JP2007266159A - Fitting jig, reflow jig using the same, and method for operating fitting jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a convenient fitting jig capable of reliably holding and fixing a wiring board to a plate even when the jig is repetitively used or a work time in one operation is long, and suppressing warp in a reflow soldering work; and to provide a reflow jig using the fitting jig, and a method for operating the fitting jig. <P>SOLUTION: The reflow jig 1 is composed of the fitting jig 3 and the plate 2. The fitting jig 3 includes: a deforming part 3a having at least elastic force so as to be deformed by the addition of force from an outer part; a lock 3e which is formed between a first wiring board pressing part 3c arranged at the end of the second constituting part 17 of the fitting jig 3 and the upper surface of a projection 3b arranged at around the middle of the second constituting part 17 and projected sideward; and a fitting board 3g for restricting a vertical movement when the fitting jig 3 is fitted to an opening 4 arranged in the plate 2. The fitting jig 3 is attachable/detachable to/from the opening 4, and the wiring board is held and fixed to the plate 2 with the use of the lock 3e by using the elastic force of the deforming part 3a. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a fixing jig that suppresses warping of a thin wiring board when an electronic component is reflow soldered to a thin wiring board, a reflow jig using the same, and a method of operating the fixing jig.

  Conventionally, when reflow soldering electronic parts to a thin wiring board, the heat of the reflow furnace warps the thin wiring board, resulting in a negative impact on the solder connection reliability of the mounted parts May occur. A thin wiring board usually means a printed wiring board or a printed board.

  In order to solve this problem, a technique of holding a thin wiring board on a flat plate using an adhesive force or an adhesive force when performing a reflow soldering operation has been put into practical use. Although this method is simple and easy, it is difficult to stably maintain the above-mentioned adhesion or adhesive force over a long period of time. That is, when the working time per time is long, the adhesion or adhesive force is reduced by the heat of the reflow path, and as a result, it becomes difficult to hold the thin wiring board on the flat plate. Moreover, when the adhesive force or adhesive force is obtained with an adhesive tape or the like, the adhesive force or adhesive force is reduced by repeated use. In addition, since a substance having adhesion or adhesive force is used, it is necessary to periodically clean the plate. Therefore, the above-mentioned problem still occurs because it is not always guaranteed that the flat surface of the thin wiring board is stably maintained.

  FIG. 8 is a partially enlarged cross-sectional view of the substrate holding jig disclosed in Patent Document 1 after the printed circuit board is mounted. This Patent Document 1 describes “a substrate holding jig, a substrate holding structure, and a component mounting method used in a reflow soldering process for mounting an electronic component on a printed circuit board. In other words, the object is that the structure is simple, the cost is low, the durability is high, the warping of the printed circuit board can be significantly suppressed, and the mounting defects can be reduced.

  In order to achieve the object, the metal plate 21 having the holding surface 21a for holding the printed circuit board 24 and the positions corresponding to the through holes 25 in the vicinity of the four corners of the printed circuit board 24 on the holding surface 21a of the metal plate 21 are provided. There is disclosed a substrate holding jig 20 including a fixing claw 22 having a substrate press-fitting portion 23 formed between the holding surface 21a and the thickness of the printed circuit board 24 or less.

  The substrate holding jig 20 is used in such a manner that the substrate holding jig 20 is superposed on the side facing the mounting surface of the printed circuit board 24 and the substrate holding jig 20 is fixed to the through holes 25 near the four corners of the printed circuit board 24. The nail 22 is inserted. Next, the printed board 24 and the board holding jig 20 are moved relatively parallel to the mounting surface, and the printed board 24 is press-fitted and fixed to the board press-fitting portion 23. Thereafter, electronic components are placed on the printed circuit board 24 and reflow soldering is performed. After the reflow soldering process, the board holding jig 20 is removed from the printed board 24, and the board holding jig 20 is reused.

  FIG. 9 is a perspective view (a) and a cross-sectional view (b) showing an embodiment of a printed wiring board warpage preventing method disclosed in Patent Document 2. FIG. This patent document 2 describes that “electronic component 30 is made to be a thin printed wiring board for the purpose of sufficiently suppressing warpage of the printed wiring board when electronic components are reflow soldered to a thin printed wiring board”. Before mounting on 32, the warp prevention metal fitting 33 is inserted from the notches 34 formed on both sides of the printed wiring board 32 mounted on the transport board 31, and the opening and the thin printed wiring board are inserted. The both ends of 32 are clamped together with the conveyance board 31 and the two warpage prevention metal fittings 33 are mounted, whereby both ends of the thin printed wiring board 32 are pressed against the conveyance board 31 by the warpage prevention metal fitting 33. Thereafter, when the electronic component 30 is placed on the thin printed wiring board 32 and reflow soldered to the printed wiring board 32, the printed wiring board 32 is exposed to a high temperature atmosphere in a reflow furnace, Warpage prevention bracket 3 Not the pressing force falls, because of the firm pressing the printed wiring board 32 to the transport board 31, warpage of thin printed wiring board 32 discloses an embodiment of suppressed is "to a minimum.

  Although the printed circuit board or the wiring board can be held and fixed by the methods disclosed in Patent Documents 1 and 2, the substrate holding jig of Patent Document 1 must (1) provide a through hole on the printed circuit board side. (2) If the vertical piece 22b hanging from the tip of the horizontal piece 22a of the fixing claw 22 is worn by repeated use, the printed circuit board cannot be fixed. (3) The lower end of the hanging piece 22b and the holding surface 21a Since the interval is formed below the thickness of the printed circuit board 24 and serves as a board press-fitting portion, there are cases in which the printed circuit board 24 may be damaged when the printed circuit board 24 is mounted. Further, the method for preventing warping of a printed wiring board disclosed in Patent Document 2 is that when the transport board 31 and the printed wiring board 32 are fixed by the warp preventing metal fitting 33 at the notch 34 of the transport board 31, the warp preventing metal fitting 33 is printed wiring. Since it is a long one that matches the length of the board 32 and it is necessary to widen the portion where the thin printed wiring board 32 and the transport board 31 are sandwiched, it is difficult to fix it easily in a short time. It has become a bad thing.

JP-A-2005-303134 Japanese Patent Laid-Open No. 11-46060

  As described above, with respect to the conventional reflow jig, there are some problems in either method, and the usability is very poor. Accordingly, the object of the present invention is to solve the problems of the prior art, and is easy to use and can be used repeatedly, and even if the work time is long, the wiring board is securely held and fixed to the plate, and reflow is performed. It is an object of the present invention to provide a fixing jig capable of suppressing warpage during soldering, a reflow jig using the same, and a fixing jig operating method.

  The fixing jig of the invention of the present application forms a first component part, a second component part, and a deforming part, which are opposed to each other by a member having heat resistance and elastic force, in a substantially U-shape through the deforming part, The component part is provided with at least a second wiring board pressing part and a fixing plate part, and the second component part is a fixing jig provided with at least a first wiring board pressing part, a convex part and a locking part. The second wiring board pressing part is formed by bending the end of the first component part outward, and the fixing plate part is perpendicular to the second wiring board pressing part on the surface of the first component part. The first wiring board pressing part is formed by bending the end of the second component part outward, and the convex part is outward in the middle of the second component part. Formed by the lower surface of the first wiring board pressing portion and the upper surface of the convex portion. The locking portion is formed, the height of the upper end of the fixed plate portion provided in the first component portion from the bottom of the deformable portion and the upper surface of the convex portion provided in the second component portion. The height of the deformable portion from the bottom is the same as that of the deformable portion.

  Further, the first component, the second component, and the deformable portion that are opposed to each other by a member having heat resistance and elastic force are formed in a substantially U-shape through the deformable portion, and the first component has at least A fixing jig in which a second wiring board pressing portion and a fixing plate portion are provided, and the second component portion is provided with at least a first wiring board pressing portion, a convex portion, a locking portion, and another locking portion; The second wiring board pressing portion is formed by bending an end portion of the first component portion outward, and the fixing plate portion is a surface of the first component portion in a direction perpendicular to the second wiring board pressing portion. The first wiring board pressing part is formed by bending the end of the second component part outward, and the convex part is formed in the middle of the second component part. It is formed so as to protrude toward the front, and the front surface is formed by the lower surface of the first wiring board pressing portion and the upper side surface of the convex portion. A locking portion is formed, the other locking portion is formed by the lower surface of the convex portion and the deformation portion, and the bottom of the deformation portion at the upper end of the fixed plate portion provided in the first component portion The height from the bottom and the height from the bottom of the deformed portion of the upper surface of the convex portion provided in the second component may be the same.

  The fixing jig holds and fixes a wiring board for reflow soldering to a plate. The fixing jig is configured to be fitted and fitted in an opening formed in the plate in a vertical direction so that the wiring board is held and fixed to the plate and is removable from the opening. A plurality of fixing jigs and openings are provided as necessary.

  The fixing jig is made of a member having heat resistance and elastic force, such as a metal plate or plastic resin, and is configured to be deformed when an external force is applied to the deformed portion and to release the wiring board that has been held and fixed. The When plastic resin is used, it may be formed by extrusion molding. The locking part is the part that holds and fixes the wiring board to the plate, and is provided so as to protrude laterally in the middle of the first wiring board holding part and the second constituent part provided at the end of the second constituent part. It is formed between the upper surface of the projected part. The fixing plate portion of the first component portion is for restricting the vertical movement of the fixing jig, and protrudes substantially parallel to the surface of the first component portion in the direction perpendicular to the second wiring board pressing portion. The positions of the upper end of the fixed plate portion and the upper side surface of the convex portion are the same. Therefore, in the state in which the wiring board is held and fixed, the upper end of the fixed plate portion and the upper side surface of the convex portion are in contact with the back surface of the plate and the vertical movement is restricted. The reason why the first plate is substantially parallel to the surface of the first component is that even if the fixed plate portion is slightly bent, there is no difference in the adoption effect as long as the bent shape is within the minor axis of the opening. Because. The vertical length of the locking portion is equal to the sum of the thickness of the plate on which the wiring board is placed and the thickness of the wiring board, and the lateral width of the first component and the second component Are the same, and the value obtained by adding the width of the fixed plate portion to the width is equal to or less than the major axis of the opening provided on the plate on which the wiring board is placed and the fixing jig is vertically inserted. It is desirable to do.

  By adopting such a configuration, it is easy to use and can be used repeatedly, and even if a single work time is long, the wiring board is securely held and fixed to the plate, and warpage can be suppressed during the reflow soldering process. The effect that it can be done will be demonstrated.

  A reflow jig of the present invention is a reflow jig comprising the fixing jig according to any one of claims 1 to 3 and a plate on which a wiring board is placed, and the fixing jig is provided on the plate. The wiring board is held and fixed to the plate by the locking portion by using the elastic force of the deforming portion of the fixing jig fitted into the opening. The plate may be provided with a component relief opening so that the double-sided mounting wiring board can be held and fixed.

  By adopting such a configuration, it is easy to use and can be used repeatedly, and even if a single work time is long, the wiring board can be securely held and fixed to the plate, and warpage can be suppressed during the reflow soldering process. The effect will be demonstrated.

  The operation method of the fixing jig according to the present invention is such that the wiring board is held and fixed to the plate by the fixing jig according to any one of claims 1 to 3, and from the bottom of the deforming portion to the deforming portion of the fixing jig. By applying an obliquely upward force toward the second wiring board pressing part, the first wiring board pressing part of the fixing jig is separated from the wiring board and released from a state where the wiring board is held and fixed. It is characterized by.

  In addition, when the wiring board is placed at a position to be held and fixed on the plate and is held and fixed by the fixing jig according to any one of claims 1 to 3, the fixing jig is provided on the plate. Inserted into the opening, the plate is positioned between the fixed plate portion and the second wiring board pressing portion, and the lower portion of the convex portion is in contact with the plate, or the other The holding part is in contact with the plate, and the wiring board is held and fixed between the first wiring board holding part and the plate by applying a force from above to the first wiring board holding part. It is characterized by being.

  When there are a plurality of the fixing jigs, a force is simultaneously applied to the first wiring board pressing portions or the deformations of the plurality of fixing jigs, and the wiring board is held and fixed to the plate or the wiring The plate may be released from the plate.

  By adopting such a method, it becomes possible to operate the fixing jig at a time, and the work efficiency at the production site is greatly improved.

According to the fixing jig of the present invention, the reflow jig using the fixing jig, and the operation method of the fixing jig, the following excellent effects are exhibited.
(1) The wiring board can be easily held and fixed to the plate.
(2) In the reflow soldering process, it is possible to sufficiently suppress warping of the wiring board.
(3) Since a plurality of fixing jigs can be attached to and detached from the plate at a time, the work efficiency at the production site is greatly improved.
(4) The wiring board can be securely held and fixed to the plate even if it is used repeatedly or even if the time for one operation is long.
(5) Since the wiring board is not warped, the reliability of component mounting and connection is improved.
(6) Cleaning of the jig is not necessary.
(7) The ease of use improves the workability of reflow soldering work at the production site.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the disclosed embodiments.

  FIG. 1 is a perspective view of a reflow jig of the present invention. The reflow jig 1 includes a fixing jig 3 and a plate 2. An opening 4 is provided in the plate 2 as necessary so that the fixing jig 3 can be fitted (fitted) vertically to the plate 2. In FIG. 1, four openings 4 are provided, which are configured to hold the four sides of the thin wiring board with the fixing jig 3. The plate 2 is made of metal in order to suppress deformation due to heat of the reflow furnace in the reflow soldering process as much as possible, and the thickness thereof is appropriately determined depending on the size and thickness of the thin wiring board. .

  The fixing jig 3 was formed by bending a single metal plate into a substantially U-shaped cross section. That is, the first component 16 and the second component 17 were formed by bending so that the two surfaces face each other, and the two components were continuous via the deformable portion 3a. The first component portion 16 is provided with a second wiring board pressing portion 3d and a fixed plate portion 3g by bending the end portion outward. The fixed plate portion 3g is formed so as to protrude in parallel to the surface of the first component portion 16 in a direction perpendicular to the second wiring board pressing portion 3d, and the maximum lateral width of the fixed jig 3 determined by the fixed plate portion 3g is: This coincides with the length of the long side of the opening 4.

  The second component 17 includes a first wiring board pressing portion 3c, a locking portion 3e, a convex portion 3b, and another locking portion 3f, which are bent continuously from the end portion. And are continuously connected via the first component 16 and the deformable portion 3a. The deformable portion 3a is configured to have an elastic force, and when the external force is released, the distance between the first wiring board pressing portion 3c and the second wiring board pressing portion 3d is short of the opening 4. The predetermined interval is longer than the length of the side. Further, the deformable portion 3a can be deformed in a direction in which the distance between the first wiring board pressing portion 3c and the second wiring board pressing portion 3d is reduced, and since it has an elastic force, a force to deform from the outside is exerted. If it is not added, it will be restored. The width of the second component 17 matches the width of the first component 16 excluding the fixed plate portion 3g, and is shorter than the length of the long side of the opening 4.

  The locking part 3e is formed between the first wiring board pressing part 3c and the convex part 3b provided so as to protrude laterally at the side part of the second component part 17 constituting the fixing jig 3. The thickness of the locking portion 3e, that is, the distance between the lower surface of the first wiring board pressing portion 3c and the upper side surface of the convex portion 3b is equal to the sum of the thicknesses of the plate 2 and the thin wiring board to be pressed. Further, the thickness of the convex portion 3b and the other locking portion 3f may be substantially equal to the thickness of the locking portion 3e.

  The position of the upper end of the fixing plate part 3g provided in the first component part 16 constituting the fixing jig 3 and the position of the upper side surface of the convex part 3b provided in the second component part 17 constituting the fixing jig 3 are the same. It is necessary to be. That is, the distance from the lower surface of the second wiring board pressing portion 3d to the upper end of the fixed plate portion 3g and the distance from the lower surface of the first wiring board pressing portion 3c to the upper side surface of the convex portion 3b are configured to be the same. ing. With such a configuration, a thin wiring board can be held and fixed between the plate 2 and the first wiring board pressing portion 3c.

  FIG. 2 is an explanatory view showing a usage mode of the present reflow jig. Three modes (modes) when the fixing jig 3 is fitted into the opening 4 of the plate 2 are shown. A is a fixed mode, B is an open mode, and C is a fixed mode in which a thin wiring board is held and fixed. In any case, the fixing jig 3 is inserted into the opening 4, and the upper end of the fixing plate 3g of the fixing jig 3 is laterally hidden so as to be in contact with the lower surface of the plate 2 (in FIG. 2, from the symbol C to the symbol A direction). ), The fitting of the fixing jig 3 into the plate 2 is completed.

  The mode A in FIG. 2 is a fixed mode, and the thin wiring board is not held and fixed. In this aspect A, the fixing jig 3 is simply inserted into the opening 4 and the fixing jig 3 is slid in the lateral direction. In this state, when the first wiring board pressing part 3c and the second wiring board pressing part 3d are pressed from above, the fixing jig 3 also moves downward. Conversely, even if the deforming portion 3a is pushed in the vertical direction from below, the fixed plate portion 3g abuts on the lower surface of the plate 2 and does not move upward, but when a certain force or more is applied, the deforming portion 3a is deformed. This will be described in the description of aspect B below.

  Aspect B corresponds to a case where a force upward obliquely is applied to the deformed portion 3a of the fixing jig 3 from below with the fixing jig opening tool as shown in FIG. The diagonally upward direction means that the position of the deformed portion 3a slightly moved from the center (substantially U-shaped bottom portion) to the other engaging portion 3f side and the second wiring board pressing portion 3d, as described with reference to the sectional view of the fixing jig 3. Means the direction of connecting When a diagonally upward force is applied to the deforming portion 3a with the fixing jig opening tool, the deforming portion 3a is first deformed, and the second component 17 having the first wiring board pressing portion 3c is bent inward, and the first wiring board pressing portion is formed. The space | interval of 3c and the 2nd wiring board holding | suppressing part 3d becomes narrow. When a further force is applied, the distance between the outside of the first component 16 of the fixing jig 3 and the top of the convex portion 3b of the second component 17 becomes shorter than the length of the short side of the opening 4, and the fixing jig The second second component 17 moves upward from the opening 4. The first component 16 cannot move upward due to the fixed plate portion 3g. And when the top part of the convex part 3b passes the plate 2, with the elastic force of the deformation | transformation part 3a, the other latching | locking part 3f contact | abuts the edge of the long side of the opening part 4, and the aspect like B of FIG. Become.

  In the aspect C, the edge of the portion of the thin wiring board 5 to be pressed is set along the long side of the opening 4, the fixing jig 3 is inserted into the opening 4, and the first wiring board pressing portion at the locking portion 3 e. A state in which the thin wiring board 5 and the plate 2 are locked between 3c and the upper side surface of the convex portion 3b and then the fixing jig 3 is slid in the lateral direction is shown. In this case, since the fixed plate portion 3g and the upper side surface of the convex portion 3b are at the same position and the plate 2 comes into contact therewith, the thin wiring board 5 has the plate 2, the first wiring board holding portion 3c, Will be securely held and fixed.

  FIG. 3 is a perspective view showing a state in which the thin printed wiring board 5 is held and fixed by the reflow jig of the present invention. In this case, each side of the thin wiring board 5 is held and fixed by one fixing jig 3. After holding and fixing in this way, the process proceeds to a reflow soldering process. The force for holding and fixing the thin wiring board 5 to the plate 2 depends on the size of the fixing jig 3 and the opening 4 and the elastic force of the deforming portion 3a of the fixing jig 3, and is held and fixed with an optimum force. It can be designed as appropriate. In addition, the elastic force of the deformable portion 3a depends on the metal material used for the fixing jig 3, and can be appropriately designed in this respect. Further, the fixing jig 3 can be made of a heat-resistant plastic resin.

  FIG. 4 is an explanatory diagram showing one countermeasure when the thin wiring board 5 is a double-side mounting type in FIG. It is assumed that the soldering operation of the electronic component has been completed on one surface (referred to as the front surface) of the double-side mounted thin wiring board 6. In order to perform the reflow soldering operation on the other surface, a component relief opening 6b is appropriately provided on the plate 2 so that the front surface mounting component 6a mounted on the front surface does not get in the way of the plate 2. Yes. After the front surface mounting component 6a is stored in the component relief opening 6b, the double-sided mounting type thin printed circuit board 6 can be held and fixed to the plate 2 in the same manner as in FIG. The position on the plate 2 of the double-sided mounting type thin wiring board 6, that is, the double-sided mounting type thin wiring board mounting position 7 is drawn on the plate 2 with a broken line. It is only necessary to draw accordingly.

  5 to 7 are modified examples of the fixing jig 3. That is, in the fixing jig 3 shown in FIGS. 5 to 7, the shape of the deformable portion 3 a is changed so as not to intentionally form the other engaging portion 3 f of the second component 17 of the fixing jig 3. Further, the second wiring board pressing part 3d and the upper end of the fixing plate part 3g are arranged so that the second wiring board pressing part 3d contacts the plate 2 when the first wiring board pressing part 3c locks the wiring board 6. The distance is shortened. Even if comprised in this way, there is no difference in an effect | action and effect with the fixing jig 3 mentioned above.

  FIG. 5 is an explanatory view showing an outline of the reflow soldering process of the thin wiring board 5 held and fixed by the reflow jig 1 of the present invention. FIG. 5A shows that the cream solder 9 is required by the squeegee 10. It shows a state where it is applied to the part and soldered. In this case, the solder mask 8 is placed on the thin wiring board 5 held and fixed by the reflow jig of the present invention. The cream solder 9 is squeezed from above the solder mask 8, and the cream solder 9 is applied to a necessary portion, and then heat is applied in a reflow furnace to perform the soldering operation. Since the thin wiring board 5 is securely held and fixed to the plate 2 by the reflow jig of the present invention, no warping occurs even when heat is applied to the thin wiring board 5, and highly reliable soldering is possible. Is possible. The substrate holding pins 11 can be used as necessary. Further, in some cases, the portion of the solder mask 8 where the first wiring board pressing portion 3c comes into contact is lifted by the thickness of the first wiring board pressing portion 3c, and therefore it is necessary to cut the thickness. This is possible by half-etching the lower surface of the solder mask 8.

  FIG. 5B shows a state where electronic components are mounted on the thin wiring board 5 by the component mounting machine 13. Also in this case, since the thin wiring board 5 is securely held and fixed to the plate 2 by the reflow jig of the present invention, warping occurs even if components are mounted on the thin wiring board 5 by the component mounting machine 13. Therefore, highly reliable soldering is possible. The substrate holding pins 11 can be used as necessary.

  6 and 7 illustrate the operation method of the fixing jig of the present invention. FIG. 6 is a schematic cross-sectional view for explaining a state in which the thin wiring board 5 held and fixed to the plate 2 by the fixing jig 3 is opened using the fixing jig opening jig 14. This open state corresponds to the open mode of the mode B of the fixing jig 3 described in FIG. The fixing jig 3 is of a type that does not have the other locking portions 3f described above, and that the length of the second wiring board pressing portion 3d and the fixing plate portion 3g is short. The fixing jig opening jig 14 may be any shape or material as long as it can simultaneously apply an obliquely upward force to one or a required number of the deformed portions 3a of the fixing jig 3. In FIG. 6, a wooden rectangular parallelepiped that can apply force to the deformed portions 3 a of the two fixing jigs 3 at the same time is adopted.

  When a diagonally upward force is applied to the deforming portion 3a by the fixing jig opening jig 14, the deforming portion 3a is first deformed, and the second component 17 having the first wiring board pressing portion 3c is bent inward, so that the first wiring The distance between the plate pressing portion 3c and the second wiring board pressing portion 3d becomes narrow. When a further force is applied, the distance between the outside of the first component 16 of the fixing jig 3 and the top of the convex portion 3b of the second component 17 becomes shorter than the length of the short side of the opening 4, and the fixing jig The second second component 17 moves upward from the opening 4. The first component 16 cannot move upward due to the fixed plate portion 3g. When the top of the convex portion 3 b passes through the plate 2, the lower portion of the convex portion 3 b of the second component 17 of the fixing jig 3 contacts the edge of the long side of the opening 4 by the elastic force of the deformable portion 3 a. Then, the state shown in the lower diagram of FIG. 6 is obtained. Here, as described above, as described above with reference to the cross-sectional view of the fixing jig 3, the diagonally upper portion refers to the point moved from the center (substantially U-shaped bottom) to the convex portion 3 b side in the deformed portion 3 a and the second wiring board. It means the direction connecting the pressing part 3d. The portion to which the force is applied by the fixing jig opening jig 14 is a point moved from the center of the deformed portion 3a (substantially U-shaped bottom) to the convex portion 3b side, and the point and force are applied in FIG. The direction is indicated by an arrow.

  FIG. 7 is a schematic cross-sectional view for explaining the operation of the fixing jig 3 using the fixing / fixing jig 15 for holding and fixing the thin wiring board 5 to the plate 2. First, a thin wiring board 5 to be held and fixed on the plate 2 is placed. Then, the fixing jig 3 is inserted into the opening 4, and the lower portion of the convex portion 3 b of the second component 17 of the fixing jig 3 is locked to the plate 2. In this state, the fixing jig 3 is stopped by the elastic force of the deformable portion 3a. After all the fixing jigs 3 are in such a state, a force is applied from above the fixing jig 3 using the fixing jig fixing tool 15. Then, the fixing jig 3 is deformed by applying a force to the deforming portion 3 a, the convex portion 3 b of the second component 17 of the fixing jig 3 is pushed down into the opening 4, and the upper surface of the convex portion 3 b passes through the plate 2. Then, the locking portion 3e holds and fixes the plate 2 and the thin wiring board 5 by the elastic force of the deformation portion 3a. In addition, since the 1st structure part 16 has the 2nd wiring board holding | suppressing part 3d in the upper end, even if the force from upper direction is applied, it is still latching to the edge of the opening part 4 of the plate 2. FIG. The fixing jig fixing tool 15 may be any shape or material as long as it can apply a force simultaneously to one or a necessary number of the wiring board pressing portions 3c of the fixing jig 3. In FIG. 7, a flat plate capable of applying force to the wiring board pressing portions 3 c of the two fixing jigs 3 at the same time is employed, but the above-described solder mask 8 can be substituted.

  As described above, the thin wiring board 5 is simply held and fixed to the plate 2 or released (released) by the fixing jig opening jig 14 and the fixing jig fixing jig 15. It can be very easy to use. 6 and 7 show an example in which there are two fixing jigs 3, but the shapes of the fixing jig releasing tool 14 and the fixing jig fixing tool 15 are changed even in the case of one or more than three. As a result, all the fixing jigs 3 can be operated simultaneously.

  According to the fixing jig of the present invention, the reflow jig using the fixing jig, and the fixing jig operating method, when the electronic component is reflow soldered to the thin wiring board, the warping of the wiring board due to the heat of the reflow furnace is sufficient. Can be suppressed. Therefore, it can be applied to all the boards that are scheduled for reflow soldering.

It is a perspective view of the reflow jig of the present invention. It is explanatory drawing which shows the usage condition of the reflow jig | tool of this invention. FIG. 3 is a perspective view showing a state in which the thin wiring board 5 is held and fixed by the reflow jig of the present invention. FIG. 4 is an explanatory diagram showing one countermeasure when the thin wiring board 5 is a double-side mounting type in FIG. FIG. 5 is an explanatory view showing an outline of a reflow soldering process of a thin wiring board held and fixed by the reflow jig of the present invention, wherein (a) shows a case where a squeegee is used, and (b) shows a component mounting. The case where a machine is used is shown. FIG. 6 is a schematic cross-sectional view for explaining a state in which the thin wiring board 5 is removed using the fixing jig opening tool 14. FIG. 7 is a schematic cross-sectional view for explaining how the fixing jig 3 is operated using the fixing jig fixing tool 15. FIG. 8 is a partially enlarged cross-sectional view of the substrate holding jig disclosed in Patent Document 1 after the printed circuit board is mounted. FIG. 9 is a perspective view (a) and a cross-sectional view (b) showing an embodiment of a printed wiring board warpage preventing method disclosed in Patent Document 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Reflow jig 2 Plate 3 Fixing jig 3a Deformation part 3b Protrusion part 3c 1st wiring board pressing part 3d 2nd wiring board pressing part 3e Locking part 3f Other locking part 3g Fixing board part 4 Opening part 5 Thin wiring Board 6 Double-side mounted thin wiring board 6a Front-side mounted component 6b Component relief opening 7 Double-side mounted thin wiring board mounting position 8 Solder mask 9 Cream solder 10 Squeegee 11 Substrate holding pin 12 Mounted component 13 Mounted component Machine 14 Fixing jig opening tool 15 Fixing jig fixing tool 16 First component 17 Second component 20 Substrate holding jig 21 Metal plate 21a Holding surface 22 Fixing claw 22a Horizontal piece 22b Vertical piece 23 Substrate press-fitting portion 24 Printed circuit board 25 Through hole 30 Electronic component 31 Transport board 32 Printed wiring board 33 Warpage prevention metal fitting 34 Notch

Claims (8)

  A first component, a second component, and a deformable portion that are opposed to each other by a member having heat resistance and elastic force are formed in a substantially U shape via the deformable portion, and the first component has at least a second shape. A fixing jig provided with a wiring board pressing part and a fixing plate part, wherein the second component part is provided with at least a first wiring board pressing part, a convex part, and a locking part, wherein the second wiring board The holding portion is formed by bending the end portion of the first component portion outward, and the fixing plate portion protrudes substantially parallel to the surface of the first component portion in a direction perpendicular to the second wiring board holding portion. The first wiring board pressing portion is formed by bending the end portion of the second component portion outward, and the convex portion is formed so as to protrude outward in the middle of the second component portion. The locking portion is formed by the lower surface of the first wiring board pressing portion and the upper surface of the convex portion. The height from the bottom of the deformed portion at the upper end of the fixed plate portion provided in the first component and the height from the bottom of the deformed portion on the upper side surface of the convex portion provided in the second component Is a fixture that is constructed to be the same.   A first component, a second component, and a deformable portion that are opposed to each other by a member having heat resistance and elastic force are formed in a substantially U shape via the deformable portion, and the first component has at least a second shape. A fixing jig in which a wiring board pressing part and a fixing plate part are provided, and the second component part is provided with at least a first wiring board pressing part, a convex part, a locking part, and another locking part. The second wiring board pressing part is formed by bending the end of the first component part outward, and the fixing plate part is substantially perpendicular to the surface of the first component part in a direction perpendicular to the second wiring board pressing part. The first wiring board pressing portion is formed by bending the end portion of the second component portion outward, and the convex portion is outward in the middle of the second component portion. It is formed so as to protrude and is locked by the lower surface of the first wiring board pressing part and the upper side surface of the convex part The other locking portion is formed by the lower surface of the convex portion and the deformable portion, and the upper end of the fixed plate portion provided in the first component portion is high from the bottom of the deformable portion. And the height of the upper surface of the convex portion provided on the second component portion from the bottom of the deformable portion is the same.   The vertical length of the locking portion is equal to the sum of the thickness of the plate on which the wiring board is placed and the thickness of the wiring board, and the horizontal width of the first component and the second component is the same. The value obtained by adding the horizontal width of the fixed plate portion to the horizontal width is equal to or less than the major axis of the opening provided on the plate on which the wiring board is placed and the fixing jig is vertically inserted. The fixing jig according to claim 1 or 2.   A reflow jig comprising the fixing jig according to any one of claims 1 to 3 and a plate on which a wiring board is placed, wherein the fixing jig is fitted into an opening provided in the plate. The reflow jig is configured to hold and fix the wiring board to the plate at the locking portion using the elastic force of the deformation portion of the fixing jig.   The reflow jig according to claim 4, wherein the plate is provided with a component escape opening so that the double-sided mounting type wiring board can be held and fixed.   A state in which the wiring board is held and fixed to the plate by the fixing jig according to any one of claims 1 to 3, and is obliquely directed from the bottom of the deforming part to the second wiring board pressing part on the deforming part of the fixing jig. The operation method of the fixing jig, wherein the first wiring board pressing portion of the fixing jig is separated from the wiring board and is released from a state in which the wiring board is held and fixed by applying an upward force.   An opening provided in the plate when the wiring board is placed on a position to be held and fixed on the plate and held and fixed by the fixing jig according to any one of claims 1 to 3. The plate is located between the fixed plate portion and the second wiring board pressing portion, and the lower portion of the convex portion is in contact with the plate or the other locking portion Is brought into contact with the plate, and a vertical force is applied to the first wiring board holding part from above, whereby the wiring board is held and fixed between the first wiring board holding part and the plate. A method for operating a fixing jig, characterized in that:   When there are a plurality of the fixing jigs, a force is simultaneously applied to the first wiring board pressing part or the deforming part of the plurality of fixing jigs to hold and fix the wiring board to the plate or the wiring board. 8. The method of operating a fixing jig according to claim 6 or 7, wherein: is released from the plate.

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