JP2007275677A5 - - Google Patents
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- Publication number
- JP2007275677A5 JP2007275677A5 JP2007200072A JP2007200072A JP2007275677A5 JP 2007275677 A5 JP2007275677 A5 JP 2007275677A5 JP 2007200072 A JP2007200072 A JP 2007200072A JP 2007200072 A JP2007200072 A JP 2007200072A JP 2007275677 A5 JP2007275677 A5 JP 2007275677A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- box
- lid
- ball
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 16
- 238000007689 inspection Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 11
- 238000003466 welding Methods 0.000 description 20
- 239000000057 synthetic resin Substances 0.000 description 16
- 229920003002 synthetic resin Polymers 0.000 description 16
- 238000003780 insertion Methods 0.000 description 15
- 238000005192 partition Methods 0.000 description 10
- 239000000835 fiber Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000000875 corresponding Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000002093 peripheral Effects 0.000 description 4
- 210000000078 Claw Anatomy 0.000 description 3
- 241000755266 Kathetostoma giganteum Species 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 238000005034 decoration Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003014 reinforcing Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006011 modification reaction Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 240000004282 Grewia occidentalis Species 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N Indium(III) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 210000000282 Nails Anatomy 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000001427 coherent Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003068 static Effects 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007200072A JP4266031B2 (ja) | 2007-07-31 | 2007-07-31 | 遊技機の基板収納ボックス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007200072A JP4266031B2 (ja) | 2007-07-31 | 2007-07-31 | 遊技機の基板収納ボックス |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007174970A Division JP4558010B2 (ja) | 2007-07-03 | 2007-07-03 | 遊技機の基板収納ボックス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007275677A JP2007275677A (ja) | 2007-10-25 |
| JP2007275677A5 true JP2007275677A5 (uk) | 2009-02-26 |
| JP4266031B2 JP4266031B2 (ja) | 2009-05-20 |
Family
ID=38677751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007200072A Expired - Lifetime JP4266031B2 (ja) | 2007-07-31 | 2007-07-31 | 遊技機の基板収納ボックス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4266031B2 (uk) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6035484B2 (ja) * | 2012-06-22 | 2016-11-30 | 株式会社北電子 | 遊技機 |
-
2007
- 2007-07-31 JP JP2007200072A patent/JP4266031B2/ja not_active Expired - Lifetime
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