JP2007264462A - Photosensitive resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having good alkali developability and giving a cured product having excellent heat resistance. <P>SOLUTION: The alkali developable photosensitive resin composition (Q) comprises a hydrophilic resin (A), a polyfunctional (meth)acrylate monomer (B), a compound (C) having two or more hydrolyzable alkoxy groups, a photo-radical polymerization initiator (D) and a photoacid generator (E), wherein the difference in solubility parameter between the polyfunctional (meth)acrylate monomer (B) and the compound (C) having two or more hydrolyzable alkoxy groups is -2.0 to 2.0. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a photosensitive resin composition capable of alkali development.

Photosensitive resin compositions are widely used for various applications. For example, in a printed wiring board, a photosensitive resin composition is widely used as a photo solder resist as a permanent protective film for a circuit. Photo solder resist is a film formed on the entire surface excluding the part to be soldered of the circuit conductor, and when wiring electronic parts on the printed circuit board, it prevents solder from adhering to unnecessary parts, It is used as a protective coating that prevents the circuit from being directly exposed to air. Currently, liquid photo solder resists are widely used as photo solder resists for printed wiring boards from the viewpoints of high precision, high density, and environmental problems.

As this liquid photo solder resist ink, Patent Document 1 and Patent Document 2 propose a solder resist ink composition mainly composed of a partial reaction product of a novolak epoxy resin with acrylic acid. However, these ink compositions have insufficient solder heat resistance and cold cycle resistance.

On the other hand, Patent Document 3 proposes a composition in which a silane-modified epoxy resin obtained by reacting an epoxy resin with a silicone compound and a phenol novolac resin that is a curing agent. However, silane-modified epoxy resins have diorganopolysiloxane units as the main constituent units of silicone compounds and methoxy group-containing silicone intermediates used for modification, and the remaining amount of alkoxy groups is small, so solder heat resistance and cooling cycle Resistance was insufficient.
As described above, a photo solder resist having good solder heat resistance and thermal cycle resistance has not yet been obtained.
In addition, other uses of the photosensitive resin composition, for example, a protective film for a TFT substrate, also have a problem that it deteriorates due to high-temperature treatment of the substrate.
As described above, the conventional photosensitive resin composition has a problem that its thermal characteristics such as heat resistance and cold cycle resistance are not sufficient.
JP-A-60-208337 JP-A-61-59447 JP-A-3-2014466

An object of the present invention is to provide a photosensitive resin composition which is excellent in alkali developability and excellent in thermal properties such as heat resistance and heat cycle resistance.

The inventors of the present invention have arrived at the present invention as a result of intensive studies to solve the above problems.
That is, the present invention relates to a hydrophilic resin (A), a polyfunctional (meth) acrylate monomer (B), a compound (C) having two or more hydrolyzable alkoxy groups, a photo radical polymerization initiator (D), and a photo acid. The solubility parameter difference between the polyfunctional (meth) acrylate monomer (B) and the compound (C) having two or more hydrolyzable alkoxy groups containing the generator (E) is -2.0 to 2.0. A photosensitive resin composition (Q) capable of alkali development, and a photo solder resist for a printed wiring board comprising the photosensitive resin composition.

The photosensitive resin composition of the present invention has the following effects.
-The photosensitive resin composition is excellent in alkali developability.
・ Excellent heat resistance and heat cycle resistance.

The photosensitive resin composition of the present invention comprises a hydrophilic resin (A) [hereinafter sometimes simply referred to as (A)], a polyfunctional (meth) acrylate monomer (B) [hereinafter simply referred to as (B). Compound (C) having two or more hydrolyzable alkoxy groups [hereinafter, simply referred to as compound (C) or simply as (C)], initiation of radical photopolymerization An agent (D) [hereinafter sometimes simply referred to as (D)] and a photoacid generator (E) [hereinafter sometimes simply referred to as (E)], and (B) When the difference in solubility parameter from (C) is -2.0 to 2.0, the compatibility between (B) and (C) is improved, and not only alkali developability, but particularly heat resistance and cooling Cycle resistance (hereinafter simply referred to as heat resistance) There is provided an excellent photosensitive resin composition is) To.
In the above and the following, for example, the expression with (meth) such as “(meth) acrylate” means “acrylate and / or methacrylate”.

Hereinafter, (A) to (E), which are essential components of the photosensitive resin composition of the present invention, will be described in order.

The hydrophilicity index in the hydrophilic resin (A) in the present invention is defined by HLB. Generally, the larger this value, the higher the hydrophilicity.
The preferable range of the HLB value of (A) varies depending on the resin skeleton of (A) (for example, vinyl resin, epoxy resin, polyester resin, etc.), but is preferably 4 to 19, more preferably 5 to 18, particularly preferably. 6-17. When it is 4 or more, the developing property is further improved when developing the photo spacer, and when it is 19 or less, the water resistance of the cured product is further improved. In addition, HLB in this invention is an HLB value by the Oda method, is a hydrophilicity-hydrophobicity balance value, and can be calculated from the ratio of the organic value and inorganic value of an organic compound.
HLB≈10 × Inorganic / Organic In addition, the inorganic value and the organic value are described in the document “Surfactant Synthesis and Applications” (published by Tsuji Shoten, Oda, Teramura), page 501; It is described in detail on page 198 of “Introduction to New Surfactants” (Takehiko Fujimoto, published by Sanyo Chemical Industries, Ltd.).

As (A), a hydrophilic vinyl resin (A1) (hereinafter sometimes simply referred to as (A1)), a hydrophilic epoxy resin (A2) (hereinafter sometimes simply referred to as (A2)), Examples include hydrophilic polyester resins, hydrophilic polyamide resins, hydrophilic polycarbonate resins, and hydrophilic polyurethane resins. (A) may be used by 1 type and may use 2 or more types together.
Among these, (A1) and (A2) are preferable from the viewpoint of photocuring reactivity of the photosensitive resin composition and the viewpoint of ease of production.

Examples of (A1) include those having a hydrophilic group in the side chain and / or terminal of the polymer molecule. Examples of the hydrophilic group include a carboxyl group, a hydroxyl group, a sulfonic acid group, an amino group, an amide group, a polyether group, and a combination of two or more of these.
Preferred as (A1) is a hydrophilic vinyl resin having at least one hydrophilic group selected from a carboxyl group and a hydroxyl group from the viewpoint of alkali developability and heat resistance.
In order to exhibit sufficient developability, those having a hydrophilic group, particularly a carboxyl group in the side chain are particularly preferred.

A preferred production method of (A1) is a vinyl monomer having a hydrophilic group (a) (hereinafter sometimes simply referred to as (a)) and, if necessary, a hydrophobic group-containing vinyl monomer (b) (hereinafter simply referred to as (b). ) Is sometimes vinyl-polymerized.

Examples of the vinyl monomer (a) having a hydrophilic group include the following vinyl monomers (a1) to (a7).
(A1) Hydroxyl-containing vinyl monomer:
Hydroxyalkyl (meth) acrylate [2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, etc.], polyalkylene glycol mono (meth) acrylate [polyethylene glycol mono (meta ) Acrylate etc.], alkylol (meth) acrylamide [N-methylol (meth) acrylamide etc.], hydroxystyrene and 2-hydroxyethylpropenyl ether.
Among (a1), hydroxyalkyl (meth) acrylate, particularly 2-hydroxyethyl (meth) acrylate, is preferred from the viewpoint of alkali developability and heat resistance.

(A2) Carboxyl group-containing vinyl monomer:
Unsaturated monocarboxylic acids [such as (meth) acrylic acid, crotonic acid and cinnamic acid], unsaturated polyvalent (2-4 valent) carboxylic acids [such as (anhydrous) maleic acid, itaconic acid, fumaric acid and citraconic acid], Unsaturated polyvalent carboxylic acid alkyl (alkyl group having 1 to 10 carbon atoms) ester [maleic acid monoalkyl ester, fumaric acid monoalkyl ester, citraconic acid monoalkyl ester, etc.] and salts thereof [alkali metal salt (sodium salt) And potassium salts, etc.), alkaline earth metal salts (calcium salts and magnesium salts, etc.), amine salts and ammonium salts, etc.].
Of (a2), preferred is an unsaturated monocarboxylic acid from the viewpoint of alkali developability, and more preferred is (meth) acrylic acid.
(A3) Sulphonic acid group-containing vinyl monomer:
Examples thereof include vinyl sulfonic acid, (meth) allyl sulfonic acid, styrene sulfonic acid, α-methyl styrene sulfonic acid, 2- (meth) acryloylamido-2-methylpropane sulfonic acid, and salts thereof. Examples of the salt include alkali metal (sodium and potassium) salts, alkaline earth metal (calcium and magnesium) salts, primary to tertiary amine salts, ammonium salts and quaternary ammonium salts.

(A4) Amino group-containing vinyl monomer:
Tertiary amino group-containing (meth) acrylates [dialkylaminoalkyl (meth) acrylates such as dimethylaminoethyl (meth) acrylate and diethylaminoethyl (meth) acrylate)] and the like.
(A5) Amide group-containing vinyl monomer:
(Meth) acrylamide, N-alkyl (C1-6) (meth) acrylamide, diacetone acrylamide, N, N'-methylene-bis (meth) acrylamide, N, N-dialkyl (C1-6) or Diaralkyl (7 to 15 carbon atoms) (meth) acrylamide (for example, N, N-dimethylacrylamide and N, N-dibenzylacrylamide), methacrylformamide, N-methyl-N-vinylacetamide, cinnamic amide and cyclic amide (N-vinylpyrrolidone, N-allylpyrrolidone, etc.).
(A6) a quaternary ammonium base-containing vinyl monomer;
A quaternized product of a tertiary amino group-containing vinyl monomer having 6 to 50 carbon atoms (preferably 8 to 20 carbon atoms, such as methyl chloride, dimethyl sulfate, benzyl chloride and dimethyl carbonate), for example, dimethyl Examples include quaternized aminoethyl (meth) acrylate, quaternized diethylaminoethyl (meth) acrylate, quaternized dimethylaminoethyl (meth) acrylamide, and quaternized diethylaminoethyl (meth) acrylamide.
(A7) Polyether group-containing vinyl monomer:
Alkoxy (alkoxy group having 1 to 8 carbon atoms) polyalkylene (alkylene group having 2 to 4 carbon atoms) glycol mono (meth) acrylate [methoxypolyethylene glycol (degree of polymerization 2 to 40) mono (meth) acrylate and methoxypolypropylene glycol ( Polymerization degree 2-30) mono (meth) acrylate, etc.].

Of these, (a) is preferably (a1) and (a2), particularly (a2) from the viewpoint of imparting sufficient developability.

Examples of the hydrophobic group-containing vinyl monomer (b) include the following nonionic monomers (b1) to (b6).

(B1) (meth) acrylic acid ester;
C1-C20 alkyl (meth) acrylate of an alkyl group [for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, n-hexyl (meth) acrylate and 2-ethylhexyl (meth) acrylate, etc.]; alicyclic group-containing (meth) acrylate [dicyclopentanyl (meth) acrylate, sidiclopentenyl (meth) acrylate, isobornyl (meth) acrylate, etc. ];

(B2) an aromatic hydrocarbon monomer;
And hydrocarbon monomers having a styrene skeleton [for example, styrene, α-methylstyrene, vinyltoluene, 2,4-dimethylstyrene, ethylstyrene, isopropylstyrene, butylstyrene, phenylstyrene, cyclohexylstyrene, and benzylstyrene] and vinylnaphthalene. It is done.
(B3) carboxylic acid vinyl ester;
Examples thereof include those having 4 to 50 carbon atoms, such as vinyl acetate, vinyl propionate and vinyl butyrate.
(B4) vinyl ether monomers;
Those having 3 to 50 (preferably 6 to 20) carbon atoms such as vinyl methyl ether, vinyl ethyl ether, vinyl propyl ether, vinyl butyl ether and the like can be mentioned.
(B5) vinyl ketone monomer;
Examples thereof include those having 4 to 50 carbon atoms, such as vinyl methyl ketone, vinyl ethyl ketone, and vinyl phenyl ketone.
(B6) a halogen atom-containing monomer;
Examples thereof include those having 2 to 50 (preferably 2 to 20) carbon atoms, such as vinyl chloride, vinyl bromide, vinylidene chloride, chlorostyrene and bromostyrene.

Among (b), (b1) is preferable from the viewpoint of photocuring reactivity, and alicyclic group-containing (meth) acrylate is more preferable.

In (A1), the charged monomer molar ratio of (a) / (b) is usually 10 to 100/0 to 90, preferably 10 to 80/20 to 90, more preferably from the viewpoint of photocuring reactivity and developability. Is 25-85 / 15-75.

(A1) may contain a (meth) acryloyl group in the side chain for the purpose of further improving photocuring reactivity in the polymer having (a) and, if necessary, (b) as a constituent monomer. Good.
Examples of the method of incorporating a (meth) acryloyl group in the side chain include the following methods (1) and (2).
(1): A polymer is produced using a monomer having a group capable of reacting with an isocyanate group (such as a hydroxyl group or a primary or secondary amino group) in at least a part of (a), and then (meth) A method of reacting a compound having an acryloyl group and an isocyanate group (such as acryloylethyl isocyanate);
(2); producing a polymer using a monomer having a group capable of reacting with an epoxy group (hydroxyl group, carboxyl group, primary or secondary amino group, etc.) in at least a part of (a); A method of reacting a compound having a (meth) acryloyl group and an epoxy group (such as glycidyl acrylate).

The number average molecular weight of (A1) (hereinafter abbreviated as Mn. The measured value by gel permeation chromatography) is preferably 500 to 500, from the viewpoint of photocuring reactivity and developability as the photosensitive resin composition. 000, more preferably 1,000 to 100,000, and particularly preferably 3,000 to 20,000.

(A1) can be obtained by performing polymerization with a radical polymerization initiator after the monomer is diluted with a solvent (F4) (hereinafter sometimes simply referred to as (F4)) if necessary. Solvents (F4) include glycol ethers (such as ethylene glycol monoalkyl ether and propylene glycol monoalkyl ether), ketones (such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone), and esters (butyl acetate, ethylene glycol alkyl). Ether acetate and propylene glycol alkyl ether acetate). Of (F4), ketones and esters are preferred.
When (F4) is used, the amount used is not particularly limited, but is usually 1 to 400% based on the total weight of the monomers (in the following,% represents% by weight unless otherwise specified), preferably 5 to 5%. 300%, particularly preferably 10 to 200%.
Examples of the polymerization initiator include peroxides and azo compounds.
Peroxides include inorganic peroxides (eg, hydrogen peroxide, ammonium persulfate, potassium persulfate, sodium persulfate, etc.) and organic peroxides (eg, benzoyl peroxide, di-t-butyl peroxide, Cumene hydroperoxide, lauryl peroxide, etc.). Examples of the azo compound include azobis (2,4-dimethylvaleronitrile), azobisisobutyronitrile, azobis (2-methylbutyronitrile), azobiscyanovaleric acid and its salts (for example, hydrochloride), and azobis (2 -Amidinopropane) hydrochloride and the like. Preferred is an azo compound. As a usage-amount of a polymerization initiator, 0.0001-20% is preferable normally based on the total weight of a monomer, More preferably, it is 0.001-15%, Most preferably, it is 0.005-10%. The reaction temperature and reaction time are appropriately determined depending on the type of radical polymerization initiator.

As described above, the hydrophilicity index of (A) is defined by HLB. Of these, the HLB value of (A1) is preferably 9 to 19, more preferably 10 to 18, particularly preferably 11 to 17. It is. If the HLB of (A1) is 9 or more, developability can be further improved.

The hydrophilic epoxy resin (A2) in the present invention (A) (hereinafter sometimes simply referred to as (A2)) is a hydroxyl group, a carboxyl group, a sulfonic acid group, an amino group, an amide group or a polyether group. It is a polymer having an epoxy resin skeleton containing one or more hydrophilic groups such as.
Among (A2), preferred is a hydrophilic epoxy resin having at least one hydrophilic group selected from a carboxyl group and a hydroxyl group from the viewpoints of alkali developability and heat resistance.
(A2) preferably further has a (meth) acryloyl group in the molecule from the viewpoint of photocuring reactivity.

A preferred production method of (A2) is an epoxy resin obtained by reacting a (meth) acryloyl group-containing monocarboxylic acid with an epoxy group in an epoxy resin (A2 ₀ ) (hereinafter sometimes simply referred to as (A2 ₀ )). A method of reacting a part of the hydroxyl group with a polyvalent carboxylic acid or a polyvalent carboxylic acid anhydride (e) (hereinafter sometimes simply referred to as (e)). is there.

Examples of (A2 ₀ ) include aliphatic epoxy resins [eg, Etototo YH-300, PG-202, PG-207 (all manufactured by Tohto Kasei Co., Ltd.)] and alicyclic epoxy resins [eg, CY-179, CY-177. CY-175 (all manufactured by Asahi Kasei Epoxy Co., Ltd.)] and aromatic epoxy resins [eg, phenol novolac epoxy resin, cresol novolac epoxy resin, bisphenol A epoxy resin, biphenyl type epoxy resin and glycidyl modified polyvinylphenol] Can be mentioned.
Among (A2 ₀ ), an aromatic epoxy resin is preferable from the viewpoint of curability.
Examples of the (meth) acryloyl group-containing monocarboxylic acid used for the production of (A2) include acrylic acid and methacrylic acid.
Examples of the polyvalent carboxylic acid and polyvalent carboxylic acid anhydride (e) used in the production of (A2) include the unsaturated polyvalent carboxylic acids and anhydrides of the above-mentioned (a), and saturated polyvalent carboxylic acids. (2-6 valent) carboxylic acids (eg, aliphatic saturated polyvalent carboxylic acids such as oxalic acid, succinic acid, phthalic acid, adipic acid, dodecanedioic acid, dodecenyl succinic acid, pentadecenyl succinic acid and octadecenyl succinic acid) Acids; aromatic polycarboxylic acids such as tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, trimellitic acid, pyromellitic acid, biphenyltetracarboxylic acid and naphthalenetetracarboxylic acid) and their anhydrides (for example, Succinic anhydride, dodecenyl succinic anhydride, pentadecenyl succinic anhydride, octadecenyl succinic anhydride, etc. Aliphatic saturated polycarboxylic anhydrides; phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, biphenyltetracarboxylic anhydride and naphthalenetetracarboxylic Aromatic polyhydric carboxylic acid anhydrides such as acid anhydrides). A saturated polycarboxylic acid anhydride is preferable from the viewpoint of reactivity and developability.

In the production of (A2), the charged weight ratio of (meth) acrylic acid / (A2 ₀ ) is preferably such that the concentration of the (meth) acryloyl group in (A2) is 1.0 mmol / g or more (meta ) Acrylic acid charge weight ratio. From the above viewpoint, the weight ratio of acrylic acid / (A2 ₀ ) is preferably 0.072 or more / 1, and more preferably 0.079 to 0.72 / 1. The weight ratio of methacrylic acid is preferably 0.092 or more / 1, more preferably 0.10 to 0.92 / 1, from the above viewpoint.
The reaction temperature in the reaction between (A2 ₀ ) and (meth) acrylic acid is not particularly limited, but is preferably 70 to 110 ° C. The reaction time is not particularly limited, but is preferably 5 to 30 hours. Further, if necessary, a catalyst (for example, triphenylphosphine) and a radical polymerization inhibitor (hydroquinone, p-methoxyphenol, etc.) may be used.
The charged equivalent of the polyvalent carboxylic acid or polyvalent carboxylic acid anhydride (e) with respect to the weight of the (meth) acrylic acid adduct of (A2 ₀ ) is the acid value of (A2) (the method for measuring the acid value is Is a charge equivalent of (e) such that it is preferably 10 to 500 mg KOH / g. For example, when (e) is a divalent carboxylic acid or an anhydride thereof, the charge equivalent of (e) / ( The weight of the (meth) acrylic acid adduct of A2 ₀ ) is preferably 0.18 to 8.9 meq / g, more preferably 0.53 to 7.1 meq / g, from the above viewpoint. .
The reaction temperature in the reaction of the (A2 ₀ ) (meth) acrylic acid adduct and (e) is not particularly limited, but is preferably 70 to 110 ° C. The reaction time is not particularly limited, but is preferably 3 to 10 hours.

Mn of (A2) is usually 500 to 3,000, preferably 1,000 to 2,800, particularly preferably 1,500 to 2, from the viewpoint of photocuring reactivity and developability as the photosensitive resin composition. , 500.

The HLB value of (A2) is preferably 4 to 14, more preferably 5 to 13, and particularly preferably 6 to 12. If the HLB of (A2) is 4 or more, the developability can be satisfactorily exhibited.

The solubility parameter (hereinafter referred to as SP value) of the hydrophilic resin (A) in the present invention is preferably 7 to 14, more preferably 8 to 13, and particularly preferably 11 to 13. When it is 7 or more, the developability can be further improved, and when it is 14 or less, the water resistance of the cured product is further improved.

The SP value in the present invention is calculated by the method described in the following document proposed by Fedors et al.
"POLYMER ENGINEERING AND SCIENCE, FEBRUARY, 1974, Vol. 14, No. 2, ROBERT F. FEDORS. (Pp. 147-154)"
Those with close SP values are easy to mix with each other (highly dispersible), and those with a distant numerical value are indexes indicating that they are difficult to mix.

As described above, (A) preferably has a carboxyl group from the viewpoint of developability, and the content of the carboxyl group is indicated by an acid value.
When the acid value of (A) is 10 mgKOH / g or more, developability is more likely to be exhibited, and when it is 500 mgKOH / g or less, the water resistance of the cured product can be further improved.

The acid value in the present invention can be measured by an indicator titration method using an alkaline titration solution.
The method is as follows.
(I) About 1 g of a sample is precisely weighed and placed in an Erlenmeyer flask, and then a neutral methanol / acetone solution (a mixture of acetone and methanol at 1: 1 (volume ratio)) is added and dissolved.
(Ii) Add several drops of phenolphthalein indicator and titrate with 0.1 mol / L potassium hydroxide titration solution. The end point of neutralization is defined as the time when the indicator is slightly red for 30 seconds.
(Iii) Determine using the following equation.
Acid value (KOHmg / g) = (A × f × 5.61) / S
However, A: The number of mL of 0.1 mol / L potassium hydroxide titration solution.
f: Potency of 0.1 mol / L potassium hydroxide titration solution
S: Sampling amount (g)

In the photosensitive resin composition (Q) of the present invention, (A) is preferably 10 to 50%, more preferably 15 to 40%, and particularly preferably 20 to 30% based on the solid content weight of (Q). contains.
If it is 10% or more, the developability can be further improved, and if it is 50% or less, the elastic recovery property of the cured product is further improved. In the present invention, “solid content” refers to components other than the solvent.

  In the present invention, the polyfunctional (meth) acrylate monomer (B) (hereinafter sometimes simply referred to as (B)) used as one component in the photosensitive resin composition is a known polyfunctional (meta) The acrylate monomer is not particularly limited, and examples thereof include bifunctional (meth) acrylate (B1), trifunctional (meth) acrylate (B2), and 4-6 functional (meth) acrylate (B3).

Examples of the bifunctional (meth) acrylate (B1) include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, and polyethylene glycol di (meth). Acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, glycerin di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate ( SP value of methacrylate = 12.5, SP value of acrylate = 10.3), 1,9-nonanediol di (meth) acrylate, 1,10-decandiol di (meth) acrylate, 3-methyl-1, -Pentanediol di (meth) acrylate, 2-butyl-2-ethyl-1,3-propanediol di (meth) acrylate, dimethylol-tricyclodecane di (meth) acrylate, di (ethylene oxide adduct of bisphenol A ( Examples include (meth) acrylate, di (meth) acrylate of propylene oxide adduct of bisphenol A, and neopentyl glycol di (meth) acrylate of hydroxypivalate.

As trifunctional (meth) acrylate (B2), glycerin tri (meth) acrylate, trimethylolpropane tri (meth) acrylate (SP value of methacrylate = 12.5, SP value of acrylate = 10.3), pentaerythritol tri Examples include (meth) acrylate (SP value of methacrylate = 12.5, SP value of acrylate = 10.3), tri (meth) acrylate of ethylene oxide adduct of trimethylolpropane, and the like.

As the 4- to 6-functional (meth) acrylate (B3), pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate (methacrylate SP value = 12.5, acrylate SP value = 10.3), Examples include dipentaerythritol hexa (meth) acrylate (SP value of methacrylate = 12.5, SP value of acrylate = 10.3).

The SP value of (B) is preferably 8 to 13, more preferably 9 to 13, particularly from the viewpoint of easily setting the difference from the SP value of (C) described later to -2.0 to 2.0. 9-12, especially 9.5-11.

Among (B), preferred are (B2) and (B3), and more preferred is a polymer containing a hydroxyl group from the viewpoint of compatibility with (C) described later, particularly preferably dipentaerythritol pentaacrylate, Pentaerythritol triacrylate and combinations thereof. As (B) which can be easily obtained from the market, for example, Aronix M-403 (manufactured by Toagosei Co., Ltd.), light acrylate PE-3A (manufactured by Kyoeisha Chemical Co., Ltd.), neomer DA-600 (Sanyo Chemical Industries ( Etc.).

Moreover, (B) in this invention may contain the photosensitive acrylic oligomer (B4) in the one part. Examples of (B4) include urethane acrylate, polyester acrylate, and polyether acrylate having Mn of 1,000 or less and containing no carboxyl group and having two or more acryloyl groups in one molecule.
The content of (B4) in (B) is preferably 50% or less, more preferably 30% or less.

The content of (B) based on the weight of the solid content of (Q) is preferably 10 to 60%, more preferably 20 to 55%, and particularly preferably 25 to 50%. If it is 10% or more, the heat resistance of the cured product is further preferable, and if it is 60% or less, the developability is further improved.

In the present invention, the compound (C) having two or more hydrolyzable alkoxy groups contained as a component in the photosensitive resin composition (Q) is a silane compound (C1) represented by the general formula (1) ( In the following, there may be mentioned simply (C1)) and polysiloxane (C2) having two or more hydrolyzable alkoxy groups (hereinafter sometimes simply referred to as (C2)).
R ¹ _m Si (OR ² ) _4-m (1)
In the formula, R ¹ is an aliphatic saturated hydrocarbon group having 1 to 12 carbon atoms or an aromatic hydrocarbon group having 6 to 14 carbon atoms, R ² is an alkyl group having 1 to 4 carbon atoms, and m is 0 It is an integer of ~ 2.

Among R ¹ , examples of the aliphatic saturated hydrocarbon group include a linear alkyl group, a branched alkyl group, and an alicyclic saturated hydrocarbon group.
Examples of linear alkyl groups include methyl, ethyl, n-propyl, n-butyl, n-octyl and n-dodecyl groups and their deuterium substitutes, and examples of branched alkyl groups include isopropyl, isobutyl, sec-butyl and 2- Examples of the ethylhexyl group and the cyclic saturated hydrocarbon group include a cyclohexyl group, a cyclooctyl group, a cyclohexylmethyl group, a cyclohexylethyl group, and a methylcyclohexyl group.
Examples of the aromatic hydrocarbon group include an aryl group, an aralkyl group, and an alkylaryl group.
As aryl groups, phenyl, biphenyl, naphthyl groups and their deuterium, fluorine or chlorine substituents; As aralkyl groups, tolyl, xylyl, mesityl and their deuterium, fluorine or chloride; and as alkylaryl groups Examples include methylphenyl and ethylphenyl groups.
Of R ^1, a linear alkyl group, a branched alkyl group and an aryl group are preferable, a linear alkyl group and an aryl group are more preferable, and a methyl group, an ethyl group, a phenyl group and a combination thereof are particularly preferable.
(C1) among the particularly preferred from the viewpoint of compatibility with the other components, the silane condensates of the silane compound R ¹ is a phenyl group in the general formula (1), or R ¹ is a phenyl group It is a condensate of two or more silane compounds including a compound and a silane compound in which R ¹ is a linear alkyl group.
Examples of R ² include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, and a sec-butyl group, and a methyl group and an ethyl group are preferable.

In the general formula (1), m is 0, that is, examples of the tetrafunctional silane compound having four alkoxy groups include tetramethoxysilane and tetraethoxysilane.
Examples of the trifunctional silane compound in which m is 1, that is, three alkoxy groups include phenyltrimethoxysilane, phenyltriethoxysilane, methyltrimethoxysilane, and methyltriethoxysilane.
Examples of the bifunctional silane compound in which m is 2, that is, two alkoxy groups include diphenyldimethoxysilane, diphenyldiethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, phenylmethyldimethoxysilane, and phenylmethyldiethoxysilane. .
Among these, m is preferably 1, that is, a trifunctional silane compound from the viewpoint of forming a uniform network of organopolysiloxane.

Examples of the polysiloxane (C2) having two or more hydrolyzable alkoxy groups include polysiloxane having two or more hydrolyzable alkoxy groups represented by the general formula (2) in one molecule.

In the formula, R is the same alkyl group having 1 to 4 carbon atoms and R ² in the general formula (1), preferable ones are also same.

The hydrolyzable alkoxy group represented by the general formula (2) may be present in any part of the polysiloxane, for example, may be present only at the molecular end or in the repeating unit in the molecule.
(C2) can be obtained by condensation of a low-molecular silane compound, introduction of an alkoxy group into polysiloxane, and the like.

Among (C2), one obtained by condensation of a low molecular silane compound includes one or more condensates (C2A) of (C1) above.
(C2A) of, particularly preferred from the viewpoint of compatibility with the other components, the silane condensates of the silane compound R ¹ is a phenyl group in the general formula (1), or R ¹ is a phenyl group It is a condensate of two or more silane compounds including a compound and a silane compound in which R ¹ is a linear alkyl group.

The condensate (C2A) of the silane compound (C1) is dropped over about 10 to 60 minutes with stirring a predetermined amount of water and, if necessary, the catalyst in the silane compound (C1) under a dry atmosphere, for example. Thereafter, it can be obtained by aging at a temperature not higher than the boiling point of the by-produced alcohol (for example, 0 to 150 ° C.) over 1 to 12 hours.

When the amount of water added in the reaction is X mol and the number of moles of the alkoxy group in the silane compound (C1) is Y, if X / Y is too small, the yield and molecular weight of the condensate are reduced. On the other hand, when X / Y is too large, the molecular weight becomes too large and the storage stability tends to decrease. From this, it is preferable to carry out in the range of 0.1 <X / Y <5, preferably in the range of 0.3 <X / Y <3. As the water to be added, ion exchange water or distilled water is usually used. Moreover, the silane compound which has one hydrolysable alkoxy group can also be added for the purpose of molecular weight adjustment. Examples of the silane compound having one hydrolyzable alkoxy group include phenyltrimethoxysilane and methyltrimethoxysilane.

Catalysts include formic acid, acetic acid, succinic acid, lactic acid, malonic acid, citric acid, tartaric acid, malic acid, succinic acid, fumaric acid, phthalic acid, pyromellitic acid, p-toluenesulfonic acid, methanesulfonic acid, trifluoroacetic acid and trifluoro Monovalent, divalent or trivalent organic acids such as romethanesulfonic acid; inorganic acids such as hydrochloric acid, phosphoric acid, nitric acid, hydrofluoric acid, bromic acid, chloric acid and perchloric acid; alkali metal hydroxides, alkaline earths Hydroxides, quaternary alkylammonium hydroxides and carbonates and alkali salts such as primary to tertiary amines; quaternary alkylammonium halides; sodium hypochlorite; tin, zirconium, titanium, aluminum and Alkoxides of metals other than silicon such as boron and their chelate complexes; Machine acids, inorganic acids, metal alkoxide, an acid catalyst is preferable, chelate compounds of a metal alkoxide, an organic acid is particularly preferred.
The addition amount of the catalyst is 0.0001 to 10 parts by weight, preferably 0.001 to 1 part by weight with respect to 100 parts by weight of (C1). The method for adding the catalyst is not particularly limited, but is preferably added as an aqueous solution. Moreover, preferable reaction temperature is 20 to 100 degreeC.

Among the polysiloxanes (C2) having two or more hydrolyzable alkoxy groups, those obtained by introducing an alkoxy group into the polysiloxane include hydrolyzable alkoxy groups and other reactive functional groups in one molecule. And a reaction product (C2B) of polysiloxane (C2 ₀ ) having two or more functional groups capable of reacting with the reactive functional group in one molecule.

Examples of the other reactive functional group in (c2) include a hydroxyl group, an amino group, a carboxyl group, a mercapto group, and a glycidyl group.
Examples of (c2) include γ-glycidoxypropyltrimethoxysilane, 2-mercaptoethyltrimethoxysilane, and the like.
Examples of the functional group in (C2 ₀ ) include a carboxyl group, an amino group, a hydroxyl group, and a mercapto group. For example, when the other reactive functional group in (c2) is a glycidyl group, (C2 ₀ ) The functional group in is preferably a carboxyl group or an amino group, and when the other reactive functional group in (c2) is a mercapto group, the functional group in (C2 ₀ ) is a glycidyl group or a carboxyl group It is preferable.
Examples of (C2 ₀ ) include polysiloxanes having carboxyl groups at both ends, polysiloxanes having amino groups at both ends, and polysiloxanes having glycidyl groups at both ends.

Examples of the method for producing (C2B) include a method obtained by reacting γ-glycidoxypropyltrimethoxysilane with polysiloxane having carboxyl groups at both ends.
Although the reaction temperature in this case is not specifically limited, Preferably it is 70-110 degreeC. The reaction time is not particularly limited, but is preferably 5 to 30 hours. Further, if necessary, a catalyst (for example, triphenylphosphine) can be used.

The obtained (C2B) can be diluted by adding a predetermined solvent, if necessary. It is preferable to carry out dilution with an appropriate solvent as the photosensitive resin composition at this stage. (F4) illustrated previously is mentioned as a solvent. (F4) is used in an amount of 0 to 1,000 parts by weight, preferably 40 to 250 parts by weight, based on 100 parts by weight of the silane compound.

  Mn of (C2) is preferably 500 to 100,000, more preferably 1,000 to 50,000, and particularly preferably 2,000 to 20,000 from the viewpoint of heat resistance.

(C) has a difference in SP value from the polyfunctional (meth) acrylate monomer (B) of usually -2.0 to 2.0, preferably from the viewpoint of compatibility and heat resistance of the cured product and heat cycle resistance. It is -1.0-1.8, More preferably, it is -0.5-1.6, Most preferably, it is 0-1.4.
Outside the range of -2.0 to 2.0, the photosensitive resin composition lacks uniformity and tends to become cloudy, which is inconvenient for fine pattern formation, and further the heat resistance of the cured product is insufficient. It is.
The SP value of (C) is preferably 7 to 13, more preferably 8 to 12, especially from the viewpoint that the difference from the SP value of (B) described above can be easily set to -2.0 to 2.0. 8-11, especially 8-10.5.

The cured product of the photosensitive resin composition of the present invention can exhibit excellent heat resistance and heat cycle resistance because the difference in SP value between (B) and (C) is in the range of -2.0 to 2.0. It is related to some reasons and is presumed to be due to the following reasons.
That is, in the photosensitive resin composition of the present invention, (1): the photoacid generator (E) generates an acid by light irradiation, and the acid undergoes hydrolysis reaction of the hydrolyzable alkoxy group of the compound (C). It is presumed that the compound (C) crosslinks and / or chain extends as a catalyst, and at the same time, the polyfunctional (meth) acrylate monomer (B) undergoes radical polymerization by radicals generated from the photoradical polymerization initiator (D). In this case, the difference in solubility parameter between (B) and (C) is −2.0 to 2 and the compatibility is good, so that the three-dimensional structure and compound by photoradical polymerization of compound (B) It is presumed that the cross-linking / chain extension reaction in the ionic reaction (C) is likely to become a mutually penetrating network structure, and the heat resistance is improved.

The content of (C) based on the weight of the solid content of the photosensitive resin composition (Q) is preferably 5 to 40%, more preferably 6 to 30%, and particularly preferably 8 to 20%. If it is 5% or more, the heat resistance can be further improved, and if it is 40% or less, the developability can be further improved.

Examples of the radical photopolymerization initiator (D) used as one component in the photosensitive resin composition (Q) include benzyl dimethyl ketal, 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl. Propan-1-one, benzophenone, methylbenzoyl formate, isopropylthioxanthone, 4,4-bis (dimethylamino) benzophenone, 3,3-dimethyl-4-methoxy-benzophenone, anthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone , Tert-butylanthraquinone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy Cetophenone, 2-hydroxy-2-methylpropiophenone, 4-isopropyl-2-hydroxy-2-methylpropiophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholino-1-propanone 2-chlorothioxanthone, diethylthioxanthone, isopropylthioxanthone, diisopropylthioxanthone, Michler's ketone, benzyl-2,4,6- (trihalomethyl) triazine, 2- (o-chlorophenyl) -4,5-diphenylimidazolyl dimer, 9 -Phenylacridine, 1,7-bis (9-acridinyl) heptane, 1,5-bis (9-acridinyl) pentane, 1,3-bis (9-acridinyl) propane, dimethylbenzyl ketal, trimethylbenzoyldiphenylphosphine Sid, tribromomethylphenylsulfone and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) - butan-1-one, and the like. (D) may be used alone or in combination of two or more.

(D) can be easily obtained as a commercially available product. For example, as 2-methyl-1- (4- (methylthio) phenyl) -2-morpholino-1-propanone, Irgacure 907, 2-benzyl- Examples of 2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one include Irgacure 369 (manufactured by Ciba Specialty Chemicals).

The content of (D) based on the weight of the solid content of the photosensitive resin composition (Q) is preferably 0.01 to 10%, more preferably 0.05 to 7%, particularly preferably 0.1 to 5. %. If it is 0.01% or more, the photocuring reactivity can be exhibited more satisfactorily, and if it is 10% or less, the resolution can be further improved.

In the photosensitive resin composition (Q), the content of (D) with respect to the total weight of (A) when having (B) and (meth) acryloyl groups is 0.02 to 20% from the viewpoint of curability. It is preferable that it is 0.05 to 10%.

The photoacid generator (E) used as one component in the photosensitive resin composition (Q) is a compound that generates an acid by light irradiation, and the generated acid is a hydrolysis of an alkoxy group in (C). And a catalyst for the condensation of (C).

Examples of (E) include a water-insoluble photoacid generator (E1) and a water-soluble photoacid generator (E2).
Examples of (E1) include the following (i) sulfone compounds, (ii) sulfonic acid ester compounds, (iii) sulfonimide compounds, (iv) disulfonyldiazomethane, and (v) disulfonylmethane.
(I) Sulfone compounds Phenacylphenylsulfone, 4-trisphenacylsulfone-ketosulfone, β-sulfonylsulfone, and α-diazo compounds thereof (ii) Sulfonic acid ester compounds Benzoin tosylate, pyrogallol tris-trifluoromethanesulfonate, pyrogallolmethane (Iii) sulfonimide compounds N- (trifluoromethylsulfonyloxy) succinimide, N- (p-toluenesulfonyloxy) bicyclo [2.2] sulfonic acid triester, α-methylolbenzointosylate, α-methylolbenzoindodecylsulfonate, etc. .1] Hept-5-ene-2,3-dicarboximide, N- (perfluorooctanesulfonyloxy) naphthylimide, N- (benzenesulfonyloxy) bishi [2.2.1] Hept-5-ene-2,3-dicarboximide, N- (benzenesulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-di Carboximide and N- (benzenesulfonyloxy) naphthylimide, etc. (iv) Disulfonyldiazomethane compounds Bis (trifluoromethylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, bis (2,4 -Dimethylbenzenesulfonyl) diazomethane, bis (1-methylethylsulfonyl) diazomethane, bis (1,4-dioxaspiro [4,5] decane-7-sulfonyl) diazomethane, etc.

Examples of (E2) include the following.
(I) Onium salt Sulfonium salt [bis [4- (diphenylsulfonio) phenyl] sulfide bishexafluorophosphate, allylsulfonium hexafluorophosphate salt, etc.],
Iodonium salts (such as diphenyliodonium hexafluorophosphate), phosphonium salts (such as ethyltriphenylphosphonium tetrafluoroborate), diazonium salts (such as phenyldiazonium hexafluorophosphate), ammonium salts (1-benzyl-2-cyanopyridinium hexafluorophosphate, etc.) ), And ferrocene [(2,4-cyclopentadien-1-yl) [(1-methylethyl) benzene] -Fe (II) hexafluorophosphate, etc.), etc.

Of these, the water-insoluble photoacid generator (E1) is preferable, and the sulfonimide compound (iii) and the disulfonyldiazomethane compound (iv) are more preferable.

The content of (E) based on the weight of the solid content of the photosensitive resin composition (Q) is preferably 0.001 to 10%, more preferably 0.01 to 7%, and particularly preferably 0.05 to 5%. %. If it is 0.001% or more, the photocuring reactivity can be exhibited more satisfactorily, and if it is 10% or less, the resolution can be further improved.

In the photosensitive resin composition (Q), the content of (E) based on the weight of the solid content of (C) is preferably 0.002 to 20%, more preferably 0.02 to 10%, particularly preferably. 0.1 to 5%. If it is 0.002% or more, the photocuring reactivity can be exhibited more satisfactorily, and if it is 20% or less, the resolution can be further improved.

The photosensitive resin composition (Q) may further contain other components (F) as necessary.
As (F), inorganic fine particles (F1), sensitizers (F2), polymerization inhibitors (F3), solvents (F4), and other additives (F5) (for example, inorganic pigments, silane coupling agents, Dyes, fluorescent brighteners, yellowing inhibitors, antioxidants, antifoaming agents, deodorants, fragrances, bactericides, antibacterial agents and fungicides, and the like.

As the inorganic fine particles (F1), metal oxides and metal salts can be used.
Examples of the metal oxide include titanium oxide, silicon oxide, and aluminum oxide.
Examples of the metal salt include calcium carbonate and barium sulfate.
Of these, metal oxides are preferable from the viewpoint of heat resistance and chemical resistance, and silicon oxide and titanium oxide, and particularly silicon oxide are more preferable.
The inorganic fine particles have a volume average primary particle diameter of 1 to 200 nm, preferably from 1 to 150 nm, more preferably from 1 to 120 nm, and particularly preferably from 5 to 20 nm, from the viewpoint of transparency.

The content of (F1) based on the weight of the solid content of the photosensitive resin composition (Q) is usually 0 to 50%, preferably 1 to 45%, particularly preferably 2 to 40%. If it is 50% or less, the developability can be further improved, and if it is 2 to 40%, the heat resistance is particularly excellent.

As the sensitizer (F2), nitro compounds (for example, anthraquinone, 1,2-naphthoquinone, 1,4-naphthoquinone, benzanthrone, p, p'-tetramethyldiaminobenzophenone, carbonyl compounds such as chloranil, nitrobenzene, p -Dinitrobenzene and 2-nitrofluorene), aromatic hydrocarbons (eg anthracene and chrysene), sulfur compounds (eg diphenyl disulfide etc.) and nitrogen compounds (eg nitroaniline, 2-chloro-4-nitroaniline) , 5-nitro-2-aminotoluene, tetracyanoethylene and the like).

The content of the sensitizer (F2) based on the weight of the photopolymerization initiator (D) is usually 0.1 to 100%, preferably 0.5 to 80%, particularly preferably 1 to 70%.

There is no limitation in particular as a polymerization inhibitor (F3), What is used for normal reaction is used. Specifically, diphenylhydrazyl, tri-p-nitrophenylmethyl, N- (3-N-oxyanilino-1,3-dimethylbutylidene) aniline oxide, p-benzoquinone, p-tert-butylcatechol, nitrobenzene, Examples include picric acid, dithiobenzoyl disulfide, and copper (II) chloride.

The content of the polymerization inhibitor (F3) based on the weight of the solid content of the photosensitive resin composition (Q) is preferably 0 to 1.0%, more preferably 0.01 to 0.5%, particularly preferably. 0.02 to 0.1%.

As the solvent, the same solvent as the solvent (F4) used in the production of the above (A) can be used. When the solvent is used, the amount of the solvent is not particularly limited, but is preferably 50 to 1,000%, more preferably 70 to 900, based on the weight of the solid content of the photosensitive resin composition (Q). %, Particularly preferably 80 to 800%. In addition, the solvent used for manufacture of above-mentioned (A) and (C) is also contained in the compounding quantity of a solvent.

The total content of (F) is usually 1,000% or less, preferably 80 to 800%, based on the weight of the photosensitive resin composition (Q).

The photosensitive resin composition (Q) of the present invention can be obtained, for example, by mixing the above-described components with a known mixing device such as a planetary mixer.
The photosensitive resin composition is usually liquid at room temperature, and its viscosity is 0.1 to 10,000 mPa · s, preferably 1 to 8,000 mPa · s at 25 ° C.

The photosensitive resin composition (Q) of the present invention is particularly suitable as a photosensitive resin composition for a printed wiring board photo solder resist because it is excellent in heat resistance and thermal cycle resistance of the cured product.

The photo solder resist for printed wiring boards of the present invention is composed of the above-described photosensitive resin composition.
Laminated boards used as printed wiring boards include various copper-clad laminated boards for printed wiring boards, metal boards such as aluminum boards, and plastic boards without copper foil (for example, paper base phenolic resin laminated boards, glass cloth bases, etc. Material Polyester resin laminate, glass cloth base epoxy resin laminate, polysulfone resin laminate, polyether sulfone resin laminate, polyetherimide resin laminate, glass cloth base Teflon (registered trademark) resin laminate, polyimide resin Laminates, etc.).

The film thickness of the photo solder resist is usually 0.5 to 500 μm, preferably 5 to 100 μm.

Examples of the application method of the photo solder resist include a method of applying with a screen printer, a roll coater, a curtain coater, etc., a method of applying with a spray, a brush, a spatula, etc., and a method of dipping.

Examples of the developer include ordinary industrial water, clean water, ion-exchanged water, an aqueous solution of a normal surfactant, an inorganic acid, an aqueous solution of an organic acid, an alcoholic organic solvent, and an aqueous solution thereof. Also good.

As the surfactant, usual cationic surfactants, anionic surfactants, and nonionic surfactants can be used.
The surfactant is usually used at a concentration of 0.01 to 2%, preferably 0.05 to 1%.
Examples of inorganic acids include boric acid, phosphoric acid, hydrochloric acid, and sulfuric acid, and examples of organic acids include acetic acid, formic acid, tartaric acid, and hydroxyacetic acid.
Inorganic acids and organic acids are usually used at a concentration of 0.1 to 10%, preferably 0.5 to 5%.

Examples of alcohol-based organic solvents include aliphatic alcohols such as methanol, ethanol, n-propanol, i-propanol, and n-butanol), cellosolves such as methyl cellosolve, ethyl cellosolve, and butyl cellosolve, and carbitols such as methyl carbitol and ethyl carbitol. Is mentioned.
The alcohol-based organic solvent is usually used at a concentration of 10 to 100%, preferably 20 to 50%.

Examples of the developing method include methods such as showering, spraying and dipping. Of these, spray is preferred.

As the curing method, a method by light irradiation and a method by thermal curing can be usually used, but each may be a single curing method, or both may be used in combination. Preferably, a combination of the two methods of curing by light irradiation and then curing by light irradiation is preferable.

The following irradiation light sources are suitable for curing with light. For example, low pressure mercury lamp, medium pressure mercury lamp, high pressure mercury lamp, ultra high pressure mercury lamp, xenon lamp, metal halogen lamp, electron beam irradiation device, X-ray irradiation device, laser (argon laser, dye laser, nitrogen laser, helium cadmium laser, etc.) There is. Of these, high pressure mercury lamps and ultrahigh pressure mercury lamps are preferred.

As the heating device, a normal air circulation dryer, an electric furnace, a gas furnace, a far infrared furnace, or the like can be used.

The heat curing temperature is usually 150 ° C. or higher, preferably 180 ° C. to 250 ° C. The curing time is 10 minutes to 120 minutes, preferably 45 minutes to 90 minutes.
The photosensitive resin composition of the present invention can be used for applications such as a protective film for a TFT substrate, an etching resist for a printed wiring board, and a plating resist for a printed wiring board in addition to a photo solder resist.

[Example]
EXAMPLES Hereinafter, although an Example and a manufacture example demonstrate this invention concretely, this invention is not limited to these. Hereinafter, the part means part by weight.

[Production of hydrophilic resin (A)]
<Production Example A-1>
A glass Kolben equipped with a heating / cooling / stirring measure, a reflux condenser, a dropping funnel and a nitrogen inlet tube, isobornyl methacrylate 50 parts (33 mol%), 2-hydroxyethyl methacrylate 30 parts (33 mol%), methacryl 20 parts (34 mol%) of acid and 150 parts of cyclohexanenone were charged and heated to 80 ° C. A solution in which 5 parts of azobisisobutyronitrile (V-60: Wako Pure Chemical Industries, Ltd., hereinafter referred to as AIBN) prepared in advance is dissolved in 50 parts of cyclohexanone after replacing the gas phase part in the system with nitrogen. 55 parts are dropped into Kolben at 80 ° C. over 10 minutes, and further reacted at the same temperature for 3 hours to obtain a hydrophilic resin (A-1) having a hydroxyl group and a carboxyl group (Mn: 8,800, SP value: 11. 86, an HLB value: 11.98, an acid value: 102 mgKOH / g) was obtained (the solid content was 25%). In addition, Mn is GPC measurement equipment (HLC-8120GPC, manufactured by Tosoh Corp.), column (TSKgel GMHXL 2 + TSKgel Multipore HXL-M, manufactured by Toso Corp.), polystyrene conversion measured by GPC method. Obtained as a value. The SP value, HLB value, and acid value were determined as described above. The same measurement method applies to the following production examples.

<Production Example A-2>
In the same Kolben as in Production Example A-1, 200 parts of a cresol novolac type epoxy resin “EOCN-1020” (manufactured by Nippon Kayaku, epoxy equivalent 200) and 245 parts of propylene glycol monomethyl ether acetate are charged and heated to 110 ° C. It was dissolved uniformly. Subsequently, 76 parts (1.07 mol part) of acrylic acid, 2 parts of triphenylphosphine, and 0.2 part of p-methoxyphenol were charged and reacted at 110 ° C. for 10 hours. The reaction product was further charged with 91 parts (0.60 mol part) of tetrahydrophthalic anhydride, further reacted at 90 ° C. for 5 hours, and after cooling, propylene glycol monomethyl ether acetate was added to adjust the solid content, and carboxyl group and acryloyl A propylene glycol monomethyl ether acetate solution of a hydrophilic resin (A-2) having a group (Mn: 2,200, SP value: 11.26, HLB value: 6.42, acid value: 91 mgKOH / g) was obtained ( Solids content is 25%).

[Production of compound (C) having two or more hydrolyzable alkoxy groups]
<Production Example C-1>
In a glass Kolben equipped with a heating / cooling / stirring measure, a reflux condenser, a dropping funnel and a nitrogen introduction pipe, 46 parts (0.34 moles) of methyltrimethoxysilane and 160 parts of phenyltrimethoxysilane (0.80 moles) ), 45 g (2.5 mol parts) of ion-exchanged water and 0.1 part (0.001 mol parts) of oxalic acid, heated and stirred at 60 ° C. for 6 hours, and further added with an evaporator. Methanol generated as a by-product by decomposition was removed over 2 hours under reduced pressure of 50 mmHg. Then, the compound (C-1) (Mn: 2,400, SP value: 8.40) having two or more hydrolyzable alkoxy groups was diluted with cyclohexanone so that the solid content was 25%. A cyclohexanone solution was obtained (solid content 25%).

<Production Example C-2>
In the same Kolben as in Production Example C-1, 170 parts (0.74 mole part) of diphenyldimethoxysilane, 40 parts (0.20 mole part) of phenyltrimethoxysilane, 30 parts (0.20 mole part) of tetramethoxysilane And 40 g (2.2 mol parts) of ion-exchanged water and 0.1 part (0.001 mol parts) of oxalic acid, heated and stirred at 60 ° C. for 6 hours, and further hydrolyzed using an evaporator. The methanol produced as a by-product was removed over 2 hours under a reduced pressure of 50 mmHg. Thereafter, the compound was diluted with cyclohexanone so that the solid content was 25%, and the compound (C-2) having two or more hydrolyzable alkoxy groups (Mn: 6,000, SP value: 9.08) A cyclohexanone solution was obtained (solid content 25%).

<Production Example C-3>
In the same Kolben as in Production Example C-1, 140 parts (1.04 mole parts) of methyltrimethoxysilane, 20 parts (0.10 mole parts) of phenyltrimethoxysilane and 45 g (2.5 mole parts) of ion-exchanged water Then, 0.1 part (0.001 mol part) of oxalic acid was charged, heated and stirred under the conditions of 60 ° C. and 6 hours, and further by using an evaporator, methanol produced as a by-product by hydrolysis was reduced to 2 under a reduced pressure of 50 mmHg. Removed over time. Thereafter, the compound was diluted with cyclohexanone so that the solid content was 25%, and the compound (C-3) having two or more hydrolyzable alkoxy groups (Mn: 2,600, SP value: 7.49) A cyclohexanone solution was obtained (solid content 25%).

<Production Example C-4>
In the same Kolben as in Production Example C-1, both ends carboxy group-modified polysiloxane ("X-22-162C": manufactured by Shin-Etsu Chemical Co., Ltd.) 50 parts, 3-aminopropyltrimethoxysilane 2 parts, triphenylphosphine 1 Part and 0.2 part of p-methoxyphenol were charged and reacted at 70 ° C. for 10 hours. Thereafter, the compound was diluted with cyclohexanone so that the solid content was 25%, and the compound (C-4) having two or more hydrolyzable alkoxy groups (Mn: 1,600, SP value: 7.86) A cyclohexanone solution was obtained (solid content 25%).

<Examples 1-6 and Comparative Examples 1-4>
[Production of photosensitive resin composition]
Number of blended parts in Table 1 [apparent parts by weight of each component, () indicates the weight% of the solid content of each component based on the weight of the solid content of the photosensitive resin composition (Q) (one decimal place) In accordance with (rounded off)], a glass container is charged with a solution of each hydrophilic resin, a solution of a compound having two or more hydrolyzable alkoxy groups, and the following (B-1), (D-1), and (E-1) was charged, stirred until uniform, and additional solvent (propylene glycol monomethyl ether acetate) was added, and photosensitive resin compositions (Q1) to (Q6) of Examples and Comparative Examples were added. Photosensitive resin compositions (Y1) to (Y4) were produced.

B-1 (polyfunctional (meth) acrylate): “light acrylate PE-3A” (SP value: 10.30, pentaerythritol triacrylate: manufactured by Kyoeisha Chemical Co., Ltd.),
C-5: Methyltrimethoxysilane (SP value: 7.28)
D-1 (photo radical polymerization initiator): “Irgacure 907” (2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one: manufactured by Ciba Specialty Chemicals Co., Ltd. ),
E-1 (photoacid generator): N- (trifluoromethylsulfonyloxy) succinimide

Evaluation Method and Evaluation Results (1) Developability: photosensitive resin compositions (Q1) to (Q6) and (Y1) to (Y4) are each finished on a glass substrate so that the finished film thickness is 5 μm. The film was spin coated, dried at 25 ° C. for 5 minutes, and then developed with a 1% aqueous sodium carbonate solution for 30 seconds to evaluate the developability. The results are shown in Table 1. The evaluation criteria are as follows.
A: There is no residue visually.
○: There is a slight residue visually.
Δ: There are many residues by visual inspection.

(2) Coating film performance: The photosensitive resin composition was applied on the entire surface of a patterned glass substrate and dried at 80 ° C. for 20 minutes. Next, a negative film was adhered to the substrate, and after exposure, a pattern was formed by developing with a 1% aqueous sodium carbonate solution. Next, the substrate was thermally cured at 150 ° C. for 60 minutes to prepare an evaluation substrate having a cured coating film, and the coating film performance was evaluated.

(A) Solder heat resistance: In accordance with the test method of JIS C 6481, the evaluation substrate having a cured coating film is immersed in a soldering iron at 260 ° C. for 30 seconds, and then a peeling test with a cellophane tape is defined as one cycle, for a total of 1 to 3 cycles. The state of the coating film was observed, and the solder heat resistance was evaluated.
A: There is no change in the coating film after 3 cycles.
○: Slightly changed after 3 cycles.
Δ: Change after 2 cycles.
X: Peeling occurs after 1 cycle.

(B) Thermal cycle resistance: An evaluation substrate having a cured coating film was subjected to a heat cycle test 1,000 times at −55 ° C. for 15 minutes, at room temperature for 10 minutes, and at 125 ° C. for 15 minutes, and soldered with an optical microscope. The presence or absence of crack generation in the resist layer was confirmed.
○: The cured coating has no blistering, peeling, or discoloration Δ: The cured coating has slight blistering, peeling, or discoloration ×: The cured coating has blistering, peeling, or discoloration

  As can be seen from Table 2, by using the photosensitive resin composition of the present invention, it is possible to form a solder resist film having good developability and excellent heat resistance and heat cycle resistance.

The photosensitive resin composition of this invention can be used conveniently for the photo solder resist for printed wiring boards.
Furthermore, it is also suitable as a photosensitive resin composition for various resist materials such as a protective film for TFT substrate, a photosensitive resist film, a photosensitive resin relief plate, a screen plate, a photoadhesive or a hard coat agent. is there.
Furthermore, coating agents for various materials such as metals (for example, iron, aluminum, titanium, copper, etc.), plastics (for example, polycarbonate, polyethylene terephthalate, poly (meth) acrylate), paper, glass, rubber and wood, paints, It can also be used as a printing ink and an adhesive, and can also be applied as a molding material.

Claims (7)

Hydrophilic resin (A), polyfunctional (meth) acrylate monomer (B), compound having two or more hydrolyzable alkoxy groups (C), photoradical polymerization initiator (D), and photoacid generator (E) Developable with a difference in solubility parameter between -2.0 and 2.0 between the polyfunctional (meth) acrylate monomer (B) and the compound (C) having two or more hydrolyzable alkoxy groups Photosensitive resin composition (Q). The photosensitive resin composition according to claim 1, wherein the hydrophilic resin (A) is a hydrophilic vinyl resin or a hydrophilic epoxy resin having one or more hydrophilic groups selected from a carboxyl group and a hydroxyl group. The photosensitive resin composition (Q) according to claim 1 or 2, wherein the polyfunctional (meth) acrylate monomer (B) is a polyfunctional (meth) acrylate monomer having a hydroxyl group. The compound (C) having two or more hydrolyzable alkoxy groups is a silane compound (C1) represented by the general formula (1) or a polysiloxane (C2) having two or more hydrolyzable alkoxy groups. The photosensitive resin composition (Q) according to any one of claims 1 to 3.
R ¹ _m Si (OR ² ) _4-m (1)
[Wherein, R ¹ is an aliphatic saturated hydrocarbon group having 1 to 12 carbon atoms or an aromatic hydrocarbon group having 6 to 14 carbon atoms, R ² is an alkyl group having 1 to 4 carbon atoms, and m is It is an integer of 0-2. ] The content of the compound (C) having two or more hydrolyzable alkoxy groups is 5 to 40% by weight based on the weight of the solid content of the photosensitive resin composition (Q). Or a photosensitive resin composition. The photosensitive resin composition according to claim 1, which is for a photo solder resist used for a printed wiring board. A photo solder resist for a printed wiring board, comprising the photosensitive resin composition according to claim 6.