d〜5d,2e〜5eは、実装された機能部品2b〜5bで覆われず、各プリント配線基板2a〜5aが枠情報外部端子板2、遊技板情報外部端子板3、遊技制御回路4、枠制御回路5として遊技機1の背部に取り付けられた形態において、遊技機1の背部より視認可能な位置に配置されている。   As shown in FIG. 1, the gaming machine 1 of this embodiment has a frame information external terminal board 2, a game board information external terminal board 3, a game control circuit 4, a frame control circuit 5, a tank set 6, a prize ball on the back. It has various game function parts such as a payout mechanism 7, a ball launch drive mechanism 8, and a sink 9. Among these game functional components, the frame information external terminal board 2, the game board information external terminal board 3, the game control circuit 4, and the frame control circuit 5 are printed wiring boards 2a, 3a, 4a, 5a are equipped with some necessary electrical functional parts 2b, 3b, 4b, 5b among connectors, fuses, switches, light emitting diodes, relays, hybrid ICs, microcomputers, ROM, RAM, etc. is doing. On the printed circuit boards 2a to 5a, there are identification signs 2c, 3c, 4c, 5c representing the gaming machine manufacturer, identification signs 2d, 3d, 4d, 5d representing the printed wiring board manufacturer, and the printed wiring board. The identification marks 2e, 3e, 4e, and 5e representing the types of these are directly provided by the same material as the printed wirings 19 to 22 described later. These identification marks 2c to 5c, 2d to 5d, and 2e to 5e are not covered with the mounted functional parts 2b to 5b, and the printed wiring boards 2a to 5a are frame information external terminal board 2, game board information external terminals. In a form in which the board 3, the game control circuit 4, and the frame control circuit 5 are attached to the back of the gaming machine 1, the board 3, the game control circuit 4, and the frame control circuit 5 are arranged at positions that are visible from the back of the gaming machine 1.

図2において、前記プリント配線基板2a〜5aの何れかに相当する1つのプリント配線基板の例としてプリント配線基板10を図示して説明する。プリント配線基板10は、その基板面の1つとしての部品側面に、前記機能部品2b〜5bに相当する複数の機能部品11,12,13,14,15を実装している。又、同部品側面には、前記各識別標識2c〜5c,2d〜5d,2e〜5eに相当する遊技機製造者を表す識別標識16、プリント配線基板製造者を表す識別標識17、プリント配線基板の種別を表す識別標識18、プリント配線19,20,21,22をエッチングにより、直接的に形成している。これらの識別標識16〜18及びプリント配線19〜22は、プリント配線基板10の基板面に塗布された半透明のように透視可能なソルダーレジスト23,24で覆われている。又、部品側面のソルダーレジスト23の表面には、機能部品11〜15の取付位置外形図25,26,27,28,29をシルク印刷により白色系塗料で印刷している。プリント配線基板10の角部には、プリント配線基板10を遊技機1に取り付ける際に使用する貫通孔30を備える。   In FIG. 2, a printed wiring board 10 is illustrated and described as an example of one printed wiring board corresponding to any of the printed wiring boards 2a to 5a. The printed wiring board 10 has a plurality of functional components 11, 12, 13, 14, and 15 corresponding to the functional components 2b to 5b mounted on a component side surface as one of the substrate surfaces. Also, on the side surface of the component, an identification mark 16 representing a gaming machine manufacturer corresponding to each of the identification marks 2c-5c, 2d-5d, 2e-5e, an identification mark 17 representing a printed wiring board manufacturer, a printed wiring board The identification mark 18 indicating the type of the printed circuit board and the printed wirings 19, 20, 21, and 22 are directly formed by etching. The identification marks 16 to 18 and the printed wirings 19 to 22 are covered with solder resists 23 and 24 that can be seen through like a semi-transparent coating applied to the surface of the printed wiring board 10. Also, on the surface of the solder resist 23 on the side surface of the part, outline diagrams 25, 26, 27, 28, and 29 of attachment positions of the functional parts 11 to 15 are printed with white paint by silk printing. The corners of the printed wiring board 10 are provided with through holes 30 that are used when the printed wiring board 10 is attached to the gaming machine 1.

図3において、プリント配線基板10は、エッチング工程が終了したが、ソルダーレジストを塗布する前の形態であって、その部品側面には、各識別標識16〜18、各プリント配線19〜22、図2に示す機能部品11〜15より外側に突出した図外の端子や取付足を結合するための中抜き形態のパッド31,32,33,34,35,36,37,38,39,40,41,42,43,44,45,46を備える。この実施形態では、パッド31〜34を機能部品11に対応させ、パッド35〜37を機能部品12に対応させ、パッド38〜40を機能部品13に対応させ、パッド41〜43を機能部品14に対応させ、パッド44〜46を機能部品15に対応させている。又、パッド34とパッド38とをプリント配線19で接続し、パッド32とパッド40とをプリント配線20で接続し、パッド36とパッド41とをプリント配線21で接続し、パッド37はアースとして使用するプリント配線22に接続している。   In FIG. 3, the printed wiring board 10 is in a form before the soldering resist is applied, after the etching process is finished, and on each side of the component, each identification mark 16 to 18, each printed wiring 19 to 22, FIG. Pads 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, which are connected to unillustrated terminals and mounting feet protruding outward from the functional components 11 to 15 shown in FIG. 41, 42, 43, 44, 45, 46 are provided. In this embodiment, the pads 31 to 34 correspond to the functional component 11, the pads 35 to 37 correspond to the functional component 12, the pads 38 to 40 correspond to the functional component 13, and the pads 41 to 43 correspond to the functional component 14. The pads 44 to 46 are made to correspond to the functional component 15. Further, the pad 34 and the pad 38 are connected by the printed wiring 19, the pad 32 and the pad 40 are connected by the printed wiring 20, the pad 36 and the pad 41 are connected by the printed wiring 21, and the pad 37 is used as the ground. Connected to the printed wiring 22.

図4において、プリント配線基板10は、エッチング工程が終了したが、ソルダーレジストを塗布する前の形態であって、その半田側面には、プリント配線基板10の種別を表す識別標識47、複数のプリント配線48,49,50,51,52、図3に示すパッド31〜46に対応するパッド53〜69、貫通孔30の周囲のアース用のパッド70を備える。この実施形態では、パッド53とパッド69とをプリント配線48で接続し、パッド55とパッド68とをプリント配線49で接続し、パッド66とパッド67とをプリント配線50で接続し、パッド62とパッド65とをプリント配線51で接続し、パッド56とパッド58とをプリント配線52で接続している。   In FIG. 4, the printed wiring board 10 is in a form before the soldering resist is applied after the etching process is finished. On the solder side surface, an identification mark 47 indicating the type of the printed wiring board 10 and a plurality of printed wiring boards 10 are provided. Wirings 48, 49, 50, 51, 52, pads 53 to 69 corresponding to the pads 31 to 46 shown in FIG. 3, and a grounding pad 70 around the through hole 30 are provided. In this embodiment, the pad 53 and the pad 69 are connected by the printed wiring 48, the pad 55 and the pad 68 are connected by the printed wiring 49, the pad 66 and the pad 67 are connected by the printed wiring 50, and the pad 62 is connected. The pad 65 is connected by the printed wiring 51, and the pad 56 and the pad 58 are connected by the printed wiring 52.

ここで、プリント配線基板10の作り方を説明する。先ず、ガラス・エポキシのような合成樹脂からなる基板の両面の全面に敷設された銅箔のような導電層の全面にエッチングレジストを塗布する。そして、エッチングレジストにレジストパターンを焼き付ける。このレジストパターンを焼き付ける際、部品側面には、図3に示す部品側面の識別標識16〜18とプリント配線19〜22及びパッド31〜46のそれぞれに対応するレジストパターンを使用する。又、半田側面には、図4に示す半田側面の識別標識47とプリント配線48〜52及びパッド53〜70に対応するレジストパターンを使用する。それから、部品側面・半田側面の双方の識別標識16〜18,47とプリント配線19〜22,48〜52及びパッド31〜46,53〜70に対応する以外のエッチングレジストを除去する。その後、エッチングレジストより露出した導電層をエッチング溶液によりプリント配線基板10の基板面が露出するまで除去する。このエッチングにより、プリント配線基板10が、図3に示すように部品側面に識別標識16〜18とプリント配線19〜22及びパッド31〜46を有し、図4に示すように半田側面に識別標識47とプリント配線48〜52及びパッド53〜70を有する。   Here, how to make the printed wiring board 10 will be described. First, an etching resist is applied to the entire surface of a conductive layer such as a copper foil laid on both surfaces of a substrate made of a synthetic resin such as glass / epoxy. Then, a resist pattern is baked on the etching resist. When this resist pattern is baked, resist patterns corresponding to the component side identification marks 16 to 18, the printed wirings 19 to 22 and the pads 31 to 46 shown in FIG. Further, the resist pattern corresponding to the solder side identification mark 47, the printed wirings 48 to 52, and the pads 53 to 70 shown in FIG. Then, etching resists other than those corresponding to the identification marks 16 to 18 and 47 on both the component side surface and the solder side surface, the printed wirings 19 to 22 and 48 to 52, and the pads 31 to 46 and 53 to 70 are removed. Thereafter, the conductive layer exposed from the etching resist is removed with an etching solution until the substrate surface of the printed wiring board 10 is exposed. By this etching, the printed wiring board 10 has identification marks 16 to 18, printed wirings 19 to 22, and pads 31 to 46 on the component side as shown in FIG. 3, and identification marks on the solder side as shown in FIG. 4. 47, printed wiring 48-52 and pads 53-70.

次に、パッド31〜46,53〜69の中抜き部分に、プリント配線基板10の部品側面又は半田側面の一方よりスルーホールをあける。又、パッド70の部分に貫通孔30をあける。そして、プリント配線基板10の部品側及び半田側面の半田を盛る以外の部分、即ち、スルーホール及びパッド31〜46,53〜70の以外の部分にソルダーレジストを塗布する。それから、プリント配線基板10の部品側面のソルダーレジストの表面に図2に示す機能部品11〜15の取付位置外形図25〜29を印刷する。その後、機能部品11〜15の端子をプリント配線基板10の部品側面よりスルーホールに挿入することにより、プリント配線基板10の部品側面に記された取付位置外形図25〜29に応じて、機能部品11〜15をプリント配線基板10の部品側面に搭載する。更に、プリント配線基板10の半田側面を半田装置の溶融半田の液面に浸けて半田を付ける。この半田付けにより、半田がプリント配線基板のソルダーレジストで覆われていない部分のパッド53〜70に付くと共に、半田がスルーホールにも侵入してパッド31〜46に付くと共に機能部品11〜15の端子をパッド31〜46,53〜69に結合する。又、プリント配線基板10の半田側面に図外の機能部品を搭載する場合には、上記部品側面への機能部品11〜15の半田付けの終了後に、上記図外の機能部品の端子をプリント配線基板10の半田側面よりスルーホールに挿入し、当該端子が突出したプリント配線基板10の部品側面のパッドに半田を半田鏝により付ける。この半田付けにより、半田がパッドに付くと共にスルーホールにも侵入して図外の機能部品の端子をパッドに結合する。   Next, through holes are formed in the hollow portions of the pads 31 to 46 and 53 to 69 from one of the component side surface and the solder side surface of the printed wiring board 10. Further, a through hole 30 is formed in the pad 70 portion. Then, a solder resist is applied to portions other than the solder on the component side and the solder side surface of the printed wiring board 10, that is, portions other than the through holes and the pads 31 to 46 and 53 to 70. Then, the mounting position outline diagrams 25 to 29 of the functional components 11 to 15 shown in FIG. 2 are printed on the surface of the solder resist on the component side surface of the printed wiring board 10. After that, by inserting the terminals of the functional components 11 to 15 into the through holes from the component side surface of the printed wiring board 10, the functional components according to the mounting position outline drawings 25 to 29 described on the component side surface of the printed wiring board 10. 11 to 15 are mounted on the component side surface of the printed wiring board 10. Further, the solder side surface of the printed wiring board 10 is dipped in the molten solder liquid surface of the soldering device to apply solder. By this soldering, the solder attaches to the pads 53 to 70 of the printed wiring board that are not covered with the solder resist, and the solder also enters the through holes and attaches to the pads 31 to 46 and the functional components 11 to 15. Terminals are coupled to pads 31-46, 53-69. Further, when mounting a functional component not shown on the solder side surface of the printed wiring board 10, after the soldering of the functional components 11 to 15 on the component side surface is finished, the terminals of the functional component not shown in the drawing are printed. It inserts into the through hole from the solder side surface of the substrate 10, and solder is applied to the pad on the side surface of the component of the printed wiring board 10 from which the terminal protrudes with a soldering iron. By this soldering, the solder attaches to the pad and also penetrates into the through hole, thereby coupling the terminal of the functional component (not shown) to the pad.

この第1実施形態の構造によれば、図1に示すように、遊技機1の背部にプリント配線基板2a〜5aを取り付けた状態において、識別標識2c〜5c,2d〜5d,2e〜5eが遊技機1の背部より視認可能な位置に設けられたので、遊技機1を遊技店に設置した後において、遊技機1を開き、その背部より識別標識2c〜5c,2d〜5d,2e〜5eを確認して不正の有無を検査することができる。   According to the structure of the first embodiment, as shown in FIG. 1, in the state where the printed wiring boards 2a to 5a are attached to the back of the gaming machine 1, the identification signs 2c to 5c, 2d to 5d, and 2e to 5e are provided. Since it is provided at a position that can be seen from the back of the gaming machine 1, after the gaming machine 1 is installed in the game shop, the gaming machine 1 is opened and identification signs 2c to 5c, 2d to 5d, and 2e to 5e from the back. Can be inspected for fraud.

図2に示すように、プリント配線基板10の部品側面に識別標識16〜18をエッチングによりプリント配線19〜22と同材料により直接的に設けたので、ソルダーレジスト23,24を削り落としても、識別標識16〜18をプリント配線基板10より払拭することができず、不正行為を受けにくい。しかも、使用済み遊技機1の不法投棄品の識別標識16〜18から投棄者を特定しやすくなる。又、識別標識16〜18をプリント配線基板10に実装した機能部品11〜15の非配置位置に設けたので、プリント配線基板10に機能部品11〜15を実装した形態において、識別標識16〜18を機能部品11〜15と同様に容易に視認して不正の有無を検査することができる。   As shown in FIG. 2, since the identification marks 16 to 18 are directly provided on the side surfaces of the printed wiring board 10 by the same material as the printed wirings 19 to 22 by etching, even if the solder resists 23 and 24 are scraped off, The identification signs 16 to 18 cannot be wiped from the printed wiring board 10 and are not easily subjected to fraud. Moreover, it becomes easy to identify the dumper from the identification marks 16 to 18 of the illegally dumped items of the used gaming machine 1. Further, since the identification marks 16 to 18 are provided at the non-arranged positions of the functional components 11 to 15 mounted on the printed wiring board 10, the identification marks 16 to 18 are mounted in the form in which the functional components 11 to 15 are mounted on the printed wiring board 10. As with the functional components 11 to 15, the presence or absence of fraud can be inspected easily.

又、図3及び図4に示すように、識別標識16〜18,47をプリント配線基板10の部品側面及び半田側面の双方に設けたので、プリント配線基板10が遊技機1に取り付けられた状態において、遊技機1の背部より部品側面の識別標識16〜18を消去したとしても、半田側面の識別標識47でプリント配線基板10の種類を特定し、遊技機1の製造者を特定する、二重安全性を発揮できる。   Further, as shown in FIGS. 3 and 4, since the identification marks 16 to 18 and 47 are provided on both the component side surface and the solder side surface of the printed wiring board 10, the printed wiring board 10 is attached to the gaming machine 1. In this case, even if the identification marks 16 to 18 on the side surface of the component are deleted from the back of the gaming machine 1, the type of the printed wiring board 10 is identified by the identification mark 47 on the solder side surface, and the manufacturer of the gaming machine 1 is identified. Heavy safety can be demonstrated.

又、図2に示すように、プリント配線基板10の部品側面のソルダーレジスト23の上に取付位置外形図25〜29を印刷したので、取付位置外形図25〜29より機能部品11〜15の正否を容易に確認することができ、しかも、ソルダーレジスト23を削り落として、取付位置外形図25〜29をプリント配線基板10より払拭した場合、その払拭した部分の機能部品が不正品であると確認することができる。結果として、不正行為を受けにくい。   Further, as shown in FIG. 2, since the mounting position outline diagrams 25 to 29 are printed on the solder resist 23 on the side surface of the printed wiring board 10, the correctness of the functional components 11 to 15 is determined from the mounting position outline diagrams 25 to 29. In addition, when the solder resist 23 is scraped off and the mounting position outline drawings 25 to 29 are wiped from the printed wiring board 10, it is confirmed that the functional parts in the wiped portion are illegal products. can do. As a result, it is less susceptible to cheating.

又、識別標識16〜18,47をエッチングにより形成したので、識別標識16〜18,47をプリント配線19〜22,48〜52及びパッド31〜46,53〜70の形成と同時に形成することができ、しかも、真空蒸着のような方法に比べて、識別標識16〜18,47を容易に形成することができる。   Further, since the identification marks 16-18, 47 are formed by etching, the identification marks 16-18, 47 can be formed simultaneously with the formation of the printed wirings 19-22, 48-52 and the pads 31-46, 53-70. Moreover, the identification marks 16 to 18 and 47 can be easily formed as compared with a method such as vacuum deposition.

図5は第2実施形態のプリント配線基板10の外観を示し、この第2実施形態では、プリント配線基板10のソルダーレジスト23に識別標識16〜18を露出する窓71を形成し、この窓71により識別標識16〜18をより確認しやすくすることができる。   FIG. 5 shows the appearance of the printed wiring board 10 of the second embodiment. In the second embodiment, a window 71 exposing the identification marks 16 to 18 is formed in the solder resist 23 of the printed wiring board 10. Thus, the identification marks 16 to 18 can be more easily confirmed.

図6は第3実施形態のプリント配線基板10の外観を示し、この第2実施形態では、前記プリント配線19〜22,48〜52に相当するプリント配線72に、前記識別標識16〜18,47に相当する識別標識73を同化させ、この同化により識別標識73の設置スペースを少なくして、プリント配線基板10における機能部品11〜15の実装密度を向上することができる。   FIG. 6 shows the appearance of the printed wiring board 10 of the third embodiment. In the second embodiment, the identification marks 16-18, 47 are placed on the printed wiring 72 corresponding to the printed wirings 19-22, 48-52. Can be assimilated, and the assimilation can reduce the installation space of the identification mark 73 and improve the mounting density of the functional components 11 to 15 on the printed wiring board 10.

尚、図1では、プリント配線基板2a〜5aを剥き出したまま遊技機1に取り付けた形態を図示したが、プリント配線基板2a〜5aを図外のケースに収納し、そのケースを遊技機1に取り付けることも考えられるが、この場合、ケースの裏面側又は全体を透明や半透明等のように透視性として形成し、プリント配線基板2a〜5aの識別標識2c〜5c,2d〜5d,2e〜5eが遊技機1の背部よりケースを通して見えるようにしてもよい。   In FIG. 1, the printed wiring boards 2 a to 5 a are illustrated as being attached to the gaming machine 1, but the printed wiring boards 2 a to 5 a are stored in a case outside the figure, and the case is attached to the gaming machine 1. In this case, the back side or the whole of the case is formed to be transparent such as transparent or translucent, and the identification marks 2c to 5c, 2d to 5d, and 2e to the printed wiring boards 2a to 5a are formed. 5e may be seen from the back of the gaming machine 1 through the case.

第1実施形態の遊技機を示す背面図。The rear view which shows the game machine of 1st Embodiment. 第1実施形態のプリント配線基板の斜視図。The perspective view of the printed wiring board of a 1st embodiment. 第1実施形態のプリント配線基板の部品側面を示す平面図。The top view which shows the components side surface of the printed wiring board of 1st Embodiment. 第1実施形態のプリント配線基板の半田側面を示す平面図。The top view which shows the solder side surface of the printed wiring board of 1st Embodiment. 第2実施形態のプリント配線基板の斜視図。The perspective view of the printed wiring board of 2nd Embodiment. 第3実施形態のプリント配線基板の斜視図。The perspective view of the printed wiring board of 3rd Embodiment.

符号の説明Explanation of symbols

1 遊技機
2a〜5a,10 プリント配線基板
2b〜5b,11〜15 機能部品
2c〜5c,2d〜5d,2e〜5e,16〜18,47,73 識別標識
19〜22,48〜52,72 プリント配線
1 gaming machines 2a-5a, 10 printed wiring boards 2b-5b, 11-15 functional components 2c-5c, 2d-5d, 2e-5e, 16-18, 47, 73 identification signs 19-22, 48-52, 72 Printed wiring

Claims (5)

製造者や種別の表す識別標識がプリント配線基板の基板面にプリント配線と同材料により設けられ、識別標識が遊技機の背部より視認可能となるように、プリント配線基板が遊技機の背部に取り付けられたことを特徴とする遊技機用プリント配線基板。   The printed circuit board is attached to the back of the gaming machine so that the identification mark indicating the manufacturer and type is provided on the printed circuit board with the same material as the printed wiring, and the identification mark is visible from the back of the gaming machine. A printed wiring board for a gaming machine, characterized by 製造者や種別の表す識別標識がプリント配線基板の基板面にプリント配線と同材料により設けられ、プリント配線基板が透視性を有するケースに収納され、識別標識が遊技機の背部より視認可能となるように、ケースが遊技機の背部に取り付けられたことを特徴とする遊技機用プリント配線基板。   An identification mark indicating the manufacturer and type is provided on the printed circuit board by the same material as the printed wiring, and the printed wiring board is housed in a transparent case so that the identification mark can be seen from the back of the gaming machine. Thus, a printed wiring board for a gaming machine, wherein the case is attached to the back of the gaming machine. プリント配線基板の基板面にはプリント配線を覆うソルダーレジストが設けられ、ソルダーレジストには識別標識を露出する窓が設けられたことを特徴とする請求項1または請求項2記載の遊技機用プリント配線基板。   3. The game machine print according to claim 1, wherein a solder resist covering the printed wiring is provided on a surface of the printed wiring board, and a window for exposing the identification mark is provided on the solder resist. Wiring board. 識別標識がプリント配線に同化されたことを特徴とする請求項1または請求項2記載の遊技機用プリント配線基板。   The printed wiring board for gaming machines according to claim 1 or 2, wherein the identification mark is assimilated to the printed wiring. プリント配線基板が枠情報外部端子板または遊技板情報外部端子板または遊技制御回路または枠制御回路を構成したことを特徴とする請求項1または請求項2記載の遊技機用プリント配線基板。   3. The printed wiring board for gaming machines according to claim 1, wherein the printed wiring board comprises a frame information external terminal board, a game board information external terminal board, a game control circuit, or a frame control circuit.
JP2007189543A 2007-07-20 2007-07-20 Printed wiring board for game machine Pending JP2007296379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007189543A JP2007296379A (en) 2007-07-20 2007-07-20 Printed wiring board for game machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007189543A JP2007296379A (en) 2007-07-20 2007-07-20 Printed wiring board for game machine

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP21495497A Division JPH1147356A (en) 1997-08-08 1997-08-08 Printed wiring board for game machine and identification mark forming method therefor

Publications (1)

Publication Number Publication Date
JP2007296379A true JP2007296379A (en) 2007-11-15

Family

ID=38766328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007189543A Pending JP2007296379A (en) 2007-07-20 2007-07-20 Printed wiring board for game machine

Country Status (1)

Country Link
JP (1) JP2007296379A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6337692A (en) * 1986-07-31 1988-02-18 日本電気株式会社 Multilayer interconnection board
JPH05131049A (en) * 1991-02-20 1993-05-28 Sophia Co Ltd Control board storage case for pachinko game machine
JPH05160577A (en) * 1991-04-25 1993-06-25 Matsushita Electric Works Ltd Case in which printed board is mounted

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6337692A (en) * 1986-07-31 1988-02-18 日本電気株式会社 Multilayer interconnection board
JPH05131049A (en) * 1991-02-20 1993-05-28 Sophia Co Ltd Control board storage case for pachinko game machine
JPH05160577A (en) * 1991-04-25 1993-06-25 Matsushita Electric Works Ltd Case in which printed board is mounted

Similar Documents

Publication Publication Date Title
CN102917550B (en) With addition process manufacture circuit board method and with the method obtain circuit board and multilayer circuit board
TWI233323B (en) Circuit board with identifiable information and method for fabricating the same
JP2007260460A (en) Printed wiring board for game machine
JPH1147356A (en) Printed wiring board for game machine and identification mark forming method therefor
JP2019180621A5 (en)
EP1195776A3 (en) Wiring boards and processes for manufacturing wiring boards
JP2007296380A (en) Printed wiring board for game machine
JP2012099670A (en) Mounting substrate
JPH07321442A (en) Parts number indication method of printed wiring board
JP2007260461A (en) Printed wiring board for game machine
JP2007296379A (en) Printed wiring board for game machine
US7498521B2 (en) Method and apparatus for marking a printed circuit board
JP3513569B2 (en) Flexible printed circuit board and method of manufacturing the same
US20040012936A1 (en) Device and method for enclosure of electronic printed circuit board based products
JP2003000912A (en) Game machine
JP2000031611A (en) Structure of circuit board for electronic device
KR100315073B1 (en) Circuit board
JPH04303988A (en) Printed wiring board
US20130240254A1 (en) Printed circuit board and method for manufacturing printed circuit board
US20060087031A1 (en) Assembly and method
JPH05167219A (en) Substrate printing method
JPH11128495A (en) Mounting board device for game machine
JPH0637499A (en) Method of inspecting electronic parts on board, and circuit board
JP2006319006A (en) Printed circuit board, and manufacturing method therefor
JPH0520359U (en) Printed circuit board

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Effective date: 20100907

Free format text: JAPANESE INTERMEDIATE CODE: A131

A02 Decision of refusal

Effective date: 20110201

Free format text: JAPANESE INTERMEDIATE CODE: A02