JP2007281104A - Component mounting system - Google Patents

Component mounting system Download PDF

Info

Publication number
JP2007281104A
JP2007281104A JP2006103723A JP2006103723A JP2007281104A JP 2007281104 A JP2007281104 A JP 2007281104A JP 2006103723 A JP2006103723 A JP 2006103723A JP 2006103723 A JP2006103723 A JP 2006103723A JP 2007281104 A JP2007281104 A JP 2007281104A
Authority
JP
Japan
Prior art keywords
component
board
boards
mounting
supply device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006103723A
Other languages
Japanese (ja)
Other versions
JP4764759B2 (en
Inventor
Kazuhiko Usu
和彦 薄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Priority to JP2006103723A priority Critical patent/JP4764759B2/en
Publication of JP2007281104A publication Critical patent/JP2007281104A/en
Application granted granted Critical
Publication of JP4764759B2 publication Critical patent/JP4764759B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting system which efficiently produces various types of boards. <P>SOLUTION: For producing a plurality of boards, a component feeder 20 collates whether the feeder is mounted at a predetermined position of a component mounting apparatus 1, using a bar code reader 31 when the feeder 20 locates at the same position in the mounting apparatus 1; if boards 5 are switched over, stores the collate result related to each board information or information featuring the production of boards; and mounts components by referring to the collate result when the boards are switched over, for mounting the components on the board where the component feeder locates at the same position. This constitution for mounting the components on the board where the component feeder locates at the same position for producing the board has no need of checking the mounting condition of the component feeder every switching over the type of boards to produce, thus efficiently producing various types of boards. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、部品を基板に実装する部品実装機により複数種類の基板を生産する部品実装システムに関する。   The present invention relates to a component mounting system that produces a plurality of types of substrates by a component mounter that mounts components on a substrate.

従来から、部品実装機(マウンタ)を用いて、部品供給装置(フィーダ)から供給される電子部品を吸着ヘッドで吸着し、この吸着ヘッドを基板の所定位置に移動させて部品を基板上に搭載することが行われている。この場合、基板の生産(部品実装)は、基板種類ごとにその基板を生産する生産プログラムを作成して行われる。各生産プログラムは、実装機上で基板を生産するための各種データを含み、例えば、基板に関するデータ、搭載位置に関するデータ、部品に関するデータ(例えば縦横高さの寸法)、吸着位置に関するデータ、画像認識用の情報、接着剤の塗布に関するデータ等から構成されている。   Conventionally, a component mounting machine (mounter) is used to suck an electronic component supplied from a component supply device (feeder) with a suction head, and the suction head is moved to a predetermined position on the substrate to mount the component on the substrate. To be done. In this case, board production (component mounting) is performed by creating a production program for producing the board for each board type. Each production program includes various data for producing a board on a mounting machine, for example, data about a board, data about a mounting position, data about a part (for example, height and width dimensions), data about a suction position, image recognition, etc. Information, data on application of adhesive, and the like.

複数種類の基板を生産する場合には、その生産プログラムごとに、実装される部品が異なるので、これらの部品を供給するフィーダ種類も異なり、フィーダの交換、再配置などの準備作業が必要となる。従って、複数の生産プログラムを効率良く最短時間で実施できるように、複数の生産プログラムをあたかも1本のプログラムのようにして(クラスタ化して)、クラスタ化された生産プログラム内では、基板の種類が変わってもフィーダの再配置が必要とならないように、生産プログラムないしフィーダ配置の最適化が行われている(特許文献1)。   When producing multiple types of boards, the parts to be mounted differ for each production program, so the types of feeders that supply these parts are also different, and preparation work such as feeder replacement and rearrangement is required. . Therefore, in order to efficiently execute a plurality of production programs in the shortest time, the plurality of production programs are made as if they were one program (clustered). Optimization of production programs or feeder arrangement is performed so that feeder rearrangement is not required even if it changes (Patent Document 1).

このクラスタ化により、生産する基板種類を切り替える時でも、フィーダの再配置が必要とならないために、大幅に段取り替え時間を短縮することができる。   With this clustering, even when the type of substrate to be produced is switched, rearrangement of feeders is not necessary, so that the setup change time can be greatly shortened.

また、フィーダなどの部品供給装置が正しい位置に装着されていないと、正しい部品を基板に搭載できないので、フィーダが正規の位置に装着されたかを検出したあとに部品搭載を行っている(特許文献2、3)。
特開2003−273597号公報 特開平10−200290号公報 特開平11−317595号公報
In addition, if a component supply device such as a feeder is not mounted at the correct position, the correct component cannot be mounted on the board. Therefore, the component is mounted after detecting whether the feeder is mounted at a proper position (Patent Literature). 2, 3).
JP 2003-273597 A JP-A-10-200200 JP 11-317595 A

しかしながら、従来では、直前に読み込んだ基板の部品供給装置配置データと一致しない部品供給装置については再度部品装着状態の確認が必要となり、段取り替え時間の短縮も限定的となっていた。   However, conventionally, it is necessary to confirm the component mounting state again for a component supply device that does not match the component supply device arrangement data of the board read immediately before, and shortening the setup change time has been limited.

本発明は、このような問題点を解決するためになされたもので、多品種の基板の生産を効率良く行うことが可能な部品実装システムを提供することを課題とする。   The present invention has been made to solve such problems, and an object of the present invention is to provide a component mounting system capable of efficiently producing a wide variety of boards.

本発明は、
部品を基板に実装して基板を生産する部品実装システムであって、
基板に搭載される部品を供給する部品供給装置と、
部品供給装置から供給される部品を基板の所定位置に搭載する部品実装機と、
複数の基板を生産するとき、基板を切り替えても部品供給装置の部品実装機における配置が同じ配置であるときに、部品供給装置が部品実装機の定められた位置に装着されているかを照合する照合手段と、
部品供給装置が部品実装機の定められた位置に装着されている場合には、その照合結果を、各基板情報ないし基板の生産を特徴付ける情報と関連させて記憶する記憶手段とを有し、
前記部品供給装置の配置が同じ配置となる基板生産時には、基板を切り替えるときに前記照合結果を参照して基板に部品を実装することを特徴とする。
The present invention
A component mounting system for mounting a component on a board to produce the board,
A component supply device for supplying components to be mounted on a substrate;
A component mounter for mounting a component supplied from a component supply device on a predetermined position of the board;
When producing multiple boards, if the placement of the component feeder in the component mounter is the same even if the boards are switched, it is checked whether the component feeder is mounted at a predetermined position on the component mounter. Matching means;
In the case where the component supply device is mounted at a predetermined position of the component mounter, it has a storage means for storing the verification result in association with each board information or information characterizing the production of the board,
At the time of board production in which the arrangement of the component supply devices is the same, the components are mounted on the board with reference to the verification result when the boards are switched.

本発明によれば、複数の基板を生産するとき、基板を切り替えても部品供給装置の部品実装機における配置が同じ配置であるときには、部品供給装置が部品実装機の正規の位置に装着されているかを照合し、その照合結果を、記憶するようにしているので、部品供給装置の配置が同じ配置である基板に部品を実装して、複数の基板の生産を行う場合に、生産する基板種類を切り替える度に部品供給装置の装着状態の確認を行う必要がなくなり、多品種の基板の生産を効率良く行うことができる、という効果が得られる。   According to the present invention, when producing a plurality of boards, if the arrangement of the component supply apparatus in the component mounting machine is the same even if the boards are switched, the component supply apparatus is mounted at the regular position of the component mounting machine. If the component is mounted on a board that has the same layout of the component supply device and multiple boards are produced, the type of board to be produced There is no need to check the mounting state of the component supply device each time the operation is switched, and the effect that the production of various types of boards can be performed efficiently is obtained.

以下、図面に示す実施例に基づいて本発明を詳細に説明する。   Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.

図1には、部品実装機1がホストコンピュータ30と接続されて基板5に部品を搭載するシステム構成が図示されている。   FIG. 1 illustrates a system configuration in which the component mounter 1 is connected to the host computer 30 and components are mounted on the substrate 5.

部品実装機1は、制御部4の制御の元に、部品供給装置20から供給される電子部品(以下、単に部品という)を吸着ヘッド2で吸着し、この吸着ヘッド2を基板5の所定位置に移動させて部品を基板5上に搭載する。この場合、基板の生産(部品実装)は、基板種類ごとにその基板を生産する生産プログラムを作成して行われる。各生産プログラムは、部品実装機1上で基板5を生産するための各種データを含み、例えば、基板に関するデータ、搭載位置に関するデータ、部品に関するデータ(例えば縦横高さの寸法)、吸着位置に関するデータ、画像認識用の情報、接着剤の塗布に関するデータ等から構成されている。生産プログラムは、通常ホストコンピュータ30で作成され、部品実装機1に送信されて部品実装機1のデータ記憶部3に格納される。   Under the control of the control unit 4, the component mounter 1 sucks an electronic component (hereinafter simply referred to as a component) supplied from the component supply device 20 with the suction head 2, and this suction head 2 is placed at a predetermined position on the substrate 5. And the component is mounted on the substrate 5. In this case, board production (component mounting) is performed by creating a production program for producing the board for each board type. Each production program includes various data for producing the substrate 5 on the component mounter 1, and includes, for example, data relating to the substrate, data relating to the mounting position, data relating to the component (for example, dimensions of height and width), and data relating to the suction position. , Information for image recognition, data relating to adhesive application, and the like. The production program is normally created by the host computer 30, transmitted to the component mounter 1, and stored in the data storage unit 3 of the component mounter 1.

部品供給装置20は、供給部品を収納した部品カセット21を備えており、部品カセット21には収納された部品を識別するバーコード22が付されている。部品供給装置20が部品実装機1に装着されると、ホストコンピュータ30は、バーコード読み取り手段としてのバーコードリーダ31を有しており、このバーコードリーダ31で部品供給装置20に装着された部品カセット21に付されたバーコード22を読み取り、また、ホストコンピュータ30が、部品実装機1のレーン6に付されたバーコード22よりレーン番号を取得することにより、どの部品供給装置20が何番目のレーン6に取り付けられているかを検出する。部品実装機1には、多数の部品供給装置20が装着されるので、各部品供給装置20に装着された部品カセット21とレーン番号との対応を検出して、その対応関係をホストコンピュータ30の記憶装置32に格納することができる。   The component supply device 20 includes a component cassette 21 that stores supply components, and the component cassette 21 is provided with a barcode 22 that identifies the stored components. When the component supply device 20 is mounted on the component mounter 1, the host computer 30 has a barcode reader 31 as barcode reading means, and the barcode reader 31 is mounted on the component supply device 20. The barcode 22 attached to the component cassette 21 is read, and the host computer 30 obtains the lane number from the barcode 22 attached to the lane 6 of the component mounter 1, which component supply device 20 is Whether it is attached to the lane 6 is detected. Since a large number of component supply devices 20 are mounted on the component mounter 1, the correspondence between the component cassette 21 mounted on each component supply device 20 and the lane number is detected, and the corresponding relationship is detected by the host computer 30. It can be stored in the storage device 32.

図2には、部品実装機1の詳細な構成が図示されている。部品実装機1の制御部4は、全体の部品実装を制御するCPU4a、各種制御プログラムやデータを格納したROM4c、制御データ、処理データを格納し作業領域を提供するRAM4bから構成される。部品実装機1とホストコンピュータ30間のデータ送受信は、データ送受信部14を介して行われる。ホストコンピュータ30から送信されてくる生産プログラムは、このデータ送受信部14を介して受信され、データ記憶部3に格納される。制御部4は、生産プログラム並びにデータ入力部13を介して入力されるデータに従って、X/Y駆動部及びその他の駆動部10を駆動して、吸着ヘッド2を部品供給装置20に移動させ、そこから供給される部品を吸着ヘッド2により吸着させる。吸着された部品は、カメラ12を備えた画像認識部11で吸着姿勢が認識され、位置が補正された後、搬送路に沿って搬送される基板5の所定個所に移動して基板上に実装される。ホストコンピュータ30は、バーコードリーダ31により読み取られたバーコードを備えた部品カセット21と、sの部品カセット21が装着された部品供給装置20の装着されているレーン番号との対応を記憶装置32に記憶する。   FIG. 2 shows a detailed configuration of the component mounting machine 1. The control unit 4 of the component mounter 1 includes a CPU 4a that controls the entire component mounting, a ROM 4c that stores various control programs and data, and a RAM 4b that stores control data and processing data and provides a work area. Data transmission / reception between the component mounter 1 and the host computer 30 is performed via the data transmission / reception unit 14. The production program transmitted from the host computer 30 is received via the data transmission / reception unit 14 and stored in the data storage unit 3. The control unit 4 drives the X / Y drive unit and other drive units 10 in accordance with the production program and the data input via the data input unit 13 to move the suction head 2 to the component supply device 20. The parts supplied from the above are sucked by the suction head 2. The sucked parts are recognized by the image recognition unit 11 provided with the camera 12 and their positions are corrected. Then, the picked parts are moved to a predetermined portion of the substrate 5 to be transported along the transport path and mounted on the substrate. Is done. The host computer 30 stores the correspondence between the component cassette 21 having the barcode read by the barcode reader 31 and the lane number in which the component supply device 20 to which the component cassette 21 of s is mounted is installed in the storage device 32. To remember.

このような構成で、部品を基板に搭載する場合、基板の種類によらず同じ種類の部品を搭載する場合も多く、それぞれの基板で異なる部品は数種類に過ぎない場合も多い。たとえば図3(A)、(B)、(C)に示したように、基板(1)では、部品A,B,C,D,E,F,G,Hとj,p,q,vが、基板(2)では部品A,B,C,D,E,F,G,Hとk,n,r,uが、また、基板(3)では部品A,B,C,D,E,F,G,Hとl,m,s,tが搭載され、部品A,B,C,D,E,F,G,Hは全ての基板で共通となっている。なお、図3では、各部品を収納した部品供給装置20は、基板の前面側(フロント側)と背面側(リア側)に対向してフロント側フィーダバンク24、リア側フィーダバンク25として配置される構成が図示されている。   In such a configuration, when components are mounted on a substrate, the same types of components are often mounted regardless of the type of substrate, and there are often only a few types of components that differ on each substrate. For example, as shown in FIGS. 3A, 3B, and 3C, in the board (1), components A, B, C, D, E, F, G, H and j, p, q, v However, parts A, B, C, D, E, F, G, and H and k, n, r, and u are in the board (2), and parts A, B, C, D, and E are in the board (3). , F, G, H and l, m, s, t are mounted, and parts A, B, C, D, E, F, G, H are common to all the boards. In FIG. 3, the component supply device 20 storing each component is arranged as a front feeder bank 24 and a rear feeder bank 25 so as to face the front side (front side) and the back side (rear side) of the board. A configuration is shown.

このような基板の生産を連続して行う場合、それぞれの基板で共通する部品は同じ位置に配置し、異なる部品はそれぞれ競合が発生しない位置に配置することにより基板種類の切り替え時に段取り替えを行う必要をなくすことができる。   When such board production is performed continuously, parts common to each board are arranged at the same position, and different parts are arranged at positions where competition does not occur, so that the setup is changed when the board type is switched. You can eliminate the need.

例えば、各基板(1)、(2)、(3)で共通する部品A,B,C,D,E,F,G,Hとそれ以外の部品j,p,q,v,k,n,r,uに分け、共通でない部品j,p,q,v,k,n,r,uの取り付け位置を調整することにより、図4に示したように、部品供給装置20の取り付け位置を定めれば、基板(1)、(2)、(3)のいずれかに切り替えられた場合でも、部品供給装置20の取り付け位置は変化しないようにすることができるので、段取り替えを行う必要をなくすことができる。   For example, the parts A, B, C, D, E, F, G, H common to the substrates (1), (2), (3) and the other parts j, p, q, v, k, n , R, u, and by adjusting the mounting position of the parts j, p, q, v, k, n, r, u which are not common, as shown in FIG. If it is determined, it is possible to prevent the mounting position of the component supply device 20 from changing even when the board (1), (2), or (3) is switched. Can be eliminated.

しかし、従来の部品誤装着防止システムでは、基板種類ごとの部品供給装置配置情報を元に部品(部品供給装置)の装着状態の照合を行っていたために、基板種類の切り替えごとに各部品供給装置20が正規の位置に装着されているかどうかの照合が必要であった。直前の基板で使用した部品と部品種を比較して、同じ部品の照合を省略した場合でも、そうでない部品についてはその部品を供給する部品供給装置20が正しい位置に装着されているかどうかの照合が必要であった。   However, in the conventional component erroneous mounting prevention system, since the mounting state of the component (component supply device) is collated based on the component supply device arrangement information for each board type, each component supply device is changed every time the board type is switched. It was necessary to check whether 20 was installed in the proper position. Even if the comparison of the part type and the part type used on the immediately preceding board is omitted and the verification of the same part is omitted, the verification of whether or not the part supply apparatus 20 that supplies the part is mounted at the correct position Was necessary.

そこで、複数の生産プログラムに共通の部品供給装置配置情報を作成し、部品供給装置20の装着状態の照合をこのデータに対して行う。たとえば図4の部品供給装置20の配置に対して、図5に示したような部品供給装置配置情報をデータ40として作成し、これを記憶装置32に格納する。そして、基板を生産するとき、その基板を生産する生産プログラムを参照する代わりに、このデータ40により部品供給装置20が正しく装着(配置)されているかどうかの照合を行って基板を生産する。   Therefore, component supply device arrangement information common to a plurality of production programs is created, and the mounting state of the component supply device 20 is checked against this data. For example, the component supply device arrangement information as shown in FIG. 5 is created as data 40 for the arrangement of the component supply device 20 in FIG. 4 and is stored in the storage device 32. Then, when the board is produced, instead of referring to the production program for producing the board, the data 40 is used to collate whether or not the component supply device 20 is correctly mounted (arranged) to produce the board.

図5に示したデータ40には、作成に使用した生産プログラムを特定可能な情報、例えば基板(1)、(2)、(3)あるいはその基板の生産を特徴付ける生産プログラム(1)、(2)、(3)自体が含まれ、部品q〜pを供給する部品供給装置20が、部品実装機の各レーン(1)〜(20)に正しく装着されているかどうかの照合結果(OK)が記録される。この照合には、ホストコンピュータ30が用いられる。ホストコンピュータ30は、ある部品供給装置20が部品実装機1に装着された場合、どのレーン6に装着されたかと、その部品供給装置20に装着されている部品カセット21に付されているバーコード22を、バーコードリーダ31により読み取り、部品供給装置20が部品実装機1の定められた位置(正規の位置)になっている場合には、「OK」の情報を記録する。作成されたデータ40は、部品実装機1に送信され、データ記憶部3に格納しておくことができる。部品供給装置20の配置がデータ40と同じ配置となる基板生産時には、部品実装機1は、基板を切り替えるときにデータ記憶部3あるいは記憶装置32に記録された照合結果を参照して基板に部品を実装する。   The data 40 shown in FIG. 5 includes information that can specify the production program used for creation, for example, the production program (1), (2) that characterizes the production of the board (1), (2), (3) or the board. ), (3) itself is included, and a verification result (OK) as to whether or not the component supply device 20 that supplies the components q to p is correctly mounted in each lane (1) to (20) of the component mounter is displayed. To be recorded. The host computer 30 is used for this verification. When a certain component supply device 20 is mounted on the component mounter 1, the host computer 30 determines which lane 6 is mounted and the barcode attached to the component cassette 21 mounted on the component supply device 20. 22 is read by the bar code reader 31, and when the component supply device 20 is at a predetermined position (regular position) of the component mounter 1, "OK" information is recorded. The created data 40 can be transmitted to the component mounter 1 and stored in the data storage unit 3. At the time of board production in which the arrangement of the component supply device 20 is the same as the data 40, the component mounter 1 refers to the collation result recorded in the data storage unit 3 or the storage device 32 when switching boards, and the component mounting machine 1 Is implemented.

このようなデータを一度作成しておくと、次に生産する基板の生産プログラムがその中に含まれている場合には、そのデータを参照して、部品供給装置20の装着状態の照合結果を引き継ぐことができる。これにより、共通の部品供給装置配置情報に含まれる生産プログラム内であれば、何度生産プログラムを読み直しても最初に行った部品の装着状態の照合結果を使用することができ、基板種類変更時の部品の装着状態の照合は不要となり、多品種の基板の生産を効率良く行うことができるようになる。   Once such data has been created, if the production program for the board to be produced next is included therein, the collation result of the mounting state of the component supply device 20 is obtained by referring to that data. Can take over. As a result, if it is within the production program included in the common component supply device arrangement information, the result of checking the component mounting state that was first performed can be used no matter how many times the production program is read again. It is not necessary to check the mounting state of these parts, and it is possible to efficiently produce a wide variety of boards.

本発明の部品実装システムの構成を示した構成図である。It is the block diagram which showed the structure of the component mounting system of this invention. 部品実装機の制御系の詳細を示したブロック図である。It is the block diagram which showed the detail of the control system of a component mounting machine. 部品供給装置の配置を示す説明図である。It is explanatory drawing which shows arrangement | positioning of a components supply apparatus. 複数の基板を生産するときの部品供給装置の配置を示す説明図である。It is explanatory drawing which shows arrangement | positioning of the component supply apparatus when producing a several board | substrate. 部品供給装置配置情報のデータを示す表図である。It is a table | surface figure which shows the data of components supply apparatus arrangement | positioning information.

符号の説明Explanation of symbols

1 部品実装機
2 吸着ヘッド
4 制御部
5 基板
20 部品供給装置
22 バーコード
30 ホストコンピュータ
31 バーコードリーダ
DESCRIPTION OF SYMBOLS 1 Component mounting machine 2 Adsorption head 4 Control part 5 Board | substrate 20 Component supply apparatus 22 Barcode 30 Host computer 31 Barcode reader

Claims (1)

部品を基板に実装して基板を生産する部品実装システムであって、
基板に搭載される部品を供給する部品供給装置と、
部品供給装置から供給される部品を基板の所定位置に搭載する部品実装機と、
複数の基板を生産するとき、基板を切り替えても部品供給装置の部品実装機における配置が同じ配置であるときに、部品供給装置が部品実装機の定められた位置に装着されているかを照合する照合手段と、
部品供給装置が部品実装機の定められた位置に装着されている場合には、その照合結果を、各基板情報ないし基板の生産を特徴付ける情報と関連させて記憶する記憶手段とを有し、
前記部品供給装置の配置が同じ配置となる基板生産時には、基板を切り替えるときに前記照合結果を参照して基板に部品を実装することを特徴とする部品実装システム。
A component mounting system for mounting a component on a board to produce the board,
A component supply device for supplying components to be mounted on a substrate;
A component mounter for mounting a component supplied from a component supply device on a predetermined position of the board;
When producing multiple boards, if the placement of the component feeder in the component mounter is the same even if the boards are switched, it is checked whether the component feeder is mounted at a predetermined position on the component mounter. Matching means;
In the case where the component supply device is mounted at a predetermined position of the component mounter, it has a storage means for storing the verification result in association with each board information or information characterizing the production of the board,
A component mounting system that mounts a component on a board with reference to the collation result when switching boards, during board production in which the arrangement of the component supply devices is the same.
JP2006103723A 2006-04-05 2006-04-05 Component mounting system Active JP4764759B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006103723A JP4764759B2 (en) 2006-04-05 2006-04-05 Component mounting system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006103723A JP4764759B2 (en) 2006-04-05 2006-04-05 Component mounting system

Publications (2)

Publication Number Publication Date
JP2007281104A true JP2007281104A (en) 2007-10-25
JP4764759B2 JP4764759B2 (en) 2011-09-07

Family

ID=38682266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006103723A Active JP4764759B2 (en) 2006-04-05 2006-04-05 Component mounting system

Country Status (1)

Country Link
JP (1) JP4764759B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011003801A (en) * 2009-06-19 2011-01-06 Fuji Mach Mfg Co Ltd Electronic circuit-assembling method and electronic circuit-assembling system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003273597A (en) * 2002-03-19 2003-09-26 Juki Corp Method and system for packaging component
JP2004079712A (en) * 2002-08-14 2004-03-11 Fuji Photo Film Co Ltd Electronic component packaging machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003273597A (en) * 2002-03-19 2003-09-26 Juki Corp Method and system for packaging component
JP2004079712A (en) * 2002-08-14 2004-03-11 Fuji Photo Film Co Ltd Electronic component packaging machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011003801A (en) * 2009-06-19 2011-01-06 Fuji Mach Mfg Co Ltd Electronic circuit-assembling method and electronic circuit-assembling system

Also Published As

Publication number Publication date
JP4764759B2 (en) 2011-09-07

Similar Documents

Publication Publication Date Title
US9310789B2 (en) Component verification method and component verification system
US9801318B2 (en) Component verification method and component verification system
EP3065521B1 (en) Component mounting line management device
JP6231188B2 (en) Traceability information management system and traceability information management method for component mounting line
JP2008243890A (en) Method and apparatus for loading electronic component
JP4816472B2 (en) Production management system, production management method and production management program in multiple production lines
JP5027101B2 (en) Electronic component mounting method and electronic component mounting apparatus
JP4787694B2 (en) Mounting machine
JP2005005288A (en) Electronic component mounter and mounting method
JP4635852B2 (en) Electronic component mounting apparatus and electronic component mounting method
JP6280935B2 (en) Board work system
JP2006351911A (en) Electronic-component mounting apparatus and method for verifying component sucking position of sucking nozzle present therein
JP5597144B2 (en) Component mounting equipment
JP6230820B2 (en) Board work machine
JP4764759B2 (en) Component mounting system
JP4744407B2 (en) Electronic component mounting device
JP2007059563A (en) Method and system for mounting component
JP2017220613A (en) Component mounting apparatus
JP4228868B2 (en) Electronic component mounting method
JP2005064026A (en) Component mounting equipment
JP2008218538A (en) System and method for mounting electronic component
JP6630729B2 (en) Component mounting system
JP4891156B2 (en) Nozzle discrimination method
JP2006012957A (en) Electronic part mounting device
JP3561320B2 (en) Mounting machine mounting method and mounting machine

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090327

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110303

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110315

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110510

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110531

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110613

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140617

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4764759

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150