JP2007281007A - Substrate conveyance method, substrate conveyance apparatus and exposure apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and surely remove a substrate from an electrostatic chuck concerning a substrate conveyance method for conveying substrates such as wafer, reticle or the like, a substrate conveyance apparatus and an exposure apparatus. <P>SOLUTION: The substrate conveyance method is used to convey a substrate which is arranged on the suction face of an electrostatic chuck. When the substrate is removed from the suction face; a conductive holding member holding the substrate is earthed, and the power supply of the electrostatic chuck is turned off. Then, while the holding member is kept in contact with the substrate; it is stopped for a specified time, and it is moved to remove the substrate from the suction face thereafter. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate transfer method, a substrate transfer apparatus, and an exposure apparatus for transferring a substrate such as a wafer and a reticle.

In an exposure apparatus such as an electron beam exposure apparatus or an EUV exposure apparatus used in a vacuum, an electrostatic chuck is used to hold a substrate such as a wafer or a reticle. In an electron beam exposure apparatus, a conductive pin is brought into contact with the wafer to remove charges on the wafer.
On the other hand, in an EUV exposure apparatus, since charged particle beams are not used as a light source, it is not always necessary to remove charges on the wafer.
JP 7-37962 A

However, in general, since the electric charge remains on the substrate attracted to the electrostatic chuck even after the electrostatic chuck is turned off, the residual attracting force acts when the substrate is detached from the electrostatic chuck, and the release response There is a problem that gets worse.
The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a substrate transport method, a substrate transport apparatus, and an exposure apparatus that can easily and reliably detach a substrate from an electrostatic chuck. To do.

  A substrate transport method according to a first aspect of the present invention is a substrate transport method for transporting a substrate disposed on an attracting surface of an electrostatic chuck, wherein a conductive holding member that retains the substrate when the substrate is detached from the attracting surface. After grounding and turning off the power of the electrostatic chuck, the holding member is stopped for a predetermined time in contact with the substrate, and then the holding member is moved to detach the substrate from the attracting surface. It is characterized by that.

A substrate transport method according to a second invention is the substrate transport method according to the first invention, wherein the holding member is provided in a robot hand that transports the substrate.
A substrate transport method according to a third aspect is the substrate transport method according to the first aspect, wherein the holding member is provided in a lifting mechanism that lifts the substrate from the electrostatic chuck.

A substrate transport method according to a fourth aspect of the present invention is the substrate transport method according to the first aspect, wherein the holding member is provided on a protective cover that protects the substrate.
A substrate transport apparatus according to a fifth aspect of the present invention is the substrate transport apparatus including a robot hand that transports a substrate disposed on the suction surface of the electrostatic chuck, wherein the substrate disposed on the suction surface is placed on the robot hand. A conductive holding member is provided that is separated from the suction surface and is held, and the holding member is grounded on the robot hand side.

A substrate transfer apparatus according to a sixth aspect of the present invention is a substrate transfer apparatus including a lifting mechanism that lifts a substrate disposed on the suction surface of the electrostatic chuck from the electrostatic chuck, and is disposed on the suction surface in the lifting mechanism. A conductive holding member is provided to hold the substrate separated from the suction surface, and the holding member is grounded on the lifting mechanism side.
A substrate transport apparatus according to a seventh aspect of the present invention is a substrate transport apparatus including a robot hand that transports a substrate disposed on an attracting surface of an electrostatic chuck via a protective cover that protects the substrate, wherein the protective cover is electrically conductive. It is characterized by being formed of a conductive material and grounded on the robot hand side.

A substrate transport apparatus according to an eighth aspect of the present invention is the substrate transport apparatus including a robot hand that transports the substrate disposed on the suction surface of the electrostatic chuck via the protective cover that protects the substrate. A conductive holding member for holding the substrate disposed on the suction surface is provided, and the holding member is grounded on the robot hand side.
A substrate transport apparatus according to a ninth aspect is characterized in that, in the substrate transport apparatus according to the eighth aspect, the holding member is conducted to the robot hand side through a conductor portion formed on the protective cover. To do.

A substrate transfer apparatus according to a tenth invention is the substrate transfer apparatus according to the ninth invention, wherein a conductive support member that supports the protective cover is provided on the robot hand, and the support member is in contact with the conductor portion. It is characterized by that.
According to an eleventh aspect of the present invention, there is provided the substrate transfer apparatus according to any one of the seventh to tenth aspects, wherein the substrate is a reticle, and the suction surface is formed on a lower surface of the electrostatic chuck. It is characterized by.

A substrate transfer apparatus according to a twelfth aspect is the substrate transfer apparatus according to the eleventh aspect, wherein the protective cover is a part of a plurality of cover members that are detachably disposed so as to cover the reticle. It is a cover member arrange | positioned so that attachment or detachment is possible.
An exposure apparatus according to a thirteenth aspect includes the substrate transfer apparatus according to any one of the fifth to twelfth aspects.

  In the present invention, the substrate can be easily and reliably detached from the electrostatic chuck.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(First embodiment)
FIG. 1 shows a first embodiment of the substrate transfer apparatus of the present invention.
A reticle stage 12 is arranged in the exposure chamber 11. On one side of the exposure chamber 11, a robot chamber 14 in which a vacuum robot 13 is disposed is provided. A vacuum reticle library 15 is provided on one side of the robot chamber 14, and a clean filter pod opener (hereinafter referred to as CFP opener) 16 is provided on the other side. The exposure chamber 11, the robot chamber 14, the vacuum reticle library 15, and the CFP opener 16 are in a vacuum atmosphere.

A load lock chamber 17 is arranged at a position facing the exposure chamber 11 of the robot chamber 14. The load lock chamber 17 communicates with the robot chamber 14 via the second gate valve 18. Further, the air is communicated with the atmosphere via the first gate valve 19.
A reticle carrier opener 21 is disposed outside the load lock chamber 17 via a second atmospheric robot 20. An atmospheric reticle library 23 is arranged outside the reticle carrier opener 21 via a first atmospheric robot 22.

In the substrate transfer apparatus described above, the EUVL reticle 25 used for exposure is double protected by the reticle carrier 26 and the clean filter pod (hereinafter referred to as CFP) 27 in the atmospheric reticle library 23 as shown in FIG. Is placed in the state. The CFP 27 has a function as a protective cover for protecting the reticle 25 in a reduced pressure atmosphere.
The reticle carrier 26 placed in the atmospheric reticle library 23 is conveyed to the reticle carrier opener 21 by the first atmospheric robot 22. Then, the reticle carrier 26 is identified by the reticle carrier ID reader 28. In the reticle carrier opener 21, the reticle carrier 26 is opened and the CFP 27 is exposed. The exposed CFP 27 is heated by a temperature compensation lamp 29 by about 2 to 3 ° C. The heated CFP 27 is transferred by the second atmospheric robot 20 into the load lock chamber 17 with only the first gate valve 19 opened. The route from the reticle carrier opener 21 to the load lock chamber 17 is a clean atmosphere.

In the load lock chamber 17, the CFP 27 is evacuated with the first gate valve 19 and the second gate valve 18 closed. When the load lock chamber 17 is in a predetermined vacuum state, only the second gate valve 18 is opened, and the CFP 27 is transferred to the vacuum reticle library 15 by the vacuum robot 13.
For example, about five reticles 25 are stored in the vacuum reticle library 15 in a state of being accommodated in the CFP 27. The reticle 25 is maintained at a predetermined temperature by a temperature adjustment mechanism (not shown). The reticle 25 accommodated in the CFP 27 is identified by the reticle ID reader 30. The identified reticle 25 is conveyed to the CFP opener 16 while being accommodated in the CFP 27 by the vacuum robot 13.

In the CFP opener 16, the CFP 27 is opened and the reticle 25 is exposed.
In this embodiment, as shown in FIG. 3, the CFP 27 transported to the CFP opener 16 is placed on the CFP stage 31. The CFP 27 includes an upper cover member (upper lid) 32 and a lower cover member (lower lid) 33. Then, as shown in FIG. 4, by lowering the CFP stage 31, the outer peripheral portion of the upper cover member 32 is locked to the locking member 35 at the upper end of the support member 34 and the reticle 25 is exposed.

  As shown in FIG. 5, the exposed reticle 25 is transferred to the reticle stage 12 by the transfer arm 36 of the vacuum robot 13 while being accommodated in the lower cover member 33 of the CFP 27. An electrostatic chuck 37 is arranged on the reticle stage 12 with the attracting surface 37a facing downward. Then, the upper surface of the reticle 25 is chucked to the suction surface 37 a by turning on the electrostatic chuck 37 while the reticle 25 is pressed against the suction surface 37 a of the electrostatic chuck 37 by the transport arm 36 via the lower cover member 33. The

  After chucking the reticle 25, the transport arm 36 transports the lower cover member 33 to the CFP opener 16, and places the lower cover member 33 on the CFP stage 31 at the lowered position as shown in FIG. As shown in FIG. 6, by raising the CFP stage 31, the upper cover member 32 and the lower cover member 33 of the CFP 27 are brought into close contact with each other, and the inside of the upper cover member 32 and the lower cover member 33 is sealed. The closed CFP 27 is kept waiting in the CFP opener 16 as it is.

  When the exposure is completed and the reticle 25 of the reticle stage 12 is replaced, the upper cover member 32 and the lower cover member 33 of the CFP 27 that have been waiting in the state shown in FIG. The lower cover member 33 is separated by lowering and lowering the lower cover member 33 (corresponding to the state where there is no reticle 25 in FIG. 4), and the lower cover member 33 is transported to the reticle 25 replacement position by the transport arm.

Then, as shown in FIG. 7, the reticle 25 is detached from the electrostatic chuck 37 with the lower cover member 33 positioned below the reticle 25 attracted to the electrostatic chuck 37.
The electrostatic chuck 37 is a bipolar system having two internal electrodes 38. The lower cover member 33 is provided with a holding member 39 that holds the reticle 25 disposed on the attracting surface 37 a of the electrostatic chuck 37. The holding member 39 has a holding portion 39a and a conductor portion 39b, and is formed of a conductive metal such as aluminum or stainless steel or a conductive resin. The holding portion 39 a protrudes upward from the bottom surface portion 33 a of the lower cover member 33. The conductor portion 39b is insert-molded on the bottom surface portion 33a of the lower cover member 33 made of resin. The lower end surface of the conductor portion 39 b is exposed on the lower surface of the bottom surface portion 33 a of the lower cover member 33.

  The end effector 41 of the transport arm 36 is provided with a support member 43 that supports the lower cover member 33. The support member 43 is disposed at a position corresponding to the conductor portion 39b of the holding member 39, and the upper end is in contact with the lower end surface of the conductor portion 39b. The support member 43 is formed of a conductive metal such as aluminum or stainless steel or a conductive resin. The support member 43 is electrically connected to the end effector 41.

  The transfer arm 36 (including the end effector 41) of the vacuum robot 13 is formed of a conductive metal such as aluminum or stainless steel or a conductive resin. And it is earth | grounded by the vacuum robot 13 side. That is, the support member 43 arranged on the end effector 41 is grounded to the vacuum robot 13 side via the transfer arm 36. Note that the support member 43 may be grounded to the vacuum robot 13 side by drawing a wire around the transfer arm 36 and connecting the wire to the support member 43.

In this embodiment, the reticle 25 is detached from the electrostatic chuck 37 as described below.
First, as shown in FIG. 7, the holding member 39 of the lower cover member 33 is brought into contact with the lower surface 25 a of the reticle 25. Then, the electrostatic chuck 37 is turned off simultaneously with the contact of the holding member 39. The electrostatic chuck 37 may be turned off when the holding member 39 approaches a predetermined distance from the lower surface 25a of the reticle 25. In a state in which the power is turned off, the reticle 25 is charged with a charge equal to or larger than an allowable amount of separation of the reticle 25 for several minutes, for example, and the reticle 25 is attracted to the electrostatic chuck 37.

  Next, the holding member 39 is stopped for a predetermined time, for example, 2 seconds in a state where it is in contact with the reticle 25. In this way, by stopping the holding member 39 for a predetermined time, the charge remaining on the reticle 25 is removed to a level at which the reticle 25 is detached from the electrostatic chuck 37 due to its own weight. That is, since the holding member 39 is grounded to the transfer arm 36 via the support member 43, the electric charge is efficiently removed in a short time. Then, by moving the holding member 39 downward, the reticle 25 is surely detached from the electrostatic chuck 37 and placed on the holding member 39.

  In this state, the reticle 25 is transported to the CFP opener 16 by the transport arm 36, and the lower cover member 33 in which the reticle 25 is accommodated is placed on the CFP stage 31 at the lowered position as shown in FIG. Then, by raising the CFP stage 31, the upper cover member 32 and the lower cover member 33 of the CFP 27 are in close contact (see FIG. 3), and the CFP 27 is sealed with the reticle 25 held in the CFP 27.

In the embodiment described above, after the electrostatic chuck 37 is turned off, the holding member 39 that is grounded to the vacuum robot 13 side is stopped for a predetermined time in contact with the reticle 25, and then the holding member 39 is moved. Since the reticle 25 is detached from the attracting surface 37a of the electrostatic chuck 37, the reticle 25 can be easily and reliably detached from the electrostatic chuck 37. Further, since the holding member 39 of the lower cover member 33 is grounded on the vacuum robot 13 side, the charge remaining on the reticle 25 after the electrostatic chuck 37 is turned off can be easily and reliably removed. .
(Second Embodiment)
FIG. 8 shows a second embodiment of the substrate transfer apparatus of the present invention. In this embodiment, the present invention is applied to a wafer stage.

The wafer stage 50 has a coarse movement stage 51 and a fine movement table 52.
The coarse movement stage 51 is guided in the main body 53 by a guide column 54 and can move in a direction perpendicular to the paper surface (X direction). Further, it can be moved in the left and right direction (Y direction) of the drawing by a guide mechanism (not shown).
The fine movement table 52 is disposed above the main body 53 of the coarse movement stage 51. The fine movement table 52 is supported by Z actuators 55 arranged on both sides of the main body 53 of the coarse movement stage 51. As shown in FIG. 9, three (or four or more) Z actuators 55 are arranged in a triangular shape. The Z actuator 55 incorporates an encoder and can finely move the fine movement table 52 in the vertical direction (Z direction) in the figure.

  The fine movement table 52 can be finely moved in the X direction and the Y direction by an XY actuator 56. The XY actuators 56 are made of, for example, a voice coil motor, and three or more sets are arranged between the fine movement table 52 and the coarse movement stage 51. Further, the fine movement table 52 is rotatable about the X axis, the Y axis, and the Z axis. A movable mirror 57 for measuring the position of the fine movement table 52 with the laser beam LB is disposed on the outer periphery of the fine movement table 52.

An electrostatic chuck 37 is disposed above the fine movement table 52. As shown in FIG. 9, the electrostatic chuck 37 is fixed to the fine movement table 52 by bolts or the like at three fixing portions 37a. The upper surface of the electrostatic chuck 37 is a suction surface 37 b for sucking the wafer 58.
A lifting mechanism 59 for lifting the wafer 58 disposed on the electrostatic chuck 37 is disposed on the upper surface of the main body 53 of the coarse movement stage 51. The lifting mechanism 59 has a fixed plate 60 and a holding member 61. The fixing plate 60 is fixed to the upper surface of the main body 53. The holding member 61 is fixed to the upper surface of the fixed plate 60. The holding member 61 holds the wafer 58 above the electrostatic chuck 37 when the fine movement table 52 is lowered. The holding member 61 has a pin shape, and as shown in FIG. 9, three holding members 61 are arranged in a triangular shape around the center of the circular electrostatic chuck 37.

The holding member 61 and the fixing plate 60 are formed of a conductive metal such as aluminum or stainless steel or a conductive resin. The holding member 61 is electrically connected to the fixed plate 60. The fixed plate 60 is grounded via an electric wire 62. The ground may be grounded via the coarse movement stage 51.
On the other hand, in the electrostatic chuck 37, three through holes 37c are formed in the vertical direction at positions corresponding to the holding member 61. The holding member 61 is inserted into the through hole 37c through a hole 52a formed in the fine movement table 52. The inner diameter of the through hole 37 c is sufficiently larger than the outer diameter of the holding member 61, and the electrostatic chuck 37 is prevented from interfering with the holding member 61 due to the fine movement of the fine movement table 52. The upper end 61 a of the holding member 61 is positioned below the suction surface 37 b of the electrostatic chuck 37 when the fine movement table 52 is raised, and protrudes upward from the suction surface 37 b of the electrostatic chuck 37 when the fine movement table 52 is lowered. Yes.

In the wafer stage 50 described above, as shown in FIG. 10, the fine movement table 52 is lowered by the Z actuator 55, and the holding member 61 is protruded upward from the suction surface 37 b of the electrostatic chuck 37. The wafer 58 is loaded.
11, the wafer 58 is placed on the upper end 61a of the holding member 61, and the positional relationship between the wafer 58 and the fine movement table 52 is adjusted in this state.

  Next, as shown in FIG. 8, the fine movement table 52 is raised by the Z actuator 55. As a result, the upper end 61 a of the holding member 61 is accommodated in the through hole 37 c of the electrostatic chuck 37, and the wafer 58 is placed on the suction surface 37 b of the electrostatic chuck 37. Then, the electrostatic chuck 37 is turned on and the wafer 58 is attracted to the electrostatic chuck 37. In this state, the fine movement table 52 is accurately positioned and the wafer 58 is exposed.

After the exposure is completed, the wafer 58 is detached from the electrostatic chuck 37. The wafer 58 is detached as described below.
First, in the state shown in FIG. 8, the electrostatic chuck 37 is turned off. In a state where the power supply is turned off, the wafer 58 has a charge exceeding the allowable amount of separation of the wafer 58 for several minutes, for example, and the wafer 58 is attracted to the electrostatic chuck 37.

  Next, as shown in FIG. 12, the fine movement table 52 is lowered by the Z actuator 55, and the upper end of the holding member 61 is brought into contact with the wafer 58. In this state, the fine movement table 52 is stopped and the holding member 61 is stopped for a predetermined time, for example, 2 seconds. Thus, by stopping the holding member 61 for a predetermined time, the charge remaining on the wafer 58 is removed to a level at which the wafer 58 can be detached. That is, since the holding member 61 is grounded via the fixed plate 60, the charges are efficiently removed in a short time. Then, the fine movement table 52 is further lowered by the Z actuator 55, so that the wafer 58 is surely detached from the electrostatic chuck 37 and placed on the holding member 61.

Then, the wafer 58 detached from the attracting surface 37 b of the electrostatic chuck 37 is transported to the accommodation place of the wafer 58 by the transport arm 37.
In this embodiment, after the electrostatic chuck 37 is turned off, the holding member 61 grounded on the lifting mechanism 59 side is stopped for a predetermined time in contact with the wafer 58, and then the holding member 61 is moved. Since the wafer 58 is detached from the attracting surface 37b of the electrostatic chuck 37, the wafer 58 can be easily and reliably detached from the electrostatic chuck 37. Further, since the holding member 61 is grounded on the lifting mechanism 59 side, the charge remaining on the wafer 58 after the electrostatic chuck 37 is turned off can be easily and reliably removed.
(Third embodiment)
FIG. 13 shows a third embodiment of the substrate transfer apparatus of the present invention.

  In this embodiment, the end effector 41 of the transport arm 36 is branched from the main body 41a and has a support 41b formed in a fork shape. A holding member 70 that holds the wafer 58 is disposed on the distal end side of the support portion 41b and the central protrusion 41c of the main body portion 41a. The holding member 70 is made of a conductive metal such as aluminum or stainless steel or a conductive resin. The holding member 70 protrudes upward from the support portion 41b or the central protrusion 41c. The holding member 70 is electrically connected to the end effector 41.

  The transfer arm 36 (including the end effector 41) of the vacuum robot is formed of a conductive metal such as aluminum or stainless steel or a conductive resin. And it is grounded on the vacuum robot side. That is, the holding member 70 disposed on the end effector 41 is grounded to the vacuum robot side via the transfer arm 36. Alternatively, the holding member 70 may be grounded to the vacuum robot side by routing the wiring to the transfer arm 36 and connecting the wiring to the holding member 70.

On the other hand, an electrostatic chuck 37 that holds the wafer 58 by suction is fixed on the table 71 of the wafer stage. The electrostatic chuck 37 is formed with a notch 37e along the direction in which the support 41b of the end effector 41 enters. Moreover, the recessed part 37f is formed in the center protrusion 41c approach position of the main-body part 41a.
In this embodiment, the wafer 58 is detached from the electrostatic chuck 37 as described below.

  First, as shown in FIG. 14, the transfer arm 36 is moved below the electrostatic chuck 37. In this state, the support portion 41b of the end effector 41 is positioned in the notch 37e of the electrostatic chuck 37, and the central protrusion 41c of the main body portion 41a is positioned in the recess 37f. In this state, the power of the electrostatic chuck 37 is turned off. In a state where the power supply is turned off, the wafer 58 has a charge exceeding the allowable amount of separation of the wafer 58 for several minutes, for example, and the wafer 58 is attracted to the electrostatic chuck 37.

  Next, as shown in FIG. 15, the transfer arm 36 is moved upward to bring the upper end of the holding member 70 into contact with the wafer 58. In this state, the transfer arm 36 is stopped and the holding member 70 is stopped for a predetermined time, for example, 2 seconds. Thus, by stopping the holding member 70 for a predetermined time, the charge remaining on the wafer 58 is removed to a level at which the wafer 58 can be detached. That is, since the holding member 70 is grounded via the end effector 41, electric charges are efficiently removed in a short time. Then, as shown in FIG. 16, the transfer arm 36 is raised and the holding member 70 is moved upward, so that the wafer 58 is surely detached from the electrostatic chuck 37 and placed on the holding member 70.

In this embodiment, after the electrostatic chuck 37 is turned off, the holding member 70 that is grounded to the transfer arm 36 is stopped for a predetermined time in contact with the wafer 58, and then the holding member 70 is moved. Since the wafer 58 is detached from the attracting surface 37a of the electrostatic chuck 37, the wafer 58 can be easily and reliably detached from the electrostatic chuck 37. Further, since the holding member 70 is grounded on the transfer arm 36 side, the electric charge remaining on the wafer 58 after the electrostatic chuck 37 is turned off can be easily and reliably removed.
(Embodiment of exposure apparatus)
FIG. 17 schematically shows an EUV light lithography system in the exposure chamber 13 of FIG. In this embodiment, the same members as those in the first or second embodiment are denoted by the same reference numerals. In this embodiment, EUV light is used as illumination light for exposure. The EUV light has a wavelength of 0.1 to 400 nm, and in this embodiment, a wavelength of about 1 to 50 nm is particularly preferable. The projection image uses the image optical system 101 and forms a reduced image of the pattern by the reticle 25 on the wafer 58.

  The pattern irradiated on the wafer 58 is determined by the reflective reticle 25 disposed below the reticle stage 12 via the electrostatic chuck 37. This reflective reticle 25 is carried in and out by the vacuum robot 13 of the above-described embodiment (illustration of the vacuum robot 13 is omitted). The wafer 58 is placed on the wafer stage 50. Typically, exposure is done by step scanning.

  Since EUV light used as illumination light at the time of exposure has low permeability to the atmosphere, the light path through which the EUV light passes is surrounded by a vacuum chamber 106 that is kept in a vacuum using a suitable vacuum pump 107. EUV light is generated by a laser plasma X-ray source. The laser plasma X-ray source includes a laser source 108 (acting as an excitation light source) and a xenon gas supply device 109. The laser plasma X-ray source is surrounded by a vacuum chamber 110. EUV light generated by the laser plasma X-ray source passes through the window 111 of the vacuum chamber 110.

  The laser source 108 generates laser light having a wavelength equal to or less than ultraviolet light. For example, a YAG laser or an excimer laser is used. The laser light from the laser source 108 is collected and applied to the flow of xenon gas (supplied from the xenon gas supply device 109) emitted from the nozzle 112. When laser light is irradiated on the flow of xenon gas, the laser light sufficiently warms the xenon gas and generates plasma. When the xenon gas molecules excited by the laser fall into a low energy state, photons of EUV light are emitted.

  The parabolic mirror 113 is disposed in the vicinity of the xenon gas discharge portion. The parabolic mirror 113 collects EUV light generated by the plasma. The parabolic mirror 113 constitutes a condensing optical system, and is arranged so that the focal position comes near the position where the xenon gas from the nozzle 112 is emitted. The EUV light is reflected by the multilayer film of the parabolic mirror 113 and reaches the condensing mirror 114 through the window 111 of the vacuum chamber 110. The condensing mirror 114 condenses and reflects the EUV light to the reflective reticle 25. The EUV light is reflected by the condensing mirror 114 and illuminates a predetermined portion of the reticle 25. That is, the parabolic mirror 113 and the condensing mirror 114 constitute an illumination system of this apparatus.

The reticle 25 has a multilayer film that reflects EUV and an absorber pattern layer for forming a pattern. The EUV light is “patterned” by being reflected by the reticle 25. The patterned EUV light reaches the wafer 58 through the projection system 101.
The image optical system 101 of this embodiment includes four reflecting mirrors: a concave first mirror 115a, a convex second mirror 115b, a convex third mirror 115c, and a concave fourth mirror 115d. Each of the mirrors 115a to 115d is provided with a multilayer film that reflects EUV light.

The EUV light reflected by the reticle 25 is sequentially reflected from the first mirror 115a to the fourth mirror 115d to form an image in which the reticle pattern is reduced (for example, 1/4, 1/5, 1/6). The image optical system 101 is telecentric on the image side (wafer 58 side).
The reticle 25 is supported at least in the XY plane by a movable reticle stage 12. The wafer 58 is preferably supported by a wafer stage 50 that is movable in the X, Y, and Z directions. When the die on the wafer 58 is exposed, EUV light is irradiated to a predetermined area of the reticle 25 by the illumination system, and the reticle 25 and the wafer 58 follow the reduction ratio of the image optical system 101 with respect to the image optical system 101. It moves at a predetermined speed. In this manner, the reticle pattern is exposed to a predetermined exposure range (with respect to the die) on the wafer 58.

  During exposure, the wafer 58 is preferably disposed behind the partition 116 so that the gas generated from the resist on the wafer 58 does not affect the mirrors 115 a to 115 d of the image optical system 101. The partition 116 has an opening 116a through which EUV light is irradiated from the mirror 115d to the wafer 58. The space in the partition 116 is evacuated by a vacuum pump 117. In this manner, gaseous dust generated by irradiating the resist is prevented from adhering to the mirrors 115a to 115d or the reticle 25. Therefore, deterioration of these optical performances is prevented.

In the exposure apparatus of this embodiment, since the reticle 25 and the wafer 58 are transferred by the substrate transfer apparatus described above, the throughput can be improved.
(Supplementary items of the embodiment)
As mentioned above, although this invention was demonstrated by embodiment mentioned above, the technical scope of this invention is not limited to embodiment mentioned above, For example, the following forms may be sufficient.

(1) In the first embodiment described above, an example in which the lower cover member 33 is formed of a non-conductive resin has been described. However, the lower cover member is formed of a conductive metal or resin, and the lower cover member is It may be grounded.
(2) In the above-described second embodiment, the example in which the holding member 61 of the lifting mechanism 59 is fixed to the coarse movement stage 51 has been described. However, the holding member of the lifting mechanism is configured to be movable in the vertical direction, and the holding member Thus, the wafer may be moved in the vertical direction.

  (3) In the above-described embodiment, an example of an exposure apparatus using EUV light has been described. However, the present invention can be widely applied to an exposure apparatus that holds a substrate on an electrostatic chuck.

It is explanatory drawing which shows 1st Embodiment of the board | substrate conveyance apparatus of this invention. It is explanatory drawing which shows the reticle carrier of FIG. It is explanatory drawing which shows the detail of the CFP stage of FIG. It is explanatory drawing which shows the state which exposed the reticle from CFP in FIG. FIG. 2 is an explanatory diagram illustrating a state in which a reticle is transferred from the CFP stage of FIG. 1 to the reticle stage. It is explanatory drawing which shows the state which waits for CFP in the CFP stage of FIG. It is explanatory drawing which shows the state which has removed the reticle from the electrostatic chuck. It is explanatory drawing which shows 2nd Embodiment of the board | substrate conveyance apparatus of this invention. It is explanatory drawing which shows the state which looked at the fine movement table of FIG. 8 from upper direction. It is explanatory drawing which shows the state which conveyed the wafer to the wafer stage with the conveyance arm. It is explanatory drawing which shows the state which is adjusting the position of a wafer and a fine movement table. It is explanatory drawing which shows the state which contacted the holding member to the wafer. It is explanatory drawing which shows 3rd Embodiment of the board | substrate conveyance apparatus of this invention. It is explanatory drawing which shows the state which moved the conveyance arm below the electrostatic chuck. It is explanatory drawing which shows the state which contacted the holding member on the lower surface of the wafer. It is explanatory drawing which shows the state which removed the wafer from the electrostatic chuck. It is explanatory drawing which shows one Embodiment of the exposure apparatus of this invention.

Explanation of symbols

  12: reticle stage, 13: vacuum robot, 25: reticle, 33: lower cover member, 36: transfer arm, 37: electrostatic chuck, 39: holding member, 39b: conductor, 41: end effector, 43: support member 58: Wafer 61: Holding member 70: Holding member

Claims (13)

In a substrate transport method for transporting a substrate disposed on an adsorption surface of an electrostatic chuck,
When the substrate is detached from the attracting surface, the conductive holding member that holds the substrate is grounded, the power of the electrostatic chuck is turned off, and then the holding member is in contact with the substrate for a predetermined time. Thereafter, the substrate transfer method is characterized in that the holding member is moved to detach the substrate from the suction surface. The substrate transfer method according to claim 1,
The substrate transfer method, wherein the holding member is provided in a robot hand for transferring the substrate. The substrate transfer method according to claim 1,
The substrate transfer method, wherein the holding member is provided in a lifting mechanism that lifts the substrate from the electrostatic chuck. The substrate transfer method according to claim 1,
The substrate carrying method, wherein the holding member is provided on a protective cover for protecting the substrate. In a substrate transport apparatus equipped with a robot hand that transports a substrate placed on the suction surface of an electrostatic chuck,
The robot hand is provided with a conductive holding member that holds the substrate disposed on the suction surface by separating from the suction surface, and the holding member is grounded on the robot hand side. Substrate transfer device. In the substrate transport apparatus having a lifting mechanism for lifting the substrate disposed on the suction surface of the electrostatic chuck from the electrostatic chuck,
The lifting mechanism is provided with a conductive holding member for separating and holding the substrate disposed on the suction surface from the suction surface, and the holding member is grounded on the lifting mechanism side. Substrate transfer device. In a substrate transfer apparatus provided with a robot hand for transferring a substrate disposed on an adsorption surface of an electrostatic chuck via a protective cover for protecting the substrate,
A substrate transfer apparatus, wherein the protective cover is formed of a conductive material and is grounded on the robot hand side. In a substrate transfer apparatus provided with a robot hand for transferring a substrate disposed on an adsorption surface of an electrostatic chuck via a protective cover for protecting the substrate,
A substrate transfer apparatus, wherein the protective cover is provided with a conductive holding member for holding the substrate disposed on the suction surface, and the holding member is grounded on the robot hand side. The substrate transfer apparatus according to claim 8, wherein
The substrate transfer apparatus, wherein the holding member is electrically connected to the robot hand side through a conductor portion formed on the protective cover. The substrate transfer apparatus according to claim 9, wherein
A substrate transfer apparatus, wherein the robot hand is provided with a conductive support member for supporting the protective cover, and the support member is in contact with the conductor portion. In the board | substrate conveyance apparatus of any one of Claim 7 thru | or 10,
The substrate transport apparatus according to claim 1, wherein the substrate is a reticle, and the suction surface is formed on a lower surface of the electrostatic chuck. The substrate transfer apparatus according to claim 11, wherein
The protective cover is a part of a plurality of cover members that are detachably disposed to cover the reticle, and is a cover member that is detachably disposed to cover the pattern of the reticle. apparatus. An exposure apparatus comprising the substrate transfer apparatus according to any one of claims 5 to 12.

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