JP2007272385A - Noncontact communication medium, and interposer for noncontact communication medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact communication medium capable of maintaining satisfactory electric connection between an IC chip and an antenna. <P>SOLUTION: The noncontact communication medium 10 comprises a nonconductive substrate sheet 12, the antenna 20 formed on the substrate sheet 12, and the IC chip 30 connected with the antenna 20. The IC chip 30 is provided on the substrate sheet 12. A cutout 50 is formed around the IC chip in the substrate sheet 12. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a non-contact communication medium capable of transmitting and receiving data without contact with an external device (for example, a reader / writer), and an interposer for the non-contact communication medium.

  In recent years, non-contact communication media (information holding media) that transmit and receive data without contact with an external device such as a reader / writer have become widespread. Such a non-contact communication medium is sometimes called an IC tag, and usually includes a base sheet, an antenna formed on the base sheet, and an IC chip fixed on the base sheet. ing. The IC chip has an IC chip main body in which an IC circuit is written, and connection electrodes (bumps) protruding from the IC chip main body, and is connected to the antenna through the connection electrodes.

  In addition, the connection electrode of the IC chip and the antenna may be further connected via a connecting conductor. Usually, the conductor is supported on a support sheet, and a member constituted by the support sheet, the conductor, and the IC chip is called an interposer.

  Such a non-contact communication medium is affixed to a product or the like, or is laminated as a plate material and used as an IC card.

  By the way, since the base material sheet is usually made of paper, PET, or the like, the base material sheet may be deformed, especially bent in a bow shape during handling. When the base sheet is deformed, a force to peel off the IC chip, the conductor for connection and the like from the base sheet is generated, thereby increasing the connection resistance value between the IC chip and the antenna. The electrical connection between the chip and the antenna may be completely lost.

  When the connection resistance value between the IC chip and the antenna increases, the communication characteristics of the non-contact communication medium deteriorate, and further, when the electrical connection between the IC chip and the antenna is completely lost, The contact communication medium does not perform its intended function at all.

  The present invention has been made in consideration of such points, and an object thereof is to provide a non-contact communication medium in which a good electrical connection between an IC chip and an antenna can be maintained.

  Also, such inconveniences can occur in the interposer when the support sheet is deformed. Therefore, an object of the present invention is to provide a non-contact communication medium in which a good connection between an IC chip and a conductor can be maintained.

  A first non-contact communication medium according to the present invention includes a non-conductive base sheet, an antenna formed on the base sheet, and an IC chip connected to the antenna, and the base sheet IC chip A notch is formed in the periphery.

  According to such a non-contact communication medium, it is possible to suppress deformation at the portion of the base sheet that supports the IC chip by cutting. Thereby, a favorable electrical connection between the IC chip and the antenna can be maintained.

  In the first non-contact communication medium according to the present invention, the cut may be arranged along the outline of the IC chip outside the IC chip of the base sheet.

  In the first non-contact communication medium according to the present invention, a plurality of cuts may be formed in the base sheet, and the plurality of cuts may be arranged so as to at least partially surround the IC chip.

  Furthermore, in the first non-contact communication medium according to the present invention, the base sheet may be formed with a pair of cuts extending across the IC chip.

  Alternatively, the IC chip has a substantially rectangular outline in plan view, and two or more incisions continuously arranged are formed on the outer sides of a pair of opposing edges of the IC chip in the base sheet. You may be made to do. In this case, in addition, cuts may be formed on the outer sides of another pair of facing edges of the IC chip different from the pair of facing edges.

  Alternatively, the IC chip may have a substantially rectangular outline in a plan view, and the base sheet may be formed with three cuts respectively arranged on the outer sides of the three edges of the IC chip. . In this case, both end portions of the center cut provided in the center of the three cuts are arranged close to one end portion of the pair of side cuts provided on both sides of the center cut. May be.

  Or you may make it the notch which encloses an IC chip from three sides formed in the base material sheet.

  Furthermore, in the first non-contact communication medium according to the present invention, the antenna has a bridge member that short-circuits a predetermined portion of the antenna provided on the base sheet, and around the bridge member of the base sheet. A cut may be further formed. According to such a non-contact communication medium, it is possible to suppress deformation of the portion of the base sheet that supports the bridge member by cutting. Therefore, a short circuit between predetermined portions of the antenna is maintained, and good communication characteristics can be maintained.

  In this case, the notch around the bridge member may be arranged along the contour of the bridge member outside the bridge member of the base sheet. Further, a plurality of cuts may be formed around the bridge member of the base sheet, and the plurality of cuts may be arranged so as to at least partially surround the bridge member.

  A second non-contact communication medium according to the present invention includes a non-conductive substrate sheet, an antenna formed on the substrate sheet, a non-conductive support sheet, a conductor disposed on the support sheet, and a conductive material. An interposer having an IC chip connected to the body, wherein the conductor is connected to the antenna, and a notch is formed around the interposer of the base sheet.

  According to such a non-contact communication medium, it is possible to suppress deformation at the portion of the base sheet that supports the interposer by cutting. Therefore, a good electrical connection between the conductor and the antenna can be maintained. As a result, a good electrical connection between the IC chip and the antenna can be maintained.

  In the second non-contact communication medium according to the present invention, the cut may be arranged along the contour of the interposer outside the interposer of the base sheet.

  In the second non-contact communication medium according to the present invention, a plurality of cuts may be formed in the base sheet, and the plurality of cuts may be disposed so as to at least partially surround the interposer.

  An interposer according to the present invention includes a non-conductive support sheet, a conductor disposed on the support sheet, and an IC chip connected to the conductor, and a cut is formed around the IC chip of the support sheet. It is characterized by being.

  According to such an interposer, it is possible to suppress deformation at the portion of the support sheet that supports the IC chip by cutting. Therefore, a good electrical connection between the IC chip and the conductor can be maintained. Further, when such an interposer is connected to a separate antenna, as a result, a good electrical connection between the IC chip and the antenna can be maintained.

  In the interposer according to the present invention, the notch may be arranged outside the IC chip of the support sheet along the outline of the IC chip.

  In the interposer according to the present invention, a plurality of cuts may be formed in the support sheet, and the plurality of cuts may be arranged so as to at least partially surround the IC chip.

  In addition, it is useful to produce a non-contact communication medium using the interposer according to the present invention, and it is particularly preferable to apply the interposer according to the present invention to the above-described second non-contact communication medium according to the present invention.

  According to the non-contact communication medium according to the present invention, it is possible to suppress deformation in the portion of the base sheet that supports the IC chip by the cut formed in the base sheet. Thereby, it is possible to ensure and maintain a good electrical connection between the IC chip and the antenna.

  Moreover, according to the interposer by this invention, the deformation | transformation in the part which supports the IC chip of a support sheet can be suppressed by the notch formed in the support sheet. Thereby, it is possible to ensure and maintain a good electrical connection between the IC chip and the conductor.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

  FIGS. 1 to 13 are diagrams showing a first embodiment of a non-contact communication medium (information holding medium) according to the present invention and its modification.

  1 is a top view showing a non-contact communication medium, FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1, and FIG. 3 is a cross-sectional view taken along line III-III in FIG. FIG. 4 is a top view showing another example of the non-contact communication medium, and FIGS. 5 to 7 are diagrams for explaining the operation of the non-contact communication medium.

  First, the non-contact communication medium 10 will be described mainly with reference to FIGS.

  As shown in FIGS. 1 to 4, the non-contact communication medium 10 in the present embodiment is connected to the non-conductive base sheet 12, the antenna 20 formed on the base sheet 12, and the antenna 20. And an IC chip 30 provided on the base sheet 12. Such a non-contact communication medium 10 is sometimes called an IC tag, and can communicate with an external device (reader / writer, etc.) in a non-contact state. If an external device (reader / writer or the like) is used, information recorded on the IC chip 30 can be read out via the antenna 20 or new information can be written into the IC chip 30 via the antenna 20.

  Therefore, at least an IC circuit for performing such a function of the non-contact communication medium 10 is written in the IC chip 30. As shown in FIG. 1, the IC chip 30 has a substantially rectangular shape in plan view, more specifically a substantially rectangular shape, and more specifically a substantially square shape. Further, as shown in FIG. 2, the IC chip 30 protrudes from the lower surface of the IC chip body 32a in which the IC circuit is written, and is electrically connected to the IC circuit of the IC chip body 32a ( And a pair of connection electrodes (also referred to as bumps) 32a and 32a that are electrically connected. The thickness of the IC chip body 32a of the normally used IC chip 30 is about 150 to 400 μm, and the protruding length of the connection electrode 32b is about 10 to 30 μm. Further, the length of one end edge of the IC chip 30 (IC chip body 32a) that is normally used is about 1 mm.

  On the other hand, the antenna 20 electrically connected to the IC chip 30 is formed on a non-conductive substrate sheet 12 made of, for example, paper or PET. In addition, the thickness of the base material sheet 12 used is about 30-200 micrometers.

  As shown in FIG. 1, the antenna 20 in the present embodiment is formed as a coiled antenna, and includes a coiled portion 22 including a connecting portion 22 a used for connection to the IC chip 30, and a coiled portion 22. And a bridge member 25 for electrically connecting (short-circuiting) the innermost peripheral end 22b and the outermost peripheral end 22c. As shown in FIG. 1, the connection portion 22a of the coiled portion 22 extends outward from a pair of opposing edges of the IC chip 30 having a square outline.

  In addition, the coil-shaped part 22 transfers conductive foil which consists of copper, aluminum, etc. on the base material sheet 12 by apply | coating conductive ink on the base material sheet 12, for example using a screen printing machine. Or by etching the conductive foil made of copper, aluminum, or the like laminated on the base sheet 12 and patterning the conductive foil into a desired shape. The thickness of the coiled portion 22 is usually about 10 to 50 μm.

  Further, as shown in FIG. 3, the bridge member 25 in the present embodiment includes a non-conductive bridge base material 25b and a conductive bridge conductor 25a fixed on the bridge base material 25b. ing. The bridge conductor 25a extends so as to protrude from both ends of the bridge base material 25b. The projecting both ends of the bridge conductor 25a are in contact with the innermost peripheral end 22b and the outermost peripheral end 22c of the coiled portion 22, and thereby the innermost periphery of the coiled portion 22 via the bridge conductor 25a. The end 22b and the outermost peripheral end 22c are electrically connected (short-circuited). Further, portions other than the innermost peripheral end 22b and the outermost peripheral end 22c of the coil-shaped portion 22 are covered with the bridge base material 25b, and are prevented from being short-circuited by the bridge conductor 25a. The thickness of the bridge base material 25b of the bridge member 25 can be about 30 to 100 μm, and the thickness of the bridge conductor 25a can be about 10 to 50 μm.

  Such a configuration of the bridge member 25 is merely an example including a connection method to the coiled portion 22, and various known configurations of the bridge member and a connection method to the coiled portion 22 are adopted. be able to.

  As shown in FIG. 2, the IC chip 30 is disposed on the base sheet 12 so that the connection electrode 32 b faces and contacts the end of the connection portion 22 a of the antenna 20. The IC chip 30 is fixed to the base sheet 12 via the antenna 20 by using an adhesive 38 made of, for example, an epoxy thermosetting resin. With such a configuration, the IC chip 30 is electrically connected to the antenna 20 and is fixed to the base sheet 12. However, the electrical connection between the IC chip 30 and the antenna 20 is not limited to such a method, and can be achieved by various methods. For example, electrical connection by ultrasonic bonding may be used, or electrical connection via a conductive or anisotropic conductive adhesive may be used.

  By the way, depending on the electromagnetic wave used for communication in a non-contact state, the antenna 20 is configured to be different from the example shown in FIGS. 1 to 3. For example, as shown in FIG. Sometimes it is formed by the body. In the example of FIG. 4, the antenna 20 includes a pair of substantially rod-shaped antenna conductors 27 and 27, and a connection portion 22 a that extends from each antenna conductor 27 and is used for connection to the IC chip 30. It functions as a so-called dipole antenna. The antenna 20 shown in FIG. 4 can be formed on the base material sheet 12 by the same method as the coiled portion 22 described above.

  As well shown in FIGS. 1 and 2, the base sheet 12 has a notch penetrating the base sheet 12 around the IC chip 30 of the base sheet 12 (also referred to as an IC chip peripheral notch). 50 is formed. As shown in FIG. 1, in the present embodiment, the cuts 50 are arranged outside the IC chip 30 of the base sheet 12 along the outline of the IC chip 30. A plurality of cuts are formed, and the plurality of cuts 50 are arranged so as to at least partially surround the IC chip 30.

  More specifically, as shown in FIG. 1, two cuts 52a, 52b, 52c, which are continuously arranged on the outer sides of a pair of opposing edges of the IC chip 30 having a rectangular outline, 52d is formed. Therefore, the cut 50 is constituted by a total of four cuts 50a, 50a, 50b, 50b. In other words, two cuts 50a and 50b arranged continuously on one side of the IC chip 30 (upper side in the drawing of FIG. 1), and the other side of the IC chip 30 (lower side in the drawing of FIG. 1). The IC chip peripheral cut 50 according to the present embodiment is formed by the two cuts 50c and 50d arranged in succession. For this reason, as shown in FIG. 1, the portion (in this embodiment, the portion facing the IC chip 30 of the base sheet 12) 15 that supports the IC chip 30 of the base sheet 12 has four cuts 50 a, It is sandwiched (enclosed) by 50b, 50c, 50d.

  As shown in FIG. 1, the edge of the IC chip 30 in which the notch 50 is disposed in proximity is the edge from which the connecting portion 22a of the antenna 20 is extended. The connecting portion 22a extends from the portion 15 supporting the IC chip to the outside through the two cuts 50a and 50b (50c and 50d) arranged in succession. In other words, each connecting portion 22a of the antenna 20 passes either between the two cuts 50a and 50b arranged on one side and between the two cuts 50c and 50d arranged on the other side. .

  In addition, as well shown in FIG. 1 and FIG. 3, the base sheet 12 has a notch penetrating the base sheet 12 around the bridge member 25 of the base sheet 12 (also called a bridge member peripheral notch). ) 52 is formed. As shown in FIG. 1, in the present embodiment, the cuts 52 are arranged outside the bridge member 25 of the base sheet 12 along the outline of the bridge member 25. A plurality of cuts are formed, and the plurality of cuts 52 are arranged so as to at least partially surround the bridge member 25.

  More specifically, as shown in FIG. 1, the bridge members 25 having a rectangular (more specifically, rectangular) outline are disposed on the outer sides of a pair of opposite corners with the top portions of the corners interposed therebetween. Two straight cuts 52a, 52b, 52c, and 52d are formed, respectively. Two straight cuts arranged across the top of the corner extend along the two edges of the bridge member 25 forming the corner. Accordingly, a total of four cuts 52a, 52b, 52c, and 52d constitute the cut 52. In other words, 2 is disposed outside one corner of the bridge member 25 having a rectangular (more specifically, rectangular) outline, and extends along each of the two edges of the bridge member 25 forming the corner. Two incisions 52a, 52b and two corners that extend along each of the two edges of the bridge member 25 that are located outside the opposite corner (diagonal) opposite the corner. The notches 52c and 52d constitute the bridge member peripheral notch 52 of the present embodiment. For this reason, as shown in FIG. 1, the portion (in this embodiment, the portion facing the bridge member 25 of the base sheet 12) 16 that supports the bridge member 25 of the base sheet 12 has four cuts 52 a, It is sandwiched (enclosed) by 52a, 52b, 52b.

  Next, the operation of such a non-contact communication medium 10 will be described mainly with reference to FIGS.

  As described above, the base sheet 12 of the non-contact communication medium 10 is made of PET or paper. For this reason, during handling, the non-contact communication medium 10 is frequently bent like a bow due to an external load and also due to the weight of the non-contact communication medium 10 itself.

  For example, it is assumed that some force is applied during handling of the non-contact communication medium 10 and a bending moment as shown in FIG. 5A is applied to the non-contact communication medium 10. If the IC chip peripheral notch 50 is not formed in the base material sheet 12 of the non-contact communication medium 10, the base material sheet 12 as a whole including the portion 15 that supports the IC chip 30 as shown in FIG. It is bent like a bow. In this case, the connection electrode 32b of the IC chip 30 may be peeled off from the connection part 22a of the antenna 20 at the end, and the contact area between the connection electrode 32b and the connection part 22a may be reduced. Further, the connection electrode 32b of the IC chip 30 may be completely peeled off from the connection portion 22a of the antenna 20, and the electrical connection between the IC chip 30 and the antenna 20 may be completely impaired.

  On the other hand, according to the present embodiment, the IC chip peripheral cut 50 is formed around the IC chip 30 of the base sheet 12, and the deformation resistance force (rigidity) of the base sheet 12 in the portion where the cut 50 is provided. Is weakened. Accordingly, as shown in FIG. 5B, the base sheet 12 is greatly deformed in the portion where the notch 50 is provided, and the force that should act on the portion 15 of the base sheet 12 that supports the IC chip 30 is exerted. It is absorbed by the notch 50. Thereby, the force acting on the portion 15 of the base sheet 12 that supports the IC chip 30 is weakened, and the force acting on the portion 15 of the base sheet 12 that supports the IC chip 30 is weakened. It can suppress that the part 15 which supports IC chip 30 deform | transforms greatly. Therefore, it is possible to remarkably suppress the electrical connection between the IC chip 30 and the antenna 20 from being damaged by the force applied during handling.

  Similarly, when the portion 16 of the base sheet 12 that supports the bridge member 25 is bent in a bow, the bridge conductor 25a of the bridge member 25 has the innermost peripheral end 22b and the outermost peripheral end of the antenna 20 at the ends. There exists a possibility that it may peel from 22c and the contact area between these may reduce. Further, the bridge conductor 25a may be completely peeled off from the innermost peripheral end 22b or the outermost peripheral end 22c, and the antenna 20 may not function.

  However, according to the present embodiment, the bridge member peripheral cut 52 is formed around the bridge member 25 of the base sheet 12. The deformation resistance force (rigidity) of the base sheet 12 in the portion where the bridge cutout 52 is provided is weakened. Therefore, as shown in FIG. 6, the base sheet 12 is greatly deformed in the portion where the notch 52 is provided, and the force that should act on the portion 16 that supports the bridge member 25 of the base sheet 12 is caused by the notch 52. Absorbed. Thereby, the force which acts on the part 16 which supports the bridge member 25 of the base material sheet 12 is weakened, and it can suppress that the part 16 which supports the bridge member 25 of the base material sheet 12 deform | transforms greatly. . Therefore, the electrical connection between the bridging conductor 25a of the bridge member 25 and the innermost peripheral end 22b and the outermost peripheral end 22c of the antenna 20 is greatly impaired by the force applied during handling. Can be suppressed.

  From these facts, it can be said that the non-contact communication medium 10 in the present embodiment has excellent bending resistance, and maintains good electrical connection (conduction state) between the IC chip 30 and the antenna 20. In addition, good communication characteristics can be maintained without deteriorating the antenna capability of the non-contact communication medium 10.

  In consideration of the effects of the IC chip peripheral cut 50 and the bridge cut 52, it is preferable that the cuts 50 and 52 are provided in parallel with the cross section of the non-contact communication medium 10 having a small bending rigidity. Thereby, the bending deformation which is more likely to occur in the non-contact communication medium 10 can be effectively absorbed, and between the IC chip 30 and the antenna 20 and between the innermost peripheral end 22b and the outermost peripheral end 22c of the antenna 20. Good electrical connection (short circuit state) can be maintained between

  In addition, the base material sheet 12 of the non-contact communication medium 10 usually has a substantially rectangular shape in plan view, specifically a rectangular shape, and more specifically a rectangular shape. For this reason, the non-contact communication medium 10 tends to bend around an axis parallel to the long side or the short side of the rectangular shape. Therefore, it is also preferable that the cuts 50 and 52 include portions parallel to the long side and the short side of the rectangular outline so that these bends can be effectively absorbed.

  Further, the non-contact communication medium 10 is often used by being fixed to a mounted object P such as a product. In this case, as shown in FIG. 7, the non-contact communication medium 10 is fixed to the mounted object P via the adhesive 8 or the like so that the side on which the IC chip 30 is fixed faces the mounted object P. It is often done. According to such an arrangement, the IC chip 30 is covered with the base sheet 12, and there is an advantage that the IC chip 30 can be prevented from being damaged or dropped off due to contact with the outside.

  The IC chip 30 arranged on the base sheet 12 protrudes from the base sheet 12 by the thickness of the IC chip 30. Therefore, when the non-contact communication medium 10 is fixed to the mounted object P so that the IC chip 30 faces the mounted object P, the base sheet 12 is deformed around the portion 15 that supports the IC chip 30. In more detail, it gets excited.

  If the notch 50 is not formed in the base material sheet 12 of the non-contact communication medium 10, the base material sheet 12 is bent and bent around the portion 15 that supports the IC chip 30, as shown in FIG. It is done. In this case, as described above, the contact area between the connection electrode 32b of the IC chip 30 and the connection portion 34a of the antenna 20 is reduced, and furthermore, the electrical connection between the IC chip 30 and the antenna 20 is completely impaired. There is even a fear of it. In addition, since the base sheet 12 is fixed to the mounted object P in a deformed state, the restoring force of the base sheet 12 itself acts so as to peel the base sheet 12 from the mounted object P. Will do. For this reason, there is a possibility that the non-contact communication medium 10 may be peeled off from the mounted object P.

  On the other hand, according to the present embodiment, since the IC chip peripheral cut 50 is formed around the IC chip 30 of the base sheet 12, the deformation resistance force of the base sheet 12 in the portion where the cut 50 is provided ( (Rigidity) is weakened. Accordingly, the overall restoring force of the base sheet 12 when it is deformed is also reduced.

  Therefore, as shown in FIG. 7A, the base sheet 12 is largely deformed in the portion where the notch 52 is provided, and supports the force acting on the base sheet 12, especially the IC chip 30 of the base sheet 12. The force that should act on the portion 15 to be absorbed is absorbed by the notch 50. Thereby, the force which acts on the part 15 which supports the IC chip 30 of the base material sheet 12 is weakened, and it can suppress that the part 15 which supports the IC chip 30 of the base material sheet 12 deform | transforms greatly. .

  Therefore, in the non-contact communication medium 10 in the present embodiment, it is possible to maintain a good electrical connection between the IC chip 30 and the antenna 20 even after being fixed on the mounted object P. Moreover, since the restoring force of the base material sheet 12 is reduced by the cut 50, it is possible to prevent the non-contact communication medium from being peeled off from the base material sheet 12.

  The bridge member 25 protrudes from the base sheet 12 by the thickness of the bridge member 25. Therefore, when the non-contact communication medium 10 is fixed on the mounted object P so that the bridge member 25 faces the mounted object P, the above-described IC chip 30 is contacted without contacting the mounted object P. For the same reason as when the communication medium 10 is fixed on the mounted object P, there is a risk that the electrical connection between the IC chip 30 and the antenna 20 may be impaired. Furthermore, the non-contact communication medium 10 is mounted. There is also a risk of peeling off the object P.

  However, according to the present embodiment, the bridge member peripheral cut 52 is formed around the bridge member 25 of the base sheet 12, and the deformation resistance force of the base sheet 12 at the portion where the bridge cut 52 is provided ( (Rigidity) is weakened. Therefore, when the non-contact communication medium 10 is fixed to the mounted object P so that the bridge member 25 faces the mounted object P, the bridge cut 52 operates in the same manner as the IC chip peripheral cut 50 described above. To do.

  That is, the base sheet 12 is greatly deformed in the portion where the cut 52 is provided, and the force that should act on the portion 16 of the base sheet 12 that supports the bridge member 25 is absorbed by the cut 52. Thereby, the force which acts on the part 16 which supports the bridge member 25 of the base material sheet 12 is weakened, and it can suppress that the part 16 which supports the bridge member 25 of the base material sheet 12 deform | transforms greatly. .

  Therefore, in the non-contact communication medium 10 according to the present embodiment, even after the bridge member 25 is fixed to the mounted object P so as to face the mounted object, the innermost end 22b of the antenna 20 and the It can be remarkably suppressed that the electrical connection (short-circuit state) with the outer peripheral end 22c is impaired. Thereby, deterioration of antenna capability can be suppressed and excellent communication characteristics can be maintained. Moreover, since the restoring force (deformation resistance force) of the base sheet 12 in the portion where the notch 52 is provided is small, it is possible to suppress the non-contact communication medium 10 once fixed from being peeled off from the mounted object.

  As described above, according to the present embodiment, the cuts 50 are formed around the IC chip of the base sheet 12. And by this notch 50, the deformation | transformation in the part 15 which supports the IC chip 30 of the base material sheet 12 can be suppressed. Thereby, the favorable electrical connection between the IC chip 30 and the antenna 20 can be maintained.

  Further, according to the present embodiment, the cuts 50 are arranged outside the IC chip 30 of the base sheet 12 along the outline of the IC chip 30. Therefore, the deformation in the portion 15 of the base sheet 12 that supports the IC chip 30 can be more accurately suppressed, and thereby it is possible to maintain a better electrical connection between the IC chip 30 and the antenna 20. it can.

  Furthermore, according to the present embodiment, a plurality of cuts 50 are formed in the base sheet 12, and the plurality of cuts 50 are arranged so as to at least partially surround the IC chip 30. Therefore, the deformation in the portion 15 of the base sheet 12 that supports the IC chip 30 can be more accurately suppressed, and thereby it is possible to maintain a better electrical connection between the IC chip 30 and the antenna 20. it can.

  Further, according to the present embodiment, the non-contact communication medium 10 includes the bridge member 25 provided and fixed on the base sheet 12, and the notch 52 is formed around the bridge member 25 of the base sheet 12. Yes. And by this notch 52, the deformation | transformation in the part 16 which supports the bridge member 25 of the base material sheet 12 can be suppressed. Therefore, the electrical connection (short circuit) between the innermost peripheral end 22b and the outermost peripheral end 22c of the antenna 20 can be remarkably suppressed. Thereby, deterioration of antenna capability can be suppressed and excellent communication characteristics can be maintained.

  Furthermore, according to the present embodiment, the bridge member peripheral cuts 52 are arranged on the outer side of the bridge member of the base sheet 12 along the outline of the bridge member 25. Therefore, the deformation in the portion 16 that supports the bridge member 25 of the base sheet 12 can be more accurately suppressed, and thereby better electrical characteristics of the antenna 20 can be maintained.

  Further, according to the present embodiment, the plurality of bridge member peripheral cuts 52 are formed in the base sheet 12, and the plurality of cuts 52 are arranged so as to at least partially surround the IC chip 30. Therefore, the deformation in the portion 16 that supports the bridge member 25 of the base sheet 12 can be more accurately suppressed, and thereby better electrical characteristics of the antenna 20 can be maintained.

  Note that various modifications can be made within the scope of the present invention with respect to the first embodiment described above. Hereinafter, an example of a modification will be described.

  For example, in the above-described embodiment, as the IC chip peripheral notch 50, two notches 52a and 52b continuously arranged on the outer sides of a pair of opposing edges of the IC chip 30 having a rectangular outline. , 52c and 52d are shown, but the present invention is not limited to this. For example, three or more cuts may be continuously arranged on the outer sides of a pair of opposing edges of the IC chip 30.

  Hereinafter, with reference to FIG. 8 to FIG. 13, a further specific modification of the IC chip peripheral cut provided on the base sheet 12 will be described. However, in these modifications, the configuration of the cut is changed together with the configuration of the antenna, and the configuration other than the cut and the antenna is substantially the same as that of the embodiment described with reference to FIGS. 8 to 13, the same parts as those in the embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals, and detailed description thereof is omitted.

  First, a first modification example of cutting shown in FIG. 8 will be described.

  The configuration of the antenna 20 in Modification 1 is the same as that of the above-described embodiment, and the connection portion 22a is opposed to the IC chip 30 having a rectangular (more specifically, rectangular) outline in plan view. It extends outward from each edge. On the other hand, in the present modification, two or more cuts 50a, 50b, 50c, 50d arranged in succession are formed on the outer sides of a pair of opposing edges of the IC chip 30, respectively. Cutouts 54a and 54b are also formed on the outer sides of a pair of opposed edges of the IC chip 30 different from the opposed edge. That is, two or more (two in the illustrated example) cuts 50a and 50b continuously arranged on one side of the IC chip 30 (the right side in FIG. 8), and the other side of the IC chip 30 ( Two or more (two in the illustrated example) cuts 50c, 50d, a cut 50a, 50b on one side, and a cut 50c, 50d on the other side arranged continuously on the left side of the sheet of FIG. A total of six cuts including a pair of cuts 54c and 54d extending between them and a pair of cuts 54a and 54b disposed with the IC chip 30 in between form a cut 54 of this modification. The connection portion 22a of the antenna 20 extends from the portion 15 supporting the IC chip 30 through two cuts 50a and 50b (50c and 50d) arranged in succession to the outside. In other words, each connection portion 22a of the antenna 20 is either between two or more cuts 50a and 50b arranged on one side and between two or more cuts 50c and 50d arranged on the other side. Has passed.

  Next, Modification 2 shown in FIG. 9 will be described. In the second modification, as in the first modification, the connection portion 22a of the antenna 20 extends outward from the opposing edges of the IC chip 30 having a square outline in plan view. On the other hand, the notch 55 in the modified example 2 has a pair of notches 55a and 55b having a substantially U-shape in plan view. As shown in FIG. 9, the pair of cuts 55a and 55b are arranged so that the U-shaped opening portions (open portions) face each other, and the connection portion 22a of the antenna 20 is connected to the pair of cuts 55a and 55b. It passes between the ends of the U-shape. Therefore, the notch 55 surrounds the IC chip 30 from the side of the edge where the connection part 22a does not extend, and also partially surrounds the edge side where the connection part 22a extends.

  Next, Modification 3 shown in FIG. 10 will be described. In the third modification, the connection portion 22a of the antenna 20 extends outward from the opposing edge of the IC chip 30 having a rectangular outline in plan view. On the other hand, the notches 56 in the present modification are arranged on the outer sides of the edge of the IC chip 30 where the connection portion 22a of the antenna 20 does not extend, and face each other across the IC chip 30 along the edge. A pair of extending cuts 56a and 56b are provided.

  Next, Modification 4 shown in FIG. 11 will be described. In the fourth modification, the pair of connection portions 22a of the antenna 20 extends together from one end edge of the IC chip 30 having a square outline in plan view. On the other hand, in the present modification, the base sheet 12 is formed with three cuts 57a, 57b, and 57c that are respectively arranged on the outer sides of the three edges of the IC chip 30. The both ends of the central notch 57a provided in the center of the notches 57 are arranged close to one ends of the pair of side notches 57b and 57c provided on both sides of the central notch 57a. ing. Therefore, as shown in FIG. 11, the three cuts 57a, 57b, and 57c are arranged along a substantially U shape along the outline of the IC chip 30, and surround the IC chip 30 from three sides. It has become.

  Next, Modification 5 shown in FIG. 12 will be described. In the fifth modification, the configuration of the antenna 20 is the same as that in the fourth modification shown in FIG. On the other hand, in the present modification, the base sheet 12 is formed with a cut 58 that surrounds the IC chip 30 from three sides. In this modification, the portion surrounded by the cuts 58 of the base sheet 12 protrudes from the other portions in a tongue shape. Therefore, when the non-contact communication medium 10 is fixed to the mounted object P so that the IC chip 30 faces the mounted object P, the portion 15 of the base sheet 12 that supports the IC chip 30 is bent like a bow. It can shift to the thickness direction of the base material sheet 12 with respect to the part which is not surrounded by the notch | incision 58 of the base material sheet 12 without. Thereby, the favorable electrical connection between the IC chip 30 and the antenna 20 can be more accurately maintained.

  In addition, such a cut 58 partially breaks (breaks) the base material sheet 12 of the modified example 4 shown in FIG. 11, and the both ends of the central cut 57a and one end of the side cuts 57b and 57c. It can also be produced by connecting the gaps. It should be noted that the distance between the both ends of the center cut 57a and one end of the side cuts 57b and 57c and the shape of both ends of the center cut 57a and one end of the side cuts 57b and 57c are appropriately set. When a force is applied to the portion 32a surrounded by the notch 57 of the base sheet 12 by designing, the notch 58 in the present modification is changed from the notch 57 having the center notch 57a and the side notches 57b and 57c. Can be formed.

  Next, Modification 6 shown in FIG. 13 will be described. In the modified example 5, the connecting portion 22a of the antenna 20 extends outward from the adjacent edge of the IC chip 30 having a square outline in plan view. On the other hand, the cuts 59 in the present modification are disposed on the outer sides of the edge of the IC chip 30 where the connection portion 22a of the antenna 20 does not extend, and extend in an L shape along the edge.

  Furthermore, the various notches described above can be modified so as to be formed in a dotted line shape by continuously arranged through holes. As with the IC chip peripheral notch 50, the configuration of the bridge notch 52 can be variously modified.

  Further, in the above-described embodiment, the example in which the IC chip peripheral notch 50 and the bridge member peripheral notch 52 penetrate the base sheet 12 has been shown, but the present invention is not limited thereto, and the notches 50 and 52 are the base sheet 12. You may make it not penetrate. The notches 50 and 52 that do not penetrate the base sheet 12 can also suppress deformation of the portion 15 of the base sheet 12 that supports the IC chip 30. In such a modification, the notches 50 and 52 that do not penetrate the base sheet 12 may be formed only on one surface of the base sheet 12, or on both surfaces of the base sheet 12. The cuts 50 and 52 may be formed. Further, when the cuts 50 and 52 are formed on both surfaces of the base sheet 12, the cuts 50 and 52 may be arranged to face each other, or the cuts 50 and 52 are formed on one surface and the other surface. The configuration (shape) can be different.

  Furthermore, in the above-described embodiment and the modification thereof, an example in which the antenna 20 and the IC chip 30 are provided on one surface of the base sheet 12 is shown. However, the antenna 20 and the IC chip 30 are electrically connected. However, the antenna 20 and the IC chip 30 may be provided on different surfaces as long as they are secured.

  As mentioned above, although some modifications regarding 1st Embodiment have been demonstrated, naturally, it is also possible to apply combining several modifications suitably.

Second Embodiment Next, a second embodiment of a non-contact communication medium (information holding medium) according to the present invention and an embodiment of an interposer according to the present invention will be described with reference to FIGS. To do.

  14 to 17 are diagrams showing a second embodiment of a non-contact communication medium (information holding medium) according to the present invention and an embodiment of an interposer according to the present invention.

  14 is a top view showing a non-contact communication medium, FIG. 15 is a top view showing an interposer, FIG. 16 is a view for explaining the operation of the interposer, and FIG. 17 is a view showing the action of the non-contact communication medium. It is a figure explaining. 14 to 17, the same parts as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 14 to 17, the non-contact communication medium 10 in the present embodiment includes a non-conductive base sheet 12, an antenna 20 formed on the base sheet 12, and the base sheet 12. And an interposer 40 provided in the apparatus. Similar to the first embodiment, such a non-contact communication medium 10 is sometimes called an IC tag, and can communicate with an external device (reader / writer, etc.) in a non-contact state. If an external device (reader / writer or the like) is used, information recorded on the IC chip 30 can be read out via the antenna 20 or new information can be written into the IC chip 30 via the antenna 20.

  As shown in FIG. 14, the antenna 20 in the present embodiment is formed as a coiled antenna having a coiled portion 22. Such an antenna 20 is, for example, by applying a conductive ink on the base sheet 12 using a screen printer, or transferring a conductive foil made of copper, aluminum or the like onto the base sheet 12. Or by etching the conductive foil made of copper, aluminum, or the like laminated on the base sheet 12 and patterning the conductive foil into a desired shape, or the like.

  On the other hand, as particularly shown in FIG. 15, the interposer 40 includes a non-conductive support sheet 42, a pair of interposer conductors 44 disposed on the support sheet 42, and a pair of interposer conductors 44. IC chip 30 provided on support sheet 42 while being connected to portion 44a. In the present embodiment, the interposer 40 has a substantially rectangular shape, specifically a rectangular shape, and more specifically a rectangular outline.

  Among these, the support sheet 42 is made of PET, paper, or the like, like the base sheet 12. Usually, the thickness of the support sheet 42 is about 30 to 200 μm.

  As shown in FIG. 15, each interposer conductor 44 has a contact portion 44b and a connection portion 44a continuous to the contact portion 44b. In FIG. 15, which is a plan view, the connection portion 44a extends outward from a pair of opposing edges of the IC chip 30 having a square outline. As can be understood from FIG. 16A showing a cross section taken along the line XVI-XVI in FIG. 14, each contact portion 44 b of the interposer conductor 44 includes the innermost peripheral end portion 22 b of the coiled portion 22 of the antenna 20 and They are electrically connected (conducted) to the outermost peripheral end 22c. On the other hand, each connection portion 44a extends from the contact portion 44b to below the connection electrodes 32b of the IC chip 30, and is electrically connected (conducted) to the pair of connection electrodes 32b of the IC chip 30. That is, each interposer conductor 44 is for electrically connecting the connection electrode 32b of the IC chip 30 to one of the innermost peripheral end 22b and the outermost peripheral end 22c of the antenna 20, and its purpose. As long as the above can be achieved, the configuration including the shape and the like can be variously changed.

  Similar to the antenna 20, such an interposer conductor 44 is formed by, for example, applying conductive ink on the support sheet 42 using a screen printing machine, or conductive material made of copper, aluminum, or the like on the support sheet 42. It can be formed on the support sheet 42 by transferring the conductive foil or by etching the conductive foil made of copper, aluminum, or the like laminated on the support sheet 42 and patterning it into a desired shape. The thickness of the interposer conductor 44 is usually about 10 to 50 μm.

  The IC chip 30 is fixed to the support sheet 42 via the interposer conductor 44 by using an adhesive 38 made of, for example, an epoxy thermosetting resin. With such a configuration, the IC chip 30 is electrically connected to the interposer conductor 44 and is fixed to the support sheet 42. However, the electrical connection between the IC chip 30 and the interposer conductor 44 is not limited to such a method, and can be achieved by various methods. For example, electrical connection by ultrasonic bonding may be used, or electrical connection via a conductive or anisotropic conductive adhesive may be used.

  On the other hand, the interposer 40 is fixed to the base sheet 12 via the antenna 20 by using an adhesive 48 made of, for example, an epoxy thermosetting resin. With such a configuration, the interposer conductor 44 is electrically connected to the antenna 20 and is fixed to the base sheet 12. However, the electrical connection between the interposer conductor 44 and the antenna 20 is not limited to such a method, and can be achieved by various methods. For example, electrical connection by ultrasonic bonding may be used, or electrical connection via a conductive or anisotropic conductive adhesive may be used.

  15 and 16A, the support sheet 42 has a cut (IC chip peripheral cut) 50 that penetrates the support sheet 42 around the IC chip 30 of the support sheet 42. As shown in FIG. Is formed. As shown in FIG. 15, in the present embodiment, the cuts 50 are arranged outside the IC chip 30 of the support sheet 42 along the outline of the IC chip 30. A plurality of cuts are formed, and the plurality of cuts 50 are arranged so as to at least partially surround the IC chip 30.

  More specifically, as shown in FIG. 15, two cuts 52a, 52b, 52c, which are continuously arranged on the outer sides of a pair of opposing edges of the IC chip 30 having a rectangular outline, 52d is formed. Therefore, the cut 50 is constituted by a total of four cuts 50a, 50a, 50b, 50b. In other words, the two notches 50a and 50b arranged continuously on one side of the IC chip 30 (right side on the paper surface of FIG. 15) and the other side of the IC chip 30 (left side on the paper surface of FIG. 15) are continuous. The IC chip peripheral cut 50 according to the present embodiment is formed by the two cuts 50c and 50d arranged as described above. For this reason, as shown in FIG. 15, the portion (the portion facing the IC chip 30 of the base sheet 12) 17 that supports the IC chip 30 of the support sheet 42 has four cuts 50 a and 50 b. , 50c and 50d (enclosed).

  As shown in FIG. 15, the end edge of the IC chip 30 in which the notches 50 are arranged close to each other is an end edge from which the connecting portion 44 a of the above-described interposer conductor 44 extends. Then, the connecting portion 44a extends from the portion 17 supporting the IC chip 30 through two cuts 50a and 50b (50c and 50d) arranged in succession to the outside. In other words, each connecting portion 44a of the interposer conductor 44 passes either between the two cuts 50a and 50b arranged on one side and between the two cuts 50c and 50d arranged on the other side. ing.

  In addition, as well shown in FIGS. 14 and 16 (a), the base sheet 12 has a notch penetrating the base sheet 12 around the interposer 40 of the base sheet 12 (also referred to as an interposer peripheral notch). 52) is formed. As shown in FIG. 14, in the present embodiment, the cuts 52 are arranged outside the interposer 40 of the base sheet 12 along the contour of the interposer 40. A plurality of cuts are formed, and the plurality of cuts 52 are arranged so as to at least partially surround the interposer 40.

  More specifically, as shown in FIG. 14, the IC chip 30 having a rectangular (more specifically, rectangular) outline is disposed on each outer side of a pair of opposing corners with the tops of the corners interposed therebetween. Two straight cuts 52a, 52b, 52c, and 52d are formed, respectively. Two straight cuts located across the top of the corner extend along the two edges of the interposer 40 that forms the corner. Accordingly, a total of four cuts 52a, 52b, 52c, and 52d constitute the cut 52. In other words, two incisions that are located outside one corner of the interposer 40 having a rectangular (more specifically rectangular) outline and extend along each of the two edges of the interposer 40 that form the corner. 52a, 52b and two notches 52c, 52d which are arranged outside of the opposite corner (diagonal) of the corner 52a and extend along each of the two edges of the other corner of the interposer Thus, the interposer peripheral cut 52 of the present embodiment is configured. For this reason, as shown in FIG. 14, a portion (in this embodiment, a portion facing the bridge member 25 of the base sheet 12) 18 that supports the interposer 40 of the base sheet 12 has four cuts 52 a and 52 b. , 52c, 52d (enclosed).

  Next, operations of the non-contact communication medium 10 and the interposer 40 will be described mainly with reference to FIGS. 16 and 17.

  As described above, the interposer 40 is disposed on the base sheet 12 and fixed to the base sheet 12. At this time, as shown in FIG. 16 (a), the interposer 40 is arranged such that the side on which the IC chip 30 is fixed faces the base sheet 12, with the adhesive 48 or the like interposed therebetween. It is often fixed to. According to such an arrangement, the IC chip 30 is covered with the base sheet 12 and the support sheet 42, and there is an advantage that the IC chip 30 can be prevented from being damaged or dropped due to contact with the outside. .

  On the other hand, in the interposer 40, the IC chip 30 disposed on the support sheet 42 protrudes from the support sheet 12 by the thickness of the IC chip 30. Therefore, when the interposer 40 is fixed to the base sheet 12 so that the IC chip 30 faces the base sheet 12, the support sheet 42 is deformed around the portion 17 that supports the IC chip 30 (swelling). )

  If the IC chip peripheral notch 50 is not formed in the support sheet 42 of the interposer 40, the support sheet 42 is bent in a bow around the portion 15 supporting the IC chip 30, as shown in FIG. In such a case, the contact area between the connection electrode 32b of the IC chip 30 and the connection portion 22a of the antenna 20 decreases for the same reason as described with reference to FIG. 7 in the first embodiment described above, Furthermore, the electrical connection between the IC chip 30 and the antenna 20 may be completely lost. In addition, since the support sheet 42 is fixed on the base sheet 12 in a deformed state, the restoring force of the support sheet 42 itself acts to peel the support sheet 42 from the base sheet 12. become. For this reason, the contact part 44b of the interposer conductor 44 may be peeled off from the innermost peripheral end part 22b and the outermost peripheral end part 22c of the antenna 20, and the electrical connection between the IC chip 30 and the antenna 20 may be impaired. Furthermore, the interposer 40 may be peeled off from the base sheet 12.

  On the other hand, according to the present embodiment, since the IC chip peripheral cut 50 is formed around the IC chip 30 of the support sheet 42, the deformation resistance force (rigidity) of the support sheet 42 in the portion where the cut 50 is provided. Is weakened. Accordingly, the overall restoring force of the support sheet 42 when it is deformed is also reduced.

  Accordingly, as shown in FIG. 16A, the support sheet 42 is greatly deformed in the portion where the notch 50 is provided, and the force acting on the support sheet 42, particularly the portion 17 that supports the IC chip 30 of the support sheet 42. The force that should act on is absorbed by the notch 50. As a result, the force acting on the portion 17 of the support sheet 42 that supports the IC chip 30 is weakened, and the support sheet 42, in particular, the portion 17 of the support sheet 42 that supports the IC chip 30 is prevented from being greatly deformed. be able to. Therefore, in the interposer 40 in the present embodiment, it is possible to maintain a good electrical connection between the IC chip 30 and the interposer conductor 44 even after being fixed on the support sheet 42.

  Further, since the restoring force of the support sheet 42 is reduced by the cuts 50, the electrical connection (short circuit) between the contact portion 44b of the interposer conductor 44 and the connection portion 22a of the antenna 20 is impaired. Furthermore, it can suppress that the interposer 40 peels from the base material sheet 12. FIG.

  Furthermore, the non-contact communication medium 10 in which the interposer 40 is disposed on the base sheet 12 is often used by being fixed to a mounted object such as a product. In this case, the non-contact communication medium 10 is often fixed to the mounted object via an adhesive or the like so that the side on which the interposer 40 is fixed faces the mounted object. According to such an arrangement, the interposer is covered by the base sheet 12, and there is an advantage that the interposer 40 can be prevented from being damaged or dropped off due to contact with the outside.

  As can be understood from FIG. 16A, in the non-contact communication medium 10, the interposer 40 protrudes from the base sheet 12 by the thickness of the interposer 40. Therefore, when the interposer 40 is fixed to the mounted object so that the interposer 40 faces the mounted object, the base material sheet is used for the same reason as described with reference to FIG. 7 in the first embodiment described above. 12 may be deformed and the electrical connection between the antenna 20 and the interposer conductor 44 may be impaired, and the non-contact communication medium 10 may be peeled off from the mounted object.

  However, according to the present embodiment, the interposer peripheral notch 52 is formed around the interposer 40 of the base sheet 12, and the deformation resistance force (rigidity) of the base sheet 12 in the portion where the interposer peripheral notch 52 is provided. Is weakened. Therefore, when the non-contact communication medium 10 is fixed to the mounted object so that the interposer 40 faces the mounted object, the interposer peripheral notch 52 has the above-described IC chip 30 facing the base material sheet 12. In this way, the interposer 40 acts in the same manner as the IC chip peripheral notch 50 when the interposer 40 is arranged and fixed on the base sheet 12.

  That is, the base sheet 12 is greatly deformed at the portion where the cut 52 is provided, and the force that should act on the portion 18 of the base sheet 12 that supports the interposer 40 is absorbed by the cut 52. Thereby, the force which acts on the part 18 which supports the interposer 40 of the base material sheet 12 is weakened, and it can suppress that the part 18 which supports the interposer 40 of the base material sheet 12 deform | transforms greatly.

  Therefore, in the non-contact communication medium 10 in the present embodiment, the connection between the contact portion 44b of the interposer conductor 44 and the antenna 20 even after the interposer 40 is fixed to the mounted object so as to face the mounted object. It can be remarkably suppressed that the electrical connection (short circuit state) between the part 22a is impaired. Moreover, since the restoring force of the base material sheet 12 is reduced by the cut 50, it is possible to suppress the non-contact communication medium 10 from being peeled off from the mounted object.

  As described above, the base sheet 12 of the non-contact communication medium 10 is made of PET, paper, or the like. For this reason, during handling, the non-contact communication medium 10 is frequently bent like a bow due to a load from the outside and also due to the weight of the non-contact communication medium.

  For example, it is assumed that some force acts during handling of the non-contact communication medium 10 and the non-contact communication medium 10 is bent as shown in FIG. In this case, if the notch 52 is not formed in the base material sheet 12 of the non-contact communication medium 10, the base material sheet is the same as described with reference to FIGS. 5 and 6 in the first embodiment described above. There is a possibility that the electrical connection between the interposer conductor 44 and the antenna 20 may be impaired due to deformation in the portion 18 that supports the twelve interposers 40.

  On the other hand, according to the present embodiment, the interposer peripheral notch 52 is formed around the interposer 40 of the base sheet 12, and the deformation resistance force (rigidity) of the base sheet 12 in the portion where the notch 52 is provided is weak. It has been. Accordingly, as shown in FIG. 17, the base sheet 12 is greatly deformed in the portion where the notch 52 is provided, and the force that should act on the portion 18 that supports the interposer 40 of the base sheet 12 is absorbed by the notch 52. Is done. Thereby, it can suppress that the part 18 which supports the interposer 40 of the base material sheet 12 deform | transforms greatly. Therefore, the electrical connection between the interposer conductor 44 and the antenna 20 can be remarkably suppressed.

  Similarly, since the support sheet 42 of the interposer 40 is also made of PET or paper, the interposer 40 itself may be bent. If the notch 50 is not formed in the support sheet 42 of the interposer 40, the IC chip 30 of the support sheet 42 is supported in the same manner as described with reference to FIGS. 5 and 6 in the first embodiment. Due to the deformation in the portion 17, the electrical connection between the IC chip 30 and the interposer conductor 44 may be impaired.

  However, according to the present embodiment, the IC chip peripheral notch 50 is formed around the IC chip 30 of the support sheet 42 of the interposer 40, and the deformation resistance force (rigidity) of the support sheet 42 at the portion where the notch 50 is provided. ) Is weakened. Therefore, even if a bending moment acts on the support sheet 12 of the interposer 40, the support sheet 42 should be greatly deformed in the portion where the notch 50 is provided, and should act on the portion 17 of the support sheet 42 that supports the IC chip 30. This force is absorbed by the notch 50. Thereby, the force which acts on the part 17 which supports the IC chip 30 of the support sheet 42 is weakened, and it can suppress that the part 17 which supports the IC chip 30 of the support sheet 42 deform | transforms greatly. Therefore, the electrical connection between the IC chip 30 and the interposer conductor 44 can be remarkably suppressed.

  As described above, according to the interposer 40 in the present embodiment, the cut 50 is formed around the IC chip of the support sheet 42. The cut 50 can suppress deformation of the portion 17 of the support sheet 42 that supports the IC chip 30. Thereby, the favorable electrical connection between the IC chip 30 and the interposer conductor 44 can be maintained.

  Further, according to the interposer in the present embodiment, the cuts 50 are arranged along the outline of the IC chip 30 outside the IC chip of the support sheet 42. Therefore, the deformation of the support sheet 42 in the portion 17 that supports the IC chip 30 can be more accurately suppressed, and thereby a better electrical connection between the IC chip 30 and the interposer conductor 44 can be maintained. Can do.

  Furthermore, according to the interposer 40 in the present embodiment, the plurality of cuts 50 are formed in the support sheet 42, and the plurality of cuts 50 are arranged so as to at least partially surround the IC chip 30. Therefore, the deformation of the support sheet 42 in the portion 17 that supports the IC chip 30 can be more accurately suppressed, and thereby a better electrical connection between the IC chip 30 and the interposer conductor 44 can be maintained. Can do.

  According to the non-contact communication medium 10 in the present embodiment, the non-contact communication medium 10 includes the interposer 40 fixed to the base sheet 12, and the interposer peripheral cut 52 is formed around the interposer 40 of the base sheet 12. Has been. And by this notch 52, the deformation | transformation in the part 18 which supports the interposer 40 of the base material sheet 12 can be suppressed. Therefore, a good electrical connection between the interposer conductor 44 of the interposer 40 and the antenna 20 can be maintained.

  In addition, according to the interposer 40 in the present embodiment, the interposer peripheral cut 52 is disposed outside the interposer of the base sheet 12 along the contour of the interposer 40. Therefore, the deformation | transformation in the part 18 which supports the interposer 40 of the base material sheet 12 can be suppressed more correctly, and, thereby, the better electrical connection between the interposer conductor 44 of the interposer 40 and the antenna 20 is maintained. be able to.

  Furthermore, according to the interposer 40 in the present embodiment, a plurality of interposer peripheral cuts 52 are formed in the base sheet 12, and the plurality of cuts 52 are arranged so as to at least partially surround the IC chip 30. Therefore, the deformation | transformation in the part 18 which supports the interposer 40 of the base material sheet 12 can be suppressed more correctly, and, thereby, the better electrical connection between the interposer conductor 44 of the interposer 40 and the antenna 20 is maintained. be able to.

  Note that various modifications can be made within the scope of the present invention with respect to the above-described second embodiment. Hereinafter, an example of a modification will be described.

  For example, in the above-described embodiment, as the IC chip peripheral notch 50, two notches 50a, which are continuously arranged on the outer sides of a pair of opposing edges of the IC chip 30 having a rectangular outline, Although an example in which 50b, 50c, and 50d are formed is shown, the present invention is not limited to this. For example, three or more cuts may be continuously arranged on the outer sides of a pair of opposing edges of the IC chip 30. Further, the configuration of the IC chip peripheral notch 50 can be modified as in Modifications 1 to 6 described with reference to FIGS. 8 to 13 in the first embodiment. Further, the notch 50 can be deformed so as to be formed in a dotted line shape by continuously arranged through holes. Similarly to the IC chip peripheral notch 50, the configuration of the interposer peripheral notch 52 can be variously modified.

  In the above-described embodiment, an example in which the IC chip peripheral notch 50 penetrates the support sheet 42 has been described. However, the present invention is not limited thereto, and the notch 50 may not penetrate the support sheet 42. The notch 50 that does not penetrate the support sheet 42 can also suppress deformation of the portion 17 of the support sheet 42 that supports the IC chip 30. Similarly, although the example in which the interposer peripheral notch 52 penetrates the base sheet 12 has been shown, the present invention is not limited to this, and the notch 52 may not penetrate the base sheet 12. The notch 52 that does not penetrate the base sheet 12 can also suppress deformation in the portion 18 that supports the interposer 40 of the base sheet 12. In such a modification, the notches 50 and 52 that do not penetrate the sheets 42 and 12 may be formed on only one surface of the sheets 42 and 12, or both surfaces of the sheets 42 and 12 may be formed. The cuts 50 and 52 may be formed. In addition, when the cuts are formed on both surfaces of the sheets 42 and 12, the cuts 50 and 52 may be arranged to face each other, and the configuration (shape) of the cut between one surface and the other surface is used. It can be different.

  Furthermore, in the above-described embodiment and the modification thereof, an example in which the antenna 20 and the IC chip 30 are provided on one surface of the base sheet 12 is shown. However, the antenna 20 and the IC chip 30 are electrically connected. However, the antenna 20 and the IC chip 30 may be provided on different surfaces as long as they are secured.

  Furthermore, in the embodiment described above, the example in which the antenna 20 is a coiled antenna has been shown. However, as described in the first embodiment, depending on the type of electromagnetic wave used for non-contact communication, For example, an antenna that is composed of a pair of substantially rod-shaped conductors and functions as a dipole antenna may be used. Even if the configuration of the antenna is changed, the interposer peripheral cut 52 is formed in the base sheet 12 and the IC chip peripheral cut 50 is formed in the support sheet 42 by appropriately changing the configuration of the interposer conductor 44 and the like. can do.

  As mentioned above, although some modifications regarding 2nd Embodiment have been demonstrated, naturally, it is also possible to apply combining several modifications suitably.

The top view which shows 1st Embodiment of the non-contact communication medium by this invention. Sectional drawing along the II-II line of FIG. Sectional drawing along the III-III line of FIG. The top view which shows the other example of a non-contact communication medium. The figure explaining the effect | action of a non-contact communication medium. The figure explaining the effect | action of a non-contact communication medium. The figure explaining the effect | action of a non-contact communication medium. The top view which shows the modification of a non-contact communication medium. The top view which shows the modification of a non-contact communication medium. The top view which shows the modification of a non-contact communication medium. The top view which shows the modification of a non-contact communication medium. The top view which shows the modification of a non-contact communication medium. The top view which shows the modification of a non-contact communication medium. The top view which shows 2nd Embodiment of the non-contact communication medium by this invention. The top view which shows one Embodiment of the interposer by this invention. The figure explaining the effect | action of a non-contact communication medium. The figure explaining the effect | action of a non-contact communication medium.

Explanation of symbols

10 Non-contact communication medium 12 Base material sheet 20 Antenna 25 Bridge member 30 IC chip 40 Interposer 42 Support sheet 44 Conductors 50, 52, 54, 55, 56, 57, 58, 59

Claims (19)

A non-conductive substrate sheet;
An antenna formed on the base sheet;
An IC chip connected to the antenna,
A non-contact communication medium, wherein a cut is formed around an IC chip of the base sheet.   The contactless communication medium according to claim 1, wherein the cut is arranged along an outline of the IC chip outside the IC chip of the base sheet.   The contactless communication medium according to claim 1, wherein a plurality of cuts are formed in the base sheet, and the plurality of cuts are disposed so as to at least partially surround the IC chip.   The contactless communication medium according to any one of claims 1 to 3, wherein the base sheet is formed with a pair of cuts extending across the IC chip. The IC chip has a substantially rectangular outline in plan view,
4. The device according to claim 1, wherein two or more cuts arranged in succession are formed on the outer sides of a pair of opposing edges of the IC chip in the base sheet. 5. A contactless communication medium according to claim 1.   6. The non-cut according to claim 5, wherein notches are also formed on the outer sides of another pair of opposed edges of the IC chip different from the pair of opposed edges. Contact communication medium. The IC chip has a substantially rectangular outline in plan view,
The non-contact according to any one of claims 1 to 3, wherein the base sheet is formed with three cuts arranged respectively outside the three edges of the IC chip. Communication medium.   Of the three cuts, both ends of the central cut provided in the center are respectively disposed close to one end of a pair of side cuts provided on both sides of the central cut. The contactless communication medium according to claim 7.   The contactless communication medium according to any one of claims 1 to 3, wherein a cut is formed in the base sheet to surround the IC chip from three directions. The antenna has a bridge member that short-circuits a predetermined portion of the antenna provided on the base sheet,
A non-contact communication medium, wherein a cut is further formed around a bridge member of the base sheet.   The contactless communication medium according to claim 10, wherein the notches around the bridge member are arranged along the outline of the bridge member outside the bridge member of the base sheet.   The non-cut according to claim 10 or 11, wherein a plurality of cuts are formed around a bridge member of the base sheet, and the plurality of cuts are arranged so as to at least partially surround the bridge member. Contact communication medium. A non-conductive substrate sheet;
An antenna formed on the base sheet;
An interposer having a non-conductive support sheet, a conductor disposed on the support sheet, and an IC chip connected to the conductor, wherein the conductor is connected to the antenna. ,
A non-contact communication medium, wherein a cut is formed around the interposer of the base sheet.   The non-contact communication medium according to claim 13, wherein the cut is disposed along an outline of the interposer outside the interposer of the base sheet.   The contactless communication medium according to claim 13 or 14, wherein a plurality of cuts are formed in the base sheet, and the plurality of cuts are arranged so as to at least partially surround the interposer. A non-conductive support sheet;
A conductor disposed on the support sheet;
An IC chip connected to the conductor,
An interposer for a non-contact communication medium, wherein a notch is formed around an IC chip of the support sheet.   17. The interposer according to claim 16, wherein the cut is disposed along an outline of the IC chip outside the IC chip of the support sheet.   The interposer according to claim 16 or 17, wherein a plurality of cuts are formed in the support sheet, and the plurality of cuts are arranged so as to at least partially surround the IC chip.   A non-contact communication medium comprising the interposer according to any one of claims 16 to 18.

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